CN118354539B - Mounting machine for processing optical modulator chip - Google Patents
Mounting machine for processing optical modulator chip Download PDFInfo
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- CN118354539B CN118354539B CN202410755488.2A CN202410755488A CN118354539B CN 118354539 B CN118354539 B CN 118354539B CN 202410755488 A CN202410755488 A CN 202410755488A CN 118354539 B CN118354539 B CN 118354539B
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- 238000012545 processing Methods 0.000 title claims abstract description 31
- 230000003287 optical effect Effects 0.000 title claims abstract description 27
- 238000012937 correction Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims description 33
- 238000004804 winding Methods 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims 4
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000002699 waste material Substances 0.000 claims 1
- 239000011093 chipboard Substances 0.000 description 10
- 238000011084 recovery Methods 0.000 description 10
- 230000008602 contraction Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of chip processing, in particular to a mounting machine for processing an optical modulator chip, which comprises a machine case, wherein a first mounting cavity and a second mounting cavity are formed in the machine case, a chip placing box is fixedly connected to the bottom end of the inner wall of the first mounting cavity, two groups of correction plates are fixedly connected to the upper end of the chip placing box, one side of one group of correction plates is fixedly connected with an automatic telescopic tube which can freely stretch, the output end of the automatic telescopic tube is fixedly connected with an abutting strip, a moving block is arranged in the first mounting cavity, a moving mechanism capable of controlling the moving block to freely move in the first mounting cavity is fixedly arranged at the bottom end of the first mounting cavity, five groups of automatic telescopic rods are fixedly connected to one side of the moving block, a patch welding mechanism is fixedly arranged at the output end of the automatic telescopic rods, and the left side of one group of the moving blocks is fixedly connected with a switching mechanism, so that chips with different sizes can be sucked and chip elements can be welded.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a mounting machine for processing an optical modulator chip.
Background
The chip mounting is a process for bonding chip components to a chip substrate by means of organic adhesive and metal bonding, and the chip mounting machine is a semi-automatic device for accomplishing the process.
But the current technology is considered to be imperfect, when the chip is taken out by the chip mounter in the chip mounting process, the chip is damaged due to the fact that the suction hole is used for sucking air, the single suction point is small, the chips with different sizes cannot be taken out, and the chips are required to be sent to the oven for hot air baking and welding after the chip mounting is finished.
Chinese patent discloses a chip processing mounter (bulletin No. CN 114530408A), the structure of which comprises: the invention discloses a chip substrate fixing device, which comprises a supporting leg, a mounting machine, a discharging plate and a chip conveying device, wherein four supporting legs are arranged at four corners of the bottom of the mounting machine, the discharging plate is arranged on the front surface of the mounting machine, the chip conveying device is arranged in the mounting machine, after the chip substrate is fixed on a chip seat, the chip substrate is pushed into a chute mechanism to slide along the inner wall until the chip seat is limited at a specific position by a positioning structure, at this moment, the mounting machine can accurately mount the chip substrate without manual calibration, after the mounting of the chip substrate is completed, a chip seat provided with the chip substrate is pushed in to slide towards the previous chip seat until the previous restriction is removed and the second chip seat is replaced by the restriction of the positioning structure, and when a plurality of chip seats are in initial contact for use, a processing mode similar to a production line is formed so as to improve the mounting efficiency.
When the scheme is used, the chip substrate is fixed and accurately positioned through the positioning element, but in the use process, chips with different sizes cannot be picked up, the chips cannot be welded after the chip patch is finished, and the problem that the chips with different sizes cannot be picked up and the chips cannot be welded after the chip patch is finished is solved.
Disclosure of Invention
The present invention is directed to a mounter for processing an optical modulator chip, so as to solve the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides an optical modulator chip processing is with installation machine, includes quick-witted case, first installation chamber and second installation chamber have been seted up to quick-witted incasement portion, first installation chamber inner wall bottom fixedly connected with chip is put the box, two sets of correction boards of box upper end fixedly connected with are put to the chip, one of them a set of correction board one side fixedly connected with freely flexible automatic shrink tube, automatic shrink tube output fixedly connected with butt strip, first installation intracavity portion is provided with the movable block, the inside bottom fixed mounting of first installation chamber has the mobile mechanism of steerable movable block at the inside free movement of first installation chamber, one side fixedly connected with five sets of automatic shrink poles of movable block, just automatic shrink pole output fixed mounting has paster welding mechanism, one of them set of the left side fixedly connected with switching mechanism of movable block, the inside bottom fixedly connected with air pump of second installation chamber drives the butt strip through automatic shrink tube and promotes the chip board for with another set of correction board butt, can realize spacing fixed to the chip board.
Further as this scheme, moving mechanism includes the movable plate, movable plate bottom and first installation intracavity wall sliding connection, the inside bottom of first installation intracavity is rotated and is connected with first threaded rod, movable plate and first threaded rod surface threaded connection, first installation intracavity up end fixed mounting has the second motor, and first threaded rod drives the movable plate and removes, makes things convenient for the removal of movable plate, adjustment position.
Further as this scheme, second motor output and first threaded rod fixed connection, one side fixed mounting of movable plate has the third motor, one side rotation of movable plate is connected with the second threaded rod, second threaded rod surface and movable block threaded connection, third motor output and second threaded rod fixed connection, this mode is the same with first threaded rod effect, does not make excessive redundant description here.
The chip bonding mechanism comprises a connecting pipe, the connecting pipe is a corrugated pipe, the upper end of the connecting pipe is fixedly connected with an automatic shrinkage rod, a connecting air box is fixedly installed between the automatic shrinkage rod and the connecting pipe, a fourth motor is fixedly installed on the inner wall of the air box and located inside the connecting pipe, a shrinkage connecting arm is arranged inside the connecting pipe, the shrinkage connecting arm is fixedly connected with the inner wall of the air box, a plurality of ventilation holes are formed in the outer surface of the shrinkage connecting arm, a first shrinkage tube is rotationally connected to the bottom of the connecting pipe, a second shrinkage tube is slidingly connected to the bottom of the first shrinkage tube, a third shrinkage tube is slidingly connected to the bottom of the third shrinkage tube, the bottom of the shrinkage connecting arm is rotationally connected with the third shrinkage tube, a plurality of round holes are formed in the bottom of the third shrinkage tube, the first shrinkage tube and the bottom of the second shrinkage tube, a tooth ring is fixedly arranged on the outer surface of the third shrinkage tube, the first shrinkage tube and the first shrinkage tube, the second shrinkage tube and the second shrinkage tube are fixedly meshed with tooth rings, the third shrinkage tube and the second shrinkage tube are fixedly connected with the second shrinkage tube, the second shrinkage tube and the second shrinkage tube are fixedly connected with the third shrinkage tube and the third shrinkage tube.
According to the scheme, the upper end faces of the third shrinkage tube, the first shrinkage tube and the second shrinkage tube are rotationally connected with a single connecting ring, the upper end faces of the single connecting ring are rotationally connected with four groups of meshing gears, the single connecting ring is fixedly connected with a shrinkage connecting arm, the meshing gears are meshed with the meshing toothed rings, the inner walls of the second shrinkage tube and the first shrinkage tube are fixedly provided with inner connecting toothed rings, the inner connecting toothed rings are meshed with the meshing gears, the upper end faces of the second shrinkage tube and the first shrinkage tube are fixedly provided with two groups of self-locking blocks, the two groups of self-locking blocks are fixedly connected with double connecting rings between the second shrinkage tube, self-locking grooves are formed in the self-locking blocks, self-locking columns are fixedly connected with the outer surfaces of the third shrinkage tube and the second shrinkage tube, the outer surfaces of the self-locking columns are abutted against the inner walls of the self-locking grooves, and the outer surfaces of the first shrinkage tube are fixedly connected with covers in a self-locking mode, and the air suction mode is similar to the self-locking mode, and the adjustment of the three groups of the third shrinkage tube, the first shrinkage tube and the second shrinkage tube can be adjusted in different positions.
The scheme is further that the switching mechanism comprises a first movable block, a first connecting hole and a second connecting hole are formed in the first movable block, the first connecting hole is fixedly connected with a connecting pipe, the second connecting hole is fixedly connected with an air suction cover, one side of the first movable block is detachably and slidably connected with the second movable block, an air suction hole and a hot air hole are formed in the second movable block, the air suction hole is fixedly connected with an air pump, the hot air hole is fixedly connected with an intelligent hot air machine, an elastic telescopic rod is connected between the first movable block and the second movable block, and different gases can be led into the third shrinkage pipe, the first shrinkage pipe and the second shrinkage pipe to finish welding of a chip original.
As this scheme is further, one side of second movable block is through bolt fixedly connected with butt cylinder, first installation intracavity wall bottom fixedly connected with promotes the strip, hot through-hole has been seted up to first movable block bottom, first movable block fixedly connected with sliding tube, the gas-supply hole has been seted up to the sliding tube inside, sliding tube surface and hot through-hole inner wall swing joint, sliding tube and intelligent air heater fixed connection, automatic shrink pole output and first movable block fixed connection, first movable block and first installation intracavity wall swing joint.
Further as this scheme, first installation cavity up end fixedly connected with fixed block, five groups of mounting brackets of fixed block up end fixedly connected with, the inside rotation of mounting bracket is connected with the winding wheel that is used for winding the chip area and retrieves the recovery wheel in useless chip area after using, five groups retrieve wheel fixed connection, fixed block up end fixed mounting has first motor, and one of them a set of retrieve wheel and first motor output fixed connection, first motor output drives retrieves wheel pulling chip area and removes, accomplishes automatically to chip on the chip area chip removal position.
Compared with the prior art, the invention has the beneficial effects that:
1. When the invention is used, through different positions of the shrinkage of the third shrinkage tube, the first shrinkage tube and the second shrinkage tube, the absorption area is increased or reduced, chip originals with different sizes can be attached, and when the chip originals are picked up, the damage to the chip originals can not be caused due to uniform stress, thereby greatly improving the working efficiency and reducing the property loss.
2. When the soldering machine is used, the way of switching the air suction and the heat release of the third shrinkage tube, the first shrinkage tube and the second shrinkage tube is adopted by the switching mechanism, so that the single hot air soldering of the secondary to the chip original is realized, the hot air is absorbed in the hot air blowing process, and the influence on other solder pastes is avoided.
Drawings
Fig. 1 is a front view of a mounter for processing an optical modulator chip.
Fig. 2 is a schematic view showing an internal structure of a first mounting cavity in a mounter for processing an optical modulator chip.
Fig. 3 is a schematic diagram showing an internal structure of a second mounting cavity in a mounter for processing an optical modulator chip.
Fig. 4 is a schematic diagram showing a connection relationship between a second motor and a first threaded rod in a mounter for processing an optical modulator chip.
Fig. 5 is a schematic diagram showing a connection relationship between a pressing wheel and an elastic shrinkage arm in a mounter for processing an optical modulator chip.
Fig. 6 is an enlarged schematic view at a in fig. 4.
Fig. 7 is a schematic diagram showing a connection relationship between a correction plate and an automatic shrink tube in a mounter for processing an optical modulator chip.
Fig. 8 is a schematic diagram showing an internal structure of a second shrink tube in a mounter for processing an optical modulator chip.
Fig. 9 is a schematic view showing an internal structure of a first shrink tube in a mounter for processing an optical modulator chip.
Fig. 10 is a schematic view showing an internal structure of a connection pipe in a mounter for processing an optical modulator chip.
Fig. 11 is a schematic view showing the position of the engaging ring gear in a mounter for processing optical modulator chips.
Fig. 12 is a schematic diagram showing a connection relationship between an air pressure box and an automatic shrinkage rod in a mounter for processing an optical modulator chip.
Fig. 13 is a schematic view showing a position structure of a second slide bar in a mounter for processing an optical modulator chip.
Fig. 14 is a schematic diagram showing a connection relationship between an air suction hole and a first movable block in a mounter for processing an optical modulator chip.
Fig. 15 is a schematic view showing the internal structure of a first movable block in a mounter for processing an optical modulator chip.
Fig. 16 is a schematic view showing an internal structure of a second mounting chamber in a mounter for processing an optical modulator chip.
In the figure: 1. a chassis; 2. a cover; 3. a computer; 4. folding the damping rod; 5. a first mounting cavity; 6. a second mounting cavity; 7. a chip placement box; 8. a fixed block; 9. an intelligent air heater; 10. an air pump; 11. a first motor; 12. a second motor; 13. a first threaded rod; 14. a third motor; 15. a moving plate; 16. a second threaded rod; 17. a first slide rail; 18. a moving block; 19. automatically retracting the rod; 20. a second slide rail; 21. a mounting frame; 22. a connecting rod; 23. a recovery wheel; 24. pressing the wheel; 25. an elastically contractible arm; 26. a correction plate; 27. the connecting air box; 28. a connecting pipe; 29. a first shrink tube; 30. a second shrink tube; 31. a third shrink tube; 32. an internal toothed ring; 33. retracting the connecting arm; 34. a fourth motor; 35. a meshing gear; 36. engaging the toothed ring; 37. a self-locking column; 38. a self-locking block; 39. a self-locking groove; 40. a double connection ring; 41. a round hole; 42. a single connection ring; 43. automatically shrinking the pipe; 44. an air pressure box; 45. an air suction cover; 46. matching with a contraction arm; 47. a first slide bar; 48. a first mating block; 49. a second slide bar; 50. a hot air hole; 51. an air suction hole; 52. pushing the strip; 53. an elastic telescopic rod; 54. a first movable block; 55. a thermal via; 56. a second movable block; 57. a first connection hole; 58. a second connection hole; 59. a sliding tube; 60. an exhaust port; 61. a heat radiating pipe; 62. a winding wheel; 101. a moving mechanism; 201. a patch welding mechanism; 301. a switching mechanism.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one: referring to fig. 1,2, 3,4, 5, 6 and 7, in the embodiment of the invention, an optical modulator chip processing mounter comprises a case 1, the case 1 is rotationally connected with a cover 2 for preventing dust in the internal space of the case 1 through a louver, a computer 3 is fixedly mounted on one side of the case 1, a first mounting cavity 5 and a second mounting cavity 6 are formed in the case 1, a folding damping rod 4 for supporting the cover 2 when the cover 2 rotates upwards is rotationally connected between the first mounting cavity 5 and the cover 2, a chip placing box 7 is fixedly connected to the bottom end of the inner wall of the first mounting cavity 5 through bolts, a plurality of vent holes are formed in the upper end surface of the chip placing box 7, two groups of correction plates 26 are symmetrically distributed on the upper end surface of the chip placing box 7, one side of the correction plates 26 is fixedly connected with a freely telescopic automatic shrinkage tube 43, an abutting strip is fixedly connected with the output end of the automatic shrinkage tube 43, a buffer rubber pad is stuck on one side of the abutting strip, damage to the abutting strip caused when the chip plates are fixedly mounted on the automatic shrinkage tube, a chip placing block 5 is also fixedly connected with a first shrinkage block 18, a chip placing mechanism 19 is also fixedly connected with the inner shrinkage block 18, a first chip placing mechanism 19 is also fixedly connected with the left end of the chip placing block 18, and a first chip placing mechanism 19 is fixedly connected with a left chip placing mechanism 19, and a first chip placing mechanism 19 is fixedly connected with a second chip placing mechanism 19, and a first chip placing mechanism 201 is fixedly connected with a second chip placing mechanism, and a second chip placing mechanism 18, and a first chip placing mechanism and a second chip placing device is fixedly and a second chip placing 18 and a 18, and a second chip can be provided with a 18 and a 18;
The utility model provides a first installation cavity 5 up end fixedly connected with fixed block 8, five groups of mounting brackets 21 of fixed block 8 up end fixedly connected with, the inside fixedly connected with elasticity shrink arm 25 of mounting bracket 21, elasticity shrink arm 25 output rotates and is connected with presses the wheel 24, and press the wheel 24 and can play the fixed effect of extrusion to the chip area, be difficult for winding, the inside rotation of mounting bracket 21 is connected with the winding wheel 62 that is used for winding the chip area and retrieves the recovery wheel 23 of useless chip area after using, five groups of recovery wheels 23 interconnect, specifically, through connecting rod 22 fixed connection between every group of recovery wheel 23, fixed block 8 up end fixed mounting has first motor 11, wherein a set of recovery wheel 23 and first motor 11 output fixed connection, the inside bottom fixed mounting of second installation cavity 6 has air pump 10.
Embodiment two: referring to fig. 1,2, 3, and 4, the moving mechanism 101 includes a moving plate 15, the bottom of the moving plate 15 is slidably connected with the inner wall of the first installation cavity 5, specifically, the inner wall of the first installation cavity 5 is provided with two groups of second sliding rails 20, the moving plate 15 is slidably connected with the outer surface of the second sliding rail 20, when the moving plate 15 slides on the outer surface of the second sliding rail 20, the second sliding rail 20 has a limiting effect on the moving plate 15, and in the moving process of the moving plate 15, the shaking of the moving plate 15 can be greatly reduced, the bottom end inside the first installation cavity 5 is rotationally connected with a first threaded rod 13, the first threaded rod 13 is longitudinally distributed, the moving plate 15 is in threaded connection with the outer surface of the first threaded rod 13, the upper end surface of the first installation cavity 5 is fixedly provided with a second motor 12, the output end of the second motor 12 is fixedly connected with the first threaded rod 13 through a coupler, one side of the moving plate 15 is fixedly provided with a third motor 14, one side of the moving plate 15 is rotationally connected with a second threaded rod 16, the outer surface of the second threaded rod 16 is in threaded connection with a moving block 18, the output end of the third motor 14 is fixedly connected with the second threaded rod 16, the first side of the second threaded rod 16 is in threaded rod 18 is not in threaded connection with the first sliding block 17, and the second sliding block 17 is in sliding connection with the first sliding block 17, and the second side 17 is not in sliding with the first sliding block 17.
Referring to fig. 6, 8, 9, 10, 11, 12, the patch welding mechanism 201 includes a connecting tube 28, the connecting tube 28 is a bellows, the upper end of the connecting tube 28 is fixedly connected with an automatic shrinking rod 19, a connecting air box 27 is fixedly installed between the automatic shrinking rod 19 and the connecting tube 28, a fourth motor 34 is fixedly installed on the inner wall of the connecting air box 27, the fourth motor 34 is located inside the connecting tube 28, a shrinking connecting arm 33 is arranged inside the connecting tube 28, the shrinking connecting arm 33 is fixedly connected with the inner wall of the connecting air box 27, a plurality of ventilation holes are formed on the outer surface of the shrinking connecting arm 33, a first shrinking tube 29 is rotatably connected at the bottom of the connecting tube 28, the output end of the fourth motor 34 is fixedly connected with the inner wall of the first shrinking tube 29, a second shrinking tube 30 is slidably connected at the bottom of the first shrinking tube 29, a third shrinking tube 31 is slidably connected at the bottom of the second shrinking tube 30, the bottom of the third shrinkage tube 31 is also provided with a corrugated tube, the bottom of the shrinkage connecting arm 33 is rotationally connected with the third shrinkage tube 31, a plurality of round holes 41 are respectively formed at the bottoms of the third shrinkage tube 31, the first shrinkage tube 29 and the second shrinkage tube 30, the outer surfaces of the third shrinkage tube 31, the second shrinkage tube 30 and the first shrinkage tube 29 are fixedly welded with an engaging toothed ring 36, the upper end surfaces of the third shrinkage tube 31, the first shrinkage tube 29 and the second shrinkage tube 30 are rotationally connected with a single connecting ring 42, the upper end surface of the single connecting ring 42 is rotationally connected with four groups of engaging gears 35, the single connecting ring 42 is fixedly connected with the shrinkage connecting arm 33, the engaging gears 35 are engaged with the engaging toothed ring 36, the inner walls of the second shrinkage tube 30 and the first shrinkage tube 29 are fixedly welded with an inner engaging toothed ring 32, the inner engaging toothed ring 32 is engaged with the engaging gears 35, the engaging toothed ring 36, the engaging gears 35 and the inner engaging toothed ring 32 are all made of titanium alloy, the titanium alloy has the characteristics of good corrosion resistance and high temperature resistance, the precision in the manufacturing process of the meshing toothed ring 36, the meshing gear 35 and the inscribed toothed ring 32 reaches 0.01MM, and the meshing toothed ring 36, the meshing gear 35 and the inscribed toothed ring 32 under the precision are meshed with each other for rotation, so that the probability of tooth clamping is greatly reduced;
The two groups of self-locking blocks 38 are fixedly welded on the upper end surfaces of the second shrinkage tube 30 and the first shrinkage tube 29, a double-connection ring 40 is fixedly connected between the two groups of second shrinkage tubes 30, a self-locking groove 39 is formed in the self-locking blocks 38, the gap between the inner space of the double-connection ring 40 and the gap between the self-locking groove 39 are 0.1MM, a self-locking column 37 is fixedly connected on the outer surfaces of the third shrinkage tube 31 and the second shrinkage tube 30, the diameter of the self-locking column 37 is 0.07MM, the diameter of the self-locking column 37 is smaller than the gap between the inner space of the double-connection ring 40 and the gap between the self-locking groove 39, the self-locking column 37 can move in the gap between the inner space of the double-connection ring 40 and the gap between the self-locking groove 39, the outer surface of the self-locking column 37 is in contact with the inner wall of the self-locking groove 39, an air suction cover 45 is fixedly connected to the outer surface of the first shrinkage tube 29, the outer surface of the air suction cover 45 is in an inverted umbrella shape, and the inverted umbrella shape can enlarge the effect of exhausting hot air to the third shrinkage tube 31, the second shrinkage tube 30 and the first shrinkage tube 29.
Referring to fig. 12, 13, 14, 15, 16, the switching mechanism 301 includes a first movable block 54, a first connection hole 57 and a second connection hole 58 are provided in the first movable block 54, the first connection hole 57 is connected with the connection pipe 28 through a hose, the second connection hole 58 is connected with the air suction cover 45 through a hose, specifically, an air pressure box 44 is fixedly connected between the second connection hole 58 and the air suction cover 45, the air pressure box 44 is fixedly installed at the bottom of the automatic contraction rod 19, firstly, air is sucked into the air pressure box 44, the air pressure box 44 sucks air from the air suction cover 45, the air suction cover 45 plays a role in regulating air pressure, so that the suction force of each group of air suction covers 45 is the same, one side of the first movable block 54 is detachably and slidably connected with the second movable block 56, the second movable block 56 is internally provided with the air suction hole 51 and the hot air hole 50, the air pump 10 is fixedly connected with the air suction hole 51, the hot air hole 50 is fixedly connected with the intelligent air heater 9, the air suction hole 51 is communicated with the second connecting hole 58 in an abutting mode, an elastic telescopic rod 53 is connected between the first movable block 54 and the second movable block 56, one side of the second movable block 56 is fixedly connected with an abutting cylinder through bolts, the bottom end of the inner wall of the first installation cavity 5 is fixedly connected with a pushing strip 52, the pushing strip 52 is positioned right below the abutting cylinder, a hot through hole 55 is arranged at the bottom of the first movable block 54, the hot air hole 50 is communicated with the hot through hole 55, the first movable block 54 is fixedly connected with a sliding tube 59, an air conveying hole is arranged inside the sliding tube 59, the outer surface of the sliding tube 59 is in sliding connection with the hot through hole 55, the sliding tube 59 is fixedly connected with the intelligent air heater 9, in particular, a radiating tube 61 is connected between the sliding tube 59 and the intelligent air heater 9, an air outlet of the air pump 10 is fixedly connected with an air outlet 60, the air outlet 60 is arranged at the bottom of the machine case 1, the inside hot-blast sliding tube 59 that gets into of intelligence air heater 9 through hot-blast hole 50, the inside hot-blast box 7 is put to the chip that can get into through cooling tube 61 to the inside hot-blast, the inside air vent of box 7 can dispel hot-blast to the chip at this moment put, cooling tube 61 can cool down to hot-blast, prevent that hot-blast temperature is high from causing melting to the solder paste that brushes on the chip board that installs, the solder paste is required suitable temperature to make the solder paste keep the viscosity on the chip board, so get into the inside box 7 from cooling tube 61, can keep the viscosity of solder paste at the hot-blast of following the air vent, automatic contraction pole 19 output and first movable block 54 fixed connection, first movable block 54 and first installation chamber 5 inner wall swing joint.
Referring to fig. 13 and 14, two sets of second sliding rods 49 are fixedly welded on the left side of the inner wall of the chassis 1, the two sets of second sliding rods 49 are vertically distributed, the outer surfaces of the second sliding rods 49 are slidably connected with first matching blocks 48, first sliding rods 47 are fixedly connected between the two sets of first matching blocks 48, first movable blocks 54 are slidably connected with the outer surfaces of the first sliding rods 47, matching shrinkage arms 46 are fixedly connected between the first movable blocks 54 and the automatic shrinkage rods 19, the output ends of the automatic shrinkage rods 19 are fixedly connected with the matching shrinkage arms 46, specifically, when the movable blocks 18 move, the movable blocks 18 drive the first movable blocks 54 to move through the matching shrinkage arms 46, and the first sliding rods 47 and the second sliding rods 49 vertically and horizontally enable the first movable blocks 54 to move up and down.
The working principle of the invention is as follows: the chip belt is arranged on the outer surface of the winding wheel 62, the other end of the chip belt is wound on the outer surface of the recovery wheel 23, when the chip on the chip belt is completely taken out, the first motor 11 is started, the recovery wheel 23 can drive the recovery wheel 23 to rotate, the recovery wheel 23 pulls the chip belt to move, the next group of chips on the chip belt are pulled up, the problem of chip feeding is solved, when the chip is required to be taken out, the second motor 12 is started, the first threaded rod 13 is driven to rotate to realize the front-back movement of the moving plate 15 and the moving block 18, the third motor 14 drives the second threaded rod 16 to rotate, the second threaded rod 16 drives the moving block 18 to move left and right, the automatic shrinkage rod 19 drives the third shrinkage tube 31, the second shrinkage tube 30 and the first shrinkage tube 29 to move downwards simultaneously, at the moment, the air suction hole 51 is communicated with the air pump 10 to suck air from the inside the air pump 10, the air hole 51 to the first connection hole 57, and the first connection hole 57 sucks air from the third shrinkage tube 31, the second shrinkage tube 30 and the first shrinkage tube 29;
When the chip is taken, the moving block 18 drives the third shrinkage tube 31 and the second shrinkage tube 30 and the first shrinkage tube 29 to absorb the chip, when the chip is larger, the fourth motor 34 is started, the fourth motor 34 drives the first shrinkage tube 29 and the inner toothed ring 32 of the inner wall of the first shrinkage tube 29 to rotate, at the moment, the meshing gear 35 meshed with the inner toothed ring 32 and the meshing toothed ring 36 at the upper end of the second shrinkage tube 30 rotate along with the same rotation, the second shrinkage tube 30 is driven by the meshing toothed ring 36 to rotate, according to the same working principle, the third shrinkage tube 31 also rotates along with the same working principle, but because the sizes of the third shrinkage tube 31 and the meshing toothed ring 36 at the upper end of the third shrinkage tube 31 and the meshing gear 35 are smaller than the sizes of the meshing toothed ring 36 at the upper end of the second shrinkage tube 30, the rotating amplitude of the third shrinkage tube 31 can be large, when the self-locking post 37 at the upper end of the third shrinkage tube 31 leaves a notch at the bottom of the self-locking block 38, the self-locking rod 19 continues to extend downwards, the third shrinkage tube 31 and the chip 31 can be connected with the inner wall of the second shrinkage tube 31 in turn, and the same principle can not rotate with the first shrinkage tube 31, and the chip can be prevented from sliding to the inner wall of the second shrinkage tube 31, and the chip can be prevented from being rotated, and the same size is prevented from sliding to the inner shrinkage tube 31.
When the automatic shrinkage rod 19 drives the third shrinkage tube 31 to move downwards with the second shrinkage tube 30 and the first shrinkage tube 29, note that when the third shrinkage tube 31 places the chip on the chip board, in order to prevent the problem that the second movable block 56 cannot be pushed upwards due to the fact that the abutting cylinder is just abutted with the pushing strip 52 when the third shrinkage tube 31 just abuts the chip on the chip board, when the third shrinkage tube 31 sucks the chip, the corrugated tube at the lower end of the third shrinkage tube 31 is abutted with the chip board first, and when the third shrinkage tube 31 continues to move downwards, the corresponding corrugated tube is shrunk, at the moment, the abutting cylinder drives the second movable block 56 to move upwards, and at the moment, the hot air hole 50 is communicated with the first connecting hole 57, and as the lengths of the third shrinkage tube 31 and the second shrinkage tube 30 and the first shrinkage tube 29 which are shrunk each time are different, the communicating area of the first connecting hole 57 and the air suction hole 51 is smaller, the communicating area of the third shrinkage tube 31 and the second shrinkage tube 30 and the first shrinkage tube 29 which are sequentially can be increased, the melting speed of the chip can be controlled according to the different manners that the lengths of the shrinkage holes which are increased each time and the air quantity of the chip is melted;
it should be noted that the first connecting hole 57 is oval, when the third shrink tube 31 is fully shrunk into the second shrink tube 30, the chip will be contacted with the lower ends of the second shrink tube 30 and the third shrink tube 31 when the chip is sucked, at this time, the second movable block 56 will be pushed upwards during the process of putting the chip on the chip board, but because the first connecting hole 57 is oval, the suction hole 51 will not be completely disconnected from the first connecting hole 57, so the chip will still be adsorbed, in this way, the chip detachment can be avoided, when the chip is contacted with the chip board, the second shrink tube 30 is pushed continuously to completely stagger the first connecting hole 57 from the suction hole 51, so the suction hole 51 is connected with the second connecting hole 58, the subsequent waste gas suction is facilitated, and similarly, when the first shrink tube 29 is contacted with the chip, the chip still operates.
In the process that the automatic contraction rod 19 drives the first movable block 54 to move downwards together, the first contraction tube 29 places the chip on the chip board, when the first connection hole 57 is connected with the hot air hole 50, the air suction hole 51 is also communicated with the second connection hole 58, the upper end of the sliding tube 59 plays a role in blocking the hot air hole 55 (at this time, the holes on the surface of the sliding tube 59 are staggered with the hot air hole 50, so that the hot air hole 50 cannot be communicated with the sliding tube 59, and the inner diameter of the hot air hole 50 is larger than the outer diameter of the holes on the surface of the sliding tube 59, therefore, when the sliding tube 59 is staggered with the hot air hole 50, the communication between the hot air hole 50 and the first connection hole 57 is not influenced, at this time, hot air inside the hot air hole 50 can be blown to the chip through the third contraction tube 31 and the second contraction tube 30, the first contraction tube 29 is also heated and welded, in order to prevent the hot air from being blown to other solder paste, at this time, the air pump 10 can suck the hot air to the second connection hole 58, so that the hot air can be sucked out, and the harmful gas during welding can be discharged from the exhaust port 60, and the harmful gas is worth being sucked to the outside, and the people can be welded, and the outside can be prevented from being required to finish the welding.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (5)
1. The utility model provides an optical modulator chip processing is with installation, includes quick-witted case (1), its characterized in that, first installation cavity (5) and second installation cavity (6) have been seted up to quick-witted case (1) inside, first installation cavity (5) inner wall bottom fixedly connected with chip is put box (7), two sets of correction board (26) of up end fixedly connected with of chip is put box (7), one of them set of correction board (26) one side fixedly connected with flexible automatic shrinkage tube (43) freely, automatic shrinkage tube (43) output fixedly connected with butt strip, first installation cavity (5) inside is provided with movable block (18), movable block (18) inside bottom fixed in first installation cavity (5) movable mechanism (101) of free movement of controllable movable block (18), one side fixedly connected with five sets of automatic shrinkage pole (19) of movable block (18), and automatic shrinkage pole (19) output fixed mounting have paster welding mechanism (201), wherein one set of movable block (18) left side fixed connection has air pump (301) inside the fixed installation of second installation cavity (301);
The moving mechanism (101) comprises a moving plate (15), the bottom of the moving plate (15) is in sliding connection with the inner wall of the first installation cavity (5), a first threaded rod (13) is rotationally connected to the bottom end inside the first installation cavity (5), the moving plate (15) is in threaded connection with the outer surface of the first threaded rod (13), and a second motor (12) is fixedly installed on the upper end surface of the first installation cavity (5);
The patch welding mechanism (201) comprises a connecting pipe (28), the connecting pipe (28) is a corrugated pipe, a plurality of air holes are formed in the outer surface of the connecting pipe (28), a first shrinkage pipe (29) is fixedly connected to the bottom of the connecting pipe (28), a second shrinkage pipe (30) is fixedly installed between the automatic shrinkage pipe (19) and the connecting pipe (28), a fourth motor (34) is fixedly installed on the inner wall of the air box (27), the fourth motor is located inside the connecting pipe (28), a shrinkage connecting arm (33) is arranged inside the connecting pipe (28), the shrinkage connecting arm (33) is fixedly connected with the inner wall of the air box (27), a plurality of air holes are formed in the outer surface of the shrinkage connecting arm (33), a first shrinkage pipe (29) is connected to the bottom of the connecting pipe (28), a third shrinkage pipe (31) is connected to the bottom of the second shrinkage pipe (30) in a sliding mode, the lower end of the third shrinkage pipe (31) is also arranged to be the corrugated pipe, the bottom of the shrinkage connecting arm (33) is fixedly connected with the third shrinkage pipe (31), a plurality of shrinkage holes are formed in the bottom of the third shrinkage pipe (31), and a plurality of shrinkage holes are formed in the bottom of the first shrinkage pipe (31) and the third shrinkage pipe (31) The outer surfaces of the second shrinkage tube (30) and the first shrinkage tube (29) are respectively fixed with an engaged toothed ring (36);
The switching mechanism (301) comprises a first movable block (54), a first connecting hole (57) and a second connecting hole (58) are formed in the first movable block (54), the first connecting hole (57) is fixedly connected with a connecting pipe (28), the second connecting hole (58) is fixedly connected with an air suction cover (45), a second movable block (56) is detachably and slidably connected to one side of the first movable block (54), an air suction hole (51) and a hot air hole (50) are formed in the second movable block (56), the air suction hole (51) is fixedly connected with an air pump (10), the hot air hole (50) is fixedly connected with an intelligent air heater (9), and an elastic telescopic rod (53) is connected between the first movable block (54) and the second movable block (56).
2. The mounting machine for processing optical modulator chips according to claim 1, wherein the output end of the second motor (12) is fixedly connected with the first threaded rod (13), a third motor (14) is fixedly mounted on one side of the moving plate (15), a second threaded rod (16) is rotatably connected on one side of the moving plate (15), the outer surface of the second threaded rod (16) is in threaded connection with the moving block (18), and the output end of the third motor (14) is fixedly connected with the second threaded rod (16).
3. The mounting machine for processing optical modulator chips according to claim 1, wherein the third shrink tube (31), the first shrink tube (29) and the second shrink tube (30) are rotationally connected with a single connecting ring (42), the upper end surface of the single connecting ring (42) is rotationally connected with four groups of meshing gears (35), the single connecting ring (42) is fixedly connected with the shrink connecting arm (33), the meshing gears (35) are mutually meshed with the meshing toothed ring (36), the second shrink tube (30) and the inner wall of the first shrink tube (29) are respectively fixed with an inner toothed ring (32), the inner toothed ring (32) and the meshing gears (35) are respectively fixed with two groups of self-locking blocks (38), a double connecting ring (40) is fixedly connected between the two groups of second shrink tubes (30), self-locking grooves (39) are formed in the self-locking blocks (38), the third shrink tube (31) and the inner wall of the first shrink tube (29) are respectively fixed with an inner toothed ring (32), the second shrink tube (30) is respectively fixed with two groups of self-locking blocks (38), and the second shrink tube (30) is fixedly connected with the outer surface of the self-locking column (37).
4. The mounting machine for processing optical modulator chips according to claim 1, wherein one side of the second movable block (56) is fixedly connected with a butt cylinder through a bolt, the bottom end of the inner wall of the first mounting cavity (5) is fixedly connected with a pushing strip (52), a thermal through hole (55) is formed in the bottom of the first movable block (54), the first movable block (54) is fixedly connected with a sliding pipe (59), a gas transmission hole is formed in the sliding pipe (59), the outer surface of the sliding pipe (59) is movably connected with the inner wall of the thermal through hole (55), the sliding pipe (59) is fixedly connected with the intelligent air heater (9), the output end of the automatic shrinkage rod (19) is fixedly connected with the first movable block (54), and the first movable block (54) is movably connected with the inner wall of the first mounting cavity (5).
5. The mounting machine for processing the optical modulator chip according to claim 1, wherein the upper end face of the first mounting cavity (5) is fixedly connected with a fixing block (8), the upper end face of the fixing block (8) is fixedly connected with five groups of mounting frames (21), a winding wheel (62) for winding a chip belt and a recycling wheel (23) for recycling a waste chip belt after use are rotatably connected inside the mounting frames (21), the five groups of recycling wheels (23) are fixedly connected, the upper end face of the fixing block (8) is fixedly provided with a first motor (11), and one group of recycling wheels (23) is fixedly connected with the output end of the first motor (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202410755488.2A CN118354539B (en) | 2024-06-12 | 2024-06-12 | Mounting machine for processing optical modulator chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410755488.2A CN118354539B (en) | 2024-06-12 | 2024-06-12 | Mounting machine for processing optical modulator chip |
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| CN118354539A CN118354539A (en) | 2024-07-16 |
| CN118354539B true CN118354539B (en) | 2024-08-27 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267463A (en) * | 2019-07-18 | 2019-09-20 | 安徽天通精电新科技有限公司 | Automatic chip mounter for mounting and processing electronic components and operation method thereof |
| CN114530408A (en) * | 2022-01-26 | 2022-05-24 | 赵美玲 | Chip processing is with subsides installation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103340029B (en) * | 2011-12-22 | 2016-02-24 | 松下知识产权经营株式会社 | Electronic component hookup wire and electronic component mounting method |
| CN220823657U (en) * | 2023-09-19 | 2024-04-19 | 深圳市瑞智欣丰电子有限公司 | Beidou chip mounting assembly |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267463A (en) * | 2019-07-18 | 2019-09-20 | 安徽天通精电新科技有限公司 | Automatic chip mounter for mounting and processing electronic components and operation method thereof |
| CN114530408A (en) * | 2022-01-26 | 2022-05-24 | 赵美玲 | Chip processing is with subsides installation |
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