CN119060504B - Chip stacking packaging film, preparation method and application thereof - Google Patents
Chip stacking packaging film, preparation method and application thereof Download PDFInfo
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- CN119060504B CN119060504B CN202411564813.3A CN202411564813A CN119060504B CN 119060504 B CN119060504 B CN 119060504B CN 202411564813 A CN202411564813 A CN 202411564813A CN 119060504 B CN119060504 B CN 119060504B
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- 229920006280 packaging film Polymers 0.000 title claims abstract description 32
- 239000012785 packaging film Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 151
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 151
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 102
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 70
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 70
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 30
- 229920000570 polyether Polymers 0.000 claims abstract description 30
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 40
- 239000002994 raw material Substances 0.000 claims description 28
- 239000000377 silicon dioxide Substances 0.000 claims description 20
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000011324 bead Substances 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000002883 imidazolyl group Chemical group 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000084 colloidal system Substances 0.000 claims 1
- 238000009849 vacuum degassing Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 9
- 239000010703 silicon Substances 0.000 abstract description 9
- 238000003860 storage Methods 0.000 abstract description 9
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 230000000052 comparative effect Effects 0.000 description 22
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 18
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 17
- 238000012360 testing method Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010025 steaming Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a chip stacking and packaging film, which comprises, by mass, 40-45 parts of an inorganic filler, 22-25 parts of a polyether modified epoxy resin, 15-17 parts of an acrylic rubber modified epoxy resin, 5-15 parts of a CTBN modified epoxy resin, 10-12 parts of a bisphenol F type epoxy resin, 10-15 parts of a bisphenol F type benzoxazine, 2-6 parts of a curing agent and 0.4-0.8 part of an accelerator. The chip stacking packaging film has excellent flexibility, fluidity and silicon wafer adhesion, low storage modulus and low moisture absorption rate, and can be applied to multi-chip stacking packaging.
Description
Technical Field
The application relates to the field of semiconductor chip packaging, in particular to a chip stacking packaging film, a preparation method and application thereof.
Background
The chip stacking packaging film is used for fixing the chip on the substrate. The use method comprises the steps of attaching the packaging film on the chip, cutting the chip, attaching the cut chip on the substrate through the packaging film, wire bonding, covering another cut chip, and stacking layer by layer to realize multi-chip packaging. When multi-chip packaging is performed, bonding wires are required to penetrate through the packaging film to realize interconnection among multiple layers of chips. The chip stack package film should have good wire embedding properties. The line embedding properties are a combination of flowability and flexibility, with good line embedding properties corresponding to good flowability and good flexibility. But the wire embedding performance of the chip stacking packaging film still needs to be further improved. In addition, in multi-chip stacked packages, the higher storage modulus of the encapsulation film causes greater stress, resulting in chip cracking or detachment, and therefore, the storage modulus of the encapsulation film needs to be further reduced.
Disclosure of Invention
The application aims to provide a chip stacking and packaging film, a preparation method and application thereof, and the chip stacking and packaging film has excellent flexibility, flowability and silicon wafer adhesion, low storage modulus and low moisture absorption rate.
The chip stacking packaging film comprises, by mass, 40-45 parts of an inorganic filler, 22-25 parts of polyether modified epoxy resin, 15-17 parts of acrylic rubber modified epoxy resin, 5-15 parts of CTBN modified epoxy resin, 10-12 parts of bisphenol F type epoxy resin, 10-15 parts of bisphenol F type benzoxazine, 2-6 parts of a curing agent and 0.4-0.8 part of an accelerator.
In some embodiments, the raw materials of the chip stack packaging film include:
40-42 parts of inorganic filler, 22-25 parts of polyether modified epoxy resin, 15 parts of acrylic rubber modified epoxy resin, 8-15 parts of CTBN modified epoxy resin, 10 parts of bisphenol F type epoxy resin, 10-15 parts of bisphenol F type benzoxazine, 2-6 parts of curing agent and 0.4-0.8 part of accelerator.
In some embodiments, the raw materials of the chip stack packaging film include:
40 parts of inorganic filler, 25 parts of polyether modified epoxy resin, 15 parts of acrylic rubber modified epoxy resin, 10-15 parts of CTBN modified epoxy resin, 10-15 parts of bisphenol F type epoxy resin, 2-6 parts of curing agent and 0.4-0.8 part of accelerator.
In some embodiments, the acrylic rubber modified epoxy resin comprises 0-12 parts by mass of SR-828R10 acrylic rubber modified epoxy resin and 5-15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin.
In some embodiments, the acrylic rubber modified epoxy resin comprises 0-10 parts by mass of SR-828R10 acrylic rubber modified epoxy resin and 5-15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin comprises YLER-200V30 acrylic rubber modified epoxy resin.
In some embodiments, the acrylic rubber modified epoxy resin comprises 0-5 parts by mass of SR-828R10 acrylic rubber modified epoxy resin and 10-15 parts by mass of YLER-200V30 acrylic rubber modified epoxy resin, wherein the SR-828R10 acrylic rubber modified epoxy resin comprises YLER-200V30 acrylic rubber modified epoxy resin.
In some embodiments, the inorganic filler is selected from silica, preferably spherical silica having a particle size of 0.1 to 0.9 um.
In some embodiments, the curing agent is selected from amine curing agents and the accelerator is selected from imidazole accelerators.
The second object of the present application is to provide a method for preparing the chip stacking and packaging film, comprising:
the preparation method comprises the steps of taking and mixing raw materials according to a proportion, grinding the mixed raw materials into jelly by using a bead mill, carrying out vacuum defoaming to obtain a glue solution, and coating the glue solution by using a coating machine to obtain the packaging film.
The third object of the present application is to provide an application of the chip stacking packaging film in multi-chip stacking packaging.
Compared with the prior art, the application has the following advantages and beneficial effects:
The chip stacking and packaging film has excellent flexibility, fluidity and silicon wafer adhesion, shows excellent wire embedding performance, has low storage modulus and low moisture absorption rate, has low storage modulus, can provide low stress combination between chips, can avoid chip fragmentation or detachment in the multi-chip stacking and packaging body, and can also ensure that the chips do not move in the wire bonding process.
Detailed Description
The present application will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantageous effects of the present application more apparent.
The chip stacking packaging film provided by the embodiment of the application comprises, by mass, 40-45 parts of inorganic filler, 22-25 parts of polyether modified epoxy resin, 15-17 parts of acrylic rubber modified epoxy resin, 5-15 parts of CTBN modified epoxy resin, 10-12 parts of bisphenol F type epoxy resin, 10-15 parts of bisphenol F type benzoxazine, 2-6 parts of curing agent and 0.4-0.8 part of accelerator.
In some embodiments, the polyether modified epoxy resin has the following structure:
。
In some embodiments, the inorganic filler is 40 to 42 parts by mass or 42 to 45 parts by mass.
In some embodiments, the CTBN-modified epoxy resin is 5-8 parts by mass, 5-10 parts by mass, 5-12 parts by mass, 8-10 parts by mass, 8-12 parts by mass, 8-15 parts by mass, 10-12 parts by mass, 10-15 parts by mass, or 12-15 parts by mass.
In some embodiments, the curing agent is 4-5 parts by mass and the accelerator is 0.65-0.7 parts by mass.
In some embodiments, the acrylic rubber modified epoxy resin comprises SR-828R10 type acrylic rubber modified epoxy resin and YLER-200V30 type acrylic rubber modified epoxy resin, wherein the SR-828R10 type acrylic rubber modified epoxy resin comprises 0-12 parts by mass, 0-5 parts by mass, 0-10 parts by mass, 5-12 parts by mass or 10-12 parts by mass, and the YLER-200V30 type acrylic rubber modified epoxy resin comprises 5-15 parts by mass, 5-10 parts by mass or 10-15 parts by mass.
The raw materials used in the examples and comparative examples are specifically as follows:
inorganic filler, spherical silicon dioxide with the grain diameter of 0.1-0.9 um is purchased in the market;
The polyether modified epoxy resin is YLSE-2000 type polyether modified epoxy resin, the epoxy equivalent is 240-260 g/eq, the viscosity is 1500-3000 cps at 25 ℃, and the manufacturer is Nanjing Yuehai new material science and technology Co., ltd;
the acrylic rubber modified epoxy resin comprises SR-828R10 type acrylic rubber modified epoxy resin, wherein the epoxy equivalent is 200-220 g/eq, the viscosity at 25 ℃ is 17000-3700 cps, the YLER-200V30 type acrylic rubber modified epoxy resin, the epoxy equivalent is 200-240 g/eq, the viscosity at 25 ℃ is 10000-50000cps, and SR-828R10 and YLER-200V30 are Nanjing Yuehai new material technology Co., ltd;
CTBN modified epoxy resin is YLSE-C15 CTBN modified epoxy resin, has an epoxy equivalent of 201g/eq and a viscosity of 24700cps at 25 ℃, and is manufactured by Nanjing Yuehai new material science and technology Co., ltd;
bisphenol F type epoxy resin 8170 type bisphenol F type epoxy resin with an epoxy equivalent of 159g/eq and a viscosity of 1000cps at 25 ℃, manufacturer's southern epoxy resin (Kunshan Co., ltd.);
bisphenol F type benzoxazine CB4100 type bisphenol F type benzoxazine, manufacturer is available from high molecular technology Co., ltd;
Dicyandiamide DICY, hydroxyl equivalent weight 21g/eq;
promoter 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Examples and comparative examples provided by the present application are as follows:
Example 1
The raw materials of the embodiment comprise 45 parts by weight of spherical silica, 22 parts by weight of YLSE-2000 type polyether modified epoxy resin, 12 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 5 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 5 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 4 parts by weight of dicyandiamide and 0.65 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 2
The raw materials of the embodiment comprise 42 parts by weight of spherical silica, 22 parts by weight of YLSE-2000 type polyether modified epoxy resin, 10 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 5 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 8 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 4 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 3
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 22 parts by weight of YLSE-2000 type polyether modified epoxy resin, 10 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 5 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 8 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 4 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 4
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 22 parts by weight of YLSE-2000 type polyether modified epoxy resin, 10 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 5 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 10 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 4 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 5
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 25 parts by weight of YLSE-2000 type polyether modified epoxy resin, 10 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 5 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 10 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 5 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 6
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 25 parts by weight of YLSE-2000 type polyether modified epoxy resin, 5 parts by weight of SR-828R10 type acrylic rubber modified epoxy resin, 10 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 10 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F benzoxazine, 5 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 7
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 25 parts by weight of YLSE-2000 type polyether modified epoxy resin, 15 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 10 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 15 parts by weight of CB4100 type bisphenol F type benzoxazine, 5 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 8
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 25 parts by weight of YLSE-2000 type polyether modified epoxy resin, 15 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 12 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 10 parts by weight of CB4100 type bisphenol F type benzoxazine, 5 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Example 9
The raw materials of the embodiment comprise 40 parts by weight of spherical silica, 25 parts by weight of YLSE-2000 type polyether modified epoxy resin, 15 parts by weight of YLER-200V30 type acrylic rubber modified epoxy resin, 15 parts by weight of YLSE-C15 type CTBN modified epoxy resin, 10 parts by weight of 8170 type bisphenol F type epoxy resin, 10 parts by weight of CB4100 type bisphenol F type benzoxazine, 5 parts by weight of dicyandiamide and 0.7 part by weight of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 1
The raw materials of the comparative example comprise 45 parts by mass of spherical silica, 15 parts by mass of YLSE-2000 type polyether modified epoxy resin, 10 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 12 parts by mass of 8170 type bisphenol F type epoxy resin, 18 parts by mass of CB4100 type bisphenol F type benzoxazine, 2 parts by mass of dicyandiamide and 0.5 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 2
The raw materials of the comparative example comprise 45 parts by mass of spherical silica, 18 parts by mass of YLSE-2000 type polyether modified epoxy resin, 10 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 12 parts by mass of 8170 type bisphenol F type epoxy resin, 18 parts by mass of CB4100 type bisphenol F type benzoxazine, 2 parts by mass of dicyandiamide and 0.6 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 3
The raw materials of the comparative example comprise 45 parts by mass of spherical silica, 18 parts by mass of YLSE-2000 type polyether modified epoxy resin, 12 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 12 parts by mass of 8170 type bisphenol F type epoxy resin, 18 parts by mass of CB4100 type bisphenol F type benzoxazine, 3 parts by mass of dicyandiamide and 0.6 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 4
The raw materials of the comparative example comprise 45 parts by mass of spherical silica, 20 parts by mass of YLSE-2000 type polyether modified epoxy resin, 12 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 12 parts by mass of 8170 type bisphenol F type epoxy resin, 15 parts by mass of CB4100 type bisphenol F type benzoxazine, 3 parts by mass of dicyandiamide and 0.6 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 5
The raw materials of the comparative example comprise 42 parts by mass of spherical silica, 20 parts by mass of YLSE-2000 type polyether modified epoxy resin, 12 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 12 parts by mass of 8170 type bisphenol F type epoxy resin, 15 parts by mass of CB4100 type bisphenol F type benzoxazine, 4 parts by mass of dicyandiamide and 0.65 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 6
The raw materials of the comparative example comprise 42 parts by mass of spherical silica, 22 parts by mass of YLSE-2000 type polyether modified epoxy resin, 15 parts by mass of SR-828R10 type acrylic rubber modified epoxy resin, 10 parts by mass of 8170 type bisphenol F type epoxy resin, 15 parts by mass of CB4100 type bisphenol F type benzoxazine, 4 parts by mass of dicyandiamide and 0.65 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
Comparative example 7
The raw materials of the comparative example comprise 42 parts by mass of spherical silica, 22 parts by mass of YLSE-2000 type polyether modified epoxy resin, 5 parts by mass of YLSE-C15 type CTBN modified epoxy resin, 10 parts by mass of 8170 type bisphenol F type epoxy resin, 15 parts by mass of CB4100 type bisphenol F type benzoxazine, 4 parts by mass of dicyandiamide and 0.65 part by mass of 4, 5-bis (hydroxymethyl) -2-phenyl-1H-imidazole.
The products of the above examples and comparative examples are prepared by mixing the raw materials in proportion, grinding the mixed raw materials to a jelly with a bead mill, vacuum defoaming to obtain a glue solution, and coating the glue solution with a coater to obtain the packaging film.
The detection method of each performance parameter of the products of the examples and the comparative examples is as follows:
1. Tensile strength and elongation at break:
Cutting a film material with the size of 10mm and 50mm, namely a spline, tearing off a light release film, adhering two ends of the spline by using adhesive tapes, respectively clamping the adhesive tapes at two ends by using a clamp of a universal material testing machine, tearing off a heavy release film, and testing the tensile strength and the elongation at break of the film.
2. Storage modulus:
Referring to the standard ASTM E2254-2018 test method for determination of storage modulus of dynamic mechanical analyzer, a Film was fabricated as a 25mm size sample of 6.5mm 0.25mm, cured at 170 ℃ for 1h, and the measurement mode: tensile: film (Film stretch), heated to 250 ℃ at 5 ℃ per min, and the storage modulus at 25 ℃ was taken.
3. Temperature rising rheological viscosity:
The film material with the thickness of 25um is pasted with 40 layers to prepare a round sample with the thickness of 1mm and the diameter of 20mm, wherein the test mode is Oscillation Temperature Ramp (oscillation mode temperature change), the temperature is raised to 200 ℃ at the temperature raising rate of 5 ℃ per minute, and the viscosity value at 130 ℃ is taken.
4. Moisture absorption rate:
And (3) sticking 20 layers of film materials with the thickness of 25um, then manufacturing 5 sample strips with the size of 8cm multiplied by 1cm, curing at 170 ℃ for 1 hour, weighing, marking the weight as Ma, then performing a pressure cooker steaming test, steaming at 120 ℃ for 24 hours, wiping off the surface moisture of the sample strips after the steaming test is completed, weighing, marking the weight as Mb, and calculating the water absorption rate (Mb-Ma)/Ma. Averaging the absorptivity of 5 sample bars;
5. Silicon wafer adhesion:
and transferring a single-layer film with the thickness of 25um and the thickness of 3mm to a silicon wafer, covering the silicon wafer above the film, clamping, curing for 1h at 170 ℃, and testing the shearing bonding strength, namely the silicon wafer adhesive force by using a universal tensile machine.
The test data for the performance of the above examples and comparative examples are shown in tables 1-2, respectively. Table 1 is the test data for the performance of the example product and table 2 is the test data for the performance of the comparative example product.
Table 1 test data for product properties of examples
Table 2 test data for comparative product properties
The resin matrix comprises polyether modified epoxy resin, acrylic rubber modified epoxy resin and CTBN modified epoxy resin, wherein the polyether modified epoxy resin is low in viscosity and has excellent fluidity and flexibility, the acrylic rubber modified epoxy resin is excellent in adhesive force, the CTBN modified epoxy resin is low in modulus, and the flexibility, fluidity and silicon wafer adhesive force of a packaging film product can be further improved and the modulus and the moisture absorption rate can be reduced by combining the polyether modified epoxy resin, the acrylic rubber modified epoxy resin and the CTBN modified epoxy resin according to specific use amounts. As can also be seen from the performance parameter data in tables 1-2, the products of examples 1-9 have excellent flexibility, flowability and silicon wafer adhesion, and lower modulus and moisture absorption, compared with the products of comparative examples 1-7, thereby exhibiting more excellent line embedding properties.
The above examples are presented for clarity of illustration only and are not limiting of the embodiments. Other variations and modifications of the above description will be apparent to those of ordinary skill in the art, and it is not necessary or exhaustive of all embodiments, and thus all obvious variations or modifications that come within the scope of the invention are desired to be protected.
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| CN117417619A (en) * | 2023-10-18 | 2024-01-19 | 绵阳惠利电子材料有限公司 | Medium-temperature curing single-component elastic epoxy resin composition |
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