CN117913487A

CN117913487A - Radio frequency device and assembly thereof

Info

Publication number: CN117913487A
Application number: CN202311851591.9A
Authority: CN
Inventors: 扎里·塔斯基拉; 蒂莫西·伯恩哈特; 威廉·威尔伯
Original assignee: Anfersch Technology Co
Current assignee: Anfersch Technology Co
Priority date: 2018-08-07
Filing date: 2018-08-07
Publication date: 2024-04-19
Also published as: CN112544011A; WO2020030250A1

Abstract

The invention relates to a device comprising: a conductive enclosure comprising a conductive enclosure wall at least partially enclosing a cavity; a printed circuit board adjacent to the conductive housing wall forming a cavity cover directly adjacent to the cavity; and a stress relief feature at an interface between the conductive enclosure wall and the printed circuit board, wherein at least a combination of the conductive enclosure wall and the printed circuit board creates a cavity of the resonant cavity filter.

Description

Radio frequency device and assembly thereof

The application relates to a split application of Chinese patent application with the application date of 2018, 08, 07, the application number of 201880096425.3 and the name of radio frequency device and components thereof.

Technical Field

Embodiments of the present disclosure relate to radio frequency devices and components thereof. In particular, at least some embodiments relate to higher integration within radio frequency devices such as base stations.

Background

It is desirable to achieve higher integration within radio frequency devices, particularly base stations, thereby reducing the need for screws, coaxial connectors, jumper cables, and the like.

It is desirable to find other methods for saving space and reducing the size of the assembly.

Disclosure of Invention

According to various, but not necessarily all, embodiments there is provided an apparatus comprising:

A conductive enclosure comprising a conductive enclosure wall at least partially enclosing a cavity;

a printed circuit board adjacent to the conductive housing wall forming a cavity cover directly adjacent to the cavity; and

Stress relief features at the interface between the conductive housing wall and the printed circuit board,

Wherein at least the combination of the conductive housing wall and the printed circuit board creates a cavity of the resonant cavity filter.

In at least some examples, the stress relief feature is configured to deform to absorb stress.

In at least some examples, the stress relief features are distinct and have a spatial separation.

In at least some examples, the stress relief features provide respective connection paths between the printed circuit board and the conductive enclosure wall and allow for relative movement of the connection paths.

In at least some examples, the stress relief feature has a repeating pattern.

In at least some examples, the stress relief features are defined by apertures in a substrate of a printed circuit board.

In at least some examples, some or all of the apertures are through apertures extending through the substrate, and/or some or all of the apertures are recesses that do not extend through the substrate.

In at least some examples, the apertures comprise external apertures that individually terminate at a point on the perimeter of the printed circuit board, and/or wherein the apertures comprise internal apertures that do not terminate at the perimeter of the printed circuit board.

In at least some examples, the inner and outer apertures have different sizes.

In at least some examples, the inner and outer apertures have different repeating patterns.

In at least some examples, the external aperture is slotted.

In at least some examples, the external aperture is a straight open slot having parallel sides that are greater than three times the distance between the parallel sides in length.

In at least some examples, the straight open slot is perpendicular to an edge at a perimeter of the printed circuit board.

In at least some examples, the straight open groove is present at all edges of the perimeter.

In at least some examples, the apertures include a plurality of parallel first external apertures at a first edge of the perimeter of the printed circuit board and a plurality of parallel third external apertures at a third edge of the perimeter of the printed circuit board, wherein the first edge is opposite the third edge, and wherein each first external aperture is opposite a respective third external aperture, each third external aperture is opposite a respective first external aperture.

In at least some examples, the apertures include regularly spaced internal apertures that extend to overlap the external apertures near the perimeter of the printed circuit board.

In at least some examples, the apertures include an outer aperture that individually terminates at a point on the perimeter of the printed circuit board and an inner aperture that does not terminate at the perimeter of the printed circuit board, wherein the inner and outer apertures are open-ended slots of different lengths.

In at least some examples, the apertures include a plurality of parallel first external apertures individually terminated at a first edge of the perimeter of the printed circuit board and a plurality of parallel third external apertures individually terminated at a third edge of the perimeter of the printed circuit board, wherein the first edge is opposite the third edge, each first external aperture is opposite a respective third external aperture, and each third external aperture is opposite a respective first external aperture; and

Including one or more second external apertures individually terminating at a second edge of the perimeter of the printed circuit board and one or more fourth external apertures individually terminating at a fourth edge of the perimeter of the printed circuit board, wherein the second edge is opposite the fourth edge, each of the one or more second external apertures is opposite and parallel to a respective fourth external aperture, and each of the one or more fourth external apertures is opposite and parallel to a respective second external aperture.

In at least some examples, the internal aperture is a straight open slot having parallel sides that are greater than five times the distance between the parallel sides in length.

In at least some examples, the apertures include an outer aperture that individually terminates at a point on the perimeter of the printed circuit board and an inner aperture that does not terminate at the perimeter of the printed circuit board, wherein the inner and outer apertures have different shapes.

In at least some examples, the apertures include a plurality of parallel first external apertures individually terminated at a first edge of the perimeter of the printed circuit board and a plurality of parallel third external apertures individually terminated at a third edge of the perimeter of the printed circuit board, wherein the first edge is opposite the third edge, each first external aperture is opposite and parallel to a respective third external aperture, and each third external aperture is opposite and parallel to a respective first external aperture; and

Comprising a plurality of second external apertures individually terminated at a second edge of the perimeter of the printed circuit board and a plurality of fourth external apertures individually terminated at a fourth edge of the perimeter of the printed circuit board,

Wherein the second edge is opposite to the fourth edge,

Wherein each second external aperture is opposite and parallel to a respective fourth external aperture, and each fourth external aperture is opposite and parallel to a respective second external aperture,

Wherein the spacing between the first and third external apertures is the same as the spacing between the second and fourth external apertures.

In at least some examples, the aperture comprises an internal aperture that does not terminate at the perimeter of the printed circuit board, wherein the internal aperture is a crossover formed by two crossover straight slots having parallel sides.

In at least some examples, the apertures include internal apertures that do not terminate at the perimeter of the printed circuit board, wherein the internal apertures are square intersections.

In at least some examples, the stress relief feature comprises a stress relief unit between the enclosure wall and the printed circuit board.

In at least some examples, the stress relief unit includes a plurality of respective support pins.

In at least some examples, the stress relief unit is electrically conductive.

In at least some examples, the stress relief unit directly connects the enclosure wall and the perimeter of the printed circuit board.

In at least some examples, the stress relief unit extends around the entire perimeter of the printed circuit board.

In at least some examples, the stress relief unit is a comb structure.

A conductive housing wall at least partially enclosing a cavity;

A stress relief feature positioned where the conductive enclosure wall attaches to the printed circuit board, wherein a combination of the conductive enclosure wall, the stress relief feature, and the attached printed circuit board creates a closed resonant cavity for the resonant cavity filter.

In at least some examples, the stress relief feature includes a stress relief unit for attaching the housing wall to the printed circuit board.

According to various, but not necessarily all, embodiments there is provided a printed circuit board for use in a resonant cavity filter comprising:

At least one conductive substrate;

At least one user-tunable device for tuning a resonant cavity filter, the device being formed by attaching a printed circuit board to a conductive housing wall that at least partially encloses a cavity, thereby creating an enclosed resonant cavity for the resonant cavity filter, wherein the at least one user-tunable device is configured to be changed by a user to tune the resonant cavity filter.

In at least some examples, the PCB includes stress relief features defined by apertures in a substrate of the printed circuit board.

According to various, but not necessarily all, embodiments there is provided a frequency selective radio frequency device comprising:

A conductive assembly;

A printed circuit board adjacent to the conductive assembly; and

Stress relief features at the interface between the conductive assembly and the printed circuit board,

Wherein at least the combination of the conductive component and the printed circuit board creates a conductive portion of the frequency selective radio frequency device.

In at least some examples, the frequency selective radio frequency component is a cavity filter or antenna.

According to various, but not necessarily all, embodiments there is provided a conductive assembly of a frequency selective radio frequency device comprising:

A conductive stress relief unit interface positioned where the conductive assembly is attached to the printed circuit board,

Wherein the combination of the conductive stress relief unit, the conductive assembly and the attached printed circuit board creates a conductive portion of the frequency selective radio frequency device.

According to various, but not necessarily all, embodiments there is provided a printed circuit board for use in a frequency selective radio frequency device comprising:

At least one conductive substrate;

At least one user-tunable arrangement for tuning a frequency selective radio frequency arrangement, the arrangement being formed by attaching a printed circuit board to a conductive component of the frequency selective radio frequency arrangement, thereby forming a conductive portion of the frequency selective radio frequency arrangement, wherein the at least one user-tunable device is configured to be varied by a user to control an electrical impedance associated with the conductive portion.

According to various, but not necessarily all, embodiments, examples are provided as claimed in the appended claims.

Drawings

Some exemplary embodiments will now be described with reference to the accompanying drawings, in which:

FIG. 1 illustrates one exemplary embodiment of the subject matter described herein;

FIG. 2 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 3 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 4 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 5 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 6 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 7 illustrates another exemplary embodiment of the subject matter described herein;

FIG. 8 illustrates another exemplary embodiment of the subject matter described herein;

fig. 9 illustrates another exemplary embodiment of the subject matter described herein.

Detailed Description

Fig. 1 shows an example of an apparatus 100. The device 100 is a frequency selective radio frequency device 100. The device is frequency selective in that it is configured to operate at certain frequencies and not at other frequencies. For example, it may have bandpass characteristics at one or more frequency ranges.

The device 100 may be, for example, a filter such as a resonant cavity filter or an antenna. A resonant cavity filter is a filter having one or more resonant cavities. In some, but not necessarily all, examples, the cavity of the resonant cavity filter may include a resonator. Examples of resonators include metal resonators and dielectric resonators.

The apparatus 100 includes a Printed Circuit Board (PCB) 10, a conductive structure 20; the stress relief feature 30 at the interface between the conductive assembly 20 and the printed circuit board 10. At least the combination of the conductive assembly 20 and the printed circuit board 10 creates a conductive portion of the frequency selective radio frequency device 100.

In the example shown in fig. 1, the frequency selective radio frequency device 100 is a resonant cavity filter. The conductive structure 20 is a conductive enclosure 20 having a conductive enclosure wall 22 at least partially defining a cavity 24.

A Printed Circuit Board (PCB) 10 provides point-to-point connections in a predetermined arrangement on a common substrate. In some, but not necessarily all, examples, the PCB 10 is designed to have an impact on circuit operation and not just a point-to-point connection. In some, but not necessarily all examples, the PCB 10 includes active and/or passive components. These components may be embedded in the PCB 10, for example, by printing, or mounted on the PCB 10, for example, by soldering. The PCB 10 with active and/or passive components may be referred to as a printed circuit board assembly. The PCB 10 mechanically supports and electrically connects the various components.

In some, but not necessarily all, examples, the substrate 12 of the PCB 10 includes an electrically isolated conductive sheet. The sheet may be formed from a metal foil such as copper. Conductive tracks, pads and other features are etched from or onto the sheet. The multi-layer PCB 10 includes individual electrically isolated conductive sheets, and features of one sheet may be interconnected to features of another sheet.

Thus, the substrate 12 provides both electrical connection and mechanical support. The substrate may comprise, for example, a glass reinforced epoxy laminate, such as FR4, and one or more conductive layers, for example copper layers.

In some, but not necessarily all, examples, the PCB 10 includes components of a radio transceiver, such as receiver circuitry and/or transmitter circuitry and/or active antenna circuitry and/or measurement circuitry for measuring transceiver performance.

In the example shown, the printed circuit board 10 is configured for use in a resonant cavity filter 100 and includes one or more user-tunable devices 14 for tuning the resonant cavity filter 100.

The resonant cavity filter 100 is formed by attaching the printed circuit board 10 to the conductive housing wall 22 of the housing 20.

The conductive enclosure walls 22 partially enclose the cavity 24 when the PCB 10 is not attached and enclose the cavity 24 when the PCB 10 is attached. The closed cavity 24 is a void filled with a dielectric (e.g., air) and forms a resonant cavity for the resonant cavity filter 100. The PCB 10 forms a cover for the cavity 24.

The one or more user-tunable devices 14 are configured to be changed by a user to tune the resonant cavity filter 100. In some, but not necessarily all, examples, the user-tunable device 14 is a conductive element that extends into the resonant cavity 24 in a variable number. In some, but not necessarily all, examples, the user-tunable device 14 is a tuning screw that is rotated in a first direction to move into the resonant cavity 24 and rotated in a second, opposite direction to move out of the resonant cavity 24. The PCB 10 forms a tuning cover for the cavity 24.

The housing 20 is electrically conductive. Which forms a conductive package with the attached PCB 10 for the resonant cavity 24. In some, but not necessarily all examples, the electrical conductivity of the housing 20 is obtained by using a metal (e.g., aluminum). In some, but not necessarily all, examples, the housing 20 is formed from metal, such as by milling or casting.

The attachment between the PCB 10 and the wall 22 of the housing 20 may be formed by any suitable means, such as using solder or screws.

In some, but not necessarily all examples, the PCB 10 is attached only to the top of the outer side wall 22 of the housing 20. The outer housing wall 22 defines the outer side of the housing 20.

In some, but not necessarily all, examples, the enclosure 20 includes an outer enclosure wall 22 defining an outer side of the enclosure 20, and an inner enclosure wall extending from the outer cavity wall 22 to define a size and shape of the resonant cavity 24. In some, but not necessarily all examples, the PCB 10 is attached to the top of one or more outside enclosure walls and/or one or more inside enclosure walls.

The PCB 10 is attached and supported at the perimeter 16 of the PCB 10 such that the PCB 10 is directly adjacent the resonant cavity 24. The resonant cavity filter 100 is a single component with the integrated printed circuit board 10 and housing 20. The PCB 10 completely replaces the solid metal cover used to close the resonant cavity in the current commercially available resonant cavity filters.

Fig. 1 shows an example of an apparatus 100 comprising: a conductive enclosure 20 including a conductive enclosure wall 22 at least partially enclosing a cavity 24; the printed circuit board 10 adjacent the conductive enclosure wall 22 forms a cover for the cavity 24 immediately adjacent the cavity 24; and a stress relief feature 30 at an interface between the conductive enclosure wall 22 and the printed circuit board 10, wherein at least a combination of the conductive enclosure wall 24 and the printed circuit board 10 creates a resonant cavity 24 of the resonant cavity filter 100.

Examples of stress relief features 30 are shown in fig. 2 through 8.

The stress relief feature 30 modifies the interface between the printed circuit board 10 and the housing 20. The stress relief feature 30 allows different components, such as the housing 20 and the PCB 10, to expand/contract at different rates without exceeding the stress generated.

In some, but not necessarily all, examples, the stress relief features 30 are configured to deform to absorb stress and prevent stress propagation.

In the example shown later, the stress relief features 30 are individual and have a spatial separation.

In the example shown later, the stress relief feature 30 provides a respective connection path between the printed circuit board 10 and the conductive enclosure wall 22 and allows for relative movement of the connection paths. In some, but not necessarily all, examples, the stress relief feature 30 is a conductive and respective connection path that provides a respective electrical connection path.

The combination of the conductive enclosure walls 24, the conductive substrate 12 of the printed circuit board 10, and the conductive stress relief features 30 creates a conductive package for the resonant cavity 24 of the resonant cavity filter 100.

In the example shown, the stress relief features 30 have a regular repeating pattern. The pattern of stress relief features has reflective symmetry in a virtual x-axis and reflective symmetry in a virtual y-axis orthogonal to the x-axis.

Pore diameter

In the example shown in fig. 2,3, 4, and 8, the stress relief feature 30 is defined by an aperture 32 in the substrate 12 of the printed circuit board 10.

In the example shown, aperture 32 is a through aperture that extends from one outer surface of PCB 10 through substrate 12 to the other outer surface of PCB 10. In other examples, some, all, or none of apertures 32 are recesses that do not extend entirely through substrate 12. The recess may for example have a U-shaped profile, but other profile shapes are also possible. Where aperture 32 is a recess, the recess may be on one outer surface of PCB 10, or may be on two opposing outer surfaces of PCB 10, for example.

In some, but not necessarily all, examples, the stress relief feature 30 defined by the through aperture 32 has a through aperture for stress relief purposes and is not used for the purpose of providing a conductive via or securing the printed circuit board 10. In some, but not necessarily all examples, the stress relief feature 30 defined by the through aperture 32 has a through aperture that is used only for stress relief purposes, and is otherwise redundant.

In the example shown, at least some of apertures 32 are or include slots.

In the examples shown in fig. 2,3,4 and 8, but not necessarily all examples, apertures 32 include outer apertures 32 _E that individually terminate at a point on perimeter 16 of printed circuit board 10, and inner apertures 32 _I that do not terminate at perimeter 16 of printed circuit board 10. Inner aperture 32 _I and outer aperture 32 _E have different sizes (e.g., different lengths or different shapes). In addition, inner aperture 32 _I and outer aperture 32 _E have different repeating patterns. Each of the repeating patterns has reflective symmetry in the x-axis and the y-axis. In these examples, but not necessarily all, the internal apertures 32 _I are of the same size. In other examples, aperture 32 may include only outer aperture 32 _E or only inner aperture 32 _I.

In the examples shown in fig. 2, 3, 4 and 8, but not necessarily all examples, the outer aperture 32 _E is slotted. The outer aperture 32 _E is an elongated straight slot with parallel sides. The length of the parallel sides is greater than three times the distance between the parallel sides. The straight open slot is perpendicular to the edge at the perimeter 16 of the printed circuit board 10.

In these examples, but not necessarily all examples, the straight open slots 32 _E are present at all edges of the perimeter 16 of the PCB 10.

In these examples, but not necessarily all examples, there are a plurality of parallel first external apertures 32 _E at the first edge 18 ₁ of the perimeter 16 of the printed circuit board 10, and a plurality of parallel third external apertures 32 _E at the third edge 18 ₃ of the perimeter 16 of the printed circuit board 10. The first edge 18 ₁ is opposite the third edge 18 ₃. Each first outer aperture 32 _E is opposite and aligned with a corresponding third outer aperture 32 _E. Each third external aperture 32 _E is opposite and aligned with a corresponding first external aperture 32 _E.

In these examples, the spacing between the first external apertures 32 _E is regular and the same as the regular spacing between the third external apertures 32 _E.

In these examples, but not necessarily all, the internal apertures 32 _I are regularly spaced. In this example, the extension of the inner aperture 32 _I partially overlaps the outer aperture 32 _E near the perimeter 16 of the printed circuit board 10.

Internal grooving

In the examples shown in fig. 2, 3 and 8, but not necessarily all examples, apertures 32 include outer apertures 32 _E that individually terminate at a point on perimeter 16 of printed circuit board 10, and inner apertures 32 _I that do not terminate at perimeter 16 of printed circuit board 10. Inner aperture 32 _I and outer aperture 32 _E are straight slots having different lengths.

In these examples, apertures 32 include a plurality of parallel first external apertures 32 _E that individually terminate at first edge 18 ₁ of perimeter 16 of printed circuit board 10, and a plurality of parallel third external apertures 32 _E that individually terminate at third edge 18 ₃ of perimeter 16 of printed circuit board 10. The first edge 18 ₁ is opposite and parallel to the third edge 18 ₃. Each first external aperture 32 _E is opposite, parallel and aligned with a corresponding third external aperture 32 _E, and each third external aperture 32 _E is opposite, parallel and aligned with a corresponding first external aperture 32 _E.

Aperture 32 also includes one or more second external apertures 32 _E that individually terminate at second edge 18 ₂ of perimeter 16 of printed circuit board 10, and one or more fourth external apertures 32 _E that individually terminate at fourth edge 18 ₄ of perimeter 16 of printed circuit board 10. The second edge 18 ₂ is opposite and parallel to the fourth edge 18 ₄. Each of the one or more second external apertures 32 _E is opposite, parallel, and aligned with a corresponding fourth external aperture 32 _E, and each of the one or more fourth external apertures 32 _E is opposite, parallel, and aligned with a corresponding second external aperture 32 _E.

The internal aperture 32 _I is a straight open slot with parallel sides. In these examples, but not necessarily all examples, the length of the parallel sides is greater than five times the distance between the parallel sides. In these examples, the straight open slot 32 is perpendicular to the first edge 18 ₁ and the third edge 18 ₃, or parallel to the second edge 18 ₂ and the fourth edge 18 ₄. Those straight slots that are internal apertures 32 _I are perpendicular to the edge that they terminate at.

The first outer aperture 32 _E and the third outer aperture 32 _E are parallel and regularly spaced shorter slots. The internal apertures 32 _I are parallel and regularly spaced longer slots. The spacing between the first outer aperture 32 _E (shorter slot), the third outer aperture 32 _E (shorter slot), and the inner aperture 32 _I (longer slot) is the same and in the same direction. The inner aperture 32 _I (longer slot) is parallel to and partially overlaps the first outer aperture 32 _E (shorter slot) and the third outer aperture 32 _E (shorter slot). The first outer aperture 32 _E (shorter slots) and the third outer aperture 32 _E (shorter slots) are aligned and alternate with the inner aperture 32 _I (longer slots). The longer slots are not positioned at the midpoint between the shorter slots.

Internal crossover

In the example shown in fig. 4, but not necessarily all examples, apertures 32 include outer apertures 32 _E that individually terminate at a point on perimeter 16 of printed circuit board 10, and inner apertures 32 _I that do not terminate at perimeter 16 of printed circuit board 10. Inner aperture 32 _I and outer aperture 32 _E have different shapes.

In this example, apertures 32 include a plurality of parallel first external apertures 32 _E individually terminating at first edge 18 ₁ of perimeter 16 of printed circuit board 10, and a plurality of parallel third external apertures 32 _E individually terminating at third edge 18 ₃ of perimeter 16 of printed circuit board 10. The first edge 18 ₁ is opposite and parallel to the third edge 18 ₃. Each first external aperture 32 _E is opposite, parallel and aligned with a corresponding third external aperture 32 _E, and each third external aperture 32 _E is opposite, parallel and aligned with a corresponding first external aperture 32 _E. Aperture 32 also includes a plurality of second external apertures 32 _E that individually terminate at second edge 18 ₂ of perimeter 16 of printed circuit board 10, and a plurality of fourth external apertures 32 _E that individually terminate at fourth edge 18 ₄ of perimeter 16 of printed circuit board 10. The second edge 18 ₂ is opposite and parallel to the fourth edge 18 ₄, each second external aperture 32 _E is opposite, parallel and aligned with a respective fourth external aperture 32 _E, and each fourth external aperture 32 _E is opposite, parallel and aligned with a respective second external aperture 32 _E.

In this example, the spacing between the first and third external apertures 32 _E is the same as the spacing between the second and fourth external apertures 32 _E.

The internal aperture 32 _I is a crossover formed by two crossover straight slots with parallel sides. The length of the parallel sides is greater than twice the distance between the parallel sides.

In this example, but not necessarily all examples, the dimensions of the internal aperture 32 _I are the same, and in this example, the internal aperture 32 _I has the same orientation.

In this example, but not necessarily in all examples, the internal apertures 32 _I are square intersections. The square cross has vertical arms of equal length. In this example, but not necessarily all examples, one arm of each square intersection is parallel to the first edge 18 ₁ and the third edge 18 ₃, and the other arm is parallel to the second edge 18 ₂ and the fourth edge 18 ₄.

The first outer aperture 32 _E and the third outer aperture 32 _E are parallel and regularly spaced shorter slots. The second outer aperture 32 _E and the fourth outer aperture 32 _E are parallel and regularly spaced shorter slots. Internal apertures 32 _I are regularly spaced intersections. The spacing between the first outer aperture 32 _E (shorter slot), the second outer aperture 32 _E (shorter slot), the third outer aperture 32 _E (shorter slot), the fourth outer aperture 32 _E (shorter slot) and the inner aperture 32 _E (cross) is the same. The inner aperture 32 _I (crossover) partially overlaps the outer aperture 32 (shorter slot). The first outer aperture 32 _E (shorter slot) and the third outer aperture 32 _E (shorter slot) are aligned and alternate (intersect) with the inner aperture 32 _I. The second outer aperture 32 _E (shorter slot) and the fourth outer aperture 32 _E (shorter slot) are aligned and alternate (intersect) with the inner aperture 32 _I. The intersection is positioned at the midpoint between the shorter slots.

In the example shown, but not necessarily all, the external apertures 32 _E are arranged in a pattern having rotational symmetry.

In the example shown, but not necessarily all, the internal apertures 32 _I are arranged in a pattern having rotational symmetry.

In the example shown, but not necessarily all examples, the shape of the internal aperture 32 _I has rotational symmetry.

Stress relief unit

In the examples shown in fig. 5, 6, 7 and 8, but not necessarily all examples, the stress relief feature 30 includes a stress relief unit 50 between the housing wall 22 and the printed circuit board 10. This may be described as a stress relief coupling or a stress relief coupling unit because it physically couples the housing wall 22 and the printed circuit board 10. In some, but not necessarily all, examples, the stress relief units are conductive.

In some, but not necessarily all examples, the stress relief unit 50 connects the enclosure wall 22 and the perimeter 16 of the printed circuit board 10. In some examples, the stress relief unit 50 may extend around the entire perimeter 16 of the printed circuit board 10.

The stress relief unit 50 directly connects the housing wall and the perimeter 16 of the printed circuit board 10. There is no intermediate layer between the stress relief unit 50 and the perimeter 16 of the printed circuit board 10, except for materials (such as adhesives or solders) that may be used to bond the stress relief unit 50 and the perimeter 16.

In the example shown in fig. 5, 6 and 7, the stress relief unit 50 comprises a plurality of respective support pins 52. The pins are individually in that each pin is independent and separate from adjacent pins so that each pin can move independently of the other pins. The pin height and width may be varied to achieve the desired stress relief effect.

In the example of fig. 7, the stress relief unit 50 is a comb-like structure. It includes a continuous portion from which the parallel pins 52 extend. The continuous portion is attached to the housing wall 22. The stress relief unit 50 forms an interface tape that is attached to the housing wall prior to assembly with the PCB 10. After assembly, the interface tape is positioned at the perimeter 16 of the PCB 10.

In some examples, the stress relief unit 50 may be soldered to the housing and/or PCB 10 in place.

In the example shown in fig. 7, the stress relief feature 30 is part of the housing 20 before the PCB 10 is attached. Such an arrangement is also possible in other examples. Thus, the housing arrangement 20 comprises: a conductive enclosure wall 22 at least partially enclosing cavity 24; and a stress relief feature 30 positioned where the conductive enclosure wall 22 is attached to the printed circuit board 10. The combination of the conductive enclosure walls 22, the stress relief features 30, and the attached printed circuit board 10 creates a closed resonant cavity for the resonant cavity filter 100. The stress relief feature 30 may be a stress relief unit 50 as previously described with reference to fig. 5, 6, 7 and 8. The stress relief unit 50 extends from the housing wall 22 and is configured to attach the housing wall 22 to the printed circuit board 10.

The printed circuit board 10 includes: at least one conductive substrate; at least one user-tunable device 14 (not shown) for tuning the resonant cavity filter 100 is formed by attaching the printed circuit board 10 to a conductive enclosure wall 22 at least partially enclosing the cavity 24. This combination of PCB 10 and housing 22 including stress relief feature 30 creates enclosed resonant cavity 24 for resonant cavity filter 100. The at least one user-tunable device 14 is configured to be changed by a user to tune the resonant cavity filter 100. As previously described (see, e.g., fig. 8), the stress relief feature 30 may additionally be defined by an aperture 32 in the substrate of the printed circuit board 10.

The stress relief feature 30 in the previously described examples of fig. 1-8 reduces negative effects due to the different coefficients of thermal expansion between the housing 20 and the PCB 10. The stress relief feature 30 allows the printed circuit board 10 to be used as a filter cover and allows for a new housing and new printed circuit board 10 with the printed circuit board 10 as a cover.

In some, but not necessarily all, of the previously described examples, solder paste may be used to attach the PCB10 to the housing. The combination of PCB10 and housing 20 with stress relief feature 30 is fused together using solder paste in a reflow chamber that may be at a temperature above 200 ℃. The solder, PCB10 and housing 20 and in some cases stress relief features 30 form a uniformly conductive encapsulated resonant cavity filter 100 having a resonant cavity 24. As the resonant cavity filter 100 cools, the stress relief feature 30 prevents excessive stress from occurring in the PCB10 due to differences in the coefficients of thermal expansion.

In the example shown in fig. 9, the resonant cavity filter 100 as described previously is part of a transceiver station 200. The filter has low cost and low weight.

The cavity filter 100 may operate as a diplexer or triplexer, for example.

The cavity filter 100 may, for example, provide components of a passive or active antenna system. An active antenna is an antenna that contains active electronic components such as transistors. These may be provided by the PCB 10.

In the previous example, the cavity filter 100 is created by combining the housing 20 and the PCB 10 while controlling the stress using the stress relief feature 30. But in other instances a different frequency selective radio frequency component 100, such as an antenna, may be produced.

The frequency selective radio frequency device 100 includes: a conductive member 20; a printed circuit board 10 adjacent to the conductive assembly 20; and a stress relief feature 30 at an interface between the conductive assembly 20 and the printed circuit board 10, wherein at least a combination of the conductive assembly 20 and the printed circuit board 10 creates a conductive portion of the frequency selective radio frequency device 100.

In some, but not necessarily all, examples, the conductive components of the frequency selective radio frequency device include, prior to attachment to the PCB 10: the conductive stress relief unit 50 being positioned at the location where the conductive assembly 20 is attached to the printed circuit board 10, wherein the combination of the conductive stress relief unit 50, the conductive assembly 20 and the attached printed circuit board 10 creates the conductive portion of the frequency selective radio frequency device 100.

In some, but not necessarily all, examples, the printed circuit board 10 for use in the frequency selective radio frequency device 100 includes: at least one conductive substrate 12; at least one user-tunable apparatus 10 for tuning a frequency selective radio frequency device 100, the apparatus being formed by attaching a printed circuit board 10 to a conductive component 20 of the frequency selective radio frequency device 100, thereby forming a conductive portion of the frequency selective radio frequency device 100, wherein the at least one user-tunable apparatus 14 is configured to be varied by a user to control an electrical impedance associated with the conductive portion.

The term "circuitry" as used in this disclosure may refer to one or more of all of the following:

(a) Circuit implementations that are hardware-only (such as implementations in analog and/or digital circuits only); and

(B) A combination of hardware circuitry and software, such as (applicable to):

(i) A combination of analog and/or digital hardware circuit(s) and software/firmware; and

(Ii) A hardware processor (including digital signal processor (s)), software, and any portion of memory(s) that work together to cause a device (such as a mobile phone or server) to perform various functions; and

(C) Hardware circuit(s) and/or processor(s) such as microprocessor(s) or part of microprocessor(s) that require software (e.g., firmware) to operate, but may not exist when software is not required to operate.

This definition of "circuitry" applies to all uses of this term in this disclosure, including in any claims. As another example, the term "circuitry" as used in this disclosure also encompasses implementations of only hardware circuitry or a processor, with its accompanying software and/or firmware. For example, if applicable to particular claim elements, the term "circuitry" also encompasses a baseband integrated circuit for a mobile device, or a similar integrated circuit in a server, a cellular network device, or other computing or network device.

Where a structural feature is described, it may be replaced by means for implementing one or more of the functions of the structural feature, whether or not the function or functions are explicitly or implicitly described.

The frequency selectivity of the frequency selective radio frequency device 100 means that it is configured to operate within one or more of a plurality of operating resonant frequency bands. For example, the operating frequency bands may include (but are not limited to): long Term Evolution (LTE) (united states) (734 to 746MHz and 869 to 894 MHz), long Term Evolution (LTE) (elsewhere in the world) (791 to 821MHz and 925 to 960 MHz), amplitude Modulated (AM) radio (0.535-1.705 MHz); frequency Modulated (FM) radio (76-108 MHz); bluetooth (2400-2483.5 MHz); wireless Local Area Networks (WLANs) (2400-2483.5 MHz); high performance radio local area network (HiperLAN) (5150-5850 MHz); global Positioning System (GPS) (1570.42-1580.42 MHz); the United states Global System for Mobile communications (US-GSM) 850 (824-894 MHz) and 1900 (1850-1990 MHz); european Global System for Mobile communications (EGSM) 900 (880-960 MHz) and 1800 (1710-1880 MHz); european wideband code division multiple access (EU-WCDMA) 900 (880-960 MHz); personal communication network (PCN/DCS) 1800 (1710-1880 MHz); U.S. wideband code division multiple access (US-WCDMA) 1700 (transmission: 1710 to 1755MHz, reception: 2110 to 2155 MHz) and 1900 (1850-1990 MHz); wideband Code Division Multiple Access (WCDMA) 2100 (transmit: 1920-1980MHz, receive: 2110-2180 MHz); personal Communication Services (PCS) 1900 (1850-1990 MHz); time division synchronous code division multiple access (TD-SCDMA) (1900 MHz to 1920MHz,2010MHz to 2025 MHz), ultra Wideband (UWB) low frequency band (3100-4900 MHz); UWB high-frequency band (6000-10600 MHz); digital video broadcasting-handheld (DVB-H) (470-702 MHz); DVB-H U.S. (1670-1675 MHz); world radio digital broadcasting (DRM) (0.15-30 MHz); worldwide interoperability for microwave access (WiMax) (2300-240mhz, 2305-2360MHz,2496-2690MHz,3300-3400MHz,3400-3800MHz,5250-5875 MHz); digital Audio Broadcasting (DAB) (174.928-239.2 MHz,1452.96-1490.62 MHz); low frequency radio frequency identification (RFID LF) (0.125-0.134 MHz); a high frequency Radio Frequency Identification (RFIDHF) (13.56-13.56 MHz); ultra high frequency radio frequency identification (RFID UHF) (433 MHz,865-956MHz,2450 MHz).

The operating band is the frequency range over which the antenna can operate efficiently. The operating band may be defined as a frequency range in which the return loss (reflection coefficient) of the antenna is below an operating threshold depending on the application.

The term "comprising" as used in this document has an inclusive rather than exclusive meaning. That is, whenever X is mentioned to include Y, it is indicated that X may include only one Y, or may include more than one Y. If an exclusive inclusion is intended, it will be clearly understood that such an inclusion is referred to herein as "comprising only one" or "consisting of …" is used.

Various examples are mentioned in the description herein. The description of features or functions with respect to one example indicates that the features or functions are present in the example. The use of the term "example" or "e.g." or "may" in this text indicates that such feature or function, whether explicitly stated or not, is present in at least the described example and whether or not described as one example, and that the feature or function may (but is not necessarily) be present in some or all other examples thereof. Thus, "instance," e.g., "may," or "may" refer to a particular instance among a class of instances. The attribute of the instance may be the attribute of the instance only, or the attribute of the category, or the attribute of a sub-category of the category that includes some but not all instances in the category. It is thus implicitly disclosed that features described with reference to one example but not with reference to another may, where possible, be used in that other example as part of a working combination, but need not necessarily be used in that other example.

While some embodiments have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the claims.

The features described in the foregoing description may be used in other combinations than those explicitly described.

Although some functions are described with reference to a particular feature, such functions may be implemented by other features, whether described or not.

Although some features are described with reference to a particular embodiment, these features may also be present in other embodiments, whether described or not.

The terms "a" or "an" as used in this document have inclusive rather than exclusive meanings. That is, whenever X is mentioned to include a certain/the Y, it is indicated that X may include only one Y, or may include more than one Y, unless the context clearly indicates the contrary. If "a" or "the" is intended to be used in an exclusive sense, it will be clear from the context. In some instances, the use of "at least one" or "one or more" may be employed to emphasize an inclusive meaning, but no exclusive meaning should be inferred therefrom if such terms are absent.

The presence of a certain feature (or combination of features) in the claims does not only relate to the feature or combination of features itself but also to features (equivalent features) that achieve substantially the same technical result. Equivalent features include, for example, features that are variants and that achieve substantially the same result in substantially the same way. Equivalent features include, for example, features that perform substantially the same function in substantially the same way to achieve substantially the same result.

The use of adjectives or adjectives in the description herein refers to various examples in order to describe the characteristics of the examples. Such a characterization description with respect to one example indicates that the described feature is present in some examples exactly as described, and in other examples substantially as described.

The use of the term "example" or "e.g." or "may" in this text indicates that such feature or function, whether explicitly stated or not, is present in at least the described example and whether or not described as one example, and that the feature or function may (but is not necessarily) be present in some or all other examples thereof. Thus, "instance," e.g., "may," or "may" refer to a particular instance among a class of instances. The attribute of the instance may be the attribute of the instance only, or the attribute of the category, or the attribute of a sub-category of the category that includes some but not all instances in the category. It is thus implicitly disclosed that features described with reference to one example but not with reference to another may, where possible, be used in that other example as part of a working combination, but need not necessarily be used in that other example.

Whilst endeavoring in the foregoing specification to draw attention to those features of interest it should be understood that the applicant claims protection in respect of any patentable feature or combination of features hereinbefore referred to and/or shown in the drawings whether or not particular emphasis has been placed thereon.

Claims

1. An apparatus, comprising:

2. The apparatus of claim 1, wherein the stress relief feature is configured to deform to absorb stress.

3. The device of claim 1 or 2, wherein the stress relief feature provides a respective connection path between the printed circuit board and the conductive enclosure wall and allows for relative movement of the connection paths.

4. The apparatus of any preceding claim, wherein the stress relief feature is defined by an aperture in a substrate of a printed circuit board.

5. The device of claim 4, wherein some or all of the apertures are through apertures extending through the substrate and/or wherein some or all of the apertures are recesses that do not extend through the substrate.

6. The apparatus of any of claims 4 or 5, wherein the apertures comprise external apertures that individually terminate at a point on the perimeter of the printed circuit board, and/or wherein the apertures comprise internal apertures that do not terminate at the perimeter of the printed circuit board.

7. The device of claim 6, wherein the external aperture is a straight open slot having parallel sides, the length of the parallel sides being greater than the distance between the parallel sides.

8. The apparatus of claims 4 to 7, comprising a plurality of parallel first external apertures at a first edge of a perimeter of the printed circuit board and a plurality of parallel third external apertures at a third edge of the perimeter of the printed circuit board, wherein the first edge is opposite the third edge, and wherein each first external aperture is opposite a respective third external aperture, each third external aperture is opposite a respective first external aperture.

9. The device of claims 6 to 8, wherein the internal aperture extends such that it overlaps the external aperture near the perimeter of the printed circuit board.

10. The apparatus of any of claims 4 to 9, wherein the apertures comprise an outer aperture that individually terminates at a point on the perimeter of the printed circuit board and an inner aperture that does not terminate at the perimeter of the printed circuit board, wherein the inner and outer apertures are straight open slots of different lengths.

11. The apparatus of any of claims 4 to 10, wherein the apertures comprise a plurality of parallel first external apertures individually terminated at a first edge of the perimeter of the printed circuit board and a plurality of parallel third external apertures individually terminated at a third edge of the perimeter of the printed circuit board, wherein the first edge is opposite the third edge, each first external aperture is opposite a respective third external aperture, and each third external aperture is opposite a respective first external aperture;

12. The device of claim 10 or 11, wherein the internal aperture is a straight open slot having parallel sides, the length of the parallel sides being greater than the distance between the parallel sides.

13. The apparatus of any of claims 4 to 9, wherein the apertures comprise an outer aperture that individually terminates at a point on the perimeter of the printed circuit board and an inner aperture that does not terminate at the perimeter of the printed circuit board, wherein the inner and outer apertures have different shapes.

14. The apparatus of any of claims 4 to 9, 13, wherein the aperture comprises an internal aperture that does not terminate at a perimeter of a printed circuit board, wherein the internal aperture is a crossover formed by two crossover straight slots having parallel sides.

15. A device according to any preceding claim, wherein the stress relief feature comprises a stress relief unit between the housing wall and the printed circuit board.

16. The device of claim 15, wherein the stress relief unit comprises a plurality of respective support pins.

17. The apparatus of claim 15 or 16, wherein the stress relief unit is electrically conductive.

18. The apparatus of any of claims 15 to 17, wherein the stress relief unit extends around the entire perimeter of the printed circuit board.

19. An apparatus, comprising:

A conductive housing wall at least partially enclosing a cavity;

20. The apparatus of any preceding claim, wherein the stress relief feature comprises a stress relief unit for attaching the housing wall to a printed circuit board.