CN118262982A - Device and method for modifying surface hydrophobicity of insulator by broad-width plasma treatment - Google Patents
Device and method for modifying surface hydrophobicity of insulator by broad-width plasma treatment Download PDFInfo
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Abstract
The invention provides a device and a method for modifying the surface hydrophobicity of a broad-width plasma treatment insulator, wherein the device comprises the following steps: the flow control unit and the insulation supporting unit are internally provided with a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and a gas supply unit; the flow control unit is used for inputting the mixed gas with the set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used for applying high-voltage pulses to the high-voltage electrode so that the high-voltage electrode and the grounding electrode are subjected to dielectric barrier to form a discharge area; after passing through the discharge area, the hydrophobic medium is deposited on the surface of an insulator to be treated under the dual actions of plasma and air flow, and the insulator to be treated is placed below the insulating support unit. The device not only improves the hydrophobic property and weather resistance of the surface of the insulator, but also effectively improves the insulating property of the surface of the insulator; the improvement of the multiple performances is realized.
Description
Technical Field
The invention relates to the technical field of insulators, in particular to a device and a method for modifying the surface hydrophobicity of a broad-width plasma treatment insulator.
Background
The insulator is used as an important part in a power transmission line of a power system, can play a role in insulation and support, and has great influence on the safe operation of the power system due to safety and reliability. However, in the long-term operation process of the power grid, the insulator is easy to accumulate dirt in a humid environment, and the electric conductivity of the pollutant on the surface of the insulator is also greatly increased in the humid environment, so that the flashover voltage of the insulator under the normal working condition is greatly reduced, flashover can occur under the power frequency voltage, and the safe and stable operation of the power grid is greatly influenced. In view of the above reasons, cleaning pollutants, preventing the pollutants from accumulating on the surface of the insulator, ensuring the insulation performance of the insulator not to be influenced by external environment, and having important significance for ensuring the safe and stable operation of the power transmission line and reducing the maintenance cost of the line operation.
The method for preventing the insulator of the power transmission line from pollution flashover at the present stage mainly comprises the following steps: periodic cleaning, increasing creepage distance, using expensive composite insulators, painting hydrophobic paint, etc.
1) The periodic cleaning is to arrange related personnel to clean the dirt-accumulation insulator, which is a method commonly adopted by the current power system. However, the cleaning process increases a great amount of labor cost, has a certain danger, and also needs to cut power to the corresponding area in the cleaning stage;
2) The climbing distance is increased by increasing the number of insulators. However, the number of insulators can be increased appropriately only within a certain range under the influence of the mechanical strength of the insulators and the heights of the wires;
3) The composite insulator consists of a glass fiber resin core rod (or core tube), a sheath of organic material and an umbrella skirt, and the hydrophobicity of the low-polarity surface of the composite insulator enables the surface of the composite insulator to have excellent dirt-and-humidity-resistant performance. However, the composite insulator is expensive, bears small radial stress, is easy to damage and is not suitable for large-scale application;
4) If the hydrophobic anti-fouling paint is adopted, the long-term operation cost is lower, the power failure caused by manual cleaning can be avoided, the advantages are relatively obvious, and the development prospect is maximum. Among them, the application of hydrophobic paint is an important technical measure for preventing transmission line from pollution flashover. However, a great deal of application practices show that the combination property of the paint and the surface of the insulator is poor, the effective time is short, the adhesion of the dirt cannot be completely avoided, and the accumulation of the dirt on the surface of the insulator is sometimes even aggravated.
In summary, besides the technology of realizing the surface hydrophobicity of the insulator by using the hydrophobic antifouling paint, other methods have the defects of high cost, low efficiency and the like, and cannot meet the pollution removal requirement of a large power grid in China.
The unique non-equilibrium characteristic of the atmospheric pressure low-temperature plasma as an emerging molecular activation method can enable the reaction which is difficult to occur under the thermodynamic equilibrium condition to be realized under the milder condition, and good effect is obtained in the application fields of material surface modification and the like. Because the electron temperature in the system is far higher than the temperature of the heavy particles, the gas temperature close to room temperature can be maintained while higher chemical activity is obtained. The special performance of the atmospheric pressure low-temperature plasma enables the atmospheric pressure low-temperature plasma to carry out surface modification on glass, ceramic, high polymer materials and the like, and the material modification technology based on the atmospheric pressure low-temperature plasma at present becomes one of hot problems in the field of surface modification of insulating materials.
As shown in publication No. CN105750229B, CN111530804B, CN107088543B, cleaning the surface of the insulator by a cleaning robot or an unmanned aerial vehicle at regular intervals, to prevent accumulation of the surface of the insulator; as shown in CN207068565U, the metal rings of the insulators are bonded together by using glue, so that the creepage distance of the insulators is increased, and pollution flashover accidents caused by environmental pollution are prevented to a certain extent; adopting an anti-pollution flashover coating, as shown in CN102618138A, CN103614044B, CN103736645A, forming a layer of hydrophobic coating on the surface of the insulator by using a silicone rubber coating or other hydrophobic coatings, improving the surface hydrophobicity of the insulator and preventing the occurrence of pollution flashover on the surface of the insulator; the composite insulator is adopted, as shown in CN208607979U, CN112759936B, CN103123832B, a silicon rubber material is used for manufacturing an outer insulation structure of the insulator, and the special umbrella-shaped structure and surface hydrophobicity of the outer insulation structure effectively improve the pollution flashover resistance of the surface of the insulator; an auxiliary umbrella cover such as CN103545062A is adopted, and the umbrella cover with a hydrophobic surface is used for completely covering the surface of the umbrella skirt of the original insulator, so that the accumulation of dirt on the surface of the insulator is prevented, and the occurrence of pollution flashover on the surface of the insulator is prevented; the invention patent publication No. CN108281243B discloses a device for treating the surface of an insulating material with a micro-stack structure by discharge plasma, which can only treat insulators with fixed shapes, and therefore, the application range of the corresponding device is limited.
Disclosure of Invention
The invention aims to: aiming at the problems in the prior art, the invention constructs a device for modifying the surface of the insulator by broad-width plasma treatment, and also provides a method for modifying the surface of the insulator by broad-width plasma treatment.
The technical scheme is as follows: in one aspect of the invention, a device for performing hydrophobic modification on the surface of a broad-width plasma treatment insulator is provided, the device comprises a flow control unit and an insulating support unit, wherein a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and a gas supply unit are arranged in the insulating support unit;
The flow control unit is used for inputting the mixed gas with the set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used for applying high-voltage pulses to the high-voltage electrode so that the high-voltage electrode and the grounding electrode are subjected to dielectric barrier to form a discharge area; wherein, the pulse width is 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV;
After passing through the discharge area, the hydrophobic medium is deposited on the surface of an insulator to be treated under the dual actions of plasma and air flow, and the insulator to be treated is placed below an insulating supporting unit.
Further, the method comprises the steps of:
The distance between the insulator to be treated and the lower surface of the insulating support unit is not more than 2cm.
Further, the method comprises the steps of:
The grounding electrode is an electrode with a fixed position, the high-voltage electrode is an electrode with an adjustable position, the high-voltage electrode is a smooth arc, and the distance between the high-voltage electrode and the grounding electrode is set to be 1-2 cm.
Further, the method comprises the steps of:
The air supply unit comprises a ventilation cavity and a mixing cavity which are sequentially arranged, a plurality of vertically arranged ventilation holes are formed in the ventilation cavity, the ventilation holes are communicated into the mixing cavity, and working gas and modified hydrophobic reagent are input into the mixing cavity through the ventilation holes.
Further, the method comprises the steps of:
the ventilation cavity comprises three ventilation pipes which are arranged side by side, wherein the ventilation pipe in the middle is used as an inlet of working gas, and the ventilation pipes on the two sides are used as a feeding port of modified hydrophobic reagent.
Further, the method comprises the steps of:
The air mixing cavity is characterized in that opposite baffles are arranged on the lower surface of the air mixing cavity, an air outlet is formed between the two baffles, a sponge is arranged in the air mixing cavity, and the sponge is 35ppi porous sponge, so that working gas and modified hydrophobic reagent are fully contacted in the cavity, and are uniformly mixed.
Further, the method comprises the steps of:
The modified hydrophobic reagent adopts a small dosage of hydrophobic reagent.
Further, the method comprises the steps of:
the mixed gas includes: the working gas and the modified hydrophobic reagent, the set flow specifically comprises: the working gas is argon, the flow is 1L/min, the modified hydrophobic reagent is PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow is 3-9 mL/min.
In another aspect of the present invention, there is provided a method for treating the surface of an insulator based on a device for broad-width plasma treatment of hydrophobic modification of the surface of the insulator, the method comprising the steps of:
Step 1, assembling a device for performing hydrophobic modification on the surface of a broad-width plasma treatment insulator;
step 2, placing the insulator to be processed below the insulating support unit, and adjusting the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is proper;
Step 3, switching on a high-voltage pulse power supply to enable the high-voltage electrode and the grounding electrode to be subjected to dielectric barrier so as to form a discharge area; wherein, the pulse width is 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV;
step 4, setting mixed gas through a flow control unit, inputting the mixed gas into a gas supply unit to form a hydrophobic medium, and depositing the hydrophobic medium on the surface of the insulator to be treated under the dual actions of plasma and gas flow;
And 5, carrying out hydrophobic treatment on the surface of the insulator to be treated.
Further, the method comprises the steps of:
the method for making the distance between the high-voltage electrode and the ground electrode suitable comprises the following specific steps: the distance between the insulator to be treated and the lower surface of the insulating support unit is not more than 2cm.
The beneficial effects are that: compared with the prior art, the invention has the following advantages:
(1) The invention uses a small dosage of hydrophobic reagent, avoids the use of a large amount of chemical reagents such as coating liquid, has low cost, saves energy and protects environment. Meanwhile, the hydrophobic modification uniformity is good, dust-free environment is not needed, and the adaptability is good; the invention utilizes the plasma modification technology to quickly realize the hydrophobic modification treatment of the insulator, and has short treatment time and high efficiency. The insulator surface after treatment has a waterproof effect.
(2) The invention is different from the traditional dielectric barrier discharge, realizes similar jet flow wide-width hydrophobic modification in an indirect discharge mode, and the traditional dielectric barrier discharge can only carry out material modification between two plate electrodes and cannot process complex shapes;
(3) Compared with the existing dielectric barrier discharge, the device and the method greatly improve the processing efficiency of some complex hollow objects with larger curvature, and the existing method can not completely process narrow gaps, but can perfectly process narrow areas such as gaps of insulators to be processed, thereby realizing rapidness, convenience and high processing rate;
(4) According to the invention, the surface characteristics of an object to be treated can be adjusted for flexible treatment, and 35ppi porous ventilation sponge is added into the surface characteristics of the object to be treated, so that inert gas and hydrophobic precursors can be fully contacted in a reactor, and the inert gas and the hydrophobic precursors are uniformly mixed;
(5) The device and the treatment method not only improve the hydrophobic property and the weather resistance of the surface of the insulator, but also effectively improve the insulating property of the surface of the insulator by combining experimental results; the improvement of the multiple performances is realized.
Drawings
FIG. 1 is a schematic diagram of a device for performing hydrophobic modification on the surface of a broad-width plasma treatment insulator according to the invention;
FIG. 2 is a schematic view of the structure of the air supply unit according to the present invention;
FIG. 3 is a side view of the structure of the device for hydrophobically modifying the surface of a broad plasma treated insulator according to the present invention;
FIG. 4 is a schematic diagram of the apparatus for hydrophobically modifying the surface of a broad plasma treated insulator according to the present invention;
FIG. 5 is a graph showing the effect of discharge images of a device for hydrophobically modifying the surface of a broad-width plasma-treated insulator according to the present invention, wherein the first graph is the effect of the insulator to be treated below, and the second and third graphs are the discharge effect graphs when the distances are different;
FIG. 6 is a graph of current voltage versus time for a broad plasma treatment insulator surface hydrophobically modified device according to the present invention;
FIG. 7 is a graph showing comparison of the results of untreated and treated sample test water contact angle changes according to the present invention;
FIG. 8 is a graph comparing flashover voltage detected by untreated and treated samples according to the present invention;
FIG. 9 is a graph comparing the sample detection trap energy level changes before and after treatment of an insulator to be treated according to the present invention;
In the figure, 1-high voltage electrode; 2-a ground electrode; 3-an insulating support unit; 4-an air supply unit; 5-insulator to be treated; 41-venting the cavity; 42-mixing chamber; 421-sponge; 411-vent pipe; 422-baffle.
Detailed Description
For a better understanding of the present invention, the technical solution of the present invention will be further described with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1-4, the invention provides a device for modifying the surface hydrophobicity of a broad-width plasma treatment insulator, which comprises a flow control unit and an insulation supporting unit 3, wherein a high-voltage pulse power supply, a high-voltage electrode 1, a grounding electrode 2 and an air supply unit 3 are arranged in the insulation supporting unit 3.
Before discharging, the flow control unit is used for inputting the mixed gas with set flow into the gas supply unit to form a hydrophobic medium, and the broad plasma is a plasma with larger transverse dimension and is one of large-area plasmas. The prior art relates to a device which is used for discharging a wide dielectric barrier and only introducing inert gas to perform discharging treatment such as cleaning or sterilizing and disinfecting. There is no device for performing the hydrophobic modification treatment. Therefore, the device disclosed by the invention carries out wide indirect hydrophobic modification treatment, and the problem that the processed material cannot be processed due to abnormal shape can be effectively solved by wide plasmas.
The set flow and the corresponding mixed gas specifically comprise:
The mixed gas comprises: the working gas and the modified hydrophobic reagent, the set flow specifically comprises: the working gas is an inert gas such as: argon, helium and the like are adopted in the embodiment, the flow is set to be 1L/min because of low cost, and the modified hydrophobic reagent is PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow is 3-9 mL/min.
The high-voltage pulse power supply is used for applying high-voltage pulses to the high-voltage electrode 1, so that the high-voltage electrode 1 and the grounding electrode 2 are subjected to dielectric barrier to form a discharge area, and the dewatering treatment of the insulator is realized; and the high-voltage electrode needs to ensure that the edge is not provided with a water chestnut which is a smooth arc, and the distance between the high-voltage electrode and the ground electrode is kept at 1-2 cm.
Wherein, the pulse width is set to be 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV; in this embodiment, the optimal set flow and related power parameters are: pulse width: 0.8 mu s, the device discharge power is: 30w, the voltage amplitude is: 12kV, argon: 1L/min, hydrophobic medium: 3-9 ml/min.
Then, after passing through the discharge area, the hydrophobic medium is deposited on the surface of the insulator to be treated under the dual actions of plasma and air flow, and the insulator to be treated is placed below the insulating support unit. Specific: the water medium is introduced into the discharge area of the device to be crushed, decomposed and agglomerated, and finally deposited on the surface of the material under the dual actions of plasma and air flow.
In this embodiment, the distance between the insulator to be treated and the lower surface of the insulating support unit is not more than 2cm. The device structure blows active substances in the plasma out from between the high-voltage electrode and the ground electrode through air flow, can carry out hydrophobic treatment on materials within 2cm below the device, and has more flexible treatment mode and higher treatment efficiency compared with the traditional DBD type and jet type device structure.
The device structure of the invention separates the discharge area and the material processing area, and the plasma is blown out of the discharge space by the air flow, so that the wide-width plasma surface processing can be applied to various complex shapes.
In addition, the prior art does not see wide-width plasma hydrophobic treatment, the application of the method is limited in the surface treatment of insulating materials of insulating type, and the porous structure of sponge is added in the structure of the invention to homogenize the air flow distribution, so that the uniformity of the wide-width plasma hydrophobic treatment is greatly improved.
Further, the method comprises the steps of: the air supply unit 4 comprises an air ventilation cavity 41 and an air mixing cavity 42 which are sequentially arranged, a plurality of vertically arranged air vents are arranged in the air ventilation cavity 41 and communicated into the air mixing cavity, and working gas and modified hydrophobic reagent are input into the air mixing cavity 42 through the air vents.
Further, in the present embodiment:
The ventilation chamber 41 comprises three ventilation pipes 411 arranged side by side, wherein the middle ventilation pipe 411 is used as an inlet of working gas, and the ventilation pipes on two sides are used as a feeding port of modified hydrophobic reagent. Namely, the modified hydrophobic reagent is introduced through two vent holes, and the working gas is introduced through one vent hole.
Further, the method comprises the steps of:
the lower surface department of mixing the air cavity is provided with relative baffle 422, is the gas outlet between two baffles 422, be provided with sponge 421 in the mixing the air cavity, just the sponge is 35ppi porous sponge for working gas and modified hydrophobic reagent fully contact in the intracavity, the misce bene. Namely, the ventilation sponge of 35ppi enters a discharge space formed by the high-voltage electrode, the ground electrode unit 1 and the insulating support unit 3, so that the specific atmosphere requirement of the discharge space is met.
Wherein, the pore size of the sponge is divided into dense and sparse pores, and the PPI from big pores to small pores with the pore size of 5ppi 10ppi 15ppi 18ppi20ppi 25ppi is how many pores are arranged above one square inch, and 30PPI filtering sponge is 30 pores on one square inch. The larger the number, kong Yuexiao. Generally 15-20ppi means large pores, 25-30ppi medium pores and more than 35ppi small pores. Experiments prove that the uniform passing of mixed gas is required to be ensured, so that 35ppi porous sponge is selected.
As shown in fig. 5, the device and the method for hydrophobically modifying the surface of an insulator are a wide-width plasma device and a discharge image, wherein the discharge image shows that the device is uniformly and widely discharged, and the wide-width plasma refers to a plasma with a larger transverse dimension and is one of large-area plasmas.
The device is designed to generate a plasma plume with larger area outside the discharge space so as to increase the treatment efficiency of the plasma on the surface of the insulating material with complex shape.
Fig. 6 is a waveform diagram of discharge of a broad-width plasma device for modifying the surface hydrophobicity of an insulator, and the waveform diagram shows that the device is stable in discharge, the discharge voltage is 12kV, and the discharge current is 4A.
Fig. 7 is a graph showing the change of the contact angle of water for sampling detection, and the graph shows that the contact angle of water is obviously improved, and the weather resistance is improved. The result detection diagram is used for sampling and detecting insulators to be processed after the insulator to be processed is processed by the device, so as to verify the effectiveness of the experimental device; the increased hydrophobicity mentioned above is meant to be this. The hydrophobicity is verified by the water contact angle, i.e. the greater the water contact angle, the better the hydrophobicity.
Fig. 8 is a graph of the change of the sample detection flashover voltage, wherein the flashover voltage of the surface of the insulator treated by the device is 10.2kV, the flashover voltage value is more discrete when the insulator is not treated, the flashover voltage of the surface is improved by 7.3% after the insulator is treated, and the flashover voltage value of the insulator is more stable and does not change significantly and greatly.
FIG. 9 is a graph showing the change in the level of the surface traps of the sample detection surface, the insulator treated by the device has the advantages of low level of the surface traps, increased shallow traps, reduced capability of binding charges on the surface, incapacity of accumulating charges, uneasy occurrence of flashover and increased flashover voltage, and is consistent with the result shown in FIG. 7.
Namely, the surface of the deposited film is subjected to physical and chemical reaction to a certain extent after being subjected to plasma film deposition treatment. After the treatment, the trap energy level of the material surface is gradually reduced, and meanwhile, the trap density is obviously reduced, which indicates that a large number of physical traps are generated on the surface by the etching action of plasma, so that the increase of shallow traps on the surface is ensured, and at the moment, the etching action of the plasma and the deposition of Si-containing groups generate good synergistic action.
Example 2
In another aspect of the present invention, there is provided a method for treating the surface of an insulator based on a device for broad-width plasma treatment of hydrophobic modification of the surface of the insulator, the method comprising the steps of:
Step 1, assembling a device for performing hydrophobic modification on the surface of a broad-width plasma treatment insulator;
step 2, placing the insulator to be processed below the insulating support unit, and adjusting the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is proper;
Step 3, switching on a high-voltage pulse power supply to enable the high-voltage electrode and the grounding electrode to be subjected to dielectric barrier so as to form a discharge area; wherein, the pulse width is 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV;
step 4, setting mixed gas through a flow control unit, inputting the mixed gas into a gas supply unit to form a hydrophobic medium, and depositing the hydrophobic medium on the surface of the insulator to be treated under the dual actions of plasma and gas flow;
And 5, carrying out hydrophobic treatment on the surface of the insulator to be treated.
Further, the method comprises the steps of:
The distance between the high-voltage electrode and the ground electrode is suitable, and the method specifically comprises the following steps: the distance between the insulator to be treated and the lower surface of the insulating support unit is not more than 2cm.
The device structure blows active substances in the plasma out from between the high-voltage electrode and the ground electrode through air flow, can carry out hydrophobic treatment on materials within 2cm below the device, and has more flexible treatment mode and higher treatment efficiency compared with the traditional DBD type and jet type device structure.
Other technical features of the method are similar to the corresponding device for modifying the surface of the insulator by the broad-width plasma treatment, and are not repeated here.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and the equivalents thereof, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The device is characterized by comprising a flow control unit and an insulating support unit, wherein a high-voltage pulse power supply, a high-voltage electrode, a grounding electrode and an air supply unit are arranged in the insulating support unit;
The flow control unit is used for inputting the mixed gas with the set flow into the gas supply unit to form a hydrophobic medium, and the high-voltage pulse power supply is used for applying high-voltage pulses to the high-voltage electrode so that the high-voltage electrode and the grounding electrode are subjected to dielectric barrier to form a discharge area; wherein, the pulse width is 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV;
After passing through the discharge area, the hydrophobic medium is deposited on the surface of an insulator to be treated under the dual actions of plasma and air flow, and the insulator to be treated is placed below an insulating supporting unit.
2. The apparatus for hydrophobically modifying a surface of a broad width plasma treated insulator as defined in claim 1 wherein the distance between the insulator to be treated and the lower surface of the insulating support unit is no more than 2cm.
3. The device for hydrophobically modifying a surface of a broad width plasma treated insulator as defined in claim 1 wherein the ground electrode is a fixed position electrode, the high voltage electrode is a position adjustable electrode, and the high voltage electrode is a smooth circular arc, and the distance between the high voltage electrode and the ground electrode is set to 1-2 cm.
4. The device for modifying the surface hydrophobicity of the broad-width plasma treatment insulator according to claim 1, wherein the air supply unit comprises a ventilation cavity and a mixing cavity which are sequentially arranged, a plurality of vertically arranged ventilation holes are arranged in the ventilation cavity, the ventilation holes are communicated into the mixing cavity, and working gas and modified hydrophobic reagent are input into the mixing cavity through the ventilation holes.
5. The apparatus of claim 4, wherein the vent chamber comprises three vent tubes arranged side by side, wherein a middle vent tube is used as an inlet for working gas and two side vent tubes are used as a feed inlet for modified hydrophobic agent.
6. The device for modifying the surface of the insulator by the wide-range plasma treatment according to claim 4, wherein opposite baffles are arranged on the lower surface of the gas mixing cavity, a gas outlet is arranged between the two baffles, a sponge is arranged in the gas mixing cavity, and the sponge is 35ppi porous sponge, so that working gas and modified hydrophobic reagent are fully contacted in the cavity and uniformly mixed.
7. The apparatus for modifying the hydrophobicity of a surface of a broad width plasma treated insulator of claim 4, wherein the modified hydrophobic agent is a small dose of hydrophobic agent.
8. The apparatus for broad width plasma treatment of surface hydrophobicity modification of insulators of claim 7, wherein said mixed gas comprises: the working gas and the modified hydrophobic reagent, the set flow specifically comprises: the working gas is argon, the flow is 1L/min, the modified hydrophobic reagent is PDMS polydimethylsiloxane or HMDSO hexamethyldisiloxane, and the corresponding flow is 3-9 mL/min.
9. A method of treating an insulator surface using the broad plasma treatment insulator surface hydrophobically modified device of any one of claims 1-8, comprising the steps of:
Step 1, assembling a device for performing hydrophobic modification on the surface of a broad-width plasma treatment insulator;
step 2, placing the insulator to be processed below the insulating support unit, and adjusting the position of the high-voltage electrode so that the distance between the high-voltage electrode and the ground electrode is proper;
Step 3, switching on a high-voltage pulse power supply to enable the high-voltage electrode and the grounding electrode to be subjected to dielectric barrier so as to form a discharge area; wherein, the pulse width is 0.6 mu s-1 mu s, the discharge power is 20 w-50 w, and the voltage amplitude is 8 kV-14 kV;
step 4, setting mixed gas through a flow control unit, inputting the mixed gas into a gas supply unit to form a hydrophobic medium, and depositing the hydrophobic medium on the surface of the insulator to be treated under the dual actions of plasma and gas flow;
And 5, carrying out hydrophobic treatment on the surface of the insulator to be treated.
10. The method for treating surface hydrophobicity modification of insulators by using broad-width plasma according to claim 9, wherein the step of adapting the distance between the high-voltage electrode and the ground electrode comprises: the distance between the insulator to be treated and the lower surface of the insulating support unit is not more than 2cm.
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