CN116864467A - Chip heat abstractor - Google Patents
Chip heat abstractor Download PDFInfo
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- CN116864467A CN116864467A CN202310973511.0A CN202310973511A CN116864467A CN 116864467 A CN116864467 A CN 116864467A CN 202310973511 A CN202310973511 A CN 202310973511A CN 116864467 A CN116864467 A CN 116864467A
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- frame
- heat dissipation
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- partition
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 123
- 238000005192 partition Methods 0.000 claims abstract description 85
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 125000006850 spacer group Chemical group 0.000 claims description 12
- 239000000110 cooling liquid Substances 0.000 description 43
- 239000011324 bead Substances 0.000 description 15
- 238000003754 machining Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a chip heat dissipation device, which comprises: a top plate, wherein a liquid inlet and a liquid outlet are respectively formed on two longitudinal sides of the top plate; multilayer heating panel, multilayer heating panel range upon range of setting, every layer of heating panel includes: a frame; the one or more clapboards are arranged in the area surrounded by the frame, at least one end of the longitudinal direction of the clapboards is provided with a first gap from the lateral side wall of the frame, the plurality of clapboards are arranged at intervals along the lateral direction, and a second gap is arranged between the longitudinal side wall of the frame and the adjacent clapboards and between the two adjacent clapboards; the plurality of groups of division bars comprise a plurality of division bars which are arranged at intervals along the longitudinal direction, two transverse ends of each division bar are respectively connected with the frame and the partition plate, or are respectively connected with two adjacent partition plates, and the division bars of the two adjacent layers of heat dissipation plates are arranged in a crossing manner; and the upper surface of the bottom plate is tightly adhered to the lower surface of the heat dissipation plate of the bottommost layer. The chip heat dissipation device can increase the heat exchange area, improve the heat dissipation efficiency and reduce the cost.
Description
Technical Field
The present invention relates to the field of chips, and in particular, to a heat dissipation device for chips.
Background
During the use of the chips (the central processing unit chip, the graphic processing chip and the IGBT chip), a large amount of heat is generated, and the chips are required to be radiated so as to ensure smooth operation of the chips.
The existing chip heat dissipation device is provided with a runner for forming cooling liquid by sampling grooves on the surface of a metal plate, the cooling liquid dissipates heat of the chip through the runner, and the heat exchange area of the chip heat dissipation device with the structure is small and the heat dissipation efficiency is low.
Disclosure of Invention
The present invention is directed to a chip heat dissipating device, which can increase heat exchanging area, improve heat dissipating efficiency, and reduce cost.
In order to solve the above problems, the present invention provides a chip heat dissipation device, including:
the liquid inlet and the liquid outlet are respectively formed on two longitudinal sides of the top plate;
multilayer heating panel, the multilayer the heating panel stacks up and sets up, and the top layer the heating panel is closely to the lower surface of roof, every layer the heating panel includes:
the frame faces and surrounds the outer edge of the top plate, and the outer edge of the top plate at least covers the inner edge of the frame;
one or more partition boards, wherein the partition boards are arranged in an area surrounded by the frame and are flush with the upper surface/lower surface of the frame, the partition boards are longitudinally arranged, at least one longitudinal end of each partition board is away from the transverse side wall of the frame by a first gap, when one partition board is arranged, the partition boards are arranged in the middle of the area surrounded by the frame, when a plurality of partition boards are arranged, the partition boards are arranged at intervals along the transverse direction, and a second gap is formed between the longitudinal side wall of the frame and the partition boards adjacent to the longitudinal side wall of the frame and between two adjacent partition boards;
the plurality of groups of division bars are in one-to-one correspondence with the plurality of second gaps, each group of division bars comprises a plurality of division bars which are arranged at intervals along the longitudinal direction, the division bars are flush with the upper surface/lower surface of the frame, the division bars are arranged in the second gaps, the transverse two ends of the division bars are respectively connected with the frame and the partition plates, or are respectively connected with two adjacent partition plates,
the frames of the two adjacent layers of the heat dissipation plates are identical in shape with the partition plates and are aligned and tightly adhered, and the partition strips of the two adjacent layers of the heat dissipation plates are arranged in a crossing manner;
the upper surface of the bottom plate is tightly adhered to the lower surface of the bottommost heat dissipation plate, and the outer edge of the bottom plate at least covers the inner edge of the frame;
the lower surface of the bottom plate and/or the upper surface of the top plate are used for connecting with a chip.
Further, the parting bead is inclined with the longitudinal side wall of the frame, and the angle between the parting bead and the longitudinal side wall of the frame is 60-95 degrees or 105-120 degrees.
Further, in the second gaps corresponding to each two adjacent heat dissipation plates, a first pattern formed by the division bars of the upper heat dissipation plate is axisymmetric to a second pattern formed by the division bars of the lower heat dissipation plate, and a symmetry axis of the axisymmetry is formed in the middle of the second gap in the transverse direction.
Further, the number of layers of the heat dissipation plate is two, three, four or five.
Further, mounting holes for mounting chips are formed in the upper surface of the bottom plate and/or the upper surface of the top plate at positions corresponding to the side frames and the partition plates of the heat dissipation plate, one chip corresponds to one second gap, and in each second gap, the number of gaps between adjacent partition strips in each group of partition strips of each layer of heat dissipation plate corresponds to the heat dissipation amount required by the chip corresponding to the group of partition strips.
Further, the heat dissipating device further includes:
the liquid inlet connector is connected with the liquid inlet at a first end and connected with the liquid inlet pipe at a second end;
the liquid outlet connector, the first end and the liquid outlet that go out the liquid connector are connected, the second end that goes out the liquid connector is used for being connected with the drain pipe.
Further, each of the heat dissipation plates includes a plurality of plate-like heat dissipation sheets of the same shape, and a plurality of heat dissipation plates are stacked in alignment to constitute each of the heat dissipation plates.
Further, the sheet-like heat dissipation sheet is formed by punching.
Further, the chip heat dissipation device further includes:
one or more stoppers flush with the upper/lower surfaces of the frame, the stoppers being connected to longitudinal ends of the partition plate and lateral side walls of the frame adjacent thereto,
when only one baffle plate exists, one baffle block is connected to one end of the longitudinal direction of the baffle plate, which is adjacent to the liquid inlet;
when the partition plate comprises a plurality of partition plates, the partition plates are in one-to-one correspondence with the stop blocks, the two stop blocks are respectively connected to the first longitudinal end of one of the adjacent two partition plates, and the second longitudinal end of the other partition plate, and the first longitudinal end and the second longitudinal end face the two opposite transverse side walls of the frame respectively.
Further, an opening is formed on the upper surface of the top plate,
the chip heat dissipation device further includes:
the first end of the adjusting rod is connected with the baffle plate, the second end of the adjusting rod protrudes out of the opening, and the adjusting rod can transversely move in the opening so as to drive the end part of the baffle plate, which is away from the baffle plate, or move to the end part of the baffle plate;
a seal disposed within the opening to seal the opening.
Due to the technical scheme, the invention has the following beneficial effects:
according to the chip heat dissipating device of the invention, the top plate, the multi-layer heat dissipating plate and the bottom plate are sequentially stacked, the lower surface of the top plate, the frame of the multi-layer heat dissipating plate and the upper surface of the bottom plate can form a cooling chamber for containing cooling liquid, the depth of the cooling liquid is the total thickness of the multi-layer frame, the cooling liquid can flow into the cooling chamber through the liquid inlet, the cooling liquid can longitudinally flow in the second gaps between the multi-layer partition plates and the multi-layer frame and between the adjacent multi-layer partition plates, and transversely flow in the first gaps between the multi-layer partition plates and the multi-layer frame, and when the cooling liquid longitudinally flows in the second gaps, the cooling liquid can pass through the upper gaps formed by the adjacent partition strips of the upper layer and the lower gaps formed by the adjacent partition strips of the lower layer in the heat dissipating plates on the two adjacent sides, the formed flow channel is a three-dimensional flow channel, the cooling liquid can contact the inner wall of the frame of each layer of heat dissipation plate, the side wall of the parting bead, the upper surface of the parting bead of the lower layer at the intersection of the upper layer parting bead and the parting bead of the lower layer, and the lower surface of the parting bead of the upper layer at the intersection of the lower layer parting bead and the parting bead of the upper layer, so that the heat exchange area is increased, the flow at the intersection of the parting bead, the partition plate and the lower surface/lower surface of the frame is avoided, the cross section area of the flow of the cooling liquid is reduced, the flow speed is increased, the heat exchange coefficient is increased, the heat dissipation plate can be manufactured through stamping, and compared with the conventional method of forming the flow channel by machining through a metal plate, the cost can be saved, the machining time is shortened, and the machining efficiency is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following description will make a brief introduction to the drawings used in the description of the embodiments or the prior art. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a block diagram of a chip heat sink according to one embodiment of the invention;
FIG. 2 is an exploded view of the chip heat sink of the embodiment of FIG. 1;
FIG. 3 is a block diagram of two adjacent heat sinks according to one embodiment of the present invention;
fig. 4 is a structural view of a heat dissipating plate according to an embodiment of the present invention;
FIG. 5 is a schematic view of a coolant flow path of a heat sink according to one embodiment of the invention;
fig. 6 is an enlarged view of area a in fig. 5;
FIG. 7 is an exploded view of a chip heat sink according to another embodiment of the invention;
fig. 8 is a structural view of a heat dissipating plate according to another embodiment of the present invention.
Reference numerals:
100. a top plate; 110. a liquid inlet; 120. a liquid outlet; 130. a mounting hole; 201. a frame; 200. a heat dissipation plate; 202. a partition plate; 203. a parting bead; 210. a first heat dissipation plate; 210a, a first sheet-like heat dissipation sheet; 220. a second heat dissipation plate; 220a, a second sheet-like heat dissipating sheet; 300. a bottom plate; 410. a liquid inlet joint; 420. a liquid outlet joint; 500. a stop block; 600. symmetry axis.
Description of the embodiments
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Next, a chip heat dissipating device according to an embodiment of the present invention is described.
As shown in fig. 1 to 6, a chip heat dissipation device according to an embodiment of the present invention includes: top plate 100, multi-layered heat dissipation plate 200, and bottom plate 300.
First, the top plate 100 and the bottom plate 300 are explained. A liquid inlet 110 and a liquid outlet 120 are formed at both sides of the top plate 100 in the longitudinal direction, respectively. The lower surface of the top plate 100 is abutted against the lower surface of the heat dissipation plate 200 of the topmost layer. The upper surface of the bottom plate 300 is closely adhered to the lower surface of the heat dissipation plate 200 at the lowermost layer. The outer edge (outer edge) of the top plate 100 covers at least the inner edge (inner edge) of the rim 201 and the outer edge of the bottom plate 300 covers at least the inner edge of the rim 201. The lower surface of the bottom plate 300 and/or the upper surface of the top plate 100 are used for connection with a chip.
The cooling liquid can flow into the chip heat radiator through the liquid inlet, and the cooling liquid can flow out of the chip heat radiator through the liquid outlet.
The lower surface of the bottom plate 300 and/or the upper surface of the top plate 100 are used for connection with the chip, thereby enabling cooling of the chip.
Alternatively, as shown in fig. 1, the outer edges of the top plate 100, the multi-layered heat dissipation plate 200, and the bottom plate 300 are flush. It should be noted that the above is only an optional example, and it should be understood that the outer edge of the top plate 100 and the outer edge of the bottom plate 300 only cover the inner edge of the frame 201, and the cooling liquid can be contained in the area surrounded by the inner edge of the frame 201 of the heat dissipation plate 200, which is within the scope of the present invention.
Next, the heat sink 200 will be described. The heat sink 200 includes a frame 201, one or more spacers 202, and a plurality of sets of spacers 203. The rim 201 faces and is disposed around the outer edge of the top plate 100, and the outer edge of the top plate 100 covers at least the inner edge of the rim 201. The partition 202 is disposed in an area surrounded by the frame 201 and is flush with an upper/lower surface of the frame 201, the partition 202 is disposed longitudinally, and at least one end in a longitudinal direction thereof has a first gap from a lateral side wall of the frame 201, when the partition 202 is one, the partition 202 is disposed in a middle portion of the area surrounded by the frame 201, when the partition 202 is plural, the partitions 202 are arranged at intervals in a lateral direction, and in the lateral direction, a second gap is provided between the longitudinal side wall of the frame 201 and the partition 202 adjacent thereto, and between the two adjacent partitions 202. The plurality of groups of division bars 203 are in one-to-one correspondence with the plurality of second gaps, each group of division bars 203 comprises a plurality of division bars 203 which are arranged at intervals along the longitudinal direction, the division bars 203 are flush with the upper surface/lower surface of the frame 201, the division bars 203 are arranged in the second gaps, and the transverse two ends of the division bars 203 are respectively connected with the frame 201 and the partition plates 202 or respectively connected with the two adjacent partition plates 202.
As shown in fig. 2, the chip heat dissipation device includes two layers of heat dissipation plates, wherein the upper layer of heat dissipation plate is a first heat dissipation plate 210, and the lower layer of heat dissipation plate is a second heat dissipation plate 220.
The hollowed-out area in the area surrounded by the frame 201 of each layer of heat dissipation plate 200 is an area where the cooling liquid can flow, and the thickness of the heat dissipation plate 200 corresponds to the depth of the cooling liquid in the layer of heat dissipation plate 200.
The partition 202 is disposed in the area surrounded by the frame 201 and is flush with the upper/lower surface of the frame 201, so as to block the coolant. The spacer 202 is longitudinally disposed, i.e., the spacer 202 extends longitudinally. At least one end of the spacer 202 in the longitudinal direction is spaced apart from the lateral side wall of the bezel 201 by a first gap. That is, both ends of the separator 202 in the longitudinal direction have a first gap from the lateral side wall of the frame 201 (as shown in fig. 5), or one end of the separator 202 in the longitudinal direction has a first gap from the lateral side wall of the frame 201 (as shown in fig. 8). The coolant can flow laterally through the first gap.
When the partition 202 is one, the partition 202 is disposed in the middle of the area surrounded by the frame 201. The coolant can flow longitudinally in the two second gaps between the longitudinal side walls of the frame 201 and the partition 202.
Where the spacer 202 is plural, the plural spacers 202 are arranged at intervals in the lateral direction. As shown in fig. 3, eight separators 202 are disposed laterally spaced apart, and the coolant can flow longitudinally from two second gaps between the longitudinal side walls of the frame 201 and the separators 202, and from second gaps between adjacent two separators 202.
The plurality of groups of division bars 203 are in one-to-one correspondence with the plurality of second gaps, i.e. a group of division bars 203 are arranged in each second gap. Each set of parting strips 203 comprises a plurality of parting strips 203 arranged longitudinally at intervals so that the longitudinal flow of cooling liquid can flow into the gaps between parting strips 203.
The parting bead 203 is disposed in the second gap. When the division bar is in the second gap formed by the frame 201 and the partition plates 202, the two transverse ends of the division bar 203 are connected with the frame 201 and the partition plates 202, and when the division bar is in the second gap formed by two adjacent partition plates 202, the two transverse ends of the division bar 203 are connected with the two partition plates 202.
The frames 201 and the partition plates 202 of two adjacent layers of heat dissipation plates 200 are identical in shape and are aligned and closely arranged. The depth to which the multi-layered heat sink 200 can accommodate the cooling liquid is the total thickness of the layers of the frame 201 of the multi-layered heat sink 200, and the cooling liquid can flow longitudinally in the second gap and laterally in the first gap.
The division bars 203 of two adjacent layers are arranged in a crossing way, so that the upper layer of the heat dissipation plates and the lower layer of the heat dissipation plates are crossed, and cross holes are formed. Wherein, the upper layer of slits formed by the adjacent parting strips 203 of the upper layer and the lower layer of slits formed by the adjacent parting strips 203 of the lower layer of heat dissipation plate 200. Wherein, the upper layer gap, the lower layer gap and the cross pore are expressed as follows. In fig. 1 and 2, the upper heat dissipation plate is a first heat dissipation plate 201, and the lower heat dissipation plate is a second heat dissipation plate 202.
The top-most heat dissipation plate 200 is attached to the top plate 100, and the bottom-most heat dissipation plate 200 is attached to the bottom plate 300. Each layer of heat dissipation plate 200 can form a two-dimensional (transverse and longitudinal) flow channel (a hollow area defined by the frame 201 for the flow of cooling liquid), the layers of heat dissipation plates 200 are stacked to form a three-dimensional (transverse, longitudinal and vertical) flow channel, and in the second gap, cooling liquid can flow from the lower layer gap of the lower layer of heat dissipation plate 200 to the upper layer gap of the upper layer of heat dissipation plate 200 through the cross holes.
The cooling liquid can flow in the upper layer slit, the lower layer slit and the cross hole, in the second gap, the cooling liquid can contact the inner wall of the frame 201 of each layer of cooling plate 200, the side wall of the division bar 203, the upper surface of the lower layer division bar 203 at the crossing position of the upper layer slit and the lower layer division bar 203, and the lower surface of the upper layer division bar 203 at the crossing position of the lower layer slit and the upper layer division bar 203, thereby increasing the heat exchange area, avoiding flowing at the crossing position of the division bar 203, the partition plate 202 and the lower surface/lower surface of the frame 201, reducing the cross section area of the cooling liquid, increasing the flow speed, thereby improving the heat exchange coefficient and improving the heat exchange capacity.
For example, as shown in fig. 5 and 6, the cooling liquid flows laterally from the liquid inlet 110 at one side of the longitudinal direction of the frame 201 to each of the first gaps adjacent to the liquid inlet 110, and flows longitudinally into each of the second gaps, in which the cooling liquid flows through the lower layer slit, flows first along the extending direction of the lower layer slit, then flows to the intersecting hole, rises from the intersecting hole, then flows to the upper layer slit, flows along the extending direction of the upper layer slit, then flows to the intersecting hole, descends from the intersecting hole, then flows … … along the extending direction of the lower layer slit, finally flows to the liquid outlet at the other side of the longitudinal direction of the frame 201, and flows out of the chip heat dissipating device from the liquid outlet 120.
According to the chip heat dissipation device, the top plate 100, the multi-layer heat dissipation plate 200 and the bottom plate 300 are sequentially stacked, a cooling cavity for containing cooling liquid can be formed on the lower surface of the top plate 100, the side frames 201 of the multi-layer heat dissipation plate 200 and the upper surface of the bottom plate 300, the depth of the cooling liquid, namely the total thickness of the multi-layer side frames 201, can flow into the cooling cavity through the liquid inlet 110, the cooling liquid can longitudinally flow between the multi-layer partition plate 202 and the multi-layer side frames 201 and in a second gap between the adjacent multi-layer partition plates 202, and transversely flow in a first gap between the multi-layer partition plates 202 and the multi-layer side frames 201, and can longitudinally flow in the second gap through an upper layer gap formed by adjacent parting strips 203 of the upper layer of the heat dissipation plate 200 on two sides, a lower layer gap formed by adjacent parting strips 203 on the lower layer, and cross-gap crossing the upper layer gaps formed by the upper layer parting strips 203 on the lower layer, and cross-layer gaps formed by the upper layer parting strips 203 on the lower layer of the adjacent parting plates are three-dimensional flow channels, the cooling liquid can contact the inner walls of the side frames 201 of each layer heat dissipation plate 200, the side walls of the parting strips 203 and the cross-layer heat exchange surface of the upper layers and the upper layers 203 cross-layer gaps are reduced, and the heat exchange surface of the heat dissipation layers is avoided, and the heat exchange surface of the heat exchange layers is increased, and the heat exchange surface between the upper layers and the parting strips and the cross-layer layers is avoided is increased. The heat sink 200 may be manufactured by punching, and thus, compared to a conventional method in which a metal plate is used to form a runner by machining, the heat sink can save costs, reduce machining time, and improve machining efficiency.
In some embodiments of the present invention, the spacer 203 is inclined to the longitudinal side wall of the frame 201, and the angle between the spacer 203 and the longitudinal side wall of the frame 201 is 60 degrees to 95 degrees, or 105 degrees to 120 degrees.
As shown in fig. 3, the angle between the spacer 203 of the upper heat spreader 200 and the longitudinal side wall of the frame 201 in the adjacent two heat spreaders 200 is α, and the angle between the spacer 203 of the lower heat spreader 200 and the longitudinal side wall of the frame 201 is β.
Wherein alpha is 60-95 degrees, and beta is 105-120 degrees. This angle allows the parting bead 203 to be closer to a transverse line, enabling more parting beads 203 to be disposed in the second gap, improving the heat transfer area.
Alternatively, α and β are complementary, so that the overlapping ratio of the division bar 203 of the upper heat dissipation plate 200 and the division bar 203 of the lower heat dissipation plate 200 is improved, and the heat exchange area is further improved.
Further, in the second gaps corresponding to each two adjacent heat dissipation plates 200, the first pattern formed by the parting strips 203 of the upper heat dissipation plate 200 is axisymmetric to the second pattern formed by the parting strips 203 of the lower heat dissipation plate 200. An axis of symmetry 600 of the axial symmetry is formed in the middle of the second gap in the lateral direction.
As shown in fig. 4, the symmetry axis 600 is the center line of the longitudinal side walls of the frame 201 and the longitudinal side walls of the partitions 202 adjacent to the longitudinal frame 201, or the center lines of the longitudinal side walls of the adjacent two partitions 202. The first pattern and the second pattern which are axisymmetric can make the overlapping rate of the parting bead 203 higher, remarkably increase the heat exchange area, and the uniformity of the flow of the cooling liquid at two sides of the symmetry axis 600 of the cooling liquid is higher, so that the uniformity of heat exchange is increased. The symmetry axis 600 is in the horizontal middle part of second clearance, and the nearer symmetry axis 600, the heat transfer area is bigger, and is big with the middle part heat of chip, and heat is little to the periphery corresponds, can concentrate the heat dissipation to the middle part of chip, improves radiating efficiency.
In some embodiments of the present invention, the number of layers of the heat dissipation plate 200 is two, three, four or five.
As shown in fig. 2, the number of layers of the heat dissipation plate 200 is two. On this basis, by superposing a layer of heat radiation plate 200 having the same shape as the original bottom layer of second heat radiation plate 220 on top of the original upper layer of first heat radiation plate 210, three layers of heat radiation plates can be formed, and by analogy, four layers of heat radiation plates and five layers of heat radiation plates can be formed. It is also possible to superimpose a layer of heat dissipation plate having a shape different from that of the second heat dissipation plate of the original bottom layer on top of the first heat dissipation plate of the original upper layer on the basis of the two layers of heat dissipation plates, as long as there are heat dissipation plates intersecting with the division bars of the heat dissipation plate of the original upper layer, which should be understood to be within the scope of the present invention.
It should be noted that the above is only an optional example, and the number of layers of the heat dissipation plate 200 is not limited, and may be seven layers, eight layers, etc., which are all understood to be within the scope of the present invention. Therefore, the multi-layer heat dissipation plate can be simply formed, and the cooling liquid can pass through the multi-layer heat dissipation device from the crossing gap, so that the heat exchange area is increased.
In some embodiments of the present invention, the positions of the frame 201 and the partition 202 of the corresponding heat dissipation plate 200 in the upper surface of the bottom plate 300 and/or the upper surface of the top plate 100 are formed with mounting holes 130 capable of mounting chips, one chip corresponding to one second gap, in each second gap, the number of gaps between adjacent ones of the division bars 203 in each set of division bars 203 of each layer of heat dissipation plate 200, and the amount of heat dissipation required for the chip corresponding to the set of division bars 203.
As shown in fig. 2, the mounting holes 130 are provided in nine groups (corresponding to nine second gaps), four of the mounting holes 130 are provided in each group, and fasteners can pass through the mounting holes 130 of the mounting portions of the four corners of the chip, so that the chip is closely attached to the chip heat sink.
As shown in fig. 5, among nine groups of division bars 203 (corresponding to nine second gaps), the number of gaps between adjacent division bars 203 in each of the third second gap, the sixth second gap and the ninth second gap is smaller than that of other gaps, the heat dissipation required by the chips corresponding to the second gaps is smaller, the flow rate of the cooling liquid flowing through the second gaps is reduced, and the heat exchange area in the second gaps is reduced, so that more cooling liquid flows into other second gaps, and more chips corresponding to other second gaps dissipate heat, and efficient heat dissipation can be performed on the chips with different requirements for heat dissipation in a targeted manner.
In some embodiments of the present invention, the heat sink further includes a liquid inlet connector 410 and a liquid outlet connector 420. The first end of the fluid inlet connector 410 is connected to the fluid inlet 110, and the second end of the fluid inlet connector 410 is adapted to be connected to a fluid inlet tube. The first end of the liquid outlet connector 420 is connected to the liquid outlet 120, and the second end of the liquid outlet connector 420 is connected to a liquid outlet pipe.
As shown in fig. 1, the liquid inlet 110 is connected to a liquid inlet pipe through a liquid inlet joint 410, and the liquid outlet 120 is connected to a liquid outlet pipe through a liquid outlet joint 420, so that the tightness can be increased, and leakage of cooling liquid can be avoided.
In some embodiments of the present invention, each of the heat dissipation plates 200 includes a plurality of plate-like heat dissipation sheets of the same shape, and a plurality of heat dissipation plates 200 are stacked in alignment to constitute each of the heat dissipation plates 200.
As shown in fig. 7, each layer of heat dissipation plate 200 includes three sheet-like heat dissipation plates. The first heat dissipation plate 210 includes three first sheet-like heat dissipation plates 210a, and the first heat dissipation plate 220 includes three second sheet-like heat dissipation plates 220a. A plurality of lamellar heat dissipation thin plates are aligned and stacked to form the heat dissipation plate 200, through increasing or reducing the quantity of lamellar heat dissipation thin plates, can form the heat dissipation plate 200 of different thickness, can conveniently adjust the thickness of heat dissipation plate 200, the processing degree of difficulty of lamellar heat dissipation plate 200 reduces moreover, and the processing of being convenient for even single lamellar heat dissipation thin plate processing failure causes the disablement, and its loss is also lower, can reduce cost.
Further, the sheet-like heat dissipation sheet is formed by punching.
The sheet-like heat dissipation sheet may be formed by one-time stamping, or by stamping a plurality of times. The thickness of the sheet-shaped heat radiation thin plate is relatively thin, the requirement of a stamping process can be met, compared with the existing machining process carried out on a metal plate through a drill bit, the stamping process has the advantages that the machining time is greatly shortened, the efficiency is high, the cost is low, and the requirement of mass machining is met.
The thicker heat dissipation plate 200 formed by stacking the plurality of heat dissipation sheets enables the chip heat dissipation device to accommodate more cooling liquid and increase heat dissipation capacity.
In some embodiments of the present invention, the chip heat dissipation device further includes: one or more stoppers 500, the stoppers 500 being flush with the upper/lower surfaces of the frame 201, the stoppers 500 being connected to the longitudinal ends of the barrier 202 and the lateral side walls of the frame 201 adjacent thereto. When there is only one baffle 202, a stop 500 is attached to one end of the baffle 202 longitudinally adjacent the inlet 110. When the partition 202 includes a plurality of partitions 202 and a plurality of stoppers 500, the plurality of stoppers 500 are connected to a first longitudinal end of one partition 202 and a second longitudinal end of the other partition 202 of the adjacent two partitions 202, respectively, and the first longitudinal end and the second longitudinal end face opposite lateral sidewalls of the frame 201, respectively.
As shown in the upper diagram of fig. 8, eight stoppers 500 are disposed in the chip heat dissipating device, and the cooling liquid flows in from the liquid inlet 110 as shown by arrows, then flows longitudinally through each second gap in turn, forms a serpentine flow channel, and finally flows out from the liquid outlet 120. Compared with a chip heat dissipating device (cooling liquid synchronously flows through all the second gaps) without the stop block 500, the cross-sectional area of the cooling liquid flowing through is relatively smaller, and when the liquid inlet amount of the cooling liquid is fixed, the flow speed of the cooling liquid is increased, so that the heat exchange coefficient is increased, and the heat exchange capacity is improved. In addition, the retention of the cooling liquid after heat exchange can be reduced, and the heat exchange efficiency is improved. The baffle block can be integrally formed with the baffle plate and the frame, or the baffle block is an independent component and is arranged between the baffle plate and the frame.
Further, an opening is formed through the upper surface of the top plate 100, and the chip heat sink further includes an adjusting lever and a sealing member. The first end of the adjusting rod is connected with the baffle 500, the second end of the adjusting rod protrudes out of the opening, and the adjusting rod can transversely move in the opening to drive the end of the baffle 500 away from the baffle 202 or move to the end of the baffle 202. A seal is disposed within the opening to seal the opening.
By moving the adjustment lever laterally at the opening, the stopper 500 can be moved to the top of the diaphragm 202 to form the flow path shown in the upper drawing in fig. 8, and the stopper 500 can be moved away from the end of the diaphragm 202 to form the flow path shown in the lower drawing in fig. 8. Therefore, the chip heat dissipation device can realize the switching of two flow channels, and different requirements of customers are met. After the adjusting rod is adjusted, the opening is sealed through the sealing piece, so that leakage of cooling liquid can be avoided. The seal may be a sealant or a silicone pad, or the like.
The foregoing is only illustrative of the present invention and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present invention.
Claims (10)
1. A chip heat dissipating device, wherein the chip heat dissipating plate comprises:
the liquid inlet and the liquid outlet are respectively formed on two longitudinal sides of the top plate;
multilayer heating panel, the multilayer the heating panel stacks up and sets up, and the top layer the heating panel is closely to the lower surface of roof, every layer the heating panel includes:
the frame faces and surrounds the outer edge of the top plate, and the outer edge of the top plate at least covers the inner edge of the frame;
one or more partition boards, wherein the partition boards are arranged in an area surrounded by the frame and are flush with the upper surface/lower surface of the frame, the partition boards are longitudinally arranged, at least one longitudinal end of each partition board is away from the transverse side wall of the frame by a first gap, when one partition board is arranged, the partition boards are arranged in the middle of the area surrounded by the frame, when a plurality of partition boards are arranged, the partition boards are arranged at intervals along the transverse direction, and a second gap is formed between the longitudinal side wall of the frame and the partition boards adjacent to the longitudinal side wall of the frame and between two adjacent partition boards;
the plurality of groups of division bars are in one-to-one correspondence with the plurality of second gaps, each group of division bars comprises a plurality of division bars which are arranged at intervals along the longitudinal direction, the division bars are flush with the upper surface/lower surface of the frame, the division bars are arranged in the second gaps, the transverse two ends of the division bars are respectively connected with the frame and the partition plates, or are respectively connected with two adjacent partition plates,
the frames of the two adjacent layers of the heat dissipation plates are identical in shape with the partition plates and are aligned and tightly adhered, and the partition strips of the two adjacent layers of the heat dissipation plates are arranged in a crossing manner;
the upper surface of the bottom plate is tightly adhered to the lower surface of the bottommost heat dissipation plate, and the outer edge of the bottom plate at least covers the inner edge of the frame;
the lower surface of the bottom plate and/or the upper surface of the top plate are used for connecting with a chip.
2. The chip heat dissipating device of claim 1, wherein the spacer is inclined to the longitudinal side wall of the frame at an angle of 60 degrees to 95 degrees or at an angle of 105 degrees to 120 degrees.
3. The heat sink according to claim 1, wherein in the second gaps corresponding to each two of the heat dissipation plates of adjacent two layers, a first pattern formed by the division bars of the heat dissipation plates of an upper layer is axisymmetric with a second pattern formed by the division bars of the heat dissipation plates of a lower layer, and a symmetry axis of the axisymmetry is formed in a middle portion of the second gaps in a lateral direction.
4. The heat sink of claim 1, wherein the number of layers of the heat spreader is two, three, four or five.
5. The heat dissipating device for chips as defined in claim 1, wherein mounting holes for mounting chips are formed in positions corresponding to the frame of the heat dissipating plate and the partition plate in the upper surface of the bottom plate and/or the upper surface of the top plate, one chip corresponding to one second gap, and the number of gaps between adjacent ones of the division bars in each of the groups of the heat dissipating plates in each of the second gaps corresponds to the heat dissipating amount required for the chips corresponding to the group of the division bars.
6. The chip heat sink of claim 1, wherein the heat sink further comprises:
the liquid inlet connector is connected with the liquid inlet at a first end and connected with the liquid inlet pipe at a second end;
the liquid outlet connector, the first end and the liquid outlet that go out the liquid connector are connected, the second end that goes out the liquid connector is used for being connected with the drain pipe.
7. The chip heat dissipating device according to any one of claims 1 to 6, wherein each of the heat dissipating plates comprises a plurality of sheet-like heat dissipating sheets of the same shape, and a plurality of heat dissipating plates are stacked in alignment to constitute each of the heat dissipating plates.
8. The chip heat sink of claim 7, wherein the sheet-like heat sink sheet is formed by stamping.
9. The chip heat sink of claim 1, further comprising:
one or more stoppers flush with the upper/lower surfaces of the frame, the stoppers being connected to longitudinal ends of the partition plate and lateral side walls of the frame adjacent thereto,
when only one baffle plate exists, one baffle block is connected to one end of the longitudinal direction of the baffle plate, which is adjacent to the liquid inlet;
when the partition plate comprises a plurality of partition plates, the partition plates are in one-to-one correspondence with the stop blocks, the two stop blocks are respectively connected to the first longitudinal end of one of the adjacent two partition plates, and the second longitudinal end of the other partition plate, and the first longitudinal end and the second longitudinal end face the two opposite transverse side walls of the frame respectively.
10. The heat sink of claim 9, wherein the top surface of the top plate is formed with an opening therethrough,
the chip heat dissipation device further includes:
the first end of the adjusting rod is connected with the baffle plate, the second end of the adjusting rod protrudes out of the opening, and the adjusting rod can transversely move in the opening so as to drive the end part of the baffle plate, which is away from the baffle plate, or move to the end part of the baffle plate;
a seal disposed within the opening to seal the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310973511.0A CN116864467A (en) | 2023-08-04 | 2023-08-04 | Chip heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310973511.0A CN116864467A (en) | 2023-08-04 | 2023-08-04 | Chip heat abstractor |
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| CN116864467A true CN116864467A (en) | 2023-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310973511.0A Pending CN116864467A (en) | 2023-08-04 | 2023-08-04 | Chip heat abstractor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457603A (en) * | 2023-10-24 | 2024-01-26 | 毫厘机电(苏州)有限公司 | Cooling plate of power device |
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