CN118549460A - Full-automatic wafer surface inspection machine and wafer inspection method - Google Patents
Full-automatic wafer surface inspection machine and wafer inspection method Download PDFInfo
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- CN118549460A CN118549460A CN202411018420.2A CN202411018420A CN118549460A CN 118549460 A CN118549460 A CN 118549460A CN 202411018420 A CN202411018420 A CN 202411018420A CN 118549460 A CN118549460 A CN 118549460A
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- 238000007689 inspection Methods 0.000 title claims abstract description 244
- 238000000034 method Methods 0.000 title claims abstract description 24
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- 230000007306 turnover Effects 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 191
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- 238000003384 imaging method Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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- 239000003153 chemical reaction reagent Substances 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The application relates to the technical field of wafer appearance inspection, and particularly discloses a full-automatic wafer surface inspection machine and a wafer inspection method. The full-automatic wafer surface inspection machine comprises a rack, and a material box, a carrying disc, a manipulator, a turnover module, a macroscopic inspection module and a microscopic inspection module which are arranged on the rack. The carrier plate is used for carrying the wafer. The turnover module is provided with a clamping mechanism and a turnover device. The turner is arranged on the frame. The output end of the turner is connected with the clamping mechanism. The clamping mechanism is configured to clamp the carrier platter. The macroscopic inspection module is provided with a macroscopic station for receiving the carrier plate. The microscopic examination module is provided with a microscopic station for receiving the carrier plate. The manipulator is configured to be capable of carrying the carrier tray and transferring the carrier tray between the storage station, the clamping mechanism, the macro station and the micro station. The inspection machine can carry out macroscopic inspection on the front surface of the wafer to locate flaws, then carry out microscopic inspection and repeated judgment on the flaws detected macroscopically, and improve the efficiency and accuracy of flaw detection.
Description
Technical Field
The application relates to the technical field of wafer appearance inspection, in particular to a full-automatic wafer surface inspection machine and a wafer inspection method.
Background
The wafer surface has many defect types, which may be defects generated by the process or may be defects of the material itself. Wafer defects can be simply classified as surface redundancy (particles, contaminants, etc.), crystal defects (slip line defects, stacking faults), scratches, pattern defects.
Redundant species on the wafer surface are relatively large, tiny particles as small as tens of nanometers, dust as large as hundreds of microns, and surface residues left over from the previous process. The particles may be introduced into the process by etching, polishing, cleaning, etc. The defects of the redundancy are mainly from dust on the surface of a wafer in production and processing, air purity does not reach the standard, chemical reagents in the processing and the like. These particles can block light during photolithography, causing defects in the integrated circuit structure, and contaminants can adhere to the wafer surface, causing pattern imperfections that affect the electrical characteristics of the chip.
Slip line defects are also a common defect caused by uneven heating during crystal growth, which usually form a horizontal fine straight line at the peripheral edge of the wafer. Due to the relatively large size of the slip line, it can be recognized in the form of manual observation.
The inspection of the surface defects of the wafer can be performed by the inspection equipment, but the current wafer inspection equipment generally only performs macroscopic inspection on the wafer, cannot automatically perform microscopic inspection and re-judgment on the macroscopically inspected flaws, can only perform re-judgment manually by using a microscope, and is inconvenient in use.
Disclosure of Invention
In view of the problem that the conventional wafer inspection equipment generally only carries out macroscopic inspection on a wafer, cannot automatically carry out microscopic inspection and re-judgment on a defect detected by macroscopic inspection, and can only carry out re-judgment by manually using a microscope, the application provides a full-automatic wafer surface inspection machine and a wafer inspection method, which can carry out microscopic re-judgment on a defect detected by macroscopic inspection and are convenient to use. Therefore, the application adopts the following technical scheme.
In a first aspect, the present application provides a full-automatic wafer surface inspection machine, and the present application adopts the following technical scheme.
A full-automatic wafer surface inspection machine comprises a rack, and a material box, a carrying disc, a manipulator, a turnover module, a macroscopic inspection module and a microscopic inspection module which are arranged on the rack. The carrier plate is configured to carry a wafer; the material box is provided with a receiving and storing station for loading the carrying disc; the turnover module is provided with a clamping mechanism and a turnover device; the turner is arranged on the frame; the output end of the turner is connected with the clamping mechanism; the clamping mechanism is configured to clamp the carrier plate; the macroscopic inspection module is configured with a macroscopic station for bearing the carrier disc; the microscopic examination module is provided with a microscopic station for bearing the carrier disc. The manipulator is configured to carry the carrier tray and transfer the carrier tray between the storage station, the clamping mechanism, the macro station and the micro station.
By adopting the technical scheme, the full-automatic wafer surface inspection machine can carry out macroscopic inspection and positioning on the front surface of the wafer, then carry out microscopic inspection and repeated judgment on the macroscopic detected flaws, and improve the efficiency and accuracy of flaw detection. Through the overturning carrying disc, the full-automatic wafer surface inspection machine can also inspect the back surface of the wafer and the bonding condition of the carrying disc and the back surface of the wafer.
The preferable scheme of the full-automatic wafer surface inspection machine is that the carrying disc comprises a frame and a transparent back adhesive film; the periphery of the transparent back adhesive film is fixed on the frame; the inside of the frame can accommodate a wafer to be inspected; the transparent back adhesive film can be configured to adhere and fix a wafer.
By adopting the technical scheme, when the front surface of the wafer is inspected, the position of the wafer is fixed, so that the defect of the wafer can be accurately positioned, and after the carrying disc is turned over, the wafer can still be fixed on the carrying disc, so that the back surface of the wafer and the condition of the transparent adhesive film attached to the wafer can be inspected.
The preferable scheme of the full-automatic wafer surface inspection machine is that the manipulator comprises a horizontal axial driver, a horizontal axial track, a lifter, a first horizontal rotator and a first telescopic arm; the first telescopic arm comprises a first transverse arm, a second horizontal rotator, a second transverse arm, a third horizontal rotator, a third transverse arm and a lifting piece; the horizontal axial driver and the horizontal axial rail are mutually parallel and are arranged on the frame; the output end of the horizontal axial driver is connected with the lifter, and the lifter is slidably arranged on the horizontal axial track; the first horizontal rotator is arranged at the output end of the lifter, and the output end of the first horizontal rotator is connected with one end of the first cross arm; the second horizontal rotator is arranged at the other end of the first cross arm, and the output end of the second horizontal rotator is connected with one end of the second cross arm; the output end of the third horizontal rotator is connected with one end of the third cross arm; the lifting piece is fixed at the other end of the third cross arm and is configured to lift the carrier plate.
Through adopting above-mentioned technical scheme, this manipulator passes through horizontal axial driver, can follow horizontal axial track and remove to adjust the overall position of manipulator, with the adjustment with the magazine, turn over the module, macroscopic inspection module and microscopic inspection module's horizontal distance, this manipulator is through the height of lifting the piece on the riser adjuster arm, with getting, put the dish, this manipulator still rotates three xarm through three horizontal revolver, make first flexible arm carry out telescopic movement, adjust the terminal position of lifting the piece promptly, above synthesize and accomplish the action of getting, putting and transferring the dish.
The preferable scheme of the full-automatic wafer surface inspection machine is that the manipulator further comprises a second telescopic arm; the second telescopic arm is connected to the output end of the first horizontal rotator.
By adopting the technical scheme, the two telescopic arms transport the carrying disc, so that the working efficiency is improved.
The optimal scheme of the full-automatic wafer surface inspection machine is that the macroscopic inspection module and the microscopic inspection module are adjacently arranged; the macroscopic station and the microscopic station are both circular; the horizontal axial track is parallel to a connecting line of the circle center of the macroscopic station and the circle center of the microscopic station.
Through adopting above-mentioned technical scheme, the manipulator can transport the carrier plate and be in macroscopic inspection module with microscopic inspection module is between translation, conveniently fixes a position the carrier plate.
The preferable scheme of the full-automatic wafer surface inspection machine is that the turnover module further comprises an installation seat; the output end of the turner is connected with the mounting seat. The clamping mechanism comprises a first clamping arm and a second clamping arm; the first clamping arm comprises a first telescopic device and a first clamping piece; the second clamping arm comprises a second telescopic device and a second clamping piece; the first telescopic device and the second telescopic device are arranged on the mounting seat; the output end of the first telescopic device and the output end of the second telescopic device are arranged oppositely, and the output end of the first telescopic device and the output end of the second telescopic device are parallel to each other or on the same axis; the first clamping piece is vertically connected to the output end of the first telescopic device; the second clamping piece is vertically connected to the output end of the second telescopic device; the first telescopic device and the second telescopic device can drive the first clamping piece and the second clamping piece to be mutually close or far away from each other.
Through adopting above-mentioned technical scheme, turn over the face module and can overturn the carrier disc, make right side up the carrier disc become the back up to after the inspection wafer front, can also inspect the wafer back and inspect the laminating condition on carrier disc and wafer back.
The preferable scheme of the full-automatic wafer surface inspection machine is that the macroscopic inspection module comprises a first transverse driver, a first transverse rail, a first longitudinal driver, a first longitudinal rail, a macroscopic inspection platform, a plurality of first lifting columns, a multi-angle linear light source, a reflecting mirror, a linear scanning mechanism and a first distance adjusting mechanism. The first transverse rail is arranged on the rack; the first transverse driver is mounted on the first transverse rail; the first longitudinal rail is fixed on the first transverse driver; the first longitudinal drive is mounted on the first longitudinal rail; the macroscopic inspection platform is fixed on the first longitudinal driver; the upper surface of the macroscopic inspection platform is the macroscopic station; the macroscopic inspection platform is provided with a plurality of first vacuum holes which lead to the macroscopic station; the macroscopic inspection platform is also provided with a plurality of first vertical holes; the upper end of each first vertical hole is flush with the macroscopic station; the first lifting columns are arranged in the first vertical holes one by one; the plurality of first lifting columns can be driven to rise flush to the macroscopic station and can also be driven to sink into the first vertical holes; the multi-angle linear light source, the reflecting mirror and the first distance adjusting mechanism are all fixed on the rack; the line scanning visual mechanism is arranged on the first distance adjusting mechanism; the line segment light emitted by the multi-angle line light source is overlapped on the same line segment of the wafer surface on the macroscopic station; the reflector is arranged to reflect the line light reflected by the wafer surface towards the line scanning vision mechanism; the first distance adjustment mechanism is configured to adjust a distance of the line glance mechanism to the mirror.
By adopting the technical scheme, the plane coordinates of the macroscopic inspection platform can be accurately adjusted to accurately adjust the position of the wafer, so that an accurate wafer flaw coordinate graph is generated. The plurality of first lifting columns are arranged and can firstly ascend to the macroscopic inspection platform so as to be used for bearing the carrying disc on the manipulator, and after the manipulator is withdrawn, the plurality of first lifting columns are descended below the macroscopic inspection platform so that the carrying disc descends on the macroscopic inspection platform, and the plurality of first vacuum holes of the macroscopic inspection platform suck vacuum to suck the carrying disc, thereby fixing the wafer so as to be convenient for inspecting and positioning the wafer flaws. The first distance adjusting mechanism can adjust the distance from the line scanning mechanism to the reflecting mirror so that the multi-angle line light source and the line scanning mechanism focus on the same straight line segment, the multi-angle light source forms an obvious imaging form on various flaws on the surface of the wafer, and the line scanning mechanism scans the surface of the wafer comprehensively. After the scanning is finished, the system performs image analysis processing, automatically identifies the flaw, records the flaw position, forms a coordinate graph, transmits the coordinate graph to a microscopic inspection machine, and switches the microscopic inspection machine to a high-power microscopic mode to perform fine photographing and repeated judgment on the flaw position.
The optimal scheme of the full-automatic wafer surface inspection machine is that the microscopic inspection module comprises a second transverse driver, a second transverse rail, a second longitudinal driver, a second longitudinal rail, a microscopic inspection platform, a plurality of second lifting columns, a focusing sensor, a microscopic inspection lens group and a second distance adjusting mechanism. The second transverse rail is arranged on the rack; the second transverse driver is mounted on the second transverse rail; the second longitudinal rail is fixed on the second transverse driver; the second longitudinal drive is mounted on the second longitudinal rail; the microscopic examination platform is fixed on the second longitudinal driver; the upper surface of the microscopic examination platform is the microscopic station; the microscopic examination platform is provided with a plurality of second vacuum holes which are communicated with the microscopic stations; the microscopic examination platform is also provided with a plurality of second vertical holes; the upper end of each second vertical hole is flush with the micro station; the second lifting columns are arranged in the second vertical holes one by one; the second lifting columns can be driven to rise above the micro station in a flush manner and can also be driven to sink into the second vertical holes; the focusing sensor is fixed on the microscopic examination lens group; the microscopic examination lens group is arranged on the second distance adjusting mechanism; the second distance adjusting mechanism is arranged on the rack; the second distance adjustment mechanism is configured to adjust a distance from the focus sensor to the micro-station.
By adopting the technical scheme, the horizontal plane position of the microscopic inspection platform can be accurately adjusted, so that the wafer position on the microscopic inspection platform is accurately adjusted to position the wafer flaw. The second lifting columns can firstly lift onto the microscopic examination platform to receive the carrying disc on the manipulator, then the manipulator descends and withdraws from the microscopic examination platform, the carrying disc descends to enable the carrying disc to fall onto the microscopic examination platform, and the second vacuum holes of the microscopic examination platform can suck the carrying disc to enable the position of the carrying disc to be fixed. According to the flaw coordinate graph transmitted by the macroscopic inspection module, the position of the microscopic inspection lens group is adjusted to align flaws one by one, the height of the focusing sensor is adjusted to focus flaws clearly, and microscopic high-power inspection and repeated judgment are carried out on the position through the microscopic inspection lens group.
In a second aspect, the present application further provides a wafer inspection method, and the following technical scheme is adopted.
A wafer inspection method adopts a full-automatic wafer surface inspection machine comprising a turn-over module with the preferable structure to inspect a wafer; the wafer inspection method comprises the following steps:
the manipulator stretches into the material box, the manipulator lifts the carrying disc, and wafers are placed in the carrying disc; the manipulator moves the carrier disc out of the material box and places the carrier disc on the macroscopic station;
After the macroscopic inspection module scans the front surface of the wafer, automatically identifying the defects of the front surface of the wafer through image analysis processing, recording the positions of the defects, forming a front coordinate graph and transmitting the front coordinate graph to the microscopic inspection module;
If the macroscopic inspection module is used for inspecting that the wafer is defective, the manipulator transfers the carrying disc to the microscopic station; the microscopic detection module is used for positioning defects one by one according to the front coordinate graph, and performing fine photographing and repeated judgment on the defect positions;
after the judgment, the manipulator transfers the carrying disc to the first clamping piece, the first telescopic device and the second telescopic device drive the first clamping piece and the second clamping piece to be close to each other and fasten the carrying disc, and the turner drives the first clamping piece and the second clamping piece to turn over so that the back surface of the carrying disc faces upwards; the first telescopic device and the second telescopic device drive the first clamping piece and the second clamping piece to be far away from each other;
The manipulator lifts a carrying disc in the clamping mechanism to be transferred to the macroscopic station, and after the macroscopic inspection module scans the back of the wafer, the wafer back flaw and/or the abnormality of the transparent adhesive-backed film attached wafer are automatically identified through image analysis processing, and the flaw and/or the abnormality position is recorded to form a back coordinate graph and transmitted to the microscopic inspection module; the microscopic detection module is used for positioning the defect and/or the abnormal position one by one according to the back coordinate graph, and performing fine photographing and repeated judgment on the defect and/or the abnormal position; after the judgment, the manipulator transfers the carrying disc into the material box.
By adopting the technical scheme, the front surface of the wafer is inspected, the requirement for the back surface inspection of the wafer can be met, the defect position of the wafer is macroscopically positioned during the inspection, and then the positioned defect is subjected to high-power microscopic repeated judgment, so that the accuracy of detecting the defect is improved.
A wafer inspection method adopts a full-automatic wafer surface inspection machine comprising a macro inspection module and a micro inspection module with the preferable structures to inspect a wafer; the wafer inspection method comprises the following steps:
The manipulator transfers the carrier plate to the macroscopic station: the manipulator firstly takes out the carrying disc in the material box; the plurality of first lifting columns ascend above the macro station; the mechanical arm places the carrying disc on the first lifting columns, then the first lifting columns descend to be submerged in the first vertical holes, so that the carrying disc falls on the macroscopic station, and the macroscopic inspection platform starts vacuum to suck the carrying disc; the macro inspection module performs macro inspection on the wafer, and comprises the steps of automatically identifying the front flaws of the wafer, recording the positions of the flaws, forming a front coordinate graph and transmitting the front coordinate graph to the micro inspection module;
after macroscopic inspection, the macroscopic inspection platform is closed in vacuum, the first lifting columns are lifted to lift the carrier plate, and the manipulator stretches into the lower part of the carrier plate and lifts the carrier plate away from the first lifting columns;
The plurality of second lifting columns ascend above the micro-station; the manipulator places the carrying disc on the second lifting columns after macroscopic inspection, then the second lifting columns descend to be submerged in the second vertical holes, so that the carrying disc falls on the microscopic station, and the microscopic inspection platform opens vacuum to suck the carrying disc; the microscopic detection module is used for positioning defects one by one according to the front coordinate graph, and performing fine photographing and repeated judgment on the defect positions;
After the repeated judgment, the microscopic examination platform is closed to vacuum, and the plurality of second lifting columns are lifted to lift the carrying disc; the manipulator stretches into the lower part of the carrying disc and lifts the carrying disc away from the plurality of second lifting columns.
By adopting the technical scheme, the wafer can be conveniently taken, placed and transferred, so that the inspection operation is more convenient.
In summary, the full-automatic wafer surface inspection machine and the wafer inspection method of the present application have the following advantages: the full-automatic wafer surface inspection machine can carry out macroscopic inspection and positioning on the front surface of the wafer, then carries out microscopic inspection and repeated judgment on the macroscopic detected flaws, and improves the efficiency and accuracy of flaw detection. Through the overturning carrying disc, the full-automatic wafer surface inspection machine can also inspect the back surface of the wafer and the bonding condition of the carrying disc and the back surface of the wafer.
Drawings
Fig. 1 is a view showing an external appearance structure of a full-automatic wafer surface inspection machine.
Fig. 2 is an internal structural view of the full-automatic wafer surface inspection machine of fig. 1.
FIG. 3 is a schematic view of the carrier tray of FIG. 1 carrying a wafer.
Fig. 4 is an enlarged view of a turn-over module in the fully automatic wafer surface inspection machine of fig. 1.
Fig. 5 is another view of fig. 2.
Fig. 6 is a schematic view showing the bottom view of the robot in the fully automatic wafer surface inspection machine of fig. 1.
FIG. 7 is a block diagram of a macro inspection module in the fully automated wafer surface inspection machine of FIG. 1.
Fig. 8 is a block diagram of the structure of fig. 7 with the macro inspection platform and wafer hidden.
FIG. 9 is a block diagram of the structure of FIG. 7 with a wafer hidden and a macroscopic inspection platform exposed.
FIG. 10 is a block diagram of a microscopic inspection module in the fully automated wafer surface inspection machine of FIG. 1.
FIG. 11 is a block diagram of the structure of FIG. 10 with the microscopic inspection platform and wafer hidden.
FIG. 12 is a block diagram of the structure of FIG. 10 with a wafer hidden and a microscopic inspection platform exposed.
Reference numerals: a frame 1; a magazine 2; a carrier plate 3; a manipulator 4; a turn-over module 5; a macro inspection module 6; a microscopic detection module 7; a wafer 8; a storage station 201; a clamping mechanism 51; a flipper 52; a macro station 6051; a micro station 7051; a frame 301; a transparent back adhesive film 302; a horizontal axial driver 401; a horizontal axial rail 402; a lifter 403; a first horizontal rotator 404; a first telescoping arm 405; a first cross arm 4051; a second horizontal rotator 4052; a second cross arm 4053; a third horizontal rotator 4054; a third cross arm 4055; a lifting member 4056; a second telescoping arm 406; a mounting base 53; a first clip arm 511; a second clamp arm 512; a first retractor 5111; a first clip 5112; a second retractor 5121; a second clip 5122; an X-shaped planar sheet 5131; a pad 5132; a first lateral driver 601; a first transverse rail 602; a first longitudinal driver 603; a first longitudinal rail 604; a macro inspection platform 605; a first lifting column 606; a multi-angle line light source 607; a mirror 608; a line glance vision mechanism 609; a first distance adjustment mechanism 610; a first vacuum hole 6052; a first vertical hole 6053; a second lateral driver 701; a second transverse rail 702; a second longitudinal driver 703; a second longitudinal rail 704; a microscopic inspection stage 705; a second lifting column 706; a focus sensor 707; a microscopy set 708; a second distance adjustment mechanism 709; a second vacuum hole 7052; second vertical bore 7053.
Detailed Description
The full-automatic wafer surface inspection machine and the wafer inspection method according to the present application will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, a full-automatic wafer surface inspection machine includes a frame 1, and a magazine 2, a carrier plate 3, a robot 4, a turn-over module 5, a macro inspection module 6 and a micro inspection module 7 mounted on the frame 1.
Referring to fig. 3, the carrier plate 3 is configured to carry wafers 8. The magazine 2 is provided with a storage station 201 for loading the carrier trays 3. For example, the magazine 2 is provided with a plurality of parallel stations, each of which is provided as two sides of an adaptable supporting pallet 3.
Referring to fig. 4, the flip module 5 has a clamping mechanism 51 and a flipper 52. The inverter 52 is mounted on the frame 1. The output of the inverter 52 is connected to the clamping mechanism 51. The holding mechanism 51 is configured to be capable of holding the carrier tray 3.
Referring to fig. 5, the macro inspection module 6 is configured with a macro station 6051 for receiving the carrier tray 3. The microscopic examination module 7 is provided with a microscopic work station 7051 for receiving the carrier tray 3.
The robot 4 is configured to be able to hold the carrier tray 3 and transfer the carrier tray 3 between the stocker station 201, the clamp mechanism 51, the macro station 6051, and the micro station 7051.
The full-automatic wafer surface inspection machine can carry out macroscopic inspection on the front surface of the wafer 8 to locate flaws, then carry out microscopic inspection and repeated judgment on the flaws detected macroscopically, and improve the efficiency and accuracy of flaw detection. By turning the carrier plate 3, the full-automatic wafer surface inspection machine can also inspect the back surface of the wafer 8 and the bonding condition of the carrier plate 3 and the back surface of the wafer 8.
Referring to fig. 3, an alternative structure of the carrier 3 is that the carrier 3 includes a frame 301 and a transparent back film 302. The periphery of the transparent back adhesive film 302 is fixed on the frame 301. The interior of the frame 301 can accommodate a wafer 8 being inspected. The back surface of the wafer 8 contacts the transparent back film 302, and is thus adhesively fixed. When the front surface of the wafer 8 is inspected, the position of the wafer 8 is fixed, so that the defect of the wafer 8 can be accurately positioned, and the wafer 8 can be always fixed on the carrier plate 3 in the process of overturning the carrier plate 3 and after overturning the carrier plate 3, so that the back surface of the wafer 8 and the condition that the transparent adhesive-backed film 302 is attached to the wafer 8 can be accurately inspected.
Referring to fig. 6, an alternative structure of the manipulator 4 is that the manipulator 4 includes a horizontal axial driver 401, a horizontal axial rail 402, a lifter 403, a first horizontal rotator 404, and a first telescopic arm 405. The first telescoping arm 405 includes a first cross arm 4051, a second horizontal rotator 4052, a second cross arm 4053, a third horizontal rotator 4054, a third cross arm 4055, and a lift 4056. A horizontal axial drive 401 and a horizontal axial track 402 are mounted on the frame 1 parallel to each other. The output end of the horizontal axial driver 401 is connected to a lifter 403, and the lifter 403 is slidably mounted on the horizontal axial rail 402. The horizontal axial driver 401 may be a servo motor, the output end of the servo motor is a screw rod, the screw rod is in threaded connection with the lifter 403, the servo motor drives the screw rod to rotate, and then the lifter 403 translates on the horizontal axial track 402. The lifter 403 may be a cylinder, a hydraulic cylinder, or the like. The first horizontal rotator 404 may be a motor mounted on the output of the lifter 403. The output end of the first horizontal rotator 404 is connected to one end of the first cross arm 4051, and can drive the first cross arm 4051 to rotate. The second horizontal rotator 4052 may be a motor, and the main body of the second horizontal rotator 4052 is fixedly installed at the other end of the first cross arm 4051, and the output end of the second horizontal rotator 4052 is connected to one end of the second cross arm 4053 and can drive the second cross arm 4053 to rotate. The third horizontal rotator 4054 may be a motor, and the main body of the third horizontal rotator 4054 is fixedly installed at the other end of the second cross arm 4053, and an output end of the third horizontal rotator 4054 is connected to one end of the third cross arm 4055, so that the third cross arm 4055 may be driven to rotate. The lifting member 4056 is fixed at the other end of the third cross arm 4055, and the lifting member 4056 is configured to lift the carrier 3, for example, the lifting member 4056 is a V-shaped sheet, and can extend under the carrier 3, and then move upwards to lift the carrier 3, so that the carrier 3 can be moved by the telescopic motion of the first telescopic arm 405.
The manipulator 4 with the structure can move along the horizontal axial track 402 through the horizontal axial driver 401, so that the overall position of the manipulator 4 is adjusted to adjust the horizontal distance from the material box 2, the turnover module 5, the macroscopic inspection module 6 and the microscopic inspection module 7, the manipulator 4 adjusts the height of the lifting piece 4056 on the arm through the lifter 403 to take and put the carrying disc 3, and the manipulator 4 also rotates three cross arms through three horizontal rotators, so that the first telescopic arm 405 performs telescopic motion, namely, adjusts the position of the lifting piece 4056 at the tail end, and the actions of taking, putting and transferring the carrying disc 3 are comprehensively completed.
Referring to fig. 6, the manipulator 4 may further include a second telescopic arm 406. The structure of the second telescopic arm 406 may be the same as that of the first telescopic arm 405, and the second telescopic arm 406 is connected to the output end of the first horizontal rotator 404. The carrier plate 3 is conveyed through the two telescopic arms, so that the working efficiency is improved.
The above-mentioned full-automatic wafer surface inspection machine, macroscopic inspection module 6 and microscopic inspection module 7 are preferably adjacent to each other, macroscopic station 6051 and microscopic station 7051 are all circular, horizontal axial track 402 is parallel to the line of the center of macroscopic station 6051 and the center of microscopic station 7051, thus, manipulator 4 can transport carrier plate 3 and translate between macroscopic inspection module 6 and microscopic inspection module 7, and carrier plate 3 is conveniently positioned.
Referring to fig. 4, an alternative structure of the flip module 5 is that the flip module 5 further includes a mounting base 53, and an output end of the inverter 52 is connected to the mounting base 53. The clamping mechanism 51 includes a first clamping arm 511 and a second clamping arm 512. The first clamping arm 511 includes a first retractor 5111 and a first clip 5112. The second clamp arm 512 includes a second retractor 5121 and a second clip 5122. The first and second retractors 5111 and 5121 may each be an air cylinder, a hydraulic cylinder, or the like, and are each mounted on the mounting base 53. The output end of the first expansion gear 5111 and the output end of the second expansion gear 5121 are disposed opposite to each other, and the output end of the first expansion gear 5111 and the output end of the second expansion gear 5121 are parallel to each other or on the same axis. The first clip 5112 is vertically connected to the output end of the first telescopic device 5111. The second clip 5122 is vertically connected to the output end of the second telescopic device 5121. Each of the first and second clips 5112 and 5122 may include an X-shaped planar sheet 5131 and four pads 5132, one pad 5132 being mounted to each of the four end points of the X-shaped planar sheet 5131, the four pads 5132 being located on the same side of the X-shaped planar sheet 5131. The first and second retractors 5111 and 5121 can drive the first and second jaws 5112 and 5122 to be closely attached to or separated from each other, i.e., the four pads 5132 of the first jaw 5112 and the four pads 5132 of the second jaw 5122 are closely attached to or separated from each other, so that the tray 3 can be clamped and released, and the front-end lifting member 4056 of the robot 4 can extend into the space between the pads 5132 to extract and place the tray 3.
The turnover module 5 with the above structure can turn the carrying disc 3 to change the carrying disc 3 with the right side facing upwards into the back side facing upwards, so that after the front side of the wafer 8 is inspected, the back side of the wafer 8 and the bonding condition of the carrying disc 3 and the back side of the wafer 8 can be inspected.
Referring to fig. 7 and 8, an alternative structure of the macro inspection module 6 is that the macro inspection module 6 includes a first transverse driver 601, a first transverse rail 602, a first longitudinal driver 603, a first longitudinal rail 604, a macro inspection platform 605, a plurality of first lifting columns 606, a multi-angle line light source 607, a reflector 608, a line scanning mechanism 609, and a first distance adjustment mechanism 610. The first transverse rail 602 is mounted on the frame 1, for example, the macro inspection module 6 further includes a marble base and vibration isolation air floats, the four corners of the bottom surface of the marble base are respectively provided with a vibration isolation air float, the vibration isolation air floats are mounted on the frame 1, and the first transverse rail 602 is mounted on the marble base. The first traverse driver 601 is mounted on a first traverse rail 602, the first traverse rail 602 may be a screw rod, the first traverse driver 601 has a connection with an internal thread, the first traverse driver 601 drives itself to rotate, and the first traverse driver 601 can move on the first traverse rail 602. The first longitudinal rail 604 is fixed to the first transverse driver 601. The first longitudinal driver 603 is mounted on a first longitudinal rail 604, which is similar in structure to the first transverse driver 601 and the first transverse rail 602, i.e. the first longitudinal driver 603 is movable along the first longitudinal rail 604. The macro inspection platform 605 is fixed to the first longitudinal drive 603. The upper surface of the macro inspection stage 605 is a macro station 6051. Referring to fig. 9, the macro inspection stage 605 is provided with a plurality of first vacuum holes 6052 leading to a macro station 6051. The macro inspection platform 605 also defines a plurality of first vertical holes 6053, for example three. The upper end of each first vertical hole 6053 is flush with the macro station 6051. The plurality of first elevating posts 606 are disposed one by one in the plurality of first vertical holes 6053. The first plurality of lifting columns 606 can be driven to rise flush above the macro station 6051 and can also be driven to sink into the first vertical bore 6053. the multi-angle line light source 607, the reflecting mirror 608, and the first distance adjusting mechanism 610 are all fixed to the chassis 1. The line glance mechanism 609 is mounted on the first distance adjustment mechanism 610. The line scan vision mechanism 609 has a large field of view line scan camera. The line segment light from the multi-angle line source 607 coincides with the same line segment on the surface of the wafer 8 at the macro station 6051. The mirror 608 is arranged to reflect line light reflected from the surface of the wafer 8 towards the line scanning vision mechanism 609. For example: in the horizontal direction, the angle between the mirror 608 and the line glance mechanism 609 is 45 °; in the vertical direction, the angle between the mirror 608 and the wafer 8 on the carrier plate 3 is 45 °, so that the line light reflected from the surface of the wafer 8 is reflected by the mirror 608 to be directed to the line scanning vision mechanism 609, and is received and processed. The first distance adjusting mechanism 610 is configured to adjust the distance from the line scanning vision mechanism 609 to the mirror 608, for example, the first distance adjusting mechanism 610 may be a screw motor in a horizontal direction, and the line scanning vision mechanism 609 is driven to move in a straight line by a screw rotation mechanism.
Based on the macro inspection module 6 with the structure, the plane coordinates of the macro inspection platform 605 can be accurately adjusted to accurately adjust the position of the wafer 8, so as to generate an accurate flaw coordinate graph of the wafer 8. The plurality of first lifting columns 606 can be lifted onto the macroscopic inspection platform 605 to be used for bearing the carrier disc 3 on the manipulator 4, and after the manipulator 4 is withdrawn, the plurality of first lifting columns 606 are lowered under the macroscopic inspection platform 605, so that the carrier disc 3 is lowered onto the macroscopic inspection platform 605, and the plurality of first vacuum holes 6052 of the macroscopic inspection platform 605 suck vacuum to suck the carrier disc 3, thereby fixing the wafer 8, and facilitating the inspection and positioning of flaws of the wafer 8. The first distance adjusting mechanism 610 may adjust the distance from the line scanning mechanism 609 to the reflector 608, so that the multi-angle line light source 607 and the line scanning mechanism 609 focus on the same straight line segment, the multi-angle light source forms an obvious imaging form for various flaws on the surface of the wafer 8, and the line scanning mechanism 609 scans the surface of the wafer 8 comprehensively. After the scanning is finished, the system performs image analysis processing, automatically identifies the flaw, records the flaw position, forms a coordinate graph, transmits the coordinate graph to a microscopic inspection machine, and switches the microscopic inspection machine to a high-power microscopic mode to perform fine photographing and repeated judgment on the flaw position.
Referring to fig. 10 and 11, an alternative configuration of the microscopic examination module 7 is that the microscopic examination module 7 includes a second lateral driver 701, a second lateral rail 702, a second longitudinal driver 703, a second longitudinal rail 704, a microscopic examination platform 705, a plurality of second elevating posts 706, a focusing sensor 707, a microscopic examination lens set 708, and a second distance adjustment mechanism 709. The structures of the second lateral driver 701, the second lateral track 702, the second longitudinal driver 703, and the second longitudinal track 704 may be similar to those of the first lateral driver 601, the first lateral track 602, the first longitudinal driver 603, and the first longitudinal track 604. The second transverse rail 702 is mounted on the frame 1, for example, the microscopic examination module 7 further includes a marble Dan Ji, and the second transverse rail 702 is mounted on a marble base. The second lateral drive 701 is mounted on a second lateral track 702. The second longitudinal rail 704 is fixed to the second transverse driver 701. The second longitudinal drive 703 is mounted on a second longitudinal rail 704. The microscopic examination table 705 is fixed to the second longitudinal driver 703. The upper surface of the microscopic examination table 705 is a microscopic station 7051. Referring to fig. 12, a microscopic examination platform 705 is provided with a plurality of second vacuum holes 7052 leading to a microscopic station 7051. The microscopic examination platform 705 is also provided with a plurality of second vertical holes 7053. The upper end of each second vertical bore 7053 is flush with the micro station 7051. The plurality of second elevating posts 706 are disposed one by one among the plurality of second vertical holes 7053. The second plurality of lifting columns 706 can be driven to rise flush above the micro-stage 7051 and can also be driven to sink into the second vertical aperture 7053. The focus sensor 707 is fixed to the microscopic examination mirror group 708. The microscopy set 708 is mounted on a second distance adjustment mechanism 709. The microscopy set 708 may comprise a microscope having 5x, 10x, 20x, and 50x switchable magnification. The second distance adjustment mechanism 709 is mounted on the frame 1. The second distance adjustment mechanism 709 is configured to adjust the distance of the focus sensor 707 to the microscopic station 7051, and the second distance adjustment mechanism 709 may be a vertical lead screw motor set.
Based on the microscopic inspection module 7 with the structure, the horizontal plane position of the microscopic inspection platform 705 can be accurately adjusted, so that the position of the wafer 8 on the platform can be accurately adjusted to position the defect of the wafer 8. The second lifting columns 706 can be lifted onto the micro-inspection platform 705 to receive the carrier tray 3 on the manipulator 4, then the manipulator 4 descends and exits the micro-inspection platform 705, the second lifting columns 706 descend to enable the carrier tray 3 to fall onto the micro-inspection platform 705, and the second vacuum holes 7052 of the micro-inspection platform 705 can suck the carrier tray 3 to enable the position of the carrier tray 3 to be fixed. According to the flaw coordinate graph transmitted by the macro inspection module 6, the position of the microscopic inspection lens set 708 is adjusted to align flaws one by one, the height of the focusing sensor 707 is adjusted to clearly focus the flaws, and microscopic high-power inspection and restoration judgment are carried out on the position through the microscopic inspection lens set 708.
One method of inspecting the wafer 8 using the fully automated wafer surface inspection machine described above includes:
(1) The manipulator 4 stretches into the material box 2, the manipulator 4 lifts the carrying disc 3, and the wafers 8 are placed in the carrying disc 3. The robot 4 moves the carrier tray 3 out of the magazine 2 and places the carrier tray 3 on the macro station 6051.
(2) After the macro inspection module 6 scans the front surface of the wafer 8, the front surface flaws of the wafer 8 are automatically identified through image analysis processing, and flaw positions are recorded to form a front surface coordinate graph and transmitted to the micro inspection module 7.
(3) If the macro inspection module 6 inspects the wafer 8 for defects, the robot 4 rotates the transfer plate 3 to the micro station 7051. The microscopic detection module 7 locates defects one by one according to the front coordinate graph, and performs fine photographing and repeated judgment on the positions of the front flaws.
(4) After the front surface is judged again, for the products needing to check the back surface of the wafer 8 or check the lamination condition of the carrier disc 3 and the back surface of the wafer 8, the mechanical arm 4 transfers the carrier disc 3 to the first clamping piece 5112, the first telescopic device 5111 and the second telescopic device 5121 drive the first clamping piece 5112 and the second clamping piece 5122 to be close to each other and tighten the carrier disc 3, and the turner 52 drives the first clamping piece 5112 and the second clamping piece 5122 to turn over, so that the back surface of the carrier disc 3 faces upwards. The first and second retractors 5111 and 5121 drive the first and second clips 5112 and 5122 away from each other.
(5) The carrying disc 3 in the clamping mechanism 51 is lifted by the manipulator 4 to be transferred to the macroscopic station 6051, and after the macroscopic inspection module 6 scans the back surface of the wafer 8, the defect on the back surface of the wafer 8 and/or the abnormality of the transparent back adhesive film 302 attached to the wafer 8 are automatically identified through image analysis processing, and the defect and/or the abnormal position is recorded, so that a back coordinate graph is formed and transferred to the microscopic inspection module 7. And the microscopic detection module 7 locates the defect and/or abnormal position one by one according to the back coordinate graph, and performs fine photographing and repeated judgment on the defect and/or abnormal position.
(6) After the back surface is judged again, the manipulator 4 transfers the carrier plate 3 into the material box 2.
In the step (3), if the macro inspection module 6 inspects that the wafer 8 has no defect, the front fine photographing and re-judgment in the step (3) can be omitted, and the wafer 8 can be directly subjected to the next action, for example, the step (4) of turning over and then inspecting, or the step (6) of returning to the material box 2.
In the step (4), if the front surface is determined again, the back surface of the wafer 8 or the adhesion condition of the carrier 3 and the back surface of the wafer 8 does not need to be checked, the overturning step in the step (4) can be skipped, and the carrier 3 can be directly transferred back into the magazine 2 in the step (6).
The method for inspecting the wafer 8 can realize the inspection of the front surface of the wafer 8 and the requirement of the inspection of the back surface of the wafer 8, and can macroscopically position the flaw position of the wafer 8 during the inspection, and then perform high-power microscopic repeated judgment on the positioned flaw, thereby improving the accuracy of flaw detection.
Based on the above-mentioned fully automatic wafer surface inspection machine, in the method for inspecting the wafer 8, the specific actions of picking, placing and transferring the wafer 8 may be as follows:
(1) During the transfer of the carrier plate 3 to the macro station 6051 by the robot 4: the mechanical arm 4 firstly takes out the carrier plate 3 in the discharging box 2, the plurality of first lifting columns 606 ascend to the macroscopic station 6051, the mechanical arm 4 places the carrier plate 3 on the plurality of first lifting columns 606, then the plurality of first lifting columns 606 descend to be buried in the plurality of first vertical holes 6053, the carrier plate 3 falls on the macroscopic station 6051, and the macroscopic inspection platform 605 starts vacuum to suck the carrier plate 3. The macro inspection module 6 performs macro inspection on the wafer 8, including automatically identifying defects on the front surface of the wafer 8, recording the positions of the defects, forming a front coordinate graph, and transmitting the front coordinate graph to the micro inspection module 7.
(2) After the macro inspection, the macro inspection stage 605 turns off the vacuum, and the plurality of first lifting columns 606 are lifted up to lift the carrier tray 3, and the robot 4 extends under the carrier tray 3 and lifts the carrier tray 3 off the plurality of first lifting columns 606.
(3) A plurality of second lifting columns 706 rise above the micro station 7051. The manipulator 4 places the macroscopic inspection-post-carrier tray 3 on the plurality of second lifting columns 706, and then the plurality of second lifting columns 706 descend to be buried in the plurality of second vertical holes 7053, so that the carrier tray 3 falls on the microscopic work station 7051, and the microscopic inspection platform 705 opens vacuum to suck the carrier tray 3. The microscopic inspection module 7 locates defects one by one according to the front coordinate graph, and performs fine photographing and repeated judgment on the defect positions.
(4) After the re-determination, the microscopic examination platform 705 turns off the vacuum, and the plurality of second elevating posts 706 ascend to raise the carrier tray 3. The robot 4 extends below the carrier platter 3 and lifts the carrier platter 3 off the plurality of second lifting columns 706.
The above inspection method can conveniently take, put and transfer the wafer 8, and improve the inspection efficiency.
The full-automatic wafer surface inspection machine is used for macroscopic and microscopic inspection of the wafer surface, a worker or a crown block loads a material box, a manipulator takes and places the wafer, automatic microscopic repeated judgment is carried out according to map coordinates after macroscopic inspection, and finally the manipulator places the wafer back to the material box.
Wherein, macroscopic examination and microscopic repeated judgment specifically comprise: the large-view line scanning camera comprehensively scans the surface of a product, the multi-angle line light source and the line scanning camera focus on the same straight line, and the multi-angle line light source forms obvious imaging forms for different flaws on the surface of various products. After the surface scanning of the product is finished, the flaws are automatically identified through image analysis processing, flaw positions are recorded, a map coordinate graph is formed and transmitted to a microscopic inspection machine, the microscopic inspection machine automatically positions each coordinate according to the map coordinate graph of the flaws after the macroscopic inspection of the previous step, the microscopic inspection machine is switched to a high-magnification microscopic mode, the multiplying power is generally 5x, 10x, 20x and 50x and microscopic high-magnification inspection repeated judgment is carried out on the flaw positions.
The inspection machine realizes full-automatic feeding and discharging and inspection, is efficient and stable, does not need personnel to intervene for inspection basically, and is applicable to the inspection range of products including 8 inch/12 inch wafer inspection, BG film (protective film) attaching quality inspection, back film attaching quality inspection, blue film (which can be attached to the periphery side of a wafer) attaching and iron ring quality inspection, wafer front quality inspection and wafer back quality inspection.
The above embodiments are merely examples of the present application, and the protection scope of the present application is not limited to the above embodiments, and it should be obvious to those skilled in the art that several modifications and variations are possible without departing from the inventive concept.
Claims (10)
1. The full-automatic wafer surface inspection machine is characterized by comprising a frame (1), and a material box (2), a carrying disc (3), a manipulator (4), a turnover module (5), a macroscopic inspection module (6) and a microscopic inspection module (7) which are arranged on the frame (1);
The carrier plate (3) is configured for carrying a wafer (8); the magazine (2) is provided with a storage station (201) for loading the carrier disc (3); the turnover module (5) is provided with a clamping mechanism (51) and a turnover device (52); the turner (52) is arranged on the frame (1); the output end of the turner (52) is connected with the clamping mechanism (51); -said clamping mechanism (51) being configured to clamp said carrier disc (3); the macroscopic inspection module (6) is provided with a macroscopic station (6051) for bearing the carrier disc (3); the microscopic detection module (7) is provided with a microscopic station (7051) for bearing the carrier disc (3);
The robot (4) is configured to carry the carrier tray (3) and transfer the carrier tray (3) between the storage station (201), the clamping mechanism (51), the macro station (6051) and the micro station (7051).
2. The fully automatic wafer surface inspection machine according to claim 1, wherein the carrier tray (3) comprises a frame (301) and a transparent back adhesive film (302); the periphery of the transparent back adhesive film (302) is fixed on the frame (301); the frame (301) can accommodate a wafer (8) to be inspected; the transparent back adhesive film (302) is configured to adhere to and fix the wafer (8).
3. The fully automatic wafer surface inspection machine of claim 2, wherein the robot (4) comprises a horizontal axial drive (401), a horizontal axial rail (402), a lifter (403), a first horizontal rotator (404), and a first telescoping arm (405); the first telescopic arm (405) comprises a first transverse arm (4051), a second horizontal rotator (4052), a second transverse arm (4053), a third horizontal rotator (4054), a third transverse arm (4055) and a lifting piece (4056); the horizontal axial driver (401) and the horizontal axial rail (402) are mutually parallel and are arranged on the frame (1); the output end of the horizontal axial driver (401) is connected with the lifter (403), and the lifter (403) is slidably mounted on the horizontal axial track (402); the first horizontal rotator (404) is arranged on the output end of the lifter (403), and the output end of the first horizontal rotator (404) is connected with one end of the first cross arm (4051); the second horizontal rotator (4052) is arranged at the other end of the first cross arm (4051), and the output end of the second horizontal rotator (4052) is connected with one end of the second cross arm (4053); the third horizontal rotator (4054) is arranged at the other end of the second cross arm (4053), and the output end of the third horizontal rotator (4054) is connected with one end of the third cross arm (4055); the lifting piece (4056) is fixed at the other end of the third cross arm (4055), and the lifting piece (4056) is configured to lift the carrier disc (3).
4. A fully automated wafer surface inspection machine according to claim 3, wherein the robot (4) further comprises a second telescopic arm (406); the second telescopic arm (406) is connected to the output of the first horizontal rotator (404).
5. The fully automatic wafer surface inspection machine according to claim 3 or 4, characterized in that the macro inspection module (6) and the micro inspection module (7) are arranged adjacently; the macro station (6051) and the micro station (7051) are both circular; the horizontal axial track (402) is parallel to a line connecting the center of the macro station (6051) and the center of the micro station (7051).
6. The fully automatic wafer surface inspection machine according to claim 2, wherein the turn-up module (5) further comprises a mounting seat (53); the output end of the turner (52) is connected with the mounting seat (53);
The clamping mechanism (51) comprises a first clamping arm (511) and a second clamping arm (512); the first clamping arm (511) comprises a first telescopic device (5111) and a first clamping piece (5112); the second clamping arm (512) comprises a second telescopic device (5121) and a second clamping piece (5122); the first telescopic device (5111) and the second telescopic device (5121) are installed on the installation seat (53); the output end of the first telescopic device (5111) and the output end of the second telescopic device (5121) are arranged oppositely, and the output end of the first telescopic device (5111) and the output end of the second telescopic device (5121) are parallel to each other or on the same axis; the first clamping piece (5112) is vertically connected to the output end of the first telescopic device (5111); the second clamping piece (5122) is vertically connected to the output end of the second telescopic device (5121); the first telescopic device (5111) and the second telescopic device (5121) can drive the first clamping piece (5112) and the second clamping piece (5122) to be close to each other or far away from each other.
7. The fully automatic wafer surface inspection machine of claim 1, wherein the macro inspection module (6) comprises a first lateral driver (601), a first lateral rail (602), a first longitudinal driver (603), a first longitudinal rail (604), a macro inspection stage (605), a plurality of first lifting columns (606), a multi-angle line light source (607), a mirror (608), a line sweep mechanism (609), and a first distance adjustment mechanism (610);
The first transverse rail (602) is mounted on the frame (1); -the first transversal drive (601) is mounted on the first transversal track (602); -the first longitudinal rail (604) is fixed on the first transverse drive (601); -the first longitudinal drive (603) is mounted on the first longitudinal rail (604); -the macro inspection platform (605) is fixed on the first longitudinal drive (603); the upper surface of the macroscopic inspection platform (605) is the macroscopic station (6051); the macroscopic inspection platform (605) is provided with a plurality of first vacuum holes (6052) leading to the macroscopic station (6051); the macroscopic inspection platform (605) is also provided with a plurality of first vertical holes (6053); the upper end of each first vertical hole (6053) is flush with the macro station (6051); the first lifting columns (606) are arranged in the first vertical holes (6053) one by one; the plurality of first lifting columns (606) can be driven to rise flush above the macroscopic station (6051) and can also be driven to sink into the first vertical holes (6053); the multi-angle linear light source (607), the reflecting mirror (608) and the first distance adjusting mechanism (610) are all fixed on the frame (1); -the line glance vision mechanism (609) is mounted on the first distance adjustment mechanism (610); the line segment light emitted by the multi-angle line light source (607) is overlapped on the same line segment of the surface of the wafer (8) on the macroscopic station (6051); the mirror (608) is arranged to reflect line light reflected from the surface of the wafer (8) towards the line scanning vision mechanism (609); the first distance adjustment mechanism (610) is configured to adjust a distance of the line glance mechanism (609) to the mirror (608).
8. The fully automated wafer surface inspection machine of claim 7, wherein the microscopic inspection module (7) comprises a second lateral driver (701), a second lateral rail (702), a second longitudinal driver (703), a second longitudinal rail (704), a microscopic inspection stage (705), a plurality of second lifting columns (706), a focus sensor (707), a microscopic inspection set (708), and a second distance adjustment mechanism (709);
the second transverse rail (702) is mounted on the frame (1); -said second transversal drive (701) is mounted on said second transversal track (702); -said second longitudinal rail (704) is fixed on said second transversal drive (701); -said second longitudinal drive (703) is mounted on said second longitudinal rail (704); -said microscopic examination table (705) is fixed on said second longitudinal drive (703); the upper surface of the microscopic examination platform (705) is the microscopic station (7051); the microscopic examination platform (705) is provided with a plurality of second vacuum holes (7052) leading to the microscopic stations (7051); the microscopic examination platform (705) is also provided with a plurality of second vertical holes (7053); the upper end of each second vertical hole (7053) is flush with the micro station (7051); the second lifting columns (706) are arranged in the second vertical holes (7053) one by one; the plurality of second lifting columns (706) can be driven to rise flush above the micro station (7051) and can also be driven to sink into the second vertical holes (7053); the focusing sensor (707) is fixed on the microscopic examination lens group (708); the microscopy set (708) is mounted on the second distance adjustment mechanism (709); the second distance adjusting mechanism (709) is arranged on the frame (1); the second distance adjustment mechanism (709) is configured to adjust a distance of the focus sensor (707) to the micro-station (7051).
9. A wafer inspection method characterized in that a fully automatic wafer surface inspection machine according to claim 6 is used for inspecting wafers (8); the wafer inspection method comprises the following steps:
The manipulator (4) stretches into the material box (2), the manipulator (4) lifts the carrying disc (3), and wafers (8) are placed in the carrying disc (3); the manipulator (4) moves the carrier disc (3) out of the magazine (2) and places the carrier disc (3) on the macro station (6051);
after the macro inspection module (6) scans the front surface of the wafer (8), automatically identifying the front surface flaws of the wafer (8) through image analysis processing, recording flaw positions, forming a front surface coordinate graph and transmitting the front surface coordinate graph to the micro inspection module (7);
If the macro inspection module (6) inspects that the wafer (8) is defective, the manipulator (4) transfers the carrier disc (3) to the micro station (7051); the microscopic detection module (7) locates defects one by one according to the front coordinate graph, and performs fine photographing and repeated judgment on the defect positions;
after the judgment, the manipulator (4) transfers the carrying disc (3) to the first clamping piece (5112), the first telescopic device (5111) and the second telescopic device (5121) drive the first clamping piece (5112) and the second clamping piece (5122) to be close to each other and fasten the carrying disc (3), and the turner (52) drives the first clamping piece (5112) and the second clamping piece (5122) to turn over so that the back surface of the carrying disc (3) faces upwards; the first telescopic device (5111) and the second telescopic device (5121) drive the first clamping piece (5112) and the second clamping piece (5122) to be far away from each other;
The manipulator (4) lifts a carrying disc (3) in the clamping mechanism (51) to be transferred to the macroscopic station (6051), and after the macroscopic inspection module (6) scans the back surface of the wafer (8), the wafer (8) is automatically identified by image analysis processing, defects on the back surface and/or the abnormal positions of the transparent back adhesive film (302) attached to the wafer (8) are recorded, and a back coordinate graph is formed and transferred to the microscopic inspection module (7); the microscopic detection module (7) is used for positioning the defect and/or the abnormal position one by one according to the back coordinate graph, and carrying out fine photographing and repeated judgment on the defect and/or the abnormal position; after the rechecking, the manipulator (4) transfers the carrying disc (3) into the material box (2).
10. A wafer inspection method characterized in that a fully automatic wafer surface inspection machine according to claim 8 is used for inspecting wafers (8); the wafer inspection method comprises the following steps:
During the transfer of the carrier plate (3) to the macro station (6051) by the manipulator (4): the manipulator (4) firstly takes out the carrying disc (3) in the material box (2); -the plurality of first lifting columns (606) rises above the macro station (6051); the mechanical arm (4) places the carrying disc (3) on the first lifting columns (606), then the first lifting columns (606) descend to be submerged into the first vertical holes (6053), so that the carrying disc (3) falls on the macroscopic station (6051), and the macroscopic inspection platform (605) opens vacuum to suck the carrying disc (3); the macro inspection module (6) performs macro inspection on the wafer (8), and comprises the steps of automatically identifying the front flaws of the wafer (8), recording the positions of the flaws, forming a front coordinate graph and transmitting the front coordinate graph to the micro inspection module (7);
After macroscopic inspection, the macroscopic inspection platform (605) turns off vacuum, the first lifting columns (606) are lifted to lift the carrying disc (3), and the mechanical arm (4) stretches into the lower part of the carrying disc (3) and lifts the carrying disc (3) away from the first lifting columns (606);
The plurality of second lifting columns (706) rise above the micro-station (7051); the manipulator (4) places the carrying disc (3) on the plurality of second lifting columns (706) after macroscopic inspection, then the plurality of second lifting columns (706) descend to be submerged in the plurality of second vertical holes (7053), so that the carrying disc (3) falls on the microscopic station (7051), and the microscopic inspection platform (705) opens vacuum to suck the carrying disc (3); the microscopic detection module (7) locates defects one by one according to the front coordinate graph, and performs fine photographing and repeated judgment on the defect positions;
After the rechecking, the microscopic examination platform (705) turns off the vacuum, and the second lifting columns (706) lift the carrying disc (3); the manipulator (4) stretches into the lower part of the carrying disc (3) and lifts the carrying disc (3) away from the plurality of second lifting columns (706).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN202411018420.2A CN118549460B (en) | 2024-07-29 | Full-automatic wafer surface inspection machine and wafer inspection method |
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| CN115958706A (en) * | 2021-10-12 | 2023-04-14 | 株式会社迪思科 | Processing device |
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