CN118431132B

CN118431132B - Wafer temporary storage device and wafer cleaning method

Info

Publication number: CN118431132B
Application number: CN202410893700.1A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Jiangsu Yuanfu Semiconductor Technology Co ltd
Current assignee: Jiangsu Yuanfu Semiconductor Technology Co ltd
Filing date: 2024-07-04
Publication date: 2024-11-12
Anticipated expiration: 2044-07-04

Abstract

The invention discloses a wafer temporary storage device and a wafer cleaning method, wherein the wafer temporary storage device comprises: the box, the box includes: the case main part and door subassembly, case main part are formed with the chamber of keeping in and first access & exit, and door subassembly includes: the door frame is fixedly and hermetically connected with the box main body, the door body is arranged on one side of the door frame facing the box main body, and the driving mechanism is connected with the door body; the liquid spraying mechanism is arranged on the box body and provided with a first spray hole arranged towards the wafer, and the leakage-proof structure is configured to guide liquid in a gap between the door assembly and the box body back to the temporary storage cavity. According to the temporary wafer storage device, the polishing liquid remained on the surface of the wafer can be washed away, crystallization of the polishing liquid on the surface of the wafer is reduced, the surface of the wafer is kept in a wet state, the leakage-proof structure can guide liquid in a gap between the door assembly and the box body back to the temporary storage cavity, the liquid is prevented from flowing to the outer side of the box body through the gap between the door assembly and the box body, and the sealing leakage-proof performance of the box body is improved.

Description

Wafer temporary storage device and wafer cleaning method

Technical Field

The present invention relates to the field of semiconductor technology, and in particular, to a wafer temporary storage device and a wafer cleaning method.

Background

After the wafer is subjected to a chemical mechanical polishing process, polishing liquid remains on the surface, and pollutants such as particles are removed. At present, chemical mechanical polishing equipment in the market adopts a dry-in and dry-out mode, and a wafer needs to be transferred from a grinding area to a cleaning area for cleaning after the polishing process is finished. The cleaning process typically includes a plurality of cleaning steps, each step being designed differently for a different polishing process, and the corresponding cleaning times also being different.

In order to improve the wafer transmission efficiency, a temporary storage station is generally arranged at the input end of the cleaning system and is used for receiving the polluted wafer transferred from the grinding area, and when the first cleaning station is idle, the wafer in the temporary storage station is transmitted to start the cleaning process.

The wafer surface in the temporary storage station remains certain polishing liquid, the wafer can be dried in the waiting cleaning process, crystals which are difficult to clean are generated, the edge part of the wafer is particularly serious, the hardness of the crystals is higher, the service life of a brush used for subsequent brushing is greatly influenced, the wafer surface is easily scratched, the polishing liquid is corrosive, and cleaning liquid mixed with the polishing liquid is required to be collected and processed in the cleaning process.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention aims to provide a wafer temporary storage device which can remarkably reduce crystallization of polishing liquid on the surface of a wafer and can prevent liquid in a temporary storage cavity from leaking.

The invention also provides a wafer cleaning method applied to the wafer temporary storage device.

The wafer temporary storage device according to the first aspect of the invention comprises: the box, the box includes: the wafer temporary storage device comprises a box main body and a door assembly, wherein the box main body is used for limiting a temporary storage cavity for temporarily storing wafers, a first access opening communicated with the temporary storage cavity is formed in one side of the box main body in a first direction, and the door assembly is connected with the box main body and used for opening and closing the first access opening; the liquid spraying mechanism is arranged on the box body and is provided with a first spray hole, and the first spray hole is arranged towards the wafer and is used for spraying the surface of the wafer; a leak-proof structure provided on the tank body and/or the door assembly, the leak-proof structure configured to guide liquid in a gap between the door assembly and the tank body back to the temporary storage chamber; the door assembly includes: the door frame is fixedly and hermetically connected with the box main body, and the door body is movably arranged on the door frame to open and close the first access opening; the driving mechanism is connected with the door body and used for driving the door body to move between an opening position and a closing position along a second direction relative to the door frame, and the second direction is perpendicular to the first direction; the door body is arranged on one side of the door frame, which faces the box main body, a second access opening is formed in the door frame, when the door body is in an open position, the first access opening is opposite to and communicated with the second access opening, and when the door body is in a closed position, the door body is blocked between the first access opening and the second access opening.

According to the temporary wafer storage device, the liquid spraying mechanism is arranged in the box body, and the liquid spraying mechanism is used for spraying the two side surfaces of the wafer in the thickness direction, so that most of the residual polishing liquid on the surface of the wafer can be washed away, the surface of the wafer is always in a moisture-preserving state, and the residual polishing liquid on the surface of the wafer is also in a moisture-preserving environment, so that crystallization of the polishing liquid on the surface of the wafer can be remarkably reduced. Simultaneously, through setting up leak protection structure, leak protection structure can be with the liquid guide back temporary storage chamber in the clearance between door subassembly and the case main part, avoids liquid to permeate the outside of box through the clearance position between door subassembly and the case main part to can promote the sealed leak protection performance of box, make things convenient for follow-up to concentrate to collect and handle the liquid in the box.

In some embodiments, a concave receiving groove is formed in a side of the door frame facing the box main body, the door body is disposed in the receiving groove, and the second inlet and outlet are formed in a bottom wall of the receiving groove.

In some embodiments, the door assembly further comprises: the rolling piece is rotatably arranged on the door body around an axis extending along a third direction, the rolling piece is respectively in rolling fit with the peripheral edge of the first access opening and the bottom wall of the accommodating groove, and the third direction is perpendicular to the first direction and the second direction.

In some embodiments, the rolling element is a bearing, a boss is formed on an end face of one end of the door body in the third direction, and an inner ring of the bearing is fixed on the boss.

In some embodiments, the door assembly further comprises: and a number of magnetic switches, two of which are configured to be triggered when the door body is in an open position and a closed position, respectively.

In some embodiments, the drive mechanism is provided on a side of the door frame facing away from the case body, and the door assembly further includes: the connecting seat, the one end of connecting seat with actuating mechanism links to each other, and the other end passes the second access & exit with the door body links to each other.

In some embodiments, the door assembly further comprises: the water pan is arranged on one side, deviating from the box main body, of the door frame and is arranged below the second access opening.

In some embodiments, the leakage preventing structure includes a water blocking groove formed at both side walls of the door body in the second direction, the water blocking groove extending in the third direction and penetrating through both ends of the door body in the third direction.

In some embodiments, the leak-proof structure comprises: and a return passage formed on the tank main body and communicating with the temporary storage chamber, the return passage being disposed at a lower side of the first inlet and outlet and penetrating through the tank main body in a first direction.

In some embodiments, the return channel extends in a second direction, and in the second direction, the return channel has a width that is greater than a width of the first inlet and outlet.

In some embodiments, the case body has a detection port formed therein, the case further comprising: the transparent plate, the transparent plate closing cap the detection mouth, wafer temporary storage device still includes: the detection mechanism is arranged at the position of the detection port and positioned at the outer side of the box body and is used for detecting whether a wafer exists in the temporary storage cavity or not, and the detection mechanism is in communication connection with the liquid spraying mechanism.

In some embodiments, the wafer temporary storage device further comprises: the liquid level sensor is used for detecting the liquid level in the temporary storage cavity and is in communication connection with the liquid spraying mechanism.

The wafer cleaning method according to the second aspect of the present invention is applied to the wafer temporary storage device according to the first aspect of the present invention, and the wafer cleaning method includes: s1, confirming that a wafer is stored in the temporary storage cavity and that the door body is at a closed position; s2, driving the wafer to rotate, and starting a liquid spraying mechanism to spray the wafer; s3, confirming that an instruction for taking out the wafer is received, stopping rotating the wafer, and stopping the liquid spraying mechanism.

According to the wafer cleaning method, the wafer is firstly confirmed to be placed in the temporary storage cavity and the door body is confirmed to be closed, then the liquid spraying mechanism is started to spray the wafer and drive the wafer to rotate, and the rotation and the spraying of the wafer are stopped until the taking-out instruction is received, so that the wafer is always sprayed in the whole temporary storage process of the wafer, polishing liquid on the wafer can be washed and removed, the wafer is kept moist, and the crystallization of the polishing liquid on the surface of the wafer is remarkably reduced or avoided.

In some embodiments, step S1 comprises: s11, detecting whether a wafer exists in the temporary storage cavity; if not, executing S12, and if so, executing S13; s12, confirming that the door body is opened, and placing the wafer; s13, closing the door body.

In some embodiments, after step S2, the wafer cleaning method further includes: and detecting the liquid level in the temporary storage cavity, and stopping spraying the wafer if the liquid level is greater than or equal to the preset height.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a schematic view of an angle of a wafer temporary storage device according to an embodiment of the invention;

FIG. 2 is a schematic view of the wafer temporary storage device of FIG. 1 at another angle;

FIG. 3 is a schematic view of a wafer temporary storage device according to another embodiment of the present invention;

FIG. 4 is a schematic view of a wafer temporary storage device according to another embodiment of the present invention;

FIG. 5 is a cross-sectional view of a wafer temporary storage device according to an embodiment of the invention;

FIG. 6 is an exploded view of a wafer temporary storage device according to an embodiment of the present invention;

FIG. 7 is an exploded view of a door assembly of a wafer temporary storage device according to an embodiment of the present invention;

fig. 8 is a cross-sectional view of a door assembly of a wafer temporary storage device according to an embodiment of the present invention.

Reference numerals:

100. a wafer temporary storage device;

10. A case; 101. a temporary storage cavity; 102. a liquid outlet;

11. a box main body; 111. a first access opening; 112. a return passage;

12. A door assembly;

121. a door frame; 1211. a second access opening; 1212. a receiving groove;

122. A door body; 1221. a boss; 1222. a water-break tank;

123. A driving mechanism; 1231. a magnetic switch; 1232. a speed regulating joint; 1233. a cylinder;

124. a rolling member; 125. a connecting seat; 126. a water receiving tray; 127. a locking screw; 128. fastening a screw;

13. A transparent plate; 14. a seal ring;

20. A liquid spraying mechanism; 21. a spray bar assembly;

211. a spray bar; 212. a first nozzle; 213. a first liquid inlet pipe; 214. a mounting base; 215. an angle indication mark;

216. A first cabin penetrating joint; 217. a first lock nut;

22. a second liquid inlet pipe; 23. a second nozzle; 24. the second cabin penetrating joint; 25. a second lock nut;

30. A filter; 40. a drive assembly; 41. a driving wheel; 42. a support; 43. a driving member;

50. A detection mechanism; 60. an exhaust pipe; 70. a liquid discharge pipe; 80. a liquid level sensor; 90. a fixing seat;

200. and (3) a wafer.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.

Referring to fig. 1-8, a wafer temporary storage device 100 according to an embodiment of the invention is described.

As shown in fig. 1 to 3, a wafer temporary storage device 100 according to an embodiment of the invention includes: a box body 10a liquid spraying mechanism 20 and a leak-proof structure.

Specifically, the case 10 includes: the box body 11 defines a temporary storage chamber 101 for placing the wafer 200, and the box body 11 is formed with a first access port 111 communicating with the temporary storage chamber 101 at one side (e.g., the front side of the box body 11 shown in fig. 2) in a first direction (e.g., the front-rear direction shown in fig. 1) and a door assembly 12 connected to the box body 11 for opening and closing the first access port 111.

The liquid spraying mechanism 20 is disposed on the case 10, and the liquid spraying mechanism 20 has a first spraying hole configured to be disposed toward the wafer 200 for spraying the surface of the wafer 200. The first spray hole is configured to spray a water curtain with a preset shape, and the shape of the water curtain can be set according to actual needs, for example, the shape of the water curtain can be linear, conical or fan-shaped, etc.

When a wafer needs to be placed, the first inlet and outlet 111 can be opened through the door assembly 12, so that the wafer passes through the first inlet and outlet 111 and is placed in the temporary storage cavity 101, and then the door assembly 12 is closed, so that the first inlet and outlet 111 is closed, and at this time, the liquid spraying mechanism 20 can spray liquid to the wafer. When the wafer needs to be taken out, the liquid spraying mechanism 20 is stopped, the door assembly 12 is opened to open the first inlet and outlet 111, and the wafer is taken out. By providing the door assembly 12, the first access opening 111 can be conveniently opened and closed, which is beneficial to sealing the temporary storage cavity 101 when the wafer is washed, reducing leakage of liquid, and facilitating the taking out of the wafer from the storage box.

For example, after the wafer 200 is processed (such as polished), the wafer 200 may be placed in the temporary storage cavity 101, after the wafer 200 is placed in the temporary storage cavity 101, the box 10 is closed, and the liquid spraying mechanism 20 may spray liquid (such as deionized water) toward two side surfaces of the wafer 200 through the first spray hole, so as to flush residual polishing liquid on the two side surfaces of the wafer 200, thereby flushing most of the residual polishing liquid on the surface of the wafer 200, keeping the surface of the wafer in a moisture state all the time, and keeping the residual polishing liquid on the surface of the wafer 200 in a moisture environment, so that crystallization of the polishing liquid on the surface of the wafer 200 can be significantly reduced, and scratch of the surface of the wafer in a subsequent process is avoided.

A leakage preventing structure is provided on the tank main body 11 and/or the door assembly 12, and the leakage preventing structure is configured to guide the liquid in the gap between the door assembly 12 and the tank main body 11 back to the temporary storage chamber 101.

That is, the leakage preventing structure may be provided only on the box body 11, only on the door assembly 12, or both on the box body 11 and the door assembly 12.

When the liquid spraying mechanism 20 sprays the wafer 200, the liquid may splash on the inner wall of the temporary storage chamber 101 and may splash on the door assembly 12, and the liquid splashed on the inner surface of the door assembly 12 may flow downward and enter the gap between the door assembly 12 and the box body 11 due to gravity, and may leak to the outside of the box body 10 from the gap position when the liquid gathers.

This embodiment is through setting up leak protection structure, when liquid enters into the clearance between case main part 11 and the door module 12, can be through leak protection structure with liquid direction and backward flow to the chamber 101 of keeping in, avoid liquid gathering in the clearance, effectively avoid liquid to permeate the outside of box 10 through the clearance, promote the sealed leak protection performance of box, make things convenient for follow-up to concentrate to collect and handle the liquid in the box.

As shown in fig. 6 and 7, the door assembly 12 may include: a door frame 121 and a door body 122, the door frame 121 is fixedly and hermetically connected with the case body 11, and the door body 122 is movably provided on the door frame 121 to open and close the first doorway 111.

The door 122 may be rotatably provided on the door frame 121 to open and close the first doorway 111, and the door 122 may be movably provided on the door frame 121 to open and close the first doorway 111.

Further, the door frame 121 and the box body 11 may be connected by a fastener, a plurality of first connection holes may be provided on the door frame 121, a plurality of second connection holes may be provided on the box body 11, the plurality of first connection holes and the plurality of second connection holes may be in one-to-one correspondence, and all arranged at intervals along the circumference of the first access opening 111, and the door frame 121 is fixed to the box body 11 by passing through the first connection holes and the second connection holes by the fastener. Further, a seal ring 14 is further provided between the door frame 121 and the box body 11, the seal ring 14 extends in a ring shape along the circumferential direction of the door frame 121 and the circumferential direction of the first inlet/outlet 111, and in the first direction, the seal ring 14 is in sealing contact between the door frame 121 and the box body 11.

In the above technical solution, the door frame 121 may be conveniently fixedly connected with the case body 11, so that the connection structure between the case body 11 and the door assembly 12 is simplified, and the first access opening 111 may be conveniently opened and closed by movably disposing the door body 122 on the door frame 121.

As shown in fig. 7, the door assembly 12 may further include: and a driving mechanism 123, the driving mechanism 123 being connected to the door body 122 for driving the door body 122 to move between the open position and the closed position with respect to the door frame 121 in a second direction (e.g., a left-right direction in fig. 1), the second direction being perpendicular to the first direction.

The driving mechanism 123 may be a driving motor or a driving cylinder 1233. In the open position, the door 122 is completely staggered from the first inlet and outlet 111 in the left-right direction, so that the first inlet and outlet 111 is exposed, and wafers can be conveniently taken and placed, and in the closed position, the door 122 is opposite to the first inlet and outlet 111 in the front-back direction, so that the first inlet and outlet 111 is completely blocked, and liquid in the temporary storage cavity 101 is prevented from leaking out of the first inlet and outlet 111.

In the above technical solution, by providing the driving mechanism 123 for driving the door 122 to move, the door 122 can be automatically opened and closed, so as to realize the automatic control of the temporary wafer storage device 100.

As shown in fig. 6, the door 122 is disposed on a side of the door frame 121 facing the main case 11, and a second inlet 1211 is formed in the door frame 121, and when the door 122 is in the open position, the first inlet 111 and the second inlet 1211 are opposite and communicate, and when the door 122 is in the closed position, the door 122 is blocked between the first inlet 111 and the second inlet 1211.

In the above technical solution, by disposing the door 122 between the door frame 121 and the box body 11, when the door 122 is in the closed position for closing the first access opening 111, the door 122 can be stopped between the door frame 121 and the box body 11, so as to improve the sealing performance and reduce the probability of leakage of the liquid in the temporary storage cavity 101.

According to the wafer temporary storage device 100 of the embodiment of the invention, by arranging the liquid spraying mechanism 20 in the box 10 and spraying the surface of the wafer 200 by using the liquid spraying mechanism 20, most of the residual polishing liquid on the surface of the wafer can be washed away, the surface of the wafer can be always in a moisturizing state, and the residual polishing liquid on the wafer can be in a moisturizing environment, so that crystallization of the polishing liquid on the surface of the wafer can be remarkably reduced. Meanwhile, by arranging the leakage-proof structure, the leakage-proof structure can guide liquid in a gap between the door assembly 12 and the box main body 11 back to the temporary storage cavity 101, so that the liquid is prevented from penetrating to the outer side of the box body through the gap between the door assembly 12 and the box main body 11, the sealing leakage-proof performance of the box body 10 can be improved, and the subsequent centralized collection and treatment of the liquid in the box body are facilitated. In addition, by disposing the door 122 between the door frame 121 and the tank main body 11, the sealing performance of the door assembly to the tank main body can be improved, and the probability of leakage of the liquid in the temporary storage chamber 101 can be reduced.

In one embodiment of the present invention, as shown in fig. 8 in combination with fig. 6, a recessed receiving groove 1212 is provided at a side of the door frame 121 facing the tank main body 11, the door 122 is provided in the receiving groove 1212, and the second inlet 1211 is formed at a bottom wall of the receiving groove 1212.

The door 122 is arranged in the accommodating groove 1212, two side walls of the accommodating groove 1212 in the left-right direction can play a role in limiting the movement of the door 122 in the left-right direction, the movement distance of the door 122 in the left-right direction is limited, and meanwhile, the door 122 is arranged in the accommodating groove 1212 of the door frame 121, so that the thickness of the door assembly 12 in the front-rear direction can be reduced, and the space occupation is reduced. Forming the second inlet 1211 in the accommodation groove 1212 facilitates the door 122 to completely close the first inlet 111 and the second inlet 1211 when in the closed position.

In the above technical solution, the door body 122 is disposed in the accommodating groove 1212 of the door frame 121, so that the accommodating groove 1212 can limit the door body 122, and the thickness of the door assembly 12 can be reduced, thereby reducing the space occupation.

In one embodiment of the present invention, as shown in fig. 7 and 8, the door assembly 12 may further include: at least one rolling member 124, the rolling member 124 is rotatably disposed on the door 122 around an axis extending along a third direction, and the rolling member 124 is respectively in rolling engagement with the peripheral edge of the first access opening 111 and the bottom wall of the accommodation groove 1212, and the third direction is perpendicular to the first direction and the second direction.

The door assembly 12 may include one, two, three, four, and more than a number of rollers 124.

In the above technical solution, by providing the rolling member 124, when the door 122 moves in the left-right direction relative to the door frame 121, the rolling member 124 can be respectively engaged with the door frame 121 and the box body 11 in a rolling manner, and can roll in the left-right direction relative to the door frame 121 and the box body 11, so as to guide the movement of the door 122, and improve the stability of the door 122 during the opening and closing process.

In one embodiment of the present invention, referring to fig. 7, the rolling member 124 may be a bearing, an end surface of one end of the door 122 in a third direction (e.g., up-down direction shown in fig. 7) is formed with a boss 1221 (e.g., a lower end surface of the door 122 shown in fig. 7), and an inner ring of the bearing is fixed to the boss 1221.

For example, two bosses 1221 are disposed on the lower end surface of the door body 122, the two bosses 1221 are arranged at left and right intervals, the rolling element 124 is a bearing, the inner ring of the bearing is fixed on the door body 122 through a locking screw 127 and a fastening screw 128, specifically, the locking screw 127 penetrates through the inner ring of the bearing and stretches into a locking hole on the door body 122, a fastening hole which is communicated with the locking hole and vertical to the locking hole is further formed on the door body 122, and a fastening screw penetrates through the locking hole and is connected with the locking screw 127, so that the bearing is fixed on the door body 122, and the reliability of the fixing of the bearing and the door body 122 is improved.

In the above technical solution, by providing the boss 1221, the boss 1221 can space the bearing from the lower end surface of the door 122, so as to avoid interference between the bearing and the lower end surface of the door 122 during rotation, and ensure that the bearing can rotate smoothly.

According to some embodiments of the invention, the door assembly 12 further comprises: the number of magnetic switches 1231 is two, the two magnetic switches 1231 being configured to be triggered when the door 122 is in the open position and the closed position, respectively. That is, one of the magnetic switches 1231 is activated when the door 122 is in the open position and the other magnetic switch 1231 is activated when the door 122 is in the closed position.

For example, when the door 122 is in the open position, one of the magnetic switches 1231 may turn on a signal and may feed back the signal to the control system of the wafer temporary storage device, which may confirm that the door 122 is in the open position. When the door 122 is in the closed position, the other magnetic switch 1231 may turn on a signal and may feed back the signal to the control system, which may then confirm that the door 122 is in the closed position. Therefore, the position of the door 122 can be conveniently monitored, and the structure is simple.

In one embodiment of the present invention, as shown in fig. 6, the driving mechanism 123 is provided at a side of the door frame 121 facing away from the case body 11, and the door assembly 12 further includes: and a connection base 125, one end of the connection base 125 is connected to the driving mechanism 123, and the other end is connected to the door 122 through the second inlet 1211.

In the above technical solution, by arranging the connecting seat 125, when the driving mechanism 123 is started, the driving mechanism 123 can drive the connecting seat 125 to move left and right, and drive the door 122 to move left and right through the connecting seat 125. Thereby, the connection between the driving mechanism 123 and the door 122 can be conveniently achieved. In addition, by disposing the driving mechanism 123 on the side of the door frame 121 facing away from the box body 11, it is possible to avoid the driving mechanism 123 occupying the space of the door frame 121 facing the box body 11 side, and the structural layout is more reasonable.

In one embodiment of the present invention, as shown in FIG. 6, the door assembly 12 may further include: a water receiving tray 126, the water receiving tray 126 being disposed at a side of the door frame 121 facing away from the case body 11 and below the second inlet 1211.

Further, the water tray 126 may be detachably connected to the door frame 121, for example, the water tray 126 may be connected to the door frame 121 by a fastener, wherein a sealing member may be provided at a connection position of the water tray 126 to the door frame 121 for sealing a gap between the water tray 126 and the door frame 121.

In the above technical solution, the water tray 126 can receive the liquid dropped when the wafer is placed in the temporary storage cavity 101 or the temporary storage cavity 101 is taken out, so as to prevent the liquid from dropping on the ground outside the box 10, and ensure the sanitation and hygiene of the periphery of the temporary storage device 100.

In one embodiment of the present invention, referring to fig. 7, the leakage preventing structure includes a water cutoff groove 1222, the water cutoff groove 1222 being formed at both side walls of the door body 122 in the second direction, the water cutoff groove 1222 extending in the third direction and penetrating both ends of the door body 122 in the third direction.

In the above-mentioned technical solution, by providing the water break tank 1222, when the liquid in the temporary storage chamber 101 splashes onto the door 122 and flows from the surface of the door 122 facing the temporary storage chamber 101 to the sides of the left and right sides of the door 122, the liquid flows forward into the water break tank 1222 in the direction from the inside of the door 122 to the outside of the door 122, i.e., in the direction from the back to the front, and flows downward along the water break tank 1222 without flowing to the front side of the water break tank 1222, so that the liquid can be prevented from flowing to the front side of the door 122 through the sides of the left and right sides of the door 122, and the probability of leakage of the liquid from the sides of the door 122 can be reduced.

In one embodiment of the present invention, referring to fig. 6, the leakage preventing structure includes a return passage 112 formed on the tank body 11 and communicating with the temporary storage chamber 101, the return passage 112 being disposed at a lower side of the first inlet/outlet 111 and penetrating the tank body 11 in the first direction.

Wherein, the backflow channel 112 is arranged on the inner side of the sealing ring 14 between the door frame 121 and the tank main body 11, that is, between the sealing ring 14 and the lower edge of the first inlet and outlet 111, when the water in the temporary storage cavity 101 splashes to the inner side surface of the door 122, the water flows downwards under the action of gravity and flows to the sealing ring 14 position on the lower side of the door 122, and is collected at the sealing ring 14 position, at this time, since the backflow channel 112 is arranged on the upper side of the sealing ring 14, the collected liquid can flow back into the temporary storage cavity 101 through the backflow channel 112, thereby avoiding the large collection of the liquid at the sealing ring 14 position on the lower side of the first inlet and outlet 111, avoiding the failure of the sealing ring 14 and ensuring the sealing performance.

In the above technical solution, by arranging the backflow channel 112 at the lower edge of the first inlet and outlet 111, the liquid converged to the lower side of the first inlet and outlet 111 can flow back into the temporary storage cavity 101 through the backflow channel 112, so as to avoid the liquid dropping from the door 122 from gathering at the position of the sealing ring 14, and ensure the sealing reliability of the sealing ring 14.

In one embodiment of the present invention, the return channel 112 extends in the second direction, and in the second direction, the width of the return channel 112 is greater than the width of the first inlet 111. That is, both ends of the return passage 112 in the second direction extend beyond both ends of the first inlet and outlet 111 in the second direction, respectively. Thereby, the covering length of the return passage 112 in the second direction can be increased, which is advantageous in that the liquid in the gap between the tank main body 11 and the door 122 can be more timely returned into the temporary storage chamber 101 through the return passage 112.

In one embodiment of the present invention, the case 10 further includes: the transparent plate 13 is formed with a detection port on the box body 11, the transparent plate 13 covers the detection port, and the wafer temporary storage device 100 further includes: the detecting mechanism 50 is arranged at the position of the detecting opening and positioned at the outer side of the box body 10 and is used for detecting whether a wafer exists in the temporary storage cavity 101, and the detecting mechanism 50 is in communication connection with the liquid spraying mechanism 20.

A sealing ring can be arranged between the transparent plate 13 and the peripheral edge of the detection opening, and extends into a ring shape along the peripheral direction of the detection opening for sealing a gap between the transparent plate 13 and the peripheral edge of the detection opening.

The detecting mechanism 50 may include a sensor, where the sensor includes a transmitting end and a receiving end, the transmitting end is used to send a signal, for example, to transmit visible light or a laser lamp, and the receiving end is used to receive the signal sent by the transmitting end, where the transmitting end and the receiving end may be disposed on opposite sides of the box 10 and located on opposite sides of a wafer, respectively, where when there is a wafer in the temporary storage cavity 101, the receiving end cannot receive the signal due to the blocking effect of the wafer, and when there is no wafer in the temporary storage cavity 101, the receiving end can receive the signal.

In other embodiments, the sensor of the detecting mechanism 50 may be a reflective sensor, where only one detecting opening and one transparent plate 13 need be provided on the case 10.

In the above technical solution, by setting the detecting mechanism 50, it is convenient to detect whether there is a wafer in the temporary storage cavity 101, and to control the start and close of the liquid spraying mechanism 20 according to whether there is a wafer in the temporary storage cavity 101.

In some embodiments of the present invention, the wafer temporary storage device 100 further includes: the liquid level sensor 80, the liquid level sensor 80 is used for detecting the liquid level in the temporary storage cavity 101, and the liquid level sensor 80 is connected with the liquid spraying mechanism 20 in a communication way.

When the liquid level sensor 80 detects that the liquid level in the temporary storage cavity 101 is higher than the preset level, the liquid level sensor 80 transmits a signal to the controller, and the controller can control the liquid spraying mechanism 20 to stop spraying liquid. Wherein, the preset height is lower than the lower edge of the first inlet and outlet 111 of the box main body 11, so as to avoid the liquid in the temporary storage cavity 101 from leaking from the position of the first inlet and outlet 111. Further, the preset height may be 5mm-10mm lower than the lower edge of the first inlet and outlet 111, so that the liquid storage capacity in the temporary storage cavity 101 may be increased on the premise of avoiding overflow of the liquid from the position of the first inlet and outlet 111.

For example, the liquid level sensor 80 may be disposed on the side where the liquid discharge port 102 is located, and the liquid level sensor 80 may be disposed at a position 5mm to 15mm below the lower edge of the first inlet/outlet port 111.

In the above technical solution, by providing the liquid level sensor 80, the liquid amount in the temporary storage cavity 101 can be detected in real time, so that the liquid in the temporary storage cavity 101 is prevented from overflowing from the first inlet and outlet 111.

According to some embodiments of the present invention, as shown in fig. 3 and 4, the number of the first spray holes is plural, and the plural first spray holes spray both side surfaces of the wafer in the thickness direction, respectively. According to the embodiment, by spraying the two side surfaces of the wafer 200 in the thickness direction at the same time, most of the residual polishing liquid on the surface of the wafer 200 can be further washed away, so that the omnibearing spraying and moisturizing of the surface of the wafer are facilitated, the crystallization of the polishing liquid on the surface of the wafer 200 is remarkably reduced, and the surface of the wafer is prevented from being scratched in the subsequent process.

According to some embodiments of the present invention, as shown in fig. 3 and 4, the spray mechanism 20 includes a spray bar assembly 21, the spray bar assembly 21 including: the device comprises a liquid spraying rod 211, a first nozzle 212 and a first liquid inlet pipe 213, wherein the first nozzle 212 is arranged on the liquid spraying rod 211 and communicated with the liquid spraying rod 211, and a first spray hole is formed on the nozzle; one end of the first liquid inlet pipe 213 is connected to the liquid spray bar 211 and the other end extends out of the tank 10 to be connected to an external liquid supply pipe.

When it is required to spray the surface of the wafer 200, the spray liquid supplied from the outside enters the spray bar 211 through the first liquid inlet pipe 213, then enters the first nozzle 212, and is sprayed to both side surfaces of the wafer through the first nozzle 212.

The liquid spraying rod 211 may be a straight rod, for example, the liquid spraying rod 211 is a straight rod extending along the front-back direction, and a liquid spraying channel is defined in the liquid spraying rod 211.

The first nozzle 212 includes a fixing ring and a nozzle portion, the fixing ring is annular and sleeved on the liquid spraying rod 211, the nozzle portion is connected with the fixing ring and is communicated with the liquid spraying rod 211, the first nozzle hole is formed on the nozzle portion, and the relative position of the nozzle portion in the circumferential direction of the liquid spraying rod 211 is adjustable so as to adjust the spraying angle of the first nozzle hole towards the wafer. Further, the first spray hole of the nozzle part can be conical or fan-shaped, so that the spray force and the spray range of the first spray hole can be improved, the flushing effect and the moisturizing effect on the surface of the wafer are further improved, and the wafer surface is favorably sprayed in all directions.

When wafers 200 with different sizes are placed in the temporary storage cavity 101, the spraying angle of the first nozzle can be adjusted according to the spraying requirements of the wafers 200 with different sizes. The injection angle of the first nozzle can also be adjusted in real time during the spraying process. Therefore, the washing effect and the moisturizing effect on the surface of the wafer can be further improved, the wafer surface is favorably sprayed and moisturized in an all-around manner, and the applicability of the wafer temporary storage device to wafers with different sizes is improved.

Further, a first cabin penetrating connector 216 is provided on the case 10, a first channel communicating the inner side and the outer side of the case 10 is defined on the inner side of the first cabin penetrating connector 216, the first liquid inlet pipe 213 extends into the temporary storage cavity 101 through the first channel, a first lock nut 217 is further sleeved on the first liquid inlet pipe 213, and the first lock nut 217 is fastened with the first cabin penetrating connector 216 to fix the first liquid inlet pipe 213 with the first cabin penetrating connector 216.

In the above technical scheme, the spray lance assembly 21 includes the spray lance 211, first nozzle 212 and first feed liquor pipe 213, first nozzle 212 can spray liquid through spray lance 211 and first feed liquor pipe 213 intercommunication outside, so can simplify the structure of spray lance assembly 21, conveniently spray the wafer, and arrange first nozzle 212 on spray lance 211, can set up the extending direction of spray lance 211 according to actual spraying demand, and arrange quantity and the concrete position of first nozzle 212, improve the spraying effect to wafer both sides surface, be favorable to realizing moisturizing and washing the arbitrary position of wafer surface.

In some embodiments of the present invention, as shown in fig. 4, the number of first nozzles 212 is plural, and the plural nozzles are arranged at intervals along the length direction of the spray bar 211. The number of first nozzles 212 may be one or more, for example, the number of first nozzles 212 may be two, three, four, five, six, eight, or ten or more. Further, three, four, or five first nozzles 212 may be provided on the spray bar 211. The plurality of first nozzles 212 are arranged at intervals along the length direction of the liquid spray bar 211.

In the above technical solution, by arranging the plurality of first nozzles 212 spaced along the length direction of the liquid spraying rod 211, the spraying range of the wafer surface can be increased, the flushing effect and the moisturizing effect of the residual polishing liquid on the wafer are further improved, and the omnibearing spraying and moisturizing of the wafer surface are facilitated.

In some embodiments of the present invention, as shown in fig. 4, the spray bar assembly 21 may further include: the mounting seat 214, the mounting seat 214 is fixed on the inner wall of the box 10, a mounting hole is formed on the mounting seat 214, the spray rod 211 is arranged in the mounting hole in a penetrating manner and is fixed in the mounting hole, and the relative position between the spray rod 211 and the mounting seat 214 is adjustable in the circumferential direction of the mounting hole. For adjusting the installation angle of the spray bar 211, and thus adjusting the spray angle of the first spray hole.

For example, the case 10 has a left side plate and a right side plate arranged opposite to each other in the left-right direction, the mount 214 may be fixed to the left side plate and/or the right side plate of the case 10, and the mount 214 may have a mount hole formed therethrough in the front-rear direction, and the spray lever 211 may extend front-rear and be inserted into the mount hole.

Wherein, mount pad 214 can include fixed block and briquetting, and the fixed block is fixed on box 10, is formed with upward open-ended first recess on the fixed block, and first recess link up the fixed block along the fore-and-aft direction, and the briquetting is arranged in the upside of fixed block, and the briquetting has downward open-ended second recess, and the briquetting is link up along the fore-and-aft direction to the second recess, and the briquetting can be dismantled with the fixed block and be connected, and first recess constitutes the mounting hole with the second recess jointly, and spray bar 211 is adjustable in the installation angle of mounting hole.

In the above technical scheme, through setting up mount pad 214, can conveniently with hydrojet pole 211 and box 10 fixed connection, improve the reliability to hydrojet pole 211 is fixed, simplify hydrojet pole 211's fixed knot constructs to can adjust the injection angle of first nozzle 212 through adjusting hydrojet pole 211 in the mounting hole, increase the injection range of first nozzle, and then improve the flushing efficiency to the polishing solution on wafer surface, reduce the polishing solution and remain. Meanwhile, the washing effect and the moisturizing effect on the surface of the wafer can be further improved, and the wafer surface is favorably sprayed and moisturized in an all-around manner.

It should be noted that, when the sizes of the wafers are different, the installation angle of the spray rod 211 can be adjusted according to the spraying requirements of the wafers with different sizes, and the installation angle of the spray rod can also be adjusted in real time in the spraying process. So as to further improve the flushing effect and the moisturizing effect on the surface of the wafer and realize the omnibearing spraying and moisturizing of the surface of the wafer.

In one embodiment of the present invention, as shown in fig. 4, the mounting base 214 is provided with an angle indication mark 215, and the angle indication mark 215 is provided at a peripheral edge of the mounting hole, for indicating a relative mounting angle of the spray bar 211 and the mounting hole.

For example, the angle indication mark 215 may include a plurality of first score lines uniformly spaced along a circumferential direction of the mounting hole, a plurality of second score lines uniformly spaced along the circumferential direction are also provided on the liquid spraying rod 211, tightness between the clamping block and the fixing block is adjustable, when the spraying angle of the first nozzle 212 needs to be adjusted, the clamping block is loosened, the liquid spraying rod 211 is rotatable in the mounting hole, and the liquid spraying rod 211 is rotated to a predetermined position by observing relative positions of the first score lines and the second score lines, so that the spraying angle of the first nozzle 212 is adjusted.

In the above technical scheme, the angle indication mark 215 is arranged at the periphery of the mounting hole, so that the mounting angle of the liquid spraying rod 211 can be accurately adjusted, and then the spraying angle of the first nozzle 212 can be accurately adjusted, thereby being beneficial to realizing omnibearing spraying and moisturizing of the surface of the wafer.

In some embodiments of the present invention, the spray bar assembly 21 further comprises: and the first driving adjusting piece is connected with the liquid spraying rod 211 and is used for driving the liquid spraying rod 211 to rotate in the mounting hole. Therefore, the position of the liquid spraying rod 211 can be automatically adjusted, the spraying angle of the first spraying hole can be automatically adjusted, and the omnibearing spraying and moisturizing of the surface of the wafer can be realized.

In some embodiments of the present invention, as shown in fig. 3 and 4, the number of the spray bar assemblies 21 is two, and two spray bar assemblies 21 are respectively disposed at opposite sides of the cabinet 10 for spraying both side surfaces of the wafer.

The wafer may be vertically placed in the temporary storage chamber 101, that is, the thickness direction of the wafer may be a horizontal direction. For example, the thickness direction of the wafer may be in the left-right direction, with both side surfaces of the wafer in the thickness direction facing to the left and right sides, respectively. The case 10 has left and right side plates oppositely disposed in the left-right direction, and two spray bar assemblies 21 may be disposed on the left and right side plates of the case 10, respectively. Thus, the spray bar assembly 21 disposed on the left side plate can spray liquid toward the left side surface of the wafer, and the spray bar assembly 21 disposed on the right side plate can spray liquid toward the right side surface of the wafer, so as to improve the rinsing effect of the polishing liquid on the two side surfaces of the wafer.

In the above technical solution, by providing two spray bar assemblies 21 to spray the two side surfaces of the wafer in the thickness direction, the spray range of the wafer can be increased, the rinsing effect on the two side surfaces of the wafer can be improved, and the residue of polishing solution and crystallization can be further reduced.

According to some embodiments of the present invention, as shown in fig. 3, the liquid spraying mechanism 20 may further include a second liquid inlet pipe 22, on which a second nozzle is disposed, the second nozzle faces the peripheral edge of the wafer, and an inlet end of the second liquid inlet pipe 22 penetrates out of the case 10 to be connected to an external liquid supply pipe. Therefore, the external spraying liquid can firstly enter the second liquid inlet pipe and then spray towards the peripheral side face of the wafer through the second spray hole, so that the residual polishing liquid at the peripheral edge of the wafer can be washed away, the residual polishing liquid at the peripheral edge of the wafer is also in a moist environment, and the crystallization of the polishing liquid at the peripheral edge of the wafer is reduced.

The second spray hole is configured to spray a water curtain with a preset shape, and the shape of the water curtain sprayed by the second spray hole can be set according to actual needs, for example, the shape of the water curtain can be linear, conical or fan-shaped, etc.

Wherein the peripheral edge of the wafer includes a peripheral side face of the wafer and portions of both side faces of the wafer in the thickness direction near the peripheral side face.

When the wafer is placed in the temporary storage cavity, the second spray holes can be utilized to spray the two side surfaces of the wafer in the thickness direction, and the second spray holes are utilized to spray the peripheral side surfaces of the wafer, so that the spray mechanism can spray the two surfaces and the peripheral side surfaces of the wafer, spraying is realized on all surfaces of the wafer, the spraying and moisturizing effects on the wafer are improved, and the crystallization of polishing liquid on all surface positions of the wafer is reduced. That is, the first spray hole and the second spray hole are matched with each other, so that the washing and moisturizing effects on any position of the surface of the wafer can be realized.

According to some embodiments of the invention, the liquid spraying mechanism further comprises: the second driving adjusting piece is connected with the outlet end of the second liquid inlet pipe 22 and is used for driving the outlet end of the second liquid inlet pipe 22 to move so as to adjust the injection angle of the second spray hole. Therefore, the automatic adjustment of the injection angle of the second spray hole can be realized, and the omnibearing spraying and moisturizing of the surface of the wafer can be realized.

In one example, the second liquid inlet pipe 22 is provided with a second nozzle 23, the second nozzle 23 is connected with the second liquid inlet pipe 22, and the second nozzle 23 has a second spraying hole arranged towards the periphery of the wafer. The second drive adjusting piece can be connected with the second liquid inlet pipe and used for driving the outlet end of the second liquid inlet pipe to rotate, and the second drive adjusting piece can also be connected with the second nozzle and used for driving the second nozzle to rotate so as to adjust the injection angle of the second spray hole.

When a wafer is placed in the temporary storage cavity 101, the externally provided spraying liquid can enter the second nozzle 23 through the second liquid inlet pipe 22 and then be sprayed to the peripheral edge of the wafer through the second spray hole.

When wafers 200 with different sizes are placed in the temporary storage cavity 101, the spraying angle of the second nozzle can be adjusted according to the spraying requirements of the wafers 200 with different sizes. The injection angle of the second nozzle can also be adjusted in real time during the spraying process. Therefore, the washing effect and the moisturizing effect on the surface of the wafer can be further improved, and the wafer surface is favorably sprayed and moisturized in an all-around manner.

In one example, the box 10 is provided with a second cabin penetrating connector 24, a second channel communicating the inner side and the outer side of the box 10 is defined on the inner side of the second cabin penetrating connector 24, the second liquid inlet pipe 22 penetrates through the second channel to extend into the temporary storage cavity 101, a second locking nut 25 is further sleeved on the second liquid inlet pipe 22, and the second locking nut 25 is fixedly connected with the second cabin penetrating connector 24 so as to fix the second liquid inlet pipe 22 with the second cabin penetrating connector 24.

In the above technical scheme, through setting up second feed liquor pipe 22 and second nozzle 23, can spray the week side and the week edge surface of wafer through the second orifice of second nozzle 23, can wash out the surplus polishing liquid of wafer circumference border position from this to make the surplus polishing liquid of wafer circumference border remain in moist environment too, reduce the polishing liquid crystallization of wafer circumference border.

According to some embodiments of the present invention, the bottom wall of the tank 10 is provided with a drain 102, and the bottom wall of the tank 10 extends obliquely downward in a direction toward the drain 102.

Further, the bottom surface of the temporary storage cavity 101 is an inclined surface extending downward toward the liquid outlet 102, and the included angle between the bottom wall of the box 10 and the horizontal plane may be greater than or equal to 1 ° and less than or equal to 5 °. For example, the included angle between the bottom surface of the temporary storage chamber 101 and the horizontal plane may be 1 °,2 °, 3 °,4 °,5 °, or the like.

In the above technical solution, the bottom wall of the tank 10 extends obliquely downward toward the liquid outlet 102, so that the liquid at the bottom of the tank 10 can flow toward the liquid outlet 102 under the action of gravity, so that the liquid in the tank 10 can be conveniently and completely discharged, and the residual liquid in the tank 10 is reduced.

In some embodiments of the present invention, as shown in fig. 3, the wafer temporary storage device 100 may further include: filter 30. Filter 30 is provided at drain 102. Further, the wafer temporary storage device 100 further includes: the drain pipe 70, the drain pipe 70 is arranged outside the tank 10, and the drain pipe 70 is connected to the peripheral edge of the drain port 102.

In the above-described technical solution, by providing the filter 30, the filter 30 can filter the liquid flowing out of the liquid drain port 102, prevent the wafer fragments from entering the liquid drain pipe 70 connected to the liquid drain port 102, and avoid the blockage of the liquid drain pipe 70.

According to some embodiments of the present invention, the wafer temporary storage device 100 further comprises: the driving assembly 40, the driving assembly 40 is disposed in the box 10 for driving the wafer to rotate.

In the above technical solution, the wafer is driven to rotate by the driving component 40, so that the spraying range of the first spraying hole on the wafer can be increased, and the rinsing effect of the residual polishing solution on the surface of the wafer can be improved.

In some embodiments of the present invention, the driving assembly 40 may include: a driving wheel 41 and a driving member 43, wherein the driving wheel 41 is rotatably arranged in the box body 10, and a driving groove suitable for accommodating the edge of the wafer is formed on the peripheral surface of the driving wheel 41; the driving member 43 is coupled to the driving wheel 41 for driving the wafer to rotate by the driving wheel 41.

The driving groove extends in a ring shape along the circumferential direction of the driving wheel 41, and the driving piece 43 may be a driving motor. When the wafer is put into the temporary storage cavity 101, the edge of the wafer stretches into the driving groove and contacts with the side wall or the bottom wall of the driving groove, and when the driving piece 43 drives the driving wheel 41 to rotate, the edge of the wafer can be always positioned in the driving groove and drives the wafer to rotate along with the rotation of the driving wheel 41. Wherein the wafer can rotate around its own central axis.

When the wafer rotates, the same first spray hole can spray to different positions of the wafer when the wafer rotates to different angles. Therefore, the spraying range of the first spray hole on the wafer can be enlarged, and the flushing effect of the residual polishing solution on the surface of the wafer is improved. For the second spray holes, the second spray holes can spray to different positions of the wafer when the wafer rotates to different angles. Therefore, the spraying range of the second spray hole to the wafer can be enlarged, the flushing effect and the moisturizing effect of the residual polishing solution on the surface of the wafer are improved, and the spraying and the moisturizing of any position on the surface of the wafer are realized.

When the driving wheel 41 drives the wafer to rotate, the rotation speed of the wafer may be 3 rpm or more and 10 rpm or less. For example, the wafer rotation speed may be 3 rpm, 4 rpm, 5 rpm, 6 rpm, 7 rpm, 8 rpm, 9 rpm, 10 rpm.

In one embodiment of the present invention, the number of the driving wheels 41 is plural, the plural driving wheels 41 are arranged at intervals along the circumferential direction of the wafer, and the rotation directions of the plural driving wheels 41 are the same.

For example, the number of driving wheels 41 may be two, three, four, five or more. By providing a plurality of driving wheels 41, the acting force on the wafer at the position of a single driving wheel 41 can be reduced, the uniformity of the stress of the driving wheels 41 in the circumferential direction can be improved, and the probability of damage when the wafer is contacted with the driving wheels 41 can be reduced.

The rotation direction of the plurality of driving wheels 41 may be either clockwise or counterclockwise, which is not limited. The rotation directions of the driving wheels 41 are the same, so that the acting force applied to the wafer during rotation is the same, and the driving wheels 41 can be matched with each other to drive the wafer to rotate.

The driving member 43 may be one driving member 43 may be connected to the plurality of driving wheels 41 for driving the plurality of driving wheels 41 to rotate simultaneously, or the driving member 43 may be a plurality of driving members 43, and the plurality of driving members 43 may be in one-to-one correspondence with and connected to the plurality of driving wheels 41, and each driving member 43 is used for driving the corresponding driving wheel 41 to rotate.

In the above technical solution, by arranging the plurality of driving wheels 41 arranged at intervals and making the rotation directions of the plurality of driving wheels 41 identical, the rotation of the wafer can be driven by the mutual cooperation of the plurality of driving wheels 41, so that the acting force on the wafer at the position of a single driving wheel 41 is reduced, and the probability of damage when the wafer contacts with the driving wheels 41 is reduced.

In one embodiment of the invention, the drive wheel 41 is rotatable about a horizontally extending axis of rotation, the drive wheel 41 being arranged on the underside of the wafer to support the wafer.

For example, the driving wheel 41 is disposed at the lower side of the wafer, and the driving wheel 41 is rotatable about a rotation axis extending in the left-right direction, when the wafer is placed in the temporary storage chamber 101, the wafer is vertically arranged, and the lower side edge of the wafer may protrude into the driving groove of the driving wheel 41. The driving wheel 41 may support the wafer through the driving groove when the driving wheel 41 is stationary, and may support the wafer and rotate the wafer when the driving wheel 41 rotates.

In the above-described solution, by arranging the driving wheel 41 at the lower side of the wafer, it is possible to conveniently support the wafer and drive the wafer to rotate.

In one embodiment of the present invention, as shown in fig. 3, the driving assembly 40 further includes a support member 42, wherein the support member 42 is disposed in the case 10 and located at the lower side of the wafer, and a support groove adapted to receive the edge of the wafer is formed in the support member 42.

Specifically, the supporting member 42 may be a supporting wheel, and a supporting groove is formed on an outer circumferential surface of the supporting wheel, and extends along a circumferential direction of the supporting member 42 to form a ring shape, and when the wafer is placed in the temporary storage cavity 101, an edge of the wafer extends into the supporting groove. The number of the supporting wheels can be one or a plurality of, and when the number of the supporting wheels is a plurality of the supporting wheels, the plurality of the supporting wheels are distributed at intervals along the circumferential direction of the wafer. Thus, the stability of the wafer support can be further improved.

For example, the driving assembly 40 includes two driving wheels 41 and one supporting wheel, both of which are disposed at the lower side of the wafer, the two driving wheels 41 are spaced apart in the front-rear direction, the supporting wheel is disposed between the two driving wheels 41, and the supporting wheel is positioned lower than the two driving wheels 41 in the up-down direction, and the lower peripheral edge of the wafer is respectively supported in the driving grooves of the two driving wheels 41 and the supporting groove of the supporting wheel when the wafer is put into the temporary storage chamber 101.

In the above technical solution, by providing the supporting member 42 for supporting the edge of the wafer, the supporting member 42 can limit the swing of the wafer during the rotation process, so as to improve the rotation stability of the wafer.

In one embodiment of the present invention, the case 10 is provided with an exhaust port communicated with the temporary storage cavity 101, and by providing the exhaust port, the gas in the temporary storage cavity 101 can be conveniently exhausted, so as to maintain the pressure balance in the temporary storage cavity 101 and avoid the aggregation of the volatile chemical gas in the temporary storage cavity 101.

In one example, the wafer temporary storage device 100 may further include: and an exhaust duct 60, the exhaust duct 60 being disposed outside the case 10, an inlet end of the exhaust duct 60 being connected to an exhaust port position, and at least a portion of the exhaust duct 60 extending upward in a flow direction of the air flow in the exhaust duct 60. Wherein the inlet end of the exhaust pipe 60 is in sealing connection with the peripheral edge of the exhaust port.

Thus, when the air flows upward along the exhaust pipe 60, the water mist in the air can flow downward under the action of gravity and flow back into the temporary storage cavity 101, and the air in the air can flow upward and be smoothly discharged to the outside. Thereby, the liquid in the temporary storage chamber 101 can be prevented from being discharged out of the exhaust pipe 60 with the gas.

In the above technical scheme, through setting up blast pipe 60, can conveniently discharge the gas in the temporary storage chamber 101, keep the pressure balance in the temporary storage chamber 101, avoid the volatile chemical gas gathering in the temporary storage chamber 101.

In one example, the wafer buffer 100 may further include a guide disposed within the buffer chamber and coupled at the exhaust port location, wherein an inner side of the guide defines a guide channel extending at least partially upward in a direction from an inlet end of the guide channel toward the exhaust port. In other examples, the guide member cooperates with an inner wall of the temporary storage chamber to define a guide channel, at least a portion of which extends upwardly in a direction from an inlet end of the guide channel toward the exhaust port.

Thus, when the air flow flows up to the exhaust port position along the guide channel, the water mist in the air can flow down under the action of gravity and flow back into the temporary storage cavity 101, and the air in the air can flow up and be smoothly discharged to the outside. Thereby, the liquid in the temporary storage chamber 101 can be prevented from being discharged out of the exhaust pipe 60 with the gas.

A wafer cleaning method according to an embodiment of the second aspect of the present invention. The wafer temporary storage device 100 applied to the embodiment of the first aspect of the present invention, the wafer cleaning method includes: s1, confirming that wafers are stored in the temporary storage cavity 101 and that the door 122 is at a closed position; s2, driving the wafer to rotate, and starting a liquid spraying mechanism 20 to spray the wafer; s4, confirming that the instruction for taking out the wafer is received, stopping rotating the wafer, and stopping the liquid spraying mechanism 20.

For example, the detecting mechanism 50 may detect whether there is a wafer in the temporary storage chamber 101, and detect whether the door 122 is in the closed position when the wafer is placed in the temporary storage chamber 101, so as to determine the sealing performance of the box 10, and prevent the liquid in the temporary storage chamber 101 from leaking or splashing.

After confirming that the temporary storage chamber 101 has a wafer and the door 122 is closed, the wafer is driven to rotate, for example, the wafer can be driven to rotate by the driving component 40, and the spraying mechanism 20 is started at the same time, the spraying mechanism 20 can be used for spraying the two side surfaces of the wafer in the thickness direction and the peripheral edge and the peripheral side surface of the wafer, so that the wafer is kept in a wet state, the polishing solution on the wafer is removed by washing, and the crystallization of the polishing solution on the surface of the wafer is reduced.

When the wafer temporary storage device 100 receives a command for taking out a wafer, for example, when the wafer can be subjected to a next cleaning step, the wafer temporary storage device 100 can be sent out a take-out command, and at this time, the driving assembly 40 is stopped to stop the wafer from rotating, so that the wafer is conveniently taken out, the wafer is prevented from being damaged when the wafer is taken out, and meanwhile, the liquid spraying mechanism 20 is arranged in the wafer temporary storage device, so that the liquid can be prevented from splashing outside the temporary storage cavity 101.

According to the wafer cleaning method of the embodiment of the invention, by firstly confirming that the wafer is placed in the temporary storage cavity 101 and confirming that the door 122 is closed, then starting the liquid spraying mechanism 20 to spray the wafer and drive the wafer to rotate, stopping rotating and spraying the wafer until receiving the taking-out instruction, so that the wafer is always sprayed in the whole temporary storage process of the wafer, the polishing liquid on the wafer can be washed and removed, the wafer is kept moist, and the crystallization of the polishing liquid on the surface of the wafer is remarkably reduced or avoided.

According to some embodiments of the invention, step S1 comprises: s11, detecting whether a wafer exists in the temporary storage cavity 101; if not, executing S12, and if so, executing S13; s12, confirming that the door 122 is opened, and placing the wafer; s13, closing the door 122.

That is, it is first detected whether there is a wafer in the temporary storage chamber 101, when there is no wafer in the temporary storage chamber 101, it is confirmed whether an instruction for placing the wafer is received, after receiving the placing instruction, the door 122 is driven to open, the wafer is placed in the temporary storage chamber 101, and then the door 122 is closed, at this time, step S2 can be executed, that is, the wafer is driven to rotate, and the spraying mechanism 20 is started to spray the wafer.

When a wafer is in the temporary storage cavity 101, detecting whether the door 122 is closed, if the door 122 is opened, driving the door 122 to close, and then executing step S2 (driving the wafer to rotate, starting the liquid spraying mechanism 20 to spray the wafer); if the door 122 is closed, step S2 (driving the wafer to rotate, starting the spray mechanism 20 to spray the wafer) is directly performed.

In the above technical solution, by detecting whether there is a wafer in the temporary storage chamber 101, if there is no wafer, the wafer is placed according to the instruction, if there is a wafer, the door 122 is closed, and then the wafer is sprayed. Therefore, the wafer can be driven and rotated on the premise that the wafer exists in the temporary storage cavity 101.

According to some embodiments of the invention, after step S2, the wafer cleaning method further comprises: and detecting the liquid level in the temporary storage cavity 101, and stopping spraying the wafer if the liquid level is greater than or equal to the preset height.

In the above technical scheme, the liquid level in the temporary storage cavity 101 can be prevented from being too high, and the liquid in the temporary storage cavity 101 is prevented from overflowing.

According to some embodiments of the invention, the wafer cleaning method may further include: detecting the state of the wafer, and sending out an alarm prompt if the wafer is damaged. Thus, the damaged wafer can be prevented from being subjected to subsequent processes.

A wafer temporary storage device 100 according to an embodiment of the present invention will be described with reference to fig. 1 to 8.

Referring to fig. 1, the wafer temporary storage device 100 includes: the liquid level sensor comprises a box body 10, a liquid spraying mechanism 20, a filter 30, a driving assembly 40, a detection mechanism 50, an exhaust pipe 60, a liquid discharge pipe 70 and a liquid level sensor 80.

Specifically, as shown in fig. 1, the box 10 is in a cuboid shape, a temporary storage cavity 101 is defined in the box 10, the bottom wall of the temporary storage cavity 101 is processed into an inclined plane with a gradient of 1-5 degrees so as to completely drain liquid, one end of the inclined plane, which is low, is provided with a liquid outlet 102, and the bottom of the liquid outlet 102 is provided with a liquid outlet pipe 70 for being connected with a liquid outlet pipe 70 of equipment. The filter 30 is disposed at the drain 102 to prevent clogging of the drain line by wafer debris.

The upper part of the box body 10 is provided with an exhaust port, the exhaust port is provided with an upward exhaust pipe 60 to pump away the volatilized gas of the chemical liquid in the box body 10, and the upward exhaust pipe 60 can prevent the liquid in the box body 10 from entering an exhaust pipe 60 path connected with the exhaust pipe 60. Further, the inner wall of the temporary storage cavity 101 is provided with a protective cover, the protective cover is arranged at the position of the exhaust port, and the opening of the protective cover faces downwards, so that liquid in the temporary storage cavity 101 can be prevented from being sucked into the exhaust pipe 60.

The two opposite side plates of the box body 10 are provided with detection ports, the detection ports are sealed by the transparent plate 13, a sealing ring is used between the transparent plate 13 and the box body 10 for preventing liquid from exuding, the detection mechanism 50 is arranged at the position of the detection ports, and the transparent plate 13 can be conveniently penetrated by sensing media (visible light or laser and the like) of a sensor of the detection mechanism 50. The transmitting end of the sensor sends out a signal (visible light or laser), if no wafer exists, the receiving end can receive the signal (visible light or laser), if the wafer exists, the receiving end can not receive the signal, and the result is fed back to the controller. The detection mechanism 50 may also employ a reflective sensor, and accordingly only one detection port and transparent plate 13 are required.

The case 10 includes a case body 11 and a door assembly 12, a first access opening 111 is provided at a front side of the case body 11, and the door assembly 12 is provided at a position of the first access opening 111 for opening and closing the first access opening 111. Wherein, door assembly 12 is connected with box main body 11 by screw, and door assembly 12 is sealed with box main body 11 by sealing washer 14, prevents the liquid in box main body 11 from oozing outside the box.

The door assembly 12 includes: door frame 121, door body 122, actuating mechanism 123, magnetic switch 1231, speed governing joint 1232, connecting seat 125, rolling member 124, locking screw 127 and fastening screw 128. The door frame 121 is internally formed with a receiving groove 1212 for mounting the door body 122 and providing a moving space of the door body 122. The door frame 121 has a second inlet 1211 formed therein, and the second inlet 1211 is similar in size to the first inlet 111 in the case body 11.

The actuating mechanism 123 is slip table cylinder 1233, and slip table cylinder 1233 installs at door frame 121 outside top, and the door body 122 is connected with slip table cylinder 1233 through connecting seat 125, and slip table cylinder 1233 has two air inlets, and two air inlets are connected with the control gas circuit through speed governing joint 1232, and after the different air inlets ventilate, cylinder 1233 left or right movement drives the door plant and moves about, adjusts speed governing joint 1232 and can adjust the switch door speed. The cylinder 1233 is provided with two magnetic switches 1231, and the magnetic switches 1231 can be respectively connected with signals at the opening position and the closing position of the door plate and feed back to the controller.

The area of the door body 122 is larger than the area of the second inlet 1211 on the door frame 121, and the left and right sides of the door body 122 are both formed with water-break grooves 1222 to prevent liquid from being drained to the outer surface of the door panel along the sides. When the door 122 is moved to the rightmost position, the liquid sprayed from the first nozzle 212 and the second nozzle 23 in the range of the first inlet 111 of the tank main body 11 can be blocked, the liquid can flow downwards along the door 122 into the bottom of the door frame 121, the left side and the right side of the door 122 are tightly attached to the side of the containing groove 1212, the water is prevented from splashing out of the second inlet 1211 of the door frame 121, and the liquid flows back into the tank main body 11 through the backflow channel 112 at the lower side of the first inlet 111 at the front side of the tank main body 11.

The bottom of the door 122 is provided with rolling elements 124, the rolling elements 124 are bearings, the materials are ceramics, and the ceramic bearings can prevent liquid corrosion. The bearing can freely roll in the left-right movement direction of the door 122. The outer diameter of the bearing is equal to the distance between the case body 11 and the bottom wall of the accommodation groove 1212 of the door frame 121, so that the lower part of the door 122 is prevented from rocking back and forth when moving left and right.

The bearing is fixed at the bottom of the door 122 by a locking screw 127, and a circular boss 1221 is processed on a bearing mounting surface of the bottom of the door 122 to prevent the outer ring of the bearing from being contacted and interfered with the door plate. The locking screw 127 is fixed by a tightening screw 128 from the side.

The outside of the door frame 121 is provided with a water receiving disc 126, the water receiving disc 126 is sealed with the door frame 121 by a sealing gasket, and the water receiving disc 126 guides the liquid dropped before the wafer enters the second inlet 1211 of the door frame 121 to a drainage system, so that the liquid is prevented from dropping on the floor outside the box body 10.

The driving assembly 40 is disposed on the case 10, and the driving assembly 40 includes two driving wheels 41, two driving members 43, and a supporting member 42, wherein the supporting member 42 is a supporting wheel, and the driving wheels 41 have driving grooves slightly wider than the thickness of the wafer for vertically placing the wafer. The two driving wheels 41 rotate in the same direction to drive the wafer to rotate at a certain speed (usually 3-10 revolutions per minute) clockwise or anticlockwise, and the supporting wheels can limit the wafer to swing left and right and back and forth in the rotation process.

The liquid ejecting mechanism 20 includes: the two spray boom assemblies 21, the second liquid inlet pipe 22 and the second nozzle 23 are respectively arranged on the left side plate and the right side plate of the box body 10, and each spray boom assembly 21 comprises a first liquid inlet pipe 213, a first lock nut 217, a spray boom 211, a mounting seat 214 and a first nozzle 212. The first nozzles 212 are installed on the liquid spraying rod 211, the number of the first nozzles 212 can be set to 3-5 according to the requirement, and the shape of the first spray holes of the first nozzles 212 can be conical or fan-shaped.

The first liquid inlet pipe 213 enters the box 10 through the first cabin penetrating connector 216 to be connected with the liquid spraying rod 211 and is locked and sealed by the first locking nut 217. The spray bar 211 is fixed on the box 10 by the mounting seat 214, and the mounting seat 214 is engraved with a scribing line serving as an angle indication mark 215 for adjusting the spray angle of the spray bar 211 so as to ensure that all parts of the wafer can be evenly washed.

The second nozzles 23 are disposed on the peripheral side of the wafer, and the second nozzles 23 spray liquid to rinse the edge of the wafer, and one or more second nozzles 23 may be disposed on one side or both sides of the wafer, respectively, as needed. The second liquid inlet pipe 22 enters the box body 10 through the second cabin penetrating connector 24 to be connected with the second nozzle 23, and the flushing angle of the second nozzle 23 can be adjusted according to the requirement. The second nozzle 23 may use a megasonic cleaning nozzle to further improve the edge cleaning effect on the wafer.

The liquid level sensor 80 is arranged on one side of the liquid outlet 102 of the box body 10, the liquid level sensor 80 is arranged on the fixing seat 90, the position of the liquid level sensor 80 is 5-15 mm lower than the lower edge of the second inlet 1211 of the door frame 121, and liquid is prevented from overflowing. When the liquid level in the temporary storage cavity 101 is higher than the position of the liquid level sensor 80, the liquid level sensor 80 feeds back a signal to the controller, and the liquid spraying rod 211 and the second nozzle 23 stop supplying liquid.

The wafer cleaning method of the wafer temporary storage device 100 according to the above embodiment of the present invention is described below.

Receiving a wafer placing signal given by a wafer clamping mechanism, wherein the wafer placing signal is required to be placed into the wafer;

Detecting whether a wafer exists in the temporary storage cavity 101;

if not, opening the door 122, confirming that the door 122 is positioned at the opening position, and placing the wafer;

confirming that the wafer is detected by the detecting mechanism 50, the mechanical arm of the wafer clamping mechanism is retracted, and the door 122 is closed;

Confirming that the door 122 is at the closed position, sending a cleaning instruction, wherein the first nozzle 212 on the liquid spraying rod 211 sprays liquid, the driving wheel 41 rotates, the second nozzle 23 sprays liquid and the exhaust pipe 60 starts to exhaust, wherein the exhaust can be always in a working state; the liquid level sensor 80 can detect the liquid level in the temporary storage cavity 101 in real time, and when the liquid level is too high, liquid spraying is stopped;

confirming that the wafer cleaning device gives a wafer taking signal for taking out the wafer, and stopping the operation of the liquid spraying rod 211, the driving wheel 41 and the second nozzle 23;

Then, the door 122 is opened, and the door 122 is detected and confirmed to be in the open position;

The mechanical arm of the wafer clamping mechanism stretches into the temporary storage cavity 101, the wafer is taken out, no wafer in the temporary storage cavity 101 is detected and confirmed, and the door 122 is closed.

According to the wafer temporary storage device 100 provided by the embodiment of the invention, deionized water is continuously sprayed to the front and back surfaces of a wafer through the spray rod 211, most of residual polishing liquid on the surface of the wafer is washed out, the residual polishing liquid is in a moist environment, and the crystallization amount is greatly reduced; continuously spraying deionized water to the edge of the wafer through a second nozzle 23 arranged on the periphery of the wafer, flushing most of residual polishing liquid on the edge of the wafer, and greatly reducing the crystallization amount when the residual polishing liquid is in a moist environment; and the wafer is driven to rotate at a constant speed by the driving wheel 41 during the rinsing process, all edge portions can be uniformly rinsed.

In addition, by providing the first access opening 111 on the front side of the box body 11, a generally cylindrical coordinate type robot (wafer clamping mechanism) disposed at one side of the wafer temporary storage device 100 can enter the wafer after the grabbing polishing process into the box body 10 from the side, and vertically place the wafer on the driving wheel 41 and the supporting wheel of the driving assembly 40. The door 122 provided at the first inlet 111 of the side of the box body 11 is opened when the wafer needs to be placed, and provides a passage for the robot to enter the box body 10. After the wafer is placed, the door 122 is closed, so that the liquid is prevented from splashing out of the first inlet 111 and the second inlet 1211 on the sides during liquid spraying.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a wafer temporary storage device which characterized in that includes:

The box, the box includes: the wafer temporary storage device comprises a box main body and a door assembly, wherein the box main body is used for limiting a temporary storage cavity for temporarily storing wafers, a first access opening communicated with the temporary storage cavity is formed in one side of the box main body in a first direction, and the door assembly is connected with the box main body and used for opening and closing the first access opening;

The liquid spraying mechanism is arranged on the box body and is provided with a first spray hole, and the first spray hole is arranged towards the wafer and is used for spraying the surface of the wafer;

A leak-proof structure provided on the tank body and/or the door assembly, the leak-proof structure configured to guide liquid in a gap between the door assembly and the tank body back to the temporary storage chamber;

the door assembly includes:

The door frame is fixedly and hermetically connected with the box main body, and the door body is movably arranged on the door frame to open and close the first access opening;

The driving mechanism is connected with the door body and used for driving the door body to move between an opening position and a closing position along a second direction relative to the door frame, and the second direction is perpendicular to the first direction;

The door body is arranged on one side of the door frame, which faces the box main body, a second access opening is formed in the door frame, when the door body is in an open position, the first access opening is opposite to and communicated with the second access opening, and when the door body is in a closed position, the door body is blocked between the first access opening and the second access opening.

2. The wafer temporary storage device according to claim 1, wherein a concave accommodating groove is formed in a side of the door frame facing the box main body, the door body is arranged in the accommodating groove, and the second inlet and outlet are formed in a bottom wall of the accommodating groove.

3. The wafer temporary storage device of claim 2, wherein the door assembly further comprises: the rolling piece is rotatably arranged on the door body around an axis extending along a third direction, the rolling piece is respectively in rolling fit with the peripheral edge of the first access opening and the bottom wall of the accommodating groove, and the third direction is perpendicular to the first direction and the second direction.

4. A temporary wafer storage device according to claim 3, wherein the rolling member is a bearing, a boss is formed on an end surface of one end of the door body in the third direction, and an inner ring of the bearing is fixed on the boss.

5. The wafer temporary storage device of claim 1, wherein the door assembly further comprises: and a number of magnetic switches, two of which are configured to be triggered when the door body is in an open position and a closed position, respectively.

6. The wafer temporary storage device of claim 1, wherein the drive mechanism is disposed on a side of the door frame facing away from the cassette body, the door assembly further comprising: the connecting seat, the one end of connecting seat with actuating mechanism links to each other, and the other end passes the second access & exit with the door body links to each other.

7. The wafer temporary storage device of claim 1, wherein the door assembly further comprises: the water pan is arranged on one side, deviating from the box main body, of the door frame and is arranged below the second access opening.

8. The wafer temporary storage device according to claim 1, wherein the leakage preventing structure comprises water breaking grooves formed in side walls of both sides of the door body in the second direction, the water breaking grooves extending in the third direction and penetrating both ends of the door body in the third direction.

9. The wafer temporary storage device according to any one of claims 1-8, wherein the leak-proof structure comprises: and a return passage formed on the tank main body and communicating with the temporary storage chamber, the return passage being disposed at a lower side of the first inlet and outlet and penetrating through the tank main body in a first direction.

10. The wafer temporary storage device of claim 9, wherein the return channel extends in a second direction, and wherein a width of the return channel is greater than a width of the first access opening in the second direction.

11. The wafer temporary storage device according to any one of claims 1 to 8, wherein the box body has a detection port formed thereon, the box body further comprising: a transparent plate, the transparent plate sealing the detection port,

The wafer temporary storage device further comprises: the detection mechanism is arranged at the position of the detection port and positioned at the outer side of the box body and is used for detecting whether a wafer exists in the temporary storage cavity or not, and the detection mechanism is in communication connection with the liquid spraying mechanism.

12. The wafer temporary storage device of any one of claims 1-8, further comprising: the liquid level sensor is used for detecting the liquid level in the temporary storage cavity and is in communication connection with the liquid spraying mechanism.

13. A wafer cleaning method, applied to the temporary wafer storage device of any one of claims 1 to 12, comprising:

s1, confirming that a wafer is stored in the temporary storage cavity and that the door body is at a closed position;

s2, driving the wafer to rotate, and starting a liquid spraying mechanism to spray the wafer;

s3, confirming that an instruction for taking out the wafer is received, stopping rotating the wafer, and stopping the liquid spraying mechanism.

14. The wafer cleaning method of claim 13, wherein step S1 comprises:

S11, detecting whether a wafer exists in the temporary storage cavity; if not, executing S12, and if so, executing S13;

S12, confirming that the door body is opened, and placing the wafer;

S13, closing the door body.

15. The wafer cleaning method of claim 13, further comprising, after step S2:

and detecting the liquid level in the temporary storage cavity, and stopping spraying the wafer if the liquid level is greater than or equal to the preset height.