CN118804557A - Immersed liquid cooling system and control method thereof - Google Patents
Immersed liquid cooling system and control method thereof Download PDFInfo
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- CN118804557A CN118804557A CN202410853873.0A CN202410853873A CN118804557A CN 118804557 A CN118804557 A CN 118804557A CN 202410853873 A CN202410853873 A CN 202410853873A CN 118804557 A CN118804557 A CN 118804557A
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- 239000007788 liquid Substances 0.000 title claims abstract description 267
- 238000001816 cooling Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000001502 supplementing effect Effects 0.000 claims description 40
- 238000009835 boiling Methods 0.000 claims description 15
- 238000007654 immersion Methods 0.000 claims description 15
- 239000002105 nanoparticle Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000004090 dissolution Methods 0.000 abstract description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 238000010438 heat treatment Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
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- 238000005057 refrigeration Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Abstract
The application relates to the liquid cooling field, in particular to an immersed liquid cooling system and a control method thereof, comprising a containing chamber, wherein the containing chamber provides a containing cavity for installing electronic equipment, the accommodating cavity is filled with single-phase heat conducting liquid and double-phase heat conducting liquid, and the single-phase heat conducting liquid and the double-phase heat conducting liquid are mixed, so that the single-phase heat conducting liquid and the double-phase heat conducting liquid are mixed with each other to form mixed heat conducting liquid. Through the mutual coordination of the single-phase heat conduction liquid and the double-phase heat conduction liquid in the mutual dissolution system, the heat transfer efficiency of the single-phase heat conduction liquid is improved, the viscosity of the heat conduction liquid system is reduced, the specific heat capacity is improved, and meanwhile, the problem that the double-phase heat conduction liquid is easy to leak when phase change occurs is solved.
Description
Technical Field
The application relates to the field of liquid cooling, in particular to an immersed liquid cooling system.
Background
The immersion liquid cooling technology is one of the more efficient cooling solutions at present, and is widely applied and developed in the fields of data centers, high-performance computers, battery thermal management and the like. The existing immersed liquid cooling system is divided into single-phase immersed liquid cooling, double-phase immersed liquid cooling and single/double-phase coexisting multi-layer immersed liquid cooling. The single-phase immersed liquid cooling adopts a heat conduction liquid with a high boiling point, such as silicon base oil, hydrocarbon and the like, and keeps the liquid state in the whole heat dissipation process; the single-phase immersed liquid cooling system is relatively simple in design, easy to operate and maintain, phase change of the heat conducting liquid is avoided, pressure control and safety requirements on the system are low, however, heat transfer efficiency of a single-phase mode is low compared with that of a double-phase mode, and heat transfer effect is poor compared with that of the double-phase mode.
The dual-phase immersion liquid cooling utilizes the characteristic that the heat conduction liquid changes from a liquid state to a gas state when heated, and effectively utilizes the phase change latent heat to dissipate heat through the conversion of the gas-liquid state, such as a fluoride liquid and the like. The dual-phase immersion liquid cooling system has higher heat transfer efficiency, can rapidly and effectively process high-density heat, but the design of the system is more complex due to the phase change of the heat conduction liquid, and a stricter control system such as pressure, temperature and the like is required to ensure the safe operation of the system; meanwhile, the requirement on the heat conducting liquid is greatly increased, so that the cost of the heat conducting liquid is also increased (the phase change liquid is generally fluoride liquid, and the fluoride liquid is considered to have global warming potential GWP, so that the gasification leakage of the fluoride liquid is prevented, and the higher requirement on the sealing performance of the whole system is provided).
In view of the above problems, publication No. CN115696850a discloses a novel submerged cooling system containing one layer of two-phase coolant fluid and one or more layers of single-phase coolant fluid, which solves the problem of gasification leakage of the two-phase heat transfer fluid to a large extent by gradual cooling of the multiple layers of single-phase heat transfer fluid,
With respect to the related art in the above, the inventors consider that there are the following drawbacks: the problem of heat accumulation of the single-phase heat-conducting liquid in the above patent is not well solved, a new challenge is presented to the temperature control of the upper-layer single-phase heat-conducting liquid, and furthermore, the heating electronic component is immersed in the two-phase layer, so that in order to prevent the bubbles of the two-phase heat-conducting liquid from escaping, the liquid level of a certain single-phase layer is required to be ensured, and the weight and the cost of the whole system are increased to a certain extent.
Disclosure of Invention
In order to improve the problem of heat conduction efficiency, the application provides an immersed liquid cooling system.
The immersed liquid cooling system provided by the application adopts the following technical scheme: the immersed liquid cooling system comprises an accommodating chamber, wherein the accommodating chamber is provided with an accommodating cavity for installing electronic equipment, mixed heat conducting liquid is filled in the accommodating cavity, the mixed heat conducting liquid comprises single-phase heat conducting liquid, double-phase heat conducting liquid, nano particles and silane coupling agent, the boiling point of the single-phase heat conducting liquid is higher than that of the double-phase heat conducting liquid, and the boiling point of the double-phase heat conducting liquid is lower than the working temperature of the mixed heat conducting liquid.
By adopting the technical scheme, the heat transfer efficiency of the single-phase heat conduction liquid is improved, the viscosity of the heat conduction liquid system is reduced, and the specific heat capacity is improved by the mutual matching of the single-phase heat conduction liquid and the double-phase heat conduction liquid in the mutual dissolution system; the heat conduction efficiency is high. The miscibility means that the single-phase heat conducting liquid and the double-phase heat conducting liquid are mixed together, and may be partially or even completely fused, or may be only contacted with each other. When the working temperature of the mixed heat conducting liquid is higher than the boiling point of the double-phase heat conducting liquid, the double-phase heat conducting liquid in the mixed liquid can escape, so that the heat exchange efficiency is reduced, and the working temperature needs to be controlled.
Optionally, the single-phase fluorinated liquid has a boiling point of 150-170 ℃, and the biphasic fluorinated liquid has a boiling point of 50-60 ℃.
Optionally, the biphase heat conduction liquid: mass ratio of single-phase heat conduction liquid=1-3:10.
By adopting the technical scheme, if the mass ratio is too large, the heat transfer efficiency is reduced (namely, the single-phase heat conduction liquid is too much), and if the mass ratio is too small, the cost is increased (namely, the single-phase heat conduction liquid is too little), so that the proportion is set in the range through comprehensive test.
Optionally, the accommodating chamber is connected with a temperature control system, the temperature control system comprises a first temperature sensor for detecting the electronic equipment and a first refrigerating unit, the first refrigerating unit directly acts on the electronic equipment, and when the temperature detected by the first temperature sensor exceeds a set value, the first refrigerating unit is started.
Through adopting above-mentioned technical scheme, first temperature sensor is used for directly monitoring electronic equipment's operating temperature, directly adopts first refrigerating unit to dispel the heat to electronic equipment when too high.
Optionally, the temperature control system further comprises a second temperature sensor and a second refrigerating unit, wherein the second temperature sensor and the second refrigerating unit are positioned in the accommodating chamber, and when the second temperature sensor detects that the temperature of the mixed heat conducting liquid is higher than a set value, the second refrigerating unit is started.
By adopting the technical scheme, the second temperature sensor is used for detecting the temperature of the mixed heat conduction liquid, and when the temperature is too high, the second refrigerating unit can be started.
Optionally, the first refrigerating unit and the second refrigerating unit each comprise at least one of a water cooling tower, a radiator, an evaporator, a condenser, a dry cooler, a heat exchanger and a semiconductor refrigerator.
Optionally, the liquid level sensor is installed in the accommodating chamber, the accommodating chamber is of an open structure, the accommodating chamber is connected with a heat conducting liquid supplementing pipe, the heat conducting liquid supplementing pipe is connected with a heat conducting liquid supplementing box, and the heat conducting liquid supplementing pipe is used for controlling liquid supplementing through a liquid supplementing pump or an electromagnetic valve.
Through adopting above-mentioned technical scheme, because after long-time operation, diphase heat conduction liquid can have a small amount of evaporation, and can take away partial single-phase heat conduction liquid, consequently need set up the heat conduction liquid and supply the case and supply mixed heat conduction liquid, can supply to initial liquid level according to level sensor's suggestion.
Optionally, the accommodating chamber is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are both connected with a heat exchanger, and a circulating pump is arranged on the liquid inlet pipe and/or the liquid outlet pipe.
By adopting the technical scheme, the mixed heat conducting liquid can absorb heat and then resume cooling again through the heat exchanger.
Another object of the present application is to provide a control method of an immersion liquid cooling system, including the following steps: the electronic equipment is installed in the accommodating chamber, mixed heat conduction liquid is added into the accommodating chamber, and the circulating pump is started when the electronic equipment works, so that the mixed heat conduction liquid and the heat exchanger perform heat exchange and then flow back; when the immersed liquid cooling system operates, liquid supplementing is performed by judging the liquid level in the accommodating chamber, and liquid supplementing is performed by adding mixed heat conducting liquid with higher mass ratio.
Optionally, detecting the temperature of the electronic device through a first temperature sensor, and starting the first refrigerating unit after the temperature of the first temperature sensor exceeds a set value; and detecting the temperature of the mixed heat conducting liquid through a second temperature sensor, and starting a second refrigerating unit after the temperature of the second temperature sensor exceeds a set value.
In summary, the present application includes at least one of the following beneficial technical effects: 1) By the mutual coordination of the single-phase heat conducting liquid and the double-phase heat conducting liquid in the mutual dissolution system, the heat transfer efficiency of the single-phase heat conducting liquid is improved, the viscosity of the heat conducting liquid system is reduced, and the specific heat capacity is improved; the heat conduction efficiency is high.
2) Because the single-phase heat conducting liquid and the double-phase heat conducting liquid are mutually matched in the mutual-dissolution system, the problem that the double-phase heat conducting liquid is easy to leak when phase change occurs is solved;
3) Through the ratio combination of single-phase heat conduction liquid and double-phase heat conduction liquid, the cost is effectively reduced while the heat dissipation efficiency is ensured.
4) The normal operation of the system is ensured by arranging the heat exchanger;
5) Through setting up first refrigerating unit, second refrigerating unit, can avoid unexpected emergence, the security is high.
Drawings
FIG. 1 is a schematic diagram of example 1 of the present application;
FIG. 2 is a schematic diagram of embodiment 2 of the present application;
FIG. 3 is a schematic diagram of embodiment 3 of the present application;
FIG. 4 is a schematic illustration of embodiments 4 and 5 of the present application;
fig. 5 is a schematic diagram of another refrigeration unit according to embodiment 4.
Reference numerals: 1. a housing chamber; 2. an electronic device; 3. a heat exchanger; 4. a circulation pump; 5. a liquid level sensor; 6. a heat transfer fluid replenishment tank; 7. a fluid supplementing pump; 8. a first temperature sensor; 9. a semiconductor refrigeration sheet; 10. a second temperature sensor; 11. a fan.
Detailed Description
The application is described in further detail below with reference to fig. 1-5.
Example 1: the immersion liquid cooling system, as shown in fig. 1, comprises a containing chamber 1, wherein the containing chamber 1 is preferably of an open top structure, and the electronic equipment 2 is convenient to install. The housing chamber 1 provides a housing chamber in which the electronic device 2 is mounted. The accommodating cavity is filled with mixed heat conducting liquid, the mixed heat conducting liquid comprises single-phase heat conducting liquid, double-phase heat conducting liquid, nano particles and silane coupling agent, the boiling point of the single-phase heat conducting liquid is higher than that of the double-phase heat conducting liquid, and the boiling point of the double-phase heat conducting liquid is lower than the working temperature of the mixed heat conducting liquid. Single-phase heat conducting liquid: the mass ratio of the two-phase heat conducting liquid is=10:1-3.
Specifically, the single-phase heat-conducting liquid may be selected from Novec7100/7100DL or Novec71IPA manufactured by 3M company, wherein the boiling point of Novec7100/7100DL is 61℃and the boiling point of Novec71IPA is 55 ℃. The single-phase heat conducting liquid can be selected from Novec7700 series products manufactured by 3M company, and the boiling point of the Novec7700 is 167 ℃.
The single-phase fluorinated solution, the double-phase fluorinated solution, the nano particles and the silane coupling agent are uniformly mixed at room temperature to obtain the mixed heat conduction liquid. The silane coupling agent is selected from KH550. The addition amount of the nano particles is 1 to 1.5 percent of the total dosage of the single-phase fluorinated liquid and the double-phase fluorinated liquid. The nano particles are selected from boron nitride, and the particle size of the nano particles is 50-100nm. The addition amount of the nano particles is limited within a reasonable range, so that the nano particles and the mixed fluorinated solution and the silane coupling agent play a better synergistic effect, the heat transfer efficiency and specific heat capacity of the composite heat conduction solution are better improved, the viscosity of the system is reduced, and meanwhile, the stability of the composite heat conduction solution is not influenced.
On the basis of the above, the accommodating chamber 1 is connected with a liquid inlet pipe and a liquid outlet pipe, both the liquid inlet pipe and the liquid outlet pipe are connected with a heat exchanger 3 (generally, the plate heat exchanger 3 or the pipe heat exchanger 3), and a circulating pump 4 is arranged on the liquid inlet pipe and/or the liquid outlet pipe, and the mixed heat conducting liquid absorbs heat and then recovers cooling through the heat exchanger 3. The circulation pump 4 is provided at least one according to the need, and may be provided on each of the liquid inlet pipe and the liquid outlet pipe in consideration of the acceleration circulation.
In use, the electronic device 2 should be completely immersed in the mixed heat transfer fluid, and the main heat-generating end of the electronic device 2 should be located at the bottom of the accommodating chamber 1. Under the operation of the product, the main heating elements in the electronic equipment 2 are a GPU and a CPU, the highest heating temperature range is about 70-75 ℃, and the single-phase heat conduction liquid is used for: the mass ratio of the two-phase heat conducting liquid is 10:3, and the working temperature of the heat conducting liquid is maintained to be about 50 ℃ when the system stably operates.
A control method of an immersed liquid cooling system comprises the following steps: the electronic equipment 2 is installed in the accommodating chamber 1, then the mixed heat conduction liquid is added in the accommodating chamber 1, and when the electronic equipment 2 works, the circulating pump 4 is started, so that the mixed heat conduction liquid flows back after heat exchange with the heat exchanger 3.
Example 2: as shown in fig. 2, a liquid level sensor 5 is added on the basis of embodiment 1, the liquid level sensor 5 is located in the accommodating chamber 1 and is used for detecting the liquid level of the mixed heat conducting liquid, and the liquid level sensor 5 can be specifically a floating ball type liquid level sensor 5. The problem of drop in the level of the mixed conducting liquid due to long-term operation (mainly, evaporation of the two-phase conducting liquid, and the part of the single-phase conducting liquid carried away by the evaporation). Therefore, the accommodating chamber 1 is connected with a heat conducting liquid supplementing pipe, the heat conducting liquid supplementing pipe is connected with a heat conducting liquid supplementing box 6, and the heat conducting liquid supplementing pipe controls supplementing liquid through a supplementing liquid pump 7 or an electromagnetic valve. If the heat conducting liquid supplementing box 6 is arranged above the accommodating chamber 1, an electromagnetic valve can be directly arranged, liquid supplementing can be carried out by relying on gravity, if the heat conducting liquid supplementing box is arranged on the side edge of the accommodating chamber 1, the electromagnetic valve can be omitted, liquid supplementing can be carried out directly through the liquid supplementing pump 7, if the heat conducting liquid supplementing box is only supplemented through the liquid supplementing pump 7, the liquid in a pipeline can fall into the accommodating chamber 1 due to gravity when the pump stops working, the liquid exceeds an initial liquid level (namely the position of a standard liquid line in the figure), the normal working is not influenced, and if more accurate control is needed, when the heat conducting liquid supplementing box 6 is arranged on the side edge of the accommodating chamber 1, the electromagnetic valve and the liquid supplementing pump 7 are preferably arranged simultaneously.
In addition, considering that more double-phase heat conducting liquid evaporates, when the mixed heat conducting liquid is added, the mass ratio of the mixed heat conducting liquid is higher than that of the double-phase heat conducting liquid and the single-phase heat conducting liquid in the mixed heat conducting liquid in the original accommodating chamber 1, the scheme adopts the mode that the supplementary liquid with the mass ratio of the double-phase heat conducting liquid to the single-phase heat conducting liquid of 4:10 is selected to be added, and the supplementary liquid is added to the normal working liquid level.
A control method of an immersed liquid cooling system comprises the following steps: the electronic equipment 2 is installed in the accommodating chamber 1, mixed heat conduction liquid is added into the accommodating chamber 1, and when the electronic equipment 2 works, the circulating pump 4 is started, so that the mixed heat conduction liquid flows back after heat exchange with the heat exchanger 3; when the immersed liquid cooling system operates, liquid supplementing is performed by judging the liquid level in the accommodating chamber 1, and liquid supplementing is performed by adding mixed heat conducting liquid with higher mass ratio.
Example 3: as shown in fig. 3, on the basis of the above embodiment 2, a temperature control system is further added, where the temperature control system includes a first temperature sensor 8 for detecting the electronic device 2, and a first refrigerating unit, and the first refrigerating unit directly acts on the electronic device 2, and when the temperature detected by the first temperature sensor 8 exceeds a set value, the first refrigerating unit is started. The first refrigerating unit is mainly used for emergency cooling, when the electronic equipment 2 has abnormal conditions to generate high temperature, the mixed heat conducting liquid cannot be quickly reduced to the set working temperature, and the first refrigerating unit can be selected to directly emergently cool the electronic equipment 2. The first refrigerating unit and the second refrigerating unit comprise at least one of a water cooling tower, a radiator, an evaporator, a condenser, a dry cooler, a heat exchanger 3 and a semiconductor refrigerator. In this scheme, a semiconductor refrigerator is adopted, specifically, a semiconductor refrigerating sheet 9 is installed at the bottom of the electronic device 2, and the cold end of the semiconductor refrigerating sheet is attached to the electronic device 2.
A control method of an immersed liquid cooling system comprises the following steps: the electronic equipment 2 is installed in the accommodating chamber 1, mixed heat conduction liquid is added into the accommodating chamber 1, and when the electronic equipment 2 works, the circulating pump 4 is started, so that the mixed heat conduction liquid flows back after heat exchange with the heat exchanger 3; when the immersed liquid cooling system operates, liquid supplementing is carried out by judging the liquid level in the accommodating chamber 1 and liquid supplementing is carried out by adding mixed heat conducting liquid with higher mass ratio; detecting the temperature of the electronic equipment 2 through the first temperature sensor 8, and starting the first refrigerating unit after the temperature of the first temperature sensor 8 exceeds a set value;
Embodiment 4, as shown in fig. 4, a temperature control system is further added on the basis of embodiment 2, where the temperature control system includes a second temperature sensor 10 for detecting the temperature of the mixed heat conducting liquid, and a second refrigerating unit, and each of the first refrigerating unit and the second refrigerating unit includes at least one of a water cooling tower, a radiator, an evaporator, a condenser, a dry cooler, a heat exchanger 3, and a semiconductor refrigerator. The second refrigerating unit is mainly used for assisting the heat exchanger 3 to control the temperature of the mixed heat conducting liquid when the efficiency of the heat exchanger 3 is low. The radiator is adopted in the scheme, specifically, heat is radiated through the fans 11, a plurality of fans 11 are arranged on the top of the accommodating chamber 1 in an array mode, and the liquid level of the mixed heat conduction liquid is blown through the fans 11. Or can be realized by directly connecting the heat exchanger 3 with a dry cooler or a water cooling tower, etc. (as shown in figure 5).
A control method of an immersed liquid cooling system comprises the following steps: the electronic equipment 2 is installed in the accommodating chamber 1, mixed heat conduction liquid is added into the accommodating chamber 1, and when the electronic equipment 2 works, the circulating pump 4 is started, so that the mixed heat conduction liquid flows back after heat exchange with the heat exchanger 3; when the immersed liquid cooling system operates, liquid supplementing is performed by judging the liquid level in the accommodating chamber 1, and liquid supplementing is performed by adding mixed heat conducting liquid with higher mass ratio. The temperature of the mixed heat conducting liquid is detected by the second temperature sensor 10, and the second refrigerating unit is started after the temperature of the second temperature sensor 10 exceeds a set value.
Example 5, as shown in fig. 4, the first temperature sensor 8, the second temperature sensor 10, the first refrigerator group, and the second refrigerator group were combined on the basis of example 2. The safety and reliability are optimal if the cost is not considered.
A control method of an immersed liquid cooling system comprises the following steps: the electronic equipment 2 is installed in the accommodating chamber 1, mixed heat conduction liquid is added into the accommodating chamber 1, and when the electronic equipment 2 works, the circulating pump 4 is started, so that the mixed heat conduction liquid flows back after heat exchange with the heat exchanger 3; when the immersed liquid cooling system operates, liquid supplementing is carried out by judging the liquid level in the accommodating chamber 1 and liquid supplementing is carried out by adding mixed heat conducting liquid with higher mass ratio; detecting the temperature of the electronic equipment 2 through the first temperature sensor 8, and starting the first refrigerating unit after the temperature of the first temperature sensor 8 exceeds a set value; the temperature of the mixed heat conducting liquid is detected by the second temperature sensor 10, and the second refrigerating unit is started after the temperature of the second temperature sensor 10 exceeds a set value.
It should be noted that the above embodiments each have a controller and a power supply, the power supply supplies power to each of the power consuming components, and the controller is configured to control the various executing elements to operate, for example, when the first temperature sensor 8 is higher than a set value, the controller controls the first refrigerating unit to operate.
In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, and that the specific orientation is constructed and operated, and therefore, the present invention should not be construed as being limited. Furthermore, the "first" and "second" are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (10)
1. The immersed liquid cooling system comprises a containing chamber, wherein the containing chamber is provided with a containing cavity for installing electronic equipment, and the immersed liquid cooling system is characterized in that: the accommodating cavity is filled with mixed heat conducting liquid, the mixed heat conducting liquid comprises single-phase heat conducting liquid, double-phase heat conducting liquid, nano particles and silane coupling agent, the boiling point of the single-phase heat conducting liquid is higher than that of the double-phase heat conducting liquid, and the boiling point of the double-phase heat conducting liquid is lower than the working temperature of the mixed heat conducting liquid.
2. The immersion liquid cooling system according to claim 1, wherein: the boiling point of the single-phase fluorinated liquid is 150-170 ℃, and the boiling point of the double-phase fluorinated liquid is 50-60 ℃.
3. The immersion liquid cooling system according to claim 1, wherein: the biphase heat conduction liquid comprises: mass ratio of single-phase heat conduction liquid=1-3:10.
4. The immersion liquid cooling system according to claim 1, wherein: the accommodating chamber is connected with a temperature control system, the temperature control system comprises a first temperature sensor for detecting electronic equipment and a first refrigerating unit, the first refrigerating unit directly acts on the electronic equipment, and when the temperature detected by the first temperature sensor exceeds a set value, the first refrigerating unit is started.
5. The immersion liquid cooling system according to claim 4, wherein: the temperature control system further comprises a second temperature sensor and a second refrigerating unit which are positioned in the accommodating chamber, and when the second temperature sensor detects that the temperature of the mixed heat conduction liquid is higher than a set value, the second refrigerating unit is started.
6. The immersion liquid cooling system according to claim 5, wherein: the first refrigerating unit and the second refrigerating unit comprise at least one of a water cooling tower, a radiator, an evaporator, a condenser, a dry cooler, a heat exchanger and a semiconductor refrigerator.
7. The immersion liquid cooling system according to claim 6, wherein: the liquid level sensor is installed in the accommodating chamber, the accommodating chamber is of an open structure, the accommodating chamber is connected with a heat conducting liquid supplementing pipe, the heat conducting liquid supplementing pipe is connected with a heat conducting liquid supplementing box, and the heat conducting liquid supplementing pipe is used for controlling liquid supplementing through a liquid supplementing pump or an electromagnetic valve.
8. The immersion liquid cooling system according to claim 1, wherein: the accommodating chamber is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are both connected with a heat exchanger, and a circulating pump is arranged on the liquid inlet pipe and/or the liquid outlet pipe.
9. A control method of an immersion liquid cooling system, employing the immersion liquid cooling system according to any one of claims 1 to 8, comprising the steps of: the electronic equipment is installed in the accommodating chamber, mixed heat conduction liquid is added into the accommodating chamber, and the circulating pump is started when the electronic equipment works, so that the mixed heat conduction liquid and the heat exchanger perform heat exchange and then flow back; when the immersed liquid cooling system operates, liquid supplementing is performed by judging the liquid level in the accommodating chamber, and liquid supplementing is performed by adding mixed heat conducting liquid with higher mass ratio.
10. The method of controlling an immersion liquid cooling system according to claim 9, wherein: detecting the temperature of the electronic equipment through a first temperature sensor, and starting a first refrigerating unit after the temperature of the first temperature sensor exceeds a set value; and detecting the temperature of the mixed heat conducting liquid through a second temperature sensor, and starting a second refrigerating unit after the temperature of the second temperature sensor exceeds a set value.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410853873.0A CN118804557A (en) | 2024-06-28 | 2024-06-28 | Immersed liquid cooling system and control method thereof |
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| CN202410853873.0A CN118804557A (en) | 2024-06-28 | 2024-06-28 | Immersed liquid cooling system and control method thereof |
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| CN118804557A true CN118804557A (en) | 2024-10-18 |
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| CN202410853873.0A Pending CN118804557A (en) | 2024-06-28 | 2024-06-28 | Immersed liquid cooling system and control method thereof |
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