CN118789446A - Polishing device and wafer processing equipment - Google Patents
Polishing device and wafer processing equipment Download PDFInfo
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- CN118789446A CN118789446A CN202410986930.2A CN202410986930A CN118789446A CN 118789446 A CN118789446 A CN 118789446A CN 202410986930 A CN202410986930 A CN 202410986930A CN 118789446 A CN118789446 A CN 118789446A
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- 238000005498 polishing Methods 0.000 title claims abstract description 380
- 238000012545 processing Methods 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 118
- 238000004140 cleaning Methods 0.000 claims description 55
- 239000007788 liquid Substances 0.000 claims description 24
- 235000012431 wafers Nutrition 0.000 description 146
- 238000012546 transfer Methods 0.000 description 46
- 238000007599 discharging Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 230000009471 action Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000003749 cleanliness Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention relates to a polishing device and wafer processing equipment. The polishing device comprises: a first swing mechanism and a second swing mechanism; the first polishing disk and the second polishing disk are arranged at intervals along the first direction, and the first swinging mechanism and the second swinging mechanism are positioned between the first polishing disk and the second polishing disk; the first bearing mechanism and the second bearing mechanism are arranged at intervals along the second direction, and the first swinging mechanism and the second swinging mechanism are positioned between the first bearing mechanism and the second bearing mechanism; the first swing mechanism comprises a first swing arm and a first polishing head arranged on the first swing arm, and the first swing arm can swing controllably and drive the first polishing head to pass through the first bearing mechanism, the first polishing disk and the second polishing disk; the second swinging mechanism comprises a second swinging arm and a second polishing head arranged on the first swinging arm, and the second swinging arm can swing controllably and drive the second polishing head to pass through the second bearing mechanism, the first polishing disk and the second polishing disk.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a polishing device and wafer processing equipment.
Background
In semiconductor device fabrication, a Chemical Mechanical Polishing (CMP) process is a process for planarizing a wafer, such as pre-metal dielectric (PMD) or inter-layer dielectric (ILD) polishing. However, in the actual production process, wafers need to be transferred between polishing stations, so that the same wafer needs to be subjected to multiple wafer taking and wafer placing, which results in low production efficiency.
Disclosure of Invention
Based on this, it is necessary to provide a polishing apparatus and a wafer processing apparatus for improving the above-mentioned defects, which solve the problem that the production efficiency is low due to the fact that the same wafer needs to be subjected to multiple wafer taking and placing processes in order to transfer the wafer between each polishing stations in the prior art.
A polishing apparatus, comprising:
the first polishing disk and the second polishing disk are arranged at intervals along the second direction;
the first bearing mechanism and the second bearing mechanism are arranged at intervals along a first direction perpendicular to the second direction;
the first swinging mechanism and the second swinging mechanism are both positioned between the first polishing disk and the second polishing disk and are both positioned between the first bearing mechanism and the second bearing mechanism;
The first swing mechanism comprises a first swing arm and a first polishing head arranged on the first swing arm, and the first swing arm can swing controllably and drive the first polishing head to pass through the first bearing mechanism, the first polishing disk and the second polishing disk; the second swinging mechanism comprises a second swinging arm and a second polishing head arranged on the second swinging arm, and the second swinging arm can swing controllably and drive the second polishing head to pass through the second bearing mechanism, the first polishing disk and the second polishing disk; the first bearing mechanism is used for providing a wafer for the first polishing head or receiving a wafer released by the first polishing head, the second bearing mechanism is used for providing a wafer for the second polishing head or receiving a wafer released by the second polishing head, and the first polishing disk and the second polishing disk are both used for polishing the wafer on the first polishing head or the second polishing head.
In one embodiment, the first swing arm and the second swing arm drive the first polishing head and the second polishing head to alternately reach the first polishing disk and the second polishing disk respectively.
In one embodiment, the first carrying mechanism includes two first carrying cups, the first swing arm can drive the first polishing head to pass through each first carrying cup when swinging, and each first carrying cup can provide a wafer for the first polishing head or receive a wafer released by the first polishing head.
In one embodiment, the first carrying mechanism includes a first carrying cup and a first cleaning assembly, the first swing arm can drive the first polishing head to pass through the first carrying cup and the first cleaning assembly when swinging, the first carrying cup is used for providing a wafer for the first polishing head or receiving a wafer released by the first polishing head, and the first cleaning assembly is used for cleaning the first polishing head.
In one embodiment, the second carrying mechanism includes two second carrying cups, the second swing arm can drive the second polishing heads to pass through each second carrying cup when swinging, and each second carrying cup can provide wafers for the second polishing heads or receive wafers released by the second polishing heads.
In one embodiment, the second carrying mechanism includes a second carrying cup and a second cleaning assembly, the second swing arm can drive the second polishing head to pass through the second carrying cup and the second cleaning assembly when swinging, the second carrying cup is used for providing a wafer for the second polishing head or receiving a wafer released by the second polishing head, and the second cleaning assembly is used for cleaning the second polishing head.
In one embodiment, the polishing device further comprises at least two first liquid supply arms, each of which is arranged at intervals around the circumference of the first polishing disk and is used for supplying the polishing liquid to the first polishing disk.
In one embodiment, the polishing device further comprises at least two second liquid supply arms, each of which is arranged at intervals around the circumference of the second polishing disk and is used for supplying the polishing liquid to the second polishing disk.
A wafer processing apparatus comprising a polishing device as described in any one of the embodiments above.
When the polishing device and the wafer processing equipment are in actual use, firstly, the carrying device transfers the wafer to be processed to the first bearing mechanism and the second bearing mechanism; then, the first swing arm drives the first polishing head to sequentially transfer among the first bearing mechanism, the first polishing disk and the second polishing disk. Picking up the wafer on the first bearing mechanism when the first polishing head swings to the first bearing mechanism; when the first polishing head swings to the first polishing disc, the first polishing disc polishes the wafer on the first polishing head for the first time; the second polishing disk polishes the wafer on the first polishing head for the second time when the first polishing head swings to the second polishing disk; when the first polishing head swings to the first bearing mechanism again, the first polishing head releases the twice polished wafer to the first bearing mechanism, so that the cycle is realized, and continuous wafer polishing operation is realized.
The first polishing head transfers among the first bearing mechanism, the first polishing disk and the second polishing disk, and the second swing arm drives the second polishing head to transfer among the second bearing mechanism, the first polishing disk and the second polishing disk. Picking up the wafer on the second carrying mechanism when the second polishing head swings to the second carrying mechanism; when the second polishing head swings to the first polishing disc, the first polishing disc polishes the wafer on the second polishing head for the first time; when the second polishing head swings to the second polishing disc, the second polishing disc polishes the wafer on the second polishing head for the second time; when the second polishing head swings to the second bearing mechanism again, the second polishing head releases the twice polished wafer to the second bearing mechanism, so that the cycle is realized, and continuous wafer polishing operation is realized.
In this way, in the process that the wafer on the first bearing mechanism in the polishing device passes through the first polishing disk and the second polishing disk and then returns to the first bearing mechanism, the first polishing head only performs the material taking action and the material discharging action at the first bearing mechanism, namely, the times of taking and discharging the wafer are reduced, and the production efficiency is improved; similarly, in the process that the wafer on the second bearing mechanism returns to the second bearing mechanism after passing through the first polishing disk and the second polishing disk, the second polishing head only performs a material taking action and a material discharging action at the second bearing mechanism, namely, the times of taking and discharging the wafer are reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of a wafer processing apparatus according to an embodiment of the present invention;
Fig. 2 is a schematic structural view of a polishing apparatus of the wafer processing apparatus shown in fig. 1.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1, an embodiment of the present invention provides a wafer processing apparatus, which includes a feeding and discharging device 10, a polishing device 20, a transferring device 30, and a cleaning device 40. The feeding and discharging device 10 and the polishing device 20 are arranged at intervals along the first direction X1. The transfer device 30 is disposed between the feeding and discharging device 10 and the polishing device 20. The cleaning device 40 is arranged at one side of the transfer device 30 in a second direction X2, which second direction X2 is perpendicular to the first direction X1. Wherein, the material feeding and discharging device 10 is used for providing wafers, the transferring device 30 is used for picking up the wafers provided by the material feeding and discharging device 10, and transferring the picked wafers between the polishing device 20 and the cleaning device 40. The polishing apparatus 20 is used for polishing the wafer transferred by the transfer apparatus 30, the cleaning apparatus 40 is used for cleaning the wafer transferred by the transfer apparatus 30, and the material feeding and discharging apparatus 10 is also used for recovering the wafer in the cleaning apparatus 40.
In practical use, the wafer processing apparatus described above first provides a wafer to be polished by the material feeding and discharging device 10; the transfer device 30 picks up the wafer provided by the material feeding and discharging device 10, and transfers the wafer to the polishing device 20 along the first direction X1 for polishing; after polishing is completed, the transfer device 30 transfers the polished wafer to the cleaning device 40 for cleaning; after the cleaning is completed, the wafer in the cleaning device 40 is recovered and stored in the feeding/discharging device 10. In this way, the material feeding and discharging device 10, the polishing device 20 and the cleaning device 40 are arranged around the transferring device 30 in the wafer processing equipment, so that the distance from the transferring device 30 to the material feeding and discharging device 10, the polishing device 20 and the cleaning device 40 is shortened, the transferring path of the wafer is optimized, and the production efficiency is improved. Alternatively, the wafer processing apparatus may be a CMP apparatus.
Alternatively, the cleaning devices 40 are provided in two, and the two cleaning devices 40 are disposed on both sides of the transfer device 30 in the second direction X2, respectively. Therefore, the transfer device 30 can transfer the wafer to any cleaning device 40 for cleaning, which greatly reduces the waiting time for cleaning and is beneficial to further improving the production efficiency. The number of the cleaning devices 40 is not limited to two, but may be one, three, or more, as long as each cleaning device 40 is disposed on both sides of the transfer device 30 in the second direction X2, and is not limited herein.
In particular embodiments, the polishing apparatus 20 is provided in at least one. When the polishing apparatus 20 is two or more (i.e., at least two), the at least two polishing apparatuses 20 are arranged at intervals along the first direction X1. The wafer processing apparatus further includes a carrying device 50, and the carrying device 50 is disposed above each polishing device 20 and movable in the first direction X1. The handling device 50 is capable of passing through each polishing device 20 during movement in the first direction X1 to transfer a wafer between the transfer device 30 and each polishing device 20. Thus, in actual production, the handling device 50 first picks up the wafer on the transfer device 30, and transfers the picked-up wafer to any one of the polishing devices 20 in the first direction X1 for polishing. When the polishing of the wafer on any one of the polishing apparatuses 20 is completed, the handling apparatus 50 picks up the polished wafer and transfers the wafer to the transfer apparatus 30 in the first direction X1.
Referring to fig. 2, in the embodiment of the present application, the polishing apparatus 20 includes a first swinging mechanism 21, a second swinging mechanism 22, a first polishing pad 23, a second polishing pad 24, a first carrying mechanism 25, and a second carrying mechanism 26. The first polishing pad 23 and the second polishing pad 24 are arranged at intervals along the second direction X2, and the first swinging mechanism 21 and the second swinging mechanism 22 are each located between the first polishing pad 23 and the second polishing pad 24. The first bearing mechanism 25 and the second bearing mechanism 26 are arranged at intervals along the first direction X1, and the first swing mechanism 21 and the second swing mechanism 22 are both located between the first bearing mechanism 25 and the second bearing mechanism 26.
The first swinging mechanism 21 includes a first swinging arm 211 and a first polishing head 213 mounted on the first swinging arm 211. The first swing arm 211 can swing controllably and drive the first polishing head 213 to pass through the first carrying mechanism 25, the first polishing disk 23 and the second polishing disk 24. The second swing mechanism 22 includes a second swing arm 221 and a second polishing head 223 mounted on the second swing arm 221. The second swing arm 221 can swing controllably and drive the second polishing head 223 to pass through the second carrying mechanism 26, the first polishing disk 23 and the second polishing disk 24. The first carrying mechanism 25 is for supplying a wafer to the first polishing head 213 or receiving a wafer released by the first polishing head 213, the second carrying mechanism 26 is for supplying a wafer to the second polishing head 223 or receiving a wafer released by the second polishing head 223, and the first polishing disk 23 and the second polishing disk 24 are each for polishing a wafer on the first polishing head 213 or the second polishing head 223.
In this way, in actual use, first, the handling device 50 transfers the wafer to be processed onto the first carrying mechanism 25 and the second carrying mechanism 26; then, the first swing arm 211 drives the first polishing head 213 to sequentially transfer between the first carrying mechanism 25, the first polishing pad 23, and the second polishing pad 24. Picking up the wafer on the first carrying mechanism 25 when the first polishing head 213 swings to the first carrying mechanism 25; the first polishing disk 23 polishes the wafer on the first polishing head 213 for the first time when the first polishing head 213 swings to the first polishing disk 23; the second polishing disk 24 performs a second polishing on the wafer on the first polishing head 213 when the first polishing head 213 swings to the second polishing disk 24; when the first polishing head 213 swings to the first carrying mechanism 25 again, the first polishing head 213 releases the twice polished wafer onto the first carrying mechanism 25, thereby circulating and realizing continuous wafer polishing operation.
The first polishing head 213 transfers between the first carrying mechanism 25, the first polishing disk 23 and the second polishing disk 24, and the second swing arm 221 also drives the second polishing head 223 to transfer between the second carrying mechanism 26, the first polishing disk 23 and the second polishing disk 24. Picking up the wafer on the second carrying mechanism 26 when the second polishing head 223 swings to the second carrying mechanism 26; the first polishing disk 23 polishes the wafer on the second polishing head 223 for the first time when the second polishing head 223 swings to the first polishing disk 23; the second polishing disk 24 performs a second polishing on the wafer on the second polishing head 223 when the second polishing head 223 swings to the second polishing disk 24; when the second polishing head 223 swings to the second carrier 26 again, the second polishing head 223 releases the twice polished wafer onto the second carrier 26, thereby circulating and realizing continuous wafer polishing operation.
In this way, in the process that the wafer on the first carrying mechanism 25 in the polishing device 20 passes through the first polishing disc 23 and the second polishing disc 23 and then returns to the first carrying mechanism 25, the first polishing head 213 only performs the material taking and discharging actions at the first carrying mechanism 25, that is, the times of taking and discharging the wafer are reduced, which is beneficial to improving the production efficiency; similarly, in the process that the wafer on the second carrying mechanism 26 passes through the first polishing disc 23 and the second polishing disc 23 and then returns to the second carrying mechanism 26, the second polishing head 223 only performs a material taking action and a material discharging action at the second carrying mechanism 26, that is, the times of taking and discharging the wafer are reduced, which is beneficial to improving the production efficiency.
Further, the first swing arm 211 and the second swing arm 221 drive the first polishing head 213 and the second polishing head 223 to alternately reach the first polishing pad 23 and the second polishing pad 24, respectively. That is, after the first polishing head 213 leaves the first polishing disk 23, the second polishing head 223 reaches the first polishing disk 23; after the first polishing head 213 leaves the second polishing disk 24, the second polishing head 223 reaches the second polishing disk 24, so that the first polishing head 213 and the second polishing head 223 are prevented from swinging to the first polishing disk 23 or the second polishing disk 24 at the same time, and the first polishing head 213 and the second polishing head 223 interfere with each other.
In particular to the embodiment, the first bearing means 25 comprise two first bearing cups 251. The first swing arm 211 can drive the first polishing head 213 to pass through each first carrying cup 251 when swinging. Each of the first carrier cups 251 is capable of providing a wafer to the first polishing head 213 or receiving a wafer released by the first polishing head 213. Optionally, one first carrying cup 251 of the first carrying mechanism 25 is used for carrying a wafer which is not polished, and the other first carrying cup 251 is used for carrying a wafer after polishing is completed.
In actual use, first, the first polishing head 213 picks up a wafer on one of the first carrier cups 251 that is not polished, and swings to the first polishing disk 23 for first polishing; then, the first polishing head 213 swings to the second polishing pad 24 for the second polishing; then, the first polishing head 213 swings to the other first carrier cup 251, and releases the polished wafer to the first carrier cup 251, thereby reciprocating, thereby realizing continuous wafer polishing operation.
It will be appreciated that the polishing apparatus 20 is also compatible with processes that perform only one polishing, as follows: first, the first polishing head 213 picks up a wafer on one of the first carrier cups 251 that is not polished, and swings to the first polishing pad 23 or the second polishing pad 24 for one polishing; then, the first polishing head 213 swings to another first carrier cup 251, and releases the polished wafer to the first carrier cup 251, thereby reciprocating, thereby realizing continuous wafer polishing operation.
In particular to the embodiment, the second bearing means 26 comprise two second bearing cups 261. The second swing arm 221 can drive the second polishing head 223 to pass through each second bearing cup 261 when swinging. Each of the second carrier cups 261 is capable of providing a wafer to the second polishing head 223 or receiving a wafer released by the second polishing head 223. Optionally, one of the second carrying cups 261 of the second carrying mechanism 26 is used for carrying wafers that are not polished, and the other second carrying cup 261 is used for carrying wafers that are polished.
In actual use, first, the second polishing head 223 picks up a wafer on one of the second carrier cups 261 that is not polished, and swings to the first polishing disk 23 for first polishing; then, the second polishing head 223 swings to the second polishing disk 24, so that the wafer on the second polishing head 223 is polished for the second time; then, the second polishing head 223 swings to the other second carrier cup 261, and releases the polished wafer to the second carrier cup 261, thereby reciprocating, thereby realizing continuous wafer polishing operation.
It will be appreciated that the polishing apparatus 20 is also compatible with processes that perform only one polishing, as follows: first, the second polishing head 223 picks up a wafer on one of the second carrier cups 261 that is not polished, and swings to the first polishing pad 23 or the second polishing pad 24 for one polishing; then, the second polishing head 223 swings onto another second carrier cup 261, and releases the polished wafer onto the second carrier cup 261, thereby reciprocating, thereby realizing a continuous wafer polishing operation.
In particular embodiments, the polishing apparatus 20 further comprises at least two first fluid supply arms 28. Each of the first liquid supply arms 28 is disposed around the first polishing pad 23 at circumferentially spaced intervals for supplying the polishing liquid to the first polishing pad 23. In this way, the first polishing disk 23 needs to polish the wafer on the first polishing head 213 and the wafer on the second polishing head 223, where the two contact positions with the first polishing disk 23 are different, so that at least two first liquid supply arms 28 are arranged on the peripheral side of the first polishing disk 23, so that the first liquid supply arms 28 spraying the polishing liquid to the first polishing disk 23 can be randomly switched, and the process consistency between the wafer on the first polishing head 213 and the wafer on the second polishing head 223 when polishing on the first polishing disk 23 is ensured to be better, which is beneficial to ensuring the polishing quality consistency of each wafer. Preferably, the number of the first liquid supply arms 28 is two, and the two first liquid supply arms 28 are respectively arranged on both sides of the first polishing pad 23 in the first direction X1.
In particular embodiments, the polishing apparatus 20 further comprises at least two second fluid supply arms 27. Each of the second liquid supply arms 27 is disposed around the second polishing pad 24 at circumferentially spaced intervals for supplying the polishing liquid to the second polishing pad 24. In this way, the second polishing disk 24 needs to polish the wafer on the first polishing head 213 and the wafer on the second polishing head 223, where the two contact positions with the second polishing disk 24 are different, so that at least two second liquid supply arms 27 are arranged on the peripheral side of the second polishing disk 24, so that the second liquid supply arms 27 spraying the polishing liquid to the second polishing disk 24 can be randomly switched, and the process consistency between the wafer on the first polishing head 213 and the wafer on the second polishing head 223 when polishing on the second polishing disk 24 is better, which is beneficial to ensuring the polishing quality consistency of each wafer. Preferably, the number of the second liquid supply arms 27 is two, and the two second liquid supply arms 27 are respectively arranged on both sides of the second polishing pad 24 in the first direction X1.
Referring to fig. 1 and 2, in the embodiment of the present application, in the same polishing apparatus 20: one of the first carrier cups 251 and one of the second carrier cups 261 are arranged at intervals in a first row of carrier cups along the first direction X1, wherein the other of the first carrier cups 251 and the other of the second carrier cups 261 are arranged at intervals in a second row of carrier cups along the first direction X1. The handling devices 50 are provided in two, wherein one handling device 50 is arranged above the first row of bearing cups and is capable of moving in the first direction X1 and passing through the first bearing cup 251 and the second bearing cup 261 in the first row of bearing cups, so that the handling device 50 is capable of transferring wafers between the transfer device 30 and the first bearing cup 251 and the second bearing cup 261 of the first row of bearing cups; another handling device 50 is arranged above the second row of carrier cups and is movable in a first direction X1 and past the first 251 and second 261 carrier cups of the second row of carrier cups such that the handling device 50 is capable of transferring wafers between the transfer device 30 and the first 251 and second 261 carrier cups of the second row of carrier cups.
It should be noted that, when the polishing apparatus 20 is provided in at least two, the first bearing cups 251 and the second bearing cups 261 of the first row of bearing cups in each polishing apparatus 20 are arranged in a row at intervals along the first direction X1, so that the carrying apparatus 50 corresponding to each first row of bearing cups can pass through the first bearing cups 251 and the second bearing cups 261 of the first row of bearing cups in each polishing apparatus 20 when moving along the first direction X1, so that the carrying assembly can transfer the wafer between the transfer apparatus 30 and the first bearing cups 251 and the second bearing cups 261 of the first row of bearing cups in each polishing apparatus 20. Similarly, the first bearing cups 251 and the second bearing cups 261 of the second row of bearing cups in each polishing apparatus 20 are arranged in a row at intervals along the first direction X1, so that the carrying apparatus 50 corresponding to the second row of bearing cups can pass through the first bearing cups 251 and the second bearing cups 261 of the second row of bearing cups in each polishing apparatus 20 when moving along the first direction X1, and the carrying apparatus 50 can transfer wafers between the transfer apparatus 30 and the first bearing cups 251 and the second bearing cups 261 of the second row of bearing cups in each polishing apparatus 20.
In other embodiments, only one first carrying cup 251 may be provided on the first carrying mechanism 25, and the wafer may be carried by the first carrying cup 251. Further, the first carrying mechanism 25 further includes a first cleaning mechanism, and the first swing arm 211 can drive the first polishing head 213 to swing to pass through the first cleaning mechanism, so that the first polishing head 213 passing through is cleaned by using the first cleaning mechanism. That is, in this embodiment, the first cleaning mechanism is used to replace one of the first carrier cups 251 in the above embodiment, and the first swing arm 211 can drive the first polishing head 213 to circulate through the first cleaning mechanism, the first carrier cup 251, the first polishing disk 23, the second polishing disk 24 and the first carrier cup 251 in sequence, so that the first polishing head 213 swings to the first cleaning mechanism for cleaning before each time a wafer on the first carrier cup 251 is picked up, thereby ensuring the cleanliness of the first polishing head 213 before the wafer is picked up.
In other embodiments, only one second carrying cup 261 may be provided on the second carrying mechanism 26, and the wafer may be carried by the second carrying cup 261. Further, the second carrying mechanism 26 further includes a second cleaning mechanism, and the second swing arm 221 can drive the second polishing head 223 to swing and pass through the second cleaning mechanism, so that the second polishing head 223 passing through is cleaned by using the second cleaning mechanism. That is, in this embodiment, the second cleaning mechanism is used to replace one of the second bearing cups 261 in the above embodiment, and the second swing arm 221 can drive the second polishing head 223 to circulate through the second cleaning mechanism, the second bearing cup 261, the first polishing disk 23, the second polishing disk 24 and the second bearing cup 261 in sequence, so that before each time a wafer on the second bearing cup 261 that is not polished is picked up, the second polishing head 223 swings to the second cleaning mechanism to clean, thereby ensuring the cleanliness of the second polishing head 223 before each time a wafer is picked up.
In an embodiment of the present application, the transfer device 30 includes an input stage 31, a robot 34, and an output stage 32. The input table 31 is controllably movable in the first direction X1 between the loading and unloading device 10 and the polishing device 20. When the input table 31 moves to the feeding and discharging device 10 along the first direction X1, the feeding and discharging device 10 can transfer the provided wafer onto the input table 31; when the input table 31 moves to the polishing apparatus 20 in the first direction X1, the handling apparatus 50 is able to pick up a wafer on the input table 31 and transfer the wafer to the first carrier cup 251 or the second carrier cup 261 of either polishing apparatus 20. The output table 32 is disposed on a side of the polishing apparatus 20 facing the in-out apparatus 10 for receiving polished wafers transferred by the carrying apparatus 50. The robot 34 is used to transfer the wafer on the output stage 32 to the cleaning device 40, and the loading and unloading device 10 is also used to recover the wafer in the cleaning device 40.
Further, the input stage 31 and the output stage 32 are arranged in a staggered manner in the vertical direction (i.e., the direction perpendicular to the paper surface in fig. 1), that is, the input stage 31 and the output stage 32 are respectively located at different height positions, so that the input stage 31 is located above or below the output stage 32 when the input stage 31 is moved to the polishing apparatus 20, that is, the interference of the output stage 32 to the movement of the input stage 31 in the first direction X1 is avoided.
Further, the number of the input tables 31 is two, so that the waiting time of the carrying device 50 for taking materials on the input tables 31 is reduced, and the production efficiency is improved. Similarly, the number of output stages 32 is two, so that the waiting time of the carrying device 50 for releasing the wafer onto the output stages 32 is reduced, which is beneficial to improving the production efficiency.
It should be noted that the transfer device 30 is not limited thereto, and in other embodiments, the input stage 31 and the output stage 32 are disposed at intervals along the first direction X1 and are configured to be fixed (i.e., not move along the first direction X1). One or more transfer robots are provided between the input stage 31 and the output stage 32, so that transfer of the wafer between the input stage 31 and the transfer device 50 and transfer between the output stage 32 and the cleaning device 40 are realized by the respective transfer robots, which are not limited herein.
The wafer transfer process in the wafer processing apparatus of the present application will be described with reference to fig. 1 and 2:
Firstly, the input table 31 moves leftwards to the feeding and discharging device 10, and the feeding and discharging device 10 transfers a wafer to be polished to the input table 31; then, the input table 31 is moved rightward to the polishing apparatus 20, the carrying device 50 is moved leftward to the input table 31, and the wafer on the input table 31 is picked up; then, the carrying device 50 moves rightward onto the first carrying cup 251 or the second carrying cup 261; then, the first polishing head 213 or the second polishing head 223 picks up the wafer on the first carrier cup 251 or the second carrier cup 261, and sequentially performs two polishing processes at the first polishing disk 23 and the second polishing disk 24; then, the first polishing head 213 or the second polishing head 223 releases the wafer after the two polishing steps to the corresponding first bearing cup 251 or second bearing cup 261; then, the carrying device 50 picks up the polished wafer on the first carrier cup 251 or the second carrier cup 261, moves to the left to the output stage 32, and releases the picked wafer to the output stage 32; then, the robot 34 transfers the wafer on the output stage 32 to the cleaning device 40 for cleaning; after the cleaning is completed, the wafer in the cleaning device 40 is recovered by the in-out device 10.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (9)
1. A polishing apparatus, comprising:
A first polishing disk (23) and a second polishing disk (24) which are arranged at intervals along a second direction (X2);
A first carrying mechanism (25) and a second carrying mechanism (26) which are arranged at intervals along a first direction (X1) perpendicular to the second direction (X2);
A first swinging mechanism (21) and a second swinging mechanism (22) which are both positioned between the first polishing disk (23) and the second polishing disk (24) and are both positioned between the first bearing mechanism (25) and the second bearing mechanism (26);
The first swinging mechanism (21) comprises a first swinging arm (211) and a first polishing head (213) arranged on the first swinging arm (211), and the first swinging arm (211) can controllably swing and drive the first polishing head (213) to pass through the first bearing mechanism (25), the first polishing disk (23) and the second polishing disk (24); the second swinging mechanism (22) comprises a second swinging arm (221) and a second polishing head (223) arranged on the second swinging arm (221), and the second swinging arm (221) can controllably swing and drive the second polishing head (223) to pass through the second bearing mechanism (26), the first polishing disk (23) and the second polishing disk (24); the first carrying mechanism (25) is used for providing a wafer to the first polishing head (213) or carrying a wafer released by the first polishing head (213), the second carrying mechanism (26) is used for providing a wafer to the second polishing head (223) or carrying a wafer released by the second polishing head (223), and the first polishing disk (23) and the second polishing disk (24) are both used for polishing the wafer on the first polishing head (213) or the second polishing head (223).
2. The polishing apparatus according to claim 1, wherein the first swing arm (211) and the second swing arm (221) drive the first polishing head (213) and the second polishing head (223), respectively, to alternately reach the first polishing disk (23) and the second polishing disk (24) with each other.
3. The polishing apparatus according to claim 1, wherein the first carrying mechanism (25) comprises two first carrying cups (251), the first swing arm (211) can drive the first polishing head (213) to pass through each first carrying cup (251) when swinging, and each first carrying cup (251) can provide a wafer to the first polishing head (213) or receive a wafer released by the first polishing head (213).
4. The polishing apparatus according to claim 1, wherein the first carrying mechanism (25) comprises a first carrying cup (251) and a first cleaning assembly, the first swing arm (211) can drive the first polishing head (213) to pass through the first carrying cup (251) and the first cleaning assembly when swinging, the first carrying cup (251) is used for providing a wafer to the first polishing head (213) or receiving a wafer released by the first polishing head (213), and the first cleaning assembly is used for cleaning the first polishing head (213).
5. The polishing apparatus according to claim 1, wherein the second carrying mechanism (26) includes two second carrying cups (261), the second swing arm (221) can drive the second polishing head (223) to pass through each second carrying cup (261) when swinging, and each second carrying cup (261) can provide a wafer to the second polishing head (223) or receive a wafer released by the second polishing head (223).
6. The polishing apparatus according to claim 1, wherein the second carrying mechanism (26) comprises a second carrying cup (261) and a second cleaning assembly, the second swing arm (221) can drive the second polishing head (223) to pass through the second carrying cup (261) and the second cleaning assembly when swinging, the second carrying cup (261) is used for providing a wafer to the second polishing head (223) or receiving a wafer released by the second polishing head (223), and the second cleaning assembly is used for cleaning the second polishing head (223).
7. A polishing device according to any one of claims 1 to 6, further comprising at least two first liquid supply arms (27), each of the first liquid supply arms (27) being arranged at circumferentially spaced intervals around the first polishing disc (23) for supplying polishing liquid to the first polishing disc (23).
8. The polishing apparatus according to any one of claims 1 to 6, further comprising at least two second liquid supply arms (28), each of the second liquid supply arms (28) being arranged at circumferentially spaced intervals around the second polishing pad (24) for supplying the polishing liquid to the second polishing pad (24).
9. Wafer processing apparatus comprising a polishing device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410986930.2A CN118789446A (en) | 2024-07-23 | 2024-07-23 | Polishing device and wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410986930.2A CN118789446A (en) | 2024-07-23 | 2024-07-23 | Polishing device and wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118789446A true CN118789446A (en) | 2024-10-18 |
Family
ID=93032677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410986930.2A Pending CN118789446A (en) | 2024-07-23 | 2024-07-23 | Polishing device and wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118789446A (en) |
-
2024
- 2024-07-23 CN CN202410986930.2A patent/CN118789446A/en active Pending
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