CN116846339B - Shock-resistant quartz crystal oscillator - Google Patents
Shock-resistant quartz crystal oscillator Download PDFInfo
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- CN116846339B CN116846339B CN202311074479.9A CN202311074479A CN116846339B CN 116846339 B CN116846339 B CN 116846339B CN 202311074479 A CN202311074479 A CN 202311074479A CN 116846339 B CN116846339 B CN 116846339B
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- 239000013078 crystal Substances 0.000 title claims abstract description 80
- 239000010453 quartz Substances 0.000 title claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 230000035939 shock Effects 0.000 title abstract description 7
- 239000000872 buffer Substances 0.000 claims abstract description 67
- 238000013016 damping Methods 0.000 claims abstract description 57
- 238000009413 insulation Methods 0.000 claims abstract description 47
- 230000003139 buffering effect Effects 0.000 claims abstract description 17
- 239000004744 fabric Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/02—Details
- H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to the technical field of crystal oscillators, in particular to an anti-vibration quartz crystal oscillator, which comprises a crystal oscillator main body, pins, a bearing plate, a buffer module, an auxiliary module and a heat insulation module, wherein the bearing plate is arranged on the outer sides of the pins, the buffer module is arranged on the upper side of the bearing plate, the auxiliary module is arranged on the outer sides of the pins, the heat insulation module is arranged on the outer sides of the bearing plate, the buffer module comprises fixing seats, the fixing seats are all fixed on the two sides of the upper part of the bearing plate, shell plates are all fixedly connected to the outer sides of the fixing seats, buffer pads are all fixedly connected to the inner walls of the shell plates, and limiting sliding rods are all connected to guide hole positions of the shell plates in a sliding mode. According to the invention, through the structures such as the bearing plate, the buffer insulating template, the damping rod, the buffer sleeve and the like, the shock-resistant structure of the quartz crystal oscillator can buffer pins while the crystal oscillator main body is subjected to shock absorption and buffering, so that the influence of external shock on the crystal oscillator main body is reduced.
Description
Technical Field
The invention relates to the technical field of crystal oscillators, in particular to an anti-vibration quartz crystal oscillator.
Background
The quartz crystal oscillator is an electronic element for generating high-precision oscillation frequency by using piezoelectric effect of quartz crystal (also called crystal), belongs to passive element, and is applied to various circuit modules, and the quartz crystal oscillator has basically the same structural principle although the appearance is different, the size and the frequency are different, so that the stable and reliable operation of the quartz crystal is improved, and the quartz resonator shell component is subjected to sealing treatment.
The quartz crystal oscillator has the advantages that the quartz crystal wafer inside the quartz crystal oscillator is thinner, the wafer size is larger, the wafer is easily damaged when the quartz crystal oscillator is subjected to external impact vibration, further, the quartz crystal oscillator is in fault, part of the crystal oscillator is arranged on a circuit board through pins, the vibration suffered by the crystal oscillator is usually caused by the vibration of the circuit board, and the vibration-resistant structure of the conventional quartz crystal oscillator is usually used for only buffering and resisting vibration of the main body of the crystal oscillator, so that the vibration-resistant effect is general, and therefore, the vibration-resistant quartz crystal oscillator is proposed according to the problems.
Disclosure of Invention
The invention aims to provide an anti-vibration quartz crystal oscillator, which aims to solve the problem that an anti-vibration structure of the traditional quartz crystal oscillator generally only buffers and anti-vibration a crystal oscillator main body.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides an antidetonation quartz crystal oscillator, includes crystal oscillator main part, pin, accepts board, buffer module, auxiliary module and thermal-insulated module, accept the board setting in the outside of pin, buffer module sets up the upside at accepting the board, auxiliary module sets up the outside at the pin, thermal-insulated module sets up the outside at accepting the board, buffer module includes the fixing base, the upper portion both sides at accepting the board are all fixed to the fixing base, the equal fixedly connected with shell plate in the outside of fixing base, the equal fixedly connected with blotter of inner wall of shell plate, the equal sliding connection of guide hole position department of shell plate has spacing slide bar, the equal fixedly connected with buffering insulation form board of the other end of spacing slide bar, equal fixedly connected with stop collar in guide hole inner wall upper and lower both sides of accepting the board, a set of fixedly connected with buffer sleeve between the stop collar, the equal fixedly connected with insulating sleeve in inboard of buffer sleeve, the upside fixedly connected with damping rod, the upper end fixedly connected with locating part of damping rod, the outside sliding connection of damping rod has the sliding sleeve from the outside of last clamp spring and the equal fixedly connected with arc-shaped body of arc-shaped connection between the arc-shaped body.
Preferably, the surface of the buffer insulating template is provided with a channel, the inner wall of the channel of the buffer insulating template is attached to the outer surface of the pin, and the outer end surface of the buffer pad is fixedly connected with the outer end surface of the buffer insulating template.
Preferably, the insulating sleeves are sleeved on the outer sides of the pins, a gap is reserved between the inner wall of the limiting ring and the insulating sleeves, and a gap is reserved between the limiting ring and the pins.
Preferably, the buffer springs are arranged between the lower end face of the limiting piece and the upper end face of the sliding sleeve, the shock absorption springs are arranged between the lower end face of the sliding sleeve and the upper end face of the bearing plate, and the inner wall of the sliding sleeve is attached to the outer curved surface of the damping rod.
Preferably, the auxiliary module comprises a clamping module and an inserting module, the clamping module comprises a clamping main body, an inserting groove is formed in the surface of the clamping main body, damping layers are fixedly connected to two sides of the inner wall of the inserting groove respectively, rail blocks are fixedly connected to two sides of the inner wall of the clamping main body respectively, the inserting module comprises an inserting piece main body and a rail groove, damping pads are fixedly connected to the inner sides of the inserting module and the clamping main body respectively, quick-release modules are mounted on two sides of the clamping main body respectively, each quick-release module comprises a rail rod, one end of each rail rod is fixedly connected with the outer end face of the clamping main body, a pushing plate is slidably connected to the outer side of each rail rod respectively, a limit rod is fixedly connected to two side guide holes of each pushing plate respectively, elastic plug-in units are fixedly connected to one end of each limit rod respectively, a supporting structure is fixedly connected to the outer sides of each clamping module and each inserting module respectively, and a limit structure is fixedly connected to the lower sides of each clamping module and each inserting module respectively.
Preferably, the clamping module and the inserting module are arranged on the outer side of the pin, the surface of the damping pad is attached to the outer curved surface of the pin, the supporting structure consists of a frame body, a seat body and an adhesive layer, the seat body of the supporting structure is of a hyperbolic X-shaped structure, the limiting structure consists of a rod body and a limiting stop piece, and the inner curved surface of the limiting stop piece of the limiting structure is attached to the outer curved surface of the pin.
Preferably, the heat insulation module comprises a connecting piece, the equal fixed connection of connecting piece is in the outer terminal surface both sides of accepting the board, a set of rotate between the outer terminal surface of connecting piece and be connected with first heat insulating board, a set of rotate between the outer terminal surface of connecting piece and be connected with the second heat insulating board, the equal fixedly connected with damping elastic pad in the inner wall both sides of first heat insulating board and second heat insulating board, all be provided with thermal insulation cloth between the inner wall of first heat insulating board and second heat insulating board, the lower extreme of thermal insulation cloth all with the up end fixed connection of connecting piece, the lower terminal surface fixedly connected with heat insulating pad of accepting the board.
Preferably, the two ends of the heat insulating cloth are arranged between the outer end faces of the damping elastic pads, the outer end faces of the heat insulating cloth are attached to the outer end faces of the damping elastic pads, the outer end faces of the first heat insulating plate and the second heat insulating plate are attached to the outer end faces of the bearing plates, and no gap is reserved between the first heat insulating plate and the bearing plates and between the second heat insulating plate and the bearing plates.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the buffer sleeve, the buffer pad and the buffer insulating template can buffer and damp the vibrating pins through the structures such as the bearing plate, the buffer insulating template, the damping rod and the buffer sleeve, so that the vibration suffered by the crystal oscillator main body is reduced, the crystal oscillator main body can be damped and buffered through the buffer layer, the arc clamping piece and the damping spring, and the damping spring can be damped and damped through the damping rod, the sliding sleeve and the damping spring, so that the pins can be buffered while the crystal oscillator main body is damped and buffered through the vibration-proof structure of the quartz crystal oscillator, the influence of external vibration on the crystal oscillator main body is reduced, and the problem that the vibration-proof structure of the conventional quartz crystal oscillator normally only buffers and dampens the crystal oscillator main body is solved.
2. According to the invention, the clamping module, the inserting module, the quick-dismantling module, the supporting structure and the like are arranged to enable the clamping module and the inserting module to be matched with each other, the auxiliary module can be fixed on the outer side of the pins, the lower ends of the pins can be supported through the supporting structure, the lower end areas of the pins can be positioned through the limiting structure, the pins can be welded with the circuit board by the auxiliary staff without worrying about the change of the positions of the pins, the auxiliary module can be quickly dismantled from the pins through the quick-dismantling module after welding without affecting the connection of the pins and the circuit board, the position positioning of the pins of the quartz crystal oscillator during welding is realized, the problem that the position of the pins is required to be kept attached to welding spots of the circuit board during welding of the pins of the quartz crystal oscillator, but the staff needs to hold a welding machine and tin bars by hand during actual welding, the positioning of the pins is inconvenient, and the change of the positions of the pins easily occurs with the circuit board is solved.
3. According to the invention, the damping elastic pad, the heat insulation cloth, the connecting piece, the heat insulation pad and other structures enable the quartz crystal oscillator after being mounted and welded to isolate heat transmission between the crystal oscillator main body and the circuit board through the heat insulation module, so that the heat transmission between the quartz crystal oscillator and the circuit board can be isolated, the heat dissipation pressure of the crystal oscillator is relieved, and the problem that the heat generated by various components can further raise the temperature of the quartz crystal oscillator when the circuit board is operated, and the heat dissipation pressure of the crystal oscillator can be increased while affecting the operation of the crystal oscillator, so that the rapid heat dissipation can not be carried out through the shell is solved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the de-insulation module of FIG. 1 according to the present invention;
FIG. 3 is a schematic diagram showing an expanded structure of the buffer module of FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the present invention in an expanded configuration at the shell plate of FIG. 3;
FIG. 5 is a schematic diagram of the buffer module of FIG. 2 according to the present invention;
FIG. 6 is a schematic view of the structure of FIG. 5A according to the present invention;
FIG. 7 is a schematic diagram of the auxiliary module of FIG. 2 according to the present invention;
FIG. 8 is a schematic view of a split structure of the fastening module of FIG. 7 according to the present invention;
FIG. 9 is a schematic diagram of the quick release module of FIG. 8 according to the present invention;
FIG. 10 is a schematic view of the heat insulation module of FIG. 1 according to the present invention;
FIG. 11 is a schematic view of the second insulation panel structure of FIG. 10 according to the present invention;
fig. 12 is a schematic view of the thermal insulation cloth of fig. 10 according to the present invention.
In the figure: 1-crystal oscillator main body, 2-pin, 3-receiving plate, 4-buffer module, 41-fixing seat, 42-shell plate, 43-buffer pad, 44-limit slide bar, 45-buffer insulating template, 46-limit ring, 47-buffer sleeve, 48-insulating sleeve, 49-damping rod, 410-sliding sleeve, 411-limit piece, 412-buffer spring, 413-damping spring, 414-arc clamping block, 415-arc clamping piece, 416-buffer layer, 5-auxiliary module, 51-clamping module, 511-clamping main body, 512-insertion groove, 513-damping layer, 514-rail block, 52-insertion module, 521-insertion main body, 522-rail groove, 53-damping pad, 54-quick-dismantling module, 541-rail rod, 542-push plate, 543-limit rod, 544-elastic plug, 55-supporting structure, 56-limit structure, 6-heat insulation module, 61-connecting piece, 62-first heat insulation board, 63-second heat insulation board, 64-damping elastic pad, 65-heat insulation cloth, 66-heat insulation pad.
Detailed Description
Example 1:
referring to fig. 1-4 and fig. 7-12, the present invention provides a technical solution:
the utility model provides an antidetonation quartz crystal oscillator, including crystal oscillator main part 1, the pin 2, accept the board 3, buffer module 4, supplementary module 5 and thermal-insulated module 6, accept the board 3 and set up in the outside of pin 2, buffer module 4 sets up in the upside of accepting board 3, supplementary module 5 sets up in the outside of pin 2, thermal-insulated module 6 sets up in the outside of accepting the board 3, buffer module 4 includes fixing base 41, fixing base 41 all is fixed in the upper portion both sides of accepting board 3, the outside of fixing base 41 all fixedly connected with shell plate 42, the inner wall of shell plate 42 all fixedly connected with blotter 43, the guide hole position department of shell plate 42 all sliding connection has spacing slide bar 44, the other end of spacing slide bar 44 all fixedly connected with buffering insulation template 45, it all fixedly connected with spacing ring 46 to accept the guide hole inner wall upper and lower both sides of board 3, fixedly connected with buffer sleeve 47 between a set of spacing ring 46, the inboard of buffer sleeve 47 all fixedly connected with insulation sleeve 48, the surface of buffering insulation template 45 is provided with the channel, buffering insulation template 45's channel inner wall is laminated with the upper portion both sides of accepting board 3, the outer surface of pin 3, the outer terminal surface of pin 45 and outer terminal surface of buffering insulation template 45 and outer terminal surface of buffering 45 are fixedly connected with spacing buffer 45, buffering buffer template 45 can be buffered and insulated template 45, buffering shock attenuation template 2; the insulating sleeve 48 is sleeved on the outer side of the pin 2, a gap is reserved between the inner wall of the limiting ring 46 and the insulating sleeve 48, and a gap is reserved between the limiting ring 46 and the pin 2, so that the insulating sleeve 48 can shake on the inner side of the limiting ring 46, and the buffer sleeve 47 can buffer the insulating sleeve 48 and the pin 2.
As shown in fig. 7-9, the auxiliary module 5 includes a clamping module 51 and an inserting module 52, the clamping module 51 includes a clamping main body 511, an inserting groove 512 is formed on the surface of the clamping main body 511, two sides of the inner wall of the inserting groove 512 are fixedly connected with a damping layer 513, two sides of the inner wall of the clamping main body 511 are fixedly connected with a rail block 514, the inserting module 52 includes an inserting main body 521 and a rail groove 522, the inner sides of the inserting module 52 and the clamping module 51 are fixedly connected with a damping pad 53, two sides of the clamping main body 511 are respectively provided with a quick-dismantling module 54, the quick-dismantling module 54 includes a rail rod 541, one end of the rail rod 541 is fixedly connected with the outer end face of the clamping main body 511, the outer side of the rail rod 541 is respectively connected with a push plate 542, two side guide holes of the push plate 542 are respectively connected with a limiting rod 543, one end of the limiting rod 543 is respectively connected with an elastic plug 544, the outer sides of the clamping module 51 and the inserting module 52 are respectively connected with a supporting structure 55, and the lower sides of the clamping module 51 and the inserting module 52 are respectively fixedly connected with a limiting structure 56, so that when a pin 2 of the quartz crystal oscillator can be welded at the position of the auxiliary module 5, the pin 2 can be prevented from being fluctuated due to the position change caused by the auxiliary positioning of the positioning module 2; the clamping module 51 and the inserting module 52 are arranged on the outer side of the pin 2, the surface of the damping pad 53 is attached to the outer curved surface of the pin 2, the supporting structure 55 is composed of a frame body, a seat body and an adhesive layer, the seat body of the supporting structure 55 is of a hyperbolic X-shaped structure, the limiting structure 56 is composed of a rod body and a limiting stop piece, the inner curved surface of the limiting stop piece of the limiting structure 56 is attached to the outer curved surface of the pin 2, the adhesive layer of the supporting structure 55 can be attached to a circuit board to fix the pin 2, the supporting structure 55 can support the lower end of the pin 2, the lower end area of the pin 2 can be positioned through the limiting structure 56, and bending of the lower end of the pin 2 due to touch of a welding machine is avoided during welding.
As shown in fig. 10-12, the heat insulation module 6 includes a connecting piece 61, the connecting pieces 61 are fixedly connected to two sides of an outer end surface of the receiving plate 3, a first heat insulation plate 62 is rotatably connected between the outer end surfaces of a group of connecting pieces 61, a second heat insulation plate 63 is rotatably connected between the outer end surfaces of a group of connecting pieces 61, damping elastic pads 64 are fixedly connected to two sides of inner walls of the first heat insulation plate 62 and the second heat insulation plate 63, a heat insulation cloth 65 is arranged between the inner walls of the first heat insulation plate 62 and the second heat insulation plate 63, the lower end of the heat insulation cloth 65 is fixedly connected with an upper end surface of the connecting piece 61, and a heat insulation pad 66 is fixedly connected to the lower end surface of the receiving plate 3, so that the quartz crystal oscillator can insulate heat transmission between the quartz crystal oscillator and the circuit board through the heat insulation module 6 so as to relieve heat dissipation pressure of the crystal oscillator; both ends of the heat insulating cloth 65 are arranged between the outer end faces of a group of damping elastic pads 64, the outer end faces of the heat insulating cloth 65 are attached to the outer end faces of the damping elastic pads 64, the outer end faces of the first heat insulating plate 62 and the second heat insulating plate 63 are attached to the outer end faces of the bearing plate 3, gaps are not reserved between the first heat insulating plate 62 and the second heat insulating plate 63 and the bearing plate 3, the heat insulating cloth 65 can be limited through the arranged damping elastic pads 64, and the heat insulating effect of the heat insulating module 6 is improved through the gaps not reserved between the first heat insulating plate 62 and the second heat insulating plate 63 and the bearing plate 3.
The working flow is as follows: in the vibration-proof process of the vibration-proof quartz crystal oscillator, when vibration (such as radiator operation and the like) occurs to a circuit board due to various reasons, the vibration is conducted to the pin 2, the vibration of the pin 2 drives the insulating sleeve 48 to vibrate, the insulating sleeve 48 and the pin 2 can be buffered through the buffer sleeve 47 so as to reduce vibration frequency, the buffer insulating templates 45 on two sides can be shifted outwards to a small extent due to the vibration of the pin 2, the buffer insulating templates 45 can be buffered through the buffer pad 43 so as to buffer the pin 2, the vibration of the pin 2 can be greatly reduced through the pre-buffering of the buffer sleeve 47 and the buffer insulating templates 45 and the large-range buffering of the buffer pad 43 matched with the curved structure of the pin 2, vibration of the crystal oscillator main body 1 is further reduced, vibration-proof buffering of the crystal oscillator main body 1 is completed, when the pin 2 and the circuit board are required to be welded, firstly, aligning the pins 2 with welding spots, attaching an adhesive layer of a supporting structure 55 to a circuit board, limiting the lower end of the pins 2 through a limiting structure 56 (avoiding bending of the lower end of the pins 2 due to touch of a welding machine during welding), at this time, a worker can weld the pins 2 on the welding spots of the circuit board through the welding machine and a tin bar, avoiding cold welding caused by position change of the pins 2, after welding, pushing a push plate 542 of a quick-release module 54 to push an elastic plug 544 to displace, separating a clamping module 51 from an inserting module 52 through displacement of the elastic plug 544, quickly detaching an auxiliary module 5 from the pins 2 through the quick-release module 54 after welding without affecting connection of the pins 2 and the circuit board, rotating heat insulation plates inside the auxiliary module 5 after detaching so that the heat insulation cloth 65 is pulled out, the heat emitted by the circuit board can be isolated through the heat insulating cloth 65, the heat insulating pad 66, the first heat insulating plate 62 and the second heat insulating plate 63, so that the quartz crystal oscillator can isolate heat transmission between the quartz crystal oscillator and the circuit board, and the heat radiating pressure of the crystal oscillator can be relieved.
Example 2
Referring to fig. 1, 5 and 6, the present invention provides a technical solution:
the utility model provides an antidetonation quartz crystal oscillator, including crystal oscillator main part 1, pin 2, accept board 3 and buffer module 4, accept the board 3 setting in the outside of pin 2, buffer module 4 sets up in the upside of accepting board 3, buffer module 4 includes damping rod 49, damping rod 49 equal fixed connection is in the upside of accepting board 3, the upper end fixedly connected with locating part 411 of damping rod 49, damping rod 49's outside sliding connection has sliding sleeve 410, damping rod 49's outside has cup jointed buffer spring 412 and damping spring 413 from top to bottom in proper order, equal fixedly connected with arc fastener 415 in arc groove surface upper and lower both sides of crystal oscillator main part 1, equal swing joint has arc fastener 414 between the outer terminal surface of a set of arc fastener 415, arc fastener 414 equal fixed connection is in the outside of sliding sleeve 410, damping spring 412 all sets up between the lower terminal surface of locating part 411 and the up end of sliding sleeve 410, damping spring 413 all sets up between the lower terminal surface of 410 and the up end of accepting board 3, the inner wall of sliding sleeve 410 and the outer curved surface of rod 49 laminate mutually, can carry out vibration damping spring 416 through the arc fastener 415, can carry out the vibration damping spring to the vibration absorber and the vibration damper main part 1, can be to the vibration damper main part 1, the vibration damper is avoided to the arc fastener is passed through to the arc fastener 415, the vibration damper 1.
The working flow is as follows: the anti-vibration quartz crystal oscillator vibration-resistant process can enable the crystal oscillator main body 1 to move up and down through each damping spring 413 arranged at the opposite angles of the crystal oscillator main body 1 when the crystal oscillator main body 1 is subjected to external vibration, the arc-shaped clamping blocks 414 and the arc-shaped clamping pieces 415 are used for limiting and buffering through the buffer layers 416, so that the crystal oscillator main body 1 can perform small-amplitude planar displacement, the crystal oscillator main body 1 can be buffered and damped through the structure, the sliding sleeve 410 can slide outside the damping rod 49 when the crystal oscillator main body 1 moves up and down, the damping rod 49, the sliding sleeve 410 and the damping springs 412 can be used for damping and dissipating energy, the vibration of the damping springs 413 can be prevented from being reversely aggravated, and the quartz crystal oscillator can be subjected to damping and buffering through the operation.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. The foregoing is merely a preferred embodiment of the invention, and it should be noted that, due to the limited text expressions, there is objectively no limit to the specific structure, and that, for a person skilled in the art, modifications, adaptations or variations may be made without departing from the principles of the present invention, and the above technical features may be combined in any suitable manner; such modifications, variations and combinations, or the direct application of the inventive concepts and aspects to other applications without modification, are contemplated as falling within the scope of the present invention.
Claims (8)
1. An anti-vibration quartz crystal oscillator, which is characterized in that: including crystal oscillator main part (1), pin (2), accept board (3), buffer module (4), auxiliary module (5) and thermal-insulated module (6), its characterized in that, accept board (3) setting is in the outside of pin (2), buffer module (4) set up accept the upside of board (3), auxiliary module (5) set up the outside of pin (2), thermal-insulated module (6) set up accept the outside of board (3), buffer module (4) include fixing base (41), fixing base (41) all fix in the upper portion both sides of accepting board (3), the outside of fixing base (41) all fixedly connected with shell plate (42), the equal fixedly connected with blotter (43) of inner wall of shell plate (42), the equal sliding connection of guide hole position department of shell plate (42) has spacing (44), the equal fixedly connected with buffering insulation template (45) of the other end of spacing slide bar (44), the equal fixedly connected with spacing collar (46) of the inner wall of accepting board (3) about both sides, one set of buffering collar (47) is connected with between the fixed collar (47) and the fixed collar (47), the upper end fixedly connected with locating part (411) of damping pole (49), the outside sliding connection of damping pole (49) has sliding sleeve (410), buffer spring (412) and damping spring (413) have been cup jointed in proper order from last to lower in the outside of damping pole (49), equal fixedly connected with arc fastener (415) in both sides about the arc groove surface of crystal oscillator main part (1), a set of fixedly connected with buffer layer (416) between the outer terminal surface of arc fastener (415), a set of equal swing joint has arc fixture block (414) between the outer terminal surface of arc fastener (415), equal fixedly connected with in the outside of sliding sleeve (410) of arc fixture block (414).
2. The vibration-resistant quartz crystal oscillator according to claim 1, wherein the surface of the buffer insulating template (45) is provided with a channel, the inner wall of the channel of the buffer insulating template (45) is attached to the outer surface of the pin (2), and the outer end surface of the buffer pad (43) is fixedly connected with the outer end surface of the buffer insulating template (45).
3. The vibration-resistant quartz crystal oscillator according to claim 1, wherein the insulating sleeves (48) are sleeved on the outer sides of the pins (2), a gap is reserved between the inner wall of the limiting ring (46) and the insulating sleeves (48), and a gap is reserved between the limiting ring (46) and the pins (2).
4. The vibration-resistant quartz crystal oscillator according to claim 1, wherein the buffer springs (412) are arranged between the lower end face of the limiting piece (411) and the upper end face of the sliding sleeve (410), the buffer springs (413) are arranged between the lower end face of the sliding sleeve (410) and the upper end face of the bearing plate (3), and the inner wall of the sliding sleeve (410) is attached to the outer curved face of the damping rod (49).
5. The anti-seismic quartz crystal oscillator according to claim 1, wherein the auxiliary module (5) comprises a clamping module (51) and an inserting module (52), the clamping module (51) comprises a clamping main body (511), an inserting groove (512) is formed in the surface of the clamping main body (511), damping layers (513) are fixedly connected to two sides of the inner wall of the inserting groove (512), rail blocks (514) are fixedly connected to two sides of the inner wall of the clamping main body (511), the inserting module (52) comprises an inserting piece main body (521) and a rail groove (522), damping pads (53) are fixedly connected to the inner sides of the inserting module (52) and the clamping module (51), quick-dismantling modules (54) are mounted on two sides of the clamping main body (511), the quick-dismantling modules (54) comprise rail rods (541), one ends of the rail rods (541) are fixedly connected with the outer end faces of the clamping main body (511), pushing plates (542) are fixedly connected to the outer sides of the rail rods (541) in a sliding mode, two ends of the rail rods (542) are fixedly connected with guide holes (543) of the clamping main body (51), one ends of the two ends of the clamping main body (511) are fixedly connected with the guide holes (55), and the lower sides of the clamping module (51) and the inserting module (52) are fixedly connected with a limiting structure (56).
6. The vibration-resistant quartz crystal oscillator according to claim 5, wherein the clamping module (51) and the inserting module (52) are arranged on the outer side of the pin (2), the surface of the damping pad (53) is attached to the outer curved surface of the pin (2), the supporting structure (55) is composed of a frame body, a seat body and an adhesive layer, the seat body of the supporting structure (55) is of a hyperbolic X-shaped structure, the limiting structure (56) is composed of a rod body and a limiting baffle, and the inner curved surface of the limiting baffle of the limiting structure (56) is attached to the outer curved surface of the pin (2).
7. The anti-seismic quartz crystal oscillator according to claim 5, wherein the heat insulation module (6) comprises connecting pieces (61), the connecting pieces (61) are fixedly connected to two sides of the outer end face of the bearing plate (3), a group of the connecting pieces (61) are rotatably connected with first heat insulation plates (62) between the outer end faces, a group of the connecting pieces (61) are rotatably connected with second heat insulation plates (63) between the outer end faces, damping elastic pads (64) are fixedly connected to two sides of the inner wall of the first heat insulation plates (62) and two sides of the inner wall of the second heat insulation plates (63), heat insulation cloth (65) are arranged between the inner walls of the first heat insulation plates (62) and the second heat insulation plates (63), the lower ends of the heat insulation cloth (65) are fixedly connected with the upper end face of the connecting pieces (61), and the lower end face of the bearing plate (3) is fixedly connected with heat insulation pads (66).
8. The vibration-resistant quartz crystal oscillator according to claim 7, wherein both ends of the heat-insulating cloth (65) are arranged between the outer end surfaces of a group of damping elastic pads (64), the outer end surfaces of the heat-insulating cloth (65) are attached to the outer end surfaces of the damping elastic pads (64), the outer end surfaces of the first heat-insulating plate (62) and the second heat-insulating plate (63) are attached to the outer end surfaces of the bearing plate (3), and no gap is reserved between the first heat-insulating plate (62) and the second heat-insulating plate (63) and the bearing plate (3).
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| CN210351105U (en) * | 2019-11-15 | 2020-04-17 | 深圳市晶科鑫实业有限公司 | Vehicle-mounted quartz crystal oscillator anti-seismic structure |
| CN213426110U (en) * | 2020-10-15 | 2021-06-11 | 唐山国芯晶源电子有限公司 | Crystal oscillator capable of reducing external impact force |
| CN214756275U (en) * | 2020-12-30 | 2021-11-16 | 常州运达新科技研发有限公司 | Combined vibration-stable piezoelectric quartz |
| CN114785308A (en) * | 2022-04-10 | 2022-07-22 | 合肥同晶电子有限公司 | Quartz crystal packaging structure |
| CN217363043U (en) * | 2022-05-24 | 2022-09-02 | 深圳市晶科鑫实业有限公司 | Constant temperature crystal oscillator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7451959B2 (en) * | 2019-11-22 | 2024-03-19 | セイコーエプソン株式会社 | Vibration devices, electronic equipment and moving objects |
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| KR101452221B1 (en) * | 2013-08-09 | 2014-10-23 | 주식회사 제트에이치티 | Vibration Absorbing Structure for Crystal Oscillator |
| JP2015169614A (en) * | 2014-03-10 | 2015-09-28 | 日本電波工業株式会社 | External force detection apparatus and inclination adjustment method for quartz piece |
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