CN116936155A - Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof - Google Patents
Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof Download PDFInfo
- Publication number
- CN116936155A CN116936155A CN202311001463.5A CN202311001463A CN116936155A CN 116936155 A CN116936155 A CN 116936155A CN 202311001463 A CN202311001463 A CN 202311001463A CN 116936155 A CN116936155 A CN 116936155A
- Authority
- CN
- China
- Prior art keywords
- aluminum alloy
- tin
- plated
- alloy wire
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 285
- 229910002549 Fe–Cu Inorganic materials 0.000 title claims abstract description 75
- 239000004020 conductor Substances 0.000 title claims abstract description 71
- 238000002360 preparation method Methods 0.000 title claims description 22
- 239000000463 material Substances 0.000 title abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 163
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 136
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000012535 impurity Substances 0.000 claims abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 246
- 229910052759 nickel Inorganic materials 0.000 claims description 120
- 238000000034 method Methods 0.000 claims description 117
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 117
- 238000005406 washing Methods 0.000 claims description 116
- 238000009713 electroplating Methods 0.000 claims description 68
- 239000011701 zinc Substances 0.000 claims description 50
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 47
- 229910052725 zinc Inorganic materials 0.000 claims description 47
- 238000007598 dipping method Methods 0.000 claims description 36
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 241000080590 Niso Species 0.000 claims description 19
- 239000003513 alkali Substances 0.000 claims description 19
- 238000005238 degreasing Methods 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 39
- 239000000956 alloy Substances 0.000 abstract description 34
- 238000005260 corrosion Methods 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 10
- 238000010248 power generation Methods 0.000 abstract description 8
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 abstract description 6
- 230000007704 transition Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 98
- 230000008569 process Effects 0.000 description 75
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 45
- 238000003723 Smelting Methods 0.000 description 25
- 239000000203 mixture Substances 0.000 description 25
- 229910045601 alloy Inorganic materials 0.000 description 21
- 229910052782 aluminium Inorganic materials 0.000 description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 19
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 18
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 16
- 239000011734 sodium Substances 0.000 description 16
- 238000005266 casting Methods 0.000 description 15
- 238000001035 drying Methods 0.000 description 15
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 15
- 238000005096 rolling process Methods 0.000 description 15
- 238000007689 inspection Methods 0.000 description 14
- 239000000654 additive Substances 0.000 description 13
- 230000000996 additive effect Effects 0.000 description 13
- 150000003841 chloride salts Chemical class 0.000 description 11
- 239000004615 ingredient Substances 0.000 description 11
- 229910000881 Cu alloy Inorganic materials 0.000 description 10
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 10
- -1 aluminum-iron-silicon Chemical compound 0.000 description 10
- 239000011780 sodium chloride Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 229960000956 coumarin Drugs 0.000 description 8
- 235000001671 coumarin Nutrition 0.000 description 8
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 8
- 229940081974 saccharin Drugs 0.000 description 8
- 235000019204 saccharin Nutrition 0.000 description 8
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 8
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000011056 performance test Methods 0.000 description 4
- 229940074439 potassium sodium tartrate Drugs 0.000 description 4
- 239000001476 sodium potassium tartrate Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a tin-plated Al-Fe-Cu aluminum alloy wire, which comprises, by mass, 0.01% -1.1% of Fe, 0.01% -0.6% of Cu and 0.001% -0.2% of Si; the balance of Al and impurities; the surface of the tin-plated Al-Fe-Cu aluminum alloy wire is provided with a tin plating layer. The tinned aluminum alloy conductor material for the photovoltaic cable improves the hardness, wear resistance, toughness and corrosion resistance of the existing aluminum alloy material, can be used for photovoltaic power generation, does not need a copper-aluminum transition terminal, can be directly crimped with a copper terminal, and particularly can be used for a photovoltaic special wire and can be directly welded with a tinned copper terminal.
Description
Technical Field
The invention belongs to the technical field of aluminum alloy photovoltaic cable preparation, relates to a tin-plated Al-Fe-Cu aluminum alloy wire, and a preparation method and application thereof, and in particular relates to a tin-plated Al-Fe-Cu aluminum alloy wire for a photovoltaic cable, and a preparation method and application thereof.
Background
In 2022 of China, the total amount of the photovoltaic installation is 87.41GW, domestic photovoltaic power generation is rapidly developed in recent years, because the cable accounts for about 5% of the total power generation cost of new energy sources, the cable consumption is huge, and the cable is mainly made of copper, more than 70% of Chinese copper resources are imported due to lack of Chinese copper resources, and the futures price of copper is controlled by international huge, so that the international copper price is expanded, the influence on the new energy source cost is larger, the influence on project construction progress and investment income is often limited by the copper price, the risk is larger, the cost advantage of an aluminum alloy cable is obvious, the cost is high, and the influence on international futures fluctuation is smaller. With the development of the technology of the aluminum alloy cable in China for more than ten years, the development of the manufacturing process, the product performance, the detection, the installation and construction and the like of the aluminum alloy cable are mature, the matched product standard and the design standard are complete gradually, and powerful guarantee is provided for the rapid development of the aluminum alloy cable in China.
Despite the rapid development of aluminum alloy cables, the vast majority of cables in the market today still use copper cores as conductor materials. However, with the increasing shortage of copper resources, the global copper price is in heavy fluctuation, and brings great operational risk to user enterprises and cable manufacturing enterprises, because the China copper cable manufacturing enterprises are almost tens of thousands of families, the competition is extremely intense, the low price competition becomes normal, and the copper price is greatly fluctuated, and great production risk is brought to the copper cable enterprises, so that the product quality is difficult to guarantee, and the conductor demand for replacing other copper core conductor materials is increasingly large. The aluminum in the metal material has good conductive effect, light weight and low price; meanwhile, in recent years, environmental awareness has been strengthened, and weight saving has been strongly demanded to improve the utilization rate of mechanical fuel. Therefore, it has been necessarily trended to replace copper cables with aluminum core cables. However, because aluminum alloy cables are subject to techniques for connection and installation in photovoltaic applications, such as connection and soldering, aluminum alloy cables are only partially used, and tin-plated copper conductors are basically used for photovoltaic dedicated wires.
Therefore, how to develop the photovoltaic special wire with the aluminum alloy as the base material and be suitable for the existing mature connection scheme is a new problem faced by the development of aluminum alloy wires and cables, solves the surface treatment problem and the connection problem of the aluminum alloy conductor material, promotes the aluminum alloy conductor material to develop in the wire and cable field towards the depth direction, and is one of the problems to be solved by a plurality of first-line researchers in the industry.
Disclosure of Invention
In view of the above, the technical problem to be solved by the invention is to provide a tinned Al-Fe-Cu aluminum alloy wire, a preparation method and application thereof, in particular to a tinned Al-Fe-Cu aluminum alloy wire for a photovoltaic cable. The tin-plated Al-Fe-Cu aluminum alloy conductor material for the photovoltaic cable greatly improves the hardness, wear resistance, toughness and corrosion resistance of the existing aluminum alloy material, can be used for photovoltaic power generation, does not need a copper-aluminum transition terminal, can be directly crimped with a copper terminal, and particularly can be used for a photovoltaic special wire and can be directly welded with a tin-plated copper terminal; and the process is simple, the controllability is strong, the site executable is high, and the method is suitable for popularization and application of industrial mass production.
The invention provides a tin-plated Al-Fe-Cu aluminum alloy wire, which is characterized by comprising the following components in percentage by mass:
Fe:0.01%~1.1%;
Cu:0.01%~0.6%;
Si:0.001%~0.2%;
the balance of Al and impurities;
the surface of the tin-plated Al-Fe-Cu aluminum alloy wire is provided with a tin plating layer.
Preferably, the thickness of the tin plating layer is 0.5-100 μm;
the tinning layer comprises the following components in percentage by mass:
Fe:0.002%~5%;
Ni:0.1%~30%;
the balance being Sn and impurities.
Preferably, the tin plating layer further comprises 0.003wt% to 3.5wt% of Cu;
The tin plating layer also comprises 0.001 to 5 weight percent of Na;
the tinned Al-Fe-Cu aluminum alloy wire comprises an aluminum alloy matrix, a nickel plating layer compounded on the wire matrix and a tin plating layer compounded on the nickel plating layer;
the transverse dimension of the aluminum alloy matrix is 0.2-50 mm;
the tin-plated Al-Fe-Cu aluminum alloy wire is used as one or more of a 1-class circular conductor, a 2-class circular conductor, a 5-class circular conductor and a 6-class circular conductor.
Preferably, the tin plating layer further comprises 0.001wt% to 3wt% of Cr;
in the tin-plated Al-Fe-Cu aluminum alloy wire, the mass content of a tin plating layer is 1-40%;
in the tin-plated Al-Fe-Cu aluminum alloy wire, the thickness of the nickel plating layer is 100 nm-10 mu m;
the tin-plated Al-Fe-Cu aluminum alloy wire comprises a tin-plated Al-Fe-Cu aluminum alloy wire for a photovoltaic cable.
The invention provides a preparation method of the tin-plated Al-Fe-Cu aluminum alloy wire according to any one of the technical schemes, which comprises the following steps:
1) Pretreating an Al-Fe-Cu aluminum alloy wire blank, and then carrying out zinc dipping and nickel plating to obtain an aluminum alloy wire compounded with a nickel plating layer;
2) And (3) tinning the aluminum alloy wire compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tin-plated Al-Fe-Cu aluminum alloy wire.
Preferably, the pretreatment step comprises one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing and light emitting;
the zincating treatment liquid comprises:
the zinc dipping time is 5-10 min.
Preferably, the nickel plating method comprises plating bright nickel;
the treatment fluid for electroplating bright nickel comprises the following components:
the pH value of the electroplated bright nickel is 3.5-4.0;
d of the electroplated bright nickel k Is 6 to 8A/dm 2 ;
The temperature of the electroplated bright nickel is 40-45 ℃;
the time for electroplating the bright nickel is 40-45 min.
Preferably, the nickel plating method comprises the steps of plating dark nickel;
the treatment fluid for electroplating the dark nickel comprises the following components:
NiSO 4 ·6H 2 O 300~350g/L;
NaCl 40~45g/L;
Na 2 SO 4 85~95g/L;
d of the electroplated dark nickel k Is 8-10A/dm 2 ;
The temperature of the electroplated dark nickel is 35-40 ℃;
the time for electroplating the dark nickel is 30-35 min.
Preferably, the tinning method comprises electroplating tin;
the treatment solution for electroplated tin comprises the following components:
d of the electroplated tin k Is 6 to 10A/dm 2 ;
The temperature of the electrotinning is 20-30 ℃;
the time of tin electroplating is 30-60 min.
The invention also provides the application of the tin-plated Al-Fe-Cu aluminum alloy wire according to any one of the technical schemes or the tin-plated Al-Fe-Cu aluminum alloy wire prepared by the preparation method according to any one of the technical schemes in the aspect of photovoltaic cables.
The invention provides a tin-plated Al-Fe-Cu aluminum alloy wire, which comprises, by mass, 0.01% -1.1% of Fe, 0.01% -0.6% of Cu and 0.001% -0.2% of Si; the balance of Al and impurities; the surface of the tin-plated Al-Fe-Cu aluminum alloy wire is provided with a tin plating layer. Compared with the prior art, the invention considers that the existing special photovoltaic wire basically uses tin-plated copper conductors, mainly because the tin-plated copper has weldability, can be directly welded with a connecting fitting, and can not be realized by an aluminum alloy conductor, the invention solves the weldability of the aluminum alloy conductor, and is a feasible technical scheme for adopting an aluminum alloy conductor core to replace a copper conductor in the photovoltaic full field.
Based on the above, the invention provides the tin-plated Al-Fe-Cu alloy conductor material for the photovoltaic cable, and the aluminum alloy greatly improves the hardness, wear resistance, toughness and corrosion resistance of the existing aluminum alloy conductor material, can be used for photovoltaic power generation, does not need a copper-aluminum transition terminal, is particularly used for a photovoltaic special wire, can be directly connected and installed with the existing terminal, and can also be directly welded with a tin-plated copper terminal. Meanwhile, the preparation process is simple, the controllability is high, the site executable performance is high, and the method is suitable for popularization and application of industrial mass production.
The invention also discloses a preparation method of the tin-plated Al-Fe-Cu aluminum alloy conductor material for the photovoltaic cable, which comprises the steps of obtaining an aluminum alloy rod through smelting, casting and rolling processes, drawing the aluminum alloy rod into an aluminum alloy wire, chemically degreasing the surface of an aluminum alloy wire blank, washing with hot water, washing with cold water, etching with strong alkali, washing with water, polishing, washing with water, immersing in zinc, washing with water, plating nickel, washing with water, electroplating tin, washing with water, drying, inspecting, and tinning the aluminum alloy wire blank. The surface of the aluminum alloy conductor material provided by the invention is treated by tin plating, so that the hardness, wear resistance and toughness of the existing aluminum alloy material are improved, and various performance indexes of the aluminum alloy as the conductor material are effectively optimized. The tin plating aluminum alloy process provided by the invention well solves the technical problem of tin plating on the surface of an aluminum alloy conductor, and solves the problems of corrosion resistance and connection with a copper terminal of the aluminum alloy on the premise of not affecting the original electrical property and mechanical property of the aluminum alloy conductor by pre-zinc dipping, nickel plating on the basis, and tin plating finally. The tin plating technology is realized on the surface of the aluminum alloy, so that the problem of weldability of aluminum is solved, and particularly, the special photovoltaic wire can be directly welded with a tin-plated copper terminal, so that the problem of connection of aluminum and copper is thoroughly solved.
The alloy cable prepared from the tin-plated Al-Fe-Cu alloy conductor material can be directly connected with a copper terminal, so that the problems of instability caused by connection of a copper-aluminum transition terminal and unnecessary installation of supporting facilities are avoided. The tinned aluminum alloy conductor can be directly crimped with a copper terminal, and according to national standard GB/T9327 (rated voltage 35kV (um=40.5 kV) and below) crimping type and mechanical connecting fitting test methods and requirements for power cable conductors, 1000 times of thermal cycle experiments are passed, the installation connection is stable and reliable, the risk of corrosion easily caused by exposure of conductors at joint positions is avoided, and the service life of the cable is prolonged.
Experimental results show that the tin-plated Al-Fe-Cu alloy conductor material provided by the invention has good electric conductivity, tensile property and fatigue resistance, the electric conductivity is more than 62% IACS, the elongation at break is more than or equal to 10%, the tensile strength is more than or equal to 100MPa, and the fatigue bending times at 90 degrees is more than or equal to 20 times.
Drawings
FIG. 1 is a microscopic image of a cross section of a tinned aluminum alloy wire for cables prepared in a similar manner to the present invention;
fig. 2 is a microstructure image of a plating layer of a tin-plated aluminum alloy wire for cables prepared in a similar technical scheme to the present invention.
Detailed Description
For a further understanding of the present invention, preferred embodiments of the invention are described below in conjunction with the examples, but it should be understood that these descriptions are merely intended to illustrate further features and advantages of the invention and are not limiting of the invention claims.
All the raw materials of the present invention are not particularly limited in their sources, and may be purchased on the market or prepared according to conventional methods well known to those skilled in the art.
All raw materials of the invention have no special limitation on the purity, and the invention preferably adopts the purity requirement of the industrial pure or photovoltaic cable aluminum alloy material preparation field.
All raw materials of the invention, the brands and abbreviations of which belong to the conventional brands and abbreviations in the field of the related application are clear and definite, and the person skilled in the art can purchase from the market or prepare by the conventional method according to the brands, abbreviations and the corresponding application.
The process used in the invention, the abbreviations thereof belong to the conventional abbreviations in the field, the specific steps and the conventional parameters of each abbreviation are clear and definite in the related field, and the process can be realized by a conventional method according to the abbreviations by a person skilled in the art.
The invention provides a tin-plated Al-Fe-Cu aluminum alloy wire, which comprises the following components in percentage by mass:
Fe:0.01%~1.1%;
Cu:0.01%~0.6%;
Si:0.001%~0.2%;
the balance of Al and impurities;
the surface of the tin-plated Al-Fe-Cu aluminum alloy wire is provided with a tin plating layer.
In the present invention, the content of Fe is 0.01% to 1.1%, may be 0.1% to 0.8%, and is preferably 0.3% to 0.5%.
In the present invention, the Cu content is 0.01% to 0.6%, may be 0.1% to 0.4%, and is preferably 0.2% to 0.3%.
In the present invention, the Si content is 0.001% to 0.2%, may be 0.01% to 0.15%, and is preferably 0.08% to 0.1%.
In the present invention, the thickness of the tin plating layer is preferably 0.5 to 100. Mu.m, more preferably 10 to 70. Mu.m, still more preferably 20 to 40. Mu.m.
In the present invention, the tin plating layer preferably comprises, in mass percent:
Fe:0.002%~5%;
Ni:0.1%~30%;
the balance being Sn and impurities.
Specifically, the content of Fe is preferably 0.002% to 5%, more preferably 0.02% to 3%, and still more preferably 0.2% to 1%.
Specifically, the content of Ni is preferably 0.1% to 30%, more preferably 1% to 20%, and even more preferably 5% to 10%.
In the present invention, the tin plating layer further preferably contains 0.003wt% to 3.5wt% of Cu, more preferably 0.008wt% to 2.5wt% of Cu, and still more preferably 0.01wt% to 1.5wt% of Cu.
In the present invention, the tin plating layer further preferably contains 0.001 to 5wt% of Na, more preferably 0.005 to 2wt% of Na, and still more preferably 0.01 to 1wt% of Na.
In the present invention, the tin-plated al—fe—cu aluminum alloy wire preferably includes an aluminum alloy base, a nickel plating layer compounded on the wire base, and a tin plating layer compounded on the nickel plating layer. Specifically, the tinned Al-Fe-Cu aluminum alloy wire preferably comprises an aluminum alloy wire substrate and a plating layer compounded on the aluminum alloy wire substrate. Wherein the plating layer preferably comprises a nickel plating layer compounded on the wire substrate and a tin plating layer compounded on the nickel plating layer. In the invention, based on the preparation process, the aluminum alloy wire substrate is firstly plated with nickel and then plated with tin, and has a structure of plated with tin and plated with nickel. From the microscopic structure of the electron microscope of the finished product of the tinned aluminum alloy wire, no obvious layer boundary structure exists between the tinned layer and the nickel-plated layer, so that the aluminum alloy wire substrate provided by the invention is considered to have an integral plating structure, or a tin-nickel mixed layer structure between the tinned layer and the nickel-plated layer.
Referring to fig. 1, fig. 1 is a microscopic image of a cross section of a tin-plated aluminum alloy wire for cables prepared in a similar technical scheme to the present invention.
Referring to fig. 2, fig. 2 is a microstructure image of a plating layer of a tin-plated aluminum alloy wire for cables prepared in a similar technical scheme to the present invention.
The microstructure of the tin-plated aluminum alloy conductor material (wire) for cables in fig. 1 and 2 is used to show that the tin-plated Al-Fe-Cu aluminum alloy wire provided by the invention has a substantially similar microstructure.
In the present invention, the lateral dimension of the aluminum alloy base is preferably 0.2 to 50mm, more preferably 0.5 to 40mm, still more preferably 1 to 30mm, still more preferably 5 to 20mm. Specifically, the lateral dimension in the present invention refers to the thickness of the aluminum alloy wire substrate, such as the radial dimension of the cylindrical wire, and the like.
In the present invention, the tin-plated al—fe—cu aluminum alloy wire is preferably one or more of a 1-class circular conductor, a 2-class circular conductor, a 5-class circular conductor, and a 6-class circular conductor, more preferably is a 1-class circular conductor, a 2-class circular conductor, a 5-class circular conductor, or a 6-class circular conductor.
In the present invention, the tin plating layer is also preferably 0.001wt% to 3wt% of Cr, more preferably 0.005wt% to 2wt% of Cr, and still more preferably 0.01wt% to 1wt% of Cr.
In the present invention, the tin plating layer is preferably 1 to 40% by mass, more preferably 6 to 30% by mass, and still more preferably 11 to 20% by mass in the tin plating al—fe—cu aluminum alloy.
In the present invention, in the tin-plated Al-Fe-Cu aluminum alloy, the thickness of the nickel plating layer is preferably 100nm to 10. Mu.m, more preferably 1 μm to 7. Mu.m, still more preferably 3 μm to 4. Mu.m.
In the present invention, the tin-plated Al-Fe-Cu aluminum alloy wire preferably includes a tin-plated Al-Fe-Cu aluminum alloy wire for a photovoltaic cable.
The invention adopts a tinning mode to form a tinning layer, but other elements are inevitably present in raw materials or processes or are present as a result of inspection mode, so that a certain amount of the elements are present after the detection of the tinning layer.
The invention provides a preparation method of the tin-plated Al-Fe-Cu aluminum alloy wire, which comprises the following steps:
1) Pretreating an Al-Fe-Cu aluminum alloy wire blank, and then carrying out zinc dipping and nickel plating to obtain an aluminum alloy wire compounded with a nickel plating layer;
2) And (3) tinning the aluminum alloy wire compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tin-plated Al-Fe-Cu aluminum alloy wire.
Firstly, pretreating an Al-Fe-Cu aluminum alloy wire blank, and then carrying out zinc dipping and nickel plating to obtain the aluminum alloy wire compounded with the nickel plating layer.
In the present invention, the pretreatment step preferably includes one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, and light emitting, more preferably, a plurality of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, and light emitting.
In the present invention, the zincating treatment liquid preferably includes:
specifically, the NaOH content is preferably 180 to 260g/L, more preferably 190 to 250g/L, still more preferably 200 to 240g/L, and still more preferably 210 to 230g/L.
Specifically, the ZnO content is preferably 30 to 40g/L, more preferably 32 to 38g/L, and still more preferably 34 to 36g/L.
Specifically, the content of the potassium sodium tartrate is preferably 50 to 60g/L, more preferably 52 to 58g/L, and still more preferably 54 to 56g/L.
Specifically, the FeCI 3 ·6H 2 The O content is preferably 16 to 25g/L, more preferably 18 to 23g/L, and still more preferably 20 to 21g/L.
Specifically, the NaNO 3 The content of (C) is preferably 16 to 25g/L, more preferably 18 to 23g/L, and still more preferably 20 to 21g/L.
In the present invention, the time for the zincating is preferably 5 to 10 minutes, more preferably 6 to 9 minutes, and still more preferably 7 to 8 minutes.
In the present invention, the nickel plating method preferably includes plating bright nickel.
In the present invention, the treatment liquid for plating bright nickel preferably includes:
specifically, the NiSO 4 ·6H 2 The O content is preferably 400 to 450g/L, more preferably 410 to 440g/L, and still more preferably 420 to 430g/L.
Specifically, the NiCl 2 ·6H 2 The O content is preferably 150 to 180g/L, more preferably 155 to 175g/L, and still more preferably 160 to 170g/L.
Specifically, the H 3 BO 4 The content of (C) is preferably 80 to 90g/L, more preferably 82 to 88g/L, and still more preferably 84 to 86g/L.
Specifically, the saccharin content is preferably 10 to 50g/L, more preferably 15 to 45g/L, still more preferably 20 to 40g/L, and still more preferably 25 to 35g/L.
Specifically, the content of 1.4-butynediol is preferably 6 to 8g/L, more preferably 6.4 to 7.6g/L, and still more preferably 6.8 to 7.2g/L.
Specifically, the coumarin content is preferably 1 to 2g/L, more preferably 1.2 to 1.8g/L, and even more preferably 1.4 to 1.6g/L.
Specifically, the content of the sodium dodecyl sulfate is preferably 1 to 5g/L, more preferably 1.5 to 4.5g/L, still more preferably 2 to 4g/L, and still more preferably 2.5 to 3.5g/L.
In the present invention, the pH of the plated bright nickel is preferably 3.5 to 4.0, more preferably 3.6 to 3.9, and still more preferably 3.7 to 3.8.
In the invention, D of the electroplated bright nickel k Preferably 6 to 8A/dm 2 More preferably 6.4 to 7.6A/dm 2 More preferably 6.8 to 7.2A/dm 2 。
In the present invention, the temperature of the bright nickel plating is preferably 40 to 45 ℃, more preferably 41 to 44 ℃, and even more preferably 42 to 43 ℃.
In the present invention, the time for plating the bright nickel is preferably 40 to 45 minutes, more preferably 41 to 44 minutes, and still more preferably 42 to 43 minutes.
In the present invention, the nickel plating means preferably includes plating of dark nickel.
In the present invention, the treatment liquid for plating dark nickel preferably includes:
NiSO 4 ·6H 2 O 300~350g/L;
NaCl 40~45g/L;
Na 2 SO 4 85~95g/L;
specifically, the NiSO 4 ·6H 2 The O content is preferably 300 to 350g/L, more preferably 310 to 340g/L, and still more preferably 320 to 330g/L.
Specifically, the NaCl content is preferably 40 to 45g/L, more preferably 41 to 44g/L, and even more preferably 42 to 43g/L.
Specifically, the Na 2 SO 4 The content of (C) is preferably 85 to 95g/L, more preferably 87 to 93g/L, and even more preferably 89 to 91g/L.
In the invention, D of the electroplated dark nickel k Preferably 8 to 10A/dm 2 More preferably 8.4 to 9.6A/dm 2 More preferably 8.8 to 9.2A/dm 2 。
In the present invention, the temperature of the plated dark nickel is preferably 35 to 40 ℃, more preferably 36 to 39 ℃, and still more preferably 37 to 38 ℃.
In the present invention, the time for plating the dark nickel is preferably 30 to 35 minutes, more preferably 31 to 34 minutes, and still more preferably 32 to 33 minutes.
Finally, tinning the aluminum alloy wire with the composite nickel coating obtained in the steps, and then performing aftertreatment to obtain the tinned Al-Fe-Cu aluminum alloy wire.
In the present invention, the means of tin plating preferably includes electrolytic tin plating.
In the present invention, the electrolytic tin plating treatment liquid preferably includes:
specifically, the SnSO 4 The content of (C) is preferably 140 to 170g/L, more preferably 145 to 165g/L, and even more preferably 150 to 160g/L.
Specifically, the H 2 SO 4 The content of (C) is preferably 240 to 270g/L, more preferably 245 to 265g/L, and still more preferably 250 to 260g/L.
Specifically, the content of SS-820 is preferably 55 to 60mL/L, more preferably 56 to 59mL/L, and even more preferably 57 to 58mL/L.
Specifically, the content of SS-821 is preferably 5 to 10mL/L, more preferably 6 to 9mL/LL, and even more preferably 7 to 8mL/L.
In the present invention, D of the electroplated tin k Preferably 6 to 10A/dm 2 More preferably 6.5 to 9.5A/dm 2 More preferably 7 to 9A/dm 2 More preferably 7.5 to 8.5A/dm 2 。
In the present invention, the temperature of the electrolytic tin is preferably 20 to 30 ℃, more preferably 22 to 28 ℃, and still more preferably 24 to 26 ℃.
In the present invention, the time for the tin plating is preferably 30 to 60 minutes, more preferably 32 to 40 minutes, still more preferably 33 to 38 minutes, still more preferably 34 to 36 minutes.
The invention provides the application of the tin-plated Al-Fe-Cu aluminum alloy wire in the aspect of photovoltaic cables, which is prepared by the tin-plated Al-Fe-Cu aluminum alloy wire in any one of the technical schemes or the preparation method in any one of the technical schemes.
The invention is a complete and refined integral technical scheme, better ensures the structure and composition of a tin-plated Al-Fe-Cu aluminum alloy wire, further improves the performance of the tin-plated Al-Fe-Cu aluminum alloy wire, and the tin-plated Al-Fe-Cu aluminum alloy wire and the preparation method thereof specifically comprise the following steps:
a tin-plated Al-Fe-Cu alloy for a photovoltaic cable comprises the following components in percentage by weight:
Fe:0.01~1.1%;
Cu:0.01~0.6%;
Si:0.001~0.2%;
the balance of Al and impurities;
the surface of the aluminum alloy conductor is plated with a layer of tin with the thickness of not less than 0.5 mu m, and the tin plating layer comprises the following components in percentage by weight:
Fe:0.002~5%;
Ni:0.1~30%;
the balance of Sn and impurities;
specifically, the tin plating layer further contains 0.003 to 3.5 wt% of Cu.
Specifically, the tin plating layer further comprises 0.001-5 wt% of Na.
Specifically, the tin plating layer further comprises 0.001-3 wt% of Cr.
Specifically, the aluminum alloy material is manufactured into an aluminum alloy rod through smelting, casting and rolling procedures, and then is drawn into an aluminum alloy wire.
Specifically, the aluminum alloy wire blank surface is subjected to chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection and tinning.
Specifically, the aluminum alloy material is manufactured into an aluminum alloy rod through smelting, casting and rolling procedures, and then is drawn into an aluminum alloy wire, and the surface of an aluminum alloy wire blank is subjected to chemical degreasing, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection and tinning.
Specifically, the zinc dipping process comprises the following steps:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16~25g/L,NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
Specifically, the bright nickel electroplating process comprises the following steps:
NiSO 4 ·6H 2 O 400~450g/L,NiCl 2 ·6H 2 O 150~180g/L,H 3 BO 4 80-90 g/L saccharin 10-50 g/L, 1.4-butynediol 6-8 g/L coumarin 1-2 g/L, sodium dodecyl sulfate 1-5 g/L, pH 3.5-4.0 g/L, D k 6~8A/dm 2 The temperature is 40-45 ℃ and the time is 40-45 min.
Specifically, the process for electroplating the dark nickel comprises the following steps:
NiSO 4 ·6H 2 O 300~350g/L,NaCl 40~45g/L,Na 2 SO 4 85~95g/L,D k 8~10A/dm 2 The temperature is 35-40 ℃ and the time is 30-35 min.
Specifically, the electrotinning process is as follows:
SnSO 4 140~170g/L,H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6~10A/dm 2 。
Specifically, the tinned aluminum alloy material can be manufactured into 1 class, 2 class, 5 class or 6 class circular conductors for photovoltaic cables.
Specifically, the zinc dipping process comprises the following steps:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16~25g/L,NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
Zinc impregnation is the key point of the process, and the quality of the zinc impregnation layer directly influences the quality of the nickel plating layer. The zinc impregnation function is as follows: (1) removing the exposed surface layer, (2) making the relative potential of the aluminum alloy conductor surface higher.
When in preparation, znO is firstly mixed into paste and added into sodium hydroxide solution, and is continuously stirred, otherwise Zn (OH) is easy to form 2 And 3, adding 3-valence Fe ions can improve the binding force between the coating and the matrix. The added potassium sodium tartrate can form a complex with 3-valent Fe ions to prevent the 3-valent Fe ions from forming Fe (OH) 3 And (5) precipitation. NaNO 3 The oxidation-reduction reaction can be promoted. Because the electrode potential of Zn is close to that of A1, the deposition speed of Zn is slow, the leaching time is too short, and a zinc layer cannot be deposited; the zinc layer is re-dissolved for too long, so that it is important to control the zinc dipping time, if the quality of the primary zinc dipping layer is poor, 100ml/L HNO can be used 3 And (5) removing the solution.
In order to enhance the binding force between the tinning layer and the aluminum matrix, the invention selects to plate a layer of nickel on the surface of the aluminum alloy in advance and then to plate tin on the basis of nickel, thus being easy to realize.
After zinc impregnation of the aluminum workpiece, nickel is plated as soon as possible, and in order to prevent the zinc impregnation layer from being dissolved in the nickel plating solution, the aluminum substrate is charged into the nickel plating solution. The bright plating layer can be directly plated by electroplating bright nickel, the plating layer is fine, but the internal stress of the plating layer is large, the plating layer cannot be too thick, or else the plating layer is easy to peel.
The plating layer obtained by electroplating the dark nickel has fine crystallization, good toughness, smaller internal stress and better corrosion resistance than bright nickel.
Specifically, the electrotinning process is as follows:
SnSO 4 140~170g/L,H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6~10A/dm 2 。
In the operation process, the workpiece is required to be cleaned after the cathode is moved to plate, and the tinning time is determined according to the required thickness.
Specifically, the tinned aluminum alloy material prepared by the procedures can be further processed into a class 1 or class 2 or class 5 or class 6 conductor stranded wire core, and can be used for wire and cable conductor wire cores for photovoltaic power generation.
Further:
the Al-Fe-Cu alloy disclosed by the invention comprises the following components:
Fe:0.01~1.1wt%;
Cu:0.01~0.6%;
Si:0.001~0.2wt%;
the balance being Al and impurities.
For matrix aluminum in the aluminum alloy, pure aluminum of industrial Al99.70 can be adopted, so that the aluminum alloy prepared by the method has the advantages of sufficient raw material supply, low cost, convenient purchase and the like; meanwhile, the aluminum base can also adopt refined aluminum or high-purity aluminum as a matrix alloy, and the aluminum base has higher quality than the common aluminum base material, and the processed product has more advantages in the aspects of electrical property and mechanical property.
In the invention, aluminum is taken as a matrix, and trace iron is added to improve the performance of the aluminum alloy, so that the iron can improve the mechanical strength and tensile property of the aluminum alloy, improve the tensile strength, yield property, heat resistance and creep resistance of the aluminum, and improve the plasticity of the aluminum alloy. And a trace amount of silicon is added into the aluminum base, so that the mechanical strength of the aluminum alloy can be improved. The addition of a trace amount of copper can improve the mechanical strength and fatigue resistance of the aluminum alloy.
The Al-Fe-Cu alloy material is manufactured into an aluminum alloy rod through smelting, casting and rolling procedures, and then the aluminum alloy rod is manufactured into an aluminum alloy wire.
The surface of the aluminum alloy wire provided by the invention is electroplated with a layer of tin with the thickness of not less than 0.5 mu m, and the tin plating layer comprises the following components:
Fe:0.002~5%;
Ni:0.1~30%;
The balance of Sn and impurities;
according to the present invention, preferably, the tin plating layer further contains 0.003 to 3.5 wt% of Cu; preferably, the tin plating layer further comprises 0.001 to 5 wt% of Na; preferably, the tin plating layer further contains 0.001 to 3 wt% of Cr.
In order to prepare the tin-plated Al-Fe-Cu alloy material, the invention also provides a tin plating process flow, wherein the tin plating process flow is as follows: the method comprises the steps of chemical degreasing of the surface of the aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, nickel electroplating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank.
In order to more fully illustrate the tin plating process, the invention further provides a zinc dipping process, which is as follows:
180-260 g/L NaOH, 30-40g/L ZnO, 50-60 g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 16~25g/L,NaNO 3 16-25 g/L, temperature: the room temperature is kept for 5-10 min.
In order to enhance the binding force between the tinning layer and the aluminum substrate, the invention can be easily realized by plating a layer of nickel on the surface of the aluminum alloy in advance and then plating tin on the basis of the nickel.
According to the application, if the bright nickel electroplating process is adopted, the bright nickel electroplating process comprises the following steps:
NiSO 4 ·6H 2 O 400~450g/L,NiCl 2 ·6H 2 O 150~180g/L,H 3 BO 4 80-90 g/L saccharin 10-50 g/L, 1.4-butynediol 6-8 g/L coumarin 1-2 g/L, sodium dodecyl sulfate 1-5 g/L, pH 3.5-4.0 g/L, D k 6~8A/dm 2 The temperature is 40-45 ℃ and the time is 40-45 min.
According to the application, if the process of plating the dark nickel is adopted, the process of plating the dark nickel is as follows:
NiSO 4 ·6H 2 O 300~350g/L,NaCl 40~45g/L,Na 2 SO 4 85~95g/L,D k 8~10A/dm 2 the temperature is 35-40 ℃ and the time is 30-35 min.
After zinc impregnation of the aluminum workpiece, nickel is plated as soon as possible, and in order to prevent the zinc impregnation layer from being dissolved in the nickel plating solution, the aluminum substrate is charged into the nickel plating solution. The bright plating layer can be directly plated by electroplating bright nickel, the plating layer is fine, but the internal stress of the plating layer is large, the plating layer cannot be too thick, or else the plating layer is easy to peel.
The plating layer obtained by electroplating the dark nickel has fine crystallization, good toughness, smaller internal stress and better corrosion resistance than the bright nickel.
According to the application, the electrotinning process is as follows:
SnSO 4 140~170g/L,H 2 SO 4 240-270 mL/L, SS-820-60 mL/L (for cylinder opening). SS-821 5-L0 mL/L (additive), temperature 20-30 ℃, D k 6~10A/dm 2 。
In the operation process, the workpiece is required to be cleaned after the cathode is moved to plate, and the tinning time is determined according to the required thickness.
According to the application, the tinned aluminum alloy material prepared by the procedures can be further processed into a class 1 or class 2 or class 5 or class 6 conductor stranded wire core, and can be used for wire and cable conductor wire cores for photovoltaic power generation.
The invention provides the application of the tin-plated Al-Fe-Cu aluminum alloy wire in the aspect of photovoltaic cables, which is prepared by the tin-plated Al-Fe-Cu aluminum alloy wire in any one of the technical schemes or the preparation method in any one of the technical schemes.
The invention provides a tin-plated Al-Fe-Cu aluminum alloy wire for a photovoltaic cable, and a preparation method and application thereof. The tin-plated Al-Fe-Cu alloy conductor material for the photovoltaic cable greatly improves the hardness, wear resistance, toughness and corrosion resistance of the existing aluminum alloy conductor material, can be used for photovoltaic power generation, does not need copper-aluminum transition terminals, is particularly used for photovoltaic special wires, can be directly connected and installed with the existing terminals, and can also be directly welded with tin-plated copper terminals. Meanwhile, the preparation process is simple, the controllability is high, the site executable performance is high, and the method is suitable for popularization and application of industrial mass production.
The invention also discloses a preparation method of the tin-plated Al-Fe-Cu aluminum alloy conductor material for the photovoltaic cable, which comprises the steps of obtaining an aluminum alloy rod through smelting, casting and rolling processes, drawing the aluminum alloy rod into an aluminum alloy wire, chemically degreasing the surface of an aluminum alloy wire blank, washing with hot water, washing with cold water, etching with strong alkali, washing with water, polishing, washing with water, immersing in zinc, washing with water, plating nickel, washing with water, electroplating tin, washing with water, drying, inspecting, and tinning the aluminum alloy wire blank. The surface of the aluminum alloy conductor material provided by the invention is treated by tin plating, so that the hardness, wear resistance and toughness of the existing aluminum alloy material are improved, and various performance indexes of the aluminum alloy as the conductor material are effectively optimized. The tin plating aluminum alloy process provided by the invention well solves the technical problem of tin plating on the surface of an aluminum alloy conductor, and solves the problems of corrosion resistance and connection with a copper terminal of the aluminum alloy on the premise of not affecting the original electrical property and mechanical property of the aluminum alloy conductor by pre-zinc dipping, nickel plating on the basis, and tin plating finally. The tin plating technology is realized on the surface of the aluminum alloy, so that the problem of weldability of aluminum is solved, and particularly, the special photovoltaic wire can be directly welded with a tin-plated copper terminal, so that the problem of connection of aluminum and copper is thoroughly solved.
The alloy cable prepared from the tin-plated Al-Fe-Cu alloy conductor material can be directly connected with a copper terminal, so that the problems of instability caused by connection of a copper-aluminum transition terminal and unnecessary installation of supporting facilities are avoided. The tinned aluminum alloy conductor can be directly crimped with a copper terminal, and according to national standard GB/T9327 (rated voltage 35kV (um=40.5 kV) and below) crimping type and mechanical connecting fitting test methods and requirements for power cable conductors, 1000 times of thermal cycle experiments are passed, the installation connection is stable and reliable, the risk of corrosion easily caused by exposure of conductors at joint positions is avoided, and the service life of the cable is prolonged.
Experimental results show that the tin-plated Al-Fe-Cu alloy conductor material provided by the invention has good electric conductivity, tensile property and fatigue resistance, the electric conductivity is more than 62% IACS, the elongation at break is more than or equal to 10%, the tensile strength is more than or equal to 100MPa, and the fatigue bending times at 90 degrees is more than or equal to 20 times.
For further explanation of the present invention, the following details of a tin-plated Al-Fe-Cu aluminum alloy wire and the preparation method and application thereof are provided in connection with the examples, but it should be understood that these examples are implemented on the premise of the technical scheme of the present invention, and detailed implementation and specific operation procedures are given, which are only for further explanation of the features and advantages of the present invention, and not for limitation of the claims of the present invention, and the scope of protection of the present invention is not limited to the examples described below.
Example 1
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
referring to Table 1, table 1 shows the composition (wt%) of the aluminum alloy prepared in the examples of the present invention.
(2) Electroplating a layer of tin with the thickness of 0.8 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
referring to table 2, table 2 is a table of composition (wt%) of tin-plated layers of tin-plated aluminum alloys prepared in examples of the present invention.
(3) The zinc dipping process conditions in the step (2) are as follows:
180g/L NaOH, 30g/L ZnO, 50g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 16g/L,NaNO 3 16g/L, under the condition of room temperature, the time is 5min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 400g/L,NiCl 2 ·6H 2 O 150g/L,H 3 BO 4 80g/L saccharin 10g/L, 1.4-butynediol 6g/L, coumarin 1g/L, sodium dodecyl sulfate 1g/L, pH 3.5g/L, D k 6A/dm 2 The temperature is 40 ℃ and the time is 40min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 140g/L,H 2 SO 4 240mL/L, SS-820 55mL/L (for cylinder opening). SS-821 5mL/L (additive), temperature 20 ℃, D k 6A/dm 2 The time is 30min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3. Table 3 is a table of performance test data for tin-plated aluminum alloy conductor wires prepared in the examples of the present invention.
Example 2
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
referring to Table 1, table 1 shows the composition (wt%) of the aluminum alloy prepared in the examples of the present invention.
(2) Electroplating a layer of tin with the thickness of 100 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
Referring to table 2, table 2 is a table of composition (wt%) of tin-plated layers of tin-plated aluminum alloys prepared in examples of the present invention.
(3) The zinc dipping process conditions in the step (2) are as follows:
260g/L NaOH, 40g/L ZnO, 60g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 25g/L,NaNO 3 25g/L, under the condition of room temperature, the time is 10min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 450g/L,NiCl 2 ·6H 2 O 180g/L,H 3 BO 4 90g/L saccharin 50g/L, 1.4-butynediol 8g/L, coumarin 2g/L, sodium dodecyl sulfate 5g/L, pH 4.0g/L, D k 8A/dm 2 The temperature is 45 ℃ and the time is 45min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 170g/L,H 2 SO 4 270mL/L, SS-820 60mL/L (for cylinder opening). SS-821L 0mL/L (additive), temperature 30 ℃, D k 10A/dm 2 The time is 60min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3. Table 3 is a table of performance test data for tin-plated aluminum alloys prepared in accordance with the examples of the present invention.
Example 3
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 30 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
Chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
190g/L NaOH, 32g/L ZnO, 52g/L sodium potassium tartrate and FeCI 3 ·6H 2 O 18g/L,NaNO 3 18g/L, under the condition of room temperature, the time is 6min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 425g/L,NiCl 2 ·6H 2 O 165g/L,H 3 BO 4 85g/L saccharin 30g/L, 1.4-butynediol 7g/L, coumarin 1.5g/L, sodium dodecyl sulfate 3g/L, pH 3.7g/L, D k 7A/dm 2 The temperature is 43 ℃ and the time is 42min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 145g/L,H 2 SO 4 250mL/L, SS-820 56mL/L (for cylinder opening). SS-821 6mL/L (additive), temperature 23 ℃, D k 8A/dm 2 The time is 40min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 4
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 10 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
NaOH 220/L, znO 35g/L, potassium sodium tartrate 55g/L, feCI 3 ·6H 2 O 20g/L,NaNO 3 20g/L, under the condition of room temperature, the time is 7min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 440g/L,NiCl 2 ·6H 2 O 170g/L,H 3 BO 4 88g/L saccharin 40g/L, 1.4-butynediol 7.5g/L, coumarin 1.8g/L, sodium dodecyl sulfate 4g/L, pH 3.8g/L, D k 8A/dm 2 The temperature is 44 ℃ and the time is 44min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 155g/L,H 2 SO 4 255mL/L, SS-820 57mL/L (for cylinder opening). SS-821 7mL/L (additive), temperature 25 ℃, D k 8A/dm 2 The time is 45min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 5
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 6 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
250g/L NaOH, 38g/L ZnO, 58g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 23g/L,NaNO 3 24 g/L, under the condition of room temperature, the time is 9min;
(4) The bright nickel electroplating process in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 410g/L,NiCl 2 ·6H 2 O 160g/L,H 3 BO 4 82g/L saccharin 20g/L, 1.4-butynediol 6.5g/L, coumarin 1.2g/L, sodium dodecyl sulfate 2g/L, pH 3.6g/L, D k 6.5A/dm 2 The temperature is 41 ℃ and the time is 41min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 160g/L,H 2 SO 4 260mL/L, SS-820 58mL/L (for cylinder opening). SS-821 8mL/L (additive), temperature 28 ℃, D k 8A/dm 2 The time is 40min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 6
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 50 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
180g/L NaOH, 30g/L ZnO, 50g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 16g/L,NaNO 3 16g/L, under the condition of room temperature, the time is 5min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 300g/L,NaCl 40g/L,Na 2 SO 4 85g/L,D k 8A/dm 2 the temperature is 35 ℃ and the time is 30min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 140g/L,H 2 SO 4 240mL/L, SS-820 55mL/L (for cylinder opening). SS-821 5mL/L (additive), temperature 20 ℃, D k 6A/dm 2 The time is 30min. The other ingredients are added in the form of chlorides. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 7
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 40 mu m on the surface of the aluminum alloy wire rod obtained in the step (1), wherein the tin process flow on the surface of the aluminum alloy wire rod is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
260g/L NaOH, 40g/L ZnO, 60g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 25g/L,NaNO 3 25g/L, under the condition of room temperature, the time is 10min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 350g/L,NaCl 45g/L,Na 2 SO 4 95g/L,D k 10A/dm 2 the temperature is 40 ℃ and the time is 35min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 170g/L,H 2 SO 4 270mL/L, SS-820 60mL/L (for cylinder opening). SS-821L 0mL/L (additive), temperature 30 ℃, D k 10A/dm 2 The time is 50min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 8
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 20 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
190g/L NaOH, 33g/L ZnO, 52g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 18g/L,NaNO 3 18g/L, under the condition of room temperature, the time is 6min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 320g/L,NaCl 42g/L,Na 2 SO 4 88g/L,D k 8A/dm 2 the temperature is 36 ℃ and the time is 34min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 155g/L,H 2 SO 4 255mL/L, SS-820 57mL/L (for cylinder opening). SS-821 7mL/L (additive), temperature 25 ℃, D k 8A/dm 2 The time is 45min. The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 9
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 60 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
250g/L NaOH, 38g/L ZnO, 58g/L potassium sodium tartrate and FeCI 3 ·6H 2 O 23g/L,NaNO 3 23g/L, under the room temperature condition, the time is 8min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 320g/L,NaCl43g/L,Na 2 SO 4 90g/L,D k 9A/dm 2 the temperature is 38 ℃ and the time is 33min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 150g/L,H 2 SO 4 245mL/L, SS-820 mL/L (for cylinder opening). SS-821 6mL/L (additive), temperature 23 ℃, D k 7A/dm 2 . The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
Example 10
(1) Putting aluminum-iron-silicon and aluminum-copper alloy ingots into a smelting furnace, manufacturing an aluminum alloy rod through smelting, casting and rolling procedures, and manufacturing the aluminum alloy rod into an aluminum alloy wire, wherein the alloy compositions are shown in table 1;
(2) Electroplating a layer of tin with the thickness of 36 mu m on the surface of the aluminum alloy wire obtained in the step (1), wherein the tin plating process flow of the surface of the aluminum alloy wire is as follows:
chemical degreasing of the surface of an aluminum alloy wire blank, hot water washing, cold water washing, strong alkali etching, water washing, light emitting, water washing, zinc dipping, water washing, bright nickel plating, water washing, tin electroplating, water washing, drying, inspection and tinning of the aluminum alloy wire blank. The composition of the tin plating layer is listed in table 2;
(3) The zinc dipping process conditions in the step (2) are as follows:
NaOH 220/L, znO 35g/L, potassium sodium tartrate 55g/L, feCI 3 ·6H 2 O 20g/L,NaNO 3 20g/L, under the condition of room temperature, the time is 7min;
(4) The process for electroplating the dark nickel in the step (2) comprises the following steps:
NiSO 4 ·6H 2 O 340g/L,NaCl 44g/L,Na 2 SO 4 92g/L,D k 10A/dm 2 the temperature is 39 ℃ and the time is 34min;
(5) The tin electroplating process in the step (2) is as follows:
SnSO 4 160g/L,H 2 SO 4 260mL/L, SS-820 58mL/L (for cylinder opening). SS-821 9mL/L (additive), temperature 28 ℃, D k 9A/dm 2 . The other ingredients are added in the form of chlorides.
The aluminum alloy prepared according to the above method and the aluminum alloy performance after the tin plating process were tested, and the results are shown in table 3.
TABLE 1
Group of | Fe | Cu | Si | Al and impurities |
Example 1 | 0.20 | 0.60 | 0.001 | Allowance of |
Example 2 | 1.10 | 0.01 | 0.20 | Allowance of |
Example 3 | 0.01 | 0.07 | 0.10 | Allowance of |
Example 4 | 1.10 | 0.09 | 0.001 | Allowance of |
Example 5 | 0.30 | 0.12 | 0.15 | Allowance of |
Example 6 | 0.55 | 0.25 | 0.10 | Allowance of |
Example 7 | 0.06 | 0.33 | 0.06 | Allowance of |
Example 8 | 0.82 | 0.43 | 0.045 | Allowance of |
Example 9 | 0.93 | 0.50 | 0.038 | Allowance of |
Example 10 | 1.05 | 0.55 | 0.008 | Allowance of |
TABLE 2
TABLE 3 Table 3
Referring to Table 4, table 4 is a table of performance test data for aluminum alloys prepared according to comparative examples of the present invention without any surface treatment.
Among these, the aluminum alloy wires in comparative examples 1 to 10 are the same as those in examples 1 to 10, respectively.
TABLE 4 Table 4
Referring to table 5, table 5 is a table of performance test data of the nickel-plated-only treated aluminum alloy prepared in comparative example of the present invention.
The aluminum alloy wires in comparative examples 11 to 20 were the same as those in examples 1 to 10, respectively, and the nickel plating process and the corresponding parameters were also the same as those in examples 1 to 10, respectively.
TABLE 5
From the comparison of examples, it was found that the examples tin-plated aluminum alloy conductor materials, while the comparative examples did not have any surface treatment, did not differ much in tensile strength, elongation at break and 90-degree fatigue bending properties from those of the aluminum alloy conductor wires subjected to only the nickel plating treatment, but the nickel-plated aluminum alloy conductor wires were inferior in electrical properties to those of the aluminum alloy conductor wires subjected to only the nickel plating treatment, and the tin-plated aluminum alloy conductor wires were much superior to those of the aluminum alloy conductor wires subjected to only the nickel plating treatment, and the aluminum alloy subjected to no surface treatment and those of the aluminum alloy conductor wires subjected to only the nickel plating treatment were significantly inferior in connection properties with copper terminals to those of the aluminum alloy materials subjected to only the tin plating treatment, and after connection of the tin-plated aluminum alloy with copper terminals, were able to pass 1000 heat cycle tests. The aluminum alloys of the examples and the comparative examples were tested with reference to the standard of GB/T4910-2009 "tin-plated round copper wire", the aluminum alloys without any surface treatment had no weldability, the weldability of the aluminum alloys with only nickel plating treatment was extremely poor, and the requirements of the GB/T4910-2009 standard could not be met, while the tin-plated aluminum alloys of the examples were excellent in weldability and met the requirements of the GB/T4910-2009 standard. The cable can be used as a photovoltaic cable product and used for replacing a copper cable in a photovoltaic full-industry chain.
The invention has been described in detail with respect to a tin-plated Al-Fe-Cu aluminum alloy wire for photovoltaic cables, a method of making and using the same, and specific examples are set forth herein to illustrate the principles and embodiments of the invention, the above examples being provided solely to aid in the understanding of the methods of the invention and its core ideas, including the best mode, and to enable any person skilled in the art to practice the invention, including making and using any devices or systems, and practicing any incorporated methods. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims. The scope of the patent protection is defined by the claims and may include other embodiments that occur to those skilled in the art. Such other embodiments are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
Claims (10)
1. A tin-plated Al-Fe-Cu aluminum alloy wire, characterized in that the Al-Fe-Cu aluminum alloy comprises, in mass percent:
Fe:0.01%~1.1%;
Cu:0.01%~0.6%;
Si:0.001%~0.2%;
the balance of Al and impurities;
the surface of the tin-plated Al-Fe-Cu aluminum alloy wire is provided with a tin plating layer.
2. The tin plated Al-Fe-Cu aluminum alloy wire according to claim 1, wherein the tin plated layer has a thickness of 0.5 to 100 μm;
the tinning layer comprises the following components in percentage by mass:
Fe:0.002%~5%;
Ni:0.1%~30%;
the balance being Sn and impurities.
3. The tin plated Al-Fe-Cu aluminum alloy wire of claim 1, wherein the tin plated layer further comprises 0.003wt% to 3.5wt% Cu;
the tin plating layer also comprises 0.001 to 5 weight percent of Na;
the tinned Al-Fe-Cu aluminum alloy wire comprises an aluminum alloy matrix, a nickel plating layer compounded on the wire matrix and a tin plating layer compounded on the nickel plating layer;
the transverse dimension of the aluminum alloy matrix is 0.2-50 mm;
the tin-plated Al-Fe-Cu aluminum alloy wire is used as one or more of a 1-class circular conductor, a 2-class circular conductor, a 5-class circular conductor and a 6-class circular conductor.
4. A tin plated Al-Fe-Cu aluminum alloy wire according to claim 3, wherein the tin plated layer further comprises 0.001wt% to 3wt% Cr;
In the tin-plated Al-Fe-Cu aluminum alloy wire, the mass content of a tin plating layer is 1-40%;
in the tin-plated Al-Fe-Cu aluminum alloy wire, the thickness of the nickel plating layer is 100 nm-10 mu m;
the tin-plated Al-Fe-Cu aluminum alloy wire comprises a tin-plated Al-Fe-Cu aluminum alloy wire for a photovoltaic cable.
5. A method for producing the tin-plated Al-Fe-Cu aluminum alloy wire according to any one of claims 1 to 4, comprising the steps of:
1) Pretreating an Al-Fe-Cu aluminum alloy wire blank, and then carrying out zinc dipping and nickel plating to obtain an aluminum alloy wire compounded with a nickel plating layer;
2) And (3) tinning the aluminum alloy wire compounded with the nickel plating layer obtained in the steps, and then performing aftertreatment to obtain the tin-plated Al-Fe-Cu aluminum alloy wire.
6. The method of claim 5, wherein the pretreatment step comprises one or more of surface chemical degreasing, hot water washing, cold water washing, strong alkali etching, water rinsing, and light extraction;
the zincating treatment liquid comprises:
the zinc dipping time is 5-10 min.
7. The method of claim 5, wherein the nickel plating comprises plating bright nickel;
The treatment fluid for electroplating bright nickel comprises the following components:
the pH value of the electroplated bright nickel is 3.5-4.0;
d of the electroplated bright nickel k Is 6 to 8A/dm 2 ;
The temperature of the electroplated bright nickel is 40-45 ℃;
the time for electroplating the bright nickel is 40-45 min.
8. The method of claim 5, wherein the nickel plating comprises plating dark nickel;
the treatment fluid for electroplating the dark nickel comprises the following components:
NiSO 4 ·6H 2 O 300~350g/L;
NaCl40~45g/L;
Na 2 SO 4 85~95g/L;
d of the electroplated dark nickel k Is 8-10A/dm 2 ;
The temperature of the electroplated dark nickel is 35-40 ℃;
the time for electroplating the dark nickel is 30-35 min.
9. The method according to claim 5, wherein the tinning comprises electroplating tin;
the treatment solution for electroplated tin comprises the following components:
d of the electroplated tin k Is 6 to 10A/dm 2 ;
The temperature of the electrotinning is 20-30 ℃;
the time of tin electroplating is 30-60 min.
10. Use of the tin-plated Al-Fe-Cu aluminum alloy wire of any one of claims 1 to 4 or the tin-plated Al-Fe-Cu aluminum alloy wire prepared by the preparation method of any one of claims 5 to 9 in photovoltaic cables.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311001463.5A CN116936155A (en) | 2023-08-09 | 2023-08-09 | Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311001463.5A CN116936155A (en) | 2023-08-09 | 2023-08-09 | Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116936155A true CN116936155A (en) | 2023-10-24 |
Family
ID=88389712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202311001463.5A Pending CN116936155A (en) | 2023-08-09 | 2023-08-09 | Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116936155A (en) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55108107A (en) * | 1980-01-07 | 1980-08-19 | Sumitomo Electric Industries | Different metal coated aluminum alloy conductor and methdo for producing same |
DE19633615A1 (en) * | 1996-08-21 | 1998-02-26 | Edelhoff Adolf Feindrahtwerk | Solderable layer application onto aluminium@ alloy wire |
CN102212855A (en) * | 2011-05-20 | 2011-10-12 | 湘潭大学 | Aluminium strip with tin soldering performance and high corrosion resistance and preparation technology thereof |
CN202054913U (en) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | Weldable tin plating aluminum alloy strip |
CN102354577A (en) * | 2011-09-14 | 2012-02-15 | 无锡市嘉邦电力管道厂 | Method for making aluminum alloy wire |
JP2012143798A (en) * | 2011-01-13 | 2012-08-02 | Hikari Keikinzoku Kogyo Kk | Plated aluminum alloy casting and method for production thereof |
CN103733436A (en) * | 2011-08-31 | 2014-04-16 | 株式会社自动网络技术研究所 | Aluminum-based terminal fitting |
CN103757495A (en) * | 2013-12-26 | 2014-04-30 | 安徽欣意电缆有限公司 | Al-Fe-Cu-Mg-Ni aluminum alloy for automobile wire and wiring harness thereof |
JP6506897B1 (en) * | 2018-10-15 | 2019-04-24 | 株式会社Uacj | Aluminum alloy plate for magnetic disk, method of manufacturing the same, and magnetic disk using the aluminum alloy plate for magnetic disk |
US20200203868A1 (en) * | 2017-05-16 | 2020-06-25 | Mitsubishi Materials Corporation | Tin-plated copper terminal material, terminal, and electric-wire terminal structure |
-
2023
- 2023-08-09 CN CN202311001463.5A patent/CN116936155A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55108107A (en) * | 1980-01-07 | 1980-08-19 | Sumitomo Electric Industries | Different metal coated aluminum alloy conductor and methdo for producing same |
DE19633615A1 (en) * | 1996-08-21 | 1998-02-26 | Edelhoff Adolf Feindrahtwerk | Solderable layer application onto aluminium@ alloy wire |
JP2012143798A (en) * | 2011-01-13 | 2012-08-02 | Hikari Keikinzoku Kogyo Kk | Plated aluminum alloy casting and method for production thereof |
CN202054913U (en) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | Weldable tin plating aluminum alloy strip |
CN102212855A (en) * | 2011-05-20 | 2011-10-12 | 湘潭大学 | Aluminium strip with tin soldering performance and high corrosion resistance and preparation technology thereof |
CN103733436A (en) * | 2011-08-31 | 2014-04-16 | 株式会社自动网络技术研究所 | Aluminum-based terminal fitting |
CN102354577A (en) * | 2011-09-14 | 2012-02-15 | 无锡市嘉邦电力管道厂 | Method for making aluminum alloy wire |
CN103757495A (en) * | 2013-12-26 | 2014-04-30 | 安徽欣意电缆有限公司 | Al-Fe-Cu-Mg-Ni aluminum alloy for automobile wire and wiring harness thereof |
US20200203868A1 (en) * | 2017-05-16 | 2020-06-25 | Mitsubishi Materials Corporation | Tin-plated copper terminal material, terminal, and electric-wire terminal structure |
JP6506897B1 (en) * | 2018-10-15 | 2019-04-24 | 株式会社Uacj | Aluminum alloy plate for magnetic disk, method of manufacturing the same, and magnetic disk using the aluminum alloy plate for magnetic disk |
Non-Patent Citations (1)
Title |
---|
PAOLO FIORINI等: "电工铝合金", 轻金属, no. 02, 31 December 1990 (1990-12-31), pages 57 - 61 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109957822B (en) | Copper alloy electroplating process | |
CN102936740A (en) | Gold-silver-rhodium multilayer composite plating process | |
CN111761257B (en) | Preparation method and application of Cu-Mn-Ni-Si copper-based brazing filler metal | |
CN107245729B (en) | Manganese electrodeposition carbon fiber-based graded composite anode material and preparation method thereof | |
WO2024160246A1 (en) | Nickel-plated aluminum alloy conductor material for cable and preparation method therefor | |
CN109137050B (en) | Graphene-doped modified interconnection belt or bus belt and preparation method thereof | |
CN116936155A (en) | Tin-plated Al-Fe-Cu aluminum alloy conductor material for photovoltaic cable and preparation method and application thereof | |
CN116844754B (en) | Tinned aluminum alloy conductor material for cables and preparation method and application thereof | |
CN117051452A (en) | Tin-plated Al-Fe aluminum alloy conductor material for wires and cables, and preparation method and application thereof | |
CN115449878B (en) | Black coloring process for aluminum profile | |
CN117210723A (en) | Tin-plated Al-Fe-Mg-Cu aluminum alloy conductor material for automobile cable and preparation method and application thereof | |
CN113293411B (en) | Gradient composite lead dioxide anode plate and preparation method and application thereof | |
CN116875851A (en) | Nickel-plated Al-Fe-Zn alloy conductor material for photovoltaic cable and preparation method thereof | |
CN117038142A (en) | Tinned aluminum alloy electric power fitting and preparation method and application thereof | |
CN110835770A (en) | Iron plating solution for pretreatment bottom plating for manufacturing galvanized steel sheet | |
CN116926518A (en) | Tinned aluminum alloy conductor material for photovoltaic solder strip, and preparation method and application thereof | |
CN116875852A (en) | Nickel-plated Al-Fe-Zn alloy conductor material and preparation method thereof | |
CN116875848A (en) | Nickel-plated Al-Fe-B alloy conductor material and preparation method thereof | |
CN116875853A (en) | Nickel-plated Al-Fe-RE alloy conductor material and preparation method thereof | |
CN105525317B (en) | Battery steel shell made from a kind of three layers of nickel plating technology of battery steel shell and the technique | |
CN116875847A (en) | Nickel-plated Al-Fe-Mg alloy conductor material for automobile wire harness and preparation method thereof | |
CN114959812A (en) | Nickel-tungsten alloy electroplating solution and insoluble anode system | |
CN116875855A (en) | Nickel-plated Al-Fe-Mg alloy conductor material and preparation method thereof | |
CN116875849A (en) | Nickel-plated Al-Fe-Mg-Cu alloy conductor material for automobile wire harness and preparation method thereof | |
CN116875850A (en) | Nickel-plated Al-Fe alloy conductor material for photovoltaic cable and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |