CN117712099A - Electronic device packaging structure and preparation method thereof - Google Patents
Electronic device packaging structure and preparation method thereof Download PDFInfo
- Publication number
- CN117712099A CN117712099A CN202311404726.7A CN202311404726A CN117712099A CN 117712099 A CN117712099 A CN 117712099A CN 202311404726 A CN202311404726 A CN 202311404726A CN 117712099 A CN117712099 A CN 117712099A
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- CN
- China
- Prior art keywords
- wireless network
- substrate
- circuit board
- network module
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 238000001746 injection moulding Methods 0.000 claims abstract description 40
- 238000004544 sputter deposition Methods 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 26
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000001052 transient effect Effects 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The application discloses an electronic device packaging structure and a preparation method thereof. The electronic device packaging structure comprises a substrate, a wireless network module, an injection molding packaging body, a metal sputtering layer and a circuit board, wherein the substrate is provided with a first surface and a second surface which are arranged in opposite directions; the wireless network module is connected to the first surface of the substrate; the injection molding packaging body is arranged on the first surface of the substrate, and the injection molding packaging body is arranged on the wireless network module in a covering mode; the metal sputtering layer is arranged on the surface of the injection molding packaging body, which is away from the wireless network module; the circuit board is connected to the second surface of the substrate, and is connected and conducted with the wireless network module.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and more particularly, to an electronic device package structure and a method for manufacturing the same.
Background
The wireless network module is a module for wireless data transmission by utilizing a wireless technology, and is an important component for realizing wireless intelligent application and Internet of things application. In recent years, with the development of wireless technology, wireless network modules have also been rapidly developed as a bridge for remote services.
In the prior art, the packaging structure of the wireless network module comprises a metal shielding cover structure, so that the packaging structure of the wireless network module cannot be connected with an external product board in a wave soldering mode, and the metal shielding cover can be caused to fall in the wave soldering process; therefore, the packaging structure of the wireless network module can be connected with an external product board only by adopting reflow soldering, and the welding reliability of the reflow soldering is lower than that of wave soldering.
In view of this, a new solution is needed to solve the above technical problems.
Disclosure of Invention
An object of the present application is to provide a new technical solution for an electronic device package structure and a method for manufacturing the same.
According to a first aspect of the present application, there is provided an electronic device package structure comprising:
a substrate having a first surface and a second surface disposed opposite each other;
the wireless network module is connected to the first surface of the substrate;
the injection molding packaging body is arranged on the first surface of the substrate and covers the wireless network module;
the metal sputtering layer is arranged on the surface, facing away from the wireless network module, of the injection molding package body;
the circuit board is connected to the second surface of the substrate, and the circuit board is connected and conducted with the wireless network module.
Optionally, the circuit board is connected and conducted with the wireless network module through a bonding pad arranged on the second surface of the substrate; and a thermosetting adhesive layer is filled between the circuit board and the second surface of the substrate.
Optionally, the wireless network module includes a wireless network element, a flash memory chip, an inductor, a capacitor, a crystal oscillator, and a transient voltage suppressor.
Optionally, the wireless network element and the flash memory chip are stacked on the first surface of the substrate, and the wireless network element and the flash memory chip are connected and conducted with the substrate through metal wires respectively.
Optionally, the circuit board is provided with a conductive through hole, and the conductive through hole is of a half-hole structure arranged at the edge position of the circuit board; the conductive through hole is connected and conducted with the wireless network module.
Optionally, along the length direction of the circuit board, the substrate is connected to one side of the circuit board, a printed antenna layer is arranged on the other side of the circuit board, and the printed antenna layer is connected and conducted with the wireless network module.
Optionally, the edge of the circuit board, which is close to the substrate along the length direction, and the two side edges of the circuit board along the width direction are both provided with the conductive through holes.
Optionally, the material of the injection molding packaging body is epoxy resin; the metal sputtering layer is made of metal copper.
Optionally, the metal sputtering layer is arranged on the top and the side part of the injection molding package body, which are away from the wireless network module; and the metal sputtering layer positioned on the side part of the injection molding packaging body covers the substrate.
According to a second aspect of the present application, there is provided a method for manufacturing the electronic device package structure as described in the first aspect, the method comprising:
providing a substrate, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged;
providing a wireless network module, and connecting the wireless network module to the first surface of the substrate;
performing injection molding encapsulation on the wireless network module by adopting an injection molding process, and forming an injection molding encapsulation body around the wireless network module;
forming a metal sputtering layer on the surface of the injection molding packaging body, which is away from the wireless network module, by adopting a sputtering process;
and connecting the second surface of the substrate with the circuit board.
Optionally, after connecting the second surface of the substrate with the circuit board, the method further comprises:
and filling the space between the second surface of the substrate and the circuit board by using thermosetting adhesive to form a thermosetting adhesive layer.
In the electronic device packaging structure provided by the embodiment of the application, the metal sputtering layer arranged on the surface of the injection molding packaging body plays a role in electromagnetic shielding, so that the problem that the metal shielding cover falls off in the subsequent wave soldering process can be avoided; thereby improving the reliability of the electronic device package structure.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
FIG. 1a is a schematic structural view of an electronic device package according to one embodiment of the present application;
FIG. 1b is an enlarged schematic view at A in FIG. 1 a;
FIG. 1c is an enlarged schematic view at B in FIG. 1 a;
fig. 2 is a schematic structural diagram of an electronic device package structure according to an embodiment of the present application.
Reference numerals illustrate:
1. an electronic device package structure; 11. a substrate; 12. a wireless network module; 121. a wireless network element; 122. a flash memory chip; 123. an inductor; 124. a capacitor; 125. a crystal oscillator; 126. a transient voltage suppressor; 127. a metal wire; 13. injection molding the package; 14. a metal sputtering layer; 15. a circuit board; 150. a conductive via; 151. printing an antenna layer; 16. and (5) a thermosetting adhesive layer.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
Referring to fig. 1 a-2, an electronic device package 1 is provided according to one embodiment of the present application. The electronic device packaging structure comprises a substrate 11, a wireless network module 12, an injection molding packaging body 13, a metal sputtering layer 14 and a circuit board 15, wherein the substrate 11 is provided with a first surface and a second surface which are oppositely arranged;
the wireless network module 12 is connected to the first surface of the substrate 11; the injection molding package 13 is disposed on the first surface of the substrate 11, and the injection molding package 13 is disposed on the wireless network module 12 in a covering manner; the metal sputtering layer 14 is arranged on the surface of the injection molding package body 13, which is away from the wireless network module 12; the circuit board 15 is connected to the second surface of the substrate 11, and the circuit board 15 is connected to the wireless network module 12.
In the electronic device package structure provided in the embodiment of the present application, the wireless network module 12 is connected to the first surface of the substrate 11, and the circuit board 15 is connected to the second surface of the substrate 11. And, adopt the injection molding encapsulation body 13 to encapsulate the wireless network module 12; optionally, the material of the injection molding package 13 is epoxy resin. In addition, a metal sputtering layer 14 is disposed on the surface of the injection molding package 13 facing away from the wireless network module 12, and optionally, the metal sputtering layer 14 is made of metal copper.
The metal sputtering layer 14 can play a role of electromagnetic shielding for the wireless network module 12, so that a metal shielding cover is not required to be arranged in the electronic device packaging structure 1; if a metal shielding cover is arranged in the electronic device packaging structure, the metal shielding cover is connected with the circuit board through solder paste, so that the electronic device packaging structure cannot adopt a wave soldering process when being connected with an external product board, and the wave soldering process can cause the solder paste to melt, so that the metal shielding cover can fall down to cause the risk of electromagnetic shielding failure.
In the electronic device packaging structure provided by the embodiment of the application, the metal sputtering layer 14 arranged on the surface of the injection molding packaging body 13 plays a role in electromagnetic shielding, so that the problem that the metal shielding cover falls off in the subsequent wave soldering process can be avoided; thereby improving the reliability of the electronic device package structure.
Referring to fig. 1 a-2, in one embodiment, the circuit board 15 is in communication with the wireless network module 12 via a pad connection disposed on the second surface of the substrate 11; and a thermosetting adhesive layer 16 is filled between the circuit board 15 and the second surface of the substrate 11.
In this specific example, pads for making an electrical conduction connection between the circuit board 15 and the wireless network module 12 are provided on the second surface of the substrate 11; and a thermosetting adhesive layer 16 is filled between the circuit board 15 and the second surface of the substrate 11; when the electronic device packaging structure 1 is subjected to a wave soldering process, the high temperature of wave soldering can play a role in curing the thermosetting adhesive layer 16 at high temperature, so that the connection between the circuit board 15 and the substrate 11 is reinforced, and the circuit board 15 and the substrate 11 are prevented from loosening. In addition, the thermosetting adhesive layer 16 plays a good role in protecting the bonding pads arranged on the second surface of the substrate 11, and prevents the bonding pads from falling off due to melting of solder paste of the bonding pads in the wave soldering process.
Referring to fig. 1 a-2, in one embodiment, the wireless network module 12 includes a wireless network element 121, a flash memory chip 122, an inductor 123, a capacitor 124, a crystal oscillator 125, and a transient voltage suppressor 126.
The flash memory chip 122 is used for storing data; the crystal oscillator 125 is used for providing an alternating current signal with high stability in frequency; the transient voltage suppressor 126 is used to suppress transient overvoltages.
Referring to fig. 1 a-2, in one embodiment, the wireless network element 121 and the flash memory chip 122 are stacked on the first surface of the substrate 11, and the wireless network element 121 and the flash memory chip 122 are respectively connected to and conducted with the substrate 11 through metal wires 127.
In this specific example, the wireless network element 121 is disposed on the first surface of the substrate 11, and the flash memory chip 122 is stacked above the wireless network element 121, so that the packaging space can be saved; in addition, the wireless network element 121 and the flash memory chip 122 are connected and conducted with the substrate 11 through a wire bonding process.
Referring to fig. 1 a-2, in one embodiment, the circuit board 15 is provided with a conductive via 150, and the conductive via 150 is a half-hole structure disposed at an edge position of the circuit board 15; the conductive via 150 is connected to the wireless network module 12.
In this specific example, a conductive via 150 of a half-hole structure is provided at an edge position of the circuit board 15, the conductive via 150 being used for signal input and output. The side of the conductive via 150 of the half-hole structure can be used for soldering, which helps to save space and facilitate soldering. The conductive via 150 is electrically connected to the wireless network module 12 through a pad provided on the second surface of the substrate 11.
Referring to fig. 1 a-2, in one embodiment, along the length direction of the circuit board 15, the substrate 11 is connected to one side of the circuit board 15, and a printed antenna layer 151 is disposed on the other side of the circuit board 15, and the printed antenna layer 151 is connected to the wireless network module 12.
In this particular example, the printed antenna layer 151 is used to radiate out the signal; the substrate 11 and the wireless network module 12 are arranged on one side of the length direction of the circuit board 15, the printed antenna layer 151 is arranged on the other side of the length direction of the circuit board 15, and the space on the circuit board 15 is reasonably utilized, so that the whole size of the electronic device packaging structure is reduced.
Referring to fig. 1 a-2, in one embodiment, the circuit board 15 is adjacent to the edge of the substrate 11 in the length direction, and the conductive vias 150 are provided at both side edges of the circuit board 15 in the width direction.
In this specific example, the conductive through holes 150 of the half-hole structure are provided at three edge positions of the circuit board 15, thereby facilitating signal input and output by the electronic device package structure 1 connected with external devices.
Referring to fig. 1b and 1c, in one embodiment, the metal sputtered layers 14 are disposed on the top and side of the injection molded package 13 facing away from the wireless network module 12; and the metal sputtering layer 14 located at the side of the injection molding package 13 covers the substrate 11. So that the metal sputtered layer 14 can form a more complete and effective shielding effect.
According to another embodiment of the present application, there is provided a method for manufacturing the electronic device package structure as described above, the method including:
s101, providing a substrate 11, wherein the substrate 11 is provided with a first surface and a second surface which are oppositely arranged;
s102, providing a wireless network module 12, and connecting the wireless network module 12 to the first surface of the substrate 11;
s103, performing injection molding packaging on the wireless network module 12 by adopting an injection molding process, and forming an injection molding packaging body 13 around the wireless network module 12;
s104, forming a metal sputtering layer 14 on the surface of the injection molding package 13, which faces away from the wireless network module 12, by adopting a sputtering process;
s105, connecting the second surface of the substrate 11 with the circuit board 15.
In the method for manufacturing the electronic device package structure provided in the embodiment of the present application, in step S101 and step S102, the inductor 123, the capacitor 124, the crystal oscillator 125 and the transient voltage suppressor 126 are mounted on the first surface of the substrate 11 by adopting a Surface Mount Technology (SMT); and, the wireless network element 121 and the flash memory chip 122 are attached to the first surface of the substrate 11 by a wafer bonding process (Die Bond); in addition, a wire bonding process (Wirebond) is used to connect the wireless network element 121 and the flash memory chip 122 to the substrate 11.
In step S103, the wireless network module 12 is injection-molded and packaged by using an injection molding process (Mold) to form an injection-molded package body 13; in step S104, a sputtering process (dispenser) is adopted to form a metal sputtering layer 14 on the surface of the injection molding package 13 facing away from the wireless network module 12; in step S105, the substrate 11, together with the wireless network module 12, and the circuit board 15 are assembled by a Surface Mount Technology (SMT), and soldered by reflow soldering.
Furthermore, in one embodiment, after connecting the second surface of the substrate 11 with the circuit board 15, the method further comprises:
and S106, filling the space between the second surface of the substrate 11 and the circuit board 15 by using thermosetting adhesive, and forming a thermosetting adhesive layer 16.
In this specific example, in step S106, the connection between the substrate 11 and the circuit board 15 may be reinforced by filling with a thermosetting adhesive between the second surface of the substrate 11 and the circuit board 15 and forming the thermosetting adhesive layer 16.
The foregoing embodiments mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in consideration of brevity of line text, no further description is given here.
Although specific embodiments of the present application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.
Claims (11)
1. An electronic device package, the electronic device package comprising:
a substrate (11), the substrate (11) having a first surface and a second surface disposed opposite each other;
a wireless network module (12), wherein the wireless network module (12) is connected to the first surface of the substrate (11);
an injection molding package (13), wherein the injection molding package (13) is arranged on the first surface of the substrate (11), and the injection molding package (13) is arranged on the wireless network module (12) in a covering manner;
the metal sputtering layer (14), the said metal sputtering layer (14) is set up in the surface facing away from said wireless network module (12) of the said injection molding encapsulation body (13);
the circuit board (15), the circuit board (15) is connected to the second surface of the base plate (11), and the circuit board (15) is connected with the wireless network module (12).
2. The electronic device package according to claim 1, wherein the circuit board (15) is connected to the wireless network module (12) via a pad provided on the second surface of the substrate (11); and a thermosetting adhesive layer (16) is filled between the circuit board (15) and the second surface of the substrate (11).
3. The electronic device package according to claim 1, wherein the wireless network module (12) comprises a wireless network element (121), a flash memory chip (122), an inductor (123), a capacitor (124), a crystal oscillator (125), and a transient voltage suppressor (126).
4. The electronic device package structure according to claim 3, wherein the wireless network element (121) and the flash memory chip (122) are stacked on the first surface of the substrate (11), and the wireless network element (121) and the flash memory chip (122) are respectively connected and conducted with the substrate (11) through metal wires (127).
5. The electronic device package according to claim 1, wherein the circuit board (15) is provided with a conductive via (150), the conductive via (150) being a half-hole structure provided at an edge position of the circuit board (15); the conductive through hole (150) is connected and conducted with the wireless network module (12).
6. The electronic device packaging structure according to claim 5, wherein the substrate (11) is connected to one side of the circuit board (15) along a length direction of the circuit board (15), a printed antenna layer (151) is disposed on the other side of the circuit board (15), and the printed antenna layer (151) is connected to the wireless network module (12).
7. The electronic device package structure according to claim 6, wherein the circuit board (15) is provided with the conductive via (150) near an edge of the substrate (11) in a length direction and both side edges of the circuit board (15) in a width direction.
8. The electronic device packaging structure according to any one of claims 1-7, wherein the material of the injection molding package (13) is epoxy resin; the metal sputtering layer (14) is made of metal copper.
9. The electronic device package according to any one of claims 1-7, wherein the metal sputtered layers (14) are disposed on the top and sides of the injection molded package (13) facing away from the wireless network module (12); and the metal sputtering layer (14) located at the side of the injection molding package (13) covers the substrate (11).
10. A method of manufacturing the electronic device package according to any one of claims 1-9, comprising:
providing a substrate (11), the substrate (11) having a first surface and a second surface disposed opposite each other;
providing a wireless network module (12), and connecting the wireless network module (12) to the first surface of the substrate (11);
carrying out injection molding encapsulation on the wireless network module (12) by adopting an injection molding process, and forming an injection molding encapsulation body (13) around the wireless network module (12);
forming a metal sputtering layer (14) on the surface of the injection molding packaging body (13) deviating from the wireless network module (12) by adopting a sputtering process;
the second surface of the substrate (11) is connected to a circuit board (15).
11. The method of manufacturing an electronic device package according to claim 10, wherein after connecting the second surface of the substrate (11) with a circuit board (15), the method further comprises:
and filling the space between the second surface of the substrate (11) and the circuit board (15) by using thermosetting adhesive to form a thermosetting adhesive layer (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311404726.7A CN117712099A (en) | 2023-10-26 | 2023-10-26 | Electronic device packaging structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311404726.7A CN117712099A (en) | 2023-10-26 | 2023-10-26 | Electronic device packaging structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117712099A true CN117712099A (en) | 2024-03-15 |
Family
ID=90144999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311404726.7A Pending CN117712099A (en) | 2023-10-26 | 2023-10-26 | Electronic device packaging structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117712099A (en) |
-
2023
- 2023-10-26 CN CN202311404726.7A patent/CN117712099A/en active Pending
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