CN117930212B - Phased array radar module - Google Patents
Phased array radar module Download PDFInfo
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- CN117930212B CN117930212B CN202410328862.0A CN202410328862A CN117930212B CN 117930212 B CN117930212 B CN 117930212B CN 202410328862 A CN202410328862 A CN 202410328862A CN 117930212 B CN117930212 B CN 117930212B
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/023—Interference mitigation, e.g. reducing or avoiding non-intentional interference with other HF-transmitters, base station transmitters for mobile communication or other radar systems, e.g. using electro-magnetic interference [EMI] reduction techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
- G01S7/028—Miniaturisation, e.g. surface mounted device [SMD] packaging or housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S2013/0236—Special technical features
- G01S2013/0245—Radar with phased array antenna
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention relates to the field of phased array radars, in particular to a phased array radar module, which comprises a packaging cover body and a T/R cavity fastened at the upper part of the packaging cover body, wherein a plurality of containing cavities distributed in a rectangular array are formed at the bottom of the T/R cavity, a PCB control plate is arranged in any containing cavity, an antenna array surface is also arranged at the top of the T/R cavity and at the position corresponding to the PCB control plate, a plurality of insulators are embedded at the top of the T/R cavity, and the top and the bottom of the insulators are respectively connected with the antenna array surface and a PCB control plate; the packaging cover body and the T/R cavity are internally provided with a thermal control assembly, and the thermal control assembly comprises a first thermal control piece positioned in the packaging cover body and a second thermal control piece positioned in the T/R cavity; through optimizing structural layout and improving related structures, the overall performance and stability of the system are improved, and meanwhile, the practicability and service reliability of the phased array radar module are improved.
Description
Technical Field
The invention relates to the technical field of phased array radars, in particular to a phased array radar module.
Background
Phased array radar (english: PHASED ARRAY RADAR, PAR), i.e. a phase-controlled electronically scanned array radar, uses a large number of individually controlled small antenna elements arranged in an antenna array plane, each antenna element being controlled by an independent phase-shifting switch, and by controlling the phase emitted by each antenna element, beams of different phases can be synthesized. Electromagnetic waves emitted by all antenna units of the phased array are synthesized into a nearly straight radar main lobe by an interference principle, and side lobes are caused by non-uniformity of all antenna units.
Phased arrays are classified into "passive" (PESA) and "active" (AESA), wherein the "passive" system with lower technical performance has been deployed on vessels and medium/small aircraft in the last 80 th century, and the "active" system with better performance, better development prospect but higher technical performance has been put into service by the end of the 90 th year. The method fundamentally solves various congenital problems of the traditional mechanical scanning radar, and the reaction speed, the target update rate, the multi-target tracking capability, the resolution, the multifunctionality, the electronic countermeasure capability and the like of the phased array are far superior to those of the traditional radar under the same aperture and the same operation wavelength.
The traditional phased array radar technology still has the problems of insufficient design, low integration level, obvious technical defects and the like, and further the structural layout defect of the traditional phased array radar technology leads to the distribution of components in the radar, long signal transmitting and receiving transmission paths, signal attenuation and interference are caused, the radar performance is affected, and the heat control management is insufficient, so that after the radar is started up for a long time and is in service, heat is gathered, and further the working stability and the service life of a radar system are affected.
Disclosure of Invention
The present invention aims to provide a phased array radar module for solving one of the above problems.
The invention is realized by the following technical scheme:
The phased array radar module comprises a packaging cover body and T/R cavities fastened on the upper part of the packaging cover body, wherein a plurality of containing cavities distributed in a rectangular array are formed in the bottom of each T/R cavity, a PCB control plate is arranged in each containing cavity, an antenna array surface is further arranged at the top of each T/R cavity and at the position corresponding to the PCB control plate, a plurality of insulators are embedded in the top of each T/R cavity, and the top and the bottom of each insulator are respectively connected with the antenna array surface and a PCB control plate; the PCB control board comprises a first sub board and a second sub board which are stacked, a gap exists between the first sub board and the second sub board, the first sub board and the second sub board are connected through gold wire bonding, and a plurality of radio frequency implanting balls are further arranged in the gap; the middle of the inside of the packaging cover body is divided into an upper cavity and a lower cavity by a partition plate, a first circuit board and a second circuit board are correspondingly arranged in the two cavities, and the first circuit board and the second circuit board are electrically connected; the packaging cover body and the T/R cavity are internally provided with a heat control assembly, the heat control assembly comprises a first heat control piece positioned in the packaging cover body and a second heat control piece positioned in the T/R cavity, and heat accumulated in the packaging cover body and the T/R cavity is conducted and radiated through the first heat control piece and the second heat control piece respectively.
As for the phased array radar, the size specification has great influence on the service performance of the radar, the phased array radar is subjected to structural optimization in a limited space, so that the phased array radar is miniaturized and modularized, and the combat performance of the phased array radar can be greatly improved. The regular rectangular shielding cavity at the bottom of the TR cavity increases isolation among channels, avoids mutual interference, and improves the sensitivity and control precision of the radar system; and further to this scheme, it makes it can divide regional heat to the T/R cavity and in the encapsulation lid to distribute through the setting of thermal control subassembly, promotes the thermal management efficiency of this radar greatly, avoids after the long-term start-up of radar is in service, and the overheat that heat accumulation leads to reduces radar performance, ensures that the radar keeps good stability when the operation to reliability and the persistence of radar system have been improved, prolonged its life.
Based on the above scheme, further, the first heat control piece includes the thermal-insulated casing that is located the baffle, thermal-insulated casing's inside is equipped with the heat conduction box, the intussuseption of heat conduction box is filled with the phase transition heat absorber. It should be noted that, in this scheme, for the first heat control element, the main purpose is to effectively dissipate heat of the first circuit board and the second circuit board in the packaging cover, while for the circuit board, it is necessary to ensure the stability of the temperature field in the area, that is, to avoid the temperature change being too severe and the temperature difference mutation, thereby affecting the normal operation of the circuit board.
Preferably, the heat insulation shell is further filled with a heat conduction medium, a plurality of heat transfer columns penetrating to the outside of the partition plate are arranged outside the heat insulation shell, one ends of the heat transfer columns are respectively contacted with the first circuit board and the second circuit board, and the other ends of the heat transfer columns penetrate into the heat insulation shell. Based on the above structure, when the first heat control piece absorbs heat accumulated by the first circuit board and the second circuit board in the packaging cover body during operation, the heat transfer column can conduct the heat into the heat insulation shell, and then the heat is conducted into the heat conduction box through the heat conduction medium in the heat insulation shell, and the heat is absorbed through the phase change heat absorber in the heat conduction box through the phase change.
Based on the above scheme, further, the second heat control piece is including corresponding the heat conduction silica gel pad that sets up between first subplate and second subplate, still crisscross being equipped with in the inside of heat conduction silica gel pad is the cold pipe of latticed capillary liquid, and a plurality of hold the liquid storage spare that one side of the inside in chamber still is equipped with the cold pipe of capillary liquid in the heat conduction silica gel pad and is linked together, a plurality of it is the fin that is L shape still corresponds to inlay to be equipped with on the both sides wall that holds the mutual coincidence in chamber, and a plurality of form cross ventilation runner between the fin, and the outside to T/R cavity is all run through to four tip of ventilation runner. Through above-mentioned structural design, with heat conduction silica gel pad setting between first subplate and second subplate, make it can carry out effective packing to the space between first subplate and the second subplate, guarantee its installation stability, and this scheme is through the crisscross capillary liquid cold tube that sets up in the silica gel pad, and the one end and the stock solution spare intercommunication of capillary liquid cold tube, with this cooling medium accessible flows in the capillary liquid cold tube, and absorb the heat that first subplate and second subplate during operation produced, thereby avoid the heat accumulation, simultaneously can form the heat shielding layer to between first subplate and the second subplate, avoid the heat of its between them to influence each other, and its operating temperature is too high, and through the setting of fin, can flow the cooling medium in the capillary liquid cold tube to its other end time, on with heat conduction to the fin, and carry out the heat exchange through the runner that forms between the fin, thereby realize giving off the heat in the T/R cavity, it helps the L shape of stock solution piece to flow with the cross flow channel structure to flow, and the heat that can be improved, and the cooling medium can be guaranteed that the whole cooling medium is stable in the cooling medium is stable in temperature distribution is guaranteed to the cooling medium, the cooling medium can flow between the cooling medium, and stable temperature distribution is guaranteed to the cooling medium through the cooling medium, the cooling system is guaranteed, the inside can be guaranteed to the cooling temperature steady circulation is guaranteed to flow between the cooling medium, and stable temperature distribution is guaranteed, and stable temperature circulation inside the cooling medium is guaranteed.
Specifically, the reservoir includes: the outer cylinder is made of copper foil, the inside of the outer cylinder is hollow, the elastic liquid storage bag is arranged in the outer cylinder, an annular cavity is formed between the elastic liquid storage bag and the outer cylinder, thermal expansion gas is filled in the annular cavity, cooling medium is stored in the elastic liquid storage bag, and one side of the cooling medium is communicated with the end part of the capillary liquid cooling pipe through a connecting joint. Based on the above structure, when the temperature in the T/R cavity gradually increases, the heat is conducted to the outer cylinder, the copper foil has excellent heat conductivity, so that the temperature in the copper foil rapidly increases, and the outer cylinder is deformed, and the annular cavity in the outer cylinder is filled with thermal expansion gas, so that when the outer cylinder is deformed by heating, the thermal expansion gas is also influenced, the molecular distance of the gas is increased, the pressure is increased, and the expansion and inward pressure are generated, so that the elastic liquid storage bag is deformed after being subjected to extrusion force, and extrusion driving force is generated on the cooling medium stored in the elastic liquid storage bag, so that the cooling medium in the elastic liquid storage bag flows into the capillary liquid cooling pipe, and the flow in the cooling medium sub-capillary liquid cooling pipe is further enhanced, so that the heat dissipation efficiency of the cooling medium sub-capillary liquid cooling pipe is further improved, the heat dissipation efficiency of the second thermal control piece in the T/R cavity is synchronously improved, and the radar heat management efficiency is improved.
Preferably, a chamfer angle part is arranged at the buckling position of the bottom of the T/R cavity and the packaging cover body, and the chamfer angle part and the packaging cover body are welded through tin sealing. Through the design, the radar module is convenient to assemble quickly.
Preferably, the bottom of the second sub-board is connected with the first circuit board through a control connector, and a control joint penetrating to the outside of the lower shell is arranged at the bottom of the second circuit board.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. According to the invention, the shielding accommodation cavities distributed in the rectangular array are arranged at the bottom of the T/R cavity, and the PCB control plates are arranged in the corresponding accommodation cavities, so that the compact layout of the phased array radar assembly is effectively realized, meanwhile, the antenna array surface is arranged at the top of the T/R cavity and corresponds to the PCB control plates in position, so that the layout of a receiving and transmitting link of the radar system is more compact, the antenna radiating unit and the TR chip realize signal interconnection through the radio frequency insulator embedded between the antenna radiating unit and the TR chip, the signal transmission path is shortened, the transmission loss is reduced, and the electric performance of radar emission and receiving is improved. The rectangular shielding accommodating cavity with the regular bottom of the TR cavity also increases isolation among channels, avoids mutual interference, and improves the sensitivity and control precision of the radar system; further, for the scheme, the heat control assembly is arranged, so that the heat control assembly can control and emit heat in the T/R cavity and the packaging cover body in different areas, the heat management efficiency of the radar is greatly improved, the overheat caused by heat accumulation is avoided to reduce the radar performance after the radar is started and used for a long time, the radar is ensured to keep good stability during working and running, the reliability and the continuous performance of a radar system are improved, and the service life of the radar system is prolonged;
2. Aiming at the first heat control piece, the heat on the first circuit board and the heat on the second circuit board can be quickly transferred in the working process of the radar module through the mutual matching of the heat insulation shell, the heat conduction box and the heat conduction column, and then the heat is quickly absorbed through the phase change heat absorber filled in the heat conduction box;
3. The invention aims at a second thermal control piece, the heat-conducting silica gel pad is arranged between the first sub-board and the second sub-board, so that the gap between the first sub-board and the second sub-board can be effectively filled, the installation and assembly stability of the second thermal control piece is ensured, and the scheme ensures that the heat-conducting silica gel pad is internally provided with the capillary liquid cooling pipes which are in grid shapes in a staggered way, one end of each capillary liquid cooling pipe is communicated with a liquid storage piece, so that a cooling medium can flow in each capillary liquid cooling pipe to absorb heat generated by the first sub-board and the second sub-board when working, thereby avoiding heat accumulation, simultaneously forming a heat shielding layer between the first sub-board and the second sub-board, avoiding the mutual influence of the heat between the first sub-board and the second sub-board, and leading the working temperature of the second sub-board to be too high, the heat can be conducted to the cooling fins when the cooling medium in the capillary liquid cooling tube flows to the other end of the cooling medium through the arrangement of the cooling fins, and heat exchange is carried out through the ventilation flow channels formed between the cooling fins, so that the heat in the T/R cavity is radiated to the outside, the L-shaped design of the cooling fins and the structure of the cross ventilation flow channels are beneficial to increasing the surface area of the cooling fins, improving the heat radiation efficiency, ensuring uniform heat distribution among the cooling fins, effectively avoiding local overheating phenomenon, ensuring the stable operation of the whole system, and simultaneously regulating and controlling the flow of the cooling medium through the arrangement of the liquid storage piece, and ensuring that the cooling liquid in the capillary liquid cooling tube always keeps circulating in a proper temperature range, thereby maintaining the temperature stability of the system;
4. When the temperature in the T/R cavity is gradually increased, the heat of the heat storage part is conducted to the outer cylinder, the copper foil of the heat storage part has excellent heat conductivity, so that the temperature in the heat storage part is rapidly increased, the outer cylinder is deformed, and the annular cavity in the outer cylinder is filled with thermal expansion gas, so that when the outer cylinder is heated and deformed, the thermal expansion gas is also influenced, the molecular distance of the gas is increased, the pressure is increased, and the expansion and inward pressure are generated, so that the elastic liquid storage bag is deformed after the elastic liquid storage bag is subjected to extrusion force, and then the cooling medium stored in the elastic liquid storage bag is extruded and pushed to flow into the capillary liquid cooling pipe, so that the flow of the cooling medium in the capillary liquid cooling pipe is further enhanced, the heat dissipation efficiency of the heat storage part is further improved, the heat dissipation efficiency of the second thermal control part in the T/R cavity is synchronously improved, and the radar thermal management efficiency is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the bottom structure of the T/R chamber of the present invention, which is intended to show the specific structure thereof;
FIG. 3 is a schematic diagram of the overall side cross-sectional structure of the present invention, which is intended to show the internal specific structure thereof;
FIG. 4 is a schematic view of the bottom structure of the T/R chamber (with PCB control boards removed) of the present invention, showing the structure of the heat-conductive silica gel pad and its internal capillary liquid-cooled tube;
FIG. 5 is a schematic view of a partially enlarged construction of the invention at A of FIG. 3, intended to specifically illustrate a second thermal control structure;
FIG. 6 is a schematic view of a part of the enlarged structure of FIG. 3B according to the present invention, which is intended to show the structure of the liquid storage member in detail;
FIG. 7 is a schematic view of a first heat control member according to a second embodiment of the present invention;
FIG. 8 is a schematic view of the enlarged partial structure of FIG. 7 according to the present invention, which is intended to specifically show the structures of the heat conducting box and the heat conducting fins;
Fig. 9 is a schematic view of the communication pipeline and the inflated balloon in the third embodiment of the present invention.
In the drawings, the reference numerals and corresponding part names:
1. packaging the cover body; 10. a partition plate; 11. a first circuit board; 12. a second circuit board; 2. a T/R cavity; 20. an antenna array surface; 21. a PCB control board; 210. a first sub-board; 211. a second sub-board; 212. a radio frequency ball is planted; 300. a heat insulating housing; 301. a heat conduction box; 3010. a heat conduction fin; 302. a heat transfer column; 310. a thermally conductive silicone pad; 311. a capillary liquid cooling tube; 312. a liquid storage member; 3120. an outer cylinder; 3121. a reservoir; 313. a heat sink; 314. a ventilation flow passage; 4. a control joint; 5. a communication pipe; 6. the balloon is inflated.
Detailed Description
For the purpose of making apparent the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present invention and the descriptions thereof are for illustrating the present invention only and are not to be construed as limiting the present invention. It should be noted that the present invention is already in a practical development and use stage.
Embodiment one;
Referring to fig. 1 to 3 together, a phased array radar module includes a packaging cover 1 and a T/R cavity 2 fastened on the upper portion of the packaging cover 1, wherein a plurality of rectangular array-distributed accommodating cavities are provided at the bottom of the T/R cavity 2, a PCB control board 21 is provided in any one of the accommodating cavities, an antenna array 20 is further installed at the top of the T/R cavity 2 and at a position corresponding to the PCB control board 21, a plurality of insulators are embedded at the top of the T/R cavity 2, and the top and bottom of the insulators are respectively connected with the antenna array 20 and the PCB control board 21; the PCB control board 21 includes a first sub-board 210 and a second sub-board 211 stacked, and a gap exists between the first sub-board 210 and the second sub-board 211, and is connected by gold wire bonding, and a plurality of radio frequency balls 212 are further disposed in the gap; the middle of the inside of the packaging cover body 1 is divided into an upper cavity and a lower cavity by a partition board 10, a first circuit board 11 and a second circuit board 12 are correspondingly arranged in the two cavities, and the first circuit board 11 and the second circuit board 12 are electrically connected; and a heat control assembly is further arranged in the packaging cover body 1 and the T/R cavity 2, and comprises a first heat control piece positioned in the packaging cover body 1 and a second heat control piece positioned in the T/R cavity 2, and heat accumulated in the packaging cover body 1 and the T/R cavity 2 is conducted and radiated through the first heat control piece and the second heat control piece respectively.
It should be noted that, in the scheme, a plurality of accommodating cavities distributed in a rectangular array are arranged at the bottom of the T/R cavity 2, and the PCB control plates 21 are arranged in the corresponding accommodating cavities, so that the compact layout of the phased array radar assembly is effectively realized, meanwhile, the antenna array surface 20 is arranged at the top of the T/R cavity 2 and corresponds to the PCB control plates 21 in position, so that the transmitting and receiving parts of the radar system are more compact, the signal transmission path is shortened, and a plurality of insulators are embedded between the transmitting and receiving parts, so that effective electrical isolation is formed between the transmitting and receiving parts, mutual interference is avoided, signal interference attenuation is effectively reduced, and the sensitivity and performance of the radar system are improved; meanwhile, the middle inside the packaging cover body is divided into an upper cavity and a lower cavity through the partition board 10, and the first circuit board 11 and the second circuit board 12 are respectively arranged; and further to this scheme, it makes it can divide regional heat to the T/R cavity 2 and in the encapsulation lid to distribute through the setting of thermal control subassembly, promotes the thermal management efficiency of this radar greatly, avoids after the long-term start-up of radar is in service, and heat accumulates, ensures that the radar keeps stability when the operation to improve the reliability and the continuous performance of radar system, prolonged its life.
Based on the above-mentioned scheme, for the convenience of the skilled person to understand the scheme, a specific structure of the first heat controlling member is described herein, and is shown in fig. 3, the first heat controlling member includes an insulating housing 300 positioned in the partition board 10, a heat conducting box 301 is provided in the insulating housing 300, and a phase change heat absorbing body is filled in the heat conducting box 301. It should be noted that, in this solution, for the first heat control element, the main purpose of the present application is to effectively dissipate heat from the first circuit board 11 and the second circuit board 12 in the package cover 1, and as the circuit board, the processing technology and materials thereof are limited, and when the circuit board dissipates heat, it is necessary to ensure the stability of the temperature field in the area, that is, to avoid the temperature change being too severe, so as to cause the abrupt temperature change, thereby causing deformation and fracture of the circuit board itself and further affecting the normal operation of the circuit board. Furthermore, compared with the traditional heat dissipation mode at present, the phase-change heat dissipation mode has excellent heat dissipation effect, can effectively reduce the heat in the radar system, does not need to additionally arrange a fan circuit and a cooling pipeline, simplifies the whole structure of the radar module, reduces noise interference, and greatly improves the service reliability of the radar. In addition, as for the radar module, in the normal service operation process, the external working condition environment is mostly very bad, not only the influence of high temperature is present, but also the influence of low temperature of the environment is possibly involved at certain moments, so in the scheme, the heat conduction box 301 is adopted to be filled with the phase change heat absorber for absorbing heat, the temperature fluctuation of the whole radar system is small, the heat is absorbed at high temperature, the heat is released in cold, the uniform change of the temperature can be kept in the heat absorption or heat release process, the influence of the local temperature of the radar system is avoided, the influence of the rapid change of the temperature on the radar performance is avoided, the temperature stability of the whole radar module is kept, and the performance and the reliability of the radar system are effectively improved.
Meanwhile, as a preferable embodiment of the heat insulation housing 300, a heat transfer medium is further filled in the heat insulation housing 300, and a plurality of heat transfer columns 302 penetrating to the outside of the partition board 10 are provided at the outside of the heat insulation housing 300, one ends of the plurality of heat transfer columns 302 are respectively contacted with the first circuit board 11 and the second circuit board 12, and the other ends of the plurality of heat transfer columns 302 penetrate into the heat insulation housing 300. Based on the above structure, when the first thermal control member absorbs heat accumulated in the package cover 1 during the operation of the first circuit board 11 and the second circuit board 12, the heat transfer column 302 can conduct the heat into the heat insulation housing 300, then the heat is conducted into the heat conduction box 301 through the heat conduction medium in the heat insulation housing 300, and the heat is absorbed through the phase change heat absorber in the heat conduction box 301, and here, it needs to be further explained that the heat on the first circuit board 11 and the second circuit board 12 can be quickly conducted through the mutual matching of the heat transfer column 302 and the heat conduction medium, and then the heat is absorbed through the heat conduction box 301 and the phase change heat absorber. Specifically, the heat conduction medium and the heat transfer column 302 have good heat conductivity, so that heat of the first circuit board 11 and the second circuit board 12 can be conducted rapidly, and meanwhile, the heat of the first circuit board 11 and the second circuit board 12 can be isolated to a certain extent through the heat insulation shell 300 in the partition board 10, so that the influence of mutual heat conduction of the heat conduction medium and the heat conduction column on the final heat dissipation effect is avoided.
Based on the above, to ensure that the heat in the T/R cavity 2 is effectively controlled and managed, the overall reliability of the radar system is further improved, herein, referring to fig. 4 to 5, the specific second heat control element includes a heat conducting silica gel pad 310 (on which holes adapted to the rf ball 212 are formed so as to be installed by the rf ball 212) correspondingly disposed between the first sub-board 210 and the second sub-board 211, a grid-shaped capillary liquid cooling tube 311 is further disposed inside the heat conducting silica gel pad 310 in a staggered manner, a liquid storage part 312 communicating with one end of the capillary liquid cooling tube 311 in the heat conducting silica gel pad 310 is disposed at one side of the inside of the plurality of accommodating cavities, a plurality of L-shaped cooling fins 313 are correspondingly embedded on two side walls overlapping each other in the accommodating cavities, a cross-shaped ventilation channel 314 is formed between the cooling fins 313, and four ends of the ventilation channel 314 extend through to the outside of the T/R cavity 2.
The heat-conducting silica gel pad 310 is arranged between the first sub-board 210 and the second sub-board 211 through the structural design, so that the gap between the first sub-board 210 and the second sub-board 211 can be effectively filled, the installation and assembly stability of the heat-conducting silica gel pad is ensured, the capillary liquid cooling pipes 311 which are in grid shapes are arranged in the silica gel pad in a staggered way, one ends of the capillary liquid cooling pipes 311 are communicated with the liquid storage piece 312, the cooling medium can flow in the capillary liquid cooling pipes 311 to absorb heat generated when the first sub-board 210 and the second sub-board 211 work, heat accumulation is avoided, a heat shielding layer is formed between the first sub-board 210 and the second sub-board 211, the heat between the first sub-board 210 and the second sub-board 211 is prevented from being influenced mutually, the working temperature of the first sub-board and the second sub-board is too high, and through the arrangement of the cooling fin 313, when the cooling medium in the capillary liquid cooling tube 311 flows to the other end of the cooling medium, heat is conducted to the cooling fins 313, and heat exchange is performed through the ventilation flow channels 314 formed between the cooling fins 313, so that the heat in the T/R cavity 2 is dissipated to the outside, and the L-shaped design of the cooling fins 313 and the structure of the cross ventilation flow channels 314 are helpful to increase the surface area of the cooling fins, improve the heat dissipation efficiency, ensure uniform heat distribution between the cooling fins 313, effectively avoid local overheating phenomenon, further ensure the stable operation of the whole system, and simultaneously regulate and control the flow of the cooling medium through the arrangement of the liquid storage piece 312, ensure that the cooling liquid in the capillary liquid cooling tube 311 is always kept to circulate in a proper temperature range, thereby maintaining the temperature stability of the system.
To further enhance the thermal management level of the second thermal control element in the T/R cavity 2, the solution specifically improves the liquid storage element 312, as shown in fig. 6, so as to accelerate the flow of the liquid cooling medium in the capillary liquid cooling tube 311, so as to improve the heat dissipation performance of the liquid storage element 312, specifically, the liquid storage element 312 includes: the outer cylinder 3120 and the elastic liquid storage bag 3121, wherein the outer cylinder 3120 is made of copper foil and has a hollow interior, the elastic liquid storage bag 3121 is arranged in the outer cylinder 3120, an annular cavity is formed between the elastic liquid storage bag 3121 and the outer cylinder 3120, the annular cavity is filled with thermal expansion gas, the elastic liquid storage bag 3121 is stored with cooling medium, and one side of the elastic liquid storage bag 3121 is communicated with the end part of the capillary liquid cooling pipe 311 through a connecting joint. Based on the above structure, when the temperature in the T/R cavity 2 is gradually increased, the copper foil thereof has excellent thermal conductivity, so that the temperature in the inner portion thereof is rapidly increased, thereby causing the outer cylinder 3120 to deform, and when the outer cylinder 3120 is thermally deformed, the thermal expansion gas therein is also affected, such that the molecular distance of the gas thereof is increased, the pressure is increased, thereby generating expansion and pressure inward, so as to cause deformation of the elastic liquid storage 3121 after the extrusion force is applied, and further generate extrusion driving force for the cooling medium stored therein, so as to push the cooling medium in the elastic liquid storage 3121 to flow into the capillary liquid cooling tube 311, thereby further enhancing the flow in the cooling medium sub-capillary liquid cooling tube 311, further enhancing the heat dissipation efficiency thereof, thereby synchronously enhancing the heat dissipation efficiency of the second thermal control element to the T/R cavity 2, and improving the radar thermal management efficiency.
Preferably, a chamfer angle part is arranged at the buckling position of the bottom of the T/R cavity 2 and the packaging cover body, and the chamfer angle part and the packaging cover body are welded through tin sealing. By providing the bottom of the T/R cavity 2 with a beveled portion, the purpose is to facilitate the rapid assembly by the assembly personnel.
Preferably, the bottom of the second sub-board 211 is connected to the first circuit board 11 through a control connector, and the bottom of the second circuit board 12 is provided with a control connector 4 penetrating to the outside of the lower housing, and it should be noted that, through the above design, the radar module can be easily connected to an external device or an interface, thereby greatly improving the operability thereof.
Embodiment two;
This embodiment is based on example 1, and a preferred embodiment is presented for a part of its solutions, so only the differences from example 1 will be described here; it should be noted that, in this embodiment, the phase-change heat absorber added in the heat-conducting box 301 is preferably a composite phase-change material made of an inorganic phase-change material (i.e. crystalline hydrated salt, molten salt, metal, etc.) and other high heat-conducting materials (such as graphite, etc.), which is a continuous process when performing phase-change heat absorption, that is, the initial state is solid particles, and when performing heat absorption, the phase-change heat absorber gradually changes from solid to liquid, and because the phase-change heat absorber is filled in the heat-conducting box 301, the position distance between the phase-change heat absorber and the heat-conducting box 301 is different, the phase-change rate is different when performing heat absorption, and then the phase-change heat absorber near the inner wall of the heat-conducting box 301 gradually changes to liquid, and slowly permeates into the phase-change material still in solid state in the middle area, so that the phase-change material located in the liquid-solid state is gradually changed into hollow layering under the influence of gravity, thereby affecting the heat absorption rate of the heat-conducting box 301.
In view of the above-described problems, the structure of the heat conduction box 301 is specifically improved here, as shown in fig. 7 to 8, that is: a plurality of heat conduction fins 3010 are staggered on the outer wall of the heat conduction box 301, and one end of each of the plurality of heat conduction fins 3010 penetrates into the heat conduction box 301 and is inserted into the phase change heat absorber. With the above structural design, the contact area between the heat conducting box 301 and the heat conducting medium is increased, so that the heat conducting medium can conduct heat to the heat conducting box 301 quickly, and conduct heat to the phase change heat absorber inside the heat conducting box quickly through the heat conducting fins 3010, and further the area of the phase change heat absorber close to the inner wall of the heat conducting box 301 and the middle area inside the phase change heat absorber can be heated timely, and the heat absorption rate of the phase change heat absorber is guaranteed to be consistent to a certain extent.
Embodiment three;
In this embodiment, based on example 1, a preferred embodiment is provided for a part of the solution, so only the difference from example 1 is described, and it should be noted that, in this embodiment, in order to achieve the coordinated heat dissipation effect of the first heat control element and the second heat control element, that is, to further enhance the overall heat management performance of the radar module, as shown in fig. 9, it is further preferred that a communication pipe 5 is provided between the heat insulation housing 300 and the outer cylinder 3120 of the liquid storage element 312, and one end of the communication pipe 5 penetrates into the heat insulation housing 300 and is provided with an expansion balloon 6, so that when the thermal expansion gas in the outer cylinder 3120 expands at a high temperature, the molecular distance between the gases increases, and when the pressure increases, a part of the gases can enter into the expansion balloon 6 in the heat insulation housing 300 through the communication pipe 5, and then squeeze the heat conduction medium in the heat insulation housing 6, thereby promoting the flow of the heat conduction medium in the heat insulation housing 300, and further promoting the heat conduction performance of the heat conduction medium to the heat conduction housing 11 and the second circuit board 12 to be uniformly conducted into the heat insulation housing 301, thereby improving the heat dissipation performance of the radar module.
It should be noted that, the phased array radar module in the scheme fully considers key factors such as integration level, modularization and thermal management in design, and the overall performance and stability of the system are greatly improved by optimizing structural layout and improving related structures, and meanwhile, the practicability and service reliability of the phased array radar module are further improved.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. The utility model provides a phased array radar module, includes encapsulation lid (1) and lock joint at T/R cavity (2) on encapsulation lid (1) upper portion, its characterized in that: a plurality of accommodating cavities distributed in a rectangular array are formed in the bottom of the T/R cavity (2), a PCB control plate (21) is arranged in any accommodating cavity, an antenna array surface (20) is further arranged at the top of the T/R cavity (2) and corresponds to the position of the PCB control plate (21), a plurality of insulators are embedded in the top of the T/R cavity (2), and the top and the bottom of the insulators are respectively connected with the antenna array surface (20) and the PCB control plate (21);
The PCB control board (21) comprises a first sub board (210) and a second sub board (211) which are stacked, a gap exists between the first sub board (210) and the second sub board (211), the first sub board and the second sub board are connected through gold wire bonding, and a plurality of radio frequency implanting balls (212) are further arranged in the gap; the middle of the inside of the packaging cover body (1) is divided into an upper cavity and a lower cavity by a partition plate (10), a first circuit board (11) and a second circuit board (12) are correspondingly arranged in the two cavities, and the first circuit board (11) and the second circuit board (12) are electrically connected;
A heat control assembly is further arranged in the packaging cover body (1) and the T/R cavity (2), the heat control assembly comprises a first heat control piece positioned in the packaging cover body (1) and a second heat control piece positioned in the T/R cavity (2), and heat accumulated in the packaging cover body (1) and the T/R cavity (2) is conducted and radiated through the first heat control piece and the second heat control piece respectively;
The first heat control piece comprises a heat insulation shell (300) positioned in the partition board (10), a heat conduction box (301) is arranged in the heat insulation shell (300), a phase change heat absorber is filled in the heat conduction box (301), a heat conduction medium is also filled in the heat insulation shell (300), a plurality of heat transfer columns (302) penetrating through the outside of the partition board (10) are arranged outside the heat insulation shell (300), one ends of the plurality of heat transfer columns (302) are respectively contacted with the first circuit board (11) and the second circuit board (12), and the other ends of the plurality of heat transfer columns (302) penetrate into the heat insulation shell (300);
The second heat control piece is including corresponding heat conduction silica gel pad (310) that sets up between first subplate (210) and second subplate (211), still crisscross being equipped with in the inside of heat conduction silica gel pad (310) is equipped with capillary liquid cold tube (311) that are latticed, and a plurality of hold the liquid storage piece (312) that one end that the intraductal capillary liquid cold tube (311) of chamber is linked together still is equipped with heat conduction silica gel pad (310), a plurality of hold still correspond on the mutual coincident both sides wall of chamber and inlay and be fin (313) of L shape, and a plurality of form ventilation runner (314) of cross form between fin (313), and the outside of ventilation runner (314) all runs through to T/R cavity (2).
2. A phased array radar module as claimed in claim 1, wherein: the reservoir (312) includes: the outer cylinder body (3120) and elasticity reservoir (3121), outer cylinder body (3120) are made by the copper foil, and its inside cavity, elasticity reservoir (3121) set up in the inside of outer cylinder body (3120) to form annular cavity between elasticity reservoir (3121) and outer cylinder body (3120), the intussuseption of annular cavity is filled with thermal expansion gas, cooling medium has been stored in elasticity reservoir (3121), and its one side is linked together with the tip of capillary liquid cooling tube (311) through the attach fitting.
3. A phased array radar module as claimed in claim 1, wherein: the bottom of the T/R cavity (2) is provided with a bevel part at the buckling position of the packaging cover body, and the bevel part and the packaging cover body are welded through tin sealing.
4. A phased array radar module as claimed in claim 1, wherein: the bottom of the second sub board (211) is connected with the first circuit board (11) through a control connector, and the bottom of the second circuit board (12) is provided with a control joint (4) penetrating to the outside of the lower shell.
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