CN117539335A - Electronic equipment - Google Patents

Abstract

The embodiment of the application provides electronic equipment. An electronic device includes: the circuit board assembly comprises a circuit board and a heating element, wherein the heating element is arranged on the circuit board; the liquid cooling heat dissipation system is used for dissipating heat of the heating element and comprises a heat dissipation block and a heat dissipation pipeline, wherein the heat dissipation pipeline is connected with the heat dissipation block and used for circulating cooling liquid, and the part of the heat dissipation pipeline corresponding to the circuit board assembly is arranged below the circuit board assembly. In the embodiment of the application, when the liquid cooling heat dissipation system leaks, damage to electronic devices in the case such as a circuit board and a heating element can be avoided or the risk and degree of damaging the electronic devices in the case such as the circuit board and the heating element can be reduced.

Description

an electronic device

Technical field

The present application relates to the field of heat dissipation, and in particular to an electronic device.

Background technique

When electronic equipment such as servers is running, heat-generating components such as CPUs and other chips that generate large amounts of heat need to be dissipated in a targeted manner. In order to reduce energy consumption and improve heat dissipation efficiency, some server chassis adopt liquid cooling solutions (including air-liquid hybrid solutions).

In existing servers, when the liquid-cooling heat dissipation system in the liquid-cooled chassis leaks, the leaked coolant can easily damage electronic devices in the chassis, such as circuit boards and heating elements on the circuit board, causing the server to fail to work properly.

Contents of the invention

Embodiments of the present application provide an electronic device that can avoid damage to electronic devices such as circuit boards and heating elements in the chassis or reduce the risk and degree of damage to electronic devices such as circuit boards and heating elements in the chassis.

To this end, the embodiments of this application adopt the following technical solutions:

An embodiment of the present application provides an electronic device. The electronic device includes: a circuit board assembly, including a circuit board and a heating element. The heating element is disposed on the circuit board; a liquid cooling system for cooling the heating element. Heat dissipation. The heat dissipation system includes a heat dissipation block and a heat dissipation duct. The heat dissipation duct is connected to the heat dissipation block and is used to circulate cooling fluid. The heat dissipation duct corresponds to the portion of the circuit board assembly that is provided on the circuit board assembly. below. Among them, the heating element can be located above the circuit board, and the heat dissipation block can be stacked below the circuit board corresponding to the heating element and can be in contact with the circuit board; or, in order to facilitate the liquid cooling system to dissipate heat from the heating element, the heating element can be located on the circuit board. Below, the heat dissipation blocks can be correspondingly and stacked under the heating element, and can be in contact with the heating element.

In the electronic equipment of the embodiment of the present application, since the part of the heat dissipation duct of the liquid cooling system corresponding to the circuit board assembly is arranged below the circuit board assembly, that is, the circuit board assembly is set at a higher position and the heat dissipation duct is set at a lower position. Some other components can be positioned higher than the heat dissipation pipe, so that when the liquid cooling system leaks, it can avoid damage to the electronic components in the chassis, such as circuit boards and heating components, or reduce damage to the electronic components in the chassis, such as circuit boards and heating components. Risk and extent of heating elements, etc.

In a possible implementation, the heat dissipation block is disposed above the circuit board assembly, and the heat dissipation pipe includes: a first pipe section located below the circuit board assembly; and a second pipe section located on the circuit board. Outside, one end of the second pipe section is connected to the heat dissipation block, and the other end is connected to the first pipe section. That is to say, in this implementation, the heating element is arranged at the edge of the circuit board, the second pipe section can extend in the vertical direction and is located outside the circuit board, and the first pipe section is connected to the second pipe section and is located below the circuit board , thus preventing the coolant leaking from the heat dissipation pipe from dripping onto the circuit board.

In a possible implementation, the heat dissipation pipe includes a third pipe section, the third pipe section is located outside the circuit board, and the second pipe section is connected to the heat dissipation block through the third pipe section, so The extension direction of the third pipe section is parallel to the plane of the circuit board or inclined relative to the plane of the circuit board. That is to say, in this implementation, in order to facilitate the connection between the heat dissipation pipe and the heat dissipation block, the third pipe section can extend along the plane where the circuit board is located or be inclined relative to the plane where the circuit board is located, and the second pipe section is connected to the heat dissipation block through the third pipe section.

In a possible implementation, the electronic device further includes a chassis, the chassis includes an upper cover, a lower cover and a side panel, and the circuit board assembly and the liquid cooling system are disposed in the chassis. , the heat dissipation block is arranged below the circuit board assembly; the electronic device includes at least two first connectors, and the circuit board is connected to the upper cover through the at least two first connectors. That is to say, in this implementation, one way of fixing the circuit board is to connect with the upper cover. The side panels are arranged between the upper cover and the lower cover around the outer peripheral edges of the upper cover and the lower cover to form an accommodation space, and the circuit board assembly and the liquid cooling system are arranged in the accommodation space.

In a possible implementation, the first connection member includes a first support member connected to the upper cover and a first fastener detachably connected to the first support member; wherein: The first support member abuts the upper surface of the circuit board, the first fastener includes a screw or a bolt, the first fastener passes through the circuit board and is threadedly connected with the first support member; Or, the first support member is provided with a step, the first support member passes through the circuit board and the step on the first support member abuts the upper surface of the circuit board, and the first tight The fastener includes a nut, and the first fastener is threadedly connected to the first support member below the circuit board. That is to say, in this implementation, the first fastener may pass through the circuit board and be threadedly connected to the first support member, or the first support member may pass through the circuit board and be threadedly connected to the first fastener. At the same time The circuit board and the upper cover can be spaced apart, and the first support member and the first fastener cooperate with each other to limit the movement of the circuit board, making the installation position of the circuit board more stable and reliable.

In a possible implementation, the electronic device includes at least two fourth connectors, and the heat dissipation block is connected to the upper cover of the chassis of the electronic device through the at least two fourth connectors, and The heat dissipation block is spaced apart from the lower cover. That is to say, in this implementation, in order to make the installation position of the heat sink reliable and stable, the heat sink can be connected to the upper cover, and in order to prevent the heat sink from blocking the leakage from flowing at the bottom of the chassis to collect, the heat sink Can be spaced apart from the lower cover.

In a possible implementation, the fourth connection member includes a fourth support member connected to the upper cover and a fourth fastener detachably connected to the fourth support member; wherein: A fourth support member abuts the upper surface of the heat dissipation block, the fourth fastener includes a screw or a bolt, the fourth fastener passes through the heat dissipation block and is threadedly connected to the fourth support member; Or, the fourth support member is provided with a step, the fourth support member passes through the heat dissipation block and the step on the fourth support member abuts the upper surface of the heat dissipation block, and the fourth tight The fastener includes a nut, and the fourth fastener is threadedly connected to the fourth support member below the heat dissipation block. That is to say, in this implementation, the fourth fastener may pass through the heat sink block and be threadedly connected to the fourth support member, or the fourth support member may pass through the heat sink block and be threadedly connected to the fourth fastener. The heat sink block is spaced apart from the lower cover, and the fourth support member and the fourth fastener cooperate with each other to limit the movement of the heat sink block, making the installation position of the heat sink block more stable and reliable.

In a possible implementation, the electronic device includes at least two second connectors, and the circuit board is connected to the lower cover through the at least two second connectors. That is to say, in this implementation, another way to fix the circuit board is to connect it to the lower cover.

In a possible implementation, the second connection member includes a second support member connected to the lower cover and a second fastener detachably connected to the second support member; wherein: A second support member abuts the lower surface of the circuit board, the second fastener includes a screw or a bolt, the second fastener passes through the circuit board and is threadedly connected with the second support member; Or, the second support member is provided with a step, the second support member passes through the circuit board and the step on the second support member abuts the lower surface of the circuit board, and the second tight The fastener includes a nut, and the second fastener is threadedly connected to the second support member above the circuit board. That is to say, in this implementation, the second fastener may pass through the circuit board and be threadedly connected to the second support member, or the second support member may pass through the circuit board and be threadedly connected to the second fastener. At the same time The circuit board and the lower cover are spaced apart, and the second support member and the second fastener cooperate with each other to limit the movement of the circuit board, making the installation position of the circuit board more stable and reliable.

In a possible implementation, the electronic device includes at least two third connectors, and the heat dissipation block is connected to the lower cover of the chassis of the electronic device through the at least two third connectors, and The heat dissipation block is spaced apart from the lower cover. That is to say, in this implementation, in order to make the installation position of the heat sink reliable and stable, the heat sink can be connected to the lower cover, and in order to prevent the heat sink from blocking the leakage from flowing at the bottom of the chassis to collect, the heat sink Can be spaced apart from the lower cover.

In a possible implementation, the third connection member includes a third support member connected to the lower cover and a third fastener detachably connected to the third support member; wherein: A third support member abuts the lower surface of the heat dissipation block, the third fastener includes a screw or bolt, the third fastener passes through the heat dissipation block and is threadedly connected to the third support member; Or, the third support member is provided with a step, the third support member passes through the heat sink block and the step on the third support member abuts the lower surface of the heat sink block, and the third tight The fastener includes a nut, and the third fastener is threadedly connected to the third support member above the heat dissipation block. That is to say, in this implementation, the third fastener may pass through the heat sink block and be threadedly connected to the third support member, or the third support member may pass through the heat sink block and be threadedly connected to the third fastener. At the same time The heat sink block is spaced apart from the lower cover, and the third support member and the third fastener cooperate with each other to limit the movement of the heat sink block, making the installation position of the heat sink block more stable and reliable.

In a possible implementation, the electronic device includes at least two fifth connectors, the heat dissipation block is connected to the circuit board through the at least two fifth connectors, and the heat dissipation block is connected to the circuit board. Set the cover spacing as follows. That is to say, in this implementation, in order to make the installation position of the heat sink reliable and stable, the heat sink can be connected to the circuit board, and since the heating element such as a chip is connected to the circuit board and is located between the heat sink and the circuit board, When the heating element is detachably connected to the circuit board, for example, a spring is provided on the circuit board, a contact is provided on the heating element, the spring is in contact with the contact, and the heat dissipation block and the circuit board are connected through a fifth connector, so that the heating element can be connected to the circuit board. The circuit board is in reliable contact. In addition, in order to prevent the heat sink block from blocking leakage from flowing to the bottom of the chassis for collection, the heat sink block can be spaced apart from the lower cover.

In a possible implementation, the fifth connection member includes a fifth support member connected to the circuit board and a fifth fastener detachably connected to the fifth support member; wherein: the Five support members are against the upper surface of the heat dissipation block, the fifth fasteners include screws or bolts, the fifth fasteners pass through the heat dissipation block and are threadedly connected with the fifth support member; or , the fifth support member is provided with a step, the fifth support member passes through the heat sink block and the step on the fifth support member abuts the upper surface of the heat sink block, and the fifth fastening member The component includes a nut, and the fifth fastener is threadedly connected to the fifth support member below the heat dissipation block. That is to say, in this implementation, the fifth fastener may pass through the heat sink block and be threadedly connected to the fifth support member, or the fifth support member may pass through the heat sink block and be threadedly connected to the fifth fastener. At the same time, The heat sink block is spaced apart from the lower cover, and the fifth support member and the fifth fastener cooperate with each other to limit the movement of the heat sink block, making the installation position of the heat sink block more stable and reliable.

In a possible implementation, the heat dissipation block and the lower cover are made integrally. That is to say, in this implementation, in order to facilitate installation and fixation and make the structure more compact, the heat sink block can be integrally made with the lower cover.

In a possible implementation, the heat dissipation block is a hollow structure, and the heat dissipation pipe is connected to the hollow structure; or the heat dissipation block is a solid structure, and the part of the heat dissipation block away from the circuit board assembly A groove is provided on the side, and a part of the heat dissipation pipe is arranged in the groove. That is to say, in this implementation, in order to facilitate heat dissipation of the heat dissipation block, the heat dissipation block may have a hollow structure, or the heat dissipation block may have a solid structure, and the heat dissipation pipe may be disposed in the groove of the heat dissipation block.

In a possible implementation, the upper surface of the heat dissipation block of the liquid cooling system is provided with a mounting slot, and the heating element is disposed in the mounting slot; or, the electronic device further includes a mounting slot disposed on the A mounting bracket on the circuit board, and the heating element is arranged on the mounting bracket. That is to say, in this implementation, in order to reliably fix the heating element, a mounting slot can be provided on the heat sink block to install the heating element, or a mounting bracket can be provided on the circuit board to install the heating element.

Other features and advantages of the present invention will be described in detail in the following specific embodiments section.

Description of drawings

The drawings needed to be used in the description of the embodiments or the prior art are briefly introduced below.

Figure 1A is a schematic cross-sectional structural diagram of an electronic device in the main direction;

1B is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the first embodiment of the present application;

1C is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the first embodiment of the present application;

FIG. 2A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the second embodiment of the present application;

FIG. 2B is a schematic cross-sectional structural view of another electronic device in the main direction according to the second embodiment of the present application;

FIG. 2C is a schematic cross-sectional structural view of another electronic device in the main direction according to the second embodiment of the present application;

FIG. 3A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the third embodiment of the present application;

3B is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the third embodiment of the present application;

4A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the fourth embodiment of the present application;

Figure 4B is a schematic cross-sectional structural view of another electronic device in the main direction according to the fourth embodiment of the present application;

Figure 5A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the fifth embodiment of the present application;

Figure 5B is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the fifth embodiment of the present application;

Figure 6A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the sixth embodiment of the present application;

6B is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the sixth embodiment of the present application;

FIG. 7A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the seventh embodiment of the present application;

FIG. 7B is a schematic cross-sectional structural diagram of another electronic device in the front direction according to the seventh embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of this application, the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inside", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply the device or device referred to. Elements must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limitations on the application.

In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. , it can also be a conflicting connection or an integral connection; for those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

Furthermore, specific features, structures, materials, or characteristics described herein may be combined in any suitable manner in any one or more embodiments.

In order to reduce energy consumption and improve heat dissipation efficiency, some electronic equipment such as servers use liquid cooling solutions (including air-liquid hybrid solutions). Liquid cooling refers to a heat dissipation method that injects liquid into an electronic device and takes away the heat of the heating elements in the electronic device through hot and cold exchange. In terms of physical form, they are divided into cold plate liquid cooling and fully immersed liquid cooling. Among them, cold plate liquid cooling technology uses the working fluid as the medium for intermediate heat transmission to transfer heat from the hot zone to the outside of the electronic device for cooling. In this technology, the working liquid is separated from the object to be cooled. The working liquid does not directly contact the electronic devices. Instead, the heat of the object to be cooled is transferred to the refrigerant through efficient heat conduction components such as liquid cooling plates. Therefore, cold plate liquid cooling technology is also Called indirect liquid cooling technology.

In one example, the liquid cooling system may include a heat dissipation block and a heat dissipation pipe connected to the heat dissipation block. The heat sink block can be in contact with the heating element. After the heat sink block absorbs the heat, it can transfer the heat to the coolant in the heat dissipation pipe. The coolant then transfers the heat to the cooling device outside the electronic device for cooling. The cooled coolant can then pass through the heat sink. The pipeline returns to the heat sink and is again used to dissipate heat from the heating element. That is to say, through the heat dissipation block and heat dissipation pipe structure, the heat inside the server chassis can be taken away by using coolant to circulate in the heat dissipation pipe.

1A is a schematic cross-sectional structural diagram of an electronic device in the front direction. As shown in FIG. 1A , the electronic device includes a chassis 10 and a circuit board assembly 20 and a liquid cooling system 30 disposed in the chassis 10 . The chassis 10 includes an upper cover 101 , a lower cover 102 and side panels 103 . The bottom of the chassis 10 is provided with a liquid outlet C’. The circuit board assembly 20 includes a circuit board 201 and a heating element 202 provided on the circuit board 201 . The circuit board 201 is fixed to the lower cover 102 of the chassis 10 through the connector L. The liquid cooling system 30 includes a heat dissipation block 301 and a heat dissipation pipe 302. The heat dissipation block 301 is stacked above the heating element 202 and is fixed to the lower cover 102 through the connector L'. On the lower cover 102 of the chassis 10, the connector L' can pass through the circuit board 201 or pass from the outside of the circuit board 201. Among them, for the sake of clarity, the chassis 10, the circuit board 201, the heat dissipation block 301, etc. are all drawn in cross-section.

In the above solution, the circuit board 201 is fixed on the lower cover 102, the heating element 202 such as a chip is arranged on the circuit board 201, the liquid cooling system 30 is located above the circuit board assembly 20, and leakage occurs in the liquid cooling system 30 such as the heat dissipation pipe 302 At this time, the leaked coolant Q will drip on the circuit board 201, causing damage to the electronic devices in the chassis 10, such as the circuit board 201 and the heating element 202.

In view of this, embodiments of the present application provide an electronic device in which the part of the heat dissipation duct corresponding to the circuit board assembly is arranged below the circuit board assembly, that is, the circuit board assembly is set at a higher position, the heat dissipation duct is set at a lower position, and the heat dissipation duct is set at a lower position. The position of other devices can also be higher than the heat dissipation pipe. When the heat dissipation pipe leaks, it can avoid damage to the electronic devices in the chassis, such as circuit boards and heating elements, or reduce damage to the electronic devices in the chassis, such as circuit boards and heating elements. risks and extent.

FIG. 1B is a schematic cross-sectional structural diagram of an electronic device according to the first embodiment of the present application. As shown in FIG. 1B , the electronic device includes a circuit board assembly 2 and a liquid cooling system 3 . The circuit board assembly 2 includes a circuit board 21 and a heating element 22. The heating element 22 is arranged on the circuit board 21. The electronic device may be a server. The heating element 22 may be a chip. The liquid cooling system 3 is used to dissipate heat from the heating element 22. The heat dissipation system 3 includes a heat dissipation block 31 and a heat dissipation pipe 32. The heat dissipation pipe 32 is connected to the heat dissipation block 31 and is used to circulate coolant. The corresponding circuit board assembly 2 of the heat dissipation pipe 32 is located below the circuit board assembly 2.

In FIG. 1B , the heat dissipation block 31 is disposed above the circuit board assembly 2 , and the heat dissipation block 31 can be stacked on the heating element 22 . The heat dissipation pipe 32 includes a first pipe section G1 and a second pipe section G2. The first pipe section G1 is located below the circuit board assembly 2 . The second pipe section G2 is located outside the circuit board 21 , and one end of the second pipe section G2 is connected to the heat dissipation block 31 , and the other end is connected to the first pipe section G1 . That is, the heating element 22 is arranged at the edge of the circuit board 21, the second pipe section G2 can extend in the vertical direction and is located outside the circuit board 21, the first pipe section G1 is connected to the second pipe section G2 and is located below the circuit board 21, so that The cooling liquid Q leaked from the heat dissipation pipe 32 can be prevented from dripping onto the circuit board 21 .

Moreover, the electronic device may also include a chassis 1. The chassis 1 may include an upper cover 11, a lower cover 12, and a side panel 13. The circuit board assembly 2 and the liquid cooling system 3 are disposed in the chassis 1. Specifically, the side panel 13 can be disposed between the upper cover 11 and the lower cover 12 around the peripheral edges of the upper cover 11 and the lower cover 12 to form an accommodation space where the circuit board assembly 2 and the liquid cooling system 3 are disposed. within the accommodation space. In one example, the side panel 13 can be connected together with the upper cover 11 or integrally formed, and then connected with the lower cover 12 to form the chassis 1 . In another example, the side panel 13 can be connected together with the lower cover 12 or integrally formed, and then connected with the upper cover 11 to form the chassis 1 . In another example, the chassis 1 is a rectangular body, and the side panels 13 may include four side panels, and a part of the four side panels (such as two side panels that are relatively spaced apart) may be integrally formed with the upper cover 11, The other part of the four side panels (such as the other two side panels arranged at opposite intervals) can be integrally formed with the lower cover 12, and then the upper cover 11 with side panels and the lower cover 12 with side panels are assembled again. The chassis 1 is formed; or, three of the four side panels, the upper cover 11 and the lower cover 12 are first connected together or integrally formed, and then connected to the fourth side panel to form the chassis 1 .

Continuing to refer to FIG. 1B , the circuit board 21 can be fixed to the lower cover 12 of the chassis 1 through the connector L, the heat sink 31 can be fixed to the lower cover 12 of the chassis 1 through the connector L', and the connector L' can pass through the circuit board. 21 or pass through the outside of the circuit board 21. For the specific structure of the connector L, please refer to the relevant introduction of the second connector in FIGS. 6A and 6B that will be introduced below. For the specific structure of the connector L', please refer to the second connector in FIGS. 5A and 5B that will be introduced below. Related introduction of the three connectors, and the connector L′ can pass through the circuit board 21 or pass from the outside of the circuit board 21 . Furthermore, in order to facilitate draining the liquid from the bottom of the chassis 1 when the liquid cooling system 3 leaks, a liquid outlet C may be provided on the lower cover 12 or the side panel 13 close to the lower cover 12 .

1C is a schematic cross-sectional structural diagram of another electronic device in the front direction according to the first embodiment of the present application. The difference from the electronic device shown in FIG. 1B is that in FIG. 1C , the heat dissipation pipe 32 includes a third pipe section G3. The third pipe section G3 is located outside the circuit board 21. The second pipe section G2 passes through the third pipe section G3 and communicates with the heat dissipation device. The extension direction of the third pipe section G3 is parallel to the plane of the circuit board 21 or inclined relative to the plane of the circuit board 21 . By providing the third pipe section G3, the connection between the heat dissipation pipe 32 and the heat dissipation block 31 can be facilitated.

FIG. 2A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the second embodiment of the present application. As shown in FIG. 2A , the electronic device includes a circuit board assembly 2 and a liquid cooling system 3 . The circuit board assembly 2 includes a circuit board 21 and a heating element 22. The heating element 22 is arranged on the circuit board 21. The electronic device may be a server. The heating element 22 may be a chip. The liquid cooling system 3 is used to dissipate heat from the heating element 22. The heat dissipation system 3 includes a heat dissipation block 31 and a heat dissipation pipe 32. The heat dissipation pipe 32 is connected to the heat dissipation block 31 and is used to circulate cooling liquid. The heat dissipation block 31 and the heat dissipation pipe 32 are both provided. Below the circuit board assembly 2. That is, the heat dissipation pipe 32 of the liquid cooling system 3 and the metal heat dissipation block 31 in contact with the heating element 22 such as the chip can overlap with the circuit board 21 in the height direction, and are located below the circuit board 21 .

The coolant circulating in the heat dissipation pipe 32 can quickly take away a large amount of heat from the heat dissipation block 31 to achieve efficient heat dissipation of the heating element 22 such as a chip. The cooling liquid may include water and/or ethylene glycol, and of course, the cooling liquid may also be other liquids. The heat dissipation block 31 can be made of metal and can be integrally formed with the lower cover 12, which facilitates installation and fixation and makes the structure more compact.

In one example, the heat dissipation block 31 can be a hollow structure, and the heat dissipation pipe 32 is connected to the hollow structure. Specifically, the heat dissipation block 31 can be provided with a joint pipe section, the heat dissipation pipe 32 can be made of elastic material, and one end of the heat dissipation pipe 32 is sleeved on the heat dissipation pipe. On the joint pipe section of block 31, further, if the elasticity of the heat dissipation pipe 32 is relatively large, in order to prevent leakage, fasteners can also be provided on the outer periphery of one end of the heat dissipation pipe 32 to seal the connection between the heat dissipation pipe 32 and the joint pipe section. ; Moreover, in order to increase the contact area between the coolant and the heat sink 31 so as to dissipate heat from the heat sink 31 as quickly as possible, a plurality of toothed plates can be provided in the hollow structure, and the extending direction of the toothed plates can be consistent with the cooling liquid in the heat sink 31 The flow direction of the cooling fluid can be consistent, and the arrangement direction of the multiple teeth can be perpendicular to the flow direction of the coolant. In another example, the heat dissipation block 31 may be a solid structure, a groove is provided on the side of the heat dissipation block 31 away from the circuit board assembly 2 , and a part of the heat dissipation pipe 32 is disposed in the groove.

In order to reliably install the heating element 22, the upper surface of the heat dissipation block 31 of the liquid cooling system 3 can be provided with a mounting slot (not shown in the figure), and the heating element 22 is arranged in the mounting slot; alternatively, the electronic device also includes a circuit There is a mounting bracket (not shown in the figure) on the board 21, and the heating element 22 is arranged on the mounting bracket.

Continuing to refer to FIG. 2A , the electronic device also includes a chassis 1 . The chassis 1 may include an upper cover 11 , a lower cover 12 , and a side panel 13 . The circuit board assembly 2 and the liquid cooling system 3 are disposed in the chassis 1 . Regarding the specific formation method of the chassis 1, please refer to the relevant introduction in Figure 1B. In addition, in order to prevent damage to the circuit board 21 when the electronic device shakes, the circuit board 21 can be spaced apart from the upper cover 11 , and a ground terminal can be provided on the circuit board 21 , and the ground terminal can be in contact with the chassis 1 such as the upper cover 11 . Alternatively, an insulating layer may be provided between the circuit board 21 and the upper cover 11 for insulation. Furthermore, in order to facilitate draining the liquid from the bottom of the chassis 1 when the liquid cooling system 3 leaks, a liquid outlet C may be provided on the lower cover 12 or the side panel 13 close to the lower cover 12 .

In the electronic equipment of the embodiment of the present application, since the liquid cooling system 3 is arranged below the circuit board assembly 2 in the chassis 1, that is, the circuit board assembly 2 is arranged at a higher position, and the liquid cooling system 3 is arranged at a lower position. The chassis 1 The position of some other components in the chassis 1 can be higher than the liquid cooling system 3, so that when the liquid cooling system 3 leaks, damage to the electronic components in the chassis 1, such as the circuit board 21 and the heating element 22, can be avoided or reduced. The risks and extent of the electronic components in the chassis 1, such as the circuit board 21 and the heating element 22, etc.

Continuing to refer to FIG. 2A , the electronic device may include at least two first connectors L1 , and the circuit board 21 is connected to the upper cover 11 through at least two first connectors L1 . The first connection member L1 includes a first support member L11 connected to the upper cover 11 and a first fastener L12 detachably connected to the first support member L11. The first support member L11 may be against the upper surface of the circuit board 21 , the first fastener L12 may include a screw or a bolt, and the first fastener L12 passes through the circuit board 21 and is threadedly connected with the first support member L11 . At this time, the first support member L11 may be a column or a plate.

FIG. 2B is a partial cross-sectional structural schematic diagram of another electronic device provided by the second embodiment of the present application. The difference from the electronic device shown in FIG. 2A is that in FIG. 2B , a step is provided on the first support member L11 , the first support member L11 can pass through the circuit board 21 and the step on the first support member L11 abuts the circuit board 21 . The first fastener L12 may include a nut against the upper surface of the circuit board 21 , and the first fastener L12 is threadedly connected to the first support member L11 below the circuit board 21 . At this time, the first support member L11 may be a column.

That is to say, as shown in FIG. 2A , the first fastener L12 may pass through the circuit board 21 and be threadedly connected to the first support member L11 , or, as shown in FIG. 2B , the first support member L11 may pass through The circuit board 21 is threadedly connected to the first fastener L12, and in both FIG. 2A and FIG. 2B, the circuit board 21 can be spaced apart from the upper cover 11. Further, the first support member L11 and the first fastener The components L12 cooperate with each other to limit the movement of the circuit board 21, making the installation position of the circuit board 21 more stable and reliable.

Moreover, in FIGS. 2A and 2B , the heating elements 22 are both arranged below the circuit board 21 , and the heat dissipation blocks 31 correspond to the heating elements 22 and are stacked. Further, in order to facilitate the heat dissipation of the heating element 22, the heat dissipation block 31 can be in contact with the heating element 22, or the heat dissipation block 31 and the heating element 22 can be bonded through a thermally conductive interface material, that is, the thermally conductive interface material is located between the heat dissipation block 31 and the heat generating element. between elements 22. In addition, in the second embodiment and other embodiments that will be introduced below, the heating element 22 can also be disposed above the circuit board 21. The following will take the second embodiment as an example and introduce it in conjunction with FIG. 2C.

FIG. 2C is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the second embodiment of the present application. The difference from the electronic device shown in FIG. 2A is that in FIG. 2C , the heating element 22 is disposed above the circuit board 21 , the heat dissipation block 31 can be disposed below the circuit board 21 corresponding to the heating element 22 , and the heat dissipation block 31 can be contacted. The circuit board 21 is used to better dissipate heat from the heating element 22 .

FIG. 3A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the third embodiment of the present application. The difference from the electronic device shown in FIG. 2A is that in FIG. 3A , the electronic device includes at least two fourth connectors L4, and the heat dissipation block 31 is connected to the upper cover 11 through at least two fourth connectors L4. And the heat dissipation block 31 is spaced apart from the lower cover 12 . The fourth connection member L4 includes a fourth support member L41 connected to the upper cover 11 and a fourth fastener L42 detachably connected to the fourth support member L41. The fourth support member L41 may pass through the circuit board 21 or pass from the outside of the circuit board 21 to be connected with the fourth fastener L42. The fourth support member L41 abuts the upper surface of the heat dissipation block 31 , the fourth fastener L42 includes a screw or a bolt, and the fourth fastener L42 passes through the heat dissipation block 31 and is threadedly connected with the fourth support member L41 . At this time, the fourth support member L41 may be a column or a plate.

FIG. 3B is a schematic cross-sectional structural diagram of another electronic device in the main direction according to the third embodiment of the present application. The difference from the electronic device shown in Figure 2B is that in Figure 3B, the electronic device includes at least two fourth connectors L4, and the heat sink 31 is connected to the upper cover 11 through at least two fourth connectors L4. And the heat dissipation block 31 is spaced apart from the lower cover 12 . The fourth connection member L4 includes a fourth support member L41 connected to the upper cover 11 and a fourth fastener L42 detachably connected to the fourth support member L41. The fourth support member L41 is provided with a step. The fourth support member L41 passes through the heat sink 31 and the step on the fourth support member L41 abuts the upper surface of the heat sink 31. The fourth fastener L42 includes a nut. The firmware L42 is threadedly connected to the fourth support member L41 below the heat dissipation block 31 . At this time, the fourth support member L41 may be a column.

That is to say, as shown in FIG. 3A , the fourth fastener L42 may pass through the heat dissipation block 31 and be threadedly connected to the fourth support member L41 , or, as shown in FIG. 3B , the fourth support member L41 may pass through The heat dissipation block 31 is threadedly connected to the fourth fastener L42, and in both FIG. 3A and FIG. 3B, the heat dissipation block 31 can be spaced apart from the lower cover 12. Further, the fourth support member L41 and the fourth fastener The parts L42 cooperate with each other to limit the movement of the heat dissipation block 31, making the installation position of the heat dissipation block 31 more stable and reliable.

FIG. 4A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the fourth embodiment of the present application. The difference from the electronic equipment shown in FIG. 3A is that in FIG. 4A , the electronic equipment is not provided with the fourth connection member L4 . The electronic equipment includes at least two fifth connection members L5 , and the heat dissipation block 31 passes through at least two fifth connection members L5 . The connecting piece L5 is connected to the circuit board 21 , and the heat dissipation block 31 is spaced apart from the lower cover 12 . The fifth connection member L5 includes a fifth support member L51 connected to the circuit board 21 and a fifth fastener L52 detachably connected to the fifth support member L51. The fifth support member L51 abuts the upper surface of the heat dissipation block 31 , the fifth fastener L52 includes a screw or a bolt, and the fifth fastener L52 passes through the heat dissipation block 31 and is threadedly connected with the fifth support member L51 . This can make the connection between the heating element 22 and the circuit board 21 more reliable. At this time, the fifth support member L51 may be a column or a plate.

FIG. 4B is a schematic cross-sectional structural diagram of another electronic device in the front direction according to the fourth embodiment of the present application. The difference from the electronic equipment shown in FIG. 3B is that in FIG. 4B , the electronic equipment is not provided with the fourth connection member L4 , the electronic equipment includes at least two fifth connection members L5 , and the heat dissipation block 31 passes through at least two fifth connection members L5 . The connecting piece L5 is connected to the circuit board 21 , and the heat dissipation block 31 is spaced apart from the lower cover 12 . The fifth connection member L5 includes a fifth support member L51 connected to the circuit board 21 and a fifth fastener L52 detachably connected to the fifth support member L51. The fifth support member L51 is provided with a step. The fifth support member L51 passes through the heat sink 31 and the step on the fifth support member L51 abuts the upper surface of the heat sink 31. The fifth fastener L52 includes a nut. The firmware L52 is threadedly connected to the fifth support member L51 below the heat dissipation block 31 . At this time, the fifth support member L51 may be a column.

That is to say, as shown in FIG. 4A , the fifth fastener L52 may pass through the heat dissipation block 31 and be threadedly connected to the fifth support member L51 , or, as shown in FIG. 4B , the fifth support member L51 may pass through The heat dissipation block 31 is threadedly connected to the fifth fastener L52, and in both FIG. 4A and FIG. 4B, the heat dissipation block 31 can be spaced apart from the lower cover 12. Further, the fifth support member L51 and the fifth fastener The parts L52 cooperate with each other to limit the movement of the heat sink 31, making the installation position of the heat sink 31 more stable and reliable.

In addition, in other embodiments, the fourth connector L4 as shown in FIG. 3A can also be provided on the basis of the electronic device shown in FIG. 4A , so that the heat dissipation block 31 is not only connected to the circuit board 21 through the fifth connector L5 , and is connected to the upper cover 11 through the fourth connecting member L4; or, if necessary, the heat dissipation block 31 can also be fixedly connected to the circuit board 21 and the upper cover 11 through the same connecting member. Correspondingly, in other embodiments, the fourth connector L4 shown in FIG. 3B can also be provided on the basis of the electronic device shown in FIG. 4B , so that the heat dissipation block 31 not only communicates with the circuit board 21 through the fifth connector L5 connection, and at the same time fixed to the upper cover 11 through the fourth connecting member L4; or, if necessary, the heat sink 31 can also be fixedly connected to the circuit board 21 and the upper cover 11 through the same connecting member.

FIG. 5A is a schematic cross-sectional structural diagram of an electronic device in the main direction according to the fifth embodiment of the present application. The difference from the electronic device shown in FIG. 2A is that in FIG. 5A , the electronic device includes at least two third connectors L3, and the heat dissipation block 31 is connected to the lower cover 12 through at least two third connectors L3. And the heat dissipation block 31 is spaced apart from the lower cover 12 . The third connection member L3 includes a third support member L31 connected to the lower cover 12 and a third fastener L32 detachably connected to the third support member L31. The third support member L31 abuts the lower surface of the heat dissipation block 31 . The third fastener L32 includes screws or bolts. The third fastener L32 passes through the heat dissipation block 31 and is threadedly connected with the third support member L31 . Among them, the third support member L31 can be a column or a plate.

FIG. 5B is a schematic cross-sectional structural diagram of another electronic device in the front direction according to the fifth embodiment of the present application. The difference from the electronic device shown in Figure 2B is that in Figure 5B, the electronic device includes at least two third connectors L3, and the heat dissipation block 31 is connected to the lower cover 12 through at least two third connectors L3. And the heat dissipation block 31 is spaced apart from the lower cover 12 . The third connection member L3 includes a third support member L31 connected to the lower cover 12 and a third fastener L32 detachably connected to the third support member L31. The third support member L31 is provided with a step. The third support member L31 passes through the heat sink 31 and the step on the third support member L31 abuts the lower surface of the heat sink 31. The third fastener L32 includes a nut. The firmware L32 is threadedly connected to the third support member L31 above the heat dissipation block 31 . Wherein, the third support member L31 may be a column.

That is to say, as shown in FIG. 5A , the third fastener L32 may pass through the heat dissipation block 31 and be threadedly connected to the third support member L31 , or, as shown in FIG. 5B , the third support member L31 may pass through The heat dissipation block 31 is threadedly connected to the third fastener L32, and in both FIG. 5A and FIG. 5B, the heat dissipation block 31 can be spaced apart from the lower cover 12. Further, the third support member L31 and the third fastener The parts L32 cooperate with each other to limit the movement of the heat dissipation block 31, making the installation position of the heat dissipation block 31 more stable and reliable.

In addition, in the electronic equipment shown in FIGS. 5A and 5B , the heat dissipation block 31 is fixed to the lower cover 12 and the circuit board 21 is fixed to the upper cover 11 , which facilitates assembly and maintenance, for example, when the circuit board 21 needs to be repaired. During processing, there is no need to disassemble the liquid cooling system 3; moreover, the heat dissipation block 31 is spaced apart from the lower cover 12 through the third connector L3, so that the leaked coolant can be easily collected so that it can be discharged from the chassis 1 through the liquid outlet C.

FIG. 6A is a schematic cross-sectional structural view of an electronic device in the main direction according to the sixth embodiment of the present application. The difference from the electronic device shown in FIG. 2A is that in FIG. 6A , the electronic device is not provided with a first connector L1 , the electronic device includes at least two second connectors L2 , and the circuit board 21 passes through at least two second connectors L2 . The connecting piece L2 is connected to the lower cover 12 . The second connection member L2 includes a second support member L21 connected to the lower cover 12 and a second fastener L22 detachably connected to the second support member L21; the second support member L21 abuts the lower surface of the circuit board 21, The second fastener L22 includes a screw or a bolt, and the second fastener L22 passes through the circuit board 21 and is threadedly connected with the second support member L21. Among them, the second supporting member L21 can be a column or a plate.

FIG. 6B is a schematic cross-sectional structural view of another electronic device in the main direction according to the sixth embodiment of the present application. The difference from the electronic device shown in FIG. 2B is that in FIG. 6B , the electronic device is not provided with a first connector L1. The electronic device includes at least two second connectors L2. The circuit board 21 passes through at least two second connectors L2. The connecting piece L2 is connected to the lower cover 12 . The second connection member L2 includes a second support member L21 connected to the lower cover 12 and a second fastener L22 detachably connected to the second support member L21. The second support member L21 is provided with a step. The second support member L21 passes through the circuit board 21 and the step on the second support member L21 abuts the lower surface of the circuit board 21. The second fastener L22 includes a nut. The firmware L22 is threadedly connected to the second support member L21 above the circuit board 21 . Wherein, the second support member L21 may be a column.

That is to say, as shown in FIG. 6A , the second fastener L22 may pass through the circuit board 21 and be threadedly connected to the second support member L21 , or, as shown in FIG. 6B , the second support member L21 may pass through The circuit board 21 is threadedly connected to the second fastener L22, and, in FIGS. 6A and 6B , the second support member L21 and the second fastener L22 cooperate with each other to limit the movement of the circuit board 21 so that the circuit board 21 The installation position is more stable and reliable.

FIG. 7A is a schematic cross-sectional structural view of an electronic device in the main direction according to the seventh embodiment of the present application. The difference from the electronic device shown in FIG. 6A is that in FIG. 7A , the electronic device includes at least two third connectors L3, and the heat dissipation block 31 is spaced apart from the lower cover 12 through at least two third connectors L3. , and, regarding the specific structure of the third connecting member L3, please refer to the relevant introduction in Figure 5A. In addition, if necessary, the third connecting member L3 in Figure 7A can also adopt the structure in Figure 5B.

FIG. 7B is a schematic cross-sectional structural diagram of another electronic device in the front direction according to the seventh embodiment of the present application. The difference from the electronic device shown in FIG. 6B is that in FIG. 7B , the electronic device includes at least two third connectors L3 , and the heat dissipation block 31 is spaced apart from the lower cover 12 through at least two third connectors L3 . , and, for the specific structure of the third connecting member L3, please refer to the relevant introduction in Figure 5B. In addition, if necessary, the third connecting member L3 in Figure 7B can also adopt the structure in Figure 5A.

Among them, when the liquid cooling system 3 is arranged below the circuit board assembly 2: if the liquid cooling system 3 is lighter, the liquid cooling system 3 can only be fixedly connected to the circuit board 21; if the liquid cooling system 3 is heavy , the liquid cooling system 3 can be fixedly connected to the upper cover 11 or the lower cover 12 . Moreover, when the liquid cooling heat dissipation system 3 is connected to the upper cover 11, it can also be connected to the circuit board 21. At this time, the liquid cooling heat dissipation system 3 can use the same connector to connect to the upper cover 11 and the circuit board 21; Alternatively, the liquid cooling system 3 can be connected to the upper cover 11 and the circuit board 21 through two connecting pieces respectively. When the liquid cooling system 3 is connected to the lower cover 12, it can also be connected to the circuit board 21. At this time, the liquid cooling system 3 can use the same connector to connect to the lower cover 12 and the circuit board 21; or, The liquid cooling system 3 can be connected to the lower cover 12 and the circuit board 21 through two connecting pieces respectively.

To sum up, for a chassis that uses liquid cooling, the circulating liquid in the liquid cooling system will cause a short circuit and must be enclosed in the pipeline and cannot come into contact with electronic devices on the circuit board. In this application, the part of the heat dissipation pipe corresponding to the circuit board assembly is arranged below the circuit board assembly. In this way, when the liquid cooling system leaks, the liquid drips downward and does not fall on the circuit board, thereby avoiding damage to the circuit board and greatly improving the efficiency of the circuit board. Improves reliability; at the same time, it facilitates the leaked coolant to flow into the chassis for interception or diversion treatment.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the foregoing. The technical solutions described in each embodiment may be modified, or some of the technical features may be equivalently replaced; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions in each embodiment of the present application.

Claims (10)

1. An electronic device, comprising:

a circuit board assembly (2) comprising a circuit board (21) and a heating element (22), the heating element (22) being arranged on the circuit board (21);

The liquid cooling heat dissipation system (3) is used for dissipating heat of the heating element (22), the heat dissipation system (3) comprises a heat dissipation block (31) and a heat dissipation pipeline (32), the heat dissipation pipeline (32) is connected with the heat dissipation block (31) and used for circulating cooling liquid, and a part of the heat dissipation pipeline (32) corresponding to the circuit board assembly (2) is arranged below the circuit board assembly (2).

2. The electronic device according to claim 1, characterized in that the heat dissipating block (31) is arranged above the circuit board assembly (2), the heat dissipating conduit (32) comprising:

a first tube section (G1) located below the circuit board assembly (2);

and the second pipe section (G2) is positioned at the outer side of the circuit board (21), one end of the second pipe section (G2) is connected with the radiating block (31), and the other end of the second pipe section is connected with the first pipe section (G1).

3. The electronic device according to claim 2, wherein the heat dissipation pipe (32) comprises a third pipe section (G3), the third pipe section (G3) is located at the outer side of the circuit board (21), the second pipe section (G2) is connected with the heat dissipation block (31) through the third pipe section (G3), and an extending direction of the third pipe section (G3) is parallel to a plane where the circuit board (21) is located or inclined relative to the plane where the circuit board (21) is located.

4. The electronic device according to claim 1, further comprising a chassis (1), the chassis (1) comprising an upper cover plate (11), a lower cover plate (12) and side panels (13), the circuit board assembly (2) and the liquid-cooled heat dissipation system (3) being disposed within the chassis (1), the heat dissipation block (31) being disposed below the circuit board assembly (2); the electronic device comprises at least two first connecting pieces (L1), and the circuit board (21) is connected with the upper cover plate (11) through the at least two first connecting pieces (L1).

5. The electronic device according to claim 4, characterized in that said first connection (L1) comprises a first support (L11) connected to said upper cover plate (11) and a first fastener (L12) removably connected to said first support (L11); wherein:

the first supporting piece (L11) is abutted against the upper surface of the circuit board (21), the first fastening piece (L12) comprises a screw or a bolt, and the first fastening piece (L12) penetrates through the circuit board (21) and is in threaded connection with the first supporting piece (L11); or alternatively, the first and second heat exchangers may be,

the circuit board is characterized in that a step is arranged on the first supporting piece (L11), the first supporting piece (L11) penetrates through the circuit board (21) and the step on the first supporting piece (L11) abuts against the upper surface of the circuit board (21), the first fastening piece (L12) comprises a nut, and the first fastening piece (L12) is in threaded connection with the first supporting piece (L11) below the circuit board (21).

6. The electronic device according to any one of claims 1, 4 and 5, characterized in that the electronic device comprises at least two third connectors (L3), the heat sink (31) is connected with a lower cover plate (12) of a chassis (1) of the electronic device by the at least two third connectors (L3), and the heat sink (31) is arranged at a distance from the lower cover plate (12).

7. The electronic device according to claim 6, characterized in that said third connection (L3) comprises a third support (L31) connected to said lower cover plate (12) and a third fastener (L32) removably connected to said third support (L31); wherein:

the third supporting piece (L31) is abutted against the lower surface of the radiating block (31), the third fastening piece (L32) comprises a screw or a bolt, and the third fastening piece (L32) penetrates through the radiating block (31) and is in threaded connection with the third supporting piece (L31); or alternatively, the first and second heat exchangers may be,

the third support (L31) is provided with a step, the third support (L31) penetrates through the radiating block (31) and the step on the third support (L31) abuts against the lower surface of the radiating block (31), the third fastener (L32) comprises a nut, and the third fastener (L32) is in threaded connection with the third support (L31) above the radiating block (31).

8. Electronic device according to claim 4 or 5, characterized in that the heat sink (31) is made in one piece with the lower cover plate (12).

9. The electronic device of any one of claims 1-8, wherein:

the radiating block (31) is of a hollow structure, and the radiating pipeline (32) is communicated with the hollow structure; or alternatively, the first and second heat exchangers may be,

the heat dissipation block (31) is of a solid structure, a groove is formed in the side face, far away from the circuit board assembly (2), of the heat dissipation block (31), and a part of the heat dissipation pipeline (32) is arranged in the groove.

10. The electronic device of any one of claims 1-9, wherein:

the upper surface of a radiating block (31) of the liquid cooling radiating system (3) is provided with a mounting groove, and the heating element (22) is arranged in the mounting groove; or alternatively, the first and second heat exchangers may be,

the electronic device further comprises a mounting bracket arranged on the circuit board (21), and the heating element (22) is arranged on the mounting bracket.