CN118135294A - Method, system, equipment and medium for identifying circuit connection relation - Google Patents
Method, system, equipment and medium for identifying circuit connection relation Download PDFInfo
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Abstract
The invention provides a method, a system, equipment and a medium for identifying circuit connection relation, wherein the method comprises the following steps: acquiring an experimental circuit image; inputting the experimental circuit image into a target detection model, and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model; for each wire: calculating the intersection ratio of the wire and each binding post, and screening out binding posts connected with the wire according to the calculated intersection ratio; determining an experimental device connected with the binding post based on the screened binding post; and connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop. The accuracy of circuit connection relation identification is improved.
Description
Technical Field
The present invention relates to the field of circuit detection, and in particular, to a method, system, device, and medium for identifying a circuit connection relationship.
Background
In electrical experiments, the placement of experimental devices is often random, and sometimes the experimental devices are placed very close together. In addition, the wires may be relatively long, which causes the long wires to visually pass through a plurality of experimental devices, and increases the difficulty in judging the experimental devices connected to the two ends of the wires, that is, the difficulty in determining the connection relationship between the experimental devices. The current solution to this problem is to select a pair of terminals that is farthest from among the plurality of terminals identified in the lead identification frame, and determine the pair of terminals as the terminal actually connected to the lead. However, this approach has limitations: when two experimental devices are placed very close together, the wrong terminal may intersect the wire identification frame, causing it to be erroneously identified as a terminal connected to the other end of the wire, resulting in erroneous judgment. Accordingly, there is a need to provide a method, system, apparatus, and medium for identifying circuit connection relationships.
Disclosure of Invention
The invention provides a method for identifying a circuit connection relation. The method solves the problem that connection identification of each experimental device in the experimental circuit image in the prior art is inaccurate.
The invention provides a method for identifying circuit connection relation, which comprises the following steps: acquiring an experimental circuit image; inputting the experimental circuit image into a target detection model, and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model; for each wire: calculating the intersection ratio of the wire and each binding post, and screening out binding posts connected with the wire according to the calculated intersection ratio; determining an experimental device connected with the binding post based on the screened binding post; and connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop.
In an embodiment of the present invention, the calculating the ratio of the conductor to each binding post, and selecting the binding post connected to the conductor according to the calculated ratio of the conductor, includes: calculating the intersection ratio of the wire and each binding post, screening out binding posts with the intersection ratio larger than a preset intersection ratio threshold value, and judging the number of the screened binding posts: if the number of the binding posts is equal to 2, taking all the screened binding posts as binding posts connected with the lead; if the number of the binding posts is greater than 2, the binding posts connected with the lead wires are screened based on the position of each screened binding post relative to the identified lead wires.
In one embodiment of the present invention, the screening the terminals connected to the wire based on the position of each screened terminal with respect to the identified wire includes: traversing all screened binding posts, and screening out one or more binding post combinations which are symmetrical with respect to the center of the wire according to the position of the wire; judging the number of binding post combinations: if the number of the binding post combinations is one, two binding posts in the binding post combinations are used as binding posts connected with a lead; if the number of terminal combinations is not one, then for each terminal combination: calculating the weight of the binding post combination according to the intersection of the two binding posts and the lead and the distance between the binding posts; the two binding posts in the binding post combination with the largest weight are selected as the binding posts connected with the lead.
In an embodiment of the present invention, the calculating the weight of the terminal assembly according to the intersection of each terminal and the wire and the distance between the terminals includes: respectively calculating the intersection of the two binding posts and the lead; calculating the ratio of the intersection to the corresponding binding post as a first ratio and a second ratio of the binding post combination; calculating the distance between the two binding posts; taking the product of the first ratio, the second ratio and the distance as the weight of the binding post combination.
In one embodiment of the present invention, the screening-based terminal, determining an experimental device connected to the terminal, includes: traversing all identified experimental devices, for each experimental device: calculating the cross-over ratio of the experimental device and each screened binding post, judging whether each calculated cross-over ratio is larger than a preset threshold value, and analyzing the number of the cross-over ratios larger than the threshold value: if the cross ratio is larger than a preset threshold value, determining that the experimental device is connected with the corresponding binding post; if the cross-over ratio is larger than the preset threshold value, determining that the experimental device is connected with the two binding posts with the largest cross-over ratio.
In an embodiment of the present invention, the object detection model is a YOLOv model.
In an embodiment of the invention, after the forming of the circuit loop, the method further includes: the circuit loop is marked in the experimental circuit image.
In an embodiment of the present invention, there is also provided a system for identifying a circuit connection relationship, the system including: the image acquisition module is used for acquiring an experimental circuit image; the device identification module is used for inputting the experimental circuit image into a target detection model and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model; terminal screening module for, for each wire: calculating the intersection ratio of the wire and each binding post, and screening out binding posts connected with the wire according to the calculated intersection ratio; the experimental device screening module is used for determining an experimental device connected with the binding post based on the screened binding post; and the circuit connection module is used for connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop.
In an embodiment of the present invention, there is also provided an electronic device including: one or more processors; and a storage means for storing one or more programs that, when executed by the one or more processors, cause the electronic device to implement the method of identifying a circuit connection relationship as described in any of the above.
In an embodiment of the present invention, there is also provided a computer-readable storage medium having a computer program stored thereon, which when executed by a processor of a computer, causes the computer to perform the method for identifying a circuit connection relationship as set forth in any one of the above.
According to the method, the system, the equipment and the medium for identifying the circuit connection relation, provided by the invention, the experimental circuit image is input into the target detection model, and all binding posts, experimental equipment and wires appearing in the image can be accurately identified. Through calculating the cross-connection ratio between the wire and the binding post, the binding post which is actually connected with the wire can be effectively screened, and the connection mode of the circuit can be further determined through analyzing the connection relation between the binding posts and corresponding experimental devices. According to the connection relation among the binding posts, the experimental devices and the wires, the connection relation of the experimental devices is constructed, and therefore the accuracy of circuit connection relation identification is remarkably improved.
Drawings
Fig. 1 is a schematic flow chart of a method for identifying a circuit connection relationship according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an experimental circuit image according to an embodiment of the present invention;
FIG. 3 is a schematic diagram showing various experimental devices identified in an experimental circuit image provided by an embodiment of the present invention;
FIG. 4 is a block diagram showing a circuit connection relationship recognition system according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the invention.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In the following description, numerous details are set forth in order to provide a more thorough explanation of embodiments of the present invention, it will be apparent, however, to one skilled in the art that embodiments of the present invention may be practiced without these specific details, in other embodiments, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the embodiments of the present invention.
In electrical experiments, a plurality of wires and various experimental devices often appear, and in order to judge the connection relationship of circuits, the core is to accurately determine the connection relationship and direction of the wires between the experimental devices. However, in a real scene, the longer wires are more likely to overlap due to different lengths of the wires, which greatly increases the difficulty in distinguishing the connection relationship of the wires between the experimental devices. The inventors have found that typically only the studs on the voltmeter can be used as parallel points, with the connection of two wires being made on one stud. In addition to voltmeters, terminals on other experimental devices were typically connected to only a single wire. The existing circuit analysis method can only verify whether the voltmeters are connected in parallel or not, and cannot distinguish various wrong connection modes. Further, current circuit analysis approaches often tend to select the most distant terminal combination as the terminal to which the wire is connected when one wire intersects more than two terminals. However, if the ratio of the intersection area to the post area is small, this means that the post is not actually connected to the wire, which is prone to erroneous judgment.
In order to solve the problems, the invention provides a method for identifying the circuit connection relation, which inputs an experimental circuit image into a target detection model and can accurately identify all binding posts, experimental equipment and wires appearing in the image. And obtaining a plurality of possible binding post combinations by utilizing the intersection ratio between the wire and the binding post, and screening out the binding post combinations actually connected with the wire. By analyzing the connection relationship between the binding posts and the corresponding experimental devices, the connection mode of the circuit can be further determined. According to the connection relation among the binding posts, the experimental devices and the wires, the connection relation of the experimental devices is constructed, and the accuracy of circuit connection relation identification is greatly improved. In the conventional or unconventional experimental device layout, the inference mechanism can accurately infer the correct binding post combination at the two ends of the wires, breaks the constraint that the binding post of the traditional upper limit voltage meter can be connected with two wires, realizes that any binding post can be connected with two wires, and can restore various possibilities of circuit connection.
Referring to fig. 1, the identification of the circuit connection relationship includes the following steps:
s1, acquiring an experimental circuit image.
The experimental circuit image is a circuit live-action image formed by connecting wiring terminals and wires on an experimental device. Illustratively, as shown in fig. 2, implementing the circuit image may include a power supply, a slide rheostat, an ammeter, a light bulb, a voltmeter, and a switch, which are connected in sequence. The experimental circuit image may be obtained by an image capturing device (e.g., a high resolution camera) or a video capturing device (e.g., a video camera), without limitation. Preferably, in order to realize real-time analysis of images, in the invention, a video shooting device is used for acquiring experimental circuit images, and a target detection model is used for carrying out real-time analysis on video streams, so that the connection relation of each experimental device is identified in real time. When the image shooting device is used, a high-definition picture of the circuit can be directly captured to acquire an experimental circuit image. When using the video photographing apparatus, it is necessary to extract a desired video frame from a photographed video to obtain an experimental circuit image. The video frames may be obtained by extracting from the video frame by frame, or may be obtained by extracting key frames, sampling at specific time intervals, and the like, which is not limited herein.
S2, inputting the experimental circuit image into a target detection model, and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model.
The experimental circuit image is input into a trained target detection model, and various pre-defined experimental devices, binding posts connected with the lead wires and the lead wires which are presented in the experimental circuit image can be identified by analyzing the whole experimental circuit image, and the identified objects are represented by the identification frames and the corresponding category labels. The recognition frame is used for defining the specific position and range of the recognition objects in the image, and each recognition object is usually encircled by the recognition frame in a rectangular frame mode. Further, class labels for experimental devices in the present invention include, but are not limited to, voltmeters, ammeter, power supplies, slide varistors, resistors, capacitors, and the like. The binding post refers to an electrical connection point on an experimental device, and category labels of the binding post include, but are not limited to, a red binding post, a black binding post, a large-range binding post and a small-range binding post of an ammeter, an upper connection binding post and a lower connection binding post of a sliding rheostat and the like. In the present invention, it is assumed that there are at most two terminals connected to the wire on each experimental device. In the present invention, all the terminals mentioned are terminals to which the lead wires have been connected. Wires are electrical conductors for connecting different terminals. In the present invention, the object detection model is adapted to all models trained under the YOLO framework, including but not limited to YOLOv, YOLOv, YOLOX, etc. Preferably, in order to improve the efficiency and accuracy of circuit image analysis and adapt to the identification requirements of various specific circuit experimental devices and configurations, in an embodiment of the present invention, the target detection model is a YOLOv model.
Illustratively, inputting FIG. 2 to the target detection model results in FIG. 3 identifying various recognition objects. Specifically, the object detection model identifies that the experimental device in fig. 2 includes a power supply, a slide rheostat, a bulb, a switch, an ammeter and a voltmeter, the wires are L1, L2, L3, L4, L5, L6 and L7, and each binding post connected with the wires is a, b, c, d, e, f, g, h, i, j, k, m.
S3, for each wire: and calculating the intersection ratio of the wire and each binding post, and screening out the binding posts connected with the wire according to the calculated intersection ratio.
Identifying each wire and each binding post from the experimental circuit image by the target detection model, and for each identified wire, identifying the frame: a ratio (Intersection over Union, ioU) of the identity of the current wire to the identity of each terminal is calculated and used to indicate the degree of spatial overlap between the wire and the terminal. And then screening out binding posts possibly connected with the wires based on the calculated intersection ratio, wherein the intersection ratio of the identification frame of the wires and the identification frame of the binding posts is: the ratio of the intersection area of the identification frame of the lead to the identification frame of the binding post to the union area of the identification frame of the lead and the identification frame of the binding post. After the screening, if a plurality of wires are connected with the same binding post at the same time, the binding post is indicated to be a parallel point. By the method, the accuracy of identifying the circuit connection relationship is improved, and the parallel connection and series connection configuration relationship in the circuit can be understood more clearly.
For example, for the identification frame a of the lead, the area thereof is S A, for the identification frame B of the post, the area thereof is S B, and the intersection area S Intersection area of the two is the area of the overlapping area of the two identification frames. The union area of the two is the difference between the area of each identification frame and the intersection area, namely S A+SB-S Intersection area . And calculating the ratio of the intersection area to the union area, wherein the ratio is the intersection ratio of the identification frame of the lead and the identification frame of the binding post. Obviously, if the two are not overlapped, the intersection area is 0, which indicates that the direct connection relationship between the wire and the binding post is not present. Conversely, if the intersection area is large, the intersection ratio increases accordingly, indicating that the lead wires and the post have a high spatial overlap, thereby indicating that there may be a connection relationship therebetween. Through calculating the cross ratio, each binding post which possibly has a connection relation with the lead can be primarily screened out.
In an embodiment of the present invention, the calculating the ratio of the wire to each binding post, and selecting the binding post connected to the wire according to the calculated ratio of the wire, includes:
calculating the intersection ratio of the wire and each binding post, screening out binding posts with the intersection ratio larger than a preset intersection ratio threshold value, and judging the number of the screened binding posts:
if the number of the binding posts is equal to 2, taking all the screened binding posts as binding posts connected with the lead;
if the number of the binding posts is greater than 2, the binding posts connected with the lead wires are screened based on the position of each screened binding post relative to the identified lead wires.
For each wire, a plurality of binding posts with the cross-over ratio larger than the cross-over ratio threshold (such as 0) are analyzed and screened by calculating the cross-over ratio of the identification frame of the wire and the identification frame of each binding post, so that a plurality of binding posts which are possibly actually connected with the wire are selected from all the identified binding posts. Judging the number of the screened binding posts, if the number of the screened binding posts is 1, the condition that the wire is connected with only one binding post or the wire is connected with two binding posts but only one binding post is identified is not used as an effective wire connection combination. If two binding posts are selected, they are considered to be directly connected to the wire. If the number of screened studs exceeds two, this indicates that the experimental device is placed in close proximity, so that a wire passes through a number of studs that are arranged relatively closely, in which case it is necessary to determine which studs are actually connected to the wire based on the position of each stud relative to the wire.
In one embodiment of the present invention, the screening the terminals connected to the wire based on the position of each screened terminal with respect to the identified wire includes:
Traversing all screened binding posts, and screening out one or more binding post combinations which are symmetrical with respect to the center of the wire according to the position of the wire;
Judging the number of binding post combinations:
If the number of the binding post combinations is one, two binding posts in the binding post combinations are used as binding posts connected with a lead;
if the number of terminal combinations is not one, then for each terminal combination: calculating the weight of the binding post combination according to the intersection of the two binding posts and the lead and the distance between the binding posts; the two binding posts in the binding post combination with the largest weight are selected as the binding posts connected with the lead.
When the number of screened binding posts (i.e. binding posts with the cross-over ratio greater than the cross-over ratio threshold) exceeds two, in this case, all the screened binding posts are traversed first, and the binding posts are divided into: four different areas located at the upper left of the wire, at the lower left of the wire, at the upper right of the wire, and at the lower right of the wire. The relative positions of the identification frame of the binding post and the identification frame of the lead are determined by calculating the center coordinates of the identification frame of the binding post and the center coordinates of the identification frame of the lead. Two studs located in the diagonal region (i.e., upper left and lower right or upper right and lower left) are selected to form a stud combination. Judging the number of binding post combinations: if there is only one terminal combination, it means that only one pair of terminals satisfies the condition of direct connection with the wire, and this pair of terminals can be regarded as the terminal connected with the wire. Conversely, if there are multiple combinations of posts, further analysis is required to determine which combination is actually connected to the wire. Specifically, for each post combination: a weight is calculated based on the intersection of the two posts with the wire and the distance between the posts. This weight is intended to evaluate the likelihood of the connection of the terminal assembly to the wire, wherein the intersection of the terminal and the wire reflects the spatial relationship of the terminal to the wire, and the distance between the terminals enables an accurate evaluation of the rationality of the assembly. And finally, selecting the binding post combination with the largest weight, and determining two binding posts in the combination as binding posts directly connected with the lead. In the invention, the wiring terminals actually connected with the lead are not closely adjacent to each other in space, but are distributed in different areas on two sides of the lead, so that the wiring terminals distributed diagonally are selected, misjudgment caused by the close proximity of the lead and the wiring terminals can be effectively reduced, and the accuracy of connection identification is improved.
In one embodiment of the present invention, the calculating the weight of the terminal assembly according to the intersection of each terminal and the wire and the distance between the terminals includes:
Respectively calculating the intersection of the two binding posts and the lead;
calculating the ratio of the intersection to the corresponding binding post as a first ratio and a second ratio of the binding post combination;
Calculating the distance between the two binding posts;
Taking the product of the first ratio, the second ratio and the distance as the weight of the binding post combination.
Each binding post combination was analyzed: an intersection of each terminal and the wire in the combination is calculated, wherein the intersection refers to the area of the overlapping area of the identification frame of the terminal and the identification frame of the wire. Then calculating the ratio of the intersection of each binding post and the self identification frame to generate two ratios: a first ratio and a second ratio, the two ratios corresponding to two studs within the combination. And calculating the linear distance between the center points of the two terminal identification frames to determine the physical distance between the two terminal identification frames. Multiplying the first ratio, the second ratio and the distance between the binding posts to obtain a product which is used as the weight of the whole binding post combination. In the invention, the binding posts at the two ends of the wire are generally positioned on the diagonal line of the wire identification frame, and the binding posts have a larger overlapping area relative to the wire identification frame. In this case, the post combinations selected according to the weights are substantially consistent with the actual situation. In this way, the calculated weights combine the degree of interaction between the studs and the conductors and the distance between the studs, thereby providing a comprehensive evaluation index for each stud combination to determine which stud combination is most likely to be actually connected to the conductors.
Illustratively, two terminals in the terminal combination are a and B, respectively, let a total be the total area of terminal a, B total be the total area of terminal B, D AB be the distance between terminal a and terminal B, the intersection area of terminal a and the wire be S 'A, and the intersection area of terminal B and the wire be S' B. The first Ratio A of the post combination is S 'A/Atotal, the second Ratio B is S' B/Btotal, and the weight W of the post combination is Ratio A*RatioB*DAB.
As a specific example, as shown in fig. 3, taking the lead L6 as an example, the posts j, k are located in the upper left region of the lead L6, the post h is located in the lower right region of the lead L6, and the intersection ratio of the lead L6 and the three posts j, k, h is greater than the intersection ratio threshold. Therefore, the combinations of the posts constituting the lead L6 are (j, h) and (k, h). Analysis (j, h): an intersection S1 of the identification frame area of the binding post j and the identification frame area of the lead L6, an intersection S2 of the identification frame area of the binding post h and the identification frame area of the lead L6, and a distance D1 between the two binding posts j and h are calculated. Further, based on the calculation result, the ratio of the intersection area S1 to the identification frame area of the binding post j is calculated as Rj, the ratio of the intersection area S1 to the identification frame area of the binding post h is calculated as Rh, and the weight of the combination is rj×rh×d1. Similarly, the weight of the post combination (k, h) is rk×rh×d2, where D2 is the distance between the posts k, h. Since the intersection of the post j and the wire L6 is larger than the intersection of the post k and the wire L6, the weight of (j, h) is larger than the weight of (k, h), so (j, h) is selected as the post connected to the wire L6. Obviously, in this way, the probability of misjudging that the wire is connected with the binding post when the wire passes through a binding post but is not truly connected with the binding post can be reduced.
S4, determining an experimental device connected with the binding post based on the screened binding post.
Specifically, in one embodiment of the present invention, the experimental device for determining connection with the terminal based on the screened terminal includes:
Traversing all identified experimental devices, for each experimental device:
Calculating the cross-over ratio of the experimental device and each screened binding post, judging whether each calculated cross-over ratio is larger than a preset threshold value, and analyzing the number of the cross-over ratios larger than the threshold value:
if the cross ratio is larger than a preset threshold value, determining that the experimental device is connected with the corresponding binding post;
if the cross-over ratio is larger than the preset threshold value, determining that the experimental device is connected with the two binding posts with the largest cross-over ratio.
Traversing all experimental devices identified in the experimental circuit image, for each experimental device: and calculating the intersection ratio between the identification frame of the experimental device and the identification frame of each screened binding post so as to evaluate the spatial overlapping degree between the experimental device and the binding post. Determining whether the calculated overlap ratio is greater than a predetermined threshold (e.g., 0) for determining which degree of spatial overlap is considered a valid connection, and analyzing the number of all overlap ratios greater than the threshold. When the number of the cross ratios greater than the threshold is one, the experimental device is connected with the binding post. If the intersection ratio of a plurality of binding posts is larger than the threshold value, since the invention assumes that at most two binding posts exist in each experimental device, two binding posts with the largest intersection ratio are selected as the connection with the experimental device. In the invention, the connection relation between each experimental device and the lead wire and the binding post is established based on the following assumption: under the condition that experimental devices are arranged at two ends of the lead, two different binding posts are respectively connected at two ends of the lead.
And S5, connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop.
From the power supply, the identified terminals, experimental devices and wires are connected according to the connection relation of the terminals, experimental devices and wires, so that a complete circuit loop is formed. If the wire connection has only one end, or there is only one post on the experimental device, the path is terminated. And obtaining experimental devices connected into the circuit from the path, thereby realizing accurate identification of the experimental devices in the experimental circuit image. For convenience of characterization, in one embodiment of the present invention, after the forming of the circuit loop, the method further includes: the circuit loop is marked in the experimental circuit image.
Referring to fig. 4, the circuit connection relationship identification system 100 includes: an image acquisition module 110, a device identification module 120, a post screening module 130, an experimental device screening module 140, and a circuit connection module 150. The image acquisition module 110 is used for acquiring an experimental circuit image. The device identification module 120 inputs the experimental circuit image to a target detection model, and identifies each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model. The post screening module 130 is for, for each wire: and calculating the intersection ratio of the wire and each binding post, and screening out the binding posts connected with the wire according to the calculated intersection ratio. The experimental device screening module 140 determines experimental devices connected to the screened binding posts. The terminals, experimental devices and wires identified by the circuit connection module 150 are connected according to respective connection relations to form a circuit loop.
For specific limitations of the circuit connection relationship identification system, reference may be made to the above limitation of the circuit connection relationship identification method, which is not described herein. The above-described modules in the circuit connection relationship identification system may be implemented in whole or in part by software, hardware, or a combination thereof. The above modules may be embedded in a hardware format or may be independent of a processor in the computer device, or may be stored in a software format in a memory in the computer device, so that the processor may call for operations corresponding to the above modules.
It should be noted that, in order to highlight the innovative part of the present invention, no module that is not very close to solving the technical problem presented by the present invention is introduced in the present embodiment, but it does not indicate that other modules are not present in the present embodiment.
Referring to fig. 5, the electronic device 1 may include a memory 12, a processor 13, and a bus, and may further include a computer program stored in the memory 12 and executable on the processor 13, such as a circuit connection relationship identification program.
The memory 12 includes at least one type of readable storage medium including flash memory, a removable hard disk, a multimedia card, a card memory (e.g., SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, etc. The memory 12 may in some embodiments be an internal storage unit of the electronic device 1, such as a mobile hard disk of the electronic device 1. The memory 12 may also be an external storage device of the electronic device 1 in other embodiments, such as a plug-in mobile hard disk, a smart memory card (SMART MEDIA CARD, SMC), a Secure Digital (SD) card, a flash memory card (FLASH CARD) or the like, which are provided on the electronic device 1. Further, the memory 12 may also include both an internal storage unit and an external storage device of the electronic device 1. The memory 12 may be used not only for storing application software installed in the electronic apparatus 1 and various types of data, such as a code for identification of a circuit connection relationship, or the like, but also for temporarily storing data that has been output or is to be output.
The processor 13 may be comprised of integrated circuits in some embodiments, for example, a single packaged integrated circuit, or may be comprised of multiple integrated circuits packaged with the same or different functions, including one or more central processing units (Central Processing unit, CPU), microprocessors, digital processing chips, graphics processors, various control chips, and the like. The processor 13 is a Control Unit (Control Unit) of the electronic device 1, connects the respective components of the entire electronic device 1 using various interfaces and lines, executes or executes programs or modules (e.g., a circuit connection relationship identification program, etc.) stored in the memory 12, and invokes data stored in the memory 12 to perform various functions of the electronic device 1 and process data.
The processor 13 executes the operating system of the electronic device 1 and various types of applications installed. The processor 13 executes the application program to implement the steps in the above-described method of identifying circuit connection relationships.
Illustratively, the computer program may be split into one or more modules that are stored in the memory 12 and executed by the processor 13 to complete the present application. The one or more modules may be a series of instruction segments of a computer program capable of performing a specific function for describing the execution of the computer program in the electronic device 1. For example, the computer program may be partitioned into an image acquisition module 110, a device identification module 120, a post screening module 130, an experimental device screening module 140, and a circuit connection module 150.
The integrated units implemented in the form of software functional modules may be stored in a computer readable storage medium, which may be non-volatile or volatile. The software functional module is stored in a storage medium, and includes several instructions for making a computer device (which may be a personal computer, a computer device, or a network device, etc.) or a processor (processor) execute part of the functions of the method for identifying a circuit connection relationship according to the embodiments of the present application.
In summary, according to the method, the system, the equipment and the medium for identifying the circuit connection relation disclosed by the invention, the experimental circuit image is input into the target detection model, and all binding posts, experimental equipment and wires appearing in the image can be accurately identified. Through calculating the cross-connection ratio between the wire and the binding post, the binding post which is actually connected with the wire can be effectively screened, and the connection mode of the circuit can be further determined through analyzing the connection relation between the binding posts and corresponding experimental devices. According to the connection relation among the binding posts, the experimental devices and the wires, the connection relation of the experimental devices is constructed, and therefore the accuracy of circuit connection relation identification is remarkably improved. The invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A method for identifying a circuit connection relationship, the method comprising:
acquiring an experimental circuit image;
Inputting the experimental circuit image into a target detection model, and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model;
For each wire: calculating the intersection ratio of the wire and each binding post, and screening out binding posts connected with the wire according to the calculated intersection ratio;
determining an experimental device connected with the binding post based on the screened binding post;
And connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop.
2. The method of claim 1, wherein calculating the ratio of the conductor to each terminal, and selecting the terminal to which the conductor is connected based on the calculated ratio, comprises:
calculating the intersection ratio of the wire and each binding post, screening out binding posts with the intersection ratio larger than a preset intersection ratio threshold value, and judging the number of the screened binding posts:
if the number of the binding posts is equal to 2, taking all the screened binding posts as binding posts connected with the lead;
if the number of the binding posts is greater than 2, the binding posts connected with the lead wires are screened based on the position of each screened binding post relative to the identified lead wires.
3. The method of claim 2, wherein the step of screening the terminals connected to the wire based on the position of each of the screened terminals with respect to the identified wire comprises:
Traversing all screened binding posts, and screening out one or more binding post combinations which are symmetrical with respect to the center of the wire according to the position of the wire;
Judging the number of binding post combinations:
If the number of the binding post combinations is one, two binding posts in the binding post combinations are used as binding posts connected with a lead;
if the number of terminal combinations is not one, then for each terminal combination: calculating the weight of the binding post combination according to the intersection of the two binding posts and the lead and the distance between the binding posts; the two binding posts in the binding post combination with the largest weight are selected as the binding posts connected with the lead.
4. A method of identifying a circuit connection according to claim 3, wherein said calculating the weight of the combination of the posts based on the intersection of each of the posts and the wires, and the distance between the posts, comprises:
Respectively calculating the intersection of the two binding posts and the lead;
calculating the ratio of the intersection to the corresponding binding post as a first ratio and a second ratio of the binding post combination;
Calculating the distance between the two binding posts;
Taking the product of the first ratio, the second ratio and the distance as the weight of the binding post combination.
5. The method of claim 1, wherein the step of determining the experimental device to which the post is connected based on the screened post comprises:
Traversing all identified experimental devices, for each experimental device:
Calculating the cross-over ratio of the experimental device and each screened binding post, judging whether each calculated cross-over ratio is larger than a preset threshold value, and analyzing the number of the cross-over ratios larger than the threshold value:
if the cross ratio is larger than a preset threshold value, determining that the experimental device is connected with the corresponding binding post;
if the cross-over ratio is larger than the preset threshold value, determining that the experimental device is connected with the two binding posts with the largest cross-over ratio.
6. The method of claim 1, wherein the object detection model is YOLOv model.
7. The method for identifying a circuit connection relationship according to claim 1, further comprising, after the forming of the circuit loop: the circuit loop is marked in the experimental circuit image.
8.A system for identifying a circuit connection relationship, the system comprising:
The image acquisition module is used for acquiring an experimental circuit image;
The device identification module is used for inputting the experimental circuit image into a target detection model and identifying each experimental device, a wire and a binding post connected with the wire which appear in the experimental circuit image; each experimental device is provided with at most two binding posts connected with wires, and the target detection model is a YOLO series model;
Terminal screening module for, for each wire: calculating the intersection ratio of the wire and each binding post, and screening out binding posts connected with the wire according to the calculated intersection ratio;
The experimental device screening module is used for determining an experimental device connected with the binding post based on the screened binding post;
And the circuit connection module is used for connecting the identified binding posts, the experimental device and the lead wires according to the respective connection relations to form a circuit loop.
9. An electronic device, the electronic device comprising:
One or more processors;
Storage means for storing one or more programs which, when executed by the one or more processors, cause the electronic device to implement the method of identifying circuit connection relationships of any of claims 1 to 7.
10. A computer-readable storage medium, characterized by: a computer program stored thereon, which, when executed by a processor of a computer, causes the computer to perform the method of identifying a circuit connection relationship according to any one of claims 1 to 7.
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