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CN118843836A - Conveying device, exposure device, conveying method, exposure method, and alignment mark - Google Patents

Conveying device, exposure device, conveying method, exposure method, and alignment mark Download PDF

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Publication number
CN118843836A
CN118843836A CN202380026416.8A CN202380026416A CN118843836A CN 118843836 A CN118843836 A CN 118843836A CN 202380026416 A CN202380026416 A CN 202380026416A CN 118843836 A CN118843836 A CN 118843836A
Authority
CN
China
Prior art keywords
substrate
holding portion
conveying
sensor
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380026416.8A
Other languages
Chinese (zh)
Inventor
金丸雄纪
黒岩大祐
森崎嘉武
大川智之
广瀬正明
牛岛康之
若林正宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN118843836A publication Critical patent/CN118843836A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Multimedia (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The conveying device (20) of the present invention comprises: an alignment mechanism (22) for positioning each of the plurality of substrates (P) arranged on the holding section (21) with respect to the holding section (21); an adsorption mechanism (23) for adsorbing the plurality of substrates (P) onto the holding portion (21); and a conveying mechanism (24) for conveying the holding part (21) to the exposure device.

Description

Conveying device, exposure device, conveying method, exposure method, and alignment mark
Technical Field
The invention relates to a conveying device, an exposure device, a conveying method, an exposure method and an alignment mark.
The present application claims priority based on japanese patent application No. 2022-058723 filed on 3/31 of 2022, and the contents thereof are incorporated herein.
Background
In manufacturing a semiconductor device, a liquid crystal display device, and the like by a photolithography process, a projection exposure apparatus is used in which a pattern of a mask (photomask) is transferred onto a substrate via a projection optical system. In order to eliminate the influence of the deflection or flatness of the substrate, there is proposed a device in which the focus position (position in the optical axis direction of the projection optical system) on the substrate is divided into substantially the same regions one by one and the regions are exposed to light (for example, refer to patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 61-232615
Disclosure of Invention
According to a first embodiment of the present invention, a transport apparatus for transporting a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the transport apparatus comprising: an alignment mechanism that positions the first substrate and the second substrate with respect to the holding portion, respectively; and a conveying mechanism that conveys the holding portion in a state where the first substrate and the second substrate have been positioned.
According to a second embodiment of the present invention, an exposure apparatus includes: a housing section for housing the holding section conveyed by the conveying device of the present invention; a stage portion that places the first substrate and the second substrate on an upper surface by accommodating the holding portion in the accommodating portion; a driving unit that drives the stage unit to position the first substrate and the second substrate at an exposure position; and a light projecting unit that irradiates the first substrate and the second substrate with exposure light.
According to a third embodiment of the present invention, a conveying method for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying method comprising: a step of positioning the first substrate and the second substrate with respect to the holding portion by an alignment mechanism; and a step in which the carrying mechanism carries the holding portion in a state in which the first substrate and the second substrate have been positioned.
According to a fourth embodiment of the present invention, an exposure method includes: a step of storing the holding portion conveyed by the conveying method of the present invention in a storage portion; a step of disposing the first substrate and the second substrate on an upper surface of a stage portion by accommodating the holding portion in the accommodating portion; a step of positioning the first substrate and the second substrate at an exposure position by driving the stage unit by a driving unit; and a step in which the light projecting unit irradiates the first substrate and the second substrate with exposure light.
According to a fifth embodiment of the present invention, an alignment mark is provided on a substrate, the alignment mark including: a first pattern composed of a plurality of first lines extending in a first direction; and a second pattern including a plurality of second lines extending in a second direction, the second lines intersecting the first pattern, the second lines being arranged so that the second lines include different values at intervals therebetween.
Drawings
Fig. 1 is a front view of a main structure of an exposure apparatus according to the present invention.
Fig. 2 is a plan view of the exposure apparatus shown in fig. 1 in a state where a substrate is disposed.
Fig. 3 is a detailed view of the plate holder of the exposure apparatus.
FIG. 4 is a front view of the conveying device of the present invention.
Fig. 5 is a plan view of the conveyance device shown in fig. 4 in a state where the substrate is disposed.
FIG. 6 is a diagram showing a reference side of a substrate.
FIG. 7 is a detail of the alignment mark of the present invention.
FIG. 8 is a cross-sectional view of a substrate before an exposure process is performed.
Fig. 9 is a first diagram relating to focusing of the exposure apparatus and the substrate.
Fig. 10 is a second diagram relating to focusing of the exposure apparatus and the substrate.
Fig. 11 is a third diagram relating to focusing of the exposure apparatus and the substrate.
Fig. 12 is a fourth diagram relating to focusing of the exposure apparatus and the substrate.
Fig. 13 is a first state of a process of transporting a substrate to an exposure apparatus by a transport apparatus.
Fig. 14 is a second state of the process of transporting the substrate to the exposure apparatus by the transport apparatus.
Fig. 15 is a third state of the process of transporting the substrate to the exposure apparatus by the transport apparatus.
Fig. 16 shows a fourth state of the process of transporting the substrate to the exposure apparatus by the transport apparatus.
Fig. 17 is a fifth state of the process of transporting the substrate to the exposure apparatus by the transport apparatus.
Detailed Description
(Regarding the exposure System 100)
Hereinafter, an exposure system 100 according to an embodiment of the present invention will be described with reference to the drawings.
The exposure system 100 of the present embodiment includes an exposure device 10 and a conveyance device 20. The exposure system 100 is used, for example, when a Touch Panel (TP) circuit or a Color Filter (CF) circuit is formed on the upper surface of a substrate P in manufacturing an organic Electroluminescence (EL) display.
The substrate P is formed by forming a thin film transistor (Thin Film Transistor, TFT) on a glass plate by vapor deposition or the like, for example, and sealing the thin film transistor. In the present embodiment, the substrate P has a rectangular shape. The size of the substrate P is a so-called half G6 (925 mm×1500 mm) size obtained by dividing a plate of G6 size (1850 mm×1500 mm) into half pieces.
The exposure apparatus 10 is used for forming a TP circuit or a CF circuit on a substrate P. The exposure apparatus 10 projects and exposes a circuit pattern of a TP circuit or a CF circuit of a photomask, not shown, onto a substrate P provided in the exposure apparatus 10. A photomask is a glass plate that is patterned with electronic circuitry.
In the present embodiment, two substrates P are conveyed to the exposure apparatus 10 at a time. Hereinafter, as shown in fig. 1, a substrate P positioned on the negative side in the first direction X of two substrates P arranged in the exposure apparatus 10 is referred to as a first substrate P1. The substrate P positioned on the positive side in the first direction X is referred to as a second substrate P2. When the first substrate P1 and the second substrate P2 are not distinguished, they are referred to as a substrate P.
As shown in fig. 1 and 9, the exposure apparatus 10 includes a stage 11, a take-out mechanism 12, a lens 13, a focusing unit 14, an optical device, a driving unit, a light projecting unit, and a storage unit, in addition to a photomask not shown.
The stage 11 is a portion where the substrate P is disposed when the substrate P is exposed by the exposure apparatus 10. As shown in fig. 1,2, and 3, the stage 11 includes a housing 11d, a third sensor 11p1, a fourth sensor 11p2, and a vacuum suction mechanism 11v.
As shown in fig. 1, the housing portion 11d is a groove provided in the platform portion 11. The housing portion 11d houses a holding portion 21 (described below) of the conveying device 20, which is conveyed by the conveying device 20. The stage 11 accommodates the holding portion 21 that holds the first substrate P1 and the second substrate P2 in the accommodation portion 11d. Thus, the first substrate P1 and the second substrate P2 are disposed on the upper surface of the stage 11.
The third sensor 11P1 detects the position of the first substrate P1 with respect to the stage 11. The fourth sensor 11P2 detects the position of the second substrate P2 with respect to the stage 11. The third sensor 11p1 and the fourth sensor 11p2 are so-called known contact potentiometers. Hereinafter, when the third sensor 11p1 and the fourth sensor 11p2 are not distinguished, they are referred to as the platform sensor 11p.
The stage sensor 11P detects the position of the substrate P by measuring the position of the end surface of the substrate P. Specifically, the stage sensor 11P measures the position of the end surface corresponding to the reference side of the rectangular substrate P.
In the present embodiment, as shown in fig. 6, the reference side is a side located on the negative side in the first direction X (hereinafter referred to as a first side S1) of the substrate P in the second direction Y, and a side located on the positive side in the second direction Y (hereinafter referred to as a second side S2) of the substrate P in the first direction X. The reference sides are provided on the respective substrates P. The positions of the first side S1 and the second side S2 are the same in any substrate P.
As shown in fig. 2 and 6, at least three third sensors 11P1 are provided with respect to the first substrate P1. Specifically, the third sensor 11P1 is provided at two places along the second side S2 with respect to the first substrate P1, for example, at one place on the first side S1.
As shown in fig. 2 and 6, at least three fourth sensors 11P2 are provided with respect to the second substrate P2. Specifically, the fourth sensor 11P2 is provided at two positions along the second side S2 with respect to the second substrate P2, for example, at one position on the side opposite to the first side S1. At this time, the third sensor 11P1 provided on the first side S1 of the first substrate P1 and the fourth sensor 11P2 provided on the side of the second substrate P2 opposite to the first side S1 are preferably located in the vicinity of the side opposite to each of the second sides S2. Accordingly, it is preferable to further improve the accuracy of detecting the positions of the first and second substrates P1 and P2 by the third and fourth sensors 11P1 and 11P 2.
The vacuum suction mechanism 11v prevents the substrate P disposed on the upper surface of the stage 11 from being positionally shifted with respect to the stage 11. Thereby, the stage 11 holds the first substrate P1 and the second substrate P2 by suction. As shown in fig. 3, the vacuum suction mechanism 11v includes a plurality of holes provided in the upper surface of the stage 11. The vacuum suction mechanism 11v reduces the air pressure inside the hole in a state where the opening of the hole is blocked by the substrate P. Thereby, the vacuum suction mechanism 11v suctions and holds the substrate P to the stage 11. When the position of the substrate P is detected by the stage sensor 11P, the substrate P is held by the stage 11. Thereby, the positional displacement of the substrate P is prevented by the contact type stage sensor 11P.
The take-out mechanism 12 has a function of taking out the exposed substrate P from the exposure apparatus 10. The substrate P is transported into the exposure apparatus 10 in a state of being placed on a holding portion 21 provided in a transport apparatus 20 described below. When the substrate P is taken out from the exposure apparatus 10, the substrate P is taken out together with the holding portion 21 in a state of being placed on the holding portion 21. Therefore, the take-out mechanism 12 has a shape that can grip the holding portion 21 without directly contacting the substrate P. The extraction mechanism 12 is movable in the first direction X shown in fig. 1 in a state where the holding portion 21 is gripped.
The lens 13 is disposed between the photomask and the substrate P, and projects a circuit pattern drawn on the photomask. As shown in fig. 9, a plurality of lenses 13 of the exposure apparatus 10 are provided at intervals along the Y direction. The lenses 13 are arranged in two rows along the Y direction. The focusing unit 14 recognizes the position of the surface of the substrate P and outputs the position as information for adjusting the position of the lens 13. The information output by the focusing unit 14 is used when the exposure apparatus 10 focuses on the substrate P (described in detail below).
The optical device is not shown and is provided in the vicinity of the lens 13. The optical machine uses a known microscope. The optical machine detects the positions of alignment marks AM (described below) formed on the first and second substrates P1 and P2. Thereby, the position of the substrate P inside the exposure apparatus 10 is measured.
The driving unit is not shown in the drawings and drives the stage unit 11. The driving section positions the first substrate P1 and the second substrate P2 at the exposure position. The exposure position is a predetermined position of the substrate P when the light projecting section irradiates exposure light. That is, the driving unit drives the stage unit 11 so that the positions of the first substrate P1 and the second substrate P2 with respect to the light projecting unit are set to predetermined positions.
The driving section drives the stage section 11 based on the detection results of the third sensor 11p1 and the fourth sensor 11p2, for example. That is, the stage 11 is driven based on information about the position of the substrate P detected by the third sensor 11P1 and the fourth sensor 11P 2.
The driving section may drive the stage section 11 based on the detection result of the optical machine. That is, the stage 11 may be driven based on information on the position of the alignment mark AM detected by the optical machine.
The driving unit may drive the stage unit 11 using information of the positional relationship between the optical devices and the third sensor 11p1 and the fourth sensor 11p2 stored in the storage unit.
The respective pieces of information, that is, the detection results of the third sensor 11p1 and the fourth sensor 11p2, the detection results of the optical device, and the information of the positional relationship stored in the storage unit may be used solely by the drive unit. The information may be used by appropriately selecting any two of the above-mentioned information by the driving unit. The drive unit may use all the information at the same time.
The driving part may drive the stage part 11 to position the first substrate P1 at the exposure position. At this time, the driving section may drive the stage section 11 to position the second substrate P2 at the exposure position after the irradiation of the exposure light to the first substrate P1 is completed.
The light projecting section irradiates the first substrate P1 and the second substrate P2 with exposure light, not shown. The light projecting unit irradiates exposure light onto the positioned first substrate P1 and second substrate P2.
The storage unit is not shown in the figure and stores the positional relationship between the third sensor 11p1 and the fourth sensor 11p2 and the optical device. The storage unit uses a known flash memory, for example. Other recording devices may be used as appropriate for the storage unit.
The conveying device 20 conveys the substrate P. The conveyor 20 has a function of disposing the conveyed substrate P inside the exposure apparatus 10. The conveying device 20 has a size capable of conveying the G6-sized board. The carrying device 20 in the present embodiment is particularly preferably used when carrying two of the half G6 sizes at the same time and being provided in the exposure device 10.
As shown in fig. 4, the conveying device 20 includes a holding unit 21, an aligning unit 22, an adsorbing unit 23, a conveying unit 24, a sensor 25, a control unit 26, and an obtaining unit. In the present embodiment, the respective structures are held by the mount portion 20R. The mount portion 20R includes a first mount portion 20R1, a second mount portion 20R2, and a third mount portion 20R3.
The first mount portion 20R1 is located at an upper portion of the mount portion 20R. The first mount portion 20R1 holds the holding portion 21, for example.
The second mount portion 20R2 extends in the up-down direction. The lower end of the second mount portion 20R2 is connected to the third mount portion 20R3, and the upper end of the second mount portion 20R2 is connected to the first mount portion 20R1. Thereby, the second mount portion 20R2 holds the first mount portion 20R1.
The third mount portion 20R3 is located below the mount portion 20R. The third mount portion 20R3 supports, for example, the horizontal moving portion 22b of the alignment mechanism 22.
The holding portion 21 conveys the substrate P. That is, the holding portion 21 carries the substrate P when the substrate P is carried and set in the exposure apparatus 10. The holding portion 21 is, for example, a lattice-shaped member. The holding portion 21 has a size capable of placing the G6-sized substrate P without protruding from the holding portion 21. That is, the holding portion 21 has a size capable of placing at least two substrates P of half G6 size. In the present embodiment, the first substrate P1 and the second substrate P2 having at least the size of half G6 are disposed in the holding portion 21.
As described above, the holding portion 21 is disposed in the first mount portion 20R1. At this time, the holding portion 21 is held by the first mount portion 20R1 by, for example, a damascene structure. Accordingly, the holding portion 21 is preferably held at a fixed position with respect to the first mount portion 20R1.
The alignment mechanism 22 positions the first substrate P1 and the second substrate P2 with respect to the holding portion 21. As described above, the substrate P is set inside the exposure apparatus 10 in a state of being placed on the holding portion 21. At this time, if the position of the substrate P is shifted from the holding portion 21, the alignment process of the substrate P by the exposure apparatus 10 cannot be performed normally, and productivity is lowered due to the stop of the exposure process, the reloading process of the substrate P, and the like. In order to prevent this, the alignment mechanism 22 has an effect of aligning the substrate P with respect to the holding portion 21.
As described above, the holding portion 21 has a size capable of holding two substrates P of half G6 size. Therefore, the alignment mechanism 22 has a function of being able to separately adjust the positions of at least the two substrates P disposed on the holding portion 21.
The alignment mechanism 22 includes a first alignment mechanism 221, a second alignment mechanism 222, and a horizontal movement portion 22b. The first alignment mechanism 221 positions the first substrate P1. The second alignment mechanism 222 positions the second substrate P2. Thereby, the first substrate P1 and the second substrate P2 are positioned separately.
The first alignment mechanism 221 includes a first grip 22a1 and a first up-and-down movement 22c1.
The first grip 22a1 supports the first substrate P1 from below. The first gripping portion 22a1 is a portion that directly contacts the first substrate P1 located on the holding portion 21 and grips the first substrate P1. As shown in fig. 4, 13, and the like, the first grip 22a1 is a sword-shaped member. The first grip 22a1 is located below the holding portion 21. Here, as described above, the holding portion 21 is a lattice-shaped member. By providing such a shape and positional relationship, the first holding portion 22a1 is brought closer to the first substrate P1 disposed on the holding portion 21 from the lower side of the holding portion 21. The first holding portion 22a1 lifts up from the lower side of the holding portion 21 through the lattice-shaped gaps of the holding portion 21 to hold the first substrate P1.
The first up-and-down moving portion 22c1 moves the first grip portion 22a1 in the vertical direction. Here, the up-down direction refers to a third direction Z shown in fig. 4. That is, the first up-and-down movement portion 22c1 moves the first grip portion 22a1 in the straight direction along the third direction Z. In the present embodiment, as shown in fig. 4, one first up-and-down moving portion 22c1 is provided with respect to one first grip portion 22a 1.
As shown in fig. 4, the second alignment mechanism 222 includes a second grip 22a2 and a second up-and-down movement 22c2.
The second holding portion 22a2 supports the second substrate P2 from below. The second grip portion 22a2 is similar in detail to the first grip portion 22a 1. Hereinafter, when the first grip 22a1 and the second grip 22a2 are not distinguished, they are referred to as the grips 22a.
The second up-and-down moving portion 22c2 moves the second grip portion 22a2 in the vertical direction. The second up-and-down moving portion 22c2 has the same detailed structure as the first up-and-down moving portion 22c 1. Hereinafter, when the first up-and-down movement portion 22c1 and the second up-and-down movement portion 22c2 are not distinguished, they are referred to as up-and-down movement portions 22c.
The horizontal movement portion 22b moves at least one of the first grip portion 22a1 and the second grip portion 22a2 in the horizontal direction. Here, the horizontal direction refers to the first direction X and the second direction Y shown in fig. 1 and the like. That is, the horizontal movement portion 22b moves the grip portion 22a in the straight direction along the first direction X and the second direction Y. The horizontal movement section 22b rotates the grip section 22a with the third direction Z as a rotation axis. Thereby, the alignment mechanism 22 moves the substrate P in the horizontal direction.
In the present embodiment, as shown in fig. 4, only one horizontal movement portion 22b is provided with respect to the first grip portion 22a1 and the second grip portion 22a 2. Alternatively, the first grip 22a1 and the second grip 22a2 may be provided with one horizontal movement portion 22 b.
The alignment mechanism 22 positions the first substrate P1 and the second substrate P2 based on detection results of the first sensor 25a and the second sensor 25b described below, for example. That is, the first substrate P1 and the second substrate P2 are positioned based on the information on the position of the substrate P on the holding portion 21 detected by the first sensor 25a and the second sensor 25 b.
The alignment mechanism 22 may also position the first substrate P1 and the second substrate P2 based on the relative positions of the first substrate P1 and the second substrate P2. Specifically, the position of the second substrate P2 with respect to the first substrate P1 may be positioned based on the relative positions of the first substrate P1 and the second substrate P2.
The alignment mechanism 22 may also position the first substrate P1 and the second substrate P2 with respect to the holding portion 21 based on the information obtained by the obtaining portion. The information obtained by the obtaining section will be described below.
The respective pieces of information, that is, the detection results of the first sensor 25a and the second sensor 25b, the relative positions of the first substrate P1 and the second substrate P2, and the information obtained by the obtaining unit may be used solely by the alignment mechanism 22. The information may be used by the alignment mechanism 22 by appropriately selecting any two of them. The information may also be used by alignment mechanism 22 all at once.
The suction mechanism 23 suctions and holds the first substrate P1 and the second substrate P2 to the holding portion 21. As shown in fig. 3, the adsorbing mechanism 23 is provided in the holding portion 21. The substrate P is sucked by the suction mechanism 23, and the suction mechanism 23 fixes the substrate P to the holding portion 21. The suction mechanism 23 is, for example, an opening provided at one end of a tube arranged in a lattice shape along the holding portion 21. A mechanism for sucking air is provided at the other end of the tube. When the substrate P is fixed to the holding portion 21, the suction mechanism 23 is in close contact with the substrate P to suck air from the inside of the tube. Thereby, the suction mechanism 23 performs vacuum suction with respect to the substrate P. In this way, the suction mechanism 23 fixes the substrate P to the holding portion 21.
The conveying mechanism 24 conveys the holding portion 21 in a state where the first substrate P1 and the second substrate P2 are positioned on the holding portion 21. Specifically, the carrying mechanism 24 carries the holding portion 21 to the exposure apparatus 10. Or the holding portion 21 disposed inside the exposure apparatus 10 is taken out from the exposure apparatus 10. As shown in fig. 13, the conveying mechanism 24 grips the holding portion 21 from both sides in the second direction Y of the holding portion 21. In this state, the conveyance mechanism 24 is moved in the first direction X by a not-shown movement mechanism. Thereby, the holding unit 21 is conveyed by the conveying mechanism 24.
The sensor 25 detects the position of the substrate P. Specifically, the sensor 25 detects the position of the substrate P by measuring the position of the end surface of the substrate P. The sensor 25 is provided in the holding portion 21, for example. The sensor 25 may be provided in the first mount portion 20R1. In the present embodiment, a known noncontact line sensor is suitably used as the sensor 25. Thereby, the positional displacement of the substrate P is prevented by using the contact sensor 25.
When the sensor 25 is provided in the holding portion 21, the substrate P is directly aligned with respect to the holding portion 21. In this case, the sensor 25 is carried into the exposure apparatus 10 by the carrying mechanism 24 together with the holding portion 21. Therefore, the sensor 25 is preferably a wireless line sensor, for example.
When the sensor 25 is provided in the first mount portion 20R1, the substrate P is aligned with respect to the first mount portion 20R 1. Here, the holding portion 21 is held at a fixed position with respect to the first mount portion 20R1 as described above. Therefore, when the sensor 25 is provided in the first mount portion 20R1, the substrate P is indirectly aligned with respect to the holding portion 21.
In the present embodiment, as shown in fig. 5, the sensor 25 that detects the position of the first substrate P1 with respect to the holding portion 21 is referred to as a first sensor 25a. The sensor 25 that detects the position of the second substrate P2 with respect to the holding portion 21 is referred to as a second sensor 25b. Hereinafter, when the first sensor 25a and the second sensor 25b are not distinguished, they are referred to as the sensors 25.
The first sensor 25a is disposed with respect to the reference side of the first substrate P1. As shown in fig. 5, the first sensors 25a are provided at least three with respect to the first substrate P1. Specifically, the first sensor 25a is provided at two places along the second side S2, for example, with respect to the first substrate P1, and at one place on the first side S1.
The second sensor 25b is provided with respect to a side corresponding to the reference side of the first substrate P1 among the sides of the second substrate P2. As shown in fig. 5, the second sensors 25b are provided at least three with respect to the second substrate P2. Specifically, the second sensor 25b is provided at two positions along the second side S2 with respect to the second substrate P2, for example, and is provided at one position on the side opposite to the first side S1.
At this time, the first sensor 25a provided on the first side S1 of the first substrate P1 and the second sensor 25b provided on the side of the second substrate P2 opposite to the first side S1 are preferably located in the vicinity of the side opposite to each of the second sides S2. Accordingly, it is preferable to further improve the accuracy of detecting the position of the substrate P by the sensor 25.
Here, as described above, the two substrates P of half G6 size are arranged in the holding portion 21. Thus, in the present embodiment, the total of six sensors 25 are provided in the holding portion 21. By providing such an arrangement, in addition to the positional shift in the two directions of the plane on which the substrate P is arranged, that is, the straight direction of the first direction X and the second direction Y, it is helpful to grasp the positional shift in the rotation direction with the third direction Z as the rotation axis.
The control unit 26 controls the alignment mechanism 22 based on the detection result of the sensor 25. Specifically, first, the amount of displacement of the substrate P with respect to the holding portion 21 is calculated based on the position of the substrate P detected by the sensor 25. The offset amounts are an offset amount in the straight direction of the first direction X and the second direction Y, and an offset amount in the rotation direction with the third direction Z as the rotation axis. Based on the calculation result, the substrate P is appropriately moved by the alignment mechanism 22. Thereby, the substrate P is aligned with respect to the holding portion 21. As shown in fig. 4, the control unit 26 is connected to the respective structures by cables. Or the control portion 26 may be built in any portion of the respective structures.
The control unit 26 includes a processor such as a central processing unit (Central Processing Unit, CPU) and a memory connected via a bus, for example, and executes a control program configured in advance to control the alignment mechanism 22. The control unit 26 may be implemented using hardware such as an Application SPECIFIC INTEGRATED Circuit (ASIC), a programmable logic device (Programmable Logic Device, PLD), or a field programmable gate array (Field Programmable GATE ARRAY, FPGA). The program may be recorded on a computer-readable recording medium. The computer readable recording medium is, for example, a portable medium such as a floppy disk, a magneto-optical disk, a Read Only Memory (ROM), a Compact Disc-Read Only Memory (CD-ROM), or a storage device such as a hard disk incorporated in a computer system. The program may also be transmitted via a telecommunication line.
The obtaining section obtains at least two of information on the relative position of the first substrate P1 and the second substrate P2, information on the relative position of the first substrate P1 and the holding section 21, and information on the relative position of the second substrate P2 and the holding section 21. The obtaining unit has a structure not shown. The obtaining unit is a processing device connected to the first sensor 25a and the second sensor 25 b. The obtaining unit transmits the respective information to the control unit 26, for example. This enables the control unit 26 to use the information when operating the alignment mechanism 22.
(Regarding alignment mark AM)
Next, the alignment mark AM provided on the substrate P will be described. The alignment mark AM is used to grasp the position of the substrate P transported to the inside of the exposure apparatus 10 by an optical device provided in the exposure apparatus 10. Using the information, the exposure apparatus 10 performs positional alignment of the substrate P with higher accuracy inside the exposure apparatus 10.
As shown in fig. 6, the alignment marks AM are arranged at intervals along the first side S1 of the rectangular substrate P and the side facing the first side S1. The positional relationship of the alignment mark AM in the substrate P is recorded in the exposure apparatus 10 in advance. Thus, the exposure apparatus 10 grasps the position of the substrate P inside the exposure apparatus 10. The plurality of alignment marks AM shown in fig. 6 are schematic, and are different from the actual size or interval.
Here, when the first substrate P1 and the second substrate P2 are aligned based on the first side S1, the second substrate P2 may be shifted in position on the side opposite to the first side S1 according to the outline tolerance of the substrate P. In order to accommodate the positional deviation, as shown in fig. 6, a crossing range T for accommodating the tolerance of the size of the substrate P is provided on the side of the second substrate P2 facing the first side S1.
For example, the stage sensor 11P (fourth sensor 11P 2) that measures the position of the side of the second substrate P2 opposite to the first side S1 is affected by the outer tolerance of the substrate P, and the measured value is subject to errors. In measuring the alignment mark AM, it is necessary to absorb the error. As a method of absorbing the error, for example, the alignment mark AM is enlarged. Or the field of view of the optical machine may be enlarged.
In the present embodiment, the error is absorbed by increasing the detection range of the alignment mark AM in the first direction X by making the alignment mark AM have the following configuration.
That is, as shown in fig. 7, the alignment mark AM includes a first line AM1, a second line AM2, and a coordinate point AM3. The first line AM1 extends in a first direction X. The first lines AM1 are arranged at intervals along the second direction Y. The first pattern AM1P is formed by the plurality of first lines AM1 arranged. The second line AM2 extends in the second direction Y. The second lines AM2 are arranged at intervals along the first direction X. The second pattern AM2P is formed by the plurality of second lines AM2 arranged. The first pattern AM1P and the second pattern AM2P are disposed to cross each other. The first pattern AM1P is disposed to intersect the second pattern AM2P. The second pattern AM2P is disposed to intersect the first pattern AM1P. The first line AM1 is longer than the second line AM2.
The coordinate point AM3 is a point that becomes a reference when the alignment mark AM is provided on the substrate P. The coordinate point AM3 is provided in a gap in the center among gaps of the plurality of arranged second lines AM 2. The sensor 25 grasps the position of the substrate P by grasping the position of the coordinate point AM 3.
As shown in fig. 7, the first line AM1 has a pair of first and second lines AM1a and AM1b, respectively, in the second direction Y. The first line AM1a is located on one end side in the first direction X with the coordinate point AM3 as a boundary. The second first line AM1b is located on the other end side in the first direction X with the coordinate point AM3 as a boundary. Thus, the gaps in the second direction Y between the first lines AM1 are defined by the coordinate point AM3, and only one gap is provided on each of the one end side and the other end side in the first direction X. Hereinafter, when the first line AM1a and the second line AM1b are not distinguished, they are referred to as a first line AM1.
The first line AM1a is arranged at one end side in the first direction X with a first distance therebetween along the second direction Y, with the coordinate point AM3 being defined. The second first line AM1b is disposed at the other end side in the first direction X along the second direction Y at intervals of a second distance different from the first distance. The first distance, that is, the gap between the first lines AM1a is d1. The second distance, that is, the gap between the second first lines AM1b is d2 (d 2> d 1). As described above, the first lines AM1 are different from each other in the first direction X with the coordinate point AM3 as a boundary. The first pattern AM1P includes: a first group (for example, a pair of first lines AM1 a) constituted by first lines AM1 arranged at a first interval (for example, d1 which is a gap between the first lines AM1 a); and a second group (for example, a pair of second first lines AM1 b) constituted by first lines AM1 arranged with a second interval (for example, a gap d2 between the second first lines AM1 b) different from the first interval. The second group (for example, a pair of second first lines AM1 b) is arranged at a position not overlapping with the first group (for example, a pair of first lines AM1 a) in the first direction X.
The second lines AM2 are provided at least four or more in the first direction X. Thereby, the gaps between the second lines AM2 are set at least three or more. In the present embodiment, as shown in fig. 7, the second line AM2 has a pair of first, second, third, fourth, fifth, sixth, and seventh second lines AM2a, AM2b, AM2c, AM2d, AM2e, AM2f, and AM2g, respectively, in the first direction X about the coordinate point AM 3. Hereinafter, when these cases are not distinguished, it is referred to as a second line AM2. Further, the gap between the second lines AM2 is smallest between the first and second lines AM2a having the coordinate point AM3 inside. The gap between the second lines AM2 is set to be larger as it is farther from the coordinate point AM 3. In other words, the second lines AM2 are arranged so that the distance between the second lines AM2 increases as the second lines become the end side in the first direction X. The plurality of second lines AM2 are arranged such that the intervals between adjacent second lines AM2 gradually change in the first direction X. The plurality of second lines AM2 are arranged such that the intervals between the adjacent second lines AM2 become larger as the distance from the predetermined position increases. The predetermined position is a set coordinate position (for example, a coordinate point AM 3) of the alignment mark AM.
In the present embodiment, the gap between the sixth second line AM2f and the seventh second line AM2g is the largest among the gaps between the second lines AM 2. Specifically, for example, the size of the gap between the first and second lines AM2a is d3. The gap between the second lines AM2 is set such that the size of the gap gradually increases Δd each time the distance from the coordinate point AM3 increases. That is, the gap between the sixth second line AM2f and the seventh second line AM2g is, for example, d3+Δdx6. As described above, the intervals of the second lines AM2 are different from each other in the first direction X. The plurality of second lines AM2 are arranged in such a manner that the intervals between each other include different values.
By providing the first line AM1 and the second line AM2 with such a configuration, the shapes of the plurality of quadrangles formed by the first line AM1 and the second line AM2 are different. The second pattern AM2P is arranged such that all of a plurality of quadrangles formed by crossing the plurality of second lines AM2 and the plurality of first lines AM1 have different shapes. As a result, the quadrilateral formed by the alignment mark AM can be grasped as a quadrilateral at a position with respect to the coordinate point AM3 by grasping the size of the gap between the first lines AM1 and the size of the gap between the second lines AM2 by the optical device. Thus, the exposure apparatus 10 grasps the position of the substrate P based on the alignment mark AM.
Not limited to the above, the position of the substrate P can be grasped as long as at least one of the plurality of quadrangles provided in the alignment mark AM can be measured in the visual field of the optical device. Thus, according to the alignment mark AM of the present embodiment, the position of the substrate P can be easily detected without enlarging the field of view of the optical device.
The alignment mark AM is preferably provided with both a longer dimension (e.g., d 4) and a shorter dimension (e.g., d4×1/2) in the first direction X. The longer dimension in the first direction X is provided along the first side S1 of the substrate P, for example. The shorter dimension of the first direction X is provided along the side of the substrate P facing the first side S1. Thus, the optical device can grasp the longer dimension of the first direction X first, and thus the subsequent detailed position can be easily detected. Here, regarding the dimension in the first direction X being shorter, the dimension is set to d4×1/2, but is not limited thereto. The size may be appropriately determined within a range that can be detected by an optical machine.
(Focusing at the time of exposure)
Next, focusing at the time of exposure by the exposure apparatus 10 will be described with reference to fig. 8 to 12. As shown in fig. 8, the surface of the substrate P at the time of exposure in the present embodiment has a step between the touch panel TP and the polyimide layer PI. Focusing is performed by an Auto Focus (AF) function provided in the exposure apparatus 10, following the touch panel TP and the polyimide layer PI, and there is a problem in that a focus shift occurs near the boundary line between the touch panel TP and the polyimide layer PI.
Therefore, in the present embodiment, the above-described situation is avoided by the following method. That is, as shown in fig. 9, the vicinity of the boundary between the touch panel TP and the polyimide layer PI is set as the forbidden band a. Then, in the transport device 20, the substrate P enters the exposure device 10, and as shown in fig. 10, when the focusing unit 14 of the exposure device 10 reaches the forbidden band a, the focusing value of the exposure device 10 is fixed. Then, as shown in fig. 11, after the focusing section 14 of the exposure apparatus 10 passes through the forbidden band a, the fixation of the focus value of the exposure apparatus 10 is released. As described above, by always aligning the touch screen panel TP, the problem is avoided.
Here, as shown in fig. 12, depending on the substrate P, the position of the boundary line between the touch screen TP and the polyimide layer PI may coincide with the position of the focusing section 14 of the exposure apparatus 10 in the second direction Y (x portion shown in fig. 12). In this case, since the portion cannot be set as the forbidden band a, the following countermeasure is taken.
That is, the boundary line can be ignored by supplementing the focus value measured by the focus unit 14 of the exposure apparatus 10 with the deviation. Alternatively, the position of the boundary line between the touch panel TP and the polyimide layer PI may be prevented from matching the position of the focusing section 14 of the exposure apparatus 10 by moving the portion measured by the focusing section 14 of the exposure apparatus 10 in the second direction Y.
By either countermeasure, it is ensured that the focus is surely focused on the touch panel TP at the time of exposure by the exposure apparatus 10.
(Method for transporting substrate P)
Next, a method of conveying the substrate P according to the present embodiment will be described with reference to fig. 13 to 17. In the present embodiment, the substrate P is conveyed using the holding portion 21 in which the first substrate P1 and the second substrate P2 are disposed. Specifically, the substrate P is transported from the transport device 20 to the exposure device 10 in a state of being placed on the holding portion 21. The substrate P is set on the stage 11 provided in the exposure apparatus 10 at the time of exposure by the exposure apparatus 10. The sequence of the steps will be described below.
The method for transporting the substrate P according to the present embodiment includes an information obtaining step, a positioning step, and a transporting step.
The information obtaining step is a step in which the obtaining portion obtains at least two of information on the relative position of the first substrate P1 and the second substrate P2, information on the relative position of the first substrate P1 and the holding portion 21, and information on the relative position of the second substrate P2 and the holding portion 21. The acquisition of the respective information uses a sensor 25. The obtaining unit obtains each information detected by the sensor 25, and transmits the information to the control unit 26. Thus, the movement amount required for the first substrate P1 and the second substrate P2 in the positioning step is determined by the control unit 26.
The positioning step is, for example, a step in which the alignment mechanism 22 positions the first substrate P1 and the second substrate P2 with respect to the holding portion 21.
In the positioning step, the first substrate P1 and the second substrate P2 are positioned based on the relative positions of the first substrate P1 and the second substrate P2, for example.
In the positioning step, the alignment mechanism 22 may position the first substrate P1 and the second substrate P2 with respect to the holding portion 21 based on the information obtained by the obtaining portion.
First, as shown in fig. 13, each of the exposure apparatus 10 and the transfer apparatus 20 is provided with a holding portion 21 in a state where the substrate P is not placed. From this state, as shown in fig. 14, the substrate P is placed on the grip portion 22a provided on the conveyor 20 from the external device G. In the present embodiment, as shown in fig. 14, the first substrate P1 and the second substrate P2 are disposed on the holding portion 22a, respectively.
After the substrate P is placed on the grip 22a, the position of the substrate P is aligned by the grip 22a as shown in fig. 15. At this time, the movement direction, movement distance, and rotation angle of the substrate P are determined by the control unit 26 based on the positional information of the substrate P detected by the sensor 25. In the present embodiment, one grip portion 22a is provided for one substrate P, and the grip portion 22a is driven by the horizontal movement portion 22b and the vertical movement portion 22c, respectively. As described above, after aligning the substrate P at a predetermined position, the grip 22a is lowered. Then, the substrate P is placed on the holding portion 21. This enables the substrate P to be transported to the exposure apparatus 10. The positioning step is completed in the manner described.
The conveying step is a step in which the conveying mechanism 24 conveys the holding portion 21. At this time, the first substrate P1 and the second substrate P2 are positioned with respect to the holding portion 21. After the alignment of the substrate P with respect to the holding portion 21 is completed, the substrate P is fixed with respect to the holding portion 21 by the suction mechanism 23. Then, as shown in fig. 16, the holding unit 21 is conveyed to the exposure apparatus 10 by the conveying mechanism 24. That is, the plurality of substrates P are positioned and adsorbed on the holding portion 21, respectively, and then the holding portion 21 is transported to the exposure apparatus 10. Here, as shown in fig. 16, when the holding portion 21 is conveyed to the exposure apparatus 10 by the conveying mechanism 24, the holding portion 21 is also disposed on the exposure apparatus 10 side, and therefore the substrate P cannot be placed on the stage 11 in this state.
Therefore, as shown in fig. 17, the holding portion 21 disposed on the table portion 11 is moved to the conveyor 20 by the take-out mechanism 12. Thereafter, the substrate P placed on the holding portion 21 and conveyed to the exposure apparatus 10 by the conveying mechanism 24 is placed on the stage 11. As shown in fig. 17, the platform 11 has a housing portion 11d for housing the lattice-shaped holding portion 21. Therefore, when the holding portion 21 is moved downward in the third direction Z so as to accommodate the holding portion 21 in the space, only the substrate P is placed on the stage 11. Thereafter, the take-out mechanism 12 for conveying the holding portion 21 to the conveying device 20 and the conveying mechanism 24 for conveying the holding portion 21 to the exposure device 10 are returned to the exposure device 10 and the conveying device 20, respectively.
After the substrate is placed on the stage 11, the substrate P is fixed to the stage 11 by a vacuum suction mechanism 11v provided in the stage 11. After the state is established, the exposure process by the exposure apparatus 10 is started.
During the exposure operation, the substrate P is preferably placed again on the holding portion 21 that is conveyed to the conveyor 20 by the take-out mechanism 12 by the external device G, and is aligned by the grip portion 22 a. In this way, the exposed substrate P can be moved to the transfer device 20 by the take-out mechanism 12, and a new substrate can be transferred to the exposure device 10 by the transfer mechanism 24. Therefore, the exposure operation can be efficiently performed without having to have a waiting time for the exposure apparatus 10.
(Exposure method for substrate P)
Next, an exposure method of the substrate P of the present embodiment will be described. The exposure method of the substrate P of the present embodiment includes a housing step, an arrangement step, a positioning step, and an irradiation step.
The housing step is a step of housing the holding portion 21 conveyed by the conveying method in the housing portion 11 d.
The disposing step is a step of disposing the first substrate P1 and the second substrate P2 on the upper surface of the stage portion 11 by housing the holding portion 21 in the housing portion 11 d.
The positioning step is a step in which the driving section drives the stage 11 to position the first substrate P1 and the second substrate P2 at the exposure position. At this time, the stage sensor 11P detects the end of the substrate P, and the position of the substrate P is grasped. Thus, the amount of movement required for the stage 11 is determined, and the drive unit performs positional alignment.
The irradiation step is a step in which the light projecting section irradiates the first substrate P1 and the second substrate P2 with exposure light. At this time, the alignment mark AM of the substrate P is detected by the optical machine. Thus, the detailed position of the substrate P is measured, and irradiation with exposure light is started.
Through the above steps, the substrate P is exposed to light to form a TP circuit or a CF circuit.
As described above, according to the conveying device 20 of the present embodiment, the plurality of substrates P are positioned with respect to the holding portion 21 by the alignment mechanism 22. The plurality of substrates P are adsorbed to the holding portion 21 by the adsorption mechanism 23. Then, the plurality of substrates P are conveyed to the exposure apparatus 10 together with the holding portion 21 by the conveying mechanism 24. In this way, the plurality of substrates P are positioned on the holding portion 21, and are conveyed to the exposure apparatus 10 without changing the state. As described above, by being conveyed to the exposure apparatus 10 in a state where the position of the substrate P is aligned in advance, the time required for the alignment of the substrate P can be shortened. Further, it is possible to prevent a reduction in productivity due to a shift in the position of the substrate P with respect to the exposure apparatus 10. This enables efficient processing of the substrate P by the exposure apparatus 10.
The alignment device further includes a control unit 26, and the control unit 26 controls the alignment mechanism 22 based on the detection result of the sensor 25. This makes it possible to more reliably and accurately position the substrate P.
At least three or more sensors 25 are provided with respect to one substrate P. This makes it possible to grasp the positional displacement in the rotation direction in addition to the two directions of the plane on which the substrate P is disposed, i.e., the first direction X and the second direction Y. This makes it possible to more reliably and accurately position the substrate P.
In addition to the exposure apparatus 10, a conveyance apparatus 20 is provided. Accordingly, when the substrate P is exposed by the exposure device 10, the substrate P can be aligned by the conveying device 20. This can prevent the productivity from being lowered due to the position of the substrate P being shifted from the exposure apparatus 10. This enables efficient processing of the substrate P by the exposure apparatus 10.
After the substrates P are positioned and adsorbed on the holding units 21, the holding units 21 are transported to the exposure apparatus 10. As described above, by being conveyed to the exposure apparatus 10 in a state where the position of the substrate P is aligned in advance, the time required for the alignment of the substrate P can be shortened. Further, it is possible to prevent a reduction in productivity due to a shift in the position of the substrate P with respect to the exposure apparatus 10. This enables efficient processing of the substrate P by the exposure apparatus 10.
The first lines AM1 are arranged at intervals along the second direction Y, the second lines AM2 are arranged at intervals along the first direction X, the intervals between the first lines AM1 are different from each other, and the intervals between the second lines AM2 are also different from each other. As described above, by avoiding the first line AM1 and the second line AM2 from being equally spaced, it is possible to easily grasp where the intersection point is located in the alignment mark AM by referring to the spaces between the adjacent first line AM1 and second line AM2, respectively. Thus, even if the position of the entire alignment mark AM is not grasped, the position can be accurately aligned by grasping only the intervals between one first line AM1 and one second line AM2 and the first line AM1 and the second line AM2 adjacent to each other. This can contribute to more efficient alignment of the substrate P.
The alignment mechanism 22 includes a first alignment mechanism 221 and a second alignment mechanism 222. This makes it possible to position the two substrates P arranged on the holding portion 21 separately. Thereby, the accuracy of the alignment can be further improved.
The sensor 25 includes a first sensor 25a and a second sensor 25b. Thereby, the positions of the two substrates P disposed on the holding portion 21 can be grasped separately. This allows the position of the substrate P to be confirmed with further high accuracy.
The first sensor 25a is provided on the reference side of the first substrate P1, and the second sensor 25b is provided on the side corresponding to the reference side of the first substrate P1 among the sides of the second substrate P2, and as described above, the first substrate P1 and the reference side of the second substrate P2 are made to correspond to each other, whereby the position can be more easily checked. Therefore, the alignment of the substrate P can be more easily performed.
In the exposure apparatus 10 according to the present embodiment, the first substrate P1 and the second substrate P2 are disposed on the upper surface of the stage 11 by housing the holding portion 21 in the housing portion 11 d. In this way, the substrate P can be directly placed on the upper surface of the stage 11 without moving particularly on the holding portion 21. The substrate P can be smoothly moved from the holding portion 21 to the stage 11. Further, the substrate P can be prevented from being displaced from the holding portion 21 when it moves toward the stage 11.
Further, at least three or more stage sensors 11P are provided with respect to one substrate P. This makes it possible to grasp the positional displacement in the rotation direction in addition to the two directions of the plane on which the substrate P is disposed, i.e., the first direction X and the second direction Y. Thus, the position of the substrate P can be checked with higher accuracy inside the exposure apparatus 10.
The stage 11 holds the substrate P by suction. This prevents the substrate P from being displaced inside the exposure apparatus 10.
The exposure apparatus 10 further includes a driving unit. Thus, the substrate P can be aligned with higher accuracy inside the exposure apparatus 10.
In the conveying method according to the present embodiment, the conveying mechanism 24 conveys the holding portion 21 in a state where the first substrate P1 and the second substrate P2 are positioned. That is, the alignment of the substrate P is performed before the substrate P is carried into the exposure apparatus 10. This eliminates the need to align the substrate P inside the exposure apparatus 10. This can further improve the manufacturing efficiency.
In the exposure method according to the present embodiment, the first substrate P1 and the second substrate P2 are placed on the upper surface of the stage 11 by housing the holding portion 21 in the housing portion. In this way, the substrate P can be directly placed on the upper surface of the stage 11 without moving particularly on the holding portion 21. The substrate P can be smoothly moved from the holding portion 21 to the stage 11. Further, the substrate P can be prevented from being displaced from the holding portion 21 when it moves toward the stage 11.
In addition, according to the alignment mark AM of the present embodiment, the first lines AM1 are spaced apart from each other differently, and the second lines AM2 are spaced apart from each other differently. Thus, the shapes of the plurality of quadrangles formed by the first line AM1 and the second line AM2 are different. Thus, if one of the quadrangles can be detected by the optical device, it is possible to know where the alignment mark AM has been detected. This makes it possible to confirm the position of the substrate P with the alignment mark AM with certainty while minimizing the size of the optical device.
The technical scope of the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.
For example, the holding portion 21 can hold two substrates P of half G6 size, and the alignment mechanism 22 can separately adjust the positions of at least two substrates P disposed on the holding portion 21, but the above description is not limited thereto. Specifically, the substrate P may be a size obtained by dividing the half G6 size further, and the alignment mechanism 22 may have a structure capable of adjusting the positions of three or more substrates P having such a size separately.
Although the case where two gripping portions are provided in the alignment mechanism 22 has been described, the number of gripping portions may be one when the positions of the plurality of substrates P disposed on the holding portion 21 can be separately adjusted.
In addition, the structural members in the above-described embodiments may be appropriately replaced with known structural members, and the above-described modifications may be appropriately combined within a range not departing from the gist of the present invention.
Description of symbols
10: Exposure apparatus
11: Platform part
12: Extraction mechanism
13: Lens
14: Focusing part
20: Conveying device
21: Holding part
22: Alignment mechanism
23: Adsorption mechanism
24: Conveying mechanism
25: Sensor for detecting a position of a body
26: Control unit
100: Exposure system
AM: alignment mark
AM1: first line
AM2: second line
P: substrate board
X: first direction
Y: second direction
Z: third direction of

Claims (29)

1. A conveying apparatus for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying apparatus comprising:
an alignment mechanism that positions the first substrate and the second substrate with respect to the holding portion, respectively; and
And a conveying mechanism for conveying the holding part in a state that the first substrate and the second substrate are positioned.
2. A conveying apparatus for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying apparatus comprising:
an alignment mechanism that positions the first substrate and the second substrate based on relative positions of the first substrate and the second substrate; and
And a conveying mechanism for conveying the holding part in a state that the first substrate and the second substrate are positioned.
3. The transport device according to claim 2, wherein,
The alignment mechanism positions the first and second substrates relative to the holding portion.
4. The conveying device according to any one of claims 1 to 3, wherein,
The alignment mechanism includes a first alignment mechanism for positioning the first substrate and a second alignment mechanism for positioning the second substrate.
5. The transport device according to claim 4, wherein,
The first alignment mechanism includes a first holding portion for supporting the first substrate from below, and a first vertical movement portion for moving the first holding portion in a vertical direction,
The second alignment mechanism includes a second holding portion that supports the second substrate from below, and a second vertical movement portion that moves the second holding portion in a vertical direction.
6. The transport device according to claim 5, wherein,
The alignment mechanism includes a horizontal movement portion that moves at least either one of the first grip portion and the second grip portion in a horizontal direction.
7. The conveying apparatus according to any one of claims 1 to 6, comprising:
The first sensor and the second sensor respectively detect the positions of the first substrate and the second substrate relative to the holding part,
The alignment mechanism positions the first substrate and the second substrate based on detection results of the first sensor and the second sensor.
8. The transport device according to claim 7, wherein,
The first sensor is disposed at least three with respect to the first substrate,
The second sensor is disposed at least three with respect to the second substrate.
9. The transport device according to claim 7 or 8, wherein,
The first sensor is disposed relative to a reference edge of the first substrate,
The second sensor is disposed with respect to a side corresponding to the reference side of the first substrate among sides of the second substrate.
10. The transport device according to any one of claims 1 to 9, comprising an adsorption mechanism,
The suction mechanism suctions and holds the first substrate and the second substrate to the holding portion.
11. A conveying apparatus for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying apparatus comprising:
An obtaining portion that obtains at least two of information related to a relative position of the first substrate and the second substrate, information related to a relative position of the first substrate and the holding portion, and information related to a relative position of the second substrate and the holding portion;
An alignment mechanism that positions the first substrate and the second substrate with respect to the holding portion based on the information obtained by the obtaining portion; and
And a conveying mechanism for conveying the holding part in a state that the first substrate and the second substrate are positioned.
12. An exposure apparatus includes:
A housing portion that houses the holding portion conveyed by the conveying device according to any one of claims 1 to 11;
A stage portion that places the first substrate and the second substrate on an upper surface by accommodating the holding portion in the accommodating portion;
a driving unit that drives the stage unit to position the first substrate and the second substrate at an exposure position; and
And a light projecting unit that irradiates the first substrate and the second substrate with exposure light.
13. The exposure apparatus according to claim 12, comprising:
a third sensor and a fourth sensor respectively detect the positions of the first substrate and the second substrate relative to the platform part,
The driving section drives the stage section based on detection results of the third sensor and the fourth sensor.
14. The exposure apparatus according to claim 13, wherein,
The third sensor is disposed at least three with respect to the first substrate,
The fourth sensor is disposed at least three with respect to the second substrate.
15. The exposure apparatus according to any one of claims 12 to 14, comprising an optical device,
The optical machine detects the position of an alignment mark formed on the first substrate and the second substrate,
The driving section drives the stage section based on a detection result of the optical machine.
16. The exposure apparatus according to claim 12, comprising:
a third sensor and a fourth sensor for detecting the positions of the first substrate and the second substrate relative to the platform part,
An optical device for detecting the position of an alignment mark formed on the first substrate and the second substrate; and
A storage unit for storing the positional relationship between the third sensor and the optical device and the positional relationship between the fourth sensor and the optical device,
The driving unit drives the stage unit so that the positions of the first substrate and the second substrate with respect to the light projecting unit are set to predetermined positions, using the detection results of the third sensor and the fourth sensor, the detection results of the optical device, and the information of the positional relationship stored in the storage unit.
17. The exposure apparatus according to any one of claims 12 to 16, wherein,
The driving section drives the stage section to position the first substrate at an exposure position, the light projecting section irradiates exposure light to the positioned first substrate,
The driving unit drives the stage unit to position the second substrate at an exposure position after the exposure light is irradiated onto the first substrate, and the light projecting unit irradiates the positioned second substrate with the exposure light.
18. The exposure apparatus according to any one of claims 12 to 17, wherein,
The stage portion adsorbs and holds the first substrate and the second substrate.
19. A conveying method for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying method comprising:
A step of positioning the first substrate and the second substrate with respect to the holding portion by an alignment mechanism; and
And a step in which the carrying mechanism carries the holding portion in a state in which the first substrate and the second substrate have been positioned.
20. A conveying method for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying method comprising:
Positioning the first substrate and the second substrate by an alignment mechanism based on the relative positions of the first substrate and the second substrate; and
And a step in which the carrying mechanism carries the holding portion in a state in which the first substrate and the second substrate have been positioned.
21. A conveying method for conveying a substrate using a holding portion in which at least a first substrate and a second substrate are disposed, the conveying method comprising:
An obtaining unit that obtains at least two of information on a relative position of the first substrate and the second substrate, information on a relative position of the first substrate and the holding unit, and information on a relative position of the second substrate and the holding unit;
A step of positioning the first substrate and the second substrate with respect to the holding portion by an alignment mechanism based on the information obtained by the obtaining portion; and
And a step in which the carrying mechanism carries the holding portion in a state in which the first substrate and the second substrate have been positioned.
22. An exposure method, comprising:
A step of accommodating the holding portion conveyed by the conveying method according to any one of claims 19 to 21 in an accommodating portion;
A step of disposing the first substrate and the second substrate on an upper surface of a stage portion by accommodating the holding portion in the accommodating portion;
a step of positioning the first substrate and the second substrate at an exposure position by driving the stage unit by a driving unit; and
And a step in which the light projecting unit irradiates the first substrate and the second substrate with exposure light.
23. An alignment mark provided on a substrate, the alignment mark comprising:
a first pattern composed of a plurality of first lines extending in a first direction; and
A second pattern formed of a plurality of second lines extending in a second direction and intersecting the first pattern,
The plurality of second lines are arranged in such a manner that the mutual intervals include different values.
24. The alignment mark of claim 23, wherein,
The plurality of second lines are arranged in such a manner that the intervals between adjacent second lines gradually change in the first direction.
25. The alignment mark according to claim 23 or 24, wherein,
The first pattern includes: a first group of first wires arranged at a first interval; and a second group including first lines arranged at a second interval different from the first interval.
26. The alignment mark of claim 25, wherein,
The second group is disposed at a position that does not overlap with the first group in the first direction.
27. The alignment mark of any of claims 23 to 26, wherein,
The plurality of second lines are arranged such that the distance between adjacent second lines increases as the distance from the predetermined position increases.
28. The alignment mark of claim 27, wherein,
The predetermined position is a set coordinate position of the alignment mark.
29. The alignment mark according to any one of claims 23 to 28, wherein,
The second pattern is arranged such that all of a plurality of quadrangles formed by crossing the plurality of second lines and the plurality of first lines are formed in different shapes.
CN202380026416.8A 2022-03-31 2023-03-24 Conveying device, exposure device, conveying method, exposure method, and alignment mark Pending CN118843836A (en)

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JP2022058723 2022-03-31
JP2022-058723 2022-03-31
PCT/JP2023/011720 WO2023190110A1 (en) 2022-03-31 2023-03-24 Transport device, exposure device, transport method, exposure method, and alignment mark

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JPH02112223A (en) * 1988-10-21 1990-04-24 Olympus Optical Co Ltd Alignment mark
JP2000323550A (en) * 1999-05-06 2000-11-24 Nikon Corp Storing unit and board processing system
US20110141448A1 (en) * 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
JP2011233776A (en) * 2010-04-28 2011-11-17 Nikon Corp Object conveying device, object supporting device, object conveying system, exposure device, device manufacturing method, manufacturing method of flat panel display and object conveying method
JP2020194007A (en) * 2019-05-24 2020-12-03 キヤノン株式会社 Exposure device

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