CN116915210A - Resonator and circuit element - Google Patents

Abstract

A resonator is arranged on a circuit board and comprises a first coupling unit, a second coupling unit, a first resonance unit and at least one ground plane. The first resonant unit forms a ring shape, and each of the first coupling unit, the second coupling unit and the first resonant unit comprises at least one signal through hole and is positioned on at least two conductive layers, and the first coupling unit and the second coupling unit are coupled with the first resonant unit. The at least one ground plane is positioned on the other conductive layer of the circuit board, and the at least one ground plane is the reference ground of the first coupling unit, the second coupling unit and the first resonance unit. Therefore, the layout area of the resonator can be effectively reduced. The present disclosure also relates to a circuit element.

Description

Resonator and circuit element

Technical Field

The present disclosure relates to a resonator and a circuit element, and more particularly, to a resonator and a circuit element provided on a circuit board.

Background

Under the drive of pursuing convenience for human beings, various wireless communication systems and radio frequency technologies thereof have been developed, and the wireless communication systems have a plurality of operation frequency bands, for example, in recent years, 5G millimeter wave (mmWave) technology is emerging, and consumer electronic products carrying the technology are numerous, and terminal products are new and have been in great demand. At the same time, it means that the time, cost and design complexity of development and verification of electronic products and their components will be correspondingly increased.

For example, in the development and design stage, a Radio Frequency (RF) engineer needs to obtain related parameters and information of the circuit board material, and design according to the material parameters to develop circuit elements suitable for the RF circuit such as the RF transmission line (Transmission Line), the resonant structure, the antenna, etc. of the board material. In this regard, although the material characteristics of the circuit board can be confirmed by designing a Resonator (Resonator) on the circuit board, the dielectric coefficients (Dielectric Constant, dk) of the circuit board are changed with frequency, so that the prior art Resonator is not applied to a wideband product, for example, the difference between two or more than three frequency bands in the frequency band (24.25 GHz to 52.6 GHz) of the 5G millimeter wave FR2-1 can not be distinguished, so that the prior art Resonator is still insufficient to meet the requirements of time course, cost and simplified design of the increasingly complex wireless communication products, and it is still difficult to accurately design the required circuit elements.

In view of this, it is an issue of interest in the market to reduce the time, cost and design complexity for verifying the resonator of the circuit board or developing the circuit element, and to meet the rf characteristics of the wireless communication system, and further to make the product more advantageous in the market.

Disclosure of Invention

The present disclosure provides a resonator and a circuit element, which are disposed on a circuit board and form a ring shape through a first resonant unit, wherein each of the first coupling unit, the second coupling unit and the first resonant unit includes at least one signal via hole and is located on at least two conductive layers, so that the layout area of the resonator can be effectively reduced.

According to one embodiment of the present disclosure, a resonator is provided and disposed on a circuit board and includes a first coupling unit, a second coupling unit, a first resonant unit, and at least one ground plane. The first coupling unit is connected with the first feed-in point, and the second coupling unit is connected with the second feed-in point. The first resonant unit forms a ring shape, each of the first coupling unit, the second coupling unit and the first resonant unit comprises at least one signal through hole and is positioned on at least two conductive layers, at least one part of the first coupling unit is parallel to at least one part of the first coupling part of the first resonant unit, at least one part of the second coupling unit is parallel to at least one part of the second coupling part of the first resonant unit, and the first coupling unit and the second coupling unit are coupled with the first resonant unit. The at least one ground plane is positioned on the other conductive layer of the circuit board, and the at least one ground plane is the reference ground of the first coupling unit, the second coupling unit and the first resonance unit.

According to another embodiment of the present disclosure, a circuit element is provided and disposed on a circuit board, wherein the circuit board sequentially includes a first conductive layer, a second conductive layer, and a third conductive layer, and the circuit element includes a first coupling unit, a second coupling unit, a first resonant unit, and at least one ground plane. The first coupling unit is connected with the first feed-in point, and the second coupling unit is connected with the second feed-in point. The first resonant unit forms a ring shape, each of the first coupling unit, the second coupling unit and the first resonant unit comprises at least one signal through hole and is positioned on the first conductive layer and the third conductive layer, at least one part of the first coupling unit is parallel to at least one part of the first coupling part of the first resonant unit, at least one part of the second coupling unit is parallel to at least one part of the second coupling part of the first resonant unit, and the first coupling unit and the second coupling unit are coupled with the first resonant unit. The at least one ground plane is located on the second conductive layer, and the at least one ground plane is the reference ground of the first coupling unit, the second coupling unit and the first resonance unit.

Drawings

FIG. 1 shows a schematic perspective view of a resonator according to an embodiment of the present disclosure;

FIG. 2 shows an exploded view of the conductive layer of the resonator of FIG. 1;

FIG. 3 shows an exploded view of a signal line of the resonator of FIG. 1;

FIG. 4 shows a schematic top view of signal lines of the resonator of FIG. 1;

FIG. 5 shows a schematic S-parameter diagram of the resonator of FIG. 1;

FIG. 6 shows a schematic diagram of the areal current density of the resonator of FIG. 1;

FIG. 7 is a schematic diagram showing a usage parameter of the resonator of FIG. 1;

FIG. 8 illustrates another usage state parameter diagram of the resonator of FIG. 1; and

fig. 9 shows a schematic diagram of still another usage state parameter of the resonator in fig. 1.

Reference numerals illustrate:

100: resonator with a plurality of resonators

101: a first conductive layer

101g,102g,103g,104g,105g: ground plane

102: second conductive layer

103: third conductive layer

104: fourth conductive layer

105: fifth conductive layer

108: circuit board

110: first feed-in line

119: a first feed-in point

120: first coupling unit

123,124,133,134,136,137,153,154,156,157,166,167: line segment

125,135,138,155,158,168: signal through hole

130: first resonance unit

131: first coupling part

132: second coupling part

146,147: bending part

150: second resonance unit

151: third coupling part

152: fourth coupling part

160: second coupling unit

170: second feed-in line

179: a second feed-in point

185: grounding through hole

g23: spacing of

w2, w3, y1: width of (L)

x: first direction

x1: length of

y: second direction

And z: third direction of

Detailed Description

Fig. 1 is a perspective view showing a resonator 100 according to an embodiment of the present disclosure, fig. 2 is an exploded view of a conductive layer of the resonator 100 in fig. 1, fig. 3 is an exploded view of a signal line of the resonator 100 in fig. 1, fig. 4 is a schematic plan view of the signal line of the resonator 100 in fig. 1, for clearly showing a structure of the resonator 100, the drawing of the present disclosure indicates a rectangular coordinate system having a first direction x, a second direction y and a third direction z, and fig. 1 omits the ground via 185 in fig. 2 and shows the signal line of the conductive layer located in the inner layer of the circuit board 108 in a solid line. Referring to fig. 1 to 4, a circuit element according to an embodiment of the disclosure is specifically a resonator 100, where the resonator 100 is disposed on a circuit board 108 and includes a first coupling unit 120, a second coupling unit 160, a first resonant unit 130, and at least one ground plane (e.g., at least a ground plane 102 g), and the circuit board 108 includes a fourth conductive layer 104, a first conductive layer 101, a second conductive layer 102, a third conductive layer 103, and a fifth conductive layer 105 sequentially. In addition, the circuit element according to other embodiments of the present disclosure may be a resonator or a filter, and the shape and size of the circuit board are not limited to the drawings in the present disclosure, and the circuit board may be a printed circuit board, a flexible circuit board or a circuit substrate made of other dielectric materials, but not limited to these.

The first coupling unit 120 is connected to the first feeding point 119, the second coupling unit 160 is connected to the second feeding point 179, and the first resonant unit 130 forms a loop shape. The first coupling unit 120 includes a signal via 125 and is located in the first conductive layer 101 and the third conductive layer 103, and specifically, the first coupling unit 120 is formed by sequentially connecting a line segment 123 located in the first conductive layer 101, the signal via 125, and a line segment 124 located in the third conductive layer 103. The second coupling unit 160 includes a signal via 168 and is located in the first conductive layer 101 and the third conductive layer 103, and specifically, the second coupling unit 160 is formed by sequentially connecting a line segment 166 located in the first conductive layer 101, the signal via 168 and a line segment 167 located in the third conductive layer 103. The first resonant unit 130 includes signal through holes 135,138 and is located on the first conductive layer 101 and the third conductive layer 103, specifically, the first coupling portion 131 of the first resonant unit 130 is formed by sequentially connecting a line segment 133 located on the first conductive layer 101, the signal through hole 135 and a line segment 134 located on the third conductive layer 103, and the second coupling portion 132 of the first resonant unit 130 is formed by sequentially connecting a line segment 136 located on the first conductive layer 101, the signal through hole 138 and a line segment 137 located on the third conductive layer 103. Furthermore, the line segment of the resonator according to the present disclosure may be a straight line, an arc line, or a curved line.

At least a portion of the first coupling unit 120 is parallel to at least a portion of the first coupling portion 131 of the first resonant unit 130 (i.e., the same distance is maintained from at least a portion of the first coupling portion 131), specifically, a portion of the line segment 123, the signal via 125, and a portion of the line segment 124 of the first coupling unit 120 are parallel to a portion of the line segment 133, the signal via 135, and a portion of the line segment 134 of the first coupling portion 131, respectively, at least a portion of the second coupling unit 160 is parallel to at least a portion of the second coupling portion 132 of the first resonant unit 130, specifically, a portion of the line segment 166, the signal via 168, and a portion of the line segment 167 of the second coupling portion 132 are parallel to a portion of the line segment 136, the signal via 138, and a portion of the line segment 137, respectively, of the first coupling unit 120 and the second coupling unit 160 are thereby coupled to the first resonant unit 130. In addition, the term "connection" in this disclosure refers to a physical connection between two elements and is a direct connection or an indirect connection, while the term "coupling" in this disclosure refers to a separation between two elements without a physical connection, and an electric field energy (Electric Field Energy) generated by a current flowing through one element excites an electric field energy of the other element.

Ground planes 101g,102g,103g,104g,105g are located on the first conductive layer 101, the second conductive layer 102, the third conductive layer 103, the fourth conductive layer 104, and the fifth conductive layer 105, respectively, and are connected to each other by a plurality of ground vias 185 to maintain system grounding. The number of each of the ground planes 101g,102g,103g,104g,105g is at least one, wherein at least the ground planes 102g, 104g,105g are the reference grounds of the first coupling unit 120, the second coupling unit 160, and the first resonant unit 130. Thus, designing the ring resonator 100 in a vertical Layout (Layout) on the circuit board 108 can effectively reduce the Layout area of the resonator 100.

In other words, the first coupling portion 131 of the first resonant unit 130 specifically includes the signal via 135 and is located in the first conductive layer 101 and the third conductive layer 103, and the second coupling portion 132 of the first resonant unit 130 specifically includes the signal via 138 and is located in the first conductive layer 101 and the third conductive layer 103. Thereby, the layout area and the design complexity of the resonator 100 are reduced.

In detail, the first resonant unit 130 may have at least two resonant frequencies, where the at least two resonant frequencies have a lowest resonant frequency 26.10GHz, and a wire of each of the first resonant unit 130 and the third conductive layer 103 (for example, a path from the signal via 135 to the signal via 138 on the first conductive layer 101 by the first resonant unit 130) corresponds to an effective wavelength at the lowest resonant frequency 26.10GHz, and a ratio of a sum of path lengths of the first resonant unit 130 and the first conductive layer 101 and the third conductive layer 103 compared to the effective wavelength may be between 0.85 and 1.00, where the path length of the wire refers to a central path length thereof. Furthermore, the ratio of the sum of the path lengths of the first and third conductive layers 101 and 103 of the first resonant unit 130 to the effective wavelength may be between 0.90 and 0.98. Therefore, the prior art resonator is often designed with its resonant frequency according to its inductance effect and capacitance effect, so the frequency selection range is narrow, and the resonator 100 according to the present disclosure has better frequency selection and structural design flexibility because the resonator is structurally endless, and besides the design is complicated, the resonant line size and the feed line configuration are also mutually limited. In this embodiment, the ratio of the sum (5780 um) of the path lengths of the first conductive layer 101 and the third conductive layer 103 of the first resonant unit 130 to the effective wavelength (6160 um) is 0.94.

The path length of the first coupling unit 120 and the path length of the second coupling unit 160 are substantially equal, and the ratio of the path length of the first resonant unit 130 located in the first conductive layer 101 to the path length of the first coupling unit 120 located in the first conductive layer 101 may be between 2.2 and 12, and the ratio of the path length of the first resonant unit 130 located in the third conductive layer 103 to the path length of the first coupling unit 120 located in the third conductive layer 103 may be between 2.2 and 12. Furthermore, the ratio of the path length of the first resonant unit 130 located in the first conductive layer 101 to the path length of the first coupling unit 120 located in the first conductive layer 101 may be between 4 and 6, and the ratio of the path length of the first resonant unit 130 located in the third conductive layer 103 to the path length of the first coupling unit 120 located in the third conductive layer 103 may be between 4 and 6. Therefore, the signal coupling and layout design flexibility are facilitated. In this embodiment, the ratio of the path length (2890 um) of the first resonant unit 130 on the first conductive layer 101 to the path length (600 um) of the first coupling unit 120 on the first conductive layer 101 is 4.82, and the ratio of the path length (2890 um) of the first resonant unit 130 on the third conductive layer 103 to the path length (600 um) of the first coupling unit 120 on the third conductive layer 103 is 4.82.

Specifically, the first coupling unit 120 extends from the first feeding point 119 to the first conductive layer 101 and the third conductive layer 103 along the positive direction and the negative direction of the third direction z in an equal length along the signal through hole 125, and extends from the first conductive layer 101 and the third conductive layer 103 in an equal length along the positive direction of the first direction x; the second coupling unit 160 extends from the second feeding point 179 to the first conductive layer 101 and the third conductive layer 103 along the positive direction and the negative direction of the third direction z with equal length along the signal through hole 168, and extends from the first conductive layer 101 and the third conductive layer 103 along the negative direction of the first direction x with equal length, i.e. each of the first coupling unit 120 and the second coupling unit 160 forms a vertical coupling arm or feeding arm structure.

On the first conductive layer 101, a space g23 is formed between a portion of the line segment 123 of the first coupling unit 120 and a portion of the line segment 133 of the first coupling portion 131, a ratio of the width w2 of the first coupling unit 120 to the width w3 of the first coupling portion 131 may be between 0.2 and 3 or between 0.4 and 2, and a ratio of the width w2 of the first coupling unit 120 to the space g23 may be between 0.25 and 4 or between 0.4 and 2. Therefore, the resonator 100 with multiple resonance frequencies can be effectively realized to meet the application requirements of the 5G millimeter wave communication module with the same wide operation bandwidth. In the present embodiment, the width w2 of the first coupling unit 120 is 40um, and the width w3 of the first coupling portion 131 is 62um, so the ratio is 0.65. The width w2 of the first coupling unit 120 is 40um, and the spacing g23 is 42um, so the ratio is 0.95.

The resonator 100 further includes a first feeding line 110 and a second feeding line 170, the first feeding point 119 is connected between the first feeding line 110 and the signal via 125 of the first coupling unit 120, and the second feeding point 179 is connected between the second feeding line 170 and the signal via 168 of the second coupling unit 160. The first feeding line 110 and the second feeding line 170 are both located on the second conductive layer 102 of the circuit board 108, and the second conductive layer 102 is sandwiched between the first conductive layer 101 and the third conductive layer 103. Thereby, the design efficiency and verification accuracy of the vertical resonator 100 are improved. Further, the first feeding line 110, the first feeding point 119 and the first coupling unit 120 are formed in a tuning fork shape, the second feeding line 170, the second feeding point 179 and the second coupling unit 160 are formed in a tuning fork shape, and each of the first feeding line 110 and the second feeding line 170 has an impedance of 50 ohms and a width of 62um.

The resonator 100 further specifically includes a second resonance unit 150 that is formed in a ring shape and includes signal through holes 155,158 and is located on the first conductive layer 101 and the third conductive layer 103, at least a portion of the first coupling unit 120 is parallel to at least a portion of the third coupling portion 151 of the second resonance unit 150, specifically, a portion of the line segment 123, the signal through hole 125, and a portion of the line segment 124 of the first coupling unit 120 are parallel to a portion of the line segment 153, a portion of the signal through hole 155, and a portion of the line segment 154 of the third coupling portion 151, respectively, at least a portion of the second coupling unit 160 is parallel to at least a portion of the fourth coupling portion 152 of the second resonance unit 150, specifically, a portion of the line segment 166, a portion of the signal through hole 168, and a portion of the line segment 167 of the second coupling unit 160 are parallel to a portion of the line segment 156, the signal through hole 158, and a portion of the line segment 157 of the fourth coupling portion 152, respectively, so that the first coupling unit 120 and the second coupling unit 160 couple the second resonance unit 150. Furthermore, the first resonant unit 130 and the second resonant unit 150 are respectively located at two sides (for example, the negative direction and the positive direction of the second direction y as shown in fig. 4) of each of the first coupling unit 120 and the second coupling unit 160, and the path length of the first resonant unit 130 is different from the path length of the second resonant unit 150. Thereby, the tuning fork type first coupling unit 120 and the tuning fork type second coupling unit 160 feed energy into the annular structures of the first resonance unit 130 and the second resonance unit 150 at two sides respectively through a coupling mode. Furthermore, the resonator 100 is designed to be a multi-frequency or three-frequency or more resonant structure, so that it can more precisely determine whether the dielectric material of the circuit board 108 in the board factory meets the provided specification according to the frequency, and can effectively avoid repeated manufacturing caused by the required resonant frequency shift, and can also shorten the product development time and reduce the risk of mass production delay by simultaneously verifying each resonant frequency.

The path length of the first resonant unit 130 is specifically greater than that of the second resonant unit 150, and the first resonant unit 130 includes bending portions 146 and 147 respectively located on the first conductive layer 101 and the third conductive layer 103, where each of the bending portions 146 and 147 is connected between the first coupling portion 131 and the second coupling portion 132. Therefore, the first coupling unit 120 and the second coupling unit 160 are respectively formed by the upper half-long annular structure and the lower half-short annular structure on both sides to form the first resonant unit 130 and the upper half-short annular structure and form the second resonant unit 150, so that the resonator 100 has at least two resonant frequencies, the sizes and structures of the first resonant unit 130 and the second resonant unit 150 are not limited, and can be independently and finely tuned, thereby the resonant frequency selectivity is high, and the vertical layout of the three-dimensional structure can save about half of the layout area compared with the prior art resonator designed at the same frequency and dielectric coefficient. Furthermore, the bending part of the resonance unit of the resonator according to the disclosure can be located on a different conductive layer from the coupling part through the through hole.

Resonator 100 is in particular mirror symmetric to second conductive layer 102. Thus, design complexity and verification accuracy can be reduced for the multi-resonant resonator 100. Furthermore, as shown in fig. 4 of the present embodiment, the length x1 of the coupled resonance structure of the resonator 100 is 1866um and the width y1 is 1023um, so the resonator 100 has a sufficiently small length-width dimension. In addition, each of the first feeding line 110, the second feeding line 170, the first coupling unit 120, the second coupling unit 160, the first resonant unit 130 and the second resonant unit 150 is specifically a strip line (Stripline), and it should be understood that a part of the transmission line types in the resonator according to the present disclosure may be Microstrip lines (Microstrip), and is not limited to the present embodiment.

Fig. 5 shows a schematic diagram of S-parameters of the resonator 100 in fig. 1, in which a first measurement end and a second measurement end for measuring S-parameters in the drawing may be disposed at positions of the first feeding line 110 and the second feeding line 170 at edges of the circuit board 108, respectively. Fig. 6 shows a schematic view of the areal current density (SurfaceCurrent Density) of the resonator 100 of fig. 1, wherein the line color shades of the edges of the structure of the resonator 100 of fig. 6 are only schematic edges and are not used to represent the magnitude of the areal current density. Referring to fig. 1, 5 and 6, the resonator 100 has at least three resonance frequencies. When the loop path length formed by the first resonant unit 130 is approximately equal to one (one time) effective wavelength of the first resonant frequency 26.10GHz, the first resonant frequency is generated, and the current distribution as shown in fig. 6 (a) is concentrated in the first resonant unit 130. When the loop path length formed by the second resonance unit 150 is approximately equal to one effective wavelength of the second resonance frequency 40.60GHz, the second resonance frequency is generated, and the current distribution as shown in fig. 6 (b) is concentrated in the second resonance unit 150. When the loop path length formed by the first resonant unit 130 is approximately equal to two (twice) effective wavelengths of the third resonant frequency 52.10GHz, the third resonant frequency is generated, and the current distribution as shown in fig. 6 (c) is concentrated in the first resonant unit 130. Furthermore, the S11 and S22 parameters of the resonator 100 at each resonance frequency are smaller than-10 dB, so that the effect of multiple resonance frequencies can be formed, the frequency selectivity is high, and the resonator 100 is particularly suitable for the product development verification of the current 5G widely used frequency band, such as FR2-1 frequency band (24.25 GHz to 52.6 GHz).

Fig. 7, 8 and 9 are schematic views showing various usage parameters of the resonator 100 in fig. 1, respectively, please refer to fig. 7 to 9, in which the simulation values represent the simulation values of the S11 parameter obtained by simulating the structure of the resonator 100 according to the declared values of the dielectric constants shown in the specification of the circuit board 108, the measurement values represent the measurement values of the S11 parameter of the resonator 100 actually manufactured by the circuit board 108, and it should be understood that the dielectric constants of the circuit board 108 are related to the frequency (vary with the frequency). As can be seen from fig. 7, when an analog value of the S11 parameter (corresponding to and using the declared value of the dielectric constant of the circuit board 108) has a resonance frequency of 26.10GHz, and a measured value of the S11 parameter (corresponding to the actual value of the dielectric constant of the circuit board 108) has a resonance frequency significantly different from 26.10GHz, it indicates that the actual value of the dielectric constant of the circuit board 108 in the vicinity of 26.10GHz is significantly different from the declared value. As can be seen from FIG. 8, when the analog value of the S11 parameter shows a resonance frequency of 40.60GHz and the measured value of the S11 parameter shows a resonance frequency significantly different from 40.60GHz, the actual value of the dielectric constant of the circuit board 108 in the vicinity of 40.60GHz is significantly different from the declared value. As can be seen from fig. 9, when the analog value of the S11 parameter shows a resonance frequency of 52.10GHz and the measured value of the S11 parameter shows a resonance frequency significantly different from 52.10GHz, the actual value of the dielectric constant of the circuit board 108 in the vicinity of 52.10GHz is significantly different from the declared value.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but may be modified and altered in various ways without departing from the spirit and scope of the invention.

Claims (10)

1. A resonator, disposed on a circuit board, comprising:

a first coupling unit connected to a first feed-in point;

a second coupling unit connected to a second feed-in point;

a first resonant unit forming a ring shape, wherein each of the first coupling unit, the second coupling unit and the first resonant unit includes at least one signal via and is located on at least two conductive layers, at least a portion of the first coupling unit is parallel to at least a portion of a first coupling portion of the first resonant unit, at least a portion of the second coupling unit is parallel to at least a portion of a second coupling portion of the first resonant unit, and the first coupling unit and the second coupling unit couple the first resonant unit; and

the at least one ground plane is positioned on the other conductive layer of the circuit board, wherein the at least one ground plane is the reference ground of the first coupling unit, the second coupling unit and the first resonance unit.

2. The resonator of claim 1, wherein each of the first coupling section and the second coupling section of the first resonant cell comprises the at least one signal via and is located in the at least two conductive layers.

3. The resonator of claim 1, wherein the first resonant unit has at least two resonant frequencies, the at least two resonant frequencies having a lowest resonant frequency, the wire of each of the at least two conductive layers of the first resonant unit corresponding to an effective wavelength at the lowest resonant frequency, the ratio of the sum of the path lengths of the at least two conductive layers of the first resonant unit to the effective wavelength being between 0.85 and 1.00;

wherein, on one of the at least two conductive layers, a space is provided between the at least one part of the first coupling unit and the at least one part of the first coupling unit, the ratio of the width of the first coupling unit to the width of the first coupling unit is between 0.2 and 3, and the ratio of the width of the first coupling unit to the space is between 0.25 and 4.

4. The resonator of claim 1, wherein the path length of the first coupling unit and the path length of the second coupling unit are equal, and the ratio of the path length of the first resonant unit in one of the at least two conductive layers to the path length of the first coupling unit in the conductive layer is between 2.2 and 12.

5. The resonator of claim 1, further comprising:

the first feed-in point is connected between the first feed-in line and the at least one signal through hole of the first coupling unit; and

the second feed-in point is connected between the second feed-in line and the at least one signal through hole of the second coupling unit;

the first feed-in line and the second feed-in line are both positioned on the other conductive layer of the circuit board, and the other conductive layer is clamped between the at least two conductive layers.

6. The resonator of claim 1, wherein the resonator is mirror symmetrical to the other conductive layer.

7. The resonator of claim 1, further comprising:

a second resonance unit formed in a ring shape and including at least one signal through hole and located in the at least two conductive layers, at least a portion of the first coupling unit being parallel to at least a portion of a third coupling portion of the second resonance unit, at least a portion of the second coupling unit being parallel to at least a portion of a fourth coupling portion of the second resonance unit, the first coupling unit and the second coupling unit coupling the second resonance unit;

the first resonance unit and the second resonance unit are respectively positioned at two sides of each of the first coupling unit and the second coupling unit, and the path length of the first resonance unit is different from that of the second resonance unit.

8. The resonator of claim 7, wherein the path length of the first resonant element is greater than the path length of the second resonant element, the first resonant element including at least one bend connected between the first coupling portion and the second coupling portion.

9. A circuit device, disposed on a circuit board, wherein the circuit board comprises a first conductive layer, a second conductive layer and a third conductive layer in sequence, the circuit device comprising:

a first coupling unit connected to a first feed-in point;

a second coupling unit connected to a second feed-in point;

the first resonant unit is formed into a ring shape, wherein each of the first coupling unit, the second coupling unit and the first resonant unit comprises at least one signal through hole and is positioned on the first conductive layer and the third conductive layer, at least one part of the first coupling unit is parallel to at least one part of a first coupling part of the first resonant unit, at least one part of the second coupling unit is parallel to at least one part of a second coupling part of the first resonant unit, and the first coupling unit and the second coupling unit are coupled with the first resonant unit; and

the at least one ground plane is positioned on the second conductive layer, wherein the at least one ground plane is the reference ground of the first coupling unit, the second coupling unit and the first resonance unit.

10. The circuit element of claim 9, further comprising:

the first feed-in point is connected between the first feed-in line and the at least one signal through hole of the first coupling unit; and

the second feed-in point is connected between the second feed-in line and the at least one signal through hole of the second coupling unit;

the first feed-in line, the first feed-in point and the first coupling unit form a tuning fork shape, and the second feed-in line, the second feed-in point and the second coupling unit form a tuning fork shape.