CN117435014B - Computer heat abstractor - Google Patents
Computer heat abstractor Download PDFInfo
- Publication number
- CN117435014B CN117435014B CN202311736301.6A CN202311736301A CN117435014B CN 117435014 B CN117435014 B CN 117435014B CN 202311736301 A CN202311736301 A CN 202311736301A CN 117435014 B CN117435014 B CN 117435014B
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- bin
- computer
- adjusting
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 claims abstract description 64
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 239000012780 transparent material Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 25
- 230000009471 action Effects 0.000 claims description 6
- 230000033228 biological regulation Effects 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 27
- 230000000694 effects Effects 0.000 abstract description 16
- 238000009434 installation Methods 0.000 abstract description 16
- 238000001816 cooling Methods 0.000 description 63
- 239000000428 dust Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation device. The technical proposal comprises: the machine cabinet is internally provided with a machine cabinet, an observation plate is arranged at the mouth of the machine cabinet and is made of transparent materials, a main board is arranged in the machine cabinet, the main board is provided with the installation mechanism, the installation mechanism is provided with the heat dissipation mechanism, one side in the machine cabinet is provided with a side plate, and an adjusting mechanism is arranged between the side plate and the heat dissipation mechanism; the device installation mechanism can be adjusted according to the installation holes of different mainboards through the movable connection between the sliding seat of the installation frame and the mainboards, is convenient for the installation of the heat dissipation mechanism, dissipates heat to the computer mainboard through cooling liquid and the heat dissipation fan, keeps normal operation of the computer mainboard, and controls the flow of the cooling liquid through the driving motor and the gear transmission, thereby influencing the heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation device.
Background
The computer is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has a memory function. The intelligent electronic device is modern intelligent electronic equipment which can automatically and rapidly process mass data according to program operation.
With the development of technology, the performance of a computer is gradually improved along with the upgrading of hardware, and the computer realizes higher computing capacity through the combination of high-performance hardware, and the heating condition in the computer is improved while the performance of the computer is improved due to the upgrading of the hardware;
however, the existing computer heat dissipation device is inconvenient to install according to the heat dissipation mounting holes of different mainboards, the whole heat dissipation device may need to be replaced or the different mainboards may be adapted through additional fixing and supporting frames, the operations may be troublesome, the installation stability and the heat dissipation effect of the heat dissipation device may be affected, the existing computer heat dissipation effect is poor, the adjustment of the flow rate of the cooling liquid according to the operation power of the computer is inconvenient, and the existing problem is solved by providing the computer heat dissipation device.
Disclosure of Invention
The present invention is directed to a heat dissipating device for a computer, which solves the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a computer heat abstractor, includes quick-witted case, observation board, supporting leg, installation mechanism, CPU chip, cooling mechanism and adjustment mechanism, machine storehouse has been seted up to machine incasement, and machine storehouse mouth is provided with the observation board, and the observation board is formed by transparent material preparation, and is provided with the mainboard in the machine storehouse, is provided with installation mechanism on the mainboard, is provided with cooling mechanism on the installation mechanism, one side is provided with the curb plate in the machine storehouse, is provided with adjustment mechanism between curb plate and the cooling mechanism, machine case below four corners is provided with the supporting leg, and is provided with first auxiliary fan on the curb plate in the machine incasement, mutually support between first auxiliary fan and the adjustment mechanism, and the quick-witted case upside is provided with the second auxiliary fan, and machine case upper surface is provided with the dust screen on the second auxiliary fan.
Preferably, the installation mechanism comprises a mounting rack, sliding grooves, sliding seats, limiting blocks, mounting rack holes, limiting clamping grooves, adjusting holes and limiting plates, wherein the sliding grooves are formed in two sides of the mounting rack, the sliding seats are connected in the sliding grooves in a sliding mode, the sliding seats are symmetrically arranged in two groups, the limiting blocks are arranged on one side of each sliding seat, CPU chips are arranged on the main board, the mounting holes are formed in the main board, and the mounting rack is movably connected to the main board through the sliding seats.
Preferably, limiting plates are symmetrically arranged in the mounting frame, the limiting plates are movably connected with the mounting frame through adjusting holes, and the limiting plates are matched with the CPU chip.
Preferably, the heat dissipation mechanism comprises a wind bin, a fixing frame, a limiting clamping block, a liquid inlet, a liquid outlet, a hose, a heat dissipation bin, a heat dissipation fan and a cold row, wherein the heat dissipation bin is arranged on the fixing frame, the wind bin is arranged on one side of the heat dissipation bin, the limiting clamping block is symmetrically arranged on one side, far away from the heat dissipation bin, of the fixing frame, and limiting clamping grooves are symmetrically arranged on the fixing frame and mutually matched with the limiting clamping blocks.
Preferably, the cooling bin is internally provided with a cold row, the air bin is internally provided with a cooling fan, the cooling fan and the cold row are mutually matched, one side of the cooling bin is provided with a liquid inlet, one side of the cooling bin is provided with a liquid outlet, and the liquid inlet and the liquid outlet are movably connected with hoses.
Preferably, the adjustment mechanism comprises an adjusting frame, a driving motor, an adjusting groove, a driving wheel, a rotating shaft, a driving wheel, a threaded rod, a guide groove, a guide rod, a transmission part, a control block, a first connecting part, a second connecting part and an adjusting bin, wherein one side in the side plate is provided with the adjusting frame, one end of the adjusting frame is provided with the driving motor, the adjusting groove is formed in the adjusting frame, the driving wheel is arranged at one side of the adjusting groove at the output end of the driving motor, the rotating shaft is arranged in the adjusting groove, the driving wheel is movably connected in the rotating shaft, and the driving wheel is positioned at one side of the driving wheel.
Preferably, the transmission wheel below is provided with the threaded rod, and the guide way has been seted up to adjusting inslot one side, is provided with the guide bar in the guide way, and swing joint has the driving medium on guide bar and the threaded rod, and one side is provided with the internal thread in the driving medium, and the screw thread is mutually supported between driving medium and the threaded rod, and driving medium one side is provided with accuse gauge block.
Preferably, an adjusting bin is arranged on one side of the adjusting frame, the control block is matched with the adjusting bin, the adjusting bin is provided with a first connecting piece and a second connecting piece respectively, and the first connecting piece is matched with the second connecting piece and the hose.
Preferably, the cold row is matched with the CPU chip, a power supply is arranged at the bottom of the machine cabin, and the first auxiliary fan, the second auxiliary fan and the driving motor are electrically connected with the power supply.
Preferably, the mounting bracket holes are formed in four corners of the mounting bracket, and the mounting bracket is movably connected with the fixing bracket through the mounting bracket holes.
Compared with the prior art, the invention has the beneficial effects that:
1. through the connection of sliding seat and sliding tray, link together mainboard and mounting bracket, the sliding seat can slide back and forth in the sliding tray to realize the mounting hole position adjustment of mainboard, the mounting hole position of different mainboards probably differs, and the symmetry is provided with the limiting plate in the mounting bracket, and the limiting plate can carry out position adjustment through the regulation hole, mutually support between limiting plate and the CPU chip, can control the position of CPU chip, ensures its correct installation and with other subassembly assorted.
2. The cooling mechanism is characterized in that the cooling liquid is introduced into the cooling bin through the hose, the liquid inlet is arranged at the upper side of the cooling bin, the cooling liquid enters the cooling bin from the liquid inlet, the cooling liquid flows in the cooling bin to cool and discharge, heat released by a CPU chip or other equipment is absorbed, the cooling liquid is conveyed to the regulating mechanism through the hose, the whole fluid circulation process is completed, the cooling fan sucks air into the air bin, air is blown to the cold row in the cooling bin, the cooling effect is enhanced, the air bin is arranged at one side of the cooling bin and corresponds to the cold row, the limiting clamping blocks on the fixing frame are symmetrically arranged at one side of the fixing frame, the limiting clamping grooves are symmetrically arranged on the fixing frame, the limiting clamping grooves are mutually matched with the limiting clamping blocks, the position of the cooling mechanism can be fixed, the stability of the whole system is guaranteed, the cooling mechanism can cool a computer main board or other equipment, so that the CPU chip or other parts are prevented from being damaged due to overheat, meanwhile, the cooling effect is better, the cooling effect can be ensured through the mutual matching of the limiting clamping blocks and the use of the limiting clamping blocks and the limiting clamping grooves, the position of the limiting clamping blocks and the cooling mechanism is stable, and the reliability and the running efficiency of the whole system can be improved.
3. When the driving motor is started, the driving motor drives the driving wheel to rotate, gears are meshed with each other between the driving wheel and the driving wheel, the driving wheel is driven to rotate, a threaded rod is arranged on one side of the driving wheel, the driving part can vertically move along the guide rod through movement of the threaded rod, meanwhile, under the action of the guide rod, movement of the driving part is limited, adjustment of the control block is achieved, the change of the control block influences flow of cooling liquid in the adjustment bin, finally the cooling liquid is conveyed to the cooling bin through a hose by the aid of the first connecting piece and the second connecting piece, flow rate of the cooling liquid can be controlled according to operation power of a computer, and the adjusting mechanism can increase or reduce flow of the cooling liquid in the cooling system, so that cooling effect is affected.
4. The device installation mechanism can be adjusted according to the installation holes of different mainboards through the movable connection between the sliding seat of the installation frame and the mainboards, is convenient for the installation of the heat dissipation mechanism, dissipates heat to the computer mainboards through cooling liquid and the heat dissipation fan, keeps normal operation of the computer mainboards, and controls the flow of the cooling liquid through the driving motor and the gear transmission, thereby influencing the heat dissipation effect, and the design and the cooperation of the components can improve the stability and the operation efficiency of the computer system.
Drawings
FIG. 1 is a schematic diagram of a chassis according to the present invention;
FIG. 2 is a schematic top view of the chassis of the present invention;
FIG. 3 is a schematic cross-sectional view of the structure of A-A in FIG. 2;
FIG. 4 is a schematic view of the internal structure of the cabin according to the present invention;
FIG. 5 is a schematic view of the mounting mechanism of the present invention;
FIG. 6 is a schematic view of an exploded construction of the mounting mechanism of the present invention;
FIG. 7 is a schematic side view of the holder of the present invention;
FIG. 8 is a schematic diagram of a heat dissipation mechanism according to the present invention;
FIG. 9 is a schematic diagram of the internal structure of the heat dissipation mechanism according to the present invention;
fig. 10 is a schematic structural view of an adjusting mechanism in the present invention.
In the figure: 1. a chassis; 2. an observation plate; 3. support legs; 4. a machine cabin; 5. a main board; 6. a mounting mechanism; 601. a mounting frame; 602. a sliding groove; 603. a sliding seat; 604. a limiting block; 605. a mounting bracket hole; 606. a limit clamping groove; 607. an adjustment aperture; 608. a limiting plate; 7. a CPU chip; 8. a heat dissipation mechanism; 801. a wind bin; 802. a fixing frame; 803. a limit clamping block; 804. a liquid inlet; 805. a liquid outlet; 806. a hose; 807. a heat dissipation bin; 808. a heat radiation fan; 809. cold row; 9. an adjusting mechanism; 901. an adjusting frame; 902. a driving motor; 903. an adjustment tank; 904. a driving wheel; 905. a rotating shaft; 906. a driving wheel; 907. a threaded rod; 908. a guide groove; 909. a guide rod; 910. a transmission member; 911. a control block; 912. a first connector; 913. a second connector; 914. adjusting the bin; 10. a first auxiliary fan; 11. a second auxiliary fan; 12. a power supply; 13. a dust screen; 14. and a side plate.
Detailed Description
The objects, technical solutions and advantages of the present invention will become more apparent by the following detailed description of the present invention with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
As shown in fig. 1-10, the heat dissipation device for a computer provided by the invention comprises a case 1, an observation plate 2, supporting legs 3, a mounting mechanism 6, a CPU chip 7, a heat dissipation mechanism 8 and an adjusting mechanism 9, wherein an organic bin 4 is arranged in the case 1, the observation plate 2 is arranged at the bin opening of the organic bin 4, the observation plate 2 is made of transparent materials, a main board 5 is arranged in the organic bin 4, the mounting mechanism 6 is arranged on the main board 5, the heat dissipation mechanism 8 is arranged on the mounting mechanism 6, a side plate 14 is arranged at one side in the organic bin 4, an adjusting mechanism 9 is arranged between the side plate 14 and the heat dissipation mechanism 8, supporting legs 3 are arranged at four corners below the case 1, a first auxiliary fan 10 is arranged on the side plate 14 in the case 1, the first auxiliary fan 10 is matched with the adjusting mechanism 9, a second auxiliary fan 11 is arranged at the upper side of the case 1, and a dust screen 13 is arranged on the second auxiliary fan 11; the first auxiliary fan 10 is used to enhance air circulation, the second auxiliary fan 11 is provided on the upper side of the cabinet 1, and the dust screen 13 is provided to prevent dust from entering the interior of the cabinet.
In an alternative embodiment, the mounting mechanism 6 includes a mounting frame 601, a sliding groove 602, sliding seats 603, a limiting block 604, a mounting frame hole 605, a limiting clamping groove 606, an adjusting hole 607 and a limiting plate 608, the sliding grooves 602 are formed in two sides of the mounting frame 601, the sliding seats 603 are slidably connected in the sliding grooves 602, the sliding seats 603 are symmetrically provided with two groups, one side of each sliding seat 603 is provided with the limiting block 604, the CPU chip 7 is arranged on the main board 5, the mounting hole is formed in the main board 5, and the main board 5 is movably connected with the mounting frame 601 through the sliding seats 603.
In an optional embodiment, a limiting plate 608 is symmetrically disposed in the mounting frame 601, the limiting plate 608 is movably connected with the mounting frame 601 through an adjusting hole 607, and the limiting plate 608 is matched with the CPU chip 7; firstly, through the connection of sliding seat 603 and sliding tray 602, link together mainboard 5 and mounting bracket 601, sliding seat 603 can slide back and forth in sliding tray 602 to realize the mounting hole position adjustment of mainboard 5, and the mounting hole position of different mainboards probably will be different, and the symmetry is provided with limiting plate 608 in the mounting bracket 601, and limiting plate 608 can carry out position adjustment through adjusting hole 607, mutually support between limiting plate 608 and the CPU chip 7, can control the position of CPU chip 7, ensures that it installs correctly and matches with other subassemblies.
In an alternative embodiment, the heat dissipation mechanism 8 comprises a wind bin 801, a fixing frame 802, a limit clamping block 803, a liquid inlet 804, a liquid outlet 805, a hose 806, a heat dissipation bin 807, a heat dissipation fan 808 and a cold row 809, wherein the fixing frame 802 is provided with the heat dissipation bin 807, one side of the heat dissipation bin 807 is provided with the wind bin 801, one side of the fixing frame 802 far away from the heat dissipation bin 807 is symmetrically provided with the limit clamping block 803, the fixing frame 601 is symmetrically provided with a limit clamping groove 606, and the limit clamping groove 606 and the limit clamping block 803 are mutually matched.
In an alternative embodiment, a cold row 809 is disposed in the heat dissipation chamber 807, a heat dissipation fan 808 is disposed in the air chamber 801, the heat dissipation fan 808 and the cold row 809 are matched with each other, a liquid inlet 804 is disposed on one side of the heat dissipation chamber 807, a liquid outlet 805 is disposed on the lower side of the heat dissipation chamber 807, and hoses 806 are movably connected to the liquid inlet 804 and the liquid outlet 805; the cooling mechanism 8 introduces cooling liquid into the cooling bin 807 through the hose 806, the liquid inlet 804 is located at the upper side of the cooling bin 807, the cooling liquid enters the cooling bin 807 from the liquid inlet, the cooling liquid flows in the cooling bin 807, the heat released by the CPU chip 7 or other equipment is absorbed, the liquid outlet 805 in the hose 806 is conveyed to the regulating mechanism 9 through the hose 806, the whole fluid circulation process is completed, the cooling fan 808 sucks air into the air bin 801, the air is blown to the cooling bin 809 in the cooling bin 807, the cooling effect is enhanced, the air bin 801 is located at one side of the cooling bin 807 and corresponds to the cooling bin 809, the limit clamping blocks 803 on the fixing frame 802 are symmetrically arranged at one side far away from the cooling bin 807, limit clamping grooves 606 are symmetrically arranged on the mounting frame 601, the limit clamping grooves 606 are mutually matched with the limit clamping blocks 803, the position of the cooling mechanism 8 can be fixed, the stability of the whole system is guaranteed, the cooling mechanism 8 can cool a computer motherboard or other equipment, thereby the CPU chip 7 or other parts are prevented from being damaged due to overheating, meanwhile, the structural design of the cooling mechanism 8 enables the cooling liquid and the air to smoothly flow to the cooling bin 809, the cooling effect and the cooling effect can be better through the limit clamping grooves 803 and the limit clamping grooves 803, the stable running performance of the whole system can be guaranteed, and the stable running performance of the cooling mechanism is guaranteed.
In an alternative embodiment, the adjusting mechanism 9 comprises an adjusting frame 901, a driving motor 902, an adjusting groove 903, a driving wheel 904, a rotating shaft 905, a driving wheel 906, a threaded rod 907, a guiding groove 908, a guiding rod 909, a transmission piece 910, a control block 911, a first connecting piece 912, a second connecting piece 913 and an adjusting bin 914, wherein the adjusting frame 901 is arranged on one side in the side plate 14, the driving motor 902 is arranged at one end of the adjusting frame 901, the adjusting groove 903 is arranged in the adjusting frame 901, the driving wheel 904 is arranged on one side of the adjusting groove 903 at the output end of the driving motor 902, the rotating shaft 905 is arranged in the adjusting groove 903, the driving wheel 906 is movably connected in the rotating shaft 905, and the driving wheel 906 is positioned on one side of the driving wheel 904.
In an alternative embodiment, a threaded rod 907 is disposed below the driving wheel 906, a guide groove 908 is disposed on one side in the adjusting groove 903, a guide rod 909 is disposed in the guide groove 908, a driving member 910 is movably connected to the guide rod 909 and the threaded rod 907, an internal thread is disposed on one side in the driving member 910, the threads of the driving member 910 and the threaded rod 907 are mutually matched, and a control block 911 is disposed on one side of the driving member 910.
In an alternative embodiment, an adjusting bin 914 is disposed on one side of the adjusting frame 901, the control block 911 is matched with the adjusting bin 914, and the adjusting bin 914 is respectively provided with a first connecting piece 912 and a second connecting piece 913, and the first connecting piece 912 and the second connecting piece 913 are matched with the hose 806; when the driving motor 902 is started, the driving motor 902 drives the driving wheel 904 to rotate, gears between the driving wheel 904 and the driving wheel 906 are meshed with each other, so that the driving wheel 906 is driven to rotate, a threaded rod 907 is arranged on one side of the driving wheel 906, the driving member 910 can vertically move along the guide rod 909, meanwhile, under the action of the guide rod 909, the movement of the driving member 910 is limited, so that the adjustment of the control block 911 is realized, the flow of cooling liquid in the adjustment bin 914 is influenced by the change of the control block 911, the cooling liquid is finally conveyed to the cooling bin 807 through a hose by the first connecting member 912 and the second connecting member 913, the flow of the cooling liquid in the cooling system can be increased or reduced by the adjusting mechanism 9 according to the operation power of a computer, and the cooling effect is influenced.
In an alternative embodiment, the cold row 809 is matched with the CPU chip 7, a power source 12 is disposed at the bottom of the machine cabinet 4, and the first auxiliary fan 10, the second auxiliary fan 11, and the driving motor 902 are electrically connected with the power source 12.
In an alternative embodiment, the four corners of the mounting frame 601 are provided with mounting frame holes 605, and the mounting frame 601 is movably connected with a fixing frame 802 through the mounting frame holes 605, so that the mounting frame 601 plays an important role in the aspect of the stability of the heat dissipation mechanism 8 and the contact of the CPU chip 7, the four corners of the mounting frame 601 are provided with mounting frame holes 605, the holes can be used for fixing the whole heat dissipation mechanism 8, the contact between the heat dissipation mechanism 8 and the CPU chip 7 is tighter, and the heat transfer efficiency is higher, thereby improving the heat dissipation effect.
The working principle of the invention is as follows: when the device is used, firstly, the main board 5 is connected with the mounting frame 601 through the connection of the sliding seat 603 and the sliding groove 602, the sliding seat 603 can slide back and forth in the sliding groove 602 to realize the adjustment of mounting holes of the main board 5, the positions of the mounting holes of different main boards can be different, the mounting frame 601 is symmetrically provided with the limiting plates 608, the limiting plates 608 can adjust the positions through the adjusting holes 607, the limiting plates 608 are matched with the CPU chip 7, the positions of the CPU chip 7 can be controlled to ensure that the CPU chip 7 is correctly mounted and matched with other components, the cooling mechanism 8 introduces cooling liquid into the cooling bin 807 through the hose 806, the liquid inlet 804 is positioned on the upper side of the cooling bin 807, the cooling liquid enters the cooling bin 807 from the cooling hole, the cooling liquid flows in the cooling bin 807 to cool the cooling bar 809, and the heat released by the CPU chip 7 or other devices is absorbed, then the liquid outlet 805 in the hose 806 is conveyed to the regulating mechanism 9 through the hose 806, the whole fluid circulation process is completed, the cooling fan 808 sucks air into the air bin 801, blows air to the cold row 809 in the cooling bin 807, enhances the cooling effect, the air bin 801 is positioned at one side of the cooling bin 807, corresponding to the cold row 809, the limit clamping blocks 803 on the fixing frame 802 are symmetrically arranged at one side far away from the cooling bin 807, the limit clamping grooves 606 are symmetrically arranged on the fixing frame 601, the limit clamping grooves 606 and the limit clamping blocks 803 are mutually matched, the position of the cooling mechanism 8 can be fixed, the stability of the whole system is ensured, the cooling mechanism 8 can dissipate heat of a computer motherboard or other equipment, so that the damage of the CPU chip 7 or other parts due to overheat is avoided, meanwhile, the cooling mechanism 8 has the structural design that the cooling liquid and the air can smoothly flow, and the cooling effect is better, through the cooperation of the limit clamping blocks 803 and the limit clamping grooves 606 and the use of the mounting frame holes 605, the position stability of the heat dissipation mechanism 8 can be ensured, the reliability and the operation efficiency of the whole system are improved, when the driving motor 902 is started, the driving motor 902 drives the driving wheel 904 to rotate, gears between the driving wheel 904 and the driving wheel 906 are meshed with each other, thereby driving the driving wheel 906 to rotate, a threaded rod 907 is arranged on one side of the driving wheel 906, the movement of the threaded rod 907 can enable the driving member 910 to vertically move along the guide rod 909, meanwhile, under the action of the guide rod 909, the movement of the driving member 910 is limited, thereby realizing the adjustment of the control block 911, the change of the control block 911 can influence the flow rate of cooling liquid in the adjustment bin 914, finally, the cooling liquid is conveyed to the heat dissipation bin 807 through a hose by the first connecting member 912 and the second connecting member 913, the flow rate of the cooling liquid in the heat dissipation system can be increased or reduced by the adjustment mechanism 9 according to the operation power of the computer, and thus the heat dissipation effect is influenced.
It is to be understood that the above-described embodiments of the present invention are intended to be illustrative or explanatory of the principles of the invention, and are not restrictive of the invention. Accordingly, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention should be included in the scope of the present invention. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims, or equivalents of such scope and boundary.
Claims (7)
1. A computer heat sink, characterized in that: the dustproof intelligent computer comprises a computer case (1), an observation plate (2), supporting legs (3), a mounting mechanism (6), a CPU chip (7), a heat dissipation mechanism (8) and an adjusting mechanism (9), wherein a computer case (4) is arranged in the computer case (1), the computer case (4) is provided with the observation plate (2) at the computer case opening, the observation plate (2) is made of transparent materials, a main plate (5) is arranged in the computer case (4), the mounting mechanism (6) is arranged on the main plate (5), the heat dissipation mechanism (8) is arranged on the mounting mechanism (6), a side plate (14) is arranged on one side in the computer case (4), the adjusting mechanism (9) is arranged between the side plate (14) and the heat dissipation mechanism (8), the supporting legs (3) are arranged at four corners below the computer case (1), a first auxiliary fan (10) is arranged on the side plate (14) in the computer case (1), a second auxiliary fan (11) is arranged between the first auxiliary fan (10) and the adjusting mechanism (9), and a second auxiliary fan (11) is arranged on the upper side of the computer case (1), and a dustproof net (13) is arranged on the upper surface of the computer case (1).
The mounting mechanism (6) comprises a mounting frame (601), sliding grooves (602), sliding seats (603), limiting blocks (604), mounting frame holes (605), limiting clamping grooves (606), adjusting holes (607) and limiting plates (608), wherein the sliding grooves (602) are formed in two sides of the mounting frame (601), the sliding seats (603) are connected in the sliding grooves (602) in a sliding mode, the two groups of the sliding seats (603) are symmetrically arranged, the limiting blocks (604) are arranged on one side of each sliding seat (603), CPU chips (7) are arranged on the main board (5), mounting holes are formed in the main board (5), and the mounting frames (601) are movably connected to the main board (5) through the sliding seats (603);
the heat dissipation mechanism (8) comprises a wind bin (801), a fixing frame (802), a limit clamping block (803), a liquid inlet (804), a liquid outlet (805), a hose (806), a heat dissipation bin (807), a heat dissipation fan (808) and a cold row (809), wherein the heat dissipation bin (807) is arranged on the fixing frame (802), the wind bin (801) is arranged on one side of the heat dissipation bin (807), limit clamping blocks (803) are symmetrically arranged on one side, far away from the heat dissipation bin (807), of the fixing frame (802), limit clamping grooves (606) are symmetrically arranged on the mounting frame (601), and the limit clamping grooves (606) are mutually matched with the limit clamping blocks (803);
adjustment mechanism (9) are including alignment jig (901), driving motor (902), adjustment groove (903), action wheel (904), axis of rotation (905), drive wheel (906), threaded rod (907), guide way (908), guide bar (909), driving medium (910), accuse piece (911), first connecting piece (912), second connecting piece (913) and regulation storehouse (914), one side is provided with alignment jig (901) in curb plate (14), and alignment jig (901) one end is provided with driving motor (902), and has seted up adjustment groove (903) in alignment jig (901), and the output of driving motor (902) is provided with action wheel (904) in adjustment groove (903) one side, is provided with axis of rotation (905) in adjustment groove (903), swing joint has drive wheel (906) in axis of rotation (905), and drive wheel (906) are located action wheel (904) one side.
2. A computer heat sink according to claim 1, wherein: limiting plates (608) are symmetrically arranged in the mounting frame (601), the limiting plates (608) are movably connected with the mounting frame (601) through adjusting holes (607), and the limiting plates (608) are matched with the CPU chip (7).
3. A computer heat sink according to claim 1, wherein: be provided with cold row (809) in heat dissipation storehouse (807), and be provided with radiator fan (808) in wind storehouse (801), mutually support between radiator fan (808) and cold row (809), one side is provided with inlet (804) on heat dissipation storehouse (807), and one side is provided with liquid outlet (805) under heat dissipation storehouse (807), and inlet (804) and liquid outlet (805) all swing joint have hose (806).
4. A computer heat sink according to claim 1, wherein: the transmission wheel (906) below is provided with threaded rod (907), and guide slot (908) has been seted up to one side in adjusting slot (903), is provided with guide bar (909) in guide slot (908), swing joint has driving medium (910) on guide bar (909) and threaded rod (907), and one side is provided with the internal thread in driving medium (910), and screw thread mutually support between driving medium (910) and threaded rod (907), and driving medium (910) one side is provided with accuse gauge block (911).
5. A computer heat sink as defined in claim 4, wherein: one side of the adjusting frame (901) is provided with an adjusting bin (914), the control block (911) is matched with the adjusting bin (914), the two ends of the adjusting bin (914) are respectively provided with a first connecting piece (912) and a second connecting piece (913), and the first connecting piece (912) and the second connecting piece (913) are matched with the hose (806).
6. A computer heat sink according to claim 3, wherein: the cold row (809) is matched with the CPU chip (7), a power supply (12) is arranged at the bottom in the machine cabin (4), and the first auxiliary fan (10), the second auxiliary fan (11) and the driving motor (902) are electrically connected with the power supply (12).
7. A computer heat sink according to claim 2, wherein: mounting bracket holes (605) are formed in four corners of the mounting bracket (601), and the mounting bracket (601) is movably connected with a fixing bracket (802) through the mounting bracket holes (605).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311736301.6A CN117435014B (en) | 2023-12-18 | 2023-12-18 | Computer heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311736301.6A CN117435014B (en) | 2023-12-18 | 2023-12-18 | Computer heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117435014A CN117435014A (en) | 2024-01-23 |
| CN117435014B true CN117435014B (en) | 2024-04-02 |
Family
ID=89546429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311736301.6A Active CN117435014B (en) | 2023-12-18 | 2023-12-18 | Computer heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117435014B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118192772B (en) * | 2024-03-19 | 2024-09-13 | 盐城建佳科技有限公司 | Heat dissipation baffle and computer for mainboard installation |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212032110U (en) * | 2020-06-24 | 2020-11-27 | 安徽文达信息工程学院 | Computer-aided heat dissipation device |
| WO2022027782A1 (en) * | 2020-08-07 | 2022-02-10 | 苏州艾宾斯信息技术有限公司 | Movable heat dissipation device for computer host |
| CN114461040A (en) * | 2022-01-06 | 2022-05-10 | 朱志辉 | Computer-aided cooling machine case |
| CN114546061A (en) * | 2022-02-17 | 2022-05-27 | 江苏经贸职业技术学院 | Remote control computer control case with protection device |
| WO2022121396A1 (en) * | 2020-12-08 | 2022-06-16 | 苏州云首软件科技有限公司 | Computer heat dissipation device |
| CN218095100U (en) * | 2022-08-09 | 2022-12-20 | 北京交通大学 | Auxiliary cooling device for desktop computer case |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202211751A (en) * | 2020-09-09 | 2022-03-16 | 陳彥為 | Modular computer case sharing monitor assembling bracket with power supply capable of assembling all components with the monitor to form an all-in-one computer, and installing the power supply outside the computer case for miniaturizing the space occupied by the computer on the desk |
-
2023
- 2023-12-18 CN CN202311736301.6A patent/CN117435014B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212032110U (en) * | 2020-06-24 | 2020-11-27 | 安徽文达信息工程学院 | Computer-aided heat dissipation device |
| WO2022027782A1 (en) * | 2020-08-07 | 2022-02-10 | 苏州艾宾斯信息技术有限公司 | Movable heat dissipation device for computer host |
| WO2022121396A1 (en) * | 2020-12-08 | 2022-06-16 | 苏州云首软件科技有限公司 | Computer heat dissipation device |
| CN114461040A (en) * | 2022-01-06 | 2022-05-10 | 朱志辉 | Computer-aided cooling machine case |
| CN114546061A (en) * | 2022-02-17 | 2022-05-27 | 江苏经贸职业技术学院 | Remote control computer control case with protection device |
| CN218095100U (en) * | 2022-08-09 | 2022-12-20 | 北京交通大学 | Auxiliary cooling device for desktop computer case |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117435014A (en) | 2024-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117435014B (en) | Computer heat abstractor | |
| CN100371854C (en) | Liquid cooling type heat sink | |
| CN114828577A (en) | Novel high-efficient data center server liquid cooling heat dissipation cabinet | |
| CN109548347B (en) | Internet big data server cabinet capable of realizing intelligentization of maintenance process | |
| CN1493953A (en) | Electronic apparatus with circulation way of liquid refrigerant for cooling heat generating component | |
| WO2023143644A1 (en) | Computer system unit heat dissipation apparatus | |
| CN118312023B (en) | Power supply overheat protection device and use method thereof | |
| CN109219302B (en) | Server intelligent cabinet for internet big data processing | |
| CN212484216U (en) | Adjustable computer heat dissipation base | |
| CN210109735U (en) | Computer peripheral heat abstractor | |
| CN114327001A (en) | Support radiator fan that removes to charge | |
| CN213302923U (en) | Computer assembling structure | |
| CN209746506U (en) | Notebook radiator with adjustable | |
| CN210166731U (en) | Mainboard that radiating effect is good | |
| CN221592465U (en) | Novel saddle | |
| CN216486353U (en) | High-efficient radiator for computer convenient to installation | |
| CN112269457A (en) | Installation heat abstractor for computer | |
| CN219302983U (en) | External auxiliary heat dissipation device for computer | |
| CN210835990U (en) | Cooling device for computer host | |
| CN219300372U (en) | Angle adjusting mechanism of host computer heating panel | |
| CN216123293U (en) | Laser power supply control panel convenient to installation | |
| CN219435862U (en) | Semiconductor chip test card temperature control device | |
| CN214846563U (en) | Computer mainboard fixing device for computer | |
| CN221668247U (en) | Chip heat dissipation device | |
| CN221743622U (en) | Notebook computer heat dissipation support device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |