CN118296970A - Cavity structure optimization method and system for embedded liquid cooling heat sink of electronic chip - Google Patents
Cavity structure optimization method and system for embedded liquid cooling heat sink of electronic chip Download PDFInfo
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Abstract
The invention belongs to the technical field of electronic core industry, and discloses a cavity structure optimization method and a system of an electronic chip embedded liquid cooling heat sink, wherein the method comprises the following steps: s1, under the condition of various heat source loads, an embedded liquid cooling heat sink model optimized for a cavity structure is established; s2, taking the highest temperature of a heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink as design variables, adopting a method of combining numerical calculation and genetic algorithm, taking the vertical plane cavity structure of the embedded liquid cooling heat sink cavity as an optimization variable, and adopting genetic algorithm to optimize the cavity structure of the embedded liquid cooling heat sink; and S3, respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
Description
Technical Field
The invention belongs to the technical field of electronic core industry, and particularly relates to a cavity structure optimization method and system of an electronic chip embedded liquid cooling heat sink.
Background
The embedded cooling technology is called "new generation cooling technology". On one hand, the embedded cooling attracts the wide attention of a plurality of students at home and abroad due to the excellent cooling performance, and is increasingly applied to the cooling research of 3D chips. On the other hand, in practical engineering applications, the power distribution of the chip is uneven, and the heat flux density at different positions is greatly different, which results in a large temperature gradient in the operation process of the chip. The excessive temperature gradient inside the chip can lead to increased delay of signal transmission inside the chip, and the chip is easy to warp due to uneven thermal stress.
The cavity structure of the heat sink also affects the heat dissipation of the heat sink. Under the condition of uniform heat source in summer, the best flow uniformity and the strongest heat dissipation capacity in the rectangular cavity are obtained by comparing the heat dissipation performance of the liquid cooling heat sink cavity structures of the trapezium, the rectangle and the triangle.
Through the above analysis, the problems and defects existing in the prior art are as follows:
(1) The heat dissipation efficiency is not enough: in the face of high heat flux density and uneven heat distribution, the existing micro-channel cooling technology still has the problem of insufficient heat dissipation efficiency, which can cause the chip temperature to be too high, and influence the performance and service life of the chip.
(2) The temperature gradient is too great: the temperature gradient is too large, so that the thermal stress in the chip is uneven, the problems of chip warpage, signal transmission delay increase and the like can be caused, and the stability and the reliability of the system are seriously affected.
Disclosure of Invention
Aiming at the problems existing in the prior art, the invention provides a cavity structure optimization method and a system for an electronic chip embedded liquid cooling heat sink.
The invention is realized in such a way that the cavity structure of the embedded liquid cooling heat sink of the electronic chip is optimized, the cavity structure optimization method of the embedded liquid cooling heat sink of the electronic chip comprises the following steps:
S1, under the condition of various heat source loads, an embedded liquid cooling heat sink model optimized for a cavity structure is established;
S2, taking the highest temperature of a heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink as design variables, adopting a method of combining numerical calculation and genetic algorithm, taking the vertical plane cavity structure of the embedded liquid cooling heat sink cavity as an optimization variable, and adopting genetic algorithm to optimize the cavity structure of the embedded liquid cooling heat sink;
And S3, respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
Further, the continuity equation of fluid flow is:
(1)
the conservation of momentum equation for fluid flow is:
(2)
the energy conservation equation for fluid flow is:
(3)
the energy conservation equation for a solid is:
(4)
the continuity equation for the heat flux density and temperature of the solid and fluid interface is:
(5)
(6)
In the method, in the process of the invention, (Kg.m -3) is the fluid density,(M.s -1) is the velocity vector of the fluid, p (Pa) is the pressure, I is the identity matrix,(N) is the volumetric force vector,(W.m -1·K-1) is the thermal conductivity of the fluid,(W.m -1·K-1) is the thermal conductivity of the solid.
Further, the boundary conditions are as follows:
(1) The flow and heat transfer are fully developed, the inlet water temperature is constant, ；
(2) The inlet Reynolds number is 250-1500;
(3) The outlet relative pressure is 0 Pa;
(4) Giving heat flux density to each partition of the chip, wherein other outer wall surfaces of the heat sink are insulated except for the position contacted with the chip;
solving equations (1) - (6) in combination with the boundary conditions can obtain information of the temperature distribution and the fluid pressure distribution.
Further, the optimizing the cavity structure of the embedded liquid cooling heat sink by adopting the genetic algorithm specifically comprises the following steps:
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow direction Liquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkTaking the minimum highest temperature as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design;
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow direction Liquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum temperature uniformity factor as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
Another object of the present invention is to provide a cavity structure optimization system for an electronic chip embedded liquid cooling heat sink, which implements the cavity structure optimization method for an electronic chip embedded liquid cooling heat sink, including:
The heat sink model building module is used for building an embedded liquid cooling heat sink model optimized for the cavity structure under various heat source load conditions;
The optimal design module is used for taking the highest temperature of the heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink along the flow direction as structural design variables, respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
And the genetic algorithm optimization module optimizes the cavity structure of the embedded liquid cooling heat sink by adopting a method of combining numerical calculation and genetic algorithm. Another object of the present invention is to provide a computer device, where the computer device includes a memory and a processor, and the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the method for optimizing a cavity structure of the electronic chip embedded liquid cooling heat sink.
Another object of the present invention is to provide a computer readable storage medium storing a computer program, which when executed by a processor, causes the processor to execute the steps of the method for optimizing a cavity structure of an electronic chip embedded liquid cooling heat sink.
The invention further aims to provide an information data processing terminal which is used for realizing the cavity structure optimization system of the electronic chip embedded liquid cooling heat sink.
In combination with the technical scheme and the technical problems to be solved, the technical scheme to be protected has the following advantages and positive effects:
According to the invention, under various heterogeneous heat source load conditions, an embedded liquid cooling heat sink model optimized for a cavity structure is established, a numerical method based on multi-physical field coupling calculation is adopted, the highest temperature of a heat source, a temperature uniformity factor and the pump consumption power of a liquid cooling heat sink are used as performance indexes, the vertical plane cavity structure of the cavity of the embedded liquid cooling heat sink is used as an optimization variable, a genetic algorithm is adopted to optimize the cavity structure of the embedded liquid cooling heat sink, the result of optimal design is obtained, and the radiating effect of an electronic device is improved.
Second, the present invention solves the problems of the prior art as follows:
the heat dissipation efficiency is not enough: the existing embedded liquid cooling heat sink structure still has insufficient heat dissipation efficiency when facing high heat flux and uneven heat source distribution, and cannot fully meet the heat dissipation requirements of modern chips with high integration level and high power density.
The temperature gradient is too great: because of uneven power distribution in the chip, a large temperature gradient exists in the operation process of the chip. Excessive temperature gradients can cause thermal stress concentration, resulting in problems such as chip warpage, signal transfer delay, and the like, thereby affecting the stability and reliability of the system.
The structural design is not optimized: the structural design of the cavity of the existing embedded liquid cooling heat sink cannot fully consider the diversity of heat source loads, and cannot realize the optimal heat dissipation effect under different heat source conditions. The existing design method lacks systematic optimization, which results in unsatisfactory cooling performance.
The invention has the remarkable technical progress that:
the invention provides a cavity structure optimization method of an electronic chip embedded liquid cooling heat sink, which is characterized in that the cavity structure of the embedded liquid cooling heat sink is optimally designed by combining numerical calculation and genetic algorithm, so that the problems in the prior art are solved, and the obvious technical progress is realized:
Improving the heat dissipation efficiency: by establishing an embedded liquid cooling heat sink model aiming at different heat source load conditions and taking the highest temperature of a heat source, the temperature uniformity factor and the pump consumption power as performance indexes, the cavity structure design is optimized, and the heat dissipation efficiency of the liquid cooling heat sink is remarkably improved.
Reducing the temperature gradient: the genetic algorithm is adopted to optimally design the heights and positions of the protrusions of the upper wall surface and the lower wall surface of the liquid cooling heat sink, so that the temperature distribution in the liquid cooling heat sink is more uniform under different heat source load conditions, the temperature gradient in the chip is reduced, the thermal stress is reduced, and the stability and the reliability of the system are improved.
And (3) structural optimization design: by combining numerical calculation and genetic algorithm, the height of the protrusions on the upper wall surface and the lower wall surface of the internal cavity of the heat sink and the position along the flow direction are used as design variables, and four-degree-of-freedom optimization design is carried out, so that the liquid cooling heat sink can realize the optimal heat dissipation effect under different heat source load conditions. The optimized cavity structure is excellent in fluid flow uniformity and heat dissipation capacity.
Optimization based on various heat source load conditions: and a model is built aiming at various heat source load conditions to respectively obtain the optimal structures under different heat source load conditions, so that the universality and the high efficiency of the liquid cooling heat sink in different use scenes are realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embedded liquid cooling channel according to an embodiment of the present invention;
FIG. 2 is a grid independence verification schematic diagram provided by an embodiment of the present invention;
FIG. 3 is a diagram of a genetic algorithm optimization trajectory provided by an embodiment of the present invention;
FIG. 4 is a schematic illustration of an embodiment of the present invention Along with itAndIs a change rule diagram of the (a);
FIG. 5 is a diagram of a genetic algorithm optimization trajectory provided by an embodiment of the present invention;
FIG. 6 is a diagram of a genetic algorithm optimization trajectory provided by an embodiment of the present invention;
FIG. 7 is a schematic illustration of an embodiment of the present invention Along with itIs a change rule diagram of the (a);
FIG. 8 is a diagram of an embodiment of the present invention Along with itAndIs a change rule diagram of the (a);
FIG. 9 is a diagram of a genetic algorithm optimization trajectory provided by an embodiment of the present invention;
FIG. 10 is a cloud chart of temperature distribution corresponding to four degrees of freedom optimization provided by an embodiment of the present invention; wherein (a) is as follows Minimum target, (b) targetThe minimum is the target;
FIG. 11 is a flow chart of a method for optimizing a cavity structure of an electronic chip embedded liquid cooling heat sink, which is provided by an embodiment of the invention;
fig. 12 is a structural diagram of a cavity structure optimization system of an electronic chip embedded liquid cooling heat sink according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Aiming at the problems in the prior art, the invention provides a cavity structure optimization method and a cavity structure optimization system for an electronic chip embedded liquid cooling heat sink, and the invention is described in detail below with reference to the accompanying drawings.
Two specific application embodiments of the embodiment of the invention are as follows:
Example 1: embedded liquid cooling heat sink optimization application of high-performance image sensor chip
And (3) establishing a model: and establishing an embedded liquid cooling heat sink model according to the heat source load condition of the image sensor chip. The power distribution and heat flux density variation of the chip are considered in the model, and the continuity equation, the momentum conservation equation and the energy conservation equation are used for describing the fluid flow and heat transfer.
And (3) optimizing design: the liquid cooling heat sink upper wall surface bulge along the flow direction position, the liquid cooling heat sink lower wall surface bulge along the flow direction position, the liquid cooling heat sink upper wall surface bulge height and the liquid cooling heat sink lower wall surface bulge height are taken as design variables. And taking the minimum highest temperature and the minimum temperature uniformity factor as objective functions, and adopting a genetic algorithm to carry out four-degree-of-freedom optimization design.
The optimization process comprises the following steps: and simulating fluid flow and temperature distribution in the liquid cooling heat sink through numerical calculation, and obtaining heat radiation performance data under different design variable combinations. And carrying out iterative optimization on the design variable by utilizing a genetic algorithm, and gradually approaching to an optimal structure.
Analysis of results: the liquid cooling heat sink cavity structure obtained through optimization shows good heat dissipation performance under different heat source load conditions. The optimized structure obviously reduces the highest temperature of the image sensor chip, reduces the temperature gradient and improves the stability and the reliability of the chip.
Example 2: embedded liquid cooling heat sink optimization application of 3D stacked semiconductor chip
And (3) establishing a model: and establishing an embedded liquid cooling heat sink model aiming at the 3D stacked semiconductor chips. The heat source load condition of the multi-layer chip is considered in the model, and the heat flow density and the temperature continuity of the interface between the fluid and the solid are described by using an energy conservation equation of the fluid and the solid.
And (3) optimizing design: the liquid cooling heat sink upper wall surface bulge along the flow direction position, the liquid cooling heat sink lower wall surface bulge along the flow direction position, the liquid cooling heat sink upper wall surface bulge height and the liquid cooling heat sink lower wall surface bulge height are taken as design variables.
Performance index: and (3) taking the minimum pump consumption power and the minimum temperature uniformity factor as objective functions, and adopting a genetic algorithm to carry out optimal design.
The optimization process comprises the following steps: and simulating fluid flow and temperature distribution in the liquid cooling heat sink to obtain heat radiation performance data under different design variable combinations. And carrying out iterative optimization on the design variable by utilizing a genetic algorithm, and gradually approaching to an optimal structure.
Analysis of results: the liquid cooling heat sink cavity structure obtained through optimization shows excellent heat dissipation performance under different heat source load conditions of the multi-layer 3D stacked chips. The optimized structure effectively reduces the highest temperature of the 3D stacked semiconductor chips, remarkably reduces the temperature gradient, and improves the reliability and service life of the chips.
The detailed working principle of the embodiment of the invention is as follows:
1. Mathematical model
1.1 Geometric model
Fig. 1 shows a schematic diagram of a 3D integrated chip with embedded liquid cooling channels. As shown in fig. 1, the upper and lower chips are connected through a passive adapter plate in the middle, and an embedded liquid cooling micro channel is integrated in the middle of the passive adapter plate. The liquid cooling heat sink model was set to 13000 μm, 23000 μm and 1000 μm in width, length and height, respectively.Is a position of the upper wall surface bulge of the liquid cooling heat sink along the flow direction,The height of the protrusion on the upper wall surface of the liquid cooling heat sink is set; is a position along the flow direction of the liquid-cooled and heated sinking wall surface bulge, The height of the wall surface bulge is sunk for liquid cooling and heating. Length and width of chip heat sourceThe hot spot is a square region of 1000 μm width at 10000 μm. The uniform heat source is a uniform heat source with 100W power, the total power of the non-uniform heat source is 100W, the hot spot power is 10W, and the inlet mass flow is 1g/s.
1.2 Physical model
Because silicon has abundant reserves in nature and low purification cost, and has more stable property at high temperature compared with other semi-metallic elements, the silicon is widely used in the semiconductor industry. At the same time, silicon has good thermal conductivity, corrosion resistance and workability, and is often used as a wall material for micro-channels. Deionized water is selected as the liquid coolant. The invention researches the convection heat transfer problem of four embedded liquid cooling heat sinks under the condition of two heat sources, and is assumed to be as follows:
(1) The fluid flow and the heat transfer are in a steady state, the coolant is incompressible, and the fluid state is laminar;
(2) The fluid and the solid material are all normal physical properties, and the solid heat conduction material is isotropic;
(3) The wall surface of the runner adopts a non-slip boundary condition;
(4) The gravity is not considered, and the heat dissipation caused by radiation heat exchange and viscous dissipation is not considered.
Based on the above assumption, the continuity equation of fluid flow is:
(1)
the conservation of momentum equation for fluid flow is:
(2)
the energy conservation equation for fluid flow is:
(3)
the energy conservation equation for a solid is:
(4)
the continuity equation for the heat flux density and temperature of the solid and fluid interface is:
(5)
(6)
In the method, in the process of the invention, (Kg.m -3) is the fluid density,(M.s -1) is the velocity vector of the fluid, p (Pa) is the pressure, I is the identity matrix,(N) is the volumetric force vector,(W.m -1·K-1) is the thermal conductivity of the fluid,(W.m -1·K-1) is the thermal conductivity of the solid.
The boundary conditions are as follows:
(1) The flow and heat transfer are fully developed, the inlet water temperature is constant, ；
(2) The inlet Reynolds number is 250-1500;
(3) The outlet relative pressure is 0 Pa;
(4) Giving heat flux density to each partition of the chip, wherein other outer wall surfaces of the heat sink are insulated except for the position contacted with the chip;
by solving the equations (1) to (6) in combination with the above boundary conditions, information on the temperature distribution and the fluid pressure distribution can be obtained.
1.3 Numerical method
The present invention uses COMSOL Multiphysics software to solve equations (1) - (6) under the corresponding boundary conditions. To ensure the accuracy and precision of the calculation result, the grid independence is checked. Table 1 lists the finite element numerical calculations for six different meshing strategies. The invention selects the 3 rd set of grid division strategies.
Table 1 grid independence test
2. Cavity structure optimization under uniform heat source condition
2.1 Maximum temperature minimizing Structure design
(1) Single degree of freedom optimization
Aiming at the height of the protrusion of the wall surface of the liquid-cooled heat sinkAnd (5) performing single-degree-of-freedom optimization. Under the condition of uniform heat source, the liquid-cooled and heated submerged wall surface bulges are positioned along the flow directionLiquid cooling heat sink upper wall surface bulge along flow direction positionAnd the height of the protrusion on the upper wall surface of the liquid cooling heat sink22.8Mm, 22.8mm and 0mm respectively.
Highest temperature of chip assemblyAlong with itIs increased by slightly increasing and then decreasing. When (when)When the heat exchange area is increased, the heat exchange area in the cavity is gradually reduced from the upstream to the downstream of the heat sink, and the fluid speed is gradually increased. In a conventional heat sink, the upstream temperature of the heat sink is low and the downstream temperature is high. The temperature of the upstream cooling working medium is low, so that the convection heat exchange capacity is strong; when the cooling working medium is heated by the heat source, the temperature is increased, the convection heat exchange capacity is weakened, and therefore the downstream temperature of the heat sink is high. When (when)When the cooling medium is increased, the speed of the fluid in the heat sink is gradually increased along the flow direction, so that the heat dissipation capacity of the cooling medium to the heat sink downstream area is enhanced. But is provided withThe increase can lead to the heat exchange area of the heat sink to be reduced, which is unfavorable for the heat dissipation of the heat sink. Thus, whenAfter greater than 0.4mm, the highest temperature of the chip assemblyAlong with itAnd increases with increasing number.
Comparing the highest temperature of the chip assembly at different powersAnd (3) withAs can be seen from the relationship between the above, the heat source powers were 50W, 75W and 100W,And (3) withThe change trend of the relation curve of (a) is similar, and the relation curve is firstly reduced and then increased.At the time of 0.4mm in length,The obtained minimum values are 315.02K, 325.33K and 335.78K respectively, and compared with a heat sink cavity structure before optimization, the highest temperature is reduced by 1.05K, 1.52K and 1.76K.
(2) Two degree of freedom optimization
Aiming at the height of the protrusion of the wall surface of the liquid-cooled heat sinkAnd the liquid cooling and heating sinking wall surface bulge are arranged along the flow directionTwo degrees of freedom optimization is performed. Under the condition of uniform heat source, the upper wall surface of the liquid cooling heat sink is not provided with a bulge.
Highest temperature of chip assemblyAnd (3) withAndExhibits small range fluctuations in three-dimensional relationships of (a) onlyAt the time of being equal to 0.5mm,Along with itThe trend of change in (2) is evident. At the position of=0.5mm，When the value of the ratio is =15.5 mm,The minimum values obtained are 312.88K, 322.51K and 332.03K respectively, compared withThe temperature was reduced by 2.93K, 4.34K and 5.51K at 0mm. By optimizing as the power of the heat source increasesAndThe more the effect of (c) is evident,The greater the magnitude of the drop in (c).
(3) Multi-degree-of-freedom optimization based on genetic algorithm
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow directionLiquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum highest temperature as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
Fig. 3 shows a diagram of the optimization trajectory of the genetic algorithm, wherein,AndRanging from 1 to 22.8mm,AndRanging from 0 to 0.3mm. Considering the precision requirement of the problem, the diversity of generated individuals is considered, the population number is 50, the maximum genetic algebra is 15, the individual selection strategy is random traversal, generation gap takes 0.9, the crossover probability is 0.7, and odd individuals are crossed with the offspring of adjacent positions.
Optimizing results、、And10.981Mm, 11.691mm, 0.288mm and 0.299mm, respectively, the highest temperature of the chipFor 328.03K, the optimization result of the two degrees of freedom is reduced by 3.99K, and the optimization result is reduced by 9.51K when the cavity is not optimized.
2.2 Temperature uniformity factor minimizing structural design
(1) Single degree of freedom optimization
Under the condition of uniform heat source, the liquid-cooled and heated submerged wall surface bulges are positioned along the flow directionIs 22.8mm and is positioned at the tail end of the heat sink cavity. The upper wall of the heat sink has no protrusions.
Temperature uniformity factor for chip assemblySinking the height of the wall surface bulge along with the cooling and heating of the liquidIs decreased and then increased. When (when)When the heat exchange area is increased, the heat exchange area in the cavity is gradually reduced from the upstream to the downstream of the heat sink, and the fluid speed is gradually increased. In a typical heat sink, the upstream temperature of the heat sink is low and the downstream temperature is high. The temperature of the cooling working medium at the upstream is low, so that the convection heat exchange capacity is strong; when the cooling working medium is heated by the heat source, the temperature is increased, the convection heat exchange capacity is weakened, and therefore the downstream temperature of the heat sink is high. When (when)When the cooling medium is increased, the speed of the fluid in the heat sink is gradually increased along the flow direction, so that the heat dissipation capacity of the cooling medium to the heat sink downstream area is enhanced. Compared with the traditional heat sink cavity, the downstream area is cooled better, the temperature is reduced, and the temperature uniformity is increased. But is provided withThe increase may result in a decrease in the heat transfer area of the heat sink. Thus, whenAfter greater than 0.4mm, withIs increased, the temperature of the downstream region of the heat sink is increased, and the chip assemblyAlong with itAnd increases with increasing number.
Comparing temperature uniformity factors of chip components at different powersHeight of protrusion of wall surface under liquid cooling and heatingAs is clear from the relation of (a), when the heat source power is 50W, 75W and 100W,And (3) withThe change trend of the relation curve of (a) is similar, and the relation curve is firstly reduced and then increased.At the time of 0.4mm in length,The obtained minimum values are 4.0285K, 6.0065K and 7.9666K respectively, and compared with the temperature uniformity factors before the heat sink cavity structure is not optimized, 0.3523K, 0.5125K and 0.6005K are reduced.
(2) Two degree of freedom optimization
Aiming at the height of the protrusion of the wall surface of the liquid-cooled heat sinkAnd the liquid cooling and heating sinking wall surface bulge are arranged along the flow directionTwo degrees of freedom optimization is performed. FIG. 4 shows the temperature uniformity factor of the chip assembly under uniform heat source conditionsHeight of protrusion of wall surface under liquid cooling and heatingAnd the liquid cooling and heating sinking wall surface bulge are arranged along the flow directionIs a relationship of (3). At this time, the upper wall surface of the heat sink cavity has no protrusion.
As can be seen from fig. 4, the temperature uniformity of the chip assemblyAnd (3) withAndExhibits small range fluctuations in three-dimensional relationships of (a) onlyThe diameter of the particles is 0.5mm,Along with itThe trend of change in (2) is evident.At the end of the length of the tube at 0.5mm,At the time of 15.5mm in length,Minimum values of 3.4642K, 5.171K and 6.8666K were obtained, respectively, and the temperature uniformity factors were reduced by 0.9166K, 1.348K and 1.7005K compared to before the cavity optimization.
(3) Multi-degree-of-freedom optimization based on genetic algorithm
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow directionLiquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum temperature uniformity factor as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
Fig. 5 shows the locus of the optimization of the genetic algorithm, wherein,AndRanging from 1 to 22.8mm,AndRanging from 0 to 0.3mm. Considering the precision requirement of the problem, the diversity of generated individuals is considered, the population number is 50, the maximum genetic algebra is 15, the individual selection strategy is random traversal, generation gap takes 0.9, the crossover probability is 0.7, and odd individuals are crossed with the offspring of adjacent positions. Optimizing the result:、、 And 11.281Mm, 10.891mm, 0.29224mm and 0.2877mm, respectively, the highest temperature of the chipFor 5.3062K, 1.5604K is reduced compared with the optimization result of double degrees of freedom, and 3.2609K is reduced compared with the optimization result of the cavity.
2.3 Flow heat transfer mechanism analysis
When the liquid cooling and heating sinking wall surface bulges are positioned along the flow directionWhen the height of the protrusion of the upper wall surface of the heat sink is 22.8mm and the protrusion of the lower wall surface is not provided with the protrusion, the liquid cooling and heating are carried outVelocity profile clouds at 0mm, 0.3mm, 0.4mm and 0.5 mm. As can be seen from the figure, asGradually increasing, the velocity downstream of the heat sink gradually increases. The upstream of the heat sink is firstly cooled by the fluid, and the fluid has low temperature, strong convection heat exchange capability and good cooling effect. After the fluid passes through the convection heat exchange of the upstream area, the temperature of the fluid is increased, the heat dissipation capacity is weakened, and therefore the temperature of the downstream heat sink is higher. Reduction ofThe flow speed of the cooling working medium in the downstream area of the heat sink is increased, and the heat exchange in the downstream area of the heat sink can be enhanced.
When the upper wall surface of the heat sink cavity is not provided with the bulge, the liquid cooling and heating are sinking to the height of the bulge of the wall surface0.3Mm and 0.5mm and the liquid cold and hot sinking wall surface bulge along the flow directionCloud of velocity profiles at 3.5mm, 15.5mm and 18.5 mm. As can be seen from the figures, by varyingThe position of the cavity with higher cooling medium flow rate can be controlled. When (when)When the high-flow-rate area is positioned below the high-temperature area of the heat source, the heat exchange capacity of the high-temperature area can be enhanced, and the temperature of the hot spot area can be reduced.
In the process of optimizing the single degree of freedom,Temperature distribution cloud patterns corresponding to 0mm, 0.3mm, 0.4mm and 0.5mm. With the follow-upGradually increasing, the speed downstream of the heat sink gradually increases, and the temperature of the hot spot area of the heat source is reduced and then increased. When (when)At 0.4mm, the area of the high temperature region of the heat source is the smallest, and the temperature of the heat source is the lowest. From the temperature distribution in the figure, it can be found that the high temperature areas of the heat source are concentrated in the downstream area of the heat sink, and the fluid temperature is increased after the fluid undergoes the convective heat transfer with the heat source, and the heat dissipation capacity is reduced, so that the downstream temperature of the heat sink is higher.
To be used forAnd carrying out temperature cloud pictures corresponding to the structure subjected to four-degree-of-freedom optimization by adopting a genetic algorithm as a minimum target. Liquid cooling heat sink upper wall surface bulge along flow direction positionLiquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sink10.981Mm, 11.691mm, 0.2877mm and 0.29883mm, respectively. Highest temperature of chipFor 328.03K, the optimization result is reduced by 3.99K compared with the double-degree-of-freedom, and 9.51K compared with the traditional cavity without the optimization. To be used forAnd carrying out temperature cloud pictures corresponding to the structure subjected to four-degree-of-freedom optimization by using a genetic algorithm with the minimum as a target.、、And11.281Mm, 10.891mm, 0.29224mm and 0.2877mm, respectively. Temperature uniformity factor of chipFor 5.3062K, 1.5604K is reduced compared with the optimization result of double degrees of freedom, and 3.2609K is reduced compared with the traditional cavity with non-optimized cavity. It can be seen from the figure that under the condition of uniform heat source, after four degrees of freedom optimization, the area of the high temperature area of the heat source is reduced, the temperature is reduced, and the temperature uniformity is increased.
3. Cavity structure optimization under non-uniform heat source condition
3.1 Maximum temperature minimizing structural design
(1) Single degree of freedom optimization
Highest temperature of chip assembly under uniform heat source conditionHeight of protrusion of wall surface under liquid cooling and heatingIs a relationship of (3). At this time, the protrusion of the lower wall surface of the liquid cooling heat sink is positioned along the flow directionThe upper wall surface of the cavity of the liquid cooling heat sink is not convex and is 22.8 mm.
At power of 10W and 20W for the hot spot region,And (3) withThe trend of the relation curve of (a) is similar, along withAnd decreases with increasing numbers.At the time of 0.5mm in length,Minimum values 370.35K and 413.73K were obtained, respectively, which were reduced by 4.77K and 7.49K compared to the temperature before optimization. The heat source heat dissipation device is characterized in that the hot spot area of the non-uniform heat source is positioned in the power area of the heat source center, so that the speed of fluid in the heat sink is gradually increased along the flow direction, and the heat dissipation capacity of the downstream area of the heat sink is enhanced.
(2) Two degree of freedom optimization
When the upper wall surface of the heat sink cavity is not provided with a bulge, under the condition of non-uniform heat source, the highest temperature of the chip assemblyHeight of protrusion of wall surface under liquid cooling and heatingAnd the liquid cooling and heating sinking wall surface bulge are arranged along the flow directionIs a relationship of (3). Highest temperature of chip assemblyAnd (3) withAndExhibits small range fluctuations in three-dimensional relationships of (a) onlyThe diameter of the particles is 0.5mm,Along with itThe trend of change in (2) is evident.
Under the conditions of uniform heat source and non-uniform heat source,In the case of 0.5mm, the diameter of the tube is set to be equal to the diameter of the tube,Along with itThe trend of change is the same, and the change is firstly reduced and then increased. Under the condition of uniform heat source, the heat source is arranged at the bottom of the furnace,At the end of the length of the tube at 0.5mm,At the time of 15.5mm in length,The minimum value is 332.03K, which is lower than the highest temperature before optimization by 5.51K. Under the condition of non-uniform heat source,At the end of the length of the tube at 0.5mm,At the time of 12.5mm in length,Minimum values 365.9K and 406.64K were obtained, which were 9.23K and 14.6K lower than the pre-optimization temperature.
(3) Multi-degree-of-freedom optimization based on genetic algorithm
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow directionLiquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum highest temperature as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
Fig. 6 shows a diagram of the optimization trajectory of the genetic algorithm, wherein,AndRanging from 1 to 22.8mm,AndRanging from 0 to 0.3mm. Considering the precision requirement of the problem, the diversity of generated individuals is considered, the population number is 50, the maximum genetic algebra is 15, the individual selection strategy is random traversal, generation gap takes 0.9, the crossover probability is 0.7, and odd individuals are crossed with the offspring of adjacent positions.
Optimizing results、、And11.3104Mm, 7.7013mm, 0.2858mm and 0.2921mm, respectively, the highest temperature of the chipFor 402.65K, the optimization result is reduced by 3.99K compared with the double-degree-of-freedom, and the optimization result is reduced by 22.89K compared with the traditional cavity without the optimization.
3.2 Temperature uniformity factor minimizing Structure design
(1) Single degree of freedom optimization
FIG. 7 shows the temperature uniformity factor of the chip assembly under uniform heat source conditionsAnd (3) withIs a relationship of (3). At this time, the liquid crystal display device,The upper wall of the heat sink has no protrusion at 22.8 mm. As can be seen from FIG. 7, the temperature uniformity factor of the chip assemblyAlong with itTrend of change of (a)Along with itThe trend of change is the same. Temperature uniformity factor of chip assembly under uniform heat source conditionAlong with itIs increased by slightly increasing and then decreasing. When the heat source power is non-uniform heat source, the temperature uniformity factor of the chip assemblyAlong with itAnd decreases with increasing numbers.
This is because the hot spot area of the non-uniform heat source is located in the power area of the heat source center, so the velocity of the fluid in the heat sink increases gradually in the direction of flow, and the heat dissipation capacity downstream of the heat sink increases. At power of 10W and 20W for the hot spot region,And (3) withThe trend of the relation curve of (a) is similar, along withAnd decreases with increasing numbers.At the time of 0.5mm in length,The minimum values are 9.5727K and 12.236K respectively, and compared with the temperature uniformity factor before the optimization of the heat sink cavity, the temperature uniformity factor is reduced by 0.7973K and 1.15K.
(2) Two degree of freedom optimization
As can be seen from fig. 8, the temperature uniformity factor of the chip assemblyHeight of protrusion of wall surface under liquid cooling and heatingAnd the liquid cooling and heating sinking wall surface bulge are arranged along the flow directionExhibits small range fluctuations in three-dimensional relationships of (a) onlyThe diameter of the particles is 0.5mm,Along with itThe trend of change in (2) is evident. At the position ofIn the case of 0.5mm, the diameter of the tube is set to be equal to the diameter of the tube,Along with itIs increased first and then decreased and then increased. Under non-uniform heat source conditions, when the hot spot power is 20W,At the end of the length of the tube at 0.5mm,At the time of 12.5mm in length,The minimum value is 10.899K, and compared with the temperature uniformity factor before the optimization of the heat sink cavity, the temperature uniformity factor is reduced by 2.46K.
(3) Multi-degree-of-freedom optimization based on genetic algorithm
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow directionLiquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum temperature uniformity factor as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
Fig. 9 shows the locus of optimization of the genetic algorithm, wherein,AndRanging from 1 to 22.8mm,AndRanging from 0 to 0.3mm. Considering the precision requirement of the problem, the diversity of generated individuals is considered, the population number is 50, the maximum genetic algebra is 15, the individual selection strategy is random traversal, generation gap takes 0.9, the crossover probability is 0.7, and odd individuals are crossed with the offspring of adjacent positions. Optimizing the result:、、 And 9.7145Mm, 11.3982mm, 0.2881mm and 0.2921mm, respectively, and the temperature uniformity factor of the chipFor 9.778K, the optimization result is reduced by 1.121K compared with the double-degree-of-freedom, and 3.581K compared with the traditional cavity without the optimization.
3.3 Flow heat transfer mechanism analysis
FIG. 10 (a) shows that under non-uniform heat source conditionsThe minimum is the goal, and the temperature cloud picture corresponding to the structure with four degrees of freedom optimized by the genetic algorithm is provided. Optimizing results、、And11.3104Mm, 7.7013mm, 0.2858mm and 0.2921mm, respectively, the highest temperature of the chipFor 402.65K, the optimization result is reduced by 3.99K compared with the double-degree-of-freedom, and the optimization result is reduced by 22.89K compared with the traditional cavity without the optimization. FIG. 10 (b) showsThe minimum is the target, and the temperature cloud image optimization result corresponding to the structure with four degrees of freedom optimized by genetic algorithm is provided、、And9.7145Mm, 11.3982mm, 0.2881mm and 0.2921mm, respectively, and the temperature uniformity factor of the chipFor 9.778K, the optimization result is reduced by 1.121K compared with the double-degree-of-freedom, and 3.581K compared with the traditional cavity without the optimization. It can be seen from the figure that under the condition of uniform heat source, after four degrees of freedom optimization, the area of the high temperature area of the heat source is reduced, the temperature is reduced, and the temperature uniformity is increased.
According to the invention, under various heat source load conditions, an embedded liquid cooling heat sink model optimized for a cavity structure is established, a numerical method based on multi-physical field coupling calculation is adopted, the highest temperature of a heat source, a temperature uniformity factor and the pump consumption power of a liquid cooling heat sink are used as performance indexes, the vertical plane cavity structure of the cavity of the embedded liquid cooling heat sink is used as an optimization variable, and a genetic algorithm is adopted to optimize the cavity structure of the embedded liquid cooling heat sink. The results show that:
(1) For the uniform heat source, the highest temperature of the heat source is slightly increased and then reduced along with the increase of the protrusion height of the lower wall surface of the heat sink cavity, and the change of the protrusion height of the wall surface of the heat sink cavity has less influence on the change of the temperature of the uniform heat source; for non-uniform heat sources, the maximum temperature of the heat source decreases as the height of the protrusion of the lower wall of the heat sink cavity increases.
(2) Under different heat source load conditions and different performance index conditions, the optimal positions of the protrusions on the upper wall surface and the lower wall surface of the liquid cooling heat sink are different. Therefore, when the heat sink cavity structure is optimized, the distribution condition and the performance index of the heat source power are comprehensively considered.
(3) In the process of optimizing the embedded liquid cooling heat sink cavity, the more the degree of freedom of optimization is, the better the optimization effect is. Therefore, when optimizing the heat sink cavity structure, the degree of freedom of optimization should be increased as much as the calculation conditions allow.
As shown in fig. 11, the method for optimizing the cavity structure of the embedded liquid cooling heat sink of the electronic chip provided by the embodiment of the invention includes:
S1, under the condition of various heat source loads, an embedded liquid cooling heat sink model optimized for a cavity structure is established;
S2, taking the highest temperature of a heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink as design variables, adopting a method of combining numerical calculation and genetic algorithm, taking the vertical plane cavity structure of the embedded liquid cooling heat sink cavity as an optimization variable, and adopting genetic algorithm to optimize the cavity structure of the embedded liquid cooling heat sink;
And S3, respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
As shown in fig. 12, a cavity structure optimization system of an electronic chip embedded liquid cooling heat sink provided by an embodiment of the present invention includes:
The heat sink model building module is used for building an embedded liquid cooling heat sink model optimized for the cavity structure under various heat source load conditions;
The genetic algorithm optimization module is used for optimizing the cavity structure of the embedded liquid cooling heat sink by taking the highest temperature of the heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink along the flow direction as design variables, adopting a method of combining numerical calculation and genetic algorithm, taking the vertical plane cavity structure of the cavity of the embedded liquid cooling heat sink as an optimization variable and adopting a genetic algorithm;
And the optimal design module is used for respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
The application embodiment of the invention provides computer equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the cavity structure optimization method of the embedded liquid cooling heat sink of the electronic chip.
The application embodiment of the invention provides a computer readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the cavity structure optimization method of the embedded liquid cooling heat sink of the electronic chip.
The embodiment of the invention provides an information data processing terminal which is used for realizing a cavity structure optimization system of an electronic chip embedded liquid cooling heat sink.
In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
It should be noted that the embodiments of the present invention can be realized in hardware, software, or a combination of software and hardware. The hardware portion may be implemented using dedicated logic; the software portions may be stored in a memory and executed by a suitable instruction execution system, such as a microprocessor or special purpose design hardware. Those of ordinary skill in the art will appreciate that the apparatus and methods described above may be implemented using computer executable instructions and/or embodied in processor control code, such as provided on a carrier medium such as a magnetic disk, CD or DVD-ROM, a programmable memory such as read only memory (firmware), or a data carrier such as an optical or electronic signal carrier. The device of the present invention and its modules may be implemented by hardware circuitry, such as very large scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, etc., or programmable hardware devices such as field programmable gate arrays, programmable logic devices, etc., as well as software executed by various types of processors, or by a combination of the above hardware circuitry and software, such as firmware.
The foregoing is merely illustrative of specific embodiments of the present invention, and the scope of the invention is not limited thereto, but any modifications, equivalents, improvements and alternatives falling within the spirit and principles of the present invention will be apparent to those skilled in the art within the scope of the present invention.
Claims (8)
1. The cavity structure optimization method of the embedded liquid cooling heat sink of the electronic chip is characterized by comprising the following steps of:
s1, under the condition of various heat source loads, an embedded liquid cooling heat sink model optimized for a cavity structure is established;
S2, taking the highest temperature of a heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink as design variables, adopting a method of combining numerical calculation and genetic algorithm, taking the vertical plane cavity structure of the embedded liquid cooling heat sink cavity as an optimization variable, and adopting genetic algorithm to optimize the cavity structure of the embedded liquid cooling heat sink;
And S3, respectively obtaining the optimal structures of the heat sink cavities under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures.
2. The method for optimizing a cavity structure of an electronic chip embedded liquid cooling heat sink according to claim 1, wherein a continuity equation of fluid flow is:
(1)
the conservation of momentum equation for fluid flow is:
(2)
the energy conservation equation for fluid flow is:
(3)
the energy conservation equation for a solid is:
(4)
the continuity equation for the heat flux density and temperature of the solid and fluid interface is:
(5)
(6)
In the method, in the process of the invention, In order to achieve a fluid density,Is the velocity vector of the fluid, p is the pressure, I is the identity matrix,As a vector of the volumetric force,Is the thermal conductivity of the fluid and,Thermal conductivity as a solid.
3. The method for optimizing the cavity structure of an electronic chip embedded liquid cooling heat sink as claimed in claim 2, wherein the boundary conditions are as follows:
(1) The flow and heat transfer are fully developed, the inlet water temperature is constant, ；
(2) The inlet Reynolds number is 250-1500;
(3) The outlet relative pressure is 0 Pa;
(4) Giving heat flux density to each partition of the chip, wherein other outer wall surfaces of the heat sink are insulated except for the position contacted with the chip;
and solving the formulas (1) - (6) in combination with the boundary conditions to obtain information of the temperature distribution and the fluid pressure distribution.
4. The method for optimizing the cavity structure of an electronic chip embedded liquid cooling heat sink as claimed in claim 1, wherein optimizing the cavity structure of the embedded liquid cooling heat sink by using a genetic algorithm specifically comprises:
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow direction Liquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkTaking the minimum highest temperature as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design;
Adopts genetic algorithm to ensure that the upper wall surface of the liquid cooling heat sink is convex along the flow direction Liquid cooling and heating sinking wall surface bulge along flow direction positionHeight of protrusion on upper wall surface of liquid cooling heat sinkAnd the height of the protrusion on the lower wall surface of the liquid cooling heat sinkAnd (3) taking the minimum temperature uniformity factor as an objective function for designing variables, and carrying out four-degree-of-freedom optimization design.
5. A cavity structure optimization system of an electronic chip embedded liquid cooling heat sink for implementing the cavity structure optimization method of an electronic chip embedded liquid cooling heat sink according to any one of claims 1 to 4, characterized by comprising:
The heat sink model building module is used for building an embedded liquid cooling heat sink model optimized for the cavity structure under various heat source load conditions;
The optimal design module is used for taking the highest temperature of the heat source, the temperature uniformity factor and the pump consumption power of the liquid cooling heat sink as performance indexes, taking the height of the upper wall surface bulge and the position of the upper wall surface bulge and the lower wall surface bulge of the inner cavity of the heat sink along the flow direction as structural design variables, respectively obtaining the optimal structures of the heat sink cavity under different heat source load conditions, and carrying out the optimal design of the embedded liquid cooling heat sink based on the optimal structures;
And the genetic algorithm optimization module optimizes the cavity structure of the embedded liquid cooling heat sink by adopting a method of combining numerical calculation and genetic algorithm.
6. A computer device comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to perform the steps of the method for optimizing the cavity structure of an electronic chip embedded liquid cooling heat sink as claimed in any one of claims 1 to 4.
7. A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of the method for optimizing a cavity structure of an electronic chip embedded liquid cooling heat sink as claimed in any one of claims 1 to 4.
8. An information data processing terminal, wherein the information data processing terminal is used for realizing the cavity structure optimization system of the electronic chip embedded liquid cooling heat sink according to claim 5.
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