CN117025102B - Photo-thermal dual-curing adhesive for camera module and preparation method thereof - Google Patents
Photo-thermal dual-curing adhesive for camera module and preparation method thereof Download PDFInfo
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- CN117025102B CN117025102B CN202311194066.4A CN202311194066A CN117025102B CN 117025102 B CN117025102 B CN 117025102B CN 202311194066 A CN202311194066 A CN 202311194066A CN 117025102 B CN117025102 B CN 117025102B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 48
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 48
- 238000002360 preparation method Methods 0.000 title claims description 24
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 7
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 28
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 230000009977 dual effect Effects 0.000 claims description 17
- 239000002202 Polyethylene glycol Substances 0.000 claims description 15
- 229920001223 polyethylene glycol Polymers 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- -1 acrylic ester Chemical class 0.000 claims description 10
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 7
- 150000003573 thiols Chemical class 0.000 claims description 7
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 5
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000000049 pigment Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 claims description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical group CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 3
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 2
- JJSYPAGPNHFLML-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylpropanoic acid Chemical compound OC(=O)CCS.OC(=O)CCS.OC(=O)CCS.CCC(CO)(CO)CO JJSYPAGPNHFLML-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- GDUZPNKSJOOIDA-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-methylprop-2-enoate Chemical compound C1C(OC(=O)C(=C)C)CCC2OC21 GDUZPNKSJOOIDA-UHFFFAOYSA-N 0.000 claims description 2
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 claims description 2
- BDAHDQGVJHDLHQ-UHFFFAOYSA-N [2-(1-hydroxycyclohexyl)phenyl]-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C1(O)CCCCC1 BDAHDQGVJHDLHQ-UHFFFAOYSA-N 0.000 claims description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 claims description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- 238000012824 chemical production Methods 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 2
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000004005 microsphere Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920006295 polythiol Polymers 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000013008 thixotropic agent Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- JKTORXLUQLQJCM-UHFFFAOYSA-N 4-phosphonobutylphosphonic acid Chemical compound OP(O)(=O)CCCCP(O)(O)=O JKTORXLUQLQJCM-UHFFFAOYSA-N 0.000 claims 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 63
- 238000012360 testing method Methods 0.000 abstract description 13
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 abstract description 8
- 230000032683 aging Effects 0.000 abstract description 5
- 238000013007 heat curing Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 18
- 238000000016 photochemical curing Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical group CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000002390 rotary evaporation Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NJUCLWRFJKIHPV-UHFFFAOYSA-N CCCC.SC(CC(=O)O)C Chemical compound CCCC.SC(CC(=O)O)C NJUCLWRFJKIHPV-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- IEZWOVIWXFLQTP-UHFFFAOYSA-N hydroperoxyethene Chemical compound OOC=C IEZWOVIWXFLQTP-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000037048 polymerization activity Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a photo-thermal dual-curing adhesive for a camera module, which comprises the following raw materials in parts by mass: a photo-thermal dual-curing compound, a polyfunctional acrylate monomer, an epoxy diluent, isobornyl (meth) acrylate, a photoinitiator, a latent curing agent, a thermosetting agent, fumed silica, a filler and a black material; the photo-thermal dual-curing compound contains at least one or more polymerizable carbon-carbon unsaturated double bonds and one or more epoxy groups. The photo-thermal dual-curing adhesive provided by the invention has excellent comprehensive performance, can be rapidly photo-cured within 2s, and has high initial adhesion; after heat curing, the adhesive strength is high, and the adhesive strength is not reduced basically through cold and hot impact, double 85 wet and heat aging and drop tests. The adhesive is very suitable for electronic precision devices such as camera modules and the like.
Description
Technical Field
The invention belongs to the field of electronic adhesives, and particularly relates to a photo-thermal dual-curing adhesive for a camera module and a preparation method thereof.
Background
The glue for the camera module requires long-term stable adhesion, and can resist wet heat aging; and simultaneously, the curing speed is required to be high, and the curing time is required to be as high as tens of seconds or even a few seconds. The traditional UV glue leaves gaps in places where UV irradiation cannot be achieved, the camera module is damaged, and the UV glue of an acrylic acid system cannot meet the bonding requirement of the camera module.
The camera module glue is usually photo-thermal dual-curing glue, the photo-curing achieves primary positioning, the curing speed is high, the camera module glue is positioned by using illumination of a few seconds, a certain primary adhesive force is achieved, the energy consumption is low, no VOC is generated, and the camera module glue is environment-friendly. After other dispensing processes are completed, the materials are transferred to an oven for baking, and the invisible light part is finally solidified by adopting thermosetting, so that the curing temperature is low, the bonding strength is high, and the reliability is good.
The camera module is a fine electronic product component, and the parameter requirement on the glue is extremely fine, so that the comprehensive performance of the camera module is required to be considered. Compared with other common photo-thermal dual-curing glue, the special feature of the camera module AA (active focusing) Cheng Jiaoshui is that a certain initial adhesion force is required in a few seconds of illumination, the motor is adjusted to automatically focus, and after focusing, threads are fastened and do not run out of focus, so that quick curing (a few seconds) and a certain initial adhesion force are required (no running out of focus); and durable aging-resistant adhesive strength (resistance to damp heat and exercise vibration); meanwhile, in order to facilitate repair, the camera module can be disassembled and assembled conveniently and rapidly without damage, and the glue can be required to be removed in a glue removing agent or heating, softening and stripping mode; in addition, the glue is required to have yellowing resistance, ultraviolet resistance, good fluidity and low thermal expansion coefficient after curing.
The english-chemical industry stock developed several types of glue dedicated for camera modules, and UV-heated dual-solid glue AAUV suitable for AA process 1160 currently occupies most of the market. Moreover, at present, the domestic manufacturers of the glue do not substitute products, the import is completely relied on, and the development of the UV heating double-solid glue suitable for the AA process has important significance and commercial value.
CN115109195A discloses a bio-based photo-thermal dual-curing filling adhesive, wherein the photo-curing resin is formed by mixing bio-based photo-curing resin, hydroxy modified epoxy acrylate, polyester acrylate and polyurethane acrylate, the bio-based photo-curing resin is grease modified acrylate resin, and the grease is linseed oil, tung oil, soybean oil, castor oil, rosin and the like. The filling glue meets the current environmental protection requirement and avoids using a large amount of petroleum carbon materials. However, the performance in the field of camera modules cannot meet the requirements, the photo-curing time is slow, the initial adhesion cannot meet the requirements, and the camera module is not resistant to wet heat aging and cold and hot impact. Adhesives are not suitable in the field of camera modules, which are increasingly stringent in terms of requirements.
CN114381208a discloses a photo-thermal dual-curing adhesive, which adopts a multifunctional photo-curing compound and a modified epoxy resin, wherein the multifunctional photo-curing monomer contains more than 2 polymerizable unsaturated bonds, the modified epoxy resin contains hydroxyl groups and isocyanate groups, and the equivalent ratio of OH to NCO is 0.5 to 1.5. The photo-thermal dual-curing adhesive has excellent moisture and heat resistance and cold and hot thermal shock resistance, but has low photo-curing speed and low initial adhesion. The requirement of the fine operation of the camera module cannot be met.
CN114507333a discloses a high-toughness, high-weather-resistant photo-thermal dual-curing resin, wherein the photo-thermal dual-curing resin has the structure of the following formula (I):
The epoxy resin has three epoxy groups and one carbon-carbon unsaturated double bond, and the epoxy groups and the double bond are introduced into the organic silicon chain segment, so that the glue has the performances of high weather resistance, high heat resistance, shock resistance, hydrophobicity and corrosion resistance, has no micromolecular volatile matters, and is environment-friendly. However, the initial adhesion of photo-curing can not meet the assembly requirement of a precise camera module, and is easy to run out, so that reworking is required or the performance of the camera is poor.
CN111205777a discloses a trifunctional resin having the structural formula:
The preparation method is characterized in that the preparation method is obtained by reacting polyacrylic acid glycidyl ether with hydroxyl vinyl ether and acrylic acid, and double bonds with photoinitiated polymerization activity are introduced into the side chain of the polyacrylic acid glycidyl ether by utilizing the reaction of epoxy groups and hydroxyl groups or carboxyl groups on the polyacrylic acid glycidyl ether. Overcomes the defect of poor compatibility of the general photo-cured acrylic resin and the thermosetting epoxy resin. However, the photo-thermal dual-curing active substance containing epoxy groups and double bonds is a polymer, so that the viscosity of the adhesive is higher, and the defects of inconvenient construction and high residue rate of a precise electronic device such as a camera module adhesive dispensing process still exist.
Disclosure of Invention
In order to realize a domestic alternative solution, the invention provides a photo-thermal dual-curing adhesive which can meet the requirements of the manufacturing process of a camera module AA. The adhesive has the advantages of high photo-curing speed, high initial adhesion, high bonding strength after heat curing, high heat and humidity resistance, cold and hot impact resistance and drop test. Is very suitable for being used as an adhesive for manufacturing precise electronic devices such as camera module AA. In order to achieve the above purpose, the present invention provides the following technical solutions:
A photo-thermal dual-curing adhesive for a camera module comprises the following raw materials in parts by mass: 20-40 parts of photo-thermal dual-curing compound, 3-5 parts of polyfunctional acrylate monomer, 10-20 parts of epoxy diluent, 5-10 parts of isobornyl (meth) acrylate, 1-5 parts of photoinitiator, 5-10 parts of latent curing agent, 10-20 parts of thermosetting agent, 1-10 parts of fumed silica, 10-30 parts of filler and 0.1-1 part of black pigment; the photo-thermal dual-curing compound contains at least one or more polymerizable carbon-carbon unsaturated double bonds and one or more epoxy groups.
Further, in the photo-thermal dual-curing compound, the total functionality is more than or equal to 4, and the total functionality is the total mole number of carbon-carbon unsaturated double bonds and epoxy groups in 1mol of the photo-thermal dual-curing compound.
Further, the photo-thermal dual-curing compound has a structural formula shown in the following formula (I):
Wherein R is
Wherein R 1、R2 is independently H or-CH 3, represents a bond to S; m is an integer between 10 and 20; the quantitative ratio of formula (II) to formula (III) is 2:4 to 4:2. in the present invention, the quantitative ratio of the formula (II) to the formula (III) is calculated as the molar ratio of the (meth) acrylic acid and the six-arm polyethylene glycol mercaptan added at the time of preparation.
Further, the photo-thermal dual curing compound is prepared by a preparation method comprising the following steps:
Reacting six-arm polyethylene glycol mercaptan and glycidyl (meth) acrylate under the conditions of a photoinitiator and ultraviolet irradiation; and then adding (methyl) acrylic acid, and reacting in the presence of a catalyst and a polymerization inhibitor to obtain the photo-thermal dual-curing compound.
Still further, the mole ratio of six-arm polyethylene glycol thiol, glycidyl (meth) acrylate, and (meth) acrylic acid is 1:6.1-6.5:2-4, preferably 1:6.2-6.3:3.
Further, the photoinitiator is DMAP, the addition amount is 1-2wt% of the mass of the hexa-arm polyethylene glycol mercaptan, the reaction of the hexa-arm polyethylene glycol mercaptan and glycidyl (meth) acrylate is carried out in an organic solvent, the reaction condition is that the reaction is carried out under normal-temperature UV irradiation for 0.5-1h, and the organic solvent is at least one of ethyl acetate and ethylene glycol dimethyl ether; the catalyst is 3, 5-diisopropyl chromium salicylate, and the catalyst dosage is 0.5-1wt% of (methyl) acrylic acid; the polymerization inhibitor is 2, 6-di-tert-butyl-p-methylphenol, and the amount of the polymerization inhibitor is 3-5wt% of the mass of (methyl) acrylic acid; further, the catalyst and the polymerization inhibitor are dispersed in (methyl) acrylic acid, the (methyl) acrylic acid containing the catalyst and the polymerization inhibitor is slowly added, after the addition is completed for 1 to 2 hours, the reaction condition after the addition is that the temperature is controlled to be 60 to 70 ℃, the reaction is carried out for 5 to 10 hours, when the acid value of the system is less than 5mgKOH/g, the reaction is considered to be completed, the cooling is carried out, and the solvent and unreacted substances are removed by rotary evaporation, thus obtaining the photo-thermal dual-curing compound.
When the photo-thermal dual-curing compound is prepared, firstly, the six-arm polyethylene glycol thiol reacts with glycidyl (methyl) acrylate to carry out click chemistry reaction of sulfhydryl-alkenyl, the reaction can be completed efficiently, the yield is high, the sulfhydryl on the six-arm polyethylene glycol thiol can be basically considered to participate in the reaction and become an intermediate product with epoxy group at the end band, at the moment, (methyl) acrylic acid is added, the ring-opening reaction of epoxy group and carboxyl group occurs in the presence of a catalyst and a polymerization inhibitor, the addition amount of the (methyl) acrylic acid is insufficient to enable the epoxy group to react, and finally, the compound with both epoxy group and carbon-carbon unsaturated double bond at the end group is obtained, namely the photo-thermal dual-curing compound.
Further, the epoxy diluent is acrylic ester containing epoxy groups, and specifically at least one selected from glycidyl methacrylate and 3, 4-epoxy cyclohexyl methacrylate.
The polyfunctional acrylate monomer is at least one selected from 1, 6-hexanediol diacrylate, trimethylolpropane triacrylate and pentaerythritol triacrylate.
The photoinitiator is at least one selected from 2-hydroxy 2-methyl-1-phenylpropion, 1-hydroxycyclohexyl benzophenone, 2-methyl-1- (4-methylthiophenyl) -2-morpholin-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide, alpha' -dimethylbenzoyl ketal, isopropylthioxanthone, benzophenone, methyl o-benzoylbenzoate and 2,4, 6-trimethylbenzoyl diphenyl phosphorus oxide.
The thermosetting agent is a mercaptan curing agent, and is specifically selected from at least one of pentaerythritol tetra (3-mercaptopropionate), trimethylolpropane tri (3-mercaptopropionate), 1, 4-di (3-mercaptobutyric acid) butane, 1,3, 5-tri (3-mercaptobutyric acid) isocyanurate and polythiol.
The latent curing agent is one or more selected from Amicure PN-23, amicure PN-40, amicure PN-50, amicure PN-H, fuji chemical production Fujicure FXE-1000, FXR-1081, FXR-1020, FXR-1030, EH3293S, EH-5011S, EH4360S of ADEKA and EH-5057 PK.
The fumed silica, which acts as a thixotropic agent, has a specific surface area of 100-220m 2/g, such as cabot TS720, winning R202, R972, W g H20.
The black pigment is at least one selected from carbon black, iron black and titanium black; the filler is at least one selected from spherical silica, calcium silicate, calcium carbonate, clay, aluminum oxide, magnesium oxide, hollow polystyrene microsphere, mica and silica micropowder, and has a particle size of 1-10 μm.
The invention also provides a preparation method of the photo-thermal dual-curing adhesive for the camera module, which comprises the following steps: the photo-thermal dual-curing adhesive is prepared by putting a photo-thermal dual-curing compound, a polyfunctional acrylate monomer, an epoxy diluent, isobornyl (meth) acrylate, a photoinitiator, a latent curing agent, a thermosetting agent, a filler and a black material into a dual-planetary stirring kettle, adding fumed silica after uniformly stirring in vacuum, and uniformly stirring again.
The invention has the excellent effects that:
1. The photo-thermal dual-curing adhesive is single-component, has good fluidity, and is suitable for a precise dispensing process of a camera module; the photo-thermal dual-curing compound contains epoxy groups and carbon-carbon unsaturated double bonds, and can perform a photo-curing and thermal curing dual-curing mode; firstly, quick photo-curing is carried out, and the adhesive has higher initial adhesion, so that the coke can not run in the subsequent curing process; and then the active ingredients are heated for further heat curing, so that the rapid high-strength curing is realized, the moisture and heat resistance is realized, the bonding strength is very high, and the high-precision camera module can be kept stable under the severe environment or vibration condition. The photo-thermal dual-curing compound is linked through the flexible polyethylene glycol chain segments, so that the cured compound has higher crosslinking density and better toughness, and has beneficial anti-falling capability.
2. The adhesive for the camera module, provided by the invention, is suitable for the requirements that the size of electronic products such as mobile phones is smaller in order to prevent the running of the camera in the use process, can finish photocuring within 2s to reach qualified initial adhesion, has proper thixotropic property and locking force, adjusts the motor to automatically focus, and ensures that the tightness after focusing can meet the requirement of no running of the camera; after baking and complete curing, the adhesive strength is required to be high, and the moisture and heat resistance, cold and heat impact resistance and drop resistance test can be realized.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. The following examples facilitate a better understanding of the present invention, but are not intended to limit the same. The experimental methods in the following examples are conventional methods unless otherwise specified.
Unless otherwise specified, the parts in the embodiment of the invention are all parts by mass, and the percent is all mass percent.
Preparation example 1
1 Molar part of six-arm polyethylene glycol mercaptan (number average molecular weight 2000) and 6.2 molar parts of glycidyl methacrylate are added into ethylene glycol dimethyl ether, a photoinitiator DMAP (the addition amount is 1 weight percent of the six-arm polyethylene glycol mercaptan) is added, and the mixture is reacted for 2 hours under the irradiation condition of 270nm ultraviolet light; then slowly adding 3 mol parts of acrylic acid (containing 1wt% of 3, 5-diisopropyl chromium salicylate and 3wt% of 2, 6-di-tert-butyl p-methylphenol) into the mixture, after the addition is completed in 1h, controlling the temperature to be 60 ℃ for reaction for 6h, wherein the acid value of the system is less than 5mgKOH/g, and after the reaction is completed, cooling and rotary evaporation are carried out to obtain the photo-thermal dual-curing compound.
Preparation example 2
The other conditions and operations were the same as in preparation example 1 except that 3 parts by mole of acrylic acid was replaced with 4 parts by mole of methacrylic acid, the catalyst and the polymerization inhibitor were used in the same proportions as in preparation example 1, based on the mass of methacrylic acid.
Preparation example 3
Other conditions and operations were the same as in preparation example 1 except that the amount of acrylic acid was 2 parts by mole.
Example 1
30 Parts by mass of the photo-thermal dual-curing compound prepared in preparation example 1, 5 parts by mass of trimethylolpropane triacrylate, 15 parts by mass of glycidyl methacrylate, 8 parts by mass of isobornyl acrylate, 3 parts by mass of 2-hydroxy-2-methyl-1-phenylpropionic acid, 7 parts by mass of latent curing agent Amicure PN-40, 12 parts by mass of tetra (3-mercaptopropionic acid) pentaerythritol ester, 20 parts by mass of silica micropowder with average particle size of 5 mu m and 0.3 part by mass of carbon black are added into a dual-planetary stirring kettle, uniformly stirred under vacuum condition, then 5 parts by mass of cabot TS720 are added, uniformly stirred again, and sealed and packaged to obtain the photo-thermal dual-curing adhesive.
Example 2
20 Parts by mass of the photo-thermal dual-curing compound prepared in preparation example 1, 5 parts by mass of pentaerythritol triacrylate, 10 parts by mass of 3, 4-epoxycyclohexyl methacrylate, 5 parts by mass of isobornyl acrylate, 3 parts by mass of 2-hydroxy-2-methyl-1-phenylpropionic acid, 5 parts by mass of latent curing agent Amicure PN-23, 10 parts by mass of tetra (3-mercaptopropionic acid) pentaerythritol ester, 15 parts by mass of silica micropowder with average particle size of 5 mu m and 0.3 part by mass of carbon black are added into a dual-planetary stirring kettle, uniformly stirred under vacuum condition, then 4 parts by mass of wack H20 is added, uniformly stirred again, and sealed and packaged to obtain the photo-thermal dual-curing adhesive.
Example 3
40 Parts by mass of the photo-thermal dual-curing compound prepared in preparation example 1, 3 parts by mass of trimethylolpropane triacrylate, 20 parts by mass of glycidyl methacrylate, 10 parts by mass of isobornyl acrylate, 3 parts by mass of 2-hydroxy-2-methyl-1-phenylpropionic acid, 10 parts by mass of latent curing agent Amicure PN-40, 15 parts by mass of tetra (3-mercaptopropionic acid) pentaerythritol ester, 20 parts by mass of silica micropowder with average particle size of 5 mu m and 0.4 part by mass of carbon black are added into a dual-planetary stirring kettle, stirred uniformly under vacuum condition, then 5 parts by mass of cabot TS720 are added, stirred uniformly again, and sealed and packaged to obtain the photo-thermal dual-curing adhesive.
Example 4
Other conditions and operations were the same as in example 1 except that the photo-thermal double curable compound obtained in preparation example 1 was replaced with the photo-thermal double curable compound obtained in preparation example 2 of equal mass.
Example 5
Other conditions and operations were the same as in example 1 except that the photo-thermal double curable compound obtained in preparation example 1 was replaced with the photo-thermal double curable compound obtained in preparation example 3 of equal mass.
Comparative example 1
Other conditions and operations were the same as in example 1, except that the photo-thermal dual curable compound prepared in preparation example 1 was replaced with an equal mass of new middle chemical dual curable resin EA-1010N (containing both epoxy groups and carbon-carbon unsaturated double bonds).
Comparative example 2
Other conditions and operations were the same as in example 1 except that the photo-thermal dual curing compound prepared in preparation example 1 was replaced with Sup>A dual curing resin seSup>A-Sup>A 150H (containing both epoxy groups and carbon-carbon unsaturated double bonds) of korean SHIN-Sup>A of equal quality.
Effect example
The photo-thermal dual curing adhesives obtained in the above examples and comparative examples were subjected to the following performance test, and the results are shown in table 1.
Light curing conditions: 1500mW,365nm light source, irradiation time 2 seconds;
Heat curing conditions: 85 ℃ for 1h;
adhesion test: bonding materials: 3mm×3mm PC/LCP, thrust machine test;
viscosity test: bohler femal plate viscometer DV2T
Cold and hot impact resistance test: at 40 ℃ below zero/1 h,80 ℃ per 1h, and 100 times of cold and hot cycles.
Wet heat resistance test: the mixture was left for 500h under the conditions of double 85 experiments (85 ℃ C., 85 RH%).
Drop resistance test: 10 samples were dropped 500 times at a height of 120cm, the number of sample cracks.
After photo-setting and thermosetting, the test pieces are subjected to cold and hot impact experiments, damp-heat experiments and anti-drop experiments respectively, and after the test pieces are subjected to the experiments, the bonding strength is tested again, and compared with the thermosetting bonding strength, the bonding strength loss rate is calculated, and the lower the loss rate is, the better the adhesive performance is. Through tests, the photo-thermal dual-curing adhesive prepared by the invention maintains satisfactory bonding strength after cold and hot impact resistance, damp and heat resistance and drop resistance tests.
Table 1 photo-thermal Dual cure adhesive Performance test
Therefore, the photo-thermal dual-curing adhesive provided by the invention has excellent comprehensive performance, can be rapidly photo-cured within 2s, and has high initial adhesion; after heat curing, the adhesive has high bonding strength, basically does not decrease the bonding strength after cold and hot impact or double 85 wet and heat aging, has excellent anti-falling performance, and is very suitable for being used as an adhesive for electronic precision devices such as camera modules and the like.
Claims (10)
1. The photo-thermal dual-curing adhesive for the camera module is characterized by comprising the following raw materials in parts by mass: 20-40 parts of photo-thermal dual-curing compound, 3-5 parts of polyfunctional acrylate monomer, 10-20 parts of epoxy diluent, 5-10 parts of isobornyl (meth) acrylate, 1-5 parts of photoinitiator, 5-10 parts of latent curing agent, 10-20 parts of thermosetting agent, 1-10 parts of fumed silica, 10-30 parts of filler and 0.1-1 part of black pigment; the filler is at least one selected from calcium silicate, calcium carbonate, clay, aluminum oxide, magnesium oxide, hollow polystyrene microspheres, mica and silica micropowder; the epoxy diluent is acrylic ester containing epoxy groups; the black pigment is at least one selected from carbon black, iron black and titanium black; the photo-thermal dual-curing compound has a structural formula shown in the following formula (I):
(I)
Wherein R is (II) or
(III)
Wherein R 1、R2 is independently H or-CH 3, represents a bond to S; m is an integer between 10 and 20; the quantitative ratio of formula (II) to formula (III) is 2:4 to 4:2.
2. The photo-thermal dual curing adhesive according to claim 1, wherein the photo-thermal dual curing compound is prepared by a preparation method comprising the steps of:
Reacting six-arm polyethylene glycol mercaptan and glycidyl (meth) acrylate under the conditions of a photoinitiator and ultraviolet irradiation; and then adding (methyl) acrylic acid, and reacting in the presence of a catalyst and a polymerization inhibitor to obtain the photo-thermal dual-curing compound.
3. The photo-thermal dual curing adhesive according to claim 2, wherein the mole ratio of six-arm polyethylene glycol thiol, glycidyl (meth) acrylate, and (meth) acrylic acid is 1:6.1-6.5:2-4.
4. A photo-thermal dual curing adhesive according to claim 3, characterized in that the mole ratio of six-arm polyethylene glycol thiol, glycidyl (meth) acrylate, and (meth) acrylic acid is 1:6.2-6.3:3.
5. The photo-thermal dual curing adhesive according to claim 2, wherein the addition amount of the photoinitiator is 1-2wt% of the mass of six-arm polyethylene glycol thiol, the reaction of six-arm polyethylene glycol thiol and glycidyl (meth) acrylate is carried out in an organic solvent, the reaction condition is that the reaction is carried out for 0.5-1h under the condition of normal temperature UV irradiation, and the organic solvent is at least one of ethyl acetate and ethylene glycol dimethyl ether; the catalyst is 3, 5-diisopropyl chromium salicylate, and the catalyst dosage is 0.5-1wt% of (methyl) acrylic acid; the polymerization inhibitor is 2, 6-di-tert-butyl p-methylphenol, and the amount of the polymerization inhibitor is 3-5wt% of the mass of the (methyl) acrylic acid.
6. The photo-thermal dual curing adhesive according to claim 5, wherein the catalyst and the polymerization inhibitor are dispersed in (meth) acrylic acid, the (meth) acrylic acid containing the catalyst and the polymerization inhibitor is slowly added, the reaction condition after the addition is controlled at 60-70 ℃ after the addition is completed for 1-2 hours, the reaction is carried out for 5-10 hours, when the acid value of the system is less than 5 mgKOH/g, the reaction is completed, the cooling is carried out, and the solvent and unreacted substances are removed by spin evaporation, thereby obtaining the photo-thermal dual curing compound.
7. The photo-thermal dual curing adhesive according to claim 1, wherein the epoxy group-containing acrylate is at least one selected from glycidyl methacrylate and 3, 4-epoxycyclohexyl methacrylate.
8. The photo-thermal dual curing adhesive according to claim 1, wherein the polyfunctional acrylate monomer is at least one selected from the group consisting of 1, 6-hexanediol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate.
9. The photo-thermal dual curing adhesive according to claim 1, wherein the photoinitiator is selected from at least one of 2-hydroxy 2-methyl-1-phenylpropion, 1-hydroxycyclohexyl benzophenone, 2-methyl-1- (4-methylsulfanyl phenyl) -2-morpholin-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinphenyl) -1-butanone, bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide, α' -dimethylbenzoyl ketal, isopropylthioxanthone, benzophenone, methyl o-benzoylbenzoate, 2,4, 6-trimethylbenzoyl diphenyl phosphorus oxide;
The thermosetting agent is a mercaptan curing agent, and is specifically selected from at least one of pentaerythritol tetra (3-mercaptopropionate), trimethylolpropane tri (3-mercaptopropionate), pentaerythritol tetra (3-mercaptobutyrate), butane 1, 4-di (3-mercaptobutyrate), isocyanurate 1,3, 5-tri (3-mercaptobutyrate) and polythiol;
The latent curing agent is one or more selected from Amicure PN-23, amicure PN-40, amicure PN-50, amicure PN-H, fuji chemical production Fujicure FXE-1000, FXR-1081, FXR-1020, FXR-1030, EH3293S, EH-5011S, EH4360S of ADEKA and EH-5057 PK; the fumed silica is used as a thixotropic agent, and the specific surface area is 100-220 m 2/g;
The particle size of the filler is 1-10 mu m.
10. The method for preparing the photo-thermal dual-curing adhesive for the camera module according to any one of claims 1 to 9, which is characterized by comprising the following steps: the photo-thermal dual-curing adhesive is prepared by putting a photo-thermal dual-curing compound, a polyfunctional acrylate monomer, an epoxy diluent, isobornyl (meth) acrylate, a photoinitiator, a latent curing agent, a thermosetting agent, a filler and a black material into a dual-planetary stirring kettle, adding fumed silica after uniformly stirring in vacuum, and uniformly stirring again.
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