CN117946598A - Chip-scale filter packaging film, filter chip and preparation method of filter chip - Google Patents
Chip-scale filter packaging film, filter chip and preparation method of filter chip Download PDFInfo
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- CN117946598A CN117946598A CN202410331494.5A CN202410331494A CN117946598A CN 117946598 A CN117946598 A CN 117946598A CN 202410331494 A CN202410331494 A CN 202410331494A CN 117946598 A CN117946598 A CN 117946598A
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- 239000012785 packaging film Substances 0.000 title claims abstract description 85
- 229920006280 packaging film Polymers 0.000 title claims abstract description 85
- 238000002360 preparation method Methods 0.000 title abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 68
- 239000003822 epoxy resin Substances 0.000 claims abstract description 68
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 68
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 41
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 41
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 34
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000004814 polyurethane Substances 0.000 claims abstract description 30
- 229920002635 polyurethane Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 25
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 19
- 238000007731 hot pressing Methods 0.000 claims abstract description 19
- 239000003086 colorant Substances 0.000 claims abstract description 17
- 239000002002 slurry Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 238000001035 drying Methods 0.000 claims description 16
- 239000011268 mixed slurry Substances 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 13
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 8
- 238000000498 ball milling Methods 0.000 claims description 7
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 4
- -1 imidazole compound Chemical class 0.000 claims description 4
- OYOFUEDXAMRQBB-UHFFFAOYSA-N cyclohexylmethanediamine Chemical compound NC(N)C1CCCCC1 OYOFUEDXAMRQBB-UHFFFAOYSA-N 0.000 claims description 3
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 42
- 239000003292 glue Substances 0.000 abstract description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 229920003023 plastic Polymers 0.000 description 10
- 239000004033 plastic Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005303 weighing Methods 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a chip-scale filter packaging film, a filter chip and a preparation method thereof, wherein the packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant, wherein the epoxy resin consists of polyurethane modified bisphenol A type epoxy resin and tetrafunctional epoxy resin, and the molecular weight of the phenoxy resin is 50000-150000. According to the invention, the large-particle-size silicon dioxide, the high-molecular-weight phenoxy resin, the polyurethane modified bisphenol A epoxy resin and the tetrafunctional epoxy resin are matched, so that the packaging film has certain fluidity under the vacuum hot-pressing condition, the periphery of the filter chip is ensured to be coated, and meanwhile, glue is not permeated into a cavity functional area, the packaging film can reduce the packaging size of the filter, simplify the packaging mode of the filter, reduce the packaging cost, improve the packaging efficiency and the packaging yield, and can meet the future packaging requirement on miniaturization.
Description
Technical Field
The invention belongs to the technical field of filter packaging, and particularly relates to a chip-scale filter packaging film, a filter chip and a preparation method of the filter chip.
Background
With the rapid development of communication equipment, higher requirements are put on the packaging technology of the filter. The filter is an important semiconductor device, and the filter packaging is a process of sealing the functional area of the filter to form a cavity so as to protect the filter from the external environment.
Because the size of the filter element is smaller, the packaging process cost is high, for example, a blocking piece is arranged to form a closed cavity around the functional surface of the filter chip, so that the plastic packaging material is blocked from entering; or the functional surface of the filter is adhered in a deep cavity manufactured on the shell by adopting a parallel welding mode of the ceramic shell, and air is replaced by nitrogen so as to ensure that the device is not polluted, but the packaging mode has larger size and low processing efficiency; or the plastic packaging material outside is isolated by adopting a film coating mode to ensure that the functional area of the filter forms a cavity without pollution, which requires the film to be covered to have excellent flexibility and adhesive force, and the packaging size of the filter is increased.
At present, the miniaturized packaging mode of the filter is to flip-chip bond the bare chip of the filter on the substrate through the metal ball, then cover the plastic package material on the upper surface of the bare chip of the filter to seal the bare chip of the filter inside the plastic package glue, and finally make the plastic package glue solidify and cut into the finished product of the single plastic-packaged filter. Because the plastic packaging material has good fluidity, the plastic packaging material in the market is easy to invade the inside of the device in the plastic packaging process, so that the functional area and the cavity environment of the filter are polluted to influence the normal operation of the device, and the production yield of the filter is reduced.
Therefore, how to provide a packaging film for a chip-scale filter, which prevents the functional area of the filter chip from being polluted by controlling the fluidity of the packaging film for the chip-scale filter, so as to improve the production efficiency of the filter chip is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a chip-scale filter packaging film, a filter chip and a preparation method thereof, so as to at least solve one technical problem.
To achieve the above object, a first aspect of the present invention provides a chip-scale filter packaging film comprising, in mass percent: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000.
In the first aspect, the silica has a particle diameter D50 of 7 to 10 μm.
In the first aspect, the epoxy equivalent of the polyurethane modified bisphenol A type epoxy resin is 230-260 g/eq; the epoxy equivalent of the tetrafunctional epoxy resin is 95-125 g/eq.
In a first aspect, the epoxy resin includes at least one of tetraglycidyl-1, 3-diaminomethylcyclohexane, tetraglycidyl diaminodiphenylmethane, and tetraglycidyl xylylenediamine.
In a first aspect, the curing agent is a latent curing agent; the latent curing agent comprises dicyandiamide.
In a first aspect, the accelerator is a latent accelerator; the latency accelerator comprises an imidazole compound.
In a first aspect, the colorant comprises carbon black; the average particle diameter of the carbon black was 5nm.
A second aspect of the present invention provides a method for preparing a packaging film for a chip-scale filter according to the first aspect, the method comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000;
s2, transferring the first slurry to a bead mill for dispersion treatment to obtain uniformly dispersed second slurry;
s3, carrying out vacuum defoaming on the second slurry to obtain third slurry;
S4, coating the third slurry on a base film, and drying;
and S5, removing the base film after drying is finished, and obtaining the packaging film of the chip-scale filter.
The third aspect of the present invention provides a method for manufacturing a filter chip, the method comprising: stirring and mixing the components in the packaging film of the chip-scale filter in the first aspect, and performing bead grinding and vacuum defoaming to obtain mixed slurry; the mass percentages of the components specifically include: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000; coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film; acquiring a bare chip of a filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball; covering the upper surface of the bare filter chip with the chip-level filter packaging film in a vacuum hot-pressing mode; the conditions of the vacuum hot pressing include: the pressure is 0.1-0.5 MPa, the temperature is 50-70 ℃ and the time is 10-60 s; and (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
According to a fourth aspect of the present invention, there is provided a filter chip manufactured by the method for manufacturing a filter chip according to the third aspect.
Advantageous effects
The invention provides a chip-scale filter packaging film, which comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant, wherein the epoxy resin consists of polyurethane modified bisphenol A type epoxy resin and tetrafunctional epoxy resin, and the molecular weight of the phenoxy resin is 50000-150000; the polarity of the polyurethane modified bisphenol A epoxy resin is enhanced, so that the polyurethane modified bisphenol A epoxy resin has stronger acting force on the silicon dioxide, the surface performance of the silicon dioxide is effectively increased, and the compatibility between the polyurethane modified bisphenol A epoxy resin and the silicon dioxide is improved; the tetrafunctional epoxy resin has high reactivity and can provide a crosslinking fulcrum; the phenoxy resin improves the wettability of the silicon dioxide, the phenoxy resin, the polyurethane modified bisphenol A epoxy resin and the tetrafunctional epoxy resin are used as matrix resin, the fluidity of the packaging film of the chip-level filter can be controlled by adjusting the proportion among the three and controlling the particle size of the silicon dioxide, and the curing efficiency is improved under the catalysis of the curing agent and the accelerator, so that the packaging efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present description or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for preparing a packaging film for a chip scale filter according to the present application
FIG. 2 is a schematic diagram of a filter chip according to the present application;
FIG. 3 is a schematic diagram of a bare chip of a filter;
FIG. 4 is a diagram showing the packaging effect of embodiment 1 of the present application;
FIG. 5 is a diagram showing the packaging effect in embodiment 2 of the present application;
FIG. 6 is a diagram showing the packaging effect in embodiment 3 of the present application;
FIG. 7 is a graph showing the encapsulation effect of comparative example 1 of the present application;
FIG. 8 is a graph showing the encapsulation effect of comparative example 2 of the present application;
reference numerals:
1. A metal ball; 2. a substrate; 3. a cavity, 4-filter bare chip; 41. a filter chip functional region; 42 filter nonfunctional area; 5. chip scale filter packaging film.
Detailed Description
The advantages and various effects of the present invention will be more clearly apparent from the following detailed description and examples. It will be understood by those skilled in the art that these specific embodiments and examples are intended to illustrate the invention, not to limit the invention.
Throughout the specification, unless specifically indicated otherwise, the terms used herein should be understood as meaning as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification will control.
Unless specifically indicated otherwise, the various raw materials, reagents, instruments, equipment, etc., used in the present invention are commercially available or may be obtained by existing methods.
The application provides a chip-scale filter packaging film, which comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000.
Specifically, the invention provides a chip-scale filter packaging film, which comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant, wherein the epoxy resin consists of polyurethane modified bisphenol A type epoxy resin and tetrafunctional epoxy resin, and the molecular weight of the phenoxy resin is 50000-150000; the polarity of the polyurethane modified bisphenol A epoxy resin is enhanced, so that the polyurethane modified bisphenol A epoxy resin has stronger acting force on the silicon dioxide, the surface performance of the silicon dioxide is effectively increased, and the compatibility between the polyurethane modified bisphenol A epoxy resin and the silicon dioxide is improved; the tetrafunctional epoxy resin has high reactivity and can provide a crosslinking fulcrum; the phenoxy resin improves the wettability of the silicon dioxide, the phenoxy resin, the polyurethane modified bisphenol A epoxy resin and the tetrafunctional epoxy resin are used as matrix resin, the fluidity of the packaging film of the chip-level filter can be controlled by adjusting the proportion among the three and controlling the particle size of the silicon dioxide, and the curing efficiency is improved under the catalysis of the curing agent and the accelerator, so that the packaging efficiency is improved.
In some possible embodiments, the silica has a particle size D50 of 7 to 10 μm.
The silica with larger particle size is selected as the filler, so that on one hand, a certain blocking effect can be achieved, and the powder with larger particle size can block the plastic packaging material from decreasing in viscosity and increasing in fluidity under the conditions of temperature and pressure and flowing into the cavity; on the other hand, a suitable storage modulus and thermal expansion coefficient can be adjusted, and as a preferred example, the particle diameter d50=8.5 um of silica.
In some possible embodiments, the polyurethane-modified bisphenol a type epoxy resin has an epoxy equivalent weight of 230 to 260g/eq; the epoxy equivalent of the tetrafunctional epoxy resin is 95-125 g/eq.
In some possible embodiments, the epoxy resin includes at least one of tetraglycidyl-1, 3-diaminomethylcyclohexane, tetraglycidyl diaminodiphenylmethane, and tetraglycidyl xylylenediamine.
As can be appreciated by those skilled in the art, the fluidity of the packaging film of the chip-level filter is controlled by adjusting the ratio of the phenoxy resin, the polyurethane modified bisphenol A type epoxy resin and the tetrafunctional epoxy resin serving as matrix materials. Wherein, the phenoxy resin can improve the wettability of the filler, provide toughness and the cohesiveness of the reinforcing material, and can control the appearance and rheological property; the tetrafunctional epoxy resin has four epoxy groups, has higher reactivity, can improve the crosslinking density after curing, has good curing performance, good high temperature resistance and excellent weather resistance and ageing resistance.
In some possible embodiments, the curing agent is a latent curing agent; the latent curing agent comprises dicyandiamide.
The latent curing agent and the epoxy resin can be stably stored at normal temperature after being mixed, and the curing agent begins to dissolve and react and cure rapidly when reaching the vicinity of the melting point through heating reaction, and the dicyandiamide curing reaction temperature is 160-180 ℃ and is usually required to be matched with an accelerator.
In some possible embodiments, the accelerator is a latent accelerator; the latency accelerator comprises an imidazole compound.
The latent accelerator can accelerate the reaction rate of the epoxy resin and the latent curing agent, reduce the curing time and improve the production efficiency; the imidazole compound can reduce the dicyandiamide curing reaction temperature, such as 2-phenyl-4, 5 dihydroxymethylimidazole.
In some possible embodiments, the colorant comprises carbon black; the average particle diameter of the carbon black was 5nm.
As will be appreciated by those skilled in the art, the colorant is used to color the chip-scale filter packaging film, and in the present application, the colorant may be carbon black having an average particle diameter of 5nm.
Based on a general inventive concept, referring to fig. 1, the present application also provides a method for preparing a chip scale filter packaging film according to the first aspect, the method comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000;
s2, transferring the first slurry to a bead mill for dispersion treatment to obtain uniformly dispersed second slurry;
s3, carrying out vacuum defoaming on the second slurry to obtain third slurry;
S4, coating the third slurry on a base film, and drying;
and S5, removing the base film after drying is finished, and obtaining the packaging film of the chip-scale filter.
The preparation method of the packaging film of the chip-scale filter provided by the application is simple and easy to operate.
Based on one general inventive concept, a method of manufacturing a filter chip, the method comprising:
S21, stirring and mixing the components in the packaging film of the chip-scale filter in the first aspect, ball milling and vacuum defoaming to obtain mixed slurry; the mass percentages of the components specifically include: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000;
S22, coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
s23, acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
s24, covering the chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode; the conditions of the vacuum hot pressing include: the pressure is 0.1-0.5 MPa, the temperature is 50-70 ℃ and the time is 10-60 s;
s25, curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
It can be understood by those skilled in the art that under the condition of vacuum hot pressing, the chip-scale filter packaging film prepared according to the above formulation proportion has certain fluidity, so that the packaging film flows towards the substrate and is in close contact with the upper surface of the bare filter chip, the packaging of the bare filter chip is completed, after the packaging is finished, the packaging film, the bare filter chip and the substrate are solidified, so that the packaging film of the chip-scale filter, the bare filter chip and the substrate form a whole, and then the filter chip with the expected size and the packaged structure is obtained by cutting, so that the packaging requirement of the miniaturized filter chip can be met.
Based on a general inventive concept, the application also provides a filter chip, which is manufactured by adopting the manufacturing method of the filter chip in the third aspect.
The application provides a filter chip, which is structurally shown in fig. 2-3, and comprises a metal ball 1, a substrate 2, a cavity 3, a filter bare chip 4 and a chip-level filter packaging film 5, wherein the lower surface of the filter bare chip 4 is welded with the substrate 2 through a plurality of metal balls 1, and the chip-level filter packaging film 5 covers the filter bare chip 4 and is contacted with the substrate 2, so that the functional area of the filter chip is protected from being polluted.
The application will be further illustrated with reference to specific examples. It is to be understood that these examples are illustrative of the present application and are not intended to limit the scope of the present application. The experimental procedures, which are not specified in the following examples, are generally determined according to national standards. If the corresponding national standard does not exist, the method is carried out according to the general international standard, the conventional condition or the condition recommended by the manufacturer.
Example 1
The packaging film of the chip-scale filter in the embodiment comprises the following components in percentage by mass:
Silicon dioxide (d50=8.5 μm) 55%
Polyurethane modified bisphenol A type epoxy resin 18%
Tetraglycidyl-1, 3-diamino methyl cyclohexane 5%
Phenoxy resin 18%
Dicyandiamide 2.5%
1% Of 2-phenyl-4, 5-dihydroxymethylimidazole
Carbon black 0.5%
Wherein the molecular weight of the phenoxy resin is 10 ten thousand.
The chip-scale filter packaging film in this embodiment is prepared by the following steps:
(1) Weighing the raw materials according to the formula proportion, and uniformly stirring to obtain first slurry;
(2) Transferring the first slurry to a bead mill for dispersion treatment to obtain second slurry which is uniformly dispersed;
(3) Vacuum defoaming is carried out on the second slurry to obtain third slurry;
(4) Coating the third slurry on the base film, and drying;
(5) And after the drying is finished, removing the base film to obtain the packaging film of the chip-scale filter.
The chip-scale filter packaging film of the present embodiment is applied to packaging a filter chip, and a specific packaging process thereof is as follows:
(21) Weighing the raw materials according to the formula proportion, stirring and mixing, ball milling and vacuum defoaming to obtain mixed slurry;
(22) Coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
(23) Acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
(24) Covering a chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode to finish packaging; the conditions of vacuum hot pressing include: the pressure is 0.3MPa, the temperature is 50 ℃ and the time is 50s;
(25) And (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
Example 2
The packaging film of the chip-scale filter in the embodiment comprises the following components in percentage by mass:
silica (d50=8.5 μm) 60%
Polyurethane modified bisphenol A type epoxy resin 15%
Tetraglycidyl xylylenediamine 4%
17% Of phenoxy resin
Dicyandiamide 2.5%
1% Of 2-phenyl-4, 5-dihydroxymethylimidazole
Carbon black 0.5%
Wherein the molecular weight of the phenoxy resin is 10 ten thousand.
The method for preparing the chip-scale filter packaging film in this embodiment is the same as that in embodiment 1.
The chip-scale filter packaging film of the present embodiment is applied to packaging a filter chip, and a specific packaging process thereof is as follows:
(21) Weighing the raw materials according to the formula proportion, stirring and mixing, ball milling and vacuum defoaming to obtain mixed slurry;
(22) Coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
(23) Acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
(24) Covering a chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode to finish packaging; the conditions of vacuum hot pressing include: the pressure is 0.2MPa, the temperature is 60 ℃ and the time is 30s;
(25) And (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
Example 3
The packaging film of the chip-scale filter in the embodiment comprises the following components in percentage by mass:
silica (d50=8.5 μm) 65%
12.7 Percent of polyurethane modified bisphenol A type epoxy resin
Tetraglycidyl xylylenediamine 3%
Phenoxy resin 16%
Dicyandiamide 2%
2-Phenyl-4, 5-dihydroxymethylimidazole 0.8%
Carbon black 0.5%
Wherein the molecular weight of the phenoxy resin is 10 ten thousand.
The method for preparing the chip-scale filter packaging film in this embodiment is the same as that in embodiment 1.
The chip-scale filter packaging film of the present embodiment is applied to packaging a filter chip, and a specific packaging process thereof is as follows:
(21) Weighing the raw materials according to the formula proportion, stirring and mixing, ball milling and vacuum defoaming to obtain mixed slurry;
(22) Coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
(23) Acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
(24) Covering a chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode to finish packaging; the conditions of vacuum hot pressing include: the pressure is 0.1MPa, the temperature is 70 ℃ and the time is 20s;
(25) And (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
Comparative example 1
The chip-scale filter packaging film of the comparative example comprises the following components in percentage by mass:
silica (d50=1.3 μm) 60%
Polyurethane modified bisphenol A type epoxy resin 15%
Bisphenol F type epoxy resin 4%
17% Of phenoxy resin
Dicyandiamide 2.5%
1% Of 2-phenyl-4, 5-dihydroxymethylimidazole
Carbon black 0.5%
Wherein the epoxy equivalent of the bisphenol F type epoxy resin is 160-180g/eq, and the molecular weight of the phenoxy resin is 10 ten thousand.
The method for producing the chip-scale filter packaging film in this comparative example was the same as that of example 1.
The chip-scale filter packaging film of the present comparative example was applied to packaging filter chips, and the specific packaging procedure thereof is as follows:
(21) Weighing the raw materials according to the formula proportion, stirring and mixing, ball milling and vacuum defoaming to obtain mixed slurry;
(22) Coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
(23) Acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
(24) Covering a chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode to finish packaging; the conditions of vacuum hot pressing include: the pressure is 0.2MPa, the temperature is 60 ℃ and the time is 30s;
(25) And (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
Comparative example 2
The chip-scale filter packaging film of the comparative example comprises the following components in percentage by mass:
silica (d50=8.5 μm) 60%
Polyurethane modified bisphenol A type epoxy resin 15%
Bisphenol F type epoxy resin 4%
Acrylic resin 17%
Dicyandiamide 2.5%
1% Of 2-phenyl-4, 5-dihydroxymethylimidazole
Carbon black 0.5%
Wherein the epoxy equivalent of the bisphenol F type epoxy resin is 160-180g/eq, and the molecular weight of the acrylic resin is 30 ten thousand.
The method for producing the chip-scale filter packaging film in this comparative example was the same as that of example 1.
The chip-scale filter packaging film of the present comparative example was applied to packaging filter chips, and the specific packaging procedure thereof is as follows:
(21) Weighing the raw materials according to the formula proportion, stirring and mixing, ball milling and vacuum defoaming to obtain mixed slurry;
(22) Coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
(23) Acquiring a bare chip of the filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
(24) Covering a chip-level filter packaging film on the upper surface of the bare filter chip in a vacuum hot-pressing mode to finish packaging; the conditions of vacuum hot pressing include: the pressure is 0.4MPa, the temperature is 70 ℃ and the time is 60s;
(25) And (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
The chip scale filter packaging films provided in examples 1-3 and comparative examples 1-2 were subjected to rheology tests, bleed distances, copper adhesion, thixotropic coefficients, glass transition temperatures, coefficients of thermal expansion, and storage moduli, as follows:
1. rheological test: after the formulation is coated into a film, the film is cut into 5cm multiplied by 5cm sample pieces, the light release film is torn off, and the film material is thermally transferred to a thickness of 1000-1200 mu m at 100 ℃. The viscosity was measured by a rheometer, the fixing force was set at 2N, and the viscosity was measured at 50℃at 60℃and at 70 ℃.
2. Glue penetration distance: after the formula is coated into a film, cutting into sample wafers with the length of 9cm multiplied by 9cm, tearing off a light release film, covering the sample wafers on a bare chip of a wave filter which is flip-chip bonded on a substrate, performing vacuum hot pressing, curing at 150 ℃ for 2 hours, cutting into single finished products, and then prying off the substrate to measure the glue penetration distance d by using an optical microscope; the functional area of the filter chip which is not penetrated by the glue is marked as "+", the functional area of the filter chip which is penetrated by the glue is marked as "×", and the periphery of the chip which is not covered by the glue (i.e. the glue is not contacted with the substrate) is marked as "-".
3. Copper sheet adhesion: after the formula is coated into a film, cutting a film material with the thickness of 2mm multiplied by 2mm, transferring and pasting the film material on a copper sheet, curing the film material for 2 hours at 150 ℃, and testing the shearing bonding strength by using a universal tensile machine.
4. Thixotropic coefficient (TI) test: the slurry obtained by the above formulation was tested for a viscosity value η1 at 0.5rpm and a viscosity value η2 at 5rpm using a doctor blade, U.S. bohler DV1MRV viscometer, no. 21 spindle, test temperature 30 ℃, ti=η1/η2.
5. Coefficient of thermal expansion and glass transition temperature: the cured samples were measured according to ASTM E831-2019, with the following parameters: preloading force: 0.05N, first scan: second scanning at room temperature-250 ℃ (heating rate 10 ℃/min): and (3) taking curve data of a second heating segment at room temperature of-250 ℃ (heating rate of 10 ℃/min).
6. Storage modulus test: the test specimens were prepared to dimensions 55mm x 10mm x 2mm and tested for storage modulus using astm e2254-2018 standard method.
The test results are shown in table 1 below:
table 1 test results
From the above table, it can be seen that: the silicon dioxide with larger average particle size and the tetrafunctional epoxy resin are added, so that the obtained film has lower fluidity and higher thixotropic coefficient, and the glue penetration distance d is not polluted to a filter functional area when the film is applied to a bare chip of the filter; in addition, compared with acrylic resin with the molecular weight of 30 ten thousand, the 10 ten thousand phenoxy resin has better fluidity, can cover the periphery of the filter chip and is adhered to the substrate to form a cavity; finally, the addition of the polyurethane modified bisphenol A epoxy resin and the phenoxy resin is beneficial to improving the adhesive force of the film material to the substrate, and is beneficial to subsequent cutting into single filter packaging finished products.
As can be seen from the packaging effect diagrams of fig. 4-8, the chip-level filter packaging film prepared in examples 1-3 is used for packaging the bare chip of the filter, and although the glue seepage occurs, the glue solution does not infiltrate into the functional area of the chip of the filter, so that the normal operation of the filter is not affected; in comparative example 1, the glue seepage condition is serious, and the glue solution has permeated into the functional area of the filter chip, so that the normal operation of the filter is affected; the glue in comparative example 2 did not contact the substrate, i.e., the encapsulation of the bare filter chip was not completed.
In summary, the packaging film of the chip-scale filter provided by the application has lower fluidity, can cover the periphery of the filter chip, enables a closed cavity to be formed between the chip and the substrate, prevents the filter functional area from being polluted, and has higher glass transition temperature and storage modulus. The filter chip can be coated in the use process, and meanwhile, glue can not be permeated into the cavity to pollute the filter functional area; the packaging mode of the filter is simplified, the packaging efficiency and the packaging yield are improved, and the packaging cost is reduced; meanwhile, the film is directly applied to plastic packaging of the filter, the packaging size of the filter can be reduced, and the thickness of the corresponding film can be produced according to the total height of the flip-chip filter chip structure, so that the size after packaging is correspondingly reduced, and the packaging requirement of the future miniaturization can be met.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A chip-scale filter packaging film, characterized in that the chip-scale filter packaging film comprises the following components in mass percent: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000.
2. The chip-scale filter packaging film according to claim 1, wherein the silica has a particle diameter D50 of 7 to 10 μm.
3. The packaging film for chip scale filters according to claim 2, wherein the epoxy equivalent of the polyurethane modified bisphenol a type epoxy resin is 230 to 260g/eq; the epoxy equivalent of the tetrafunctional epoxy resin is 95-125 g/eq.
4. The chip-scale filter packaging film according to claim 3, wherein the epoxy resin comprises at least one of tetraglycidyl-1, 3-diaminomethylcyclohexane, tetraglycidyl diaminodiphenylmethane and tetraglycidyl xylylenediamine.
5. The chip scale filter packaging film according to claim 4, wherein the curing agent is a latent curing agent; the latent curing agent comprises dicyandiamide.
6. The chip scale filter packaging film according to claim 5, wherein the accelerator is a latent accelerator; the latency accelerator comprises an imidazole compound.
7. The chip-scale filter packaging film according to claim 6, wherein the colorant comprises carbon black; the average particle diameter of the carbon black was 5nm.
8. A method of manufacturing a chip-scale filter packaging film according to any one of claims 1 to 7, comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000;
s2, transferring the first slurry to a bead mill for dispersion treatment to obtain uniformly dispersed second slurry;
s3, carrying out vacuum defoaming on the second slurry to obtain third slurry;
S4, coating the third slurry on a base film, and drying;
and S5, removing the base film after drying is finished, and obtaining the packaging film of the chip-scale filter.
9. A method of manufacturing a filter chip, the method comprising:
Stirring and mixing the components in the packaging film of the chip-scale filter according to any one of claims 1 to 7, ball milling and vacuum defoaming to obtain mixed slurry; the mass percentages of the components specifically include: the chip-scale filter packaging film comprises the following components in percentage by mass: 55-70% of silicon dioxide, 14-24% of epoxy resin, 15-20% of phenoxy resin, 1-2.5% of curing agent, 0.5-1.2% of accelerator and 0.3-0.9% of colorant; the epoxy resin consists of polyurethane modified bisphenol A epoxy resin and tetrafunctional epoxy resin; the molecular weight of the phenoxy resin is 50000-150000;
coating the mixed slurry on a base film, and drying to obtain a chip-scale filter packaging film on the base film;
Acquiring a bare chip of a filter, wherein the lower surface of the bare chip of the filter is flip-chip welded on a substrate through a metal ball;
Covering the upper surface of the bare filter chip with the chip-level filter packaging film in a vacuum hot-pressing mode; the conditions of the vacuum hot pressing include: the pressure is 0.1-0.5 MPa, the temperature is 50-70 ℃ and the time is 10-60 s;
and (3) curing for 2 hours at 150 ℃, and cutting after curing is finished to obtain the filter chip with good package.
10. A filter chip, wherein the filter chip is manufactured by the method for manufacturing the filter chip according to claim 9.
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