CN117457263A - Display panel, conductive film and preparation method of conductive film - Google Patents

Abstract

The embodiment of the application provides a conductive film, a preparation method thereof and a display panel. The conductive film includes a conductive body, an adhesive, a solvent, and an additive disposed in a relationship of mass percentages provided in the examples of the present application. The different materials described above were formed into films and cured to form conductive films provided in the examples of the present application. The conductive film is directly arranged above the electronic ink layer of the electronic paper product, on one hand, the conductive film can provide driving voltage for the electronic ink layer and control the migration of the electronic ink to achieve the purpose of display, and on the other hand, the conductive film can play a role in sealing the electronic ink layer so as to ensure the normal work of the electronic paper product. According to the embodiment of the application, the conductive film is directly arranged inside the electronic paper product, so that the distance between the conductive film and the ink is reduced, the mobility of the electronic ink in the electronic paper product and the display effect of the panel are effectively improved, and the purpose of improving the comprehensive performance of the product is achieved.

Description

Display panel, conductive film and preparation method of conductive film

Technical Field

The invention relates to the technical field of manufacturing of display panels, in particular to a display panel, a conductive film and a preparation method of the conductive film.

Background

With the continuous development of display panel manufacturing technology, people put forward higher requirements on the quality and display performance of the display panel.

The display panel is widely applied to various electronic display products, and when the electronic products work, the electronic products are displayed through the display panel, so that different use requirements of people are met. With the development of electronic products toward light and thin and portability, conventional heavy panels cannot meet the usage requirements. And then, an electronic paper display panel appears, and in the prior art, the prepared electronic paper screen is applied to different display devices, so that the weight of the devices is reduced. Common electronic paper display technology products are microencapsulated electronic ink electronic paper and microcup electrophoretic display electronic paper. When the display is performed, the migration of the electrophoretic particles is further realized by controlling the voltage between the polar plates, and the picture is displayed. However, in the above product, because of the limitation of the electronic paper product structure, the laminated film layer is more and thicker, if a sealing layer needs to be arranged at the top of the electronic paper product structure, the sealing layer can further reduce the response speed of the electronic ink, so that the display effect of the electronic paper product is not ideal, and the requirement of people on the performance of the high-performance electronic product cannot be met.

In summary, in the electronic paper display product prepared in the prior art, the film layer structure inside the electronic paper product is unreasonably arranged, the response speed of the electronic ink inside the electronic paper product is slower, and therefore, the display effect of the product is not ideal, and the pursuit of users on the performance of high-performance electronic products cannot be met.

Disclosure of Invention

The embodiment of the invention provides a conductive film, a display panel and a preparation method of the conductive film, which are used for effectively solving the problem that the response speed of electronic ink is not ideal due to unreasonable film layer structure arrangement in the existing electronic paper product.

To solve the above technical problem, a first aspect of an embodiment of the present invention provides a conductive film, including:

a conductor, an adhesive, a solvent, and an additive;

wherein the mass percentage of the electric conductor is set to be 10% -20%, the mass percentage of the adhesive is set to be 30% -40%, the mass percentage of the solvent is set to be 30% -50%, and the mass percentage of the additive is set to be 0.5% -5%.

According to an embodiment of the present invention, the conductor is configured as a transparent conductor, and the material of the conductor includes any one of a metal nanowire, a carbon nanotube, graphene, and poly (3, 4-ethylenedioxythiophene) -polystyrene sulfonic acid.

According to an embodiment of the present invention, the conductors are sized in a circular, bar or block structure, and the conductors are uniformly distributed in the conductive film.

According to an embodiment of the present invention, the adhesive comprises any one of acrylate, epoxy resin, polyurethane, and silicone resin, the solvent comprises aromatic hydrocarbon or halogenated hydrocarbon such as toluene, xylene, ethyl acetate, and the additive comprises filler and tackifier.

According to an embodiment of the present invention, the conductivity of the conductive film is set to be more than 1000 siemens per meter.

According to a second aspect of the embodiments of the present invention, there is also provided a display panel including:

the ink layer is arranged between the first substrate and the second substrate; the method comprises the steps of,

the conductive film is arranged on one side surface of the first substrate or the second substrate facing the ink layer, and the conductive film is provided as the conductive film in the embodiment of the application.

According to an embodiment of the invention, the first substrate is an array substrate, the second substrate is a color film substrate, and a retaining wall structure is arranged on the array substrate in a patterning manner;

the conductive film is arranged in the hollowed-out areas of the two adjacent retaining wall structures, and the conductive film is arranged on one side surface of the color film substrate, which is close to the ink layer.

According to an embodiment of the present invention, the thickness of the conductive thin film may be set to 1 μm to 10 μm.

According to an embodiment of the present invention, the ink layer includes a plurality of ink microcapsules therein, and the particle size of the ink microcapsules is set to 80 μm to 450 μm.

According to a third aspect of the embodiment of the present invention, there is also provided a method for preparing a conductive film, the method comprising the steps of:

providing a substrate;

coating a solvent on the substrate, adding a conductor, an adhesive and an additive into the solvent, mixing and stirring, and uniformly distributing the conductor into the solvent, wherein the mass percent of the conductor is set to be 10% -20%, the mass percent of the adhesive is set to be 30% -40%, the mass percent of the solvent is set to be 30% -50%, and the mass percent of the additive is set to be 0.5% -5%;

and curing the solvent after uniform mixing, and obtaining the conductive film.

The embodiment of the invention has the beneficial effects that: compared with the prior art, the embodiment of the application provides a conductive film, a preparation method thereof and a display panel. The conductive film includes a conductive body, an adhesive, a solvent, and an additive disposed in a relationship of mass percentages provided in the examples of the present application. The different materials described above were formed into films and cured to form conductive films provided in the examples of the present application. The conductive film is directly arranged above the electronic ink layer of the electronic paper product, so that on one hand, driving voltage can be provided for the electronic ink layer through the conductive film, the purpose of migration of electronic ink is improved, and on the other hand, the conductive film can play a role in sealing the electronic ink layer, and further normal operation of the electronic paper product is guaranteed. According to the embodiment of the application, the conductive film is directly arranged inside the electronic paper product, so that the distance between the conductive film and the electronic ink is reduced, the mobility of the electronic ink in the electronic paper product and the display effect of the panel are effectively improved, and the purpose of improving the comprehensive performance of the product is achieved.

Drawings

In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a conductive film according to an embodiment of the present application;

fig. 2 is a schematic diagram of a film layer corresponding to a preparation process of the conductive film provided in the embodiment of the present application;

fig. 3 is a schematic diagram of a film structure of a display panel according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram of a film structure of another electronic paper display panel according to an embodiment of the present disclosure.

Detailed Description

In the following detailed description, certain embodiments of the invention are shown and described, simply by way of illustration. As will be appreciated by those skilled in the art, the embodiments described herein may be modified in numerous ways without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, plates, regions, etc. may be exaggerated for clarity and for better understanding and ease of description. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.

In addition, unless explicitly described to the contrary, the word "comprise" and variations such as "comprises" or "comprising" will be understood to imply the inclusion of stated elements but not the exclusion of other elements. Further, in the specification, the word "on … …" means placed above or below the object portion, and not necessarily placed on the upper side of the object portion based on the direction of gravity.

It will be understood that, although the terms "first," "second," etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

It will be understood that when a layer, region or element is referred to as being "formed on" another layer, region or element, it can be directly or indirectly formed on the other layer, region or element. For example, intervening layers, regions, or components may be present.

In the following examples, the x-axis, y-axis, and z-axis are not limited to three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

The embodiment of the application provides a conductive film, a preparation method of the conductive film and a display panel. The conductive film is prepared and is directly arranged above the electronic ink layer of the display panel, so that the internal structure of the electronic paper product is simplified, and the comprehensive performance of the electronic paper product is effectively improved.

As shown in fig. 1, fig. 1 is a schematic structural diagram of a conductive film according to an embodiment of the present application. Specifically, in a first aspect of embodiments of the present application, a conductive film is provided. In the preparation of the conductive film structure, the conductive film material includes a conductor, an adhesive, a solvent and an additive. The above-mentioned conductor, adhesive, solvent and additive are mixed and cured to finally form the conductive film provided in the examples of the present application.

Specifically, the mass percentage of the conductor in the conductive film is set to be 10% -20%, the mass percentage of the adhesive in the conductive film is set to be 30% -40%, the mass percentage of the solvent is set to be 30% -50%, and the mass percentage of the additive is set to be 0.5% -5%. Alternatively, the mass percentage of the conductor is set to 15%, the mass percentage of the adhesive is set to 35%, the mass percentage of the solvent is set to 47%, and the mass percentage of the additive is set to 3%. Thus, the conductive film provided in the embodiment of the present application is formed according to the above-mentioned different ratios. The component proportions among the different substances can be set according to the performances of different products, and are not repeated here. In this embodiment of the application, through the above-mentioned different ratio, the conductive film that finally obtains can have better electrical property effect on the one hand, simultaneously, can also effectual improvement this conductive film's electric capacity effect, and then improve its control effect to the ink layer.

Specifically, in the embodiment of the present application, when the conductive body is configured according to the above components and proportions, the conductive body is configured as a transparent conductive body, and the material of the conductive body includes a metal material, an inorganic material, or an organic material, which can realize charge or electron movement. Optionally, the material of the electrical conductor includes at least one of metal nanowires, carbon nanotubes, graphene, and poly (3, 4-ethylenedioxythiophene) -polystyrene sulfonic acid. As in the following embodiments, the conductor material is selected to be a metal nanowire material. In this embodiment, in order to avoid the influence of the conductive material on the performance of the formed conductive film, when the conductive material is set and selected, the shape of the conductive material may be set to different shapes, such as a sphere, a bar, or other different structures, and optionally, the size of each conductive material is set to 15 μm-55 μm, such as the size of the conductive material is 45 μm, and the conductive materials are uniformly distributed in the conductive film, so as to ensure that the same voltage effect is provided in different areas.

Meanwhile, in the embodiment of the application, the material of the adhesive comprises any one or a combination of at least two of acrylic acid ester, epoxy resin, polyurethane and organic silicon resin. As in the examples below, the material of the adhesive is selected to be acrylate.

Further, the solvent comprises any one or more of toluene, xylene, ethyl acetate, aromatic hydrocarbon or halogenated hydrocarbon. Optionally, the solvent is selected to be toluene, thereby achieving mixing and dissolution of other materials.

Meanwhile, in the embodiment of the application, the material of the additive is mainly a filler and a tackifier, for example, the additive comprises fumed silica, polyethylene and organic or inorganic particles. Meanwhile, the tackifier comprises phthalate esters, aliphatic dibasic acid esters and phosphate esters. Therefore, the viscosity of the liquid before the forming of the conductive film is regulated and controlled by the additive, and the comprehensive performance of the conductive film after film forming is effectively improved.

Further, in the embodiment of the application, the conductivity of the prepared conductive film is set to be more than 1000 Siemens per meter, so that the conductive performance of the conductive film and the sealing and anti-corrosion effects of the film layer are improved. Meanwhile, the adhesion of the conductive film is set to be 3B or more, optionally, the adhesion of the conductive film is set to be 7B, wherein B is a hundred-cell test standard, such as the hundred-cell test standard can be performed with reference to GBT9286-1998 standard. Meanwhile, the thickness of the conductive film is set to 1 μm-10 μm, and the thickness of the optional conductive film is set to 8 μm, or according to the requirements of different products.

In the embodiment of the application, a preparation method of the conductive film is also provided. Specifically, the preparation method comprises the following steps:

providing a substrate;

coating a solvent on the substrate, adding a conductor, an adhesive and an additive into the solvent, mixing and stirring, and uniformly distributing the conductor into the solvent, wherein the mass percent of the conductor is set to be 10% -20%, the mass percent of the adhesive is set to be 30% -40%, the mass percent of the solvent is set to be 30% -50%, and the mass percent of the additive is set to be 0.5% -5%;

and curing the solvent after uniform mixing, and obtaining the conductive film.

As shown in fig. 2, fig. 2 is a schematic diagram of a film layer corresponding to a preparation process of the conductive film provided in the embodiment of the present application. A substrate 201 is first provided, and a solution 202 is coated on the substrate 201, and then the conductor 203 provided in the embodiment of the present application, and a solvent, an adhesive, and an additive are added in a specific mass fraction and mixed with the above-described solution.

Wherein, in the process of adding and mixing, the liquid is fully mixed and dissolved, and simultaneously, the electric conductor 203 is uniformly distributed in the liquid. Therefore, after film formation, the conductive films at different positions have the same material performance, and the comprehensive performance of the conductive films is further ensured.

In the embodiment of the application, when different substances are added, the mass percentage of the conductor 203 is set to 10% -20%, the mass percentage of the adhesive is set to 30% -40%, the mass percentage of the solvent is set to 30% -50%, and the mass percentage of the additive is set to 0.5% -5%. After the treatment is completed, the above material is subjected to a curing treatment. Alternatively, in the curing treatment, the treatment may be performed by heating, ultraviolet irradiation or the like. If in the heating process, the heating temperature is controlled to be less than or equal to 150 ℃ and heated for 0.8-1.5 h, so as to ensure that the liquid material is completely solidified and molded.

Further, when the conductive material 203 is added into the liquid solvent, the conductive material can be processed by any one of a screen printing process, a spraying process, a slit filling process or a knife coating process, and the conductive material can be uniformly dispersed in the liquid material, so that the uniformity of the performance of the prepared conductive film is ensured.

The embodiment of the application also provides a display panel. As shown in fig. 3, fig. 3 is a schematic film structure of a display panel according to an embodiment of the present disclosure. When the display panel is provided, the display panel is mainly exemplified by an electronic paper display panel, and the display panel comprises: a first substrate 401, an ink layer 402, a conductive film 403, and a second substrate 404.

Specifically, the first substrate 401 is disposed opposite to the second substrate 404. In the following embodiments, the first substrate 401 is exemplified by a thin film transistor array substrate, and the second substrate 404 disposed opposite to the first substrate is exemplified by a color film substrate. And a control signal is provided for the electronic paper through the thin film transistor array substrate, and the purposes of lighting and displaying of the electronic paper are realized.

Meanwhile, an ink layer 402 is further provided between the first substrate 401 and the second substrate 404. When the ink layer 402 is disposed, a plurality of ink microcapsule 405 particles are included within the ink layer 402, the ink microcapsule 405 encapsulating electronic ink. Specifically, the ink microcapsule 405 is a microcapsule that encapsulates electrons of a plurality of different charged pigments, such as an electrophoretic display liquid in which electrons of a white pigment, charged black pigment particles or neutral black pigment particles are encapsulated, because if only two particles are in the electrophoretic liquid and both particles are charged, the voltages of the two particles are opposite, and during normal operation of the electronic paper, the two particles are adsorbed by one particle during the electro-adsorption process, but at the same time are still repelled by the other charged particle, thereby causing unstable adsorption, so the electronic ink microcapsule 405 in this embodiment is a microcapsule that encapsulates electrons of a charged white pigment and electrophoretic display liquid with neutral black pigment particles. Wherein the diameter of the ink microcapsule is 80-450 μm. Optionally, the diameter of the ink microcapsule is set to 120 μm, so as to ensure the performance of the ink layer, and at the same time, the charged particles may be set to particles of other colors, which will not be described herein.

In this embodiment, the ink microcapsules can be uniformly distributed in the ink layer, and the conductive film 403 is disposed on a side surface of the second substrate 404 facing the first substrate 401. Thus, when the electronic paper screen display panel works normally, a certain voltage or electric field is formed between the conductive film 403 and the array substrate at the bottom, so as to drive the ink microcapsules 405 in the ink layer, thereby realizing different display effects.

Specifically, the voltage on the conductive film 403 can be set according to the requirements of different products. In this embodiment of the present application, the conductive film 403 is directly disposed on the ink layer 402 and is directly attached to the ink layer, so that the distance between the conductive film 403 and the ink microcapsule 405 can be effectively shortened, and after the voltage is applied to the conductive film, the particles in the ink layer can be driven and controlled better, so as to improve the response speed of the ink layer and the comprehensive performance of the panel.

In the embodiment of the present application, the thickness of the film layer of the conductive film 403 in the display panel may be set to 1 μm to 10 μm. Alternatively, the thickness of the film layer of the conductive film 403 is set to 8 μm, thereby securing a slim arrangement of the electronic paper as much as possible.

Fig. 4 is a schematic diagram of a film structure of another electronic paper display panel according to an embodiment of the present disclosure. In combination with the film structure in fig. 3, in the embodiment of the present application, the display panel includes a first substrate 401, an ink layer 402, a second substrate 404, and a conductive film 403.

Specifically, the first substrate 401 and the second substrate 404 are disposed opposite to each other, and the ink layer 402 is disposed between the two substrates. In this embodiment, the display panel further includes a retaining wall structure 406. The retaining wall structure 406 is disposed on the first substrate 401, that is, the retaining wall structure 406 is disposed on the array substrate and patterned on the array substrate, so as to define a plurality of different pixel regions.

Referring to the structure in fig. 4, the display panel is a micro-cup type electronic paper structure. By disposing a plurality of retaining wall structures 406, a hollow area 44 is disposed between adjacent retaining wall structures 406. The ink layer 402 is correspondingly disposed in the hollowed-out areas 44 of the two adjacent wall structures. Meanwhile, the conductive film 403 is disposed on a side surface of the second substrate 404 close to the first substrate and the ink layer, and one side surface of the conductive film is directly abutted against the retaining wall structure 406, and the other side surface of the conductive film is attached to the second substrate. Thus, the conductive film 403 can directly control the ink layer 402, and effectively shorten the distance between the ink layer 402 and the conductive film 403.

In the embodiment of the application, the voltage can be provided for the conductive films in different hollowed areas according to the requirement, so that the electronic screen can be displayed normally.

Meanwhile, in the embodiment of the application, the conductive film 403 is directly arranged on one side of the ink layer, so that the common electrode layer structure on the second substrate of the display panel is omitted, and the film layer structure and the preparation procedure of the display panel are effectively simplified.

Further, in the embodiment of the present application, the conductive film 403 is configured as a transparent polymer film. The transparent polymer film can also be directly used as a top sealing layer structure, so that a sealing layer is omitted, and the film layer structure is simplified again. Meanwhile, since the conductive film 403 is provided as a transparent polymer film, the transparent polymer film has a lower capacitance, thereby improving the capacitance effect between the film layers and more effectively improving the migration efficiency of ink particles.

Further, in the embodiment of the present application, a display device is further provided, where the display device includes a display panel in the embodiment of the present application, and the display panel may be any product or component having a display function or a curling function, such as a scroll display panel, an electronic paper display panel, and the specific type of the product or component is not limited specifically.

In summary, the foregoing details of the conductive film, the method for preparing the conductive film and the display panel provided by the embodiments of the present invention are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present invention, and the description of the foregoing examples is only for helping to understand the technical solution and core idea of the present invention; although the present invention has been described with reference to the preferred embodiments, it should be understood that the invention is not limited to the particular embodiments described, but can be modified and altered by persons skilled in the art without departing from the spirit and scope of the invention.

Claims (10)

1. A conductive film, wherein the material of the conductive film comprises:

a conductor, an adhesive, a solvent, and an additive;

wherein the mass percentage of the electric conductor is set to be 10% -20%, the mass percentage of the adhesive is set to be 30% -40%, the mass percentage of the solvent is set to be 30% -50%, and the mass percentage of the additive is set to be 0.5% -5%.

2. The conductive film according to claim 1, wherein the conductor is provided as a transparent conductor, and a material of the conductor includes any one of a metal nanowire, a carbon nanotube, graphene, and poly (3, 4-ethylenedioxythiophene) -polystyrene sulfonic acid.

3. The conductive film according to claim 2, wherein the conductive body is provided in a circular, bar-shaped or block-shaped structure, and the conductive body is uniformly distributed in the conductive film.

4. The conductive film according to claim 1, wherein the adhesive comprises any one of acrylate, epoxy, polyurethane, and silicone resin, and the solvent comprises any one of toluene, xylene, ethyl acetate, aromatic hydrocarbon, or halogenated hydrocarbon, and the additive comprises a filler and a tackifier.

5. A display panel comprising the conductive film according to any one of claims 1 to 4, and,

the ink layer is arranged between the first substrate and the second substrate;

the conductive film is arranged on one side surface of the first substrate or the second substrate facing the ink layer.

6. The display panel according to claim 5, wherein the first substrate is an array substrate, the second substrate is a color film substrate, and a retaining wall structure is patterned on the array substrate;

the ink layer is arranged in the hollowed-out areas of the two adjacent retaining wall structures, and the conductive film is arranged on one side surface of the color film substrate, which is close to the ink layer.

7. The display panel according to claim 6, wherein a film thickness of the conductive film is set to 1 μm to 10 μm.

8. The display panel according to claim 5, wherein the ink layer includes a plurality of ink microcapsules therein, the ink microcapsules having a particle size of 80 μm to 450 μm.

9. The conductive film according to claim 5, wherein the conductive film has a conductivity set to be more than 1000 siemens per meter.

10. The preparation method of the conductive film is characterized by comprising the following steps:

providing a substrate;

coating a solvent on the substrate, adding a conductor, an adhesive and an additive into the solvent, mixing and stirring, and uniformly distributing the conductor into the solvent, wherein the mass percent of the conductor is set to be 10% -20%, the mass percent of the adhesive is set to be 30% -40%, the mass percent of the solvent is set to be 30% -50%, and the mass percent of the additive is set to be 0.5% -5%;

and curing the solvent after uniform mixing, and obtaining the conductive film.