CN117817182B - Sensor chip, pin welding material and method - Google Patents
Sensor chip, pin welding material and method Download PDFInfo
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- CN117817182B CN117817182B CN202410094229.XA CN202410094229A CN117817182B CN 117817182 B CN117817182 B CN 117817182B CN 202410094229 A CN202410094229 A CN 202410094229A CN 117817182 B CN117817182 B CN 117817182B
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- 239000000463 material Substances 0.000 title claims abstract description 78
- 238000003466 welding Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000003756 stirring Methods 0.000 claims abstract description 51
- 238000005476 soldering Methods 0.000 claims abstract description 49
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000002156 mixing Methods 0.000 claims abstract description 33
- 230000004907 flux Effects 0.000 claims abstract description 32
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 32
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims abstract description 28
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000002360 preparation method Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 16
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims abstract description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 15
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 15
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 15
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 15
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000001530 fumaric acid Substances 0.000 claims abstract description 14
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 14
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 14
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000005566 electron beam evaporation Methods 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000012300 argon atmosphere Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000003921 oil Substances 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
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- 239000000758 substrate Substances 0.000 description 4
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- 150000002739 metals Chemical class 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a sensor chip, a pin welding material and a pin welding method, and belongs to the technical field of sensor processing. The welding material comprises SAC305 solder, soldering flux and reinforcing agent; the preparation method of the soldering flux comprises the following steps: taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A; mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath, adding a material A, suberic acid, triethanolamine and OP-10 to obtain a soldering flux; the preparation steps of the reinforcing agent are as follows: mixing reduced graphene oxide and absolute ethyl alcohol to obtain a material B; mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate and silver nitrate to obtain a material C; mixing the material B and the material C, regulating the pH value, preserving heat, washing, drying and calcining to obtain the reinforcing agent; and the welding material is used for welding the sensor chip and the pins, so that the welding strength is high, and breakage is avoided.
Description
Technical Field
The invention belongs to the technical field of sensor processing, and particularly relates to a sensor chip, a pin welding material and a pin welding method.
Background
With the development of microelectronic technology, the chip integration level is higher and higher, and the requirement on the chip welding process is higher and higher, so that the reliability of the chip welding process can be improved and the circuit function of the chip can be improved by arranging a reasonable and effective chip welding process flow. Particularly, the high-power chip needs to be grounded sufficiently to dissipate heat, so that the chip can be ensured to work normally. The existing technology for welding the chip and the pins usually adopts solder paste to weld the electrode on the back of the chip with one pin, then the two electrodes on the front of the chip are respectively connected with the pins through solder, the existing connection mode usually comprises the steps of placing the solder on the upper sides of the corresponding electrode and the pin of the chip, and then melting and cooling the solder, so that the welding of the chip and the pins is completed. However, the existing welding technology is easy to cause unstable connection of chips or pins and easy to disconnect, so that the triode or the controllable silicon is unstable in work and short in service life.
Disclosure of Invention
The invention discloses a sensor chip, a pin welding material and a pin welding method, and belongs to the technical field of sensor processing. The welding material comprises SAC305 solder, soldering flux and reinforcing agent; the preparation method of the soldering flux comprises the following steps: taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A; mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath, adding a material A, suberic acid, triethanolamine and OP-10 to obtain a soldering flux; the preparation steps of the reinforcing agent are as follows: mixing reduced graphene oxide and absolute ethyl alcohol to obtain a material B; mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate and silver nitrate to obtain a material C; mixing the material B and the material C, regulating the pH value, preserving heat, washing, drying and calcining to obtain the reinforcing agent; and the welding material is used for welding the sensor chip and the pins, so that the welding strength is high, and breakage is avoided.
The invention aims to solve the technical problems: the welding strength of the sensor chip and the pins is improved, and breakage is avoided.
The aim of the invention can be achieved by the following technical scheme:
A sensor chip and pin welding material comprises the following raw materials in parts by mass:
SAC305 solder 84.5-87.5 parts by mass
12.5 To 15.5 parts by mass of soldering flux
8.2-9.6 Parts by mass of reinforcing agent;
The SAC305 solder is purchased from Dongguan green island metals limited, wherein the alloy component of the SAC305 solder is Sn96.5Ag3.0Cu0.5.
As a preferable technical scheme of the invention, the preparation of the soldering flux comprises the following steps:
(11) Taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A;
(12) Mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath at 35 ℃, stirring for 20-30min, adding the material A, stirring for 2-3h, adding suberic acid, triethanolamine and OP-10, and stirring for 4-6h to obtain the soldering flux.
As a preferable technical scheme of the invention, in the step (11), the mass ratio of the gum rosin, the fumaric acid and the maleic anhydride is 18-22:2-3.5:2-3.5; the temperature-controlled stirring refers to stirring for 2-3 hours at 180-220 ℃; the heating in the oil bath means heating at 140 ℃ for 4-6 hours.
In the step (12), the mass ratio of the material A to the absolute ethyl alcohol to the tetraethylene glycol dimethyl ether to the diethylene glycol butyl ether to the suberic acid to the triethanolamine to the OP-10 is 15-20:20-30:20-30:20-30:2-4:2-4:2-3.
As a preferred technical scheme of the invention, the preparation of the reinforcing agent comprises the following steps:
(21) Mixing reduced graphene oxide and absolute ethyl alcohol, and performing ultrasonic vibration for 2-3 hours to obtain a material B;
(22) Mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate, stirring for 3-4h, adding silver nitrate, and stirring for 2-3h to obtain a material C;
(23) Mixing the materials B and C, stirring for 2-3h, adding 10 mol/L sodium hydroxide solution to adjust the pH of the mixed materials to 11-12, preserving heat at 180 ℃ for 18-26h, washing, drying, and calcining at 400-450 ℃ in argon atmosphere for 1-1.5h to obtain the reinforcing agent.
As a preferable technical scheme of the invention, in the step (21), the dosage ratio of the reduced graphene oxide and the absolute ethyl alcohol is 10-30mg:30-40mL.
In the step (22), the proportioning ratio of the absolute ethyl alcohol, the absolute acetic acid, the tetrabutyl titanate and the silver nitrate is 16-20mL:3-5mL:4-6mL:16-48mg.
In step (23), the mass ratio of the materials B and C is 1-3:10.
A method of using a sensor chip and a pin bonding material, the method of using comprising the steps of:
(31) Mixing the SAC305 solder and the soldering flux, and stirring for 3-4h to obtain soldering paste;
(32) Depositing the reinforcing agent on the surface of a sensor copper liner plate to be welded by using an electron beam evaporation method to form a reinforcing layer;
(33) Coating the solder paste on the surface of the enhancement layer, fixing the chip and the pins on the surface of the solder paste, and carrying out vacuum welding;
The thickness of the enhancement layer is 120-150nm;
the thickness of the soldering paste is 4000-5000nm;
The electron beam evaporation method comprises the following technological parameters: the voltage of the electron gun is 10-20kV, the vacuum degree is less than or equal to 0.5X10 -3 Pa, and the evaporation rate is 0.5-0.7nm/s;
The technological parameters of the vacuum welding are as follows: the welding temperature is 450-550 ℃, the heat preservation is carried out for 0.5-1h, and the vacuum degree is more than or equal to 2 multiplied by 10 -2 Pa.
The invention has the beneficial effects that:
According to the sensor chip, the pin welding material and the method disclosed by the invention, the reinforcing agent is deposited on the surface of the sensor copper substrate in advance to form the reinforcing layer, and the attachment sites are increased, so that the welding paste is combined more firmly;
further, the graphene with a lamellar structure is introduced to form a porous structure, so that the stress dispersing area is increased, stress concentration is avoided, and the bonding strength of the soldering paste is enhanced;
Further, by increasing the activation acid value, more active sites are exposed on the surface of the sensor copper liner, and the reinforcing agent is easier to deposit on the surface of the sensor copper liner.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description is given below with reference to the embodiments, structures, features and effects according to the present invention.
Example 1
A method of using a sensor chip and a pin bonding material, the method of using comprising the steps of:
(31) Mixing SAC305 solder and soldering flux, and stirring for 3h to obtain soldering paste;
(32) Depositing a reinforcing agent on the surface of a sensor copper substrate to be welded by using an electron beam evaporation method to form a reinforcing layer;
(33) Coating soldering paste on the surface of the enhancement layer, fixing the chip and the pins on the surface of the soldering paste, and vacuum welding, so that the chip and the pins are fixed on a sensor copper lining board;
The thickness of the enhancement layer is 120nm;
the thickness of the soldering paste is 4000nm;
the electron beam evaporation method comprises the following technological parameters: the voltage of the electron gun is 10kV, the vacuum degree is less than or equal to 0.5 multiplied by 10 -3 Pa, and the evaporation rate is 0.5nm/s;
The technological parameters of the vacuum welding are as follows: the welding temperature is 450 ℃, the heat preservation is carried out for 0.5h, and the vacuum degree is more than or equal to 2 multiplied by 10 -2 Pa.
Wherein, the mass ratio of SAC305 solder, soldering flux and reinforcing agent is 84.5:12.5:8.2;
The alloy composition of the SAC305 solder is Sn96.5Ag3.0Cu0.5.
The preparation of the soldering flux comprises the following steps:
(11) Taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A;
(12) Mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath at 35 ℃, stirring for 20min, adding the material A, stirring for 2h, adding suberic acid, triethanolamine and OP-10, and stirring for 4h to obtain the soldering flux;
In the step (11), the mass ratio of the gum rosin, the fumaric acid and the maleic anhydride is 18:2:2; the temperature-controlled stirring refers to stirring for 2 hours at 180 ℃; the heating in the oil bath means heating at 140 ℃ for 4 hours;
in the step (12), the mass ratio of the material A to the absolute ethyl alcohol to the tetraethylene glycol dimethyl ether to the diethylene glycol butyl ether to the suberic acid to the triethanolamine to the OP-10 is 15:20:20:20:2:2:2.
The preparation of the reinforcing agent comprises the following steps:
(21) Mixing reduced graphene oxide and absolute ethyl alcohol, and performing ultrasonic vibration for 2 hours to obtain a material B;
(22) Mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate, stirring for 3 hours, adding silver nitrate, and stirring for 2 hours to obtain a material C;
(23) Mixing the materials B and C, stirring for 2 hours, adding 10 mol/L sodium hydroxide solution to adjust the pH of the mixed materials to 11, preserving heat at 180 ℃ for 18 hours, washing, drying, and calcining at 400 ℃ in an argon atmosphere for 1 hour to obtain the reinforcing agent;
in the step (21), the dosage ratio of the reduced graphene oxide and the absolute ethyl alcohol is 10mg:30mL;
in the step (22), the proportioning ratio of the absolute ethyl alcohol, the absolute acetic acid, the tetrabutyl titanate and the silver nitrate is 16mL:3mL:4mL:16mg;
in the step (23), the mass ratio of the material B to the material C is 1:10.
After welding, the bonding strength between the chip and the pins is 64.2MPa.
Example 2
A method of using a sensor chip and a pin bonding material, the method of using comprising the steps of:
(31) Mixing SAC305 solder and soldering flux, and stirring for 3.5h to obtain soldering paste;
(32) Depositing a reinforcing agent on the surface of a sensor copper substrate to be welded by using an electron beam evaporation method to form a reinforcing layer;
(33) Coating soldering paste on the surface of the enhancement layer, fixing the chip and the pins on the surface of the soldering paste, and vacuum welding, so that the chip and the pins are fixed on a sensor copper lining board;
The thickness of the enhancement layer is 135nm;
The thickness of the soldering paste is 4500nm;
The electron beam evaporation method comprises the following technological parameters: the voltage of the electron gun is 15kV, the vacuum degree is less than or equal to 0.5X10 -3 Pa, and the evaporation rate is 0.6nm/s;
the technological parameters of the vacuum welding are as follows: the welding temperature is 500 ℃, the heat preservation is carried out for 0.8h, and the vacuum degree is more than or equal to 2 multiplied by 10 -2 Pa.
Wherein, the mass ratio of the SAC305 solder, the soldering flux and the reinforcing agent is 85.5:13.5:8.8;
The alloy composition of the SAC305 solder is Sn96.5Ag3.0Cu0.5.
The preparation of the soldering flux comprises the following steps:
(11) Taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A;
(12) Mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath at 35 ℃, stirring for 25min, adding the material A, stirring for 2-3h, adding suberic acid, triethanolamine and OP-10, and stirring for 5h to obtain the soldering flux;
in the step (11), the mass ratio of the gum rosin, the fumaric acid and the maleic anhydride is 20:3:3, a step of; the temperature-controlled stirring is carried out at 200 ℃ for 2.5h; the heating in the oil bath means heating at 140 ℃ for 5 hours;
in the step (12), the mass ratio of the material A to the absolute ethyl alcohol to the tetraethylene glycol dimethyl ether to the diethylene glycol butyl ether to the suberic acid to the triethanolamine to the OP-10 is 18:25:25:25:3:3:2.5.
The preparation of the reinforcing agent comprises the following steps:
(21) Mixing reduced graphene oxide and absolute ethyl alcohol, and performing ultrasonic oscillation for 2.5 hours to obtain a material B;
(22) Mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate, stirring for 3.5 hours, adding silver nitrate, and stirring for 2.5 hours to obtain a material C;
(23) Mixing the materials B and C, stirring for 2.5h, adding 10 mol/L sodium hydroxide solution to adjust the pH of the mixed materials to 11.5, preserving heat at 180 ℃ for 22h, washing, drying, and calcining at 430 ℃ in argon atmosphere for 1.2h to obtain the reinforcing agent;
in the step (21), the dosage ratio of the reduced graphene oxide and the absolute ethyl alcohol is 20mg:35mL;
in the step (22), the proportioning ratio of the absolute ethyl alcohol, the absolute acetic acid, the tetrabutyl titanate and the silver nitrate is 18mL:4mL:5mL:30mg;
In the step (23), the mass ratio of the material B to the material C is 2:10.
After welding, the bonding strength between the chip and the pins is 68.3MPa.
Example 3
A method of using a sensor chip and a pin bonding material, the method of using comprising the steps of:
(31) Mixing SAC305 solder and soldering flux, and stirring for 4h to obtain soldering paste;
(32) Depositing a reinforcing agent on the surface of a sensor copper substrate to be welded by using an electron beam evaporation method to form a reinforcing layer;
(33) Coating soldering paste on the surface of the enhancement layer, fixing the chip and the pins on the surface of the soldering paste, and vacuum welding, so that the chip and the pins are fixed on a sensor copper lining board;
the thickness of the enhancement layer is 150nm;
the thickness of the soldering paste is 5000nm;
the electron beam evaporation method comprises the following technological parameters: the voltage of the electron gun is 20kV, the vacuum degree is less than or equal to 0.5X10 -3 Pa, and the evaporation rate is 0.7nm/s;
The technological parameters of the vacuum welding are as follows: the welding temperature is 550 ℃, the heat preservation is carried out for 1h, and the vacuum degree is more than or equal to 2 multiplied by 10 -2 Pa.
Wherein, the mass ratio of the SAC305 solder, the soldering flux and the reinforcing agent is 87.5:15.5:9.6;
The alloy composition of the SAC305 solder is Sn96.5Ag3.0Cu0.5.
The preparation of the soldering flux comprises the following steps:
(11) Taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A;
(12) Mixing absolute ethyl alcohol, tetraethylene glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath at 35 ℃, stirring for 30min, adding the material A, stirring for 3h, adding suberic acid, triethanolamine and OP-10, and stirring for 6h to obtain the soldering flux;
In the step (11), the mass ratio of the gum rosin, the fumaric acid and the maleic anhydride is 22:3.5:3.5; the temperature-controlled stirring refers to stirring for 3 hours at 220 ℃; the heating in the oil bath means heating at 140 ℃ for 6 hours;
in the step (12), the mass ratio of the material A to the absolute ethyl alcohol to the tetraethylene glycol dimethyl ether to the diethylene glycol butyl ether to the suberic acid to the triethanolamine to the OP-10 is 20:30:30:30:4:4:3.
The preparation of the reinforcing agent comprises the following steps:
(21) Mixing reduced graphene oxide and absolute ethyl alcohol, and performing ultrasonic vibration for 3 hours to obtain a material B;
(22) Mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate, stirring for 4 hours, adding silver nitrate, and stirring for 3 hours to obtain a material C;
(23) Mixing the materials B and C, stirring for 3h, adding 10 mol/L sodium hydroxide solution to adjust the pH of the mixed materials to 12, preserving heat at 180 ℃ for 26h, washing, drying, and calcining at 450 ℃ in argon atmosphere for 1.5h to obtain the reinforcing agent;
In the step (21), the dosage ratio of the reduced graphene oxide and the absolute ethyl alcohol is 30mg:40mL;
in the step (22), the proportioning ratio of the absolute ethyl alcohol, the absolute acetic acid, the tetrabutyl titanate and the silver nitrate is 20mL:5mL:6mL:48mg;
In the step (23), the mass ratio of the materials B and C is 3:10.
After welding, the bonding strength between the chip and the pins is 66.4MPa.
Comparative example 1
The difference from example 1 is that no reinforcing agent is used during the welding process. After welding, the bonding strength between the chip and the pins is 32.5MPa.
Comparative example 2
The difference from example 1 is that the mass ratio of gum rosin, fumaric acid, and maleic anhydride in the preparation of the flux is 18:4:0. after welding, the bonding strength between the chip and the pins is 48.1MPa.
Comparative example 3
The difference from example 1 is that the mass ratio of gum rosin, fumaric acid, and maleic anhydride in the preparation of the flux is 18:0:4. after welding, the bonding strength between the chip and the pins is 47.8MPa.
Comparative example 4
The difference with example 1 is that the mass ratio of the material A, absolute ethyl alcohol, tetraethylene glycol dimethyl ether, diethylene glycol butyl ether, suberic acid, triethanolamine and OP-10 in the preparation of the soldering flux is 15:20:20:20:0:4:2. after welding, the bonding strength between the chip and the pins is 38.2MPa.
Comparative example 5
The difference with example 1 is that the mass ratio of the material A, absolute ethyl alcohol, tetraethylene glycol dimethyl ether, diethylene glycol butyl ether, suberic acid, triethanolamine and OP-10 in the preparation of the soldering flux is 15:20:20:20:4:0:2. after welding, the bonding strength between the chip and the pins is 38.3MPa.
Comparative example 6
The difference with example 1 is that the mass ratio of the material A, absolute ethyl alcohol, tetraethylene glycol dimethyl ether, diethylene glycol butyl ether, suberic acid, triethanolamine and OP-10 in the preparation of the soldering flux is 0:20:20:20:2:17:2. after welding, the bonding strength between the chip and the pins is 37.4MPa.
Comparative example 7
The difference from example 1 is that reduced graphene oxide was not added in the preparation of the reinforcing agent. After welding, the bonding strength between the chip and the pins is 44.7MPa.
Comparative example 8
The difference from example 1 is that tetrabutyl titanate is not added in the preparation of the reinforcing agent. After welding, the bonding strength between the chip and the pins is 44.3MPa.
Comparative example 9
The difference from example 1 is that no silver nitrate was added in the preparation of the enhancer. After welding, the bonding strength between the chip and the pins is 43.8MPa.
Analysis of results
The chip and the pins are connected through the prepared welding material according to the scheme, so that the bonding strength is high, the chip and the pins are not easy to break, and the durable strength of the sensor is improved.
Comparative example 1 does not use a reinforcing agent during the soldering process, resulting in too concentrated stress of the soldering material and easy breakage, resulting in a decrease in the bonding strength of the solder paste.
Comparative example 2 and comparative example 3 only added a single acid source during the gum rosin modification process, resulting in a low acid value of material a, a reduced surface activation effect on the sensor copper liner, and a reduced bonding strength of the solder paste.
In the welding process of comparative examples 4,5 and 6, the bonding strength of the solder paste is reduced due to different activation proportions of the soldering flux, because the bonding strength of the solder paste can be enhanced by the synergistic effect of the material A, suberic acid and triethanolamine.
In the welding process of comparative examples 7,8 and 9, the reduced graphene oxide, tetrabutyl titanate and silver nitrate are different in proportion, so that the synergistic effect is reduced, the stress at the joint of the soldering paste is concentrated, the solder paste cannot be effectively dispersed, and the bonding strength is reduced.
The present invention is not limited to the above embodiments, but is capable of modification and variation in detail, and other modifications and variations can be made by those skilled in the art without departing from the scope of the present invention.
Claims (2)
1. The sensor chip and pin welding material is characterized by comprising the following raw materials in parts by mass:
SAC305 solder 84.5-87.5 parts by mass
12.5 To 15.5 parts by mass of soldering flux
8.2-9.6 Parts by mass of reinforcing agent;
The preparation of the soldering flux comprises the following steps:
(11) Taking gum rosin, crushing, heating in an oil bath, adding fumaric acid and maleic anhydride, stirring at a controlled temperature, cooling, discharging, and grinding to obtain a material A;
(12) Mixing absolute ethyl alcohol, tetraethyl glycol dimethyl ether and diethylene glycol butyl ether in a constant-temperature water bath, stirring, adding the material A, stirring, adding suberic acid, triethanolamine and OP-10, and stirring to obtain the soldering flux;
In the step (11), the mass ratio of the gum rosin, the fumaric acid and the maleic anhydride is 18-22:2-3.5:2-3.5; the temperature-controlled stirring refers to stirring for 2-3 hours at 180-220 ℃; the heating in the oil bath means heating at 140 ℃ for 4-6 hours;
in the step (12), the mass ratio of the material A to the absolute ethyl alcohol to the tetraethylene glycol dimethyl ether to the diethylene glycol butyl ether to the suberic acid to the triethanolamine to the OP-10 is 15-20:20-30:20-30:20-30:2-4:2-4:2-3;
the preparation of the reinforcing agent comprises the following steps:
(21) Mixing reduced graphene oxide and absolute ethyl alcohol, and performing ultrasonic vibration to obtain a material B;
(22) Mixing absolute ethyl alcohol and absolute acetic acid, adding tetrabutyl titanate, stirring, adding silver nitrate, and stirring to obtain a material C;
(23) Mixing the materials B and C, stirring, adjusting the pH of the mixed materials, preserving the temperature at 180 ℃ for 18-26h, washing, drying, and calcining for 1-1.5h in the argon atmosphere at 400-450 ℃ to obtain the reinforcing agent;
in the step (21), the dosage ratio of the reduced graphene oxide to the absolute ethyl alcohol is 10-30mg:30-40mL;
In the step (22), the proportioning ratio of the absolute ethyl alcohol, the absolute acetic acid, the tetrabutyl titanate and the silver nitrate is 16-20mL:3-5mL:4-6mL:16-48mg;
in the step (23), the mass ratio of the materials B and C is 1-3:10.
2. A method of using the sensor chip and pin bonding material of claim 1, comprising the steps of:
(31) Mixing the SAC305 solder and the soldering flux, and stirring for 3-4h to obtain soldering paste;
(32) Depositing the reinforcing agent on the surface of a sensor copper liner plate to be welded by using an electron beam evaporation method to form a reinforcing layer;
(33) And coating the solder paste on the surface of the enhancement layer, fixing the chip and the pins on the surface of the solder paste, and performing vacuum welding.
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| CN106475703A (en) * | 2016-11-30 | 2017-03-08 | 安徽华众焊业有限公司 | Lead-free pasty welding material and preparation method thereof |
| CN110091093A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-temperature and lead-free tin soldering cream and preparation method thereof |
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| KR20170098233A (en) * | 2014-12-26 | 2017-08-29 | 유니버시티 오브 리머릭 | Soldering flux, solder paste and method for manufacturing soldering flux |
| CN110961829B (en) * | 2019-12-09 | 2022-02-22 | 青岛歌尔微电子研究院有限公司 | Soldering flux and preparation method thereof, and solder paste and preparation method thereof |
| CN112621024B (en) * | 2020-12-08 | 2022-04-29 | 湖北省哈福生物化学有限公司 | Soldering flux material composition and preparation method of soldering flux |
| CN114951947A (en) * | 2022-07-14 | 2022-08-30 | 深圳芯源新材料有限公司 | Preparation and packaging method of graphene reinforced tin-based composite solder |
| CN115488546B (en) * | 2022-09-30 | 2024-01-30 | 西南石油大学 | Silver nanowire modified tin-silver-copper composite soldering paste and preparation method thereof |
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| CN106475703A (en) * | 2016-11-30 | 2017-03-08 | 安徽华众焊业有限公司 | Lead-free pasty welding material and preparation method thereof |
| CN110091093A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-temperature and lead-free tin soldering cream and preparation method thereof |
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