CN117214225B - A long-pulse high-power millimeter-wave transmitting mirror heat removal performance testing device - Google Patents

Abstract

The invention relates to the technical field of heat removal performance test in engineering research of a magnetic confinement nuclear fusion plasma microwave auxiliary heating system, and discloses a long-pulse high-power millimeter wave emission mirror heat removal performance test device, which comprises: the connecting frame is used for being connected with the transmitting mirror; the heating assembly comprises a heating element and a compression unit, the heating element is used for providing a heat source for the transmitting mirror and is arranged on the transmitting mirror in the middle, and the compression unit is arranged on the connecting frame and is used for propping the heating element against the mirror surface of the transmitting mirror; the temperature acquisition assembly comprises an elastic jacking unit and a plurality of temperature acquisition elements, wherein the temperature acquisition elements are tightly attached to the mirror surface of the transmitting mirror through the elastic jacking unit and are used for acquiring the mirror surface temperature of the transmitting mirror. The invention has the beneficial effects that: the heating element and the temperature acquisition element are ensured to be always clung to the mirror surface of the transmitting mirror, and the accuracy of the heat removal test result is improved.

Description

A long-pulse high-power millimeter-wave transmitting mirror heat removal performance testing device

Technical field

The invention relates to the technical field of heat removal performance testing in engineering research on magnetic confinement nuclear fusion plasma microwave-assisted heating systems, and in particular to a long pulse high power millimeter wave emitter mirror heat removal performance testing device.

Background technique

In the field of magnetic confinement nuclear fusion research, high-power millimeter wave heating systems are very effective means of plasma-assisted heating. They have the advantages of good localization, high power density, and flexible control of deposition positions. When electrons in thermonuclear fusion plasma When the cyclotron frequency is consistent with or is a multiple of the microwave electric field frequency, the electrons will resonate and absorb microwave energy. Therefore, the millimeter wave heating system is also called an electron cyclotron resonance heating (ECRH) system. At present, the output power of millimeter wave sources used for auxiliary heating of magnetically confined nuclear fusion plasma has reached the megawatt level. The transmission and emission equipment supporting the system must also be able to withstand the corresponding power level. For quasi-optical transmitting antennas, its The heat removal performance of the emitter is one of the key technologies in its development. When the transmitting antenna of the ECRH system of the EAST device is running, the transmitting mirror is in a high-temperature, high-vacuum, and high-magnetic field environment, and its temperature distribution and heat removal status cannot be monitored in real time. Flow-thermal coupling simulation is a commonly used means of heat removal performance design and analysis. , and the heat removal performance test is the best choice to verify the rationality of simulation analysis.

To measure the heat removal performance of the emitter mirror, a high-power (kilowatt-level) ceramic electric heating plate can be used to simulate the heat source, and the temperature of the emitter mirror can be collected at multiple points through the temperature measuring element. When the high-power ceramic heating plate continues to work, it is necessary to keep the heating plate and the emitter mirror always in close contact to ensure that the heating plate can effectively heat the emitter mirror. At the same time, it is also necessary to keep the temperature measuring element and the emitting mirror in close contact to ensure that the collected information is accurate and reliable. Adhesion with high-temperature-resistant thermal conductive adhesive is a common method of fixing heating plates and temperature measuring elements. However, when the heating temperature continues to rise, the adhesive easily falls off and the heat transfer is insufficient, resulting in reduced heating effect and large temperature deviation in the collection. . Therefore, how to ensure that the heating power is effectively transmitted to the emitter under test and how to ensure that the temperature collection information is accurate are key points in the experimental test.

Contents of the invention

The purpose of this invention is to provide a long-pulse high-power millimeter-wave transmitter mirror thermal removal performance test device, aiming to solve the problem of insufficient heat transfer and insufficient heat transfer caused by insufficient fixation between heating elements and temperature measuring elements and the transmitter mirror at high temperatures. Technical problem of insufficiently accurate temperature collection information.

In order to achieve the above objectives, the present invention provides a long pulse high power millimeter wave transmitting mirror thermal removal performance testing device, including:

A connecting frame, the connecting frame is used to connect with the emitting mirror;

Heating assembly, including a heating element and a pressing unit. The heating element is used to provide a heat source for the emitting mirror and is centrally arranged on the emitting mirror. The pressing unit is arranged on the connecting frame for attaching the heating element to the emitting mirror. The heating element is disposed against the mirror surface of the emitting mirror;

A temperature acquisition component includes an elastic pressing unit and a plurality of temperature acquisition elements. The plurality of temperature acquisition elements are arranged in close contact with the mirror surface of the emitting mirror through the elastic pressing unit and are used to collect the mirror surface of the emitting mirror. temperature.

Furthermore, the connecting frame includes a frame body, the two ends of the frame body extend downward to form connecting parts, and the two connecting parts are provided with connecting shafts facing each other, and the connecting shafts are used to connect to both sides of the transmitting mirror. The shaft holes are connected accordingly.

Furthermore, the pressing unit includes a T-shaped pressing block and a heat-insulating plate. The T-shaped pressing block is fixed to the connecting frame. The heat-insulating plate is provided under the T-shaped pressing block. A hot plate rests on the heating element.

Furthermore, the T-shaped pressing block includes a first screw rod and a pressure plate. The first screw rod is passed through the connecting frame, and a first anti-loosening nut and a locking nut are provided on the upper end. The unnutting nut is located above the connecting frame, and the locking nut is located below the connecting frame and is used to fix the first screw rod and the connecting frame. The axis of the first screw rod and the mirror surface of the emitting mirror Vertical and facing the center of the mirror surface of the emitting mirror; the lower end of the first screw is provided with the pressure plate, the heat insulation plate is provided below the pressure plate, and the heat insulation plate is placed against the heating element.

Furthermore, the first screw is also provided with a fastening nut for installation and limiting of the elastic pressing unit. The fastening nut is located below the locking nut. The locking nut and the locking nut are The elastic pressing unit is fixed with a fastening nut.

Furthermore, the elastic pressing unit includes a connecting piece and an elastic piece; the elastic piece is slidingly connected to the connecting piece, and the connecting piece has a plurality of the connecting pieces symmetrically and evenly distributed on both sides of the pressing unit. An elastic member is used to place the temperature collecting element against the mirror surface of the emitting mirror.

Furthermore, the elastic member includes a guide rod and a spring. The guide rod is passed through the connecting piece and is movably connected to the connecting piece. The spring is sleeved on the guide rod. One end of the spring is against the connecting piece, and the other end is against the guide rod. The temperature acquisition element is located below the guide rod. The spring drives the guide rod axially close to the launcher. The trend of mirror movement.

Furthermore, the guide rod is a screw, and the screw is provided with a second anti-loosening nut and a pressing nut in sequence from top to bottom. The second anti-loosing nut and the pressing nut are respectively located on the connecting piece. On the upper and lower sides, one end of the spring is against the connecting piece, and the other end is against the pressing nut. The spring has a tendency to drive the screw downward, and the temperature acquisition element is located on the underneath the screw.

Furthermore, the temperature acquisition components are divided into two groups, and the angle between the two groups of temperature acquisition components is between 30° and 60°.

Furthermore, thermal conductive grease is provided at the contact points between the heating element, the temperature collecting element and the emitting mirror.

Compared with the existing technology, a long-pulse high-power millimeter-wave emitter thermal removal performance test device according to the embodiment of the present invention has the following beneficial effects: it is provided with a connecting frame that can be used for quick connection with the emitter; the heating element is used to The emitter mirror provides a heat source and is centrally located on the emitter mirror. The compression unit can place the heating element against the mirror surface of the emitter mirror, so that the heating element is always in close contact with the mirror surface of the emitter mirror, ensuring that the heat generated by the heating element can be fully conducted to Emitting mirror; the temperature collection element is set in close contact with the mirror surface of the emitting mirror through an elastic pressing unit and is used to collect the mirror surface temperature of the emitting mirror. The elastic pressing unit can make the temperature collection element and the emitting mirror firmly connected; through the pressing unit and The elastic pressing unit squeezes and fixes the heating element, temperature acquisition element and emitter mirror respectively to ensure the accuracy of the temperature collection information of the emitter mirror and improve the accuracy of the heat removal test results. It provides reliable guarantee for the development of long-pulse high-power millimeter-wave emitters, and also provides valuable reference for the research of high-power millimeter-wave heating systems.

Description of drawings

Figure 1 is a schematic structural diagram of a long-pulse high-power millimeter-wave emitter thermal removal performance testing device according to an embodiment of the present invention;

Figure 2 is a schematic structural diagram of the emitting mirror;

Figure 3 is a schematic structural diagram of the connection frame of the long pulse high power millimeter wave transmitting mirror thermal removal performance testing device according to the embodiment of the present invention;

Figure 4 is a schematic assembly diagram of the compression unit of the long pulse high power millimeter wave transmitting mirror thermal removal performance testing device according to the embodiment of the present invention;

Figure 5 is a schematic structural diagram of the T-shaped pressing block of the thermal removal performance testing device for long pulse high-power millimeter wave transmitting mirrors according to the embodiment of the present invention;

Figure 6 is a schematic distribution diagram of the temperature acquisition components of the long-pulse high-power millimeter-wave emitter heat removal performance testing device according to the embodiment of the present invention;

Figure 7 is a top view of the thermal removal performance testing device of the long pulse high power millimeter wave emitter mirror according to the embodiment of the present invention.

In the figure, 1. Connecting frame; 11. Frame body; 12. Connecting part; 13. Connecting shaft; 2. Heating component, 21. Heating element; 22. Pressing unit; 221. T-shaped pressing block; 2211. First Screw; 2212, pressure plate; 222, heat insulation plate; 223, first anti-loosening nut; 224, locking nut; 225, fastening nut; 3. Temperature acquisition component, 31, elastic pressing unit; 311, connector; 312. Screw; 313. Spring; 314. Second anti-loosening nut; 315. Pressure nut; 32. Temperature acquisition element; a. Emitting mirror; a1, axis hole.

Detailed ways

Specific implementations of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back", "inner", "outer", etc. in the present invention are based on the appended The positional relationships shown in the figures are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices and components referred to must have specific orientations, be constructed and operated in specific orientations, and therefore cannot be understood as limitations of the present invention. .

In the description of the present invention, it should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but the information should not be limited to these terms. These terms are only used to describe the same type of information. information are distinguished from each other. For example, without departing from the scope of the present invention, "first" information may also be called "second" information, and similarly, "second" information may also be called "first" information.

As shown in Figure 1, a long-pulse high-power millimeter-wave transmitting mirror heat removal performance testing device according to the preferred embodiment of the present invention is used to heat the mirror surface of transmitting mirror a and then collect the mirror surface temperature. Figure 2 is Schematic structural diagram of the transmitting mirror a. Axial holes a1 are coaxially provided on both sides of the transmitting mirror. The axis of the shaft hole a1 is located on the symmetry plane in the width direction of the transmitting mirror. It is used for installation with the heat removal performance testing device of the present invention.

The long-pulse high-power millimeter-wave transmitting mirror heat removal performance testing device of the present invention includes a connecting frame 1, a heating component 2 and a temperature acquisition component 3. The connecting frame 1 is used to connect with the transmitting mirror to connect the entire device. and fixed to the emitting mirror; the heating assembly 2 includes a heating element 21 and a compression unit 22. The heating element 21 is used to provide a heat source for the emitting mirror and is centrally located on the emitting mirror. In order to ensure that the heating element 21 and the mirror surface of the emitting mirror are closely aligned , the pressing unit 22 is provided on the connecting frame 1, and is used to place the heating element 21 against the mirror surface of the emitting mirror. In this embodiment, the heating element 21 uses a common ceramic heating plate, which is easy to replace; the temperature collection component 3, It is used to collect the temperature on the mirror surface, including the elastic pressing unit 31 and the temperature collection element 32. Since the heating element 21 is centrally located on the emitting mirror, the temperature on the emitting mirror close to the central position and the temperature far away from the central position will be different, as To facilitate the measurement of the temperature of each area on the mirror surface and improve the reliability of test data analysis, multiple temperature acquisition elements 32 are provided on the elastic pressing unit 31. In order to keep the temperature acquisition elements 32 in close contact with the mirror surface at all times to ensure the temperature collection To ensure accuracy, the temperature collection element 32 is arranged in close contact with the mirror surface of the emitting mirror through the elastic pressing unit 31 and is used to collect the mirror surface temperature of the emitting mirror. In some embodiments, the temperature collection element 32 is a thermal resistance element or a thermocouple element. , easy to replace.

Further, the connecting frame 1 is used to connect with the transmitting mirror. In order to facilitate quick assembly with the transmitting mirror, specifically, referring to Figure 3, the connecting frame 1 includes a frame body 11, and both ends of the frame body 11 extend downward to form connecting portions 12. , the two connecting parts 12 are provided with connecting shafts 13 facing each other. The connecting shafts 13 are used to connect correspondingly to the shaft holes a1 on both sides of the transmitting mirror. The connecting shafts 13 can be installed by passing through the shaft holes. In order to lower the connecting frame 1 assembly error, in this embodiment, the frame body 11 and the two connecting parts 12 are integrally formed, and the shape is C-shaped.

The pressing unit 22 is used to press and fix the heating element 21. It includes a T-shaped pressing block 221 and a heat insulation plate 222. The T-shaped pressing block 221 is fixed to the connecting frame 1, and there is a partition below the T-shaped pressing block 221. The heat plate 222 and the heat shield plate 222 are placed against the heating element 21. The heat shield plate 222 is provided to prevent part of the heat from being lost through heat transfer when the heating element 21 heats the mirror surface, resulting in higher power consumption of the heating element 21. Therefore, in this embodiment, the heat insulation plate 222 is made of high-temperature resistant glass fiber material with a small thermal conductivity.

Further, in order to facilitate the design of the T-shaped pressing block 221, refer to Figures 4 and 5. The T-shaped pressing block 221 includes a first screw 2211 and a pressing plate 2212. The first screw 2211 is used to connect with the connecting frame 1, and the pressing plate 2212. 2212 is used to compress the heating element 21 by pressing the heat insulation plate 222. Specifically, the first screw 2211 is vertically installed on the connecting frame 1, and the upper end is provided with a first anti-separation nut 223 and a locking nut 224. The first anti-separation nut 223 is located above the connecting frame 1, and the locking nut 224 is located below the connecting frame 1 and is used to fix the first screw rod 2211 and the connecting frame 1. Specifically, refer to Figures 1 and 3, the first anti-separating nut 223 is located above the frame body 11, and the locking nut 224 is located below the frame body 11. When the first screw rod 2211 is fixed, the upper end surface of the locking nut 224 fits the lower end surface of the frame body 11. Since the heating element 21 is centrally located on the emitting mirror, in order to distribute the pressure evenly when it is pressed, the axis of the first screw 2211 is perpendicular to the mirror surface of the emitting mirror and faces the center of the mirror surface of the emitting mirror; a pressure plate is provided at the lower end of the first screw 2211 2212, a heat insulation plate 222 is provided below the pressure plate 2212, and the heat insulation plate 222 is placed against the heating element 21.

The elastic pressing unit 31 is used to compress multiple temperature collecting elements 32. The multiple temperature collecting elements 32 are arranged according to the distance from the center of the mirror. Specifically, the elastic pressing unit 31 includes a connecting piece 311 and an elastic piece; wherein, the elastic The connecting piece is slidably connected to the connecting piece. Refer to Figures 4 and 5. The connecting piece has a number of elastic pieces symmetrically and evenly distributed on both sides of the pressing unit 22. The elastic pieces are used to place the temperature collecting element 32 against the mirror surface of the emitting mirror.

Further, the elastic member includes a guide rod and a spring 313. The guide rod is passed through the connecting piece 311 and is movably connected to the connecting piece. A spring 313 is set on the guide rod. One end of the spring 313 is against the connecting piece 311, and the other end of the spring 313 is against the connecting piece 311. One end is against the guide rod, and the temperature collecting element 32 is located below the guide rod. The spring 313 has a tendency to drive the guide rod to move axially close to the mirror surface, thereby compressing the temperature collecting element 32 .

Furthermore, in order to facilitate the design of the guide rod and adjust the elastic force of the spring 313, in this embodiment, the guide rod uses a screw 312. In order to facilitate the installation of a limiter between the screw 312 and the connector 311, the screw 312 is made of A second anti-separation nut 314 and a pressure nut 315 are provided in sequence from top to bottom. The second anti-separation nut 314 and the pressure nut 315 are located on the upper and lower sides of the connector respectively. One end of the spring 313 is against the connector 311, and the other end is against the connector 311. Set on the top pressure nut 315, the temperature acquisition element 32 is located below the screw 312. The spring 313 has a tendency to drive the screw 312 to move downward. The compression amount of the spring 313 can be adjusted by adjusting the height of the top pressure nut 315 on the screw 312, corresponding to Adjust the pressing force required for the temperature collecting element 32 to avoid damage to the temperature collecting element 32 due to excessive pressing force. The number of temperature collecting elements 32 and screws 312 corresponds one to one. In this embodiment, referring to Figures 1 and 4, the number of screws 312 in a single elastic pressing unit 31 is 8, and the corresponding number of temperature collecting elements 32 is also 8. The number of screw rods 312 can be increased or decreased accordingly according to the size of the mirror surface of the emitting mirror.

In this embodiment, in order to facilitate the installation and limiting of the elastic pressing unit 31 and the pressing unit 22, the first screw 2211 is also provided with a limiting fastening nut 225 for the installation of the elastic pressing unit. Specifically, at the connection There is a through hole in the middle of the member 311 for being sleeved on the first screw 2211. The fastening nut 225 is located below the locking nut 224. The locking nut 224 and the fastening nut 225 cooperate to fix the connecting member 311, thereby tightening the elastic top. The pressing unit 31 is fixed.

Since when collecting the temperature of the transmitting mirror, the more temperature data collected in different areas on the mirror surface of the transmitting mirror, the more accurate the final test structure will be. When the temperature acquisition component 3 is set to a single one, in order to facilitate the measurement of multiple sets of temperatures Data can be measured in different areas on the reflector by adjusting the installation angle of the temperature acquisition unit; in order to further improve the measurement efficiency, in this embodiment, referring to Figure 6 and Figure 7, the temperature acquisition component 3 is set into two groups. In order to enable two sets of temperature acquisition assemblies 3 to measure the temperature in different areas on the mirror surface, the two sets of temperature acquisition assemblies 3 are stacked and arranged at a certain angle. Since the temperature acquisition elements on the two sets of temperature acquisition assemblies 3 are dispersedly arranged, the temperature in different areas on the mirror surface can be collected. Multiple temperatures are conducive to improving the accuracy of the test results. The angle α between the two sets of temperature acquisition components 3 is between 30° and 60°. That is, the angle α of the two sets of temperature acquisition components 3 can be used during temperature testing. The angle varies between 30° and 60° to achieve monitoring of more points. In some other embodiments, due to changes in the structural dimensions of the temperature acquisition assembly 3, the angle between the two sets of temperature acquisition assemblies 3 is not limited to 30°. ~60° change, which can be flexibly adjusted according to actual conditions. Furthermore, the temperature acquisition component 3 can also be set in multiple groups, which can measure multiple sets of temperature data at one time, and can be adapted and adjusted according to the actual temperature acquisition situation.

Furthermore, in order to improve the heating efficiency of the emitter mirror by the heating element 21 and improve the measurement efficiency of the temperature collection element 32, thermal conductive grease is provided at the contacts between the heating element 21, the temperature collection element 32 and the emitter mirror.

The working process of the present invention is: first assemble the temperature acquisition component 3, the pressing unit 22 and the connecting frame 1, then centrally place the heating element 21 on the mirror surface of the emitting mirror, and at the same time cover the heating element with the heat insulation plate 222 21, then connect the connecting frame 1 to the emitting mirror through the two connecting shafts 13, adjust the locking nut 224 on the pressing unit 22 to close the heating element 21 to the mirror surface of the emitting mirror, and adjust the pressing nut in the temperature acquisition unit 315. Place the temperature collection element 32 close to the mirror surface of the emitting mirror.

In summary, embodiments of the present invention provide a long pulse high-power millimeter wave transmitting mirror thermal removal performance testing device, which is provided with a connecting frame 1 that can be used to quickly connect to the transmitting mirror; the heating element 21 is used to provide a heat source to the transmitting mirror and Set centrally on the emitting mirror, the pressing unit 22 can push the heating element 21 against the mirror surface of the emitting mirror, so that the heating element 21 always maintains close contact with the mirror surface of the emitting mirror, ensuring that the heat generated by the heating element 21 can be fully conducted to the emitting mirror. mirror; the temperature collecting element 32 is arranged in close contact with the mirror surface of the transmitting mirror through the elastic pressing unit 31, and is used to collect the mirror surface temperature of the transmitting mirror. The elastic pressing unit 31 can make the temperature collecting element and the transmitting mirror firmly connected; by pressing The unit 22 and the elastic pressing unit 31 press and fix the heating element 21, the temperature collection element 32 and the emitting mirror respectively, ensuring that the temperature collection information of the emitting mirror is accurate and improving the accuracy of the heat removal test results. It provides reliable guarantee for the development of long-pulse high-power millimeter-wave emitters, and also provides valuable reference for the research of high-power millimeter-wave heating systems.

The above are only preferred embodiments of the present invention. It should be noted that those of ordinary skill in the art can also make several improvements and substitutions without departing from the technical principles of the present invention. These improvements and substitutions It should also be regarded as the protection scope of the present invention.

Claims (5)

1. A long-pulse high-power millimeter-wave transmitter mirror thermal removal performance testing device, which is characterized by including: A connecting frame, the connecting frame is used to connect with the emitting mirror; Heating assembly, including a heating element and a pressing unit. The heating element is used to provide a heat source for the emitting mirror and is centrally arranged on the emitting mirror. The pressing unit is arranged on the connecting frame for attaching the heating element to the emitting mirror. The heating element is disposed against the mirror surface of the emitting mirror; A temperature acquisition component includes an elastic pressing unit and a plurality of temperature acquisition elements. The plurality of temperature acquisition elements are arranged in close contact with the mirror surface of the emitting mirror through the elastic pressing unit and are used to collect the mirror surface of the emitting mirror. Temperature; the connecting frame includes a frame body, the two ends of the frame body extend downward to form connecting parts, and the two connecting parts are provided with connecting shafts facing each other, and the connecting shafts are used to connect to the shafts on both sides of the emitting mirror. The holes correspond to the connections; The pressing unit includes a T-shaped pressing block and a heat-insulating plate, the T-shaped pressing block is fixed to the connecting frame, and the heat-insulating plate is provided below the T-shaped pressing block; The T-shaped pressing block includes a first screw and a pressure plate. The first screw is installed on the connecting frame, and a first anti-loosing nut and a locking nut are provided on the upper end. The first anti-loosing nut is located on the Above the connecting frame, the locking nut is located below the connecting frame and is used to fix the first screw rod and the connecting frame. The axis of the first screw rod is perpendicular to and facing the mirror surface of the emitting mirror. The center of the mirror surface of the emitting mirror; the lower end of the first screw is provided with the pressure plate, the heat insulation plate is provided below the pressure plate, and the heat insulation plate is placed against the heating element; The first screw is also provided with a fastening nut for limiting the installation of the elastic pressing unit. The fastening nut is located below the locking nut. The locking nut cooperates with the fastening nut. Fix the elastic pressing unit; The elastic pressing unit includes a connecting piece and an elastic piece; the elastic piece is slidingly connected to the connecting piece, and the connecting piece has a number of the elastic pieces symmetrically and evenly distributed on both sides of the pressing unit, so The elastic member is used to place the temperature collecting element against the mirror surface of the emitting mirror; A through hole is opened in the middle of the connecting piece for being sleeved on the first screw. The locking nut and the fastening nut cooperate to fix the connecting piece, thereby fixing the elastic pressing unit. 2. The long-pulse high-power millimeter-wave emitter thermal removal performance testing device as claimed in claim 1, characterized in that: the elastic member includes a guide rod and a spring, and the guide rod passes through the connecting piece. and is movably connected to the connecting piece. The guide rod is covered with the spring. One end of the spring is against the connecting piece, and the other end is against the guide rod. The temperature collecting The element is located below the guide rod, and the spring has a tendency to drive the guide rod to move axially close to the mirror surface of the emitting mirror. 3. The long-pulse high-power millimeter-wave emitter thermal removal performance testing device as claimed in claim 2, characterized in that: the guide rod is a screw, and the screw is provided with second anti-loosening nuts in sequence from top to bottom. and a push nut. The second anti-separation nut and the push nut are respectively located on the upper and lower sides of the connector. One end of the spring is against the connector, and the other end is against the push nut. The spring has a tendency to drive the screw to move downward, and the temperature collecting element is located below the screw. 4. The long-pulse high-power millimeter-wave emitter thermal removal performance testing device as claimed in claim 1, characterized in that: the temperature acquisition components are in two groups, and the angle between the two groups of temperature acquisition components is large. Between 30°~60°. 5. The long-pulse high-power millimeter-wave transmitter mirror thermal removal performance testing device according to claim 1, characterized in that: thermal conductive grease is provided at the contact points of the heating element, the temperature collection element and the transmitter mirror.