CN117487489A - Underfill with high stretching rate, preparation method thereof and chip packaging structure - Google Patents
Underfill with high stretching rate, preparation method thereof and chip packaging structure Download PDFInfo
- Publication number
- CN117487489A CN117487489A CN202311467231.9A CN202311467231A CN117487489A CN 117487489 A CN117487489 A CN 117487489A CN 202311467231 A CN202311467231 A CN 202311467231A CN 117487489 A CN117487489 A CN 117487489A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- underfill
- mass
- chip
- polyether modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 75
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 75
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 26
- 229920000570 polyether Polymers 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000006229 carbon black Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 18
- 150000001412 amines Chemical class 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 abstract description 15
- 238000004132 cross linking Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 208000007254 Tetrasomy X Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101150091203 Acot1 gene Proteins 0.000 description 1
- 102100025854 Acyl-coenzyme A thioesterase 1 Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides an underfill with high stretching rate, a preparation method thereof and a chip packaging structure, which belong to the technical field of underfill packaging, wherein the underfill comprises the following components in percentage by mass: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin; the stretching rate and the glass transition temperature of the epoxy resin are changed by adjusting the proportion between the tetrafunctional epoxy resin and the polyether modified epoxy resin, and the underfill has high stretching rate, high glass transition temperature and excellent fluidity, so that the reliability and the service life of the packaged chip are effectively ensured.
Description
Technical Field
The invention belongs to the technical field of underfill packaging, and particularly relates to an underfill with high stretching rate, a preparation method thereof and a chip packaging structure.
Background
The underfill is an underfill glue for underfill, which is required to have a fast flow property, and can fill a narrow gap between a chip and a substrate well under an applicable temperature condition, thereby achieving the effect of packaging and protecting the chip. The chip can generate a large amount of heat during working, so that the temperature of the electronic element is increased, the circuit is easy to be out of control under the action of external force, and the service life of the electronic product is influenced, so that the underfill is required to have higher glass transition temperature, and the reliability of the packaging element is ensured; the underfill is prone to cracking during high and low temperature cycle testing to affect packaging effects, so that the underfill needs to have a high stretching rate and good flowability.
Therefore, how to provide an underfill with high elongation, which has a higher glass transition temperature and better fluidity to enhance the protection effect on the chip is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The present invention is directed to an underfill having a high elongation, a method for manufacturing the underfill, and a chip package structure for solving at least one of the above-mentioned problems.
To achieve the above object, the first aspect of the present invention provides an underfill having a high elongation, the underfill comprising the following components in mass percent: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin.
In the first aspect, the mass percentage of the tetrafunctional resin epoxy resin is 15% -20%, the mass percentage of the polyether modified epoxy resin is 10% -16%, and the mass percentage of the carbon black is 0.2% -0.3%.
In a first aspect, the tetrafunctional epoxy resin includes At least one of them.
In a first aspect, the polyether modified epoxy resin has the structural formula:
in a first aspect, the filler comprises silica.
In a first aspect, the curing agent comprises an amine curing agent; the amine curing agent comprises at least one of 4, 4-diamino diphenyl sulfone and 3, 3-diethyl-4, 4-diamino diphenyl methane.
In a first aspect, the accelerator comprises an amine accelerator; the amine promoter comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol and o-hydroxybenzyl dimethylamine.
In a second aspect, the present invention provides a method for preparing an underfill having a high elongation as described in the first aspect, comprising: s1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; s2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry; s3: and carrying out vacuum defoaming on the second slurry to obtain the underfill.
In the second aspect, the epoxy resin comprises a tetrafunctional epoxy resin and a polyether modified epoxy resin, the tetrafunctional epoxy resin is 15% -20% by mass, the polyether modified epoxy resin is 10% -16% by mass, and the carbon black is 0.2% -0.3% by mass.
The third aspect of the invention provides a chip packaging structure, comprising a substrate, a chip arranged on the substrate, and a plurality of welding convex points arranged between the substrate and the chip and electrically connected with the substrate and the chip at intervals, wherein a gap is formed between the substrate and the chip, and the glue solution of the underfill with high stretching rate according to the first aspect is arranged at the edge of the substrate, so that the glue solution of the underfill flows from one end of the gap to the other end of the gap through capillary action to fill the gap; curing the glue solution of the underfill at 165 ℃ for 2 hours; and after the solidification is finished, obtaining the chip packaging structure.
The beneficial effects are that:
the invention provides an underfill with high stretching rate, which comprises the following components in percentage by mass: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin; the four-functional epoxy resin has the advantages that the molecular structure of the four-functional epoxy resin contains alicyclic rings and a plurality of epoxy groups, more crosslinking points can be provided during curing, the three-dimensional network structure with higher crosslinking density is easy to form, and the movement between molecular chains is more limited, so that the heat resistance, the mechanical strength and the glass transition temperature of a cured product are good; the polyether modified epoxy resin has more methylene, ether bond and other flexible groups in the molecular structure, the flexible chain segment can be bonded into a compact epoxy resin crosslinking network, microscopic phase separation is generated in the curing process to form a compact phase and loose phase-to-phase two-phase network structure, the toughness of an epoxy resin cured product is improved, the chain length of the structural molecule is long, the branch structure is few, the material stretching rate is increased, and the underfill with high stretching rate and high glass transition temperature is obtained by adjusting the proportion between the four-functional epoxy resin and the polyether modified epoxy resin, so that the chip protection effect is improved.
Drawings
In order to more clearly illustrate the embodiments of the present description or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a method for preparing an underfill with a high elongation.
Detailed Description
The advantages and various effects of the present invention will be more clearly apparent from the following detailed description and examples. It will be understood by those skilled in the art that these specific embodiments and examples are intended to illustrate the invention, not to limit the invention.
Throughout the specification, unless specifically indicated otherwise, the terms used herein should be understood as meaning as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification will control.
Unless specifically indicated otherwise, the various raw materials, reagents, instruments, equipment, etc., used in the present invention are commercially available or may be obtained by existing methods.
The application provides an underfill of high tensile rate, the underfill includes following components according to mass percent: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin.
The invention provides an underfill with high stretching rate, which comprises the following components in percentage by mass: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin; the four-functional epoxy resin has the advantages that the molecular structure of the four-functional epoxy resin contains alicyclic rings and a plurality of epoxy groups, more crosslinking points can be provided during curing, the three-dimensional network structure with higher crosslinking density is easy to form, and the movement between molecular chains is more limited, so that the heat resistance, the mechanical strength and the glass transition temperature of a cured product are good; the polyether modified epoxy resin has more methylene, ether bond and other flexible groups in the molecular structure, the flexible chain segment can be bonded into a compact epoxy resin crosslinking network, microscopic phase separation is generated in the curing process to form a compact phase and loose phase-to-phase two-phase network structure, the toughness of an epoxy resin cured product is improved, the chain length of the structural molecule is long, the branch structure is few, the material stretching rate is increased, and the underfill with high stretching rate and high glass transition temperature is obtained by adjusting the proportion between the four-functional epoxy resin and the polyether modified epoxy resin, so that the chip protection effect is improved.
In some possible embodiments, the mass percent of the tetrafunctional resin epoxy is 15% -20%, the mass percent of the polyether modified epoxy is 10% -16%, and the mass percent of the carbon black is 0.2% -0.3%.
In some possible embodiments, the tetrafunctional epoxy includes At least one of them.
The tetrafunctional group is used as a material matrix, and can provide adhesive property and mechanical property for the underfill. Tetrafunctional epoxy resins are commercially available, for example: tetra-X and tetra-C produced by Mitsubishi gas of Japan, wherein the tetra-X has the structural formula:the structural formula of tetra D-C is:
in some possible embodiments, the polyether modified epoxy resin has the structural formula:
the polyether modified epoxy resin is used as a material matrix, and can provide adhesive property and mechanical property for the underfill. Polyether modified epoxy resins are commercially available, for example: nanjing Yuehai material YLSE-2000.
In some possible embodiments, the filler comprises silica.
Silica as an inorganic filler can reduce the thermal expansion coefficient of the cured product and change the material modulus.
In some possible embodiments, the curing agent comprises an amine curing agent; the amine curing agent comprises at least one of 4, 4-diamino diphenyl sulfone and 3, 3-diethyl-4, 4-diamino diphenyl methane.
The curing agent reacts with the trifunctional epoxy resin under the action of a certain temperature and an accelerator, and the curing reaction generates a thermosetting compound with a three-dimensional network structure. The curing agent may be an amine curing agent, which is commercially available, for example: 4, 4-diamino diphenyl sulfone of Shandong new kinetic energy chemistry, 3-diethyl-4, 4-diamino diphenyl methane of Hubei Tesco chemical industry and SH-3710F of Nanjing Yuehui new material.
In some possible embodiments, the accelerator comprises an amine accelerator; the amine promoter comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol and o-hydroxybenzyl dimethylamine.
The accelerator can accelerate the crosslinking reaction rate, reduce the curing time and improve the production efficiency; preferably, the accelerator is an amine accelerator.
Based on a general inventive concept, the present application also provides a method for preparing the underfill having a high elongation according to the first aspect, wherein the method comprises:
s1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; wherein, the stirring and mixing time is 95-185s, the rotation is 1150r/min, and the revolution is 1420r/min;
s2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry; wherein, the feeding gap in the three-roller grinder is 15-45 μm, and the discharging gap is 5-20 μm;
s3: and (3) carrying out vacuum defoaming on the second slurry to obtain the underfill, wherein the vacuum defoaming is carried out in a centrifugal mixer, the time of vacuum defoaming is 60-90s, and the rotation is 1150r/min and the revolution is 1420r/min.
As another alternative embodiment, the epoxy resin includes a tetrafunctional epoxy resin and a polyether modified epoxy resin, the tetrafunctional epoxy resin having a mass percentage of 15% -20%, the polyether modified epoxy resin having a mass percentage of 10% -16%, and the carbon black having a mass percentage of 0.2% -0.3%.
Based on one general inventive concept, the present application further provides a chip package structure, including a substrate, a chip disposed on the substrate, and a plurality of spaced solder bumps disposed between and electrically connected to the substrate and the chip, wherein a gap is formed between the substrate and the chip:
disposing a glue solution of the high-elongation underfill according to the first aspect at an edge of the substrate such that the glue solution of the underfill flows from one end of the gap to the other end of the gap by capillary action to fill the gap;
curing the glue solution of the underfill at 165 ℃ for 2 hours;
and after the solidification is finished, obtaining the chip packaging structure.
The present application is further illustrated below in conjunction with specific examples. It should be understood that these examples are illustrative only of the present application and are not intended to limit the scope of the present application. The experimental procedures, which are not specified in the following examples, are generally determined according to national standards. If the corresponding national standard does not exist, the method is carried out according to the general international standard, the conventional condition or the condition recommended by the manufacturer.
The underfill compositions of comparative examples 1-4 and examples 1-3 are shown in Table 1 below in mass percent:
TABLE 1 mass percent of raw material components
The underfill adhesives provided in examples 1-3 and comparative examples 1-4 were tested for storage modulus, glass transition temperature, coefficient of thermal expansion, elongation/tensile strength, and flowability as follows:
1. storage modulus: reference standard: ASTM E2254-2018, taking a sample cured at 165℃for 2 hours to complete, preparing test samples of dimensions 55mm 10mm 2mm, measuring with DMA, measuring mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10 μm, rate of temperature rise: 5 ℃/min; the energy storage modulus is measured at 25-245 ℃.
2. Glass transition temperature Tg: reference standard: ASTM E2254-2018, taking a sample cured at 165℃for 2 hours to complete, preparing test samples of dimensions 55mm 10mm 2mm, measuring with DMA, measuring mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10 μm, rate of temperature rise: 5 ℃/min.
3. Coefficient of thermal expansion: reference standard ASTM E831-2019, samples were prepared with dimensions 5mm by 2mm, at 165℃for 2 hours to cure the samples completely. Samples were tested for coefficient of thermal expansion using TMA (compression mode). Parameter setting of TMA: preloading force: 0.05N, first scan: room temperature-220 ℃ (heating rate 10 ℃/min); second scan: taking curve data of a second heating segment at room temperature-220 ℃ (heating rate 10 ℃/min); the coefficient of expansion CTE1/2 takes on values of 50℃to 90℃and 160℃to 200℃respectively.
4. Elongation/tensile strength: the measurement was performed by DMA, 165℃was used, and a sample was prepared in which the dimensions of the test sample were 12 mm. Times.3 mm. Times.0.1 to 0.3 mm, and the measurement mode was: DMAControlled Force the force is 5N/min up to 18N.
5. The fluidity test method comprises the following steps: four corners of a square glass sheet with the thickness of 20mm multiplied by 20mm and the thickness of 0.5mm are stuck on a glass slide by using double-sided adhesive with the thickness of 50um, the glass slide is placed on an electric heating plate with the temperature of 90 ℃, the glass slide is preheated for three minutes, the underfill to be measured is transversely smeared along one edge of the square glass sheet by adopting a thin steel needle, and simultaneously, the timing is started, the underfill can flow at the bottom of the glass sheet in a casting way under the action of capillary force, and the time from flowing to half the length of the edge and the time when the underfill flows are recorded.
The test results are shown in table 2 below:
table 2 test results
From the above table, it can be seen that:
(1) In the comparative example 1, only tetra D-C is added, the alicyclic structure of the tetra D-C leads to poor chain segment movement capability, the brittleness of the material is increased, and the stretching rate is low; the epoxy resin with four functional groups has high epoxy value, can provide more crosslinking points during curing to form a compact three-dimensional network structure, and has good heat resistance and high glass transition temperature; the prepared glue solution of the bottom filling glue is transversely smeared along one edge of a square glass sheet, the glue solution is cast at the bottom of the glass sheet under the action of capillary force, 86s is used when the casting is carried out to 10mm, 387s is used when the casting is carried out to 20mm, and the fluidity of the glue solution is poor;
(2) In comparative example 2, only YLSE-2000 is added, and ether bonds, methylene and the like in the molecular structure increase the flexibility of a molecular chain, so that the underfill has high elongation, low glass transition temperature and poor fluidity;
(3) Comparative examples 3-4 added tetra-C and YLSE-2000 at the same time, but the amount of epoxy resin added was not within the specified percentage range, and the underfill properties obtained were general;
(4) Examples 1-3 to which tetra d-C and YLSE-2000 were added, the amount of epoxy resin used was in the optimum range, which had a high elongation, a high glass transition temperature and excellent fluidity as compared with comparative examples 1-4.
In summary, the raw material components adopt the underfill configured in the specified range of the application, and the ratio of the tetrafunctional epoxy resin and the polyether modified epoxy resin is adjusted in the fixed range, so as to adjust the glass transition temperature and the stretching rate of the underfill, synchronously improve the fluidity of the underfill, prevent the underfill from cracking after solidification and not protecting the chip, i.e. the application provides the underfill with high stretching rate, high glass transition temperature and excellent fluidity, which is beneficial to improving the protection effect on the chip.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. The underfill with the high stretching rate is characterized by comprising the following components in percentage by mass: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black; the epoxy resin comprises tetrafunctional epoxy resin and polyether modified epoxy resin.
2. The high elongation underfill according to claim 1, wherein the mass percent of the tetrafunctional resin epoxy resin is 15% -20%, the mass percent of the polyether modified epoxy resin is 10% -16%, and the mass percent of the carbon black is 0.2% -0.3%.
3. The high elongation underfill of claim 2, wherein the tetrafunctional epoxy comprisesAt least one of them.
4. The high elongation underfill according to claim 3, wherein the polyether modified epoxy resin has the structural formula:
5. the high elongation underfill of claim 4, wherein the filler comprises silica.
6. The high elongation underfill according to claim 5, wherein the curing agent comprises an amine-based curing agent; the amine curing agent comprises at least one of 4, 4-diamino diphenyl sulfone and 3, 3-diethyl-4, 4-diamino diphenyl methane.
7. The high elongation underfill of claim 5, wherein the accelerator comprises an amine accelerator; the amine promoter comprises at least one of 2,4, 6-tris (dimethylaminomethyl) phenol and o-hydroxybenzyl dimethylamine.
8. A method of preparing the high elongation underfill according to any one of claims 1-7, comprising:
s1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 26-36% of epoxy resin, 52-59% of filler, 9-18% of curing agent, 0.3-0.5% of accelerator and 0.1-0.3% of carbon black;
s2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry;
s3: and carrying out vacuum defoaming on the second slurry to obtain the underfill.
9. The preparation method according to claim 8, wherein the epoxy resin comprises a tetrafunctional epoxy resin and a polyether modified epoxy resin, the tetrafunctional epoxy resin is 15-20% by mass, the polyether modified epoxy resin is 10-16% by mass, and the carbon black is 0.2-0.3% by mass.
10. A chip packaging structure comprises a substrate, a chip arranged on the substrate, and a plurality of welding convex points arranged between the substrate and the chip and electrically connected with the substrate and the chip at intervals, wherein a gap is formed between the substrate and the chip,
disposing a glue solution of the high elongation underfill of any one of claims 1-7 at an edge of the substrate such that the glue solution of the underfill flows from one end of the gap to the other end of the gap by capillary action to fill the gap;
curing the glue solution of the underfill at 165 ℃ for 2 hours;
and after the solidification is finished, obtaining the chip packaging structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311467231.9A CN117487489B (en) | 2023-11-03 | 2023-11-03 | Underfill with high stretching rate, preparation method thereof and chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311467231.9A CN117487489B (en) | 2023-11-03 | 2023-11-03 | Underfill with high stretching rate, preparation method thereof and chip packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117487489A true CN117487489A (en) | 2024-02-02 |
| CN117487489B CN117487489B (en) | 2024-08-16 |
Family
ID=89668602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311467231.9A Active CN117487489B (en) | 2023-11-03 | 2023-11-03 | Underfill with high stretching rate, preparation method thereof and chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117487489B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117801745A (en) * | 2024-02-28 | 2024-04-02 | 武汉市三选科技有限公司 | Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105907040A (en) * | 2016-06-14 | 2016-08-31 | 航天材料及工艺研究所 | Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof |
| CN109439254A (en) * | 2018-10-31 | 2019-03-08 | 深圳广恒威科技有限公司 | A kind of reworkable high reliability filling glue |
| CN112457807A (en) * | 2020-11-14 | 2021-03-09 | 烟台德邦科技股份有限公司 | Preparation method of chip-level underfill material with excellent thermal stability |
| CN113056519A (en) * | 2018-11-14 | 2021-06-29 | 长濑化成株式会社 | Curable resin composition and curable sheet |
| CN114045137A (en) * | 2022-01-12 | 2022-02-15 | 武汉市三选科技有限公司 | Panel driving circuit bottom filling adhesive, preparation method thereof and chip packaging structure |
| JP2022060062A (en) * | 2020-10-02 | 2022-04-14 | 昭和電工マテリアルズ株式会社 | Epoxy resin composition and electronic component device |
| CN116741648A (en) * | 2023-08-11 | 2023-09-12 | 四川遂宁市利普芯微电子有限公司 | Flip chip packaging method and flip chip packaging structure |
| US20230295415A1 (en) * | 2020-11-26 | 2023-09-21 | Wuhan Choice Technology Co., Ltd. | High-glossiness epoxy molding compound (emc) film for protecting chip and preparation method thereof |
-
2023
- 2023-11-03 CN CN202311467231.9A patent/CN117487489B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105907040A (en) * | 2016-06-14 | 2016-08-31 | 航天材料及工艺研究所 | Epoxy resin composition suitable for being adopted at low temperature and preparation method thereof |
| CN109439254A (en) * | 2018-10-31 | 2019-03-08 | 深圳广恒威科技有限公司 | A kind of reworkable high reliability filling glue |
| CN113056519A (en) * | 2018-11-14 | 2021-06-29 | 长濑化成株式会社 | Curable resin composition and curable sheet |
| JP2022060062A (en) * | 2020-10-02 | 2022-04-14 | 昭和電工マテリアルズ株式会社 | Epoxy resin composition and electronic component device |
| CN112457807A (en) * | 2020-11-14 | 2021-03-09 | 烟台德邦科技股份有限公司 | Preparation method of chip-level underfill material with excellent thermal stability |
| US20230295415A1 (en) * | 2020-11-26 | 2023-09-21 | Wuhan Choice Technology Co., Ltd. | High-glossiness epoxy molding compound (emc) film for protecting chip and preparation method thereof |
| CN114045137A (en) * | 2022-01-12 | 2022-02-15 | 武汉市三选科技有限公司 | Panel driving circuit bottom filling adhesive, preparation method thereof and chip packaging structure |
| CN116741648A (en) * | 2023-08-11 | 2023-09-12 | 四川遂宁市利普芯微电子有限公司 | Flip chip packaging method and flip chip packaging structure |
Non-Patent Citations (2)
| Title |
|---|
| （美）拉奥•R.图马拉著；李晨等译: "《半导体与集成电路关键技术丛书 器件和系统封装技术与应用》", vol. 2, 30 June 2021, 机械工业出版社, pages: 357 - 358 * |
| 李子东等: "《胶黏剂助剂》", vol. 2, 30 June 2009, 化学工业出版社, pages: 428 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117801745A (en) * | 2024-02-28 | 2024-04-02 | 武汉市三选科技有限公司 | Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure |
| CN117801745B (en) * | 2024-02-28 | 2024-05-31 | 武汉市三选科技有限公司 | Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117487489B (en) | 2024-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20020058778A1 (en) | Toughened thermosetting resin compositions useful as underfill sealants | |
| TW201836027A (en) | Method for manufacturing semiconductor apparatus | |
| TWI667737B (en) | Semiconductor device manufacturing method and semiconductor device | |
| CN106084184B (en) | Composition, epoxy resin curing agent, epoxy resin composition, thermosetting composition, cured product, semiconductor device, and interlayer insulating material | |
| JP2008127577A (en) | Epoxy resin composition for sealing multi-chip package and multi-chip package using the same | |
| CN117487489B (en) | Underfill with high stretching rate, preparation method thereof and chip packaging structure | |
| JP2012007007A (en) | Die bond agent composition and semiconductor device | |
| CN113736401A (en) | High-heat-resistance single-component adhesive and preparation method thereof | |
| CN117801745B (en) | Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure | |
| US6361879B1 (en) | Semiconductor device and method for fabricating it, and semiconductor sealing resin composition | |
| JP7013790B2 (en) | Epoxy resin composition for encapsulation and electronic component equipment | |
| CN114276652A (en) | Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof | |
| WO2019138919A1 (en) | Liquid sealing resin composition, electronic component device, and method for manufacturing electronic component device | |
| CN117143550B (en) | Underfill for eliminating flow marks, preparation method thereof and flip chip | |
| CN115895551B (en) | Underfill with high reliability and preparation method thereof | |
| CN110903604B (en) | Ternary resin composition for power device packaging | |
| CN107793701A (en) | Thermosetting epoxy resin composition | |
| JP4975514B2 (en) | DIE BONDING AGENT AND SEMICONDUCTOR DEVICE USING THE SAME | |
| CN117186820A (en) | Adjustable underfill, preparation method thereof and chip packaging structure | |
| CN113831878B (en) | Epoxy resin composition and application thereof | |
| KR20100079280A (en) | Liquid epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same | |
| CN113891913A (en) | Resin composition for sealing and electronic component device | |
| JP2008214548A (en) | Liquid epoxy resin composition and semiconductor device using it | |
| JP2016040393A (en) | Liquid epoxy resin composition, and electronic component device | |
| WO2024157853A1 (en) | Epoxy resin composition for sealing semiconductor and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |