CN117116139A - Colloid bonding structure, colloid bonding method and electronic equipment - Google Patents
Colloid bonding structure, colloid bonding method and electronic equipment Download PDFInfo
- Publication number
- CN117116139A CN117116139A CN202210583580.6A CN202210583580A CN117116139A CN 117116139 A CN117116139 A CN 117116139A CN 202210583580 A CN202210583580 A CN 202210583580A CN 117116139 A CN117116139 A CN 117116139A
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- Prior art keywords
- groove
- glue
- touch screen
- distance
- shell
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000084 colloidal system Substances 0.000 title abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 104
- 238000004026 adhesive bonding Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides a colloid bonding structure, a colloid bonding method and electronic equipment, wherein the structure comprises a touch screen and a shell, the shell is provided with a bonding surface facing the touch screen, the periphery of the bonding surface is provided with a first groove, at least one second groove facing the shell is arranged near the first groove, the first groove is used for injecting glue and forming a glue layer between the shell and the touch screen, the glue layer overflows inwards to an inner side position close to the touch screen far away from the first groove so as to bond the touch screen on the bonding surface, and the second groove is used for storing the overflowed glue after bonding. The invention can increase the contact area between the glue and the touch screen, thereby enhancing the bonding force between the glue and the whole touch screen.
Description
Technical Field
The present invention relates to the field of bonding technologies, and in particular, to a colloid bonding structure, a colloid bonding method, and an electronic device.
Background
Currently, the electronic equipment industry is more and more competitive, and the requirements on the extreme appearance are more and more high, wherein a narrow frame is an important direction for pursuing. But the narrow frame brings a very good appearance and also brings new problems. For example, when electronic devices (such as mobile phones and IPAD) are assembled, the touch screen and the casing are generally fixed by dispensing, but when the frame is extremely narrow, the adhesion between the glue and the casing becomes a bottleneck, and the adhesion force is insufficient, so that the touch screen is separated from the casing.
Disclosure of Invention
The invention provides a colloid bonding structure, a colloid bonding method and electronic equipment, which are used for solving the problem that a touch screen is separated from a shell due to insufficient bonding force in the prior art.
In a first aspect, the present invention provides a glue bonding structure comprising:
the touch-sensitive screen is arranged to be in contact with the substrate,
the shell is provided with a binding face facing the touch screen, a first groove is formed in the periphery of the binding face, at least one second groove facing the shell is formed near the first groove, the first groove is used for injecting glue and forming a glue layer between the shell and the touch screen, the glue layer overflows inwards to an inner side position close to the touch screen towards the first groove to press the touch screen on the binding face, and the second groove is used for storing the overflowed glue after press-fitting.
In an embodiment of the invention, the structure further comprises at least one third groove communicating with the first groove, the third groove being perpendicular to the first groove and located to the left and/or right of the first groove.
In an embodiment of the present invention, the third grooves located at the left side and the right side of the first groove are symmetrically distributed or dislocated.
In an embodiment of the present invention, the second groove is located inside the first groove and has a first distance from the first groove, the glue layer overflows inward away from the first groove to form a second distance, the second distance is greater than the first distance, and a horizontal distance of the glue layer is the second distance.
In an embodiment of the present invention, the second groove is located outside the first groove and has a first distance from the first groove, the glue layer overflows inward away from the first groove to form a second distance, and a horizontal distance of the glue layer is a sum of the first distance and the second distance.
In an embodiment of the present invention, the first groove after injecting the glue forms a seal protection ring around the touch screen, and the glue layer is in a closed ring structure.
In an embodiment of the invention, the structure further includes a display screen attached to a bottom surface of the touch screen, and the touch screen is adhered to the casing through the glue layer so as to wrap the display screen between the touch screen and the casing.
In a second aspect, the present invention also provides a method for bonding a colloid, comprising:
providing a touch screen and a shell, wherein the shell is provided with a joint surface facing the touch screen;
a first groove is formed in the peripheral ring of the joint surface, and at least one second groove facing the shell is formed near the first groove;
injecting glue into the first groove to form a glue layer between the shell and the touch screen, wherein the glue layer overflows inwards towards the inner side position far away from the second groove to be close to the touch screen so as to press the touch screen on the joint surface, and the second groove is used for storing the overflowed glue after press-fitting.
In an embodiment of the present invention, the method further includes:
at least one third groove is arranged, the third groove is communicated with the first groove and is perpendicular to the first groove, and the third groove is positioned on the left side and/or the right side of the first groove.
In a third aspect, the present invention also provides an electronic device, including a glue bonding structure according to any one of the first aspect.
In an embodiment of the invention, the electronic device is a mobile phone or a tablet computer.
According to the colloid bonding structure, the colloid bonding method and the electronic equipment, the at least one second groove facing the shell is arranged near the first groove, after glue is injected into the first groove, the glue forms a glue layer between the shell and the touch screen and overflows inwards to the inner side position near the touch screen far away from the first groove, and after the glue is pressed, the glue flows to the second groove.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a glue bonding structure according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a housing provided in an embodiment of the present invention;
FIG. 3 is an overall schematic view of a glue bonding structure according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a glue bonding structure according to a second embodiment of the invention;
FIG. 5 is a schematic view of a first groove provided in an embodiment of the present invention;
FIG. 6 is a schematic view of a first groove and a third groove provided in a third embodiment of the present invention;
FIG. 7 is a schematic view of a first groove and a third groove provided in a fourth embodiment of the present invention;
FIG. 8 is a schematic view of a first groove and a third groove provided in a fifth embodiment of the present invention;
FIG. 9 is a schematic view of a first groove and a third groove provided in a sixth embodiment of the present invention;
FIG. 10 is a flow chart of a method of bonding glue according to an embodiment of the present invention;
reference numerals:
10: a touch screen; 20: a housing; 30: a display screen;
201: a bonding surface; 202: a first groove; 203: a second groove;
204: a glue layer; 205: and a third groove.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein.
Technical terms related to the present invention are described as follows:
the dispensing refers to a process for industrial production of electronic products, namely, white glue, UV glue, red glue and the like are smeared, encapsulated and dripped on the products to play roles of reinforcing, sealing, insulating and the like. The purpose of dispensing is mainly to provide moisture and heat protection and heat conduction functions for electronic boards and important electronic components so as to better protect the sensitive components.
In order to solve the problem of separation of a touch screen and a shell caused by insufficient adhesion force in the prior art, the invention provides a colloid adhesion structure, a colloid adhesion method and electronic equipment.
The following describes the adhesive bonding structure, method and electronic device of the present invention with reference to fig. 1 to 10.
Embodiment one:
referring to fig. 1 to 3, fig. 1 is a schematic cross-sectional view of a glue bonding structure according to a first embodiment of the present invention, fig. 2 is a schematic cross-sectional view of a casing according to an embodiment of the present invention, and fig. 3 is an overall schematic view of a glue bonding structure according to an embodiment of the present invention, where the glue bonding structure includes a touch screen 10 and a casing 20.
Illustratively, the housing 20 has an abutment surface 201 facing the touch screen 10, the periphery of the abutment surface 201 having a first recess 202, and at least one second recess 203 facing the housing 20 is provided adjacent to the first recess 202.
The second groove 203 shown in fig. 1 is located inside the first groove 202, and is located inside the first groove 202 and has a first distance from the first groove 202, and the glue layer 204 overflows inward away from the first groove 202 to form a second distance, which is greater than the first distance, and the glue layer 204 has a horizontal distance of the second distance.
When glue is injected into the first groove 202, a glue layer 204 is formed between the housing 20 and the touch screen 10, the glue layer 204 overflows inward toward the inner side away from the first groove 202 to a position close to the touch screen 10, the touch screen 10 can be pressed on the bonding surface 201 by the glue pressing, and the glue after pressing flows to the second groove 203 to be stored until solidification.
Therefore, when glue is injected into the first groove 202 by the dispensing device, a glue layer 204 is formed between the housing 20 and the touch screen 10, and the glue overflows to the inner side of the touch screen by increasing the dispensing amount, and the excess glue flows to the second groove 203 after being pressed and cured. By increasing the dispensing quantity, the contact area of the glue and the touch screen can be increased, the overall binding force of the glue and the touch screen is further enhanced, and the problem of excessive dispensing overflow is solved through the designed second groove.
Illustratively, the first groove 202 after injecting the glue forms a sealing protection ring around the touch screen 10, and the glue layer 204 has a closed ring structure, so that the reliability of the connection between the touch screen 10 and the housing 20 can be enhanced, and the sealing performance can be improved.
Illustratively, the glue layer 204 is formed by dispensing. However, the glue layer 204 is not limited thereto, and other possible forming methods may be used.
Illustratively, the adhesive bonding structure further includes a display screen 30, and the lower surface (bottom surface) of the touch screen 10 is mounted to the upper surface of the display screen 30 in a fitting manner. The touch screen 10 is adhered to the casing 20 through the glue layer 204 to wrap the display screen 30 between the touch screen 10 and the casing 20. Alternatively, the display screen 30 may be directly accommodated in the casing 20 without being attached to the touch screen 10; optionally, a glass protective screen may be further included over the touch screen 10.
It should be noted that although fig. 1 shows one of the second grooves 203, the number, shape, width, depth, etc. of the second grooves 203 are not particularly limited, and the present invention can be designed according to practical requirements, so long as the second grooves have a receiving space and can store the overflow glue after lamination.
Therefore, by providing the second groove 203 on the casing 20, the touch screen 10 and the casing 20 can be better contacted, the touch screen 10 and the casing 20 are prevented from being separated, the glue layer 204 forms a sealing protection ring between the touch screen 10 and the casing 20, the touch screen 10 can be better protected, the glue layer 204 can also prevent liquid from entering the electronic device from the position between the touch screen 10 and the casing 20, and the waterproof performance of the electronic device is improved.
Embodiment two:
referring to fig. 4, fig. 4 is a schematic cross-sectional view of a glue bonding structure according to a second embodiment of the invention. The difference between the second embodiment and the first embodiment is that the second groove 203 shown in fig. 4 is located outside the first groove 202 and has a first distance from the first groove 202, the glue layer 204 overflows inward away from the first groove 202 to form a second distance, and the distance in the horizontal direction of the glue layer 204 is the sum of the first distance and the second distance.
It can be appreciated that, in the second embodiment, the second groove 203 is disposed outside the first groove 202 to achieve the same function as the embodiment, that is, the contact area between the glue and the touch screen 10 can be increased, so that the bonding force between the glue and the touch screen 10 is also enhanced. However, since the casing 20 has a narrow rim, the maximum distance of the second groove 203 disposed outside the first groove 202 cannot be greater than the distance of the narrow rim, at least should be flush with the narrow rim.
Similarly, fig. 4 only shows one of the second grooves 203, and one or more second grooves 203 may be further disposed near the first groove 202, or the second grooves 203 may not be further disposed, which may be specifically determined according to practical requirements.
It should be noted that the functions of the second embodiment and the first embodiment having the same components are not described again, and the adhesive structures of the second embodiment and the first embodiment may be referred to correspondingly.
According to the glue bonding structure, test data show that due to the arrangement of the second groove 203, the distance between the glue layer 204 in the horizontal direction is prolonged, the contact area between the glue and the casing 20 is increased by about 1/3-1/2, and the overall bonding force between the glue and the casing 20 is also increased by about 1/3-1/2.
Embodiment III:
in the first embodiment or the second embodiment, the enlarged view of the portion a shown in fig. 3 may be a schematic view of the first groove 202 as shown in fig. 5.
In the third embodiment, as shown in fig. 6, the enlarged view of the portion a shown in fig. 3 further includes at least one third groove 205 communicating with the first groove 202, the third groove 205 is perpendicular to the first groove 202, and the third groove 205 is located on the right side of the first groove 202.
The first groove 202 and the third groove 205 are used for injecting glue, and the contact area between the glue and the touch screen can be further increased by additionally arranging the third groove 205, so that the overall binding force between the glue and the touch screen is also enhanced, and the bonding between the shell and the touch screen is more stable.
Embodiment four:
the enlarged view of the portion a shown in fig. 3 is shown in fig. 7, and the adhesive bonding structure according to the embodiment of the present invention further includes at least one third groove 205 communicating with the first groove 202, the third groove 205 being perpendicular to the first groove 202, and the third groove 205 being located on the left side of the first groove 202.
The first groove 202 and the third groove 205 are used for injecting glue, and the contact area between the glue and the touch screen can be further increased by additionally arranging the third groove 205, so that the overall binding force between the glue and the touch screen is also enhanced, and the bonding between the shell and the touch screen is more stable.
Fifth embodiment:
as shown in fig. 8, the enlarged view of the portion a shown in fig. 3 further includes a plurality of third grooves 205 communicating with the first groove 202, the plurality of third grooves 205 are perpendicular to the first groove 202, and the plurality of third grooves 205 are located on the left and right sides of the first groove 202.
Specifically, fig. 8 shows a plurality of third grooves 205 located at the left and right sides of the first groove 202 in a symmetrical distribution.
The first groove 202 and the third groove 205 are used for injecting glue, and the contact area between the glue and the touch screen can be further increased by additionally arranging the third groove 205, so that the overall binding force between the glue and the touch screen is also enhanced, and the bonding between the shell and the touch screen is more stable.
Example six:
as shown in fig. 9, the enlarged view of the portion a shown in fig. 3 further includes a plurality of third grooves 205 communicating with the first groove 202, the plurality of third grooves 205 are perpendicular to the first groove 202, and the plurality of third grooves 205 are located on the left and right sides of the first groove 202.
Specifically, fig. 9 shows a plurality of third grooves 205 located on the left and right sides of the first groove 202 in a staggered distribution.
The first groove 202 and the third groove 205 are used for injecting glue, and the contact area between the glue and the touch screen can be further increased by additionally arranging the third groove 205, so that the overall binding force between the glue and the touch screen is also enhanced, and the bonding between the shell and the touch screen is more stable.
It should be noted that the structures of the first groove 202 and the third groove 205 shown in fig. 5 to 9 may be arbitrarily combined with the structures of the second groove 203 shown in fig. 1 and 4 to form various embodiments of the present invention.
For example, the embodiment of the adhesive bonding structure of the present invention may be the structural combination of fig. 1+5, the structural combination of fig. 4+5, the structural combination of any one of fig. 1+6 to 9, or the structural combination of any one of fig. 4+6 to 9, which will not be described herein.
It can be understood that, in the above structure with the third groove, the maximum distance is within the range of the narrow frame of the casing, so as to maximize the contact area between the glue and the touch screen.
The following describes the method for bonding a colloid provided by the present invention, and the method for bonding a colloid described below and the structure for bonding a colloid described above can be referred to correspondingly.
With continued reference to fig. 10, fig. 10 is a flowchart of a method for bonding glue according to an embodiment of the invention. The colloid bonding method provided by the embodiment of the invention comprises the following steps:
in step 801, a touch screen and a housing having an engagement surface facing the touch screen are provided.
The shell is used for bearing or fixing internal components such as a main board, a battery and the like of the electronic equipment, and is also used for being connected with a touch screen and a display screen of the electronic equipment to be packaged into a whole machine. The joint surface is a surface of the shell and the touch screen, which are jointed by glue.
Further, when the shell is adhered and fixed with the touch screen, the shell is adhered and fixed through the colloid generally so as to achieve good tightness, and meanwhile, the stability of the adhesion of the shell and the touch screen can be improved.
Step 802, a first groove is disposed on the periphery of the bonding surface, and at least one second groove facing the casing is disposed near the first groove.
For example, at least one second groove facing the casing may be provided near the inside or outside of the first groove.
Specifically, the first grooves are circumferentially distributed on the surface, close to the touch screen, of the casing. In order to improve the bonding stability of the casing and the touch screen, the first groove and the second groove are matched at least so that the first groove is arranged around the periphery of the casing, and therefore the bonding part of the casing and the touch screen is approximately in a complete annular shape.
Step 803, glue is injected into the first groove to form a glue layer between the casing and the touch screen, the glue layer overflows inwards towards the second groove to an inner side position close to the touch screen to press the touch screen on the bonding surface, and the second groove is used for storing the overflowed glue after pressing.
When the adhesive dispensing device is used for carrying out adhesive dispensing, contact and touch the screen and the shell, the colloid can flow into the inner side position close to the touch screen through the first groove more quickly, so that the shell and the touch screen have better tightness and are more stable in adhesion.
In one embodiment of the present invention, the method for bonding glue further comprises providing at least one third groove, wherein the third groove is communicated with the first groove and perpendicular to the first groove, and the third groove is located on the left side and/or the right side of the first groove. The structure and advantages of the third groove are as shown in the third to sixth embodiments, and will not be described here again.
Exemplary, an embodiment of the present invention further provides an electronic device, where the electronic device includes the adhesive colloid structure according to any one of the foregoing.
The electronic device may be a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, or the like, which requires a glue bonding or a dispensing process to bond related components, for example. In structural applications of electronic devices, a chassis is generally used to carry or fix internal components such as a motherboard and a battery of the electronic device.
According to the electronic equipment provided by the embodiment of the invention, the touch screen and the shell are bonded and fixed by the glue dispensing method, the glue dispensing mode is flexible, the glue filling speed is high, the efficiency is improved, the internal space of the electronic equipment is not additionally occupied, and overflowed glue can be stored through the second groove for solidification.
It should be noted that, the electronic device provided in the embodiment of the present invention can realize the functions implemented by the embodiment of the colloid bonding structure and achieve the same technical effects, and the parts and beneficial effects that are the same as those of the embodiment of the colloid bonding structure in the embodiment are not described in detail herein.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A glue bonding structure, the structure comprising:
the touch-sensitive screen is arranged to be in contact with the substrate,
the shell is provided with a binding face facing the touch screen, a first groove is formed in the periphery of the binding face, at least one second groove facing the shell is formed near the first groove, the first groove is used for injecting glue and forming a glue layer between the shell and the touch screen, the glue layer overflows inwards to an inner side position close to the touch screen towards the first groove to press the touch screen on the binding face, and the second groove is used for storing the overflowed glue after press-fitting.
2. The glue string structure of claim 1, further comprising at least one third groove in communication with the first groove, the third groove being perpendicular to and to the left and/or right of the first groove.
3. The glue joint structure of claim 2, wherein the third grooves are symmetrically or offset on the left and right sides of the first groove.
4. The glue joint structure according to claim 1 or 2, wherein the second groove is located inside the first groove and has a first distance from the first groove, the glue layer overflows inward away from the first groove to form a second distance, the second distance is greater than the first distance, and the glue layer has a horizontal distance of the second distance.
5. The glue joint structure according to claim 1 or 2, wherein the second groove is located outside the first groove and has a first distance from the first groove, the glue layer overflows inward away from the first groove to form a second distance, and the horizontal distance of the glue layer is the sum of the first distance and the second distance.
6. The glue bonding structure according to claim 1, wherein the first groove after glue injection forms a seal protection ring around the touch screen, and the glue layer is a closed ring structure.
7. The glue joint structure of claim 1, further comprising a display screen attached to the bottom surface of the touch screen, wherein the touch screen is bonded to the housing by the glue layer to encapsulate the display screen between the touch screen and the housing.
8. A method of bonding a gel comprising:
providing a touch screen and a shell, wherein the shell is provided with a joint surface facing the touch screen;
a first groove is formed in the peripheral ring of the joint surface, and at least one second groove facing the shell is formed near the first groove;
injecting glue into the first groove to form a glue layer between the shell and the touch screen, wherein the glue layer overflows inwards towards the inner side position far away from the second groove to be close to the touch screen so as to press the touch screen on the joint surface, and the second groove is used for storing the overflowed glue after press-fitting.
9. A method of bonding a gel as set forth in claim 8 further comprising:
at least one third groove is arranged, the third groove is communicated with the first groove and is perpendicular to the first groove, and the third groove is positioned on the left side and/or the right side of the first groove.
10. An electronic device comprising the adhesive gel structure of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210583580.6A CN117116139A (en) | 2022-05-25 | 2022-05-25 | Colloid bonding structure, colloid bonding method and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210583580.6A CN117116139A (en) | 2022-05-25 | 2022-05-25 | Colloid bonding structure, colloid bonding method and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117116139A true CN117116139A (en) | 2023-11-24 |
Family
ID=88804413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210583580.6A Pending CN117116139A (en) | 2022-05-25 | 2022-05-25 | Colloid bonding structure, colloid bonding method and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117116139A (en) |
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2022
- 2022-05-25 CN CN202210583580.6A patent/CN117116139A/en active Pending
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