CN118507386A - Automatic packaging machine for semiconductor packaging frame - Google Patents
Automatic packaging machine for semiconductor packaging frame Download PDFInfo
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- CN118507386A CN118507386A CN202410509536.XA CN202410509536A CN118507386A CN 118507386 A CN118507386 A CN 118507386A CN 202410509536 A CN202410509536 A CN 202410509536A CN 118507386 A CN118507386 A CN 118507386A
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- machine
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 112
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 78
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 59
- 238000012546 transfer Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000004140 cleaning Methods 0.000 claims description 29
- 230000007704 transition Effects 0.000 claims description 19
- 239000005022 packaging material Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 13
- 210000000078 claw Anatomy 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 description 26
- 150000001875 compounds Chemical class 0.000 description 22
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000007789 sealing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 238000010137 moulding (plastic) Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of semiconductor package frame production, and particularly relates to an automatic packaging machine for a semiconductor package frame, which comprises the following steps: the machine is provided with a support frame, and one side of the machine is provided with a plastic package die; the packaging frame feeding device is arranged on the machine table and is used for providing a packaging frame; the plastic package material feeding device is arranged on the machine table and is used for providing plastic package materials; the transfer device comprises a first linear module, a transfer platform and a clamping mechanism, and the photoresist removing device comprises a second linear module, a photoresist removing lower die platform and a photoresist removing die mechanism; and the blanking manipulator is arranged on one side of the second linear module and is configured to perform blanking on the packaging frame with the photoresist removing operation completed. This packaging machine is through encapsulation frame feed arrangement and plastic envelope material feed arrangement, provides required encapsulation frame and plastic envelope material automatically, has reduced manual operation, has improved efficiency.
Description
Technical Field
The application relates to the technical field of semiconductor package frame production, in particular to an automatic packaging machine for a semiconductor package frame.
Background
With the rapid growth of the semiconductor industry, the demand for MGP die production of semiconductor packaging frames is increasing. MGP die encapsulation is commonly referred to as Micro LEADFRAME PACKAGE, i.e., micro leadframe encapsulation. This packaging technology is a miniaturized, high-density chip packaging technology commonly used for integrated circuit packaging. The MGP package has the characteristics of small volume, thin lead, low power consumption, high transmission rate and the like, and is suitable for the fields of mobile phones, intelligent wearing equipment, automobile electronics and the like. The packaging modes are various, such as QFN, SON and the like, and can meet the packaging requirements of different chips. MGP encapsulation technology has become a common way of encapsulation in modern electronic products.
At present, the feeding mode of the semiconductor packaging frame produced by the MGP mould in China mainly adopts the traditional manual feeding mode for production, and the production mode has a plurality of problems, such as frequent manual walking of the upper and lower process connection flows, time and labor consumption for manual back and forth carrying, poor quality consistency, low efficiency and the like. In order to solve these problems, it is necessary to develop a fully automatic MGP full-automatic packaging machine to reduce manpower, reduce cost, improve packaging efficiency, simplify field space, and optimize field environment.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
In view of at least one of the above technical problems, the application provides an automatic packaging machine for a semiconductor packaging frame, which solves the problems of frequent manual walking of an upper and lower process connection flow, time and labor consumption for back and forth manual transportation, poor quality consistency and low efficiency.
The embodiment of the application provides an automatic packaging machine for a semiconductor packaging frame, which comprises the following steps:
The machine is provided with a support frame, and one side of the machine is provided with a plastic package die;
The packaging frame feeding device is arranged on the machine table and is used for providing a packaging frame;
the plastic package material feeding device is arranged on the machine table and is used for providing plastic package materials;
The transfer device comprises a first linear module, a transfer platform and a clamping mechanism, wherein the first linear module is arranged on the support frame along a second direction, the transfer platform is connected with the output end of the first linear module, the clamping mechanism is movably arranged on the transfer platform, and the clamping mechanism is configured to clamp the packaging frame and the plastic packaging material at the same time and transfer the packaging frame and the plastic packaging material into the plastic packaging mould for plastic packaging; the clamping mechanism is further configured to be capable of taking out the packaging frame which is subjected to plastic packaging from the plastic packaging die;
The photoresist removing device comprises a second linear module, a photoresist removing lower die platform and a photoresist removing die mechanism, wherein the second linear module is arranged on the machine table along a first direction, the photoresist removing lower die platform is connected with the output end of the second linear module, the photoresist removing die mechanism is arranged above the second linear module, and the photoresist removing die mechanism is configured to perform photoresist removing operation on a hole site on a packaging frame subjected to plastic packaging; and
And the blanking manipulator is arranged on one side of the second linear module and is configured to perform blanking on the packaging frame with the photoresist removing operation completed.
Compared with the prior art, the packaging machine automatically provides the required packaging frame and plastic packaging materials through the packaging frame feeding device and the plastic packaging material feeding device, so that manual operation is reduced, and efficiency is improved; the clamping mechanism can simultaneously clamp the packaging frame and the plastic packaging material, and transfer the packaging frame and the plastic packaging material into a plastic packaging die for plastic packaging, and meanwhile, the packaging frame after plastic packaging can be taken out, so that accurate transfer operation is realized; and (3) performing photoresist removing operation on the hole sites on the packaging frame subjected to plastic packaging through a photoresist removing mould mechanism, so as to ensure that the hole sites of the packaging frame are not blocked and ensure subsequent bending operation of the packaging frame.
In some possible implementations, the transfer device further includes a cleaning mechanism located on a side of the gripping mechanism adjacent to the molding die.
In some possible implementations, the clamping mechanism includes a lifting assembly, a clamping base, a first clamping assembly and a second clamping assembly, the lifting assembly is arranged in the transfer platform, the clamping base is connected with the lifting assembly, and the first clamping assembly and the second clamping assembly are provided with a plurality of clamping bases and are respectively arranged on the clamping base.
In some possible implementations, the first clamping assembly includes a plurality of accommodating seats, an accommodating cylinder, a connecting plate and an abutting insertion sheet, the accommodating seats are arranged on the clamping base in a penetrating manner, the accommodating seats are provided with accommodating spaces and slots which are communicated with each other, the accommodating spaces are arranged along a third direction, the accommodating cylinder is arranged on the clamping base, the connecting plate is connected with an output end of the accommodating cylinder, the abutting insertion sheet is provided with a plurality of abutting insertion sheets and is arranged on the connecting plate, and the end parts of the abutting insertion sheets are inserted into the slots and are configured to be capable of sealing the accommodating spaces.
In some possible implementations, the accommodating seat includes an upper pipe body portion, a middle seat body and a lower pipe body portion that are sequentially connected from top to bottom, the upper pipe body portion, the middle seat body and the lower pipe body portion are mutually communicated, the upper pipe body portion and the lower pipe body portion are hollow cylindrical, the accommodating space penetrates through the upper pipe body portion along a third direction, the slot penetrates through the middle seat body along a second direction, and the lower pipe body portion penetrates through a communication space communicated with the slot along the third direction.
In some possible implementations, the length of the lower tube body is greater than the length of the upper tube body.
In some possible implementations, the second clamping assembly includes a clamping motor, a connecting rod, and clamping claws, the clamping motor is disposed on the clamping base, the clamping motor has two output ends, the connecting rod has two output ends and is respectively connected to one output end of the clamping motor, and the clamping claws have a plurality of output ends and are distributed on the connecting rod at intervals.
In some possible implementation manners, the plastic package material feeding device comprises a lifting cylinder, a lifting seat, a transition wobble plate, a material ejection cylinder, a material ejection seat and a push rod, wherein the lifting cylinder is arranged on a machine table along a third direction, the lifting seat is connected with the output end of the lifting cylinder, the transition wobble plate is arranged on the lifting seat at intervals, a plurality of bumps are arranged on the transition wobble plate, the transition wobble plate is provided with perforations, the perforations penetrate through the upper surface of the bumps and the lower surface of the transition wobble plate, the material ejection cylinder is arranged on the lifting seat along the third direction, the material ejection seat is arranged on the output end of the material ejection cylinder, the push rod is provided with a plurality of push rods and is arranged on the material ejection seat, and the end parts of the push rod are arranged in the perforations in a penetrating manner.
In some possible implementations, the photoresist stripping mechanism includes a mounting base, a lower air cylinder, a lower mounting plate, photoresist stripping cutters and a lower pressing plate, the mounting base is arranged on the machine table, the lower air cylinder is arranged on the mounting base, the lower mounting plate is connected with the output end of the lower air cylinder, the lower pressing plate is arranged on the lower mounting plate, the photoresist stripping cutters are provided with a plurality of and are arranged on the lower mounting plate at intervals, and the photoresist stripping cutters are arranged in the lower pressing plate in a penetrating manner.
In some possible implementations, a surface of the lower platen facing away from the downward moving mounting plate is provided with a protrusion, and the protrusion is disposed along the first direction.
The invention will be further described with reference to the drawings and examples.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will briefly explain the embodiments or the drawings needed in the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present invention and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of an automatic packaging machine for semiconductor package frames according to an embodiment;
FIG. 2 is a schematic view of the transfer apparatus of FIG. 1 in an angle;
FIG. 3 is an exploded view of the first gripper assembly of FIG. 2 at an angle;
FIG. 4 is a schematic view of the internal structure of the housing seat in FIG. 3;
FIG. 5 is a schematic view of the second gripper assembly of FIG. 2 at an angle;
FIG. 6 is a schematic view of the molding compound feeding device of FIG. 1 at an angle;
FIG. 7 is a schematic view of the mold stripping mechanism of FIG. 1 in an angular orientation;
Wherein, the reference numerals are as follows:
100. A machine table; 110. a support frame; 120. molding and sealing;
200. packaging frame feeding device;
300. a plastic package material feeding device; 310. a lifting cylinder; 320. a lifting seat; 330. a transition wobble plate; 340. a liftout cylinder; 350. a material ejection seat;
360. a push rod;
331. A bump; 332. perforating;
400. A transfer device; 410. a transfer platform; 420. a clamping mechanism; 430. a cleaning mechanism;
421. A lifting assembly; 422. clamping a base; 423. a first clamping assembly; 424. a second clamping assembly;
4231. A housing seat; 4232. an accommodating cylinder; 4233. a connecting plate; 4234. abutting the inserting sheet;
42311. An upper tube body; 42312. a middle seat body; 42313. a lower pipe body; 42314. an accommodating space; 42315. a slot; 42316. a communicating space;
4241. clamping a motor; 4242. a connecting rod; 4243. clamping claws;
500. a photoresist removing device; 510. a photoresist removing lower die platform; 520. a gumming mould mechanism;
521. a mounting base; 522. a pressing cylinder; 523. moving the mounting plate downwards; 524. a photoresist removing cutter; 525. a lower pressing plate;
600. a blanking manipulator;
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
MGP encapsulation is commonly referred to as Micro LEADFRAME PACKAGE, i.e. Micro leadframe encapsulation. This packaging technology is a miniaturized, high-density chip packaging technology commonly used for integrated circuit packaging. The MGP package has the characteristics of small volume, thin lead, low power consumption, high transmission rate and the like, and is suitable for the fields of mobile phones, intelligent wearing equipment, automobile electronics and the like. The packaging modes are various, such as QFN, SON and the like, and can meet the packaging requirements of different chips. MGP encapsulation technology has become a common way of encapsulation in modern electronic products.
At present, the feeding mode of the semiconductor packaging frame produced by the MGP mould in China mainly adopts the traditional manual feeding mode for production, and the production mode has a plurality of problems, such as frequent manual walking of the upper and lower process connection flows, time and labor consumption for manual back and forth carrying, poor quality consistency, low efficiency and the like. In order to solve these problems, it is necessary to develop a fully automatic MGP full-automatic packaging machine to reduce manpower, reduce cost, improve packaging efficiency, simplify field space, and optimize field environment. Compared with the prior art, the packaging machine automatically provides the required packaging frame and plastic packaging materials through the packaging frame feeding device and the plastic packaging material feeding device, so that manual operation is reduced, and efficiency is improved; the clamping mechanism can simultaneously clamp the packaging frame and the plastic packaging material, and transfer the packaging frame and the plastic packaging material into a plastic packaging die for plastic packaging, and meanwhile, the packaging frame after plastic packaging can be taken out, so that accurate transfer operation is realized; and (3) performing photoresist removing operation on the hole sites on the packaging frame subjected to plastic packaging through a photoresist removing mould mechanism, so as to ensure that the hole sites of the packaging frame are not blocked and ensure subsequent bending operation of the packaging frame.
The specific structure of the automatic packaging machine for semiconductor package frames will be described in detail.
Fig. 1 is a schematic view of an automatic packaging machine for semiconductor package frames according to an embodiment;
As shown in fig. 1, the present embodiment provides an automatic packaging machine for a semiconductor package frame, including: the plastic package machine comprises a machine platform 100, a package frame feeding device 200, a plastic package material feeding device 300, a transfer device 400, a photoresist removing device 500 and a blanking manipulator 600.
Wherein, the machine 100 is provided with a supporting frame 110, and one side of the machine 100 is provided with a plastic package die 120; the packaging frame feeding device 200 is arranged on the machine 100 and is used for providing a packaging frame; the plastic package material feeding device 300 is arranged on the machine 100 and is used for providing plastic package materials; the transfer device 400 comprises a first linear module, a transfer platform 410 and a clamping mechanism 420, wherein the first linear module is arranged on the support frame 110 along a second direction, the transfer platform 410 is connected with an output end of the first linear module, the clamping mechanism 420 is movably arranged on the transfer platform 410, and the clamping mechanism 420 is configured to clamp a packaging frame and a plastic package material at the same time and transfer the packaging frame and the plastic package material into the plastic package mold 120 for plastic package; the gripping mechanism 420 is further configured to be able to take out the package frame completed with the plastic package from the plastic package mold 120; the photoresist removing device 500 comprises a second linear module, a photoresist removing lower die platform 510 and a photoresist removing die mechanism 520, wherein the second linear module is arranged on the machine table 100 along a first direction, the photoresist removing lower die platform 510 is connected with the output end of the second linear module, the photoresist removing die mechanism 520 is arranged above the second linear module, and the photoresist removing die mechanism 520 is configured to perform photoresist removing operation on holes on a packaging frame which is subjected to plastic packaging; and the blanking manipulator is arranged on one side of the second linear module and is configured to perform blanking on the packaging frame with the photoresist removing operation completed.
It will be appreciated that the first direction corresponds to the X-axis of the spatial coordinate axis (i.e., the left-right direction), the second direction corresponds to the Y-axis of the spatial coordinate axis (i.e., the front-back direction), and the third direction corresponds to the Z-axis of the spatial coordinate axis (i.e., the up-down direction).
For example, the package frame feeding device 200 may include a third linear module and a preheating and material transferring platform, wherein the third linear module is disposed on the machine 100 along the first direction, and the preheating and material transferring platform is connected to the third linear module. The preheating material moving platform is used for preheating the packaging frame which is fed to the preheating material moving disc platform. Then, the third linear module drives the preheating transfer platform to move to the lower part of the transfer device 400. The clamping mechanism 420 then clamps the package frame from the pre-heated material moving platform.
Illustratively, the molding compound feeder apparatus 300 is used to feed molding compound into the clamping mechanism 420. When the plastic package material is fed, the plastic package material feeding device 300 is located right below the clamping mechanism 420, and the plastic package material feeding device 300 pushes up a plurality of plastic package materials into the clamping mechanism 420.
Illustratively, the clamping mechanism 420 clamps the package frame and the molding compound from the package frame feeding device 200 and the molding compound feeding device 300, respectively, the clamping mechanism 420 brings the package frame and the molding compound into the molding die 120 at the same time, and puts the package frame and the molding compound into the molding die 120. After the discharging is finished, the clamping mechanism 420 is withdrawn from the plastic sealing die 120, and the plastic sealing die 120 is clamped for the plastic sealing process. After the plastic packaging process is completed, the clamping mechanism 420 reenters the plastic packaging mold 120, takes out the packaging frame after plastic packaging is completed, and transfers the packaging frame to the photoresist removing lower mold platform 510.
Illustratively, the lower mold platform 510 moves with the encapsulated package frame to a position just below the mold mechanism 520, and the mold mechanism 520 performs a photoresist stripping process on the package frame. After completion, the photoresist removing lower mold platform 510 is moved to one side of the discharging manipulator under the driving, and is discharged.
Illustratively, the transfer device 400 is used for simultaneously transferring the package frame and the molding compound into the plastic package mold 120 from a single-side direction of the plastic package mold 120, and also taking out the package frame, which completes the plastic package process, from the plastic package mold 120 from the same side direction. In this way, the transfer device 400 operates from the single side direction of the plastic packaging mold 120, which saves space and makes the packaging machine more compact in design.
Specifically, the first linear module drives the transfer platform 410 to reciprocate along the second direction, and the gripping mechanism 420 follows the movement of the transfer platform 410. First, the clamping mechanism 420 can clamp the packaging frame and the plastic packaging material at the same time, so that single-side mold feeding and discharging is realized, the number of times of independent clamping and transferring is reduced, and the efficiency of the plastic packaging process is improved. Second, the clamping mechanism 420 accurately places the package frame and the molding compound into the plastic package mold 120, ensuring the accuracy and the package quality of the plastic package process. Again, the clamping mechanism 420 is not only responsible for putting in, but also can take out the packaging frame which completes plastic packaging, thereby realizing continuous automation of the packaging process and further improving the production efficiency.
Fig. 2 is a schematic view of the transfer apparatus 400 in fig. 1 in a configuration at an angle.
As shown in fig. 2, the transfer apparatus 400 further includes a cleaning mechanism 430, where the cleaning mechanism 430 is located at a side of the gripping mechanism 420 near the plastic molding die 120.
Illustratively, the cleaning mechanism 430 is disposed on the transfer platform 410 and is located on a side of the gripping mechanism 420 near the plastic molding die 120, so as to be able to follow the movement of the transfer platform 410. After the clamping mechanism 420 clamps the package frame from the plastic package mold 120, the clamping mechanism 420 moves forward along with the transfer platform 410, and the cleaning mechanism 430 moves along with the transfer platform 410, so that the cleaning mechanism 430 moves to the position of the plastic package mold 120, and at this time, the cleaning mechanism 430 can clean residues and impurities in the plastic package mold 120, thereby avoiding the impurities from affecting the plastic package process and improving the quality of the final subsequent plastic package products. In addition, the cleaning mechanism 430 can clean without interrupting the production flow, thereby reducing the downtime caused by manual cleaning and improving the overall production efficiency.
Illustratively, the cleaning mechanisms 430 are two in number and are juxtaposed on the transfer platform 410 along the height direction of the transfer platform 410. The cleaning mechanism 430 is movably disposed on the transfer platform 410, that is, the cleaning mechanism 430 above can move upwards to extend out of the transfer platform 410, and the cleaning mechanism 430 below can move downwards to extend out of the transfer platform 410, so as to approach the plastic packaging mold 120, and cleaning is completed.
Specifically, the cleaning mechanism 430 may include a lifting motor, a cleaning base, a rotating motor, a transmission mechanism and a cleaning shaft, where the lifting motor is disposed on the transfer platform 410, the cleaning base is connected with an output end of the lifting motor, the rotating motor is disposed on the cleaning base, the cleaning shaft is rotationally connected on the cleaning base, the cleaning shaft is disposed along a length direction of the cleaning base, an output end of the rotating motor is communicated with the cleaning shaft through the transmission mechanism, and a cleaning soft adhesive tape is disposed on the cleaning shaft.
As shown in fig. 2, the clamping mechanism 420 includes a lifting assembly 421, a clamping base 422, a first clamping assembly 423 and a second clamping assembly 424, the lifting assembly 421 is disposed in the transfer platform 410, the clamping base 422 is connected with the lifting assembly 421, and the first clamping assembly 423 and the second clamping assembly 424 each have a plurality of clamping bases 422.
The lifting assembly 421 is used for driving the clamping base 422 to move up and down, so that the clamping base 422 can approach the plastic package mold 120, and the first clamping assembly 423 and the second clamping assembly 424 can put the package frame and the plastic package material into the plastic package mold 120. Specifically, the lifting assembly 421 may include a supporting transverse plate and a driving cylinder, wherein two opposite ends of the supporting transverse plate are fixed at two ends of the transfer platform 410, one end of the driving cylinder is disposed on the clamping base 422, and the other end of the driving cylinder is connected with the supporting transverse plate. In this way, through the cooperation of the supporting transverse plate and the driving cylinder, the clamping base 422 can move up and down relative to the transfer platform 410, and the first clamping component 423 and the second clamping component 424 can be close to or far away from the plastic package die 120, so that the material taking and discharging are facilitated.
Illustratively, the first clamping assembly 423 has four components, and thus, the processing amount of the molding compound can be increased. The second clamping assembly 424 has eight, and thus, the number of processes of the package frame can be increased. In addition, the first clamping assembly 423 and the second clamping assemblies 424 are a set of clamping units, and the package frame and the molding compound clamped by the clamping units are placed in the inner cavity of the same molding die 120.
Fig. 3 is an exploded view of the first gripper assembly 423 of fig. 2 at an angle.
As shown in fig. 3, the first clamping assembly 423 includes a housing seat 4231, a housing cylinder 4232, a connecting plate 4233, and an abutment insert 4234, the housing seat 4231 has a plurality of slots 42314 and 42315 penetrating the clamping base 422, the housing seat 4231 has a housing space 42314 and a slot 42315 communicating with each other, the housing space 42314 is disposed along a third direction, the housing cylinder 4232 is disposed on the clamping base 422, the connecting plate 4233 is connected to an output end of the housing cylinder 4232, the abutment insert 4234 has a plurality of slots and is disposed on the connecting plate 4233, an end portion of the abutment insert 4234 is inserted into the slot 42315, and the abutment insert 4234 is configured to be capable of closing the housing space 42314.
In an exemplary embodiment, there are five receiving seats 4231 and five abutting tabs 4234 in one clamping assembly, so that five molding compounds can be simultaneously fed into the receiving spaces 42314 of the receiving seats 4231.
Illustratively, the end of the abutment tab 4234 is provided with a recess that can allow the ejector rod 360 of the molding compound feeding device 300 to pass through, so that the ejector rod 360 is convenient to reset, and the retention of the molding compound in the receiving space 42314 is not affected.
Taking a housing seat 4231 as an example, when the molding compound is transferred to the first clamping component 423, the bottom of the housing seat 4231 contacts with the molding compound feeding device 300, and the molding compound feeding device 300 pushes up the molding compound, so that the molding compound enters the housing seat 4231 and moves into the housing space 42314. The accommodating cylinder 4232 drives the connecting plate 4233 to move towards the accommodating seat 4231, so that the inserting and inserting piece passes through the inserting groove 42315, the connection between the accommodating space 42314 and the inserting groove 42315 is gradually closed, the plastic package material can be accommodated in the accommodating space 42314, and the ejector rod 360 of the plastic package material feeding device 300 can also be reset.
Fig. 4 is a schematic view illustrating an internal structure of the housing 4231 in fig. 3.
As shown in fig. 4, the housing seat 4231 includes an upper tube body portion 42311, a middle seat body 42312, and a lower tube body portion 42313, which are sequentially connected from top to bottom, the upper tube body portion 42311, the middle seat body 42312, and the lower tube body portion 42313 are mutually communicated, the upper tube body portion 42311, and the lower tube body portion 42313 are hollow cylindrical, the housing space 42314 penetrates the upper tube body portion 42311 in the third direction, the slot 42315 penetrates the middle seat body 42312 in the second direction, and the lower tube body portion 42313 is provided with a communication space 42316 in the third direction, which is communicated with the slot 42315.
Illustratively, the upper body 42311, intermediate housing 42312, and lower body 42313 are integrally formed. The lower pipe body 42313 is favorable for plastic package materials to fall into the plastic package die 120 from the accommodating space 42314 through the communicating space 42316, and can realize accurate blanking and blanking in a vertical placement state.
As shown in fig. 4, the length of the lower tube body 42313 is greater than the length of the upper tube body 42311.
Illustratively, because the second clamping assembly 424 is disposed on the lower surface of the clamping base 422, the design of the lower tubular body portion 42313 is advantageous in avoiding interference of the second clamping assembly 424.
Fig. 5 is a schematic view of the second gripper assembly 424 of fig. 2 in an angled configuration.
As shown in fig. 5, the second clamping assembly 424 includes a clamping motor 4241, a connecting rod 4242 and a clamping claw 4243, wherein the clamping motor 4241 is disposed on the clamping base 422, the clamping motor 4241 has two output ends, the connecting rod 4242 has two output ends and is respectively connected to one output end of the clamping motor 4241, and the clamping claw 4243 has a plurality of clamping claws and is distributed on the connecting rod 4242 at intervals.
Illustratively, the number of the connecting rods 4242 is two, the number of the clamping claws 4243 is four, the two clamping claws 4243 are arranged on one connecting rod 4242 at intervals, the two connecting rods 4242 are arranged oppositely, and the clamping claws 4243 on the connecting rod 4242 are arranged oppositely, so that one second clamping assembly 424 can clamp one package frame. When in use, the clamping motor 4241 drives the connecting rods 4242 to move, so that the two connecting rods 4242 move in opposite directions or back directions, and further the edge of the packaging frame is clamped.
Fig. 6 is a schematic view of the molding compound feeding apparatus 300 in fig. 1 at an angle.
As shown in fig. 6, the plastic package feeding device 300 includes a lifting cylinder 310, a lifting seat 320, a transition wobble plate 330, a lifting cylinder 340, a lifting seat 350 and a lifting rod 360, wherein the lifting cylinder 310 is disposed on the machine 100 along a third direction, the lifting seat 320 is connected with an output end of the lifting cylinder 310, the transition wobble plate 330 is disposed on the lifting seat 320 at intervals, the transition wobble plate 330 is provided with a plurality of protrusions 331, the transition wobble plate 330 is provided with a perforation 332, the perforation 332 penetrates through an upper surface of the protrusions 331 and a lower surface of the transition wobble plate 330, the lifting cylinder 340 is disposed on the lifting seat 320 along the third direction, the lifting seat 350 is disposed on an output end of the lifting cylinder 340, the lifting rod 360 is provided with a plurality of lifting rods and is disposed on the lifting seat 350, and an end of the lifting rod 360 is disposed in the perforation 332.
Illustratively, the molding compound is pre-received in the perforations 332 of the transition wobble plate 330 and supported by the carrier rods 360. When plastic package material is fed, the lifting cylinder 310 drives the lifting seat 320 to lift, the transition wobble plate 330, the ejection cylinder 340, the ejection seat 350 and the ejector rod 360 lift along with each other, and the transition wobble plate is close to the clamping mechanism 420. The ejector cylinder 340 drives the ejector base 350 to rise, so that the ejector rod 360 ejects the plastic molding compound and enters the accommodating base 4231 of the clamping mechanism 420 to be accommodated.
Fig. 7 is a schematic view of the mold stripping mechanism 520 in fig. 1 in an angle.
As shown in fig. 7, the photoresist stripping mechanism 520 includes a mounting seat 521, a lower air cylinder 522, a lower mounting plate 523, photoresist stripping cutters 524 and a lower pressing plate 525, wherein the mounting seat 521 is disposed on the machine 100, the lower air cylinder 522 is disposed on the mounting seat 521, the lower mounting plate 523 is connected with an output end of the lower air cylinder 522, the lower pressing plate 525 is disposed on the lower mounting plate 523, the photoresist stripping cutters 524 are plural and are disposed on the lower mounting plate 523 at intervals, and the photoresist stripping cutters 524 are disposed in the lower pressing plate 525 in a penetrating manner.
Illustratively, when the lower photoresist mold platform 510 moves below the lower photoresist mold mechanism 520, the lower pressure cylinder 522 drives the lower moving mounting plate 523 to move toward the lower photoresist mold platform 510, and the lower pressure plate 525 and the photoresist cutter 524 follow the movement, so that the lower pressure plate 525 contacts with the package frame on the lower photoresist mold platform 510. The downward moving mounting plate 523 is continuously moved downward by driving, and the lower pressing plate 525 is moved upward with respect to the downward moving mounting plate 523, at this time, the photoresist removing cutter 524 passes through the lower pressing plate 525 and cuts off the photoresist in the slot of the package frame.
As shown in fig. 7, a surface of the lower platen 525 facing away from the downward moving mounting plate 523 is provided with a convex strip, and the convex strip is disposed along the first direction. Through setting up the sand grip, sticis the encapsulation frame, avoids when the photoresist stripping process, and the encapsulation frame takes place to shift.
In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
The above is merely a preferred embodiment of the present application, and is not intended to limit the present application in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present application or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, all equivalent changes according to the shape, structure and principle of the present application are covered in the protection scope of the present application.
Claims (10)
1. An automatic packaging machine for a semiconductor package frame, comprising:
The machine is provided with a support frame, and one side of the machine is provided with a plastic package die;
the packaging frame feeding device is arranged on the machine table and is used for providing a packaging frame;
the plastic package material feeding device is arranged on the machine table and is used for providing plastic package materials;
the transfer device comprises a first linear module, a transfer platform and a clamping mechanism, wherein the first linear module is arranged on the support frame along a second direction, the transfer platform is connected with the output end of the first linear module, the clamping mechanism is movably arranged on the transfer platform, and the clamping mechanism is configured to clamp the packaging frame and the plastic packaging material at the same time and transfer the packaging frame and the plastic packaging material into a plastic packaging mold for plastic packaging; the clamping mechanism is further configured to be capable of taking out the packaging frame which is subjected to plastic packaging from the plastic packaging die;
The photoresist removing device comprises a second linear module, a photoresist removing lower die platform and a photoresist removing die mechanism, wherein the second linear module is arranged on the machine table along a first direction, the photoresist removing lower die platform is connected with the output end of the second linear module, the photoresist removing die mechanism is arranged above the second linear module, and the photoresist removing die mechanism is configured to perform photoresist removing operation on a hole site on a packaging frame subjected to plastic packaging; and
And the blanking manipulator is arranged on one side of the second linear module and is configured to perform blanking on the packaging frame with the photoresist removing operation completed.
2. The automated packaging machine for semiconductor package frames according to claim 1, wherein said transfer device further comprises a cleaning mechanism, said cleaning mechanism being located at a side of said gripping mechanism adjacent to said plastic packaging mold.
3. The automatic packaging machine for semiconductor package frames according to claim 1, wherein said clamping mechanism comprises a lifting assembly, a clamping base, a first clamping assembly and a second clamping assembly, said lifting assembly is disposed in said transfer platform, said clamping base is connected with said lifting assembly, and said first clamping assembly and said second clamping assembly are respectively disposed on said clamping base.
4. The automatic packaging machine for semiconductor package frames according to claim 3, wherein said first clamping assembly comprises a plurality of holding seats, holding cylinders, a connecting plate and a contact insert, said holding seats are provided with a plurality of holding spaces and slots, said holding seats are provided with said holding spaces and slots, said holding spaces are arranged along a third direction, said holding cylinders are provided on said holding seats, said connecting plate is connected with the output ends of said holding cylinders, said contact insert is provided with a plurality of contact inserts, said contact insert is provided with said connecting plate, the end of said contact insert is inserted into said slots, and said contact insert is configured to close said holding spaces.
5. The automatic packaging machine for semiconductor package frames according to claim 4, wherein said housing seat comprises an upper tube body portion, a middle seat body and a lower tube body portion which are sequentially connected from top to bottom, said upper tube body portion, said middle seat body and said lower tube body portion are communicated with each other, said upper tube body portion and said lower tube body portion are hollow cylindrical, said housing space penetrates said upper tube body portion along a third direction, said slot penetrates said middle seat body along a second direction, and said lower tube body portion is provided with a communication space communicated with said slot along a third direction.
6. The automated packaging machine for semiconductor packages according to claim 5, wherein the length of the lower tube portion is greater than the length of the upper tube portion.
7. The automatic packaging machine for semiconductor package frames according to claim 3, wherein said second clamping assembly comprises a clamping motor, a connecting rod and clamping claws, said clamping motor is arranged on said clamping base, said clamping motor has two output ends, said connecting rod has two output ends and is respectively connected to one output end of said clamping motor, and said clamping claws have a plurality of and are distributed on said connecting rod at intervals.
8. The automatic packaging machine for semiconductor package frames according to claim 1, wherein said plastic package material feeding device comprises a lifting cylinder, a lifting seat, a transition wobble plate, a material ejection cylinder, a material ejection seat and a top rod, said lifting cylinder is arranged on said machine table along a third direction, said lifting seat is connected with the output end of said lifting cylinder, said transition wobble plate is arranged on said lifting seat at intervals, said transition wobble plate is provided with a plurality of bumps, said transition wobble plate is provided with perforations, said perforations penetrate the upper surface of said bumps and the lower surface of said transition wobble plate, said material ejection cylinder is arranged on said lifting seat along a third direction, said material ejection seat is arranged on the output end of said material ejection cylinder, said top rod is provided with a plurality of top rods and is arranged on said material ejection seat, and the end of said top rod is arranged in said perforations.
9. The automatic packaging machine for semiconductor package frames according to claim 1, wherein said photoresist removing mold mechanism comprises a mounting seat, a lower air cylinder, a lower mounting plate, photoresist removing cutters and a lower pressing plate, said mounting seat is arranged on said machine table, said lower air cylinder is arranged on said mounting seat, said lower mounting plate is connected with the output end of said lower air cylinder, said lower pressing plate is arranged on said lower mounting plate, said photoresist removing cutters are arranged on said lower mounting plate in a plurality of intervals, and said photoresist removing cutters are arranged in said lower pressing plate in a penetrating manner.
10. The automated packaging machine for semiconductor packages according to claim 9, wherein a surface of the hold-down plate facing away from the downset mounting plate is provided with a ridge, the ridge being disposed along a first direction.
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| CN202410509536.XA CN118507386B (en) | 2024-04-26 | 2024-04-26 | Automatic packaging machine for semiconductor packaging frame |
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| CN202410509536.XA CN118507386B (en) | 2024-04-26 | 2024-04-26 | Automatic packaging machine for semiconductor packaging frame |
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