CN117091516B - Method, system and storage medium for detecting thickness of circuit board protective layer - Google Patents
Method, system and storage medium for detecting thickness of circuit board protective layer Download PDFInfo
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- CN117091516B CN117091516B CN202210520945.0A CN202210520945A CN117091516B CN 117091516 B CN117091516 B CN 117091516B CN 202210520945 A CN202210520945 A CN 202210520945A CN 117091516 B CN117091516 B CN 117091516B
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- 239000011241 protective layer Substances 0.000 title claims abstract description 124
- 238000000034 method Methods 0.000 title claims description 22
- 238000001514 detection method Methods 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 238000005286 illumination Methods 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000003595 spectral effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10028—Range image; Depth image; 3D point clouds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Geometry (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The application discloses a thickness detection method, a system and a storage medium of a circuit board protective layer. The thickness detection method comprises the steps of obtaining an optical image of one side of a circuit board provided with a protective layer; identifying the light image to obtain a protective layer coverage area and a non-coverage area on one side of the circuit board; acquiring point cloud data of one side of a circuit board; calculating the point cloud data to obtain first height information of a coverage area of the protection layer and second height information of a non-coverage area; and acquiring the thickness of the protective layer based on the first height information and the second height information. The thickness detection method and the thickness detection system for the circuit board protection layer can detect the thickness of the circuit board protection layer, reduce detection cost and improve test accuracy.
Description
Technical Field
The present application relates to the field of circuit board protection layer detection technology, and in particular, to a method, a system, and a storage medium for detecting a thickness of a circuit board protection layer.
Background
In order to prolong the service life of products and enhance the stability of circuit boards, a layer of three-proofing adhesive is coated on the circuit boards to serve as a protective layer. At present, the detection technology of the three-proofing glue of the circuit board mainly comprises a brightness fitting technology and a spectrum confocal technology, but when the brightness fitting technology is used, different base colors of the circuit board are inconsistent with the thickness value of the three-proofing glue fed back, and when the thickness reaches a certain value, the color change of a picture shot through ultraviolet irradiation is not obvious, and the linear relation is lost, so that the test is inaccurate. The spectral confocal technology needs a short distance to detect the detected object, and the spectral confocal sensor is expensive, so that the detection cost is high.
Disclosure of Invention
The application mainly solves the technical problem of providing a thickness detection method and a thickness detection system for a circuit board protection layer, which can detect the thickness of the circuit board protection layer, reduce the detection cost and improve the test accuracy.
In order to solve the technical problem, the application adopts a technical scheme that a motor control circuit is provided, and the thickness detection method comprises the steps of acquiring an optical image of one side of a circuit board provided with a protective layer; identifying the light image to obtain a protective layer coverage area and a non-coverage area on one side of the circuit board; acquiring point cloud data of one side of a circuit board; calculating the point cloud data to obtain first height information of a coverage area of the protection layer and second height information of a non-coverage area; and acquiring the thickness of the protective layer based on the first height information and the second height information.
In order to solve the technical problem, another technical scheme adopted by the application is to provide a thickness detection system of a circuit board protective layer, wherein the thickness detection system comprises an illumination device, an image acquisition circuit, a laser scanning sensor and a processor; the illumination device is used for generating an optical signal on one side of the circuit board, which is provided with the protective layer; the image acquisition circuit is used for acquiring an optical image of one side of the circuit board provided with the protective layer; the laser scanning sensor is used for acquiring point cloud data of one side of the circuit board; the processor is connected with the illumination device, the laser scanning sensor and the image acquisition circuit, and is used for controlling the illumination device to generate optical signals, acquiring optical images from the image acquisition circuit and detecting the thickness of the protective layer by adopting a thickness detection method.
In order to solve the above technical problem, another technical aspect adopted by the present application is to provide a storage medium, where a computer program is stored, and the computer program can be executed by a processor to implement a thickness detection method.
The beneficial technical effects are as follows: according to the method for detecting the thickness of the circuit board protective layer, the obtained light image of the circuit board provided with the protective layer is used for identifying the light image so as to distinguish the covered area and the uncovered area of the protective layer on the circuit board, the obtained point cloud data of the circuit board are used for respectively obtaining the first height of the covered area and the second height of the uncovered area of the protective layer on the circuit board, and finally the thickness of the protective layer is calculated by utilizing the first height and the second height. The thickness of the protective layer of the circuit board can be detected by the method; in addition, the requirement on the lens for acquiring the optical image of the circuit board is low, and the acquisition of the point cloud data only needs a proper laser scanning sensor, so that the manufacturing cost is lower than that of a spectral confocal sensor, and the detection cost of the circuit board protective layer is reduced; furthermore, the thickness of the protective layer is obtained by utilizing the light image and the point cloud data of the circuit board, and compared with the traditional brightness fitting technology, the application can improve the testing accuracy.
Drawings
For a clearer description of the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a flow chart of an embodiment of a method for detecting thickness of a circuit board protective layer according to the present application;
FIG. 2 is a flowchart of step S400 in the embodiment of FIG. 1;
FIG. 3 is a flowchart of step S420 in the embodiment of FIG. 2;
FIG. 4 is a flowchart of step S430 in the embodiment of FIG. 2;
FIG. 5 is a schematic diagram illustrating an embodiment of a thickness detection system for a circuit board protective layer according to the present application;
FIG. 6 is a schematic diagram illustrating the structure of an embodiment of a storage medium of the present application;
FIG. 7 is a schematic view of an optical image according to an embodiment of the present application;
Fig. 8 is a schematic diagram of the result of the optical image recognition of the embodiment of fig. 7.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are intended to be within the scope of the present disclosure.
In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present application will be understood in detail by those of ordinary skill in the art.
In embodiments of the application, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Referring to fig. 1, fig. 1 is a flow chart illustrating an embodiment of a method for detecting a thickness of a circuit board protection layer according to the present application. As shown in fig. 1, the thickness detection method of the circuit board protective layer includes the following steps:
s100: an optical image of a side of the circuit board provided with the protective layer is acquired.
And acquiring an optical image of one side, which is to be detected, of the circuit board provided with the protective layer, wherein the circuit board provided with the protective layer can be a single-layer board or a multi-layer board. For a single-layer circuit board, acquiring an optical image of one side of the single-layer circuit board, which is provided with a protective layer and an electronic element; for the multilayer board, an optical image on either side of the electronic component and a protective layer provided in either surface layer may be taken.
Wherein, the light image refers to: when monochromatic light is irradiated on an object provided with a protective layer, an image of the object including the protective layer is acquired. Since the material of the protective layer is different, the capability of absorbing monochromatic light or reflecting monochromatic light is different, an ultraviolet light image, an infrared light image, or the like of an object provided with the protective layer can be obtained according to the capability of the protective layer to reflect monochromatic light, or the like. For example, ultraviolet light can be emitted by ultraviolet light equipment, the ultraviolet light irradiates on one side of the circuit board provided with the protective layer and the electronic component, and then the ultraviolet light image of the protective layer of the circuit board is obtained by equipment with a camera. Referring to fig. 7, a protective layer is disposed on a circuit board, and when ultraviolet light irradiates the circuit board, a region covered with the protective layer on the circuit board can reflect blue light, and a region not covered with the protective layer is light of other colors.
The device for acquiring the light image may be a common camera, an intelligent device including a camera, a high-precision camera, or the like.
S200: and identifying the light image to obtain a protective layer coverage area and a non-coverage area on one side of the circuit board.
Since the protective layers can emit different lights under the irradiation of monochromatic light, the obtained light image (as shown in fig. 7) of the circuit board provided with the protective layers is identified, and image information in the light image of the circuit board is processed, so that the protective layers on the light image can be divided into areas, the areas provided with the protective layers are protective layer coverage areas, and the areas without the protective layers are non-coverage areas. Specifically, this can be achieved by step S210.
Step S210: and identifying the light image, and acquiring at least one protection layer coverage area and at least one non-coverage area on one side of the circuit board.
Different circuit boards are inconsistent in component and wiring layout, some components are compact in layout, some components are scattered, when protective layers are arranged on the circuit boards, the coverage areas of the circuit board protective layers with compact layout are concentrated, and the circuit board protective layers with scattered layout are scattered correspondingly.
In order to realize accurate detection of the thickness of each position of the protective layer of the circuit board, the protective layer coverage area of the circuit board can be divided to obtain at least one protective layer coverage area and at least one non-coverage area (as shown in fig. 8), so as to obtain the thickness of the protective layer of the target area in the protective layer coverage area according to measurement requirements.
And the validity of the thickness measurement data of the protective layer is ensured by acquiring at least one protective layer coverage area and at least one non-coverage area on one side of the circuit board, so that the reliability of the thickness detection of the protective layer of the circuit board is improved.
S300: and acquiring point cloud data of one side of the circuit board.
The point cloud data can be acquired by a laser radar, a stereo camera or a transition time camera and the like. According to the embodiment, the point cloud data of the circuit board can be obtained through the laser scanning sensor, wherein laser emitted by the laser scanning sensor is arranged so as not to penetrate through the protective layer arranged on the circuit board, and therefore the accuracy of the point cloud data is improved.
S400: and calculating the point cloud data to obtain first height information of the coverage area of the protection layer and second height information of the non-coverage area.
And calculating the obtained point cloud data on one side of the circuit board, and respectively calculating the first height information of the coverage area of the protective layer and the second height information of the non-coverage area through position information and the like of the point cloud data.
In one embodiment, step S400 may be implemented as follows.
Referring to fig. 2, fig. 2 is a flowchart illustrating step S400 in the embodiment of fig. 1. As shown in fig. 2, step S400 includes the following specific steps:
step S410: and determining a non-coverage area closest to the coverage area of the protective layer.
For the obtained coverage area and non-coverage area of the protection layer, when only one coverage area and one non-coverage area of the protection layer exist, the thickness of the protection layer can be directly determined based on the first height information of the coverage area of the protection layer and the second height information of the non-coverage area; when there are a plurality of protection layer coverage areas and non-coverage areas, a non-coverage area closest to any one protection layer coverage area can be determined as a corresponding non-coverage area, so that the thickness of the protection layer of the protection coverage area can be determined based on the first height information of the protection layer coverage area and the second height information of the non-coverage area corresponding to the protection layer coverage area.
Step S420: and acquiring first point cloud data of the coverage area of the protection layer and second point cloud data of a non-coverage area closest to the first point cloud data based on the point cloud data.
After confirming the coverage area of the protection layer and the non-coverage area closest to the coverage area, acquiring first point cloud data of the coverage area of the protection layer and second point cloud data of the non-coverage area closest to the first point cloud data from the point cloud data. Specifically, the method may be implemented by the following steps included in step S420.
Referring to fig. 3, fig. 3 is a flowchart illustrating step S420 in the embodiment of fig. 2. As shown in fig. 3, step S420 includes the following specific steps:
Step S421: and determining a first target point, and acquiring a first target area of the coverage area of the protective layer based on the first target point.
In the selected coverage area of the protective layer, a target point is selected as the first target point. The first target point is determined to be located in the coverage area of the protective layer and located in the non-device area of the circuit board by performing other image recognition on the circuit board and recognizing the non-device area and the device area of the circuit board. A first target area taking a first target point as a circle center and a circular area with the radius of 1mm as a protective layer coverage area can be obtained; or a plurality of first target points are taken and are sequentially connected, and the area between the connecting points is used as a first target area of the coverage area of the protective layer.
Step S422: and acquiring first point cloud data of the first target area from the point cloud data.
And acquiring first point cloud data corresponding to the first target area from the acquired point cloud data.
Step S423: and determining a second target point, and acquiring a second target area of the non-coverage area of the protective layer based on the second target point. In step S410, a non-covered area closest to the covered area of the protective layer has been determined, and in this non-covered area, a second target point is determined, in a similar way as the first target point. When a second target area of the non-coverage area is acquired, a circular area with the radius of 1mm and the second target point serving as the center of a circle can be acquired in the same manner as the second target area of the non-coverage area; or a plurality of second target points are taken and are sequentially connected, and the area between the connecting points is used as a second target area of the non-coverage area.
The method of acquiring the second target area may be consistent with the method of acquiring the first target area to reduce errors.
Step S424: and acquiring second point cloud data of a second target area from the point cloud data.
And acquiring second point cloud data corresponding to the second target area from the acquired point cloud data.
The first target area taking the first target point as a reference is acquired in the coverage area of the protective layer, the second target area taking the second target point as a reference is acquired in the non-coverage area, and the first point cloud data of the first target area and the second point cloud data of the second target area are acquired, so that the boundaries of the coverage area and the non-coverage area of the whole protective layer are not required to be identified, the corresponding point cloud data is determined, and the detection efficiency can be improved.
Step S430: and acquiring first height information of the coverage area of the protective layer based on the first point cloud data, and acquiring second height information of the non-coverage area closest to the second point cloud data.
The method comprises the steps of obtaining first height information of a coverage area of a protective layer based on first point cloud data, and obtaining second height information of a non-coverage area closest to the first point cloud data based on second point cloud data.
Selecting a non-coverage area closest to the coverage area of the protection layer, selecting first point cloud data and second point cloud data of the non-coverage area in the corresponding coverage area, and acquiring first height information corresponding to the first point cloud data and second height information corresponding to the second point cloud data. The point cloud data of the non-coverage area closest to the coverage area of the protection layer is selected, so that errors of the coverage area and the non-coverage area data are reduced, and the accuracy of detecting the thickness of the protection layer of the circuit board is improved.
Specifically, the following steps included in step S430 may be implemented.
Referring to fig. 4, fig. 4 is a flowchart illustrating step S430 in the embodiment of fig. 2. As shown in fig. 4, step S430 includes the following specific steps:
step S431: a first height of each point cloud of a first target area from the first point cloud data is obtained.
After a first target area of the coverage area of the protective layer is determined, a first height of each point cloud is obtained from the first point cloud data.
Step S432: and calculating the average value of the first heights as the first heights of the first target areas.
And carrying out average value operation on the obtained first height of each point cloud of the first target area, and taking the average value as the first height of the first target area.
Step S433: and acquiring a second height of each point cloud of the second target area from the second point cloud data.
And determining a second target area of the non-coverage area, and acquiring a second height of each point cloud from the second point cloud data.
Step S434: and calculating the average value of the second height as the second height of the second target area.
And carrying out average value operation on the obtained first height of each point cloud of the second target area, and taking the average value as the second height of the second target area.
By acquiring the height values of all the point cloud data of the target area and taking the average value of the height values of all the point cloud data as the height value of the target area, the reliability of the height value of the target area can be improved, so that the error of thickness calculation is reduced, and the accuracy of thickness detection is improved.
The first height of the first target region within the protective layer coverage area may be taken as the first height of the protective layer coverage area, or the average of the first heights of the plurality of first target regions within the protective layer coverage area may be taken as the first height of the protective layer coverage area.
The second height of the second target area in the non-covered area may be taken as the second height of the non-covered area, or the average of the second heights of the plurality of second target areas in the non-covered area may be taken as the second height of the non-covered area.
S500: and acquiring the thickness of the protective layer based on the first height information and the second height information.
And (3) carrying out difference operation on the two pieces of height information based on the first height information of the coverage area and the second height information of the non-coverage area of the protective layer of the circuit board, wherein the difference value is the thickness value of the protective layer on the circuit board. Specifically, this can be achieved by step S510.
Step S510: and taking the absolute value of the difference between the first and second heights as the thickness of the protective layer based on the first height corresponding to the first point cloud data of the first target area and the second height corresponding to the second point cloud data of the second target area.
And carrying out difference operation on the obtained first height corresponding to the first point cloud data based on the first target area and the obtained second height corresponding to the second point cloud data of the second target area, wherein the thickness of the protective layer is the absolute value of the difference of the two heights.
The obtained first height of the first target area and the obtained second height of the second target area are used as the thickness of the protective layer, namely, the obtained data are subjected to simple difference operation, so that the detection rate of the thickness of the protective layer of the circuit board can be improved.
In other embodiments, the average of the thicknesses of the protective layers corresponding to the coverage areas of the plurality of protective layers may also be used as the thickness of the protective layer of the entire circuit board.
According to the method for detecting the thickness of the circuit board protective layer, the obtained light image of the circuit board provided with the protective layer is used for identifying the light image so as to distinguish the covered area and the uncovered area of the protective layer on the circuit board, the obtained point cloud data of the circuit board are used for respectively obtaining the first height of the covered area and the second height of the uncovered area of the protective layer on the circuit board, and finally the thickness of the protective layer is calculated by utilizing the first height and the second height. The thickness of the protective layer of the circuit board can be detected by the method; in addition, the requirement on the lens for acquiring the optical image of the circuit board is low, and the acquisition of the point cloud data only needs a proper laser scanning sensor, so that the manufacturing cost is lower than that of a spectral confocal sensor, and the detection cost of the circuit board protective layer is reduced; furthermore, the thickness of the protective layer is obtained by utilizing the light image and the point cloud data of the circuit board, and compared with the traditional brightness fitting technology, the application can improve the testing accuracy.
In one embodiment, the protective layer on the circuit board is a three-proofing adhesive, referring to fig. 7 and 8, fig. 7 is a schematic diagram of an optical image according to an embodiment of the present application, and fig. 8 is a schematic diagram of a result after the optical image of the embodiment of fig. 7 is identified. By acquiring an ultraviolet light image of one side of the circuit board, which is provided with the three-proofing glue, as shown in fig. 7, the three-proofing glue emits blue light under the irradiation of ultraviolet light, the part covered with the three-proofing glue is a white area, and the black part is free of the three-proofing glue; identifying the ultraviolet light image, and acquiring a three-proofing adhesive coverage area and a non-coverage area of one side of the circuit board as shown in fig. 8; scanning by using a laser line scanning sensor to obtain point cloud data of one side of the circuit board, selecting a region without components in a three-proofing glue coverage area, determining a circular region with a radius of 1mm in the coverage area, obtaining height information of all point clouds of the circular region in the point cloud data, and carrying out average value calculation on all the height information to serve as the height of the three-proofing glue coverage area; and the height of a non-covered area closest to the covered area of the three-proofing glue is obtained in the same way, and finally the thickness of the three-proofing glue is obtained by performing difference operation on the two heights.
The application also provides a thickness detection system of the circuit protection layer, referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of the thickness detection system of the application. As shown in fig. 5, the thickness detection system 50 includes an illumination device 510, an image acquisition circuit 520, a laser scanning sensor 530, and a processor 540; the illumination device 510 is used for generating an optical signal on one side of the circuit board provided with the protective layer; the image acquisition circuit 520 is used for acquiring an optical image of one side of the circuit board provided with the protective layer; the laser scanning sensor 530 is used for acquiring point cloud data of one side of the circuit board; the processor 540 is connected to the illumination device 510, the laser scanning sensor 530, and the image acquisition circuit 520, and is used for controlling the illumination device 510 to generate an optical signal, acquiring an optical image from the image acquisition circuit 520, and detecting the thickness of the protective layer by using a thickness detection method.
The detection system 50 of the circuit protection layer includes an illumination device 510, an image acquisition circuit 520, a laser scanning sensor 530, and a processor 540, wherein the processor 540 is respectively connected with the illumination device 510, the point cloud sensor, and the image acquisition circuit 520. The processor 540 provides an optical signal by controlling the illumination device 510, and controls the image acquisition circuit 520 to acquire an optical image of a side of the circuit board provided with the protective layer and acquire the optical image, wherein the optical image of the side of the circuit board provided with the protective layer acquired by the image acquisition circuit 520 may include an ultraviolet light image, a color image, and the like; the processor 540 also controls the laser scanning sensor 530 to perform laser line scanning on the side of the circuit board provided with the protective layer, and obtains point cloud data of the side of the circuit board provided with the protective layer. Finally, the processor 540 detects the thickness of the protective layer by using any of the above thickness detection method embodiments based on the obtained light image and the point cloud data, which is not described herein.
According to the circuit board protective layer thickness detection system 50 provided by the application, the image acquisition circuit 520 and the laser scanning sensor 530 are used for acquiring the light image and the point cloud data of the circuit board, the visual field range is large, and the protective layer thickness of the circuit board provided with the patch and the plug-in can be detected.
Another aspect of the present application is to provide a storage medium, and referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a storage medium according to the present application. As shown in fig. 6, the storage medium 60 stores a computer program 610, and the computer program 610 is executable by a processor to implement the thickness detection method according to the embodiment of the method of the present application.
In the description of the present application, a description of the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, mechanism, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, mechanisms, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing mechanisms, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present application in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order from that shown or discussed, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present application.
Logic and/or steps represented in the flowcharts or otherwise described herein, e.g., may be considered as a ordered listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device (which can be a personal computer, server, network device, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions). For the purposes of this description, storage medium 60 can be any apparatus that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer storage medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). In addition, the computer readable medium may even be paper or other suitable medium on which the program is printed, as the program may be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (9)
1. A method for detecting thickness of a protective layer of a circuit board, the method comprising:
Acquiring an optical image of one side of the circuit board provided with the protective layer;
Identifying the light image, and acquiring at least one protection layer coverage area and at least one non-coverage area of one side of the circuit board;
Acquiring point cloud data of the side of the circuit board;
Calculating the point cloud data to obtain first height information of the coverage area of the protection layer and second height information of the non-coverage area; the second height information is the second height information of a non-coverage area closest to the coverage area of the protection layer;
And acquiring the thickness of the protective layer based on the first height information and the second height information.
2. The method of claim 1, wherein the calculating the point cloud data to obtain the first height information of the covered region of the protective layer and the second height information of the uncovered region includes:
determining a non-coverage area closest to the coverage area of the protective layer;
Acquiring first point cloud data of the coverage area of the protection layer and second point cloud data of the non-coverage area closest to the first point cloud data based on the point cloud data;
And acquiring first height information of the coverage area of the protective layer based on the first point cloud data, and acquiring second height information of the non-coverage area closest to the first point cloud data based on the second point cloud data.
3. The thickness detection method according to claim 2, wherein the acquiring, based on the point cloud data, first point cloud data of the covered region of the protective layer and second point cloud data of the non-covered region closest to the protective layer includes:
determining a first target point, and acquiring a first target area of the coverage area of the protective layer;
Acquiring first point cloud data of the first target area from the point cloud data;
determining a second target point, and acquiring a second target area of the non-coverage area of the protective layer based on the second target point;
And acquiring second point cloud data of the second target area from the point cloud data.
4. The thickness detection method according to claim 3, wherein the acquiring the first height information of the covered region of the protective layer based on the first point cloud data and the second height information of the non-covered region closest to the protective layer based on the second point cloud data includes:
Acquiring a first height of each point cloud of the first target area from first point cloud data;
Calculating the average value of the first heights as the first height of the first target area;
acquiring a second height of each point cloud of the second target area from second point cloud data;
and calculating the average value of the second height as the second height of the second target area.
5. The method according to claim 4, wherein obtaining the thickness of the protective layer based on the first height information and the second height information, comprises:
And taking the absolute value of the difference value of the first and second heights as the thickness of the protective layer based on the first height corresponding to the first point cloud data of the first target area and the second height corresponding to the second point cloud data of the second target area.
6. A thickness detection method according to claim 3, wherein the first target point is located in a device-free region of the circuit board.
7. A thickness detection system for a protective layer of a circuit board, the thickness detection system comprising:
the illumination device is used for generating an optical signal on one side of the circuit board, which is provided with the protective layer;
the image acquisition circuit is used for acquiring an optical image of one side of the circuit board provided with the protective layer;
The laser scanning sensor is used for acquiring point cloud data of one side of the circuit board;
And the processor is connected with the illumination device, the laser scanning sensor and the image acquisition circuit, and is used for controlling the illumination device to generate light signals, acquiring light images from the image acquisition circuit and detecting the thickness of the protective layer by adopting the thickness detection method according to any one of claims 1-6.
8. The thickness detection system according to claim 7, wherein the circuit board light image comprises an ultraviolet light image.
9. A storage medium storing a computer program executable by a processor to implement the thickness detection method of any one of claims 1-6.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101215083B1 (en) * | 2011-12-27 | 2012-12-24 | 경북대학교 산학협력단 | Method for generating height information of board inspection apparatus |
| JP2019100753A (en) * | 2017-11-29 | 2019-06-24 | アンリツ株式会社 | Printed circuit board inspection device and printed circuit board inspection method |
| WO2019224534A1 (en) * | 2018-05-21 | 2019-11-28 | 3D Automated Metrology Inspection Limited | Apparatus for monitoring a coating |
| WO2020165386A1 (en) * | 2019-02-15 | 2020-08-20 | Atotech Deutschland Gmbh | Method for obtaining information about a layer of an organic solderability preservative on a printed circuit board |
| CN112611763A (en) * | 2019-09-20 | 2021-04-06 | 深圳市腾盛精密装备股份有限公司 | Transparent body detection method and system based on spectrum confocal |
| CN113240724A (en) * | 2021-05-14 | 2021-08-10 | 长江存储科技有限责任公司 | Thickness detection method and related product |
| WO2021213241A1 (en) * | 2020-04-20 | 2021-10-28 | 上海商汤临港智能科技有限公司 | Target detection method and apparatus, and electronic device, storage medium and program |
| CN114283121A (en) * | 2021-12-02 | 2022-04-05 | 湖南三一中益机械有限公司 | Paving width detection method and device, readable storage medium and paver |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140198185A1 (en) * | 2013-01-17 | 2014-07-17 | Cyberoptics Corporation | Multi-camera sensor for three-dimensional imaging of a circuit board |
| US11216928B2 (en) * | 2019-09-10 | 2022-01-04 | The Boeing Company | Method and apparatus for coating thickness inspection of a surface and coating defects of the surface |
-
2022
- 2022-05-12 CN CN202210520945.0A patent/CN117091516B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101215083B1 (en) * | 2011-12-27 | 2012-12-24 | 경북대학교 산학협력단 | Method for generating height information of board inspection apparatus |
| JP2019100753A (en) * | 2017-11-29 | 2019-06-24 | アンリツ株式会社 | Printed circuit board inspection device and printed circuit board inspection method |
| WO2019224534A1 (en) * | 2018-05-21 | 2019-11-28 | 3D Automated Metrology Inspection Limited | Apparatus for monitoring a coating |
| WO2020165386A1 (en) * | 2019-02-15 | 2020-08-20 | Atotech Deutschland Gmbh | Method for obtaining information about a layer of an organic solderability preservative on a printed circuit board |
| CN112611763A (en) * | 2019-09-20 | 2021-04-06 | 深圳市腾盛精密装备股份有限公司 | Transparent body detection method and system based on spectrum confocal |
| WO2021213241A1 (en) * | 2020-04-20 | 2021-10-28 | 上海商汤临港智能科技有限公司 | Target detection method and apparatus, and electronic device, storage medium and program |
| CN113240724A (en) * | 2021-05-14 | 2021-08-10 | 长江存储科技有限责任公司 | Thickness detection method and related product |
| CN114283121A (en) * | 2021-12-02 | 2022-04-05 | 湖南三一中益机械有限公司 | Paving width detection method and device, readable storage medium and paver |
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