CN118549335B - Welding wire quality inspection device, welding wire quality inspection system and welding wire quality inspection method - Google Patents

Abstract

The application relates to the field of production equipment, discloses a welding wire quality inspection device, a welding wire quality inspection system and a welding wire quality inspection method, comprising the following steps: a base; the transmission module comprises an assembling part and a connecting part which are arranged on different sides, wherein the assembling part is used for being connected and matched with the thread-picking workpiece, and the transmission module is movably connected with the base through the connecting part; the driving module comprises a main-stage driving assembly connected to the base and a secondary driving assembly connected to the transmission module, wherein the main-stage driving assembly drives the secondary driving assembly to move towards a first direction based on the input first driving current, so that the secondary driving assembly and the transmission module drive the thread-picking workpiece to apply force to the target welding wire, and the force application of the thread-picking workpiece to the target welding wire is matched with the current intensity of the first driving current. The application utilizes the host driving component to drive the secondary driving component to accurately control the force applied to the target welding wire, ensures reliable welding quality detection result of the target welding wire, intuitively reflects the firm degree of the welding wire and has lower cost.

Description

Welding wire quality inspection device, welding wire quality inspection system and welding wire quality inspection method

Technical Field

The application relates to the field of production instruments, in particular to a welding wire quality inspection device, a welding wire quality inspection system and a welding wire quality inspection method.

Background

In handling and packaging semiconductor devices, wire bonding has been the primary method of providing electrical connection between two locations within the package (e.g., between pads of a circuit board, between a leadframe and a leadframe, or between a pad and a leadframe). More specifically, wire bonding machines or other tooling are currently used in the industry to perform large batches of wire bonds to provide wire loops between two locations within the package that are to be electrically connected to one another.

However, the package product produced by the wire bonding machine needs to be checked for the firmness of the bonding wires to ensure the quality of the product, especially for the package product produced by the wire bonding machine for mass welding.

At present, some welding wire quality inspection schemes adopt machine vision to detect the quality of welding wires on a circuit board, but the cost of the schemes is high, and whether welding of wire arcs on the circuit board is firm or not is difficult to intuitively and accurately detect.

Therefore, providing a welding wire quality inspection scheme with low cost, reliable detection result and visual indication of the firmness of the welding wire is a problem to be solved by the person skilled in the art.

Disclosure of Invention

The embodiment of the application provides a welding wire quality inspection device, a welding wire quality inspection system and a welding wire quality inspection method, which aim to accurately control the force applied to a target welding wire, ensure the reliability of the welding quality inspection result of the target welding wire, intuitively embody the firmness degree of the welding wire and reduce the cost of welding wire quality inspection and inspection.

In a first aspect, an embodiment of the present application provides a quality inspection device for a bonding wire, including:

a base for providing mounting support;

The transmission module comprises a connecting part and an assembling part which is arranged on the side different from the connecting part, the transmission module is movably connected with the base through the connecting part, and the assembling part is configured to be connected and matched with the thread-picking workpiece;

The driving module comprises a main-stage driving assembly connected to the base and a secondary driving assembly connected to the transmission module and adapted to the main-stage driving assembly, and the main-stage driving assembly is at least used for driving the secondary driving assembly to move in a first direction based on a first driving current input into the main-stage driving assembly so as to drive a wire picking workpiece connected to the assembly part to apply force to a target bonding wire welded to the circuit board through the secondary driving assembly and the transmission module;

the first direction is the direction that the target bonding wire is far away from the circuit board, and the force applied by the thread picking tool to the target bonding wire is matched with the current intensity of the first driving current input to the main-stage driving assembly.

In some embodiments, the primary driving assembly comprises a first coil unit and a second coil unit which are arranged at intervals and connected with the base, the first coil unit and the second coil unit form a containing groove at intervals, and the secondary driving assembly comprises a magnet unit connected with the transmission module and matched with the containing groove;

The first coil unit and the second coil unit are used for receiving a first driving current and generating a target coil magnetic field under the excitation of the first driving current, so that the magnet unit accommodated in the accommodating groove moves towards a first direction under the action of the target coil magnetic field, and the thread-picking workpiece is driven to move towards the first direction through the transmission module.

In some embodiments, the first coil unit and the second coil unit are both wound around a second direction perpendicular to the first direction, and the S-pole and the N-pole of the magnet unit are arranged along a third direction perpendicular to the first direction and forming an angle with the second direction.

In some embodiments, the base comprises a base part for providing connection support, and a first winding support part and a second winding support part which are connected with the base part and are arranged on two opposite sides of the connection part, wherein the first winding unit is wound on the first winding support part, and the second winding unit is wound on the second winding support part;

the first winding supporting part and the second winding supporting part are iron cores or insulating pieces.

In some embodiments, the connection portion forms a limit groove extending along the first direction on at least one of a side near the first winding support portion and a side near the second winding support portion, and the connection portion is used for forming a guiding fit with the base through the limit groove;

the magnet unit is arranged at the connecting part corresponding to the first winding supporting part and the second winding supporting part, and at least part of the magnet unit is exposed out of the limiting groove.

In some embodiments, the primary drive assembly is further configured to drive the secondary drive assembly to move in a direction opposite the first direction based on an input second drive current, the second drive current having a current direction opposite the first drive current.

In some embodiments, the drive module further includes a guide portion disposed between the mounting portion and the connecting portion, the guide portion forming at least one guide slot extending in the first direction, the guide slot configured to cooperate with an external guide workpiece to guide a direction of movement of the drive module.

In some embodiments, the assembly portion includes at least a first assembly front end and a second assembly front end connected to the guide portion and extending in a direction away from the guide portion, and the first assembly front end and the second assembly front end are disposed apart to form an assembly opening for receiving the thread take-up workpiece.

In some embodiments, at least one of the first fitting front end and the second fitting front end forms a fitting hole for connection fitting with the thread take-up workpiece;

And/or the first assembling front end and the second assembling front end are used for clamping the thread-picking workpiece through the assembling opening in a matched mode.

In a second aspect, an embodiment of the present application further provides a bonding wire quality inspection system, including:

the welding wire quality inspection device provided by any embodiment of the application;

a collection device;

The accommodating platform is used for accommodating a circuit board to be inspected and fixing the circuit board, and a target welding wire is welded on the circuit board;

And the controller is electrically connected with the welding wire quality inspection device and the acquisition device and is used for:

when the circuit board is fixed on the accommodating platform, the wire quality inspection device is controlled to drive the wire picking workpiece to apply force to the target wire based on the first driving current input into the wire quality inspection device;

The control acquisition device acquires the connection state of the target bonding wire, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire and the circuit board is separated, and the second state represents that the connection of the target bonding wire and the circuit board is not separated;

And determining the force application size of the thread take-up workpiece to the target welding wire according to the current intensity of the first driving current, and outputting the welding wire quality inspection information corresponding to the target welding wire based on the force application size and the connection state.

In a third aspect, an embodiment of the present application further provides a quality inspection method for a bonding wire, which is applied to a quality inspection device for a bonding wire provided in any embodiment of the present application or a quality inspection system for a bonding wire provided in any embodiment of the present application, where the method includes:

When the circuit board is fixed on a preset accommodating platform, the wire quality inspection device is controlled to drive the wire picking workpiece to apply force to the target wire welded on the circuit board;

Acquiring a connection state of the target bonding wire, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire and the circuit board is separated, and the second state represents that the connection of the target bonding wire and the circuit board is not separated;

And determining the force application size of the thread take-up workpiece to the target welding wire according to the current intensity of the first driving current, and outputting the welding wire quality inspection information corresponding to the target welding wire based on the force application size and the connection state.

In summary, an embodiment of the present application provides a bonding wire quality inspection device, a bonding wire quality inspection system, and a bonding wire quality inspection method, where the bonding wire quality inspection device includes: a base for providing mounting support; the transmission module comprises a connecting part and an assembling part which is arranged on the side different from the connecting part, the transmission module is movably connected with the base through the connecting part, and the assembling part is configured to be connected and matched with the thread-picking workpiece; the driving module comprises a main-stage driving assembly connected to the base and a secondary driving assembly connected to the transmission module and adapted to the main-stage driving assembly, and the main-stage driving assembly is at least used for driving the secondary driving assembly to move in a first direction based on a first driving current input into the main-stage driving assembly so as to drive a wire picking workpiece connected to the assembly part to apply force to a target bonding wire welded to the circuit board through the secondary driving assembly and the transmission module; the first direction is the direction that the target bonding wire is far away from the circuit board, and the force applied by the thread picking tool to the target bonding wire is matched with the current intensity of the first driving current input to the main-stage driving assembly. According to the welding wire quality inspection device, the welding wire quality inspection system and the welding wire quality inspection method provided by the embodiment of the application, the current intensity of the first driving current is converted into the force applied by the thread picking workpiece to the target welding wire by utilizing the driving of the secondary driving component by the host driving component in the driving module, so that the force applied to the target welding wire can be accurately controlled, the welding quality inspection result of the target welding wire is ensured to be reliable, the welding wire firmness degree is intuitively reflected, and compared with a scheme of machine vision, the scheme realizes lower cost of welding wire quality inspection.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a block diagram of an embodiment of a welding wire quality inspection apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of an implementation of a quality inspection device for bonding wires according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a base and a main driving assembly in a welding wire quality inspection device according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a transmission module and a secondary driving assembly in a welding wire quality inspection device according to an embodiment of the present application;

fig. 5 is a schematic view of a scenario of performing quality inspection on a bonding wire by using the bonding wire quality inspection device according to an embodiment of the present application;

fig. 6 is a schematic layout diagram of a first coil unit, a second coil unit and a magnet unit in a welding wire quality inspection device according to an embodiment of the present application;

Fig. 7 is a block diagram illustrating an implementation of a bonding wire quality inspection system according to an embodiment of the present application;

Fig. 8 is a schematic flowchart of a method for inspecting quality of bonding wires according to an embodiment of the present application;

reference numerals:

100. a welding wire quality inspection device; 10. a base; 11. a first winding support; 12. a second winding support; 13. a base portion; 20. a transmission module; 21. a connection part; 211. a limit groove; 22. an assembling portion; 221. a first assembly front; 222. a second assembly front; 223. a fitting opening; 224. a fitting hole; 23. a guide part; 231. a guide slot; 30. a driving module; 31. a primary drive assembly; 311. a first coil unit; 312. a second coil unit; 313. a receiving groove; 32. a secondary drive assembly; 321. a magnet unit; 200. a collection device; 300. a receiving platform; 400. a controller; 500. a weld line quality inspection system; 600. picking up the thread workpiece; 700. a circuit board; 800. a target bonding wire; d1, a first direction; d2, a second direction; d3, third direction.

Detailed Description

The technical solutions of the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. Based on the embodiments of the present application, other embodiments that may be obtained by those of ordinary skill in the art without making any inventive effort are within the scope of the present application. The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.

Referring to fig. 1 to 5, fig. 1 is a block diagram of an implementation of a quality inspection apparatus 100 for bonding wires according to an embodiment of the present application, fig. 2 is a schematic structural diagram of an implementation of a quality inspection apparatus 100 for bonding wires according to an embodiment of the present application, fig. 3 is a schematic structural diagram of a base 10 and a primary driving component 31 in a quality inspection apparatus 100 for bonding wires according to an embodiment of the present application, fig. 4 is a schematic structural diagram of a transmission module 20 and a secondary driving component 32 in a quality inspection apparatus 100 for bonding wires according to an embodiment of the present application, and fig. 5 is a schematic view of a scene of quality inspection apparatus 100 for bonding wires according to an embodiment of the present application.

As shown in fig. 1 to 5, an embodiment of the present application provides a bonding wire quality inspection device 100, which includes: the base 10, the transmission module 20 and the driving module 30, and the driving module 30 may be used for assembling the wire picking tool 600 for carrying out the pulling force in the direction away from the circuit board 700 on the target bonding wire 800 welded on the circuit board 700, so as to determine whether the bonding of the bonding wire is firm according to whether the connection between the target bonding wire 800 and the circuit board 700 is separated, thereby detecting the bonding quality of the target bonding wire 800.

The structure and function of each portion of wire quality control apparatus 100 are described in detail below.

Specifically, the base 10 is used for providing a mounting support, which can form a fixed connection with an external object to provide a fixed base point for the whole welding wire quality inspection device 100, or can directly place the base 10 at a preset position, and provide mechanical support for the driving module 20 and the driving module 30 by the base 10.

Specifically, the transmission module 20 includes a connection portion 21 and an assembly portion 22 disposed on a different side from the connection portion 21, the transmission module 20 is movably connected to the base 10 through the connection portion 21, and the assembly portion 22 is configured to be connected to and adapted to the thread take-up tool 600. It should be noted that, when the transmission module 20 moves relatively to the base 10 through the connection portion 21, the connection portion 21 and the assembly portion 22 are located at different sides of the transmission module 20, and the thread take-up workpiece 600 connected to the assembly portion 22 moves synchronously with the transmission module 20, so as to pull and apply force to the target bonding wire 800 welded on the circuit board 700 in a direction away from the circuit board 700.

Specifically, the driving module 30 includes a primary driving component 31 connected to the base 10 and a secondary driving component 32 connected to the transmission module 20 and adapted to the primary driving component 31, where the primary driving component 31 is at least configured to drive the secondary driving component 32 to move in a first direction D1 based on a first driving current input to the primary driving component 31, so as to drive the wire picking tool 600 connected to the assembly 22 through the secondary driving component 32 and the transmission module 20 to apply a force to the target bonding wire 800 connected to the circuit board 700, and the first direction D1 is a direction in which the target bonding wire 800 is far away from the circuit board 700.

For example, the primary driving component 31 is a linear motor coil, the secondary driving component 32 is a linear motor magnet, and the linear motor coil and the linear motor magnet form a linear motor (also referred to as a linear motor) to drive the thread take-up tool 600 connected to the assembly portion 22 to move through the linear motor driving transmission module 20. It should be appreciated that the linear motor is capable of providing a high acceleration and has a fast response time, thereby meeting the need to drive the wire bonding work piece 600 to move quickly and accurately and to control the amount of force applied to the target bonding wire 800 in the context of detecting the bonding quality of the target bonding wire 800.

Specifically, under the condition that the thread take-up workpiece 600 is connected and adapted to the assembly portion 22, when the first driving current is input to the main driving assembly 31, the main driving assembly 31 generates the target coil magnetic field due to the excitation of the first driving current, and the secondary driving assembly 32 moves in the first direction D1 by the electromagnetic force applied to the secondary driving assembly 32 by the target coil magnetic field, so that the thread take-up workpiece 600 connected to the assembly portion 22 is driven to move in the first direction D1 by the transmission module 20, thereby driving the thread take-up workpiece 600 to apply force to the target bonding wires 800 welded to the circuit board 700.

It should be noted that, the first direction D1 is specifically any direction away from the circuit board 700, for example, a direction perpendicular to the circuit board 700. Moreover, the magnitude of the electromagnetic force applied by the secondary driving assembly 32 is matched with the current intensity of the first driving current input to the primary driving assembly 31, and the magnitude of the force applied by the thread take-up tool 600 to the target bonding wire 800 is matched with the current intensity of the first driving current input to the primary driving assembly 31 due to the transmission action of the transmission module 20.

Further, based on the fact that the magnitude of the force applied by the wire picking workpiece 600 to the target bonding wire 800 matches the current intensity of the first driving current input to the main driving assembly 31, the current intensity of the first driving current may be set to adjust the magnitude of the force applied by the wire picking workpiece 600 to the target bonding wire 800, for example, the magnitude of the force applied by the wire picking workpiece 600 to the target bonding wire 800 may be calibrated: when the first driving current is a first current value, the magnitude of the force applied by the wire picking tool 600 to the target bonding wire 800 is a first force value, and when the second driving current is a second current value, the magnitude of the force applied by the wire picking tool 600 to the target bonding wire 800 is a second force value. For example, if the first driving current is 1A, the force applied by the wire picking tool 600 to the target bonding wire 800 is 1N.

After the wire picking tool 600 applies force to the target bonding wire 800 welded to the circuit board 700, a bonding wire quality inspection result of the target bonding wire 800 can be determined based on the connection state of the target bonding wire 800 and the first driving current, wherein the connection state of the target bonding wire 800 at least includes a first state and a second state, the first state indicates that the connection of the target bonding wire 800 and the circuit board 700 is separated, and the second state indicates that the connection of the target bonding wire 800 and the circuit board 700 is not separated.

As can be readily seen, after the wire picking tool 600 applies force to the target bonding wire 800 welded to the circuit board 700, if the target bonding wire 800 is in the first state, the bonding wire quality inspection result can be obtained: under the current force applied by the thread-picking workpiece 600, the connection between the target bonding wire 800 and the circuit board 700 is poor; if the target bonding wire 800 is in the second state, the bonding wire quality inspection result may be obtained: the target bonding wire 800 is well connected to the circuit board 700 with the current amount of force applied by the wire bonding work 600.

Further, the energizing time of the first driving current is adjustable to adjust the time for the primary driving component 31 to form the target coil magnetic field and the time for the secondary driving component 32 to move in the target coil magnetic field, so as to limit the time and the amplitude of the movement of the wire-picking workpiece 600 in the first direction D1, and avoid the target bonding wire 800 from being separated from the circuit board 700 due to the excessive force applied by the wire-picking workpiece 600 to the target bonding wire 800 (which is different from the poor connection between the target bonding wire 800 and the circuit board 700 in the first state).

It should be noted that, in the case where the quality inspection device 100 inspects the quality of the target bonding wire 800, the wire picking tool 600 connected to and adapted to the quality inspection device 100 needs to be aligned with the target bonding wire 800 on the circuit board 700. Specifically, at least one of translation circuit board 700 and wire quality inspection device 100 performs the steps of: the positions of the wire picking tool 600 and the target bonding wire 800 are aligned with each other, then the wire picking tool 600 is inserted into the position between the circuit board 700 and the target bonding wire 800, and then the first driving current is enabled to be input into the main driving assembly 31 to drive the wire picking tool 600 to apply force to the target bonding wire 800 welded to the circuit board 700.

For example, the wire-picking work 600 is a needle work such that the needle of the needle work is accurately inserted into a position between the circuit board 700 and the target bonding wire 800.

According to the welding wire quality inspection device 100, the welding wire quality inspection system 500 and the welding wire quality inspection method provided by the embodiment of the application, the current intensity of the first driving current is converted into the force applied by the wire picking workpiece 600 to the target welding wire 800 by utilizing the driving of the secondary driving assembly 32 by the host driving assembly in the driving module 30, so that the force applied to the target welding wire 800 can be accurately controlled, and the welding quality inspection result of the target welding wire 800 is ensured to be reliable.

Compared with the existing methods for detecting the welding quality of the target welding wire 800 on the circuit board 700 by adopting machine vision, the method has the advantages that the cost can be effectively reduced by adopting the method without configuring a processor for image processing, and the welding wire is directly applied with force, so that whether the wire arc welding is firm or not can be intuitively reflected in the force application process.

As shown in fig. 1 to 5, in some embodiments, the primary driving assembly 31 includes a first coil unit 311 and a second coil unit 312 that are disposed at intervals and connected to the base 10, the first coil unit 311 and the second coil unit 312 form a receiving slot 313 at intervals, and the secondary driving assembly 32 includes a magnet unit 321 connected to the transmission module 20 and adapted to the receiving slot 313;

The first coil unit 311 and the second coil unit 312 are configured to receive a first driving current and generate a target coil magnetic field under excitation of the first driving current, so that the magnet unit 321 accommodated in the accommodating groove 313 moves in the first direction D1 under the action of the target coil magnetic field, and the transmission module 20 drives the thread take-up workpiece 600 to move in the first direction D1.

Specifically, when the first driving current is input to the main driving assembly 31, the first driving current flows to the first coil unit 311 and the second coil unit 312 at the same time, the first coil unit 311 generates a first sub-magnetic field under the excitation of the first driving current, the second coil unit 312 generates a second sub-magnetic field under the excitation of the second driving current, the first sub-magnetic field and the second sub-magnetic field form a target coil magnetic field, and the target coil magnetic field generates an electromagnetic force to the magnet unit 321, so that the magnet unit 321 moves in the first direction D1 under the electromagnetic force, and the picking-up work 600 is driven to move in the first direction D1 by the transmission module 20, wherein the target coil magnetic field is located between the first coil unit 311 and the second coil unit 312.

It should be appreciated that during the movement of the magnet unit 321 in the first direction D1, at least a portion of the magnet unit 321 is kept in the accommodating groove 313 between the first coil unit 311 and the second coil unit 312, so as to have an effect of limiting the movement amplitude of the magnet unit 321, the transmission module 20, and the thread take-up workpiece 600 in the first direction D1.

Further, the first coil unit 311 and the second coil unit 312 are separated from opposite sides of the magnet unit 321, and the inductances of the first coil unit 311 and the second coil unit 312 are the same (for example, the number of turns of the first coil unit 311 and the number of turns of the second coil unit 312 are the same), so that the first sub-magnetic field and the second sub-magnetic field can form uniformly distributed magnetic fields, so as to ensure that the magnet unit 321, the transmission module 20, and the thread take-up tool 600 smoothly move in the first direction D1.

The first coil unit 311 and the second coil unit 312 are linear motor coils, and the magnet unit 321 is a linear motor magnet, i.e. the first coil unit 311, the second coil unit 312, and the magnet unit 321 form a linear motor.

Referring to fig. 6, fig. 6 is a schematic diagram illustrating an arrangement of a first coil unit 311, a second coil unit 312 and a magnet unit 321 in a wire bonding quality inspection apparatus 100 according to an embodiment of the application.

As shown in fig. 6, in some embodiments, the first coil unit 311 and the second coil unit 312 are both wound around a second direction D2 perpendicular to the first direction D1, and the S-pole and the N-pole of the magnet unit 321 are arranged along a third direction D3 perpendicular to the first direction D1 and forming an included angle with the second direction D2.

Specifically, the second direction D2 and the third direction D3 form an included angle, and the coplanarity between the second direction D2 and the third direction D3 is perpendicular to the first direction D1, preferably, the second direction D2 is perpendicular to the third direction D3, that is, the first direction D1, the second direction D2 and the third direction D3 are perpendicular to each other.

Note that the magnet unit 321 may be a single magnet, and the S-pole and the N-pole of the single magnet are arranged along the third direction D3. The magnet unit 321 may further include two magnets of S-pole and N-pole, respectively, and the magnets of S-pole and the magnets of N-pole are arranged along the third direction D3.

It should be understood that the coil windings of the first coil unit 311 and the second coil unit 312 are arranged in the direction of the second direction D2 and the direction of arrangement of the S-poles and the N-poles of the magnet unit 321, respectively, so as to ensure that the magnetic field generated when the first driving current is input to the first coil unit 311 and the second coil unit 312 can drive the magnet unit 321 to move in the first direction D1 or the direction opposite to the first direction D1.

As shown in fig. 4, in some embodiments, the base 10 includes a base portion 13 for providing connection support, and a first winding support portion 11 and a second winding support portion 12 connected to the base portion 13 and disposed at opposite sides of the connection portion 21, the first coil unit 311 is wound around the first winding support portion 11, and the second coil unit 312 is wound around the second winding support portion 12;

wherein the first winding support 11 and the second winding support 12 are iron cores or insulators.

Specifically, the base portion 13 is configured to provide a mounting support, which may form a fixed connection with an external object to provide a fixed base point for the whole wire bonding quality inspection device 100, or may directly place the base portion 13 at a predetermined position to provide mechanical support by the base portion 13.

Further, the side of the first winding support 11 away from the base portion 13 and the side of the second winding support 12 away from the base portion 13 extend opposite to each other while being spaced apart from each other, and the receiving groove 313 is located between the first winding support 11 and the second winding support 12, i.e., the extending direction of the side of the first winding support 11 away from the base portion 13 and the side of the second winding support 12 away from the base portion 13 is parallel to the second direction D2, and the first coil unit 311 is wound on the side of the first winding support 11 away from the base portion 13, and the second coil unit 312 is wound on the side of the second winding support 12 away from the base portion 13.

Thus, the first winding support portion 11 provides axial support for the first coil unit 311, and the second winding support portion 12 provides axial support for the second coil unit 312, so as to restrict the winding direction of the first coil unit 311 and the second coil unit 312, and avoid deviation of the driving direction of the magnet unit 321 caused by dislocation of the first coil unit 311 and the second coil unit 312.

It is to be noted that the first winding supporting portion 11 and the second winding supporting portion 12 may be an insulating member or an iron core, and when the first winding supporting portion 11 and the second winding supporting portion 12 are insulators, axial support may be provided for the first coil unit 311 and the second coil unit 312; when the first winding support 11 and the second winding support 12 are iron cores, the strength of the magnetic field generated by the first coil unit 311 and the second coil unit 312 can be enhanced after the axial support is provided.

In some embodiments, the connection portion 21 forms a limit groove 211 extending in the first direction D1 at least one of a side near the first winding support portion 11 and a side near the second winding support portion 12, and the connection portion 21 is for forming a guide fit with the base 10 through the limit groove 211;

the magnet unit 321 is disposed at the connecting portion 21 corresponding to the first winding supporting portion 11 and the second winding supporting portion 12, and at least a portion of the magnet unit 321 is exposed out of the limiting groove 211.

It should be appreciated that the connection portion 21 forms a guiding engagement with the base 10 through the limiting groove 211 such that the movement of the magnet unit 321 is limited to the first direction D1 or a direction opposite to the first direction D1. Specifically, the magnet unit 321 is disposed at the connection portion 21 and forms part of the exposure, and the exposed part of the magnet unit 321 is opposite to the first winding support portion 11 and the second winding support portion 12, so that the magnet unit 321 has a compact mechanical structure and reduces the occupied volume, while satisfying the function of forming a magnetic field by using the magnet unit 321.

Further, at least part of the magnet unit 321 is exposed from the limiting groove 211, which is convenient for disassembling and replacing the magnet unit 321.

It should be noted that, in the quality inspection device 100 for bonding wires according to the embodiment of the present application, in the case of inspecting the quality of the plurality of target bonding wires 800, after the secondary driving assembly 32 and the transmission module 20 drive the wire picking tool 600 to apply the force to the target bonding wires 800 welded to the circuit board 700 along the first direction D1, the secondary driving assembly 32, the transmission module 20 and the wire picking tool 600 are required to be reset.

Specifically, the secondary driving assembly 32, the transmission module 20 and the thread take-up workpiece 600 may be reset by using weight, for example, as shown in fig. 2, the wire quality inspection device 100 is placed, so that after the first driving current is stopped from being input to the primary driving assembly 31, the secondary driving assembly 32, the transmission module 20 and the thread take-up workpiece 600 move downward under the action of gravity to complete the reset.

The secondary driving assembly 32, the transmission module 20 and the thread take-up tool 600 may be reset by inputting a second driving current to the primary driving assembly 31 in a direction opposite to the first driving current:

in some embodiments, the primary drive assembly 31 is further configured to drive the secondary drive assembly 32 to move in a direction opposite to the first direction D1 based on an input second drive current having a current direction opposite to the first drive current.

Specifically, under the condition that the second driving current is input to the primary driving component 31, the primary driving component generates a reset coil magnetic field opposite to the magnetic field of the target coil magnetic field, and the secondary driving component 32 moves in a direction opposite to the first direction D1 under the action of the reset coil magnetic field, and accordingly, the transmission module 20 and the thread take-up workpiece 600 synchronously move in a direction opposite to the first direction D1, so that the secondary driving component 32, the transmission module 20 and the thread take-up workpiece 600 are reset.

It should be appreciated that this arrangement promotes the suitability of the wire quality inspection device 100 for quality inspection of a large number of target wire bonds 800, and this scheme greatly promotes the accuracy and response speed of resetting, as compared to a mode that simply utilizes gravity to reset.

In some embodiments, the transmission module 20 further includes a guide portion 23 disposed between the fitting portion 22 and the connection portion 21, the guide portion 23 forming at least one guide slot 231 extending in the first direction D1, the guide slot 231 configured to cooperate with an external guide workpiece to guide a movement direction of the transmission module 20.

Specifically, the guide slot 231 cooperates with the external guide workpiece to limit the movement of the secondary driving assembly 32 to the first direction D1 or the direction opposite to the first direction D1, so as to avoid the bias of the direction of the thread take-up workpiece 600.

As shown in fig. 3, the guide slots 231 are provided in two numbers, and the two guide slots 231 are provided at intervals between the fitting portion 22 and the connecting portion 21.

In some embodiments, the assembly portion 22 includes at least a first assembly front 221 and a second assembly front 222 connected to the guide portion 23 and extending in a direction away from the guide portion 23, and the first assembly front 221 and the second assembly front 222 are spaced apart to form an assembly opening 223, and the assembly opening 223 is configured to receive the thread take-up tool 600.

Specifically, when the thread take-up workpiece 600 is connected and adapted to the transmission module 20, the thread take-up workpiece 600 is accommodated in the assembly opening 223 formed between the first assembly front end 221 and the second assembly front end 222, wherein the connection manner between the thread take-up workpiece 600 and the assembly opening 223 may be: the first assembling front end 221 and the second assembling front end 222 cooperate to clamp the thread take-up workpiece 600, or the thread take-up workpiece 600 is connected and matched with at least one of the first assembling front end 221 and the second assembling front end 222.

In some embodiments, at least one of the first fitting front 221 and the second fitting front 222 forms a fitting hole 224 for connection fitting with the thread take-up tool 600.

Specifically, the thread take-up tool 600 may achieve a snap fit or a bolt fit with at least one of the first and second fitting front ends 221 and 222 through the fitting hole 224.

In other embodiments, the first mounting front 221 and the second mounting front 222 are configured to cooperatively clamp the thread take-up tool 600 through the mounting opening 223.

Specifically, the first assembling front end 221 and the second assembling front end 222 cooperate to clamp the thread take-up workpiece 600 located in the assembling opening 223, and further, the distance between the first assembling front end 221 and the second assembling front end 222 in the clamping direction is adjustable, so as to clamp and release the thread take-up workpiece 600.

It should be appreciated that the two embodiments described above may be implemented separately or in combination to enhance the connection between the thread take-up work 600 and the fitting portion 22.

Referring to fig. 7, fig. 7 is a block diagram illustrating an implementation of a wire quality inspection system 500 according to an embodiment of the present application.

As shown in fig. 7, the embodiment of the present application further provides a bonding wire quality inspection system 500, which includes a bonding wire quality inspection device 100, a collection device 200, a receiving platform 300, and a controller 400, wherein the bonding wire quality inspection device 100 is the bonding wire quality inspection device 100 provided in any embodiment of the present application, and is used for being connected and adapted to a wire picking tool 600, the receiving platform 300 is used for receiving a circuit board 700 to be inspected and fixing the circuit board 700, wherein a target bonding wire 800 is welded on the circuit board 700 to be inspected, and the collection device 200 is used for performing image collection on the circuit board 700 received in the receiving platform 300.

The controller 400 is electrically connected to the wire quality inspection device 100 and the collection device 200 and is configured to perform the following control steps:

when the circuit board 700 is fixed on the accommodating platform 300, the wire quality inspection device 100 is controlled to drive the wire picking tool 600 to apply force to the target wire 800 based on the first driving current input into the wire quality inspection device 100;

The control acquisition device 200 acquires a connection state of the target bonding wire 800, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire 800 and the circuit board 700 is separated, and the second state represents that the connection of the target bonding wire 800 and the circuit board 700 is not separated;

The magnitude of the force applied to the target bonding wire 800 by the wire picking tool 600 is determined according to the current intensity of the first driving current, and the bonding wire quality inspection information corresponding to the target bonding wire 800 is output based on the magnitude of the force and the connection state.

Specifically, when the circuit board 700 is fixed to the accommodating platform 300 and the wire picking tool 600 is performed, the controller 400 controls the wire quality inspection device 100 to drive the wire picking tool 600 to apply a force to the target wire 800 based on the first driving current input into the wire quality inspection device 100, and then controls the collecting device 200 to obtain the connection state of the target wire 800, so that it is easy to know that whether the connection between the target wire 800 and the circuit board 700 is separated or not can be determined according to the connection state. After that, the controller 400 determines the magnitude of the force applied to the target wire 800 by the wire picking tool 600 according to the current intensity of the first driving current, and outputs the wire quality inspection information corresponding to the target wire 800 based on the magnitude of the force and the connection state.

More specifically, based on the fact that the magnitude of the force applied by the wire bonding tool 600 to the target bonding wire 800 matches the current intensity of the first driving current input to the main driving assembly 31, a mapping relationship between the magnitude of the force applied and the current intensity of the first driving current may be established in advance, and the controller 400 may determine the magnitude of the force applied by the wire bonding tool 600 to the target bonding wire 800 according to the mapping relationship.

After determining the magnitude of the force applied by the wire picking tool 600 to the target wire 800, the controller 400 may generate wire quality inspection information corresponding to the target wire 800 by integrating the magnitude of the force and the connection state.

For example, the wire quality inspection information may be recorded in a format of "force magnitude, connection status", e.g., "2N, second status", or "3N, first status". The bonding wire quality inspection information obtained by applying force to the single target bonding wire 800 at multiple times of different force applying magnitudes can be recorded by integrating the multiple times of force applying magnitudes and connection states corresponding to the force applying magnitudes, for example: "1N, second state; 2N, second state; 3N, first state; 4N, the first state ", thereby more accurately obtaining the critical point of the force magnitude for disengaging the connection of the target bonding wire 800 to the circuit board 700.

It should be noted that, the specific manner of using the wire quality inspection device 100 to drive the wire picking tool 600 to apply force to the target wire 800 based on the first driving current input to the wire quality inspection device 100 may refer to the description of the wire quality inspection device 100 in the above embodiment, and will not be repeated herein.

The acquisition device 200 will be described: the acquisition device 200 is used for acquiring an image of the circuit board 700 to obtain an image corresponding to the circuit board 700, and the controller 400 performs image processing on the acquired image to determine the connection state of the target bonding wire 800.

Exemplary, the acquisition device 200 includes, but is not limited to, at least one of a sensor, a camera, and a camera.

It should be appreciated that, compared to a scheme of performing quality inspection on the target bonding wire 800 only by using machine vision, the bonding wire quality inspection system 500 provided by the embodiment of the application can perform quality inspection based on the target bonding wire 800 subjected to the force applied by the bonding wire quality inspection device 100, so as to intuitively embody the force applied by the target bonding wire 800, avoid the unstable connection between the target bonding wire 800 and the circuit board 700, and more accurately determine the connection reliability of the target bonding wire 800 and the circuit board 700.

Referring to fig. 8, fig. 8 is a schematic flowchart illustrating a method for inspecting quality of bonding wires according to an embodiment of the present application.

As shown in fig. 8, the embodiment of the present application further provides a quality inspection method for bonding wires, which is applied to the quality inspection device 100 for bonding wires provided in any embodiment of the present application or the quality inspection system 500 for bonding wires provided in any embodiment of the present application, and the method specifically includes steps S901 to S903:

step S901: when the circuit board 700 is fixed on the preset accommodating platform 300, the wire quality inspection device 100 is controlled to drive the wire picking tool 600 to apply force to the target wire 800 welded on the circuit board 700;

Step S902, obtaining a connection state of the target bonding wire 800, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire 800 and the circuit board 700 is separated, and the second state represents that the connection of the target bonding wire 800 and the circuit board 700 is not separated;

Step 903, determining the magnitude of the force applied to the target bonding wire 800 by the wire picking tool 600 according to the current intensity of the first driving current, and outputting bonding wire quality inspection information corresponding to the target bonding wire 800 based on the magnitude of the force and the connection state.

Specifically, when the circuit board 700 is fixed to the accommodating platform 300 and the wire picking tool 600 is performed, the wire quality inspection device 100 is controlled to drive the wire picking tool 600 to apply a force to the target wire 800 based on the first driving current input into the wire quality inspection device 100, and then the collecting device 200 is controlled to obtain the connection state of the target wire 800, so that it is easy to know that whether the connection between the target wire 800 and the circuit board 700 is separated or not can be determined according to the connection state. After that, the magnitude of the biasing force of the wire picking tool 600 on the target wire 800 is determined according to the current intensity of the first driving current, and the wire quality inspection information corresponding to the target wire 800 is output based on the magnitude of the biasing force and the connection state.

More specifically, based on the fact that the magnitude of the force applied by the wire pick-up workpiece 600 to the target bonding wire 800 matches the current intensity of the first driving current input to the main stage driving assembly 31, a mapping relationship between the magnitude of the force applied and the current intensity of the first driving current may be established in advance, so that the magnitude of the force applied by the wire pick-up workpiece 600 to the target bonding wire 800 is determined according to the mapping relationship.

After determining the magnitude of the force applied by the wire picking tool 600 to the target bonding wire 800, bonding wire quality inspection information corresponding to the target bonding wire 800 may be generated by integrating the magnitude of the force applied and the connection state.

Note that, for a specific manner of using wire quality inspection device 100 to drive wire picking tool 600 to apply force to target wire 800 based on the first driving current input to wire quality inspection device 100, reference is made to the description of wire quality inspection device 100 in the above embodiment.

For example, the wire quality inspection information may be recorded in a format of "force magnitude, connection status", e.g., "2N, second status", or "3N, first status". The bonding wire quality inspection information obtained by applying force to the single target bonding wire 800 at multiple times of different force applying magnitudes can be recorded by integrating the multiple times of force applying magnitudes and connection states corresponding to the force applying magnitudes, for example: "1N, second state; 2N, second state; 3N, first state; 4N, the first state ", thereby more accurately obtaining the critical point of the force magnitude for disengaging the connection of the target bonding wire 800 to the circuit board 700.

It should be appreciated that, compared to a scheme of performing quality inspection on the target bonding wire 800 only by using machine vision, the bonding wire quality inspection system 500 provided by the embodiment of the application can perform quality inspection based on the target bonding wire 800 subjected to the force applied by the bonding wire quality inspection device 100, so as to intuitively embody the force applied by the target bonding wire 800, avoid the unstable connection between the target bonding wire 800 and the circuit board 700, and more accurately determine the connection reliability of the target bonding wire 800 and the circuit board 700.

In summary, an embodiment of the present application provides a bonding wire quality inspection device 100, a bonding wire quality inspection system 500, and a bonding wire quality inspection method, where the bonding wire quality inspection device 100 includes: a base 10 for providing mounting support; the transmission module 20, the transmission module 20 includes a connection portion 21 and an assembly portion 22 disposed on a different side from the connection portion 21, the transmission module 20 is movably connected with the base 10 through the connection portion 21, and the assembly portion 22 is configured for connection and adaptation with the thread take-up tool 600; the driving module 30, the driving module 30 includes a main driving component 31 connected to the base 10 and a secondary driving component 32 connected to the transmission module 20 and adapted to the main driving component 31, the main driving component 31 is at least used for driving the secondary driving component 32 to move in a first direction D1 based on a first driving current input to the main driving component 31, so as to apply a force to a target bonding wire 800 welded to the circuit board 700 by driving the wire picking tool 600 connected to the assembly portion 22 through the secondary driving component 32 and the transmission module 20; the first direction D1 is a direction in which the target bonding wire 800 is far away from the circuit board 700, and the magnitude of the force applied by the wire picking tool 600 to the target bonding wire 800 matches the current intensity of the first driving current input to the main driving component 31. According to the welding wire quality inspection device 100, the welding wire quality inspection system 500 and the welding wire quality inspection method provided by the embodiment of the application, the current intensity of the first driving current is converted into the force applied by the wire picking workpiece 600 to the target welding wire 800 by utilizing the driving of the secondary driving assembly 32 by the host driving assembly in the driving module 30, so that the force applied to the target welding wire 800 can be accurately controlled, the welding quality inspection result of the target welding wire 800 is ensured to be reliable, the welding wire firmness degree is intuitively reflected, and compared with a machine vision scheme, the welding wire quality inspection method is lower in cost.

The foregoing is merely illustrative of embodiments of the present application, and the scope of the present application is not limited thereto, and any equivalent modifications or substitutions will be apparent to those skilled in the art within the scope of the present application, which is defined by the appended claims.

It is to be understood that the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations. In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system.

Claims (8)

1. A bonding wire quality inspection device, characterized by includes:

a base for providing mounting support;

The transmission module comprises a connecting part and an assembling part which is arranged on the side different from the connecting part, the transmission module is movably connected with the base through the connecting part, and the assembling part is configured to be connected and matched with the thread picking workpiece;

The driving module comprises a main-stage driving assembly connected to the base and a secondary driving assembly connected to the transmission module and adapted to the main-stage driving assembly, and the main-stage driving assembly is at least used for driving the secondary driving assembly to move in a first direction based on a first driving current input into the main-stage driving assembly so as to drive a take-up workpiece connected to the assembly part to apply force to a target bonding wire welded to a circuit board through the secondary driving assembly and the transmission module;

the first direction is a direction in which the target bonding wire is far away from the circuit board, and the magnitude of the force applied by the wire-picking workpiece to the target bonding wire is matched with the current intensity of the first driving current input to the main-stage driving assembly;

the primary driving assembly comprises a first coil unit and a second coil unit which are arranged at intervals and connected with the base, a containing groove is formed between the first coil unit and the second coil unit at intervals, and the secondary driving assembly comprises a magnet unit which is connected with the transmission module and is matched with the containing groove;

The first coil unit and the second coil unit are respectively wound by taking a second direction perpendicular to the first direction as an axis, and the S pole and the N pole of the magnet unit are distributed along a third direction perpendicular to the first direction and forming an included angle with the second direction;

The first coil unit and the second coil unit are used for receiving the first driving current and generating a target coil magnetic field under the excitation of the first driving current, so that the magnet unit accommodated in the accommodating groove moves towards the first direction under the action of the target coil magnetic field, and the thread-picking workpiece is driven to move towards the first direction through the transmission module;

The base comprises a base part for providing connection support, a first winding support part and a second winding support part, wherein the first winding support part and the second winding support part are connected with the base part and are arranged on two opposite sides of the connection part, the first winding unit is wound on the first winding support part, and the second winding unit is wound on the second winding support part;

The connecting part forms a limit groove extending along the first direction on at least one of one side close to the first winding support part and one side close to the second winding support part, and the connecting part is used for forming guide fit with the base through the limit groove;

The magnet unit is arranged at the connecting part corresponding to the first winding supporting part and the second winding supporting part, at least part of the magnet unit is exposed out of the limiting groove, and the exposed part of the magnet unit is opposite to the first winding supporting part and the second winding supporting part.

2. The wire quality inspection device of claim 1, wherein the first winding support and the second winding support are iron cores or insulators.

3. The wire quality inspection device of claim 2 wherein said primary drive assembly is further configured to drive said secondary drive assembly in a direction opposite said first direction based on an input second drive current, said second drive current having a current direction opposite said first drive current.

4. The wire inspection device of any one of claims 1-3 wherein the drive module further includes a guide portion disposed between the mounting portion and the connecting portion, the guide portion defining at least one guide slot extending in the first direction, the guide slot configured to cooperate with an external guide workpiece to guide a direction of movement of the drive module.

5. The wire quality inspection device of claim 4, wherein the mounting portion includes at least a first mounting front end and a second mounting front end connected to the guide portion and extending in a direction away from the guide portion, and the first mounting front end and the second mounting front end are spaced apart to form a mounting opening for receiving the wire-bonding work piece.

6. The wire bonding quality inspection device of claim 5 wherein at least one of the first and second assembly front ends defines an assembly aperture for connection adaptation with the take-up workpiece;

And/or the first assembling front end and the second assembling front end are used for clamping the thread-picking workpiece through the assembling opening in a matched mode.

7. A weld line quality inspection system, comprising:

the wire bonding quality inspection device of any one of claims 1-6;

a collection device;

The device comprises a containing platform, a testing platform and a testing platform, wherein the containing platform is used for containing a circuit board to be tested and fixing the circuit board, and target welding wires are welded on the circuit board;

and the controller is electrically connected with the welding wire quality inspection device and the acquisition device and is used for:

When the circuit board is fixed on the accommodating platform, controlling the welding wire quality inspection device to drive the thread-taking-up workpiece to apply force to the target welding wire based on a first driving current input into the welding wire quality inspection device;

the acquisition device is controlled to acquire the connection state of the target bonding wire, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire and the circuit board is separated, and the second state represents that the connection of the target bonding wire and the circuit board is not separated;

And determining the force application size of the thread-picking workpiece to the target welding wire according to the current intensity of the first driving current, and outputting the welding wire quality inspection information corresponding to the target welding wire based on the force application size and the connection state.

8. A wire quality inspection method for use with a wire quality inspection device as claimed in any one of claims 1 to 6 or a wire quality inspection system as claimed in claim 7, the method comprising:

When the circuit board is fixed on a preset accommodating platform, controlling the welding wire quality inspection device to drive the wire picking workpiece to apply force to a target welding wire welded on the circuit board;

Acquiring a connection state of the target bonding wire, wherein the connection state at least comprises a first state and a second state, the first state represents that the connection of the target bonding wire and the circuit board is separated, and the second state represents that the connection of the target bonding wire and the circuit board is not separated;

And determining the force application size of the thread-picking workpiece to the target welding wire according to the current intensity of the first driving current, and outputting the welding wire quality inspection information corresponding to the target welding wire based on the force application size and the connection state.