CN118136539B - Chip abnormality detection device and detection method - Google Patents
Chip abnormality detection device and detection method Download PDFInfo
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- CN118136539B CN118136539B CN202410532561.XA CN202410532561A CN118136539B CN 118136539 B CN118136539 B CN 118136539B CN 202410532561 A CN202410532561 A CN 202410532561A CN 118136539 B CN118136539 B CN 118136539B
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- 238000001514 detection method Methods 0.000 title claims abstract description 118
- 230000005856 abnormality Effects 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 230000007306 turnover Effects 0.000 claims abstract description 15
- 238000007599 discharging Methods 0.000 claims abstract description 8
- 230000008093 supporting effect Effects 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
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- 238000001125 extrusion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip abnormality detection device and a detection method, which relate to the technical field of chip detection, wherein the detection device comprises a workbench, and the workbench is circumferentially and sequentially provided with: the chip substrate detection device comprises a feeding part, a first detection part, a second detection part and a discharging part, wherein the feeding part is used for feeding a chip substrate to be detected, the first detection part is used for detecting the upper surface of the chip substrate, the second detection part is used for detecting the lower surface of the chip substrate, and the discharging part is used for discharging the chip substrate after detection; a turnover module is further arranged between the first detection part and the second detection part and used for driving the bearing table to rotate 180 degrees; the turnover mode of the invention drives the bearing table to rotate, so that the chip substrate is not required to be disassembled and assembled, the detection efficiency is further improved, and the automation degree is higher.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip abnormality detection device and a detection method.
Background
Chip inspection is an important step in ensuring the quality of a chip substrate, involving inspection of multiple aspects. These assays include, but are not limited to: appearance detection: checking whether the surface of the chip substrate has the problems of scratches, stains, particles, warpage and the like; size detection: the size of the chip substrate is measured to determine whether it meets the requirements, including length, width, thickness, etc. And (3) structural detection: checking the internal structure of the chip substrate, if the chip substrate has the problems of cracking, hollowness, uneven filling and the like; and (3) performance detection: the electrical properties of the chip substrate, such as insulation resistance, thermal conductivity, pressure resistance, etc., are tested.
These tests are typically performed using automated equipment, such as automated optical inspection equipment (AOI), automated X-ray inspection equipment (AXI), and the like.
In the prior art, when appearance detection is carried out on a chip, a chip substrate is usually placed at the detection end of automatic optical detection equipment, after one-side detection is finished, the chip substrate is taken out manually or matched with a mechanical arm to be turned over for detection of the other side, and in the turning process, pollution is very easy to the chip, so that the problems of low detection quality and low detection efficiency are solved.
Disclosure of Invention
The invention aims to provide a chip abnormality detection device and a detection method, which solve the following technical problems:
after one side of the chip substrate is detected, the chip substrate needs to be taken out manually or matched with a manipulator to be turned over for detecting the other side, and the chip is easy to pollute in the turning process, so that the problems of low detection quality and low detection efficiency are solved.
The aim of the invention can be achieved by the following technical scheme:
the chip abnormality detection device comprises a workbench, wherein the workbench is circumferentially and sequentially provided with:
a feeding part for feeding the chip substrate to be detected, and
A first detection part for detecting the upper surface of the chip substrate, an
A second detection part for detecting the lower surface of the chip substrate, an
The blanking part is used for discharging the chip substrate after detection;
and a turnover module is further arranged between the first detection part and the second detection part and used for driving the bearing table to rotate 180 degrees.
Preferably, the feeding part comprises a positioning frame for stacking the chip substrates, two sides of the positioning frame are fixedly arranged on a supporting table through mounting frames, and the supporting table is fixed with the workbench.
Preferably, a supporting plate is arranged at the opening at the bottom end of the positioning frame in a sliding manner;
wherein, fixed branch of laying of locating frame side, slide on the branch and be equipped with the slide fixed with the backup pad, still be equipped with first spring on the branch.
Preferably, one end of the bearing table far away from the driving plate is set to be an arc-shaped end, the direction of the supporting plate towards the turntable is set to be an arc-shaped end, and when the bearing table rotates to the bottom of the positioning frame, the bearing groove coincides with the bottom end opening of the positioning frame.
Preferably, the groove walls at two sides of the bearing groove are provided with first through grooves, clamping plates are embedded in the first through grooves in a sliding manner, and one ends, close to each other, of the two groups of clamping plates are provided with first inclined surfaces;
wherein, two sets of the holding plate keep away from the one end fixed layout regulating plate mutually, and the plummer both sides are symmetrical fixed layout first guide arm, regulating plate and first guide arm sliding connection still are equipped with the second spring on the first guide arm.
Preferably, a second through groove is further formed in the bottom of the first through groove, a bearing plate is slidably arranged in the second through groove, second guide rods are fixedly arranged on two sides of the bearing table, a sliding seat fixed with the bearing plate is slidably arranged on the second guide rods, and a third spring is arranged on the second guide rods;
The bearing platform is characterized in that positioning plates are fixedly arranged on two sides of the bearing platform, third guide rods are slidably arranged in the positioning plates, rollers are rotatably arranged at one ends of the third guide rods towards the bearing plates, second inclined surfaces in rolling butt connection with the rollers are correspondingly arranged at the side ends of the bearing plates, first magnets are fixedly arranged at the other ends of the third guide rods, second magnets are symmetrically arranged at the supporting platform towards the direction of the positioning frame, and the first magnets repel each other with the second magnets in the same polarity.
Preferably, the mounting frame is rotationally provided with a limiting rod, one end of the limiting rod is fixed with the bottom of the limiting rod, the other end of the limiting rod is fixed with a limiting plate which is sleeved on the limiting rod in a sliding mode, the tail end of the limiting plate is fixedly provided with a pressing rod towards the direction of the positioning frame, and the tail end of the pressing rod is fixedly provided with a pressing plate.
Preferably, the turnover module comprises a hollow groove arranged between the driving plates, a rotating shaft fixed with the bearing table is rotationally arranged in the hollow groove, a first bevel gear is fixedly arranged at one end of the rotating shaft far away from the bearing table, a U-shaped frame is fixedly arranged at the bottom of the hollow groove, a second bevel gear meshed with the first bevel gear is rotationally arranged on the U-shaped frame, and the second bevel gear is fixed with the main gear;
And a first arc-shaped rack is arranged between the first detection part and the second detection part, and a first arc-shaped rack used for being meshed with the main gear is arranged on the outer side of the first arc-shaped rack.
Preferably, the overturning module further comprises a second arc-shaped frame arranged between the second detecting part and the blanking part, and a second arc-shaped rack used for being meshed with the main gear is arranged on the inner end face of the second arc-shaped frame.
A detection method of a chip abnormality detection device comprises the following steps:
stacking the chip substrate to be detected in a positioning frame by a manipulator or manually, rotating a limiting rod and pulling a limiting plate to move towards the top so that a pressing plate is pressed on the chip substrate at the top;
The first motor drives the turntable to rotate, the driving plate drives the bearing table to rotate towards the bottom end of the positioning frame, and the bearing table is abutted with the end surface of the supporting plate to drive the bearing table to move towards the direction of the offset positioning frame until the bearing table is transferred to the position right below the positioning frame;
the two ends of the chip substrate are firstly abutted against the first inclined surface and push the clamping plates at the two sides to be away from each other, at the moment, the clamping plates drive the second springs to stretch through the adjusting plates to generate elastic force, and the clamping force is given to the chip substrate under the elastic force action of the second springs, so that positioning is realized;
the turntable is driven to move to the first detection part by the first motor for detection;
After the chip substrate is detected by the first detection part, in the process of rotating towards the second detection part, the main gear is meshed with the first arc-shaped rack to drive the second bevel gear to rotate, and the second bevel gear is meshed with the first bevel gear to drive the rotating shaft and the bearing table to rotate 180 degrees, so that overturning is realized;
after the chip substrate after overturning is detected by the second detection part, in the process of rotating towards the blanking part, the main gear is meshed with the second arc-shaped rack to drive the bearing table to reset and rotate to an initial state;
When the bearing table rotates to the blanking part, the vertical cylinder pushes the first push plate to move upwards, the chip substrate is pushed out from between the clamping plates at two sides, the transverse cylinder drives the second push plate to shrink, and the chip substrate is pulled out from the bearing table;
And when the chip substrate is unqualified, the second motor drives the conveyor belt to reversely drive, and the chip substrate is conveyed to the other side for recovery processing.
The invention has the beneficial effects that:
(1) After the upper surface of the chip substrate is detected by the first detection part, the first motor drives the bearing table to rotate 180 degrees through the turnover module in the process of driving the bearing table to rotate towards the second detection part, so that the original lower surface of the chip substrate is turned upwards, and the detection can be completed through the second detection part.
(2) The two groups of clamping plates are only in contact with the end faces of the two sides of the chip substrate, and the upper surface and the lower surface of the chip substrate are not shielded, so that the double-sided complete detection of the chip substrate can be realized during detection, and the detection effect is better.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a chip abnormality detection apparatus according to the present invention;
FIG. 2 is a schematic diagram of a chip anomaly detection device according to the present invention;
FIG. 3 is a schematic diagram of a main gear in a chip abnormality detection apparatus according to the present invention;
FIG. 4 is a schematic diagram of a positioning frame in a chip anomaly detection device according to the present invention;
FIG. 5 is a schematic view of a carrying platform in a chip anomaly detection device according to the present invention;
FIG. 6 is a second schematic diagram of a positioning frame in a chip anomaly detection device according to the present invention;
fig. 7 is a schematic structural view of a clamping plate in the chip abnormality detection device according to the present invention.
In the figure: 1. a work table; 2. a positioning frame; 3. a turntable; 4. a conveyor belt; 5. detecting a box body; 6. a carrying platform; 101. a support table; 102. a mounting frame; 103. a first arc-shaped frame; 104. a first arcuate rack; 105. a second arc-shaped frame; 106. a second arcuate rack; 107. a support frame; 201. a pressing plate; 202. a compression bar; 203. a limiting plate; 204. a limit rod; 205. a fourth spring; 206. a support plate; 207. a support rod; 208. a second magnet; 209. a first spring; 301. a first motor; 302. a driving plate; 303. a hollow groove; 304. a rotating shaft; 305. a first bevel gear; 306. a second bevel gear; 307. a main gear; 308. a U-shaped frame; 401. a conveying roller; 402. a second motor; 403. a second push plate; 404. a vertical cylinder; 405. a first push plate; 406. a transverse cylinder; 501. a detection chamber; 601. a carrying groove; 602. a first through groove; 603. a clamping plate; 604. a first inclined surface; 605. an adjusting plate; 606. a first guide bar; 607. a second spring; 608. a carrying plate; 609. a second inclined surface; 610. a roller; 611. a positioning plate; 612. a third guide bar; 613. a first magnet; 614. a second guide bar; 615. a slide; 616. a third spring; 617. and a second through slot.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1 and 2, the present invention is a chip anomaly detection device, which includes a workbench 1, wherein the workbench 1 is circumferentially and sequentially arranged with:
The feeding part is used for feeding the chip substrate to be detected;
a first detection unit for detecting the upper surface of the chip substrate;
a second detection unit for detecting the lower surface of the chip substrate;
The blanking part is used for discharging the chip substrate after detection;
Specifically, a first motor 301 is fixedly arranged at the center end of the workbench 1, the output end of the first motor 301 is fixed with the turntable 3, a plurality of groups of driving plates 302 are fixedly arranged on the surface of the turntable 3 in a circumferential array, a bearing table 6 is rotatably arranged at the tail end of each driving plate 302, and a bearing groove 601 for positioning a chip substrate is formed in the bearing table 6; in one implementation of the embodiment, four groups of driving boards 302 are arranged, so that each driving board 302 corresponds to the feeding part, the first detecting part, the second detecting part and the discharging part one by one in a static state;
When detecting the chip substrate, the first motor 301 drives the turntable 3 to rotate so that the bearing table 6 rotates to the feeding part, then the chip substrate is placed in the bearing groove 601 for positioning, and then the first motor 301 drives the turntable 3 to sequentially move to the first detection part, the second detection part and the discharging part, the output end of the first motor 301 intermittently rotates, and the single rotation angle is 90 degrees.
A turnover module is also arranged between the first detection part and the second detection part and is used for driving the bearing table 6 to rotate 180 degrees; it may be noted that, after the detection of the first detection portion is completed on the upper surface of the chip substrate, the first motor 301 drives the plummer 6 to rotate 180 degrees through the turnover module in the process of driving the plummer 6 to rotate towards the second detection portion, so that the original lower surface of the chip substrate is turned to face upwards, and the detection can be completed through the second detection portion.
Example 2
On the basis of embodiment 1, referring to fig. 1 and 4, the feeding portion includes a positioning frame 2 for stacking chip substrates, two sides of the positioning frame 2 are fixedly arranged on a supporting table 101 through a mounting frame 102, and the supporting table 101 is fixed with the workbench 1; specifically, the chip substrate to be detected can be piled in the positioning frame 2 by a manipulator or manually, so that orderly feeding can be realized, and the feeding efficiency is improved;
Referring to fig. 4 and 6, a support plate 206 is slidably disposed at an opening at the bottom end of the positioning frame 2, wherein a support rod 207 is fixedly disposed at a side end of the positioning frame 2, a sliding plate fixed to the support plate 206 is slidably disposed on the support rod 207, and a first spring 209 is further disposed on the support rod 207; specifically, one end of the first spring 209 is fixed with the side end of the positioning frame 2, and the other end is fixed with the slide plate;
In this embodiment, in the initial state, the supporting plate 206 is located at the bottom opening of the positioning frame 2, and can support the chip substrates stacked in the positioning frame 2, and in the feeding process, the supporting plate 206 is driven to shift to one side of the positioning frame 2, so that the supporting effect on the chip substrates is lost, and the chip substrates can be discharged from the bottom opening of the positioning frame 2;
As a further scheme of the embodiment, one end of the bearing table 6 away from the driving plate 302 is set to be an arc-shaped end, the direction of the supporting plate 206 towards the turntable 3 is set to be an arc-shaped end, and when the bearing table 6 rotates to the bottom of the positioning frame 2, the bearing groove 601 coincides with the bottom end opening of the positioning frame 2; it may be noted that, when the driving plate 302 drives the carrying platform 6 to rotate towards the bottom end of the positioning frame 2, the carrying platform 6 abuts against the end surface of the supporting plate 206 to drive the carrying platform to move towards the direction of the offset positioning frame 2, at this time, the first spring 209 stretches to generate an elastic force, and when the carrying platform 6 is transferred to the position right below the positioning frame 2, the carrying groove 601 coincides with the bottom end opening of the positioning frame 2, so that the chip substrate can fall into the carrying groove 601;
It can be understood that, after the bottommost chip substrate falls into the carrying groove 601, the upper surface of the chip substrate is flush with the upper surface of the carrying table 6, so that the chip substrate in the positioning frame 2 can not be discharged any more, and then the carrying table 6 is driven to rotate towards the first detecting portion by the driving plate 302, and the supporting plate 206 can be gradually reset and support the chip substrate in the positioning frame 2 again.
Referring to fig. 5, in order to improve the positioning stability of the chip substrate in the carrying groove 601, the groove walls at two sides of the carrying groove 601 are provided with first through grooves 602, clamping plates 603 are slidably embedded in the first through grooves 602, one ends of the two groups of clamping plates 603 close to each other are provided with first inclined surfaces 604, wherein one ends of the two groups of clamping plates 603 far away from each other are fixedly provided with adjusting plates 605, two sides of the carrying table 6 are symmetrically and fixedly provided with first guide rods 606, the adjusting plates 605 are slidably connected with the first guide rods 606, and the first guide rods 606 are also provided with second springs 607; specifically, one end of the second spring 607 is fixed to the carrying table 6, and the other end is fixed to the adjusting plate 605; in this embodiment, when the carrying groove 601 positions the chip substrate, the two ends of the chip substrate are first abutted against the first inclined surface 604, when a pressure is applied to the chip substrate, the chip substrate pushes the two clamping plates 603 away from each other, at this time, the clamping plates 603 drive the second springs 607 to stretch through the adjusting plate 605 to generate elastic force, the chip substrate stops when moving to the middle of the two groups of clamping plates 603, and a clamping acting force is applied to the chip substrate under the elastic force of the second springs 607, so that the chip substrate is firmly fixed between the two groups of clamping plates 603;
It can be appreciated that the two groups of clamping plates 603 in this embodiment only contact with two side end surfaces of the chip substrate, and do not shade the upper surface and the lower surface of the chip substrate, so that during detection, the double-sided complete detection of the chip substrate can be realized, and the detection effect is better.
Referring to fig. 3, 5 and 7, further, a second through slot 617 is further formed at the bottom of the first through slot 602, a bearing plate 608 is slidably disposed in the second through slot 617, wherein second guide rods 614 are fixedly disposed on two sides of the bearing table 6, a sliding seat 615 fixed to the bearing plate 608 is slidably disposed on the second guide rods 614, and a third spring 616 is disposed on the second guide rods 614; specifically, one end of the third spring 616 is fixed to the slide 615, and the other end is fixed to the carrying table 6;
Referring to fig. 6, positioning plates 611 are fixedly arranged on both sides of the carrying platform 6, third guide rods 612 are slidably arranged in the positioning plates 611, rollers 610 are rotatably arranged at the third guide rods 612 towards one end of the carrying plate 608, second inclined surfaces 609 in rolling contact with the rollers 610 are correspondingly arranged at the side end of the carrying plate 608, first magnets 613 are fixedly arranged at the other end of the third guide rods 612, second magnets 208 are symmetrically arranged at the supporting platform 101 towards the direction of the positioning frame 2, and the first magnets 613 and the second magnets 208 repel each other in the same polarity;
It may be noted that, when the carrying platform 6 rotates to the position right below the positioning frame 2, at this time, the first magnet 613 corresponds to the second magnet 208, under the pushing of magnetic force, the first magnet 613 moves towards the direction away from the second magnet 208, the first magnet 613 pushes the roller 610 to move along the second inclined plane 609 through the third guide rod 612, under the extrusion action, pushes the positioning plate 611 to move towards the carrying groove 601, so that the chip substrate pressed into the carrying groove 601 can be limited, the chip substrate is prevented from falling when moving over, and as the carrying platform 6 continues to rotate, the first magnet 613 and the second magnet 208 lose the magnetic force, and under the elastic force of the third spring 616, the positioning plate 611 can be driven to reset.
In this embodiment, referring to fig. 4 and 6, a limiting rod 204 is rotatably arranged on the mounting frame 102, a fourth spring 205 is arranged on the limiting rod 204, one end of the fourth spring 205 is fixed with the bottom of the limiting rod 204, the other end of the fourth spring is fixed with a limiting plate 203 slidably sleeved on the limiting rod 204, the tail end of the limiting plate 203 is fixedly provided with a pressing rod 202 towards the direction of the positioning frame 2, and the tail end of the pressing rod 202 is fixedly provided with a pressing plate 201; it may be noted that, after the chip substrates are stacked on the positioning frame 2, the limiting rod 204 is rotated and the limiting plate 203 is pulled to move towards the top, so that the pressing plate 201 may be pressed onto the top-most chip substrate, and a downward acting force is given to the chip substrates under the action of the elastic force of the fourth spring 205, so that when the bearing groove 601 is overlapped with the bottom opening of the positioning frame 2, the acting force may press the chip substrates between the two side clamping plates 603.
Referring to fig. 1, the turnover module includes a hollow groove 303 disposed between driving plates 302, a rotating shaft 304 fixed to a carrying platform 6 is rotationally disposed in the hollow groove 303, a first bevel gear 305 is fixedly disposed at one end of the rotating shaft 304 far away from the carrying platform 6, a U-shaped frame 308 is fixedly disposed at the bottom of the hollow groove 303, a second bevel gear 306 engaged with the first bevel gear 305 is rotationally disposed on the U-shaped frame 308, the second bevel gear 306 is fixed to a main gear 307, a first arc-shaped frame 103 is disposed between a first detection portion and a second detection portion, and a first arc-shaped rack 104 engaged with the main gear 307 is disposed outside the first arc-shaped frame 103; after the chip substrate is detected by the first detecting portion, in the process of rotating towards the second detecting portion, the main gear 307 is meshed with the first arc-shaped rack 104 to drive the second bevel gear 306 to rotate, and the second bevel gear 306 is meshed with the first bevel gear 305 to drive the rotating shaft 304 to rotate 180 degrees with the bearing table 6, so as to achieve the effect of automatic overturning.
The turnover module further comprises a second arc-shaped frame 105 arranged between the second detection part and the blanking part, and a second arc-shaped rack 106 which is used for being meshed with the main gear 307 is arranged on the inner end surface of the second arc-shaped frame 105; it may be noted that, after the flipped chip substrate is detected by the second detecting portion, the main gear 307 drives the carrying platform 6 to reset and rotate to the initial state by being meshed with the second arc-shaped rack 106 in the process that the carrying platform 6 rotates towards the blanking portion, so as to facilitate the subsequent blanking operation.
In this embodiment, the first detection portion and the second detection portion each include a detection box 5, a detection cavity 501 is formed on a side of the detection box 5, which is close to the turntable 3, and a detection module is disposed in the detection cavity 501; specifically, the detection module may employ an automatic optical detection device or an image capturing device to detect the surface defect of the chip substrate.
Referring to fig. 2 and3, the blanking portion includes a vertical cylinder 404 fixedly arranged on the workbench 1, a first push plate 405 is fixedly arranged at a driving end of the vertical cylinder 404, a supporting frame 107 is fixedly arranged at one side of the workbench 1, a transverse cylinder 406 is fixedly arranged on the supporting frame 107, and a second push plate 403 is fixedly arranged at a driving end of the transverse cylinder 406; it may be noted that when the loading platform 6 rotates to the blanking portion, the vertical cylinder 404 is started to push the first push plate 405 to move upwards, so as to push out the chip substrate from between the clamping plates 603 at two sides, so that the lower surface of the chip substrate is flush with the upper surface of the loading platform 6, and then the horizontal cylinder 406 drives the second push plate 403 to shrink, so that the chip substrate is pulled out from the loading platform 6.
Specifically, the blanking part further comprises a conveyor belt 4, two sides of the conveyor belt 4 are sleeved on the conveying roller 401, and one side of the conveying roller 401 is fixed with the output end of the second motor 402; it may be noted that, after the pulled chip substrate falls onto the conveyor belt 4, when the chip substrate is detected to be qualified, the second motor 402 drives the conveyor belt 4 to convey the chip substrate to one side for collection, and when the chip substrate is detected to be unqualified, the second motor 402 drives the conveyor belt 4 to reversely drive, and conveys the chip substrate to the other side for recovery processing, so as to realize automatic classification.
A detection method of a chip abnormality detection device comprises the following steps:
Stacking the chip substrate to be detected in the positioning frame 2 by a manipulator or manually, rotating the limiting rod 204 and pulling the limiting plate 203 to move towards the top so as to press the pressing plate 201 on the top chip substrate;
The first motor 301 drives the turntable 3 to rotate, the driving plate 302 drives the bearing table 6 to rotate towards the bottom end of the positioning frame 2, and the bearing table 6 is abutted with the end surface of the supporting plate 206 to drive the bearing table 6 to move towards the direction of the offset positioning frame 2 until the bearing table is transferred to the position right below the positioning frame 2;
The two ends of the chip substrate are firstly abutted against the first inclined surface 604 and push the clamping plates 603 at the two sides to be away from each other, at the moment, the clamping plates 603 drive the second springs 607 to stretch through the adjusting plates 605 to generate elastic force, and the clamping force is given to the chip substrate under the elastic force action of the second springs 607, so that positioning is realized;
the turntable 3 is driven to move to the first detection part by the first motor 301 for detection;
after the chip substrate is detected by the first detection part, in the process of rotating towards the second detection part, the main gear 307 is meshed with the first arc-shaped rack 104 to drive the second bevel gear 306 to rotate, and the second bevel gear 306 is meshed with the first bevel gear 305 to drive the rotating shaft 304 and the bearing table 6 to rotate 180 degrees, so that turnover is realized;
After the chip substrate after overturning is detected by the second detection part, in the process of rotating towards the blanking part, the main gear 307 drives the bearing table 6 to reset and rotate to an initial state by being meshed with the second arc-shaped rack 106;
When the bearing table 6 rotates to the blanking part, the vertical cylinder 404 is started to push the first push plate 405 to move upwards, the chip substrate is pushed out from between the clamping plates 603 at the two sides, the transverse cylinder 406 drives the second push plate 403 to shrink, and the chip substrate is pulled out from the bearing table 6;
The pulled chip substrate falls onto the conveyor belt 4, when the chip substrate is detected to be qualified, the second motor 402 drives the conveyor belt 4 to convey the chip substrate to one side for collection, and when the chip substrate is detected to be unqualified, the second motor 402 drives the conveyor belt 4 to reversely drive, and conveys the chip substrate to the other side for recovery processing.
In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation and a specific orientation configuration and operation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (5)
1. The utility model provides a chip anomaly detection device, includes workstation (1), its characterized in that, be circumference on workstation (1) and laid in proper order:
a feeding part for feeding the chip substrate to be detected, and
A first detection part for detecting the upper surface of the chip substrate, an
A second detection part for detecting the lower surface of the chip substrate, an
The blanking part is used for discharging the chip substrate after detection;
A turnover module is further arranged between the first detection part and the second detection part and used for driving the bearing table (6) to rotate 180 degrees;
The feeding part comprises a positioning frame (2) for stacking chip substrates, two sides of the positioning frame (2) are fixedly arranged on a supporting table (101) through a mounting frame (102), and the supporting table (101) is fixed with the workbench (1);
a supporting plate (206) is arranged at the opening of the bottom end of the positioning frame (2) in a sliding way;
wherein, a supporting rod (207) is fixedly arranged at the side end of the positioning frame (2), a sliding plate fixed with the supporting plate (206) is arranged on the supporting rod (207) in a sliding way, and a first spring (209) is also arranged on the supporting rod (207);
One end of the bearing table (6) far away from the driving plate (302) is provided with an arc-shaped end, the direction of the supporting plate (206) facing the turntable (3) is provided with the arc-shaped end, and when the bearing table (6) rotates to the bottom of the positioning frame (2), the bearing groove (601) coincides with the bottom end opening of the positioning frame (2);
The groove walls at two sides of the bearing groove (601) are provided with first through grooves (602), clamping plates (603) are embedded in the first through grooves (602) in a sliding manner, and one ends, close to the two groups of clamping plates (603), of the bearing groove are provided with first inclined surfaces (604);
wherein, two groups of clamping plates (603) are fixedly provided with adjusting plates (605) at the ends far away from each other, the two sides of the bearing table (6) are symmetrically and fixedly provided with first guide rods (606), the adjusting plates (605) are in sliding connection with the first guide rods (606), and the first guide rods (606) are also provided with second springs (607);
the bottom of the first through groove (602) is also provided with a second through groove (617), a bearing plate (608) is arranged in the second through groove (617) in a sliding way, second guide rods (614) are also fixedly arranged on two sides of the bearing table (6), a sliding seat (615) fixed with the bearing plate (608) is arranged on the second guide rods (614) in a sliding way, and a third spring (616) is arranged on the second guide rods (614);
The bearing table (6) both sides are still fixed lay locating plate (611), slide in locating plate (611) and lay third guide arm (612), third guide arm (612) rotate towards one end of bearing plate (608) and lay gyro wheel (610), bearing plate (608) side end is equipped with corresponding second inclined plane (609) with gyro wheel (610) roll butt, first magnet (613) are laid to the fixed layout of third guide arm (612) other end, supporting bench (101) are the symmetry towards the direction of locating frame (2) and have been laid second magnet (208), first magnet (613) are like poles repulse with second magnet (208).
2. The device for detecting abnormal chips according to claim 1, wherein the mounting frame (102) is rotatably provided with a limiting rod (204), the limiting rod (204) is provided with a fourth spring (205), one end of the fourth spring (205) is fixed with the bottom of the limiting rod (204), the other end of the fourth spring is fixed with a limiting plate (203) which is sleeved on the limiting rod (204) in a sliding manner, the tail end of the limiting plate (203) is fixedly provided with a pressing rod (202) towards the direction of the positioning frame (2), and the tail end of the pressing rod (202) is fixedly provided with a pressing plate (201).
3. The chip anomaly detection device according to claim 1, wherein the turnover module comprises a hollow groove (303) which is formed between the driving plates (302), a rotating shaft (304) which is fixed with the bearing table (6) is rotationally arranged in the hollow groove (303), a first bevel gear (305) is fixedly arranged at one end of the rotating shaft (304) far away from the bearing table (6), a U-shaped frame (308) is fixedly arranged at the bottom of the hollow groove (303), a second bevel gear (306) which is meshed with the first bevel gear (305) is rotationally arranged on the U-shaped frame (308), and the second bevel gear (306) is fixed with the main gear (307);
wherein, be equipped with first arc frame (103) between first detection portion and the second detection portion, first arc frame (103) outside is equipped with first arc rack (104) that are used for with main gear (307) meshing.
4. A chip anomaly detection apparatus according to claim 3, wherein the turnover module further comprises a second arc-shaped frame (105) disposed between the second detection portion and the blanking portion, and a second arc-shaped rack (106) for meshing with the main gear (307) is provided at an inner end surface of the second arc-shaped frame (105).
5. A detection method of the chip abnormality detection device according to any one of claims 1 to 4, comprising the steps of:
Stacking the chip substrate to be detected in the positioning frame (2) by a mechanical arm or manually, rotating the limiting rod (204) and pulling the limiting plate (203) to move towards the top so as to press the pressing plate (201) on the chip substrate at the top;
The first motor (301) drives the turntable (3) to rotate, the driving plate (302) drives the bearing table (6) to rotate towards the bottom end of the positioning frame (2), and the bearing table (6) is abutted with the end face of the supporting plate (206) to drive the bearing table to move towards the direction of the offset positioning frame (2) until the bearing table is transferred to the position right below the positioning frame (2);
The two ends of the chip substrate are firstly abutted against the first inclined surface (604) and push the clamping plates (603) at the two sides to be away from each other, at the moment, the clamping plates (603) drive the second springs (607) to stretch through the adjusting plates (605) to generate elastic force, and the clamping force is given to the chip substrate under the elastic force of the second springs (607) to realize positioning;
The turntable (3) is driven to move to the first detection part by the first motor (301) for detection;
After the chip substrate is detected by the first detection part, in the process of rotating towards the second detection part, the main gear (307) is meshed with the first arc-shaped rack (104) to drive the second bevel gear (306) to rotate, and the second bevel gear (306) is meshed with the first bevel gear (305) to drive the rotating shaft (304) and the bearing table (6) to rotate 180 degrees, so that turnover is realized;
after the turnover chip substrate is detected by the second detection part, in the process of rotating towards the blanking part, the main gear (307) drives the bearing table (6) to reset and rotate to an initial state by being meshed with the second arc-shaped rack (106);
When the bearing table (6) rotates to the blanking part, the vertical cylinder (404) pushes the first push plate (405) to move upwards, the chip substrate is pushed out from between the clamping plates (603) at two sides, the second push plate (403) is driven to shrink by the horizontal cylinder (406), and the chip substrate is pulled out from the bearing table (6);
And when the chip substrate is unqualified, the second motor (402) drives the conveyor belt (4) to reversely drive, and the chip substrate is conveyed to the other side for recovery processing.
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| CN202410532561.XA CN118136539B (en) | 2024-04-30 | 2024-04-30 | Chip abnormality detection device and detection method |
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| CN202410532561.XA CN118136539B (en) | 2024-04-30 | 2024-04-30 | Chip abnormality detection device and detection method |
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| CN118136539B true CN118136539B (en) | 2024-07-12 |
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|---|---|---|---|---|
| CN115274477A (en) * | 2022-06-30 | 2022-11-01 | 苏州精濑光电有限公司 | Method for detecting appearance of crystal grains after wafer cutting |
| CN220613682U (en) * | 2023-07-25 | 2024-03-19 | 赵建苹 | Clamping tool for chip detection |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101703904B1 (en) * | 2015-08-28 | 2017-02-22 | (주)오로스 테크놀로지 | Wafer gripping apparatus and dual wafer stress inspection apparatus having the same |
| CN218824570U (en) * | 2022-10-13 | 2023-04-07 | 深圳晶芯半导体封测有限公司 | Chip detection table structure |
| CN115610990A (en) * | 2022-11-28 | 2023-01-17 | 南通金泰科技有限公司 | Turntable type turnover laser printer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115274477A (en) * | 2022-06-30 | 2022-11-01 | 苏州精濑光电有限公司 | Method for detecting appearance of crystal grains after wafer cutting |
| CN220613682U (en) * | 2023-07-25 | 2024-03-19 | 赵建苹 | Clamping tool for chip detection |
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