CN116793132A - Intelligent waste heat recycling system - Google Patents
Intelligent waste heat recycling system Download PDFInfo
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- CN116793132A CN116793132A CN202310536098.1A CN202310536098A CN116793132A CN 116793132 A CN116793132 A CN 116793132A CN 202310536098 A CN202310536098 A CN 202310536098A CN 116793132 A CN116793132 A CN 116793132A
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- 239000002918 waste heat Substances 0.000 title claims abstract description 53
- 238000004064 recycling Methods 0.000 title claims abstract description 11
- 230000008859 change Effects 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 238000005057 refrigeration Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 12
- 230000005678 Seebeck effect Effects 0.000 claims description 10
- 238000011084 recovery Methods 0.000 claims description 10
- 230000005679 Peltier effect Effects 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 5
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- 238000007789 sealing Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 230000005619 thermoelectricity Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 28
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Abstract
The invention relates to the technical field of thermoelectricity, in particular to an intelligent waste heat recycling system which comprises: the temperature control part can sense the temperature change to be measured in the external environment and control the circuit, and the thermoelectric conversion part can generate cold when the external environment temperature is higher than the set temperature module and can utilize waste heat when the external environment temperature is lower than the set temperature module. The system is universal and flexible, and can be arranged on the existing server which needs to realize high-precision temperature control, so that the power consumption is reduced, and the stability is improved.
Description
Technical Field
The invention relates to the technical field of thermoelectricity, in particular to an intelligent waste heat recycling system.
Background
Electronic equipment commonly used in daily life brings great convenience to people, so that one of the most popular research subjects of people at present is the improvement of the performance of the electronic equipment. Cooling of electronic devices is very important and power loss due to high temperatures is also becoming more important. With the rapid development of economic technology, the total consumption of energy sources is increasing. The waste heat is used as secondary energy generated in the production process of primary energy, the resources are rich, the forms are various, and the proportion of the waste heat to the total fuel consumption is large. Recently, it is considered as a conventional energy source having the same development and utilization value as coal, oil, natural gas and water power. The heat transmission process of the electronic equipment comprises 3 modes of heat conduction, heat convection and heat radiation, wherein the heat conduction from the heating element to the radiator and the heat convection from the radiator to the surrounding environment are the main heat transmission modes. Therefore, the heat dissipation design of electronic devices mainly starts from the two aspects, and common heat dissipation modes can be classified into active heat dissipation, passive heat dissipation, thermoelectric cooling and the like according to the heat dissipation mode of the electronic devices. The passive heat dissipation mainly comprises common natural convection, indirect contact gas-liquid, solid-liquid phase change cooling, direct contact immersed liquid cooling, phase change cooling and the like; the active heat dissipation mainly comprises the common modes of forced air cooling heat dissipation, forced liquid cooling and the like. The conventional electronic device heat dissipation device generally adopts air cooling or water cooling, wherein an air cooling fin radiator is divided into two parts, and the part directly contacted with a heat source is called a fin radiator and is responsible for leading out the heat emitted by the heat source, a fan is used for forced convection cooling of the radiator, and the cooling effect of the air cooling fin radiator is closely related to the structure of the radiator. Another factor affecting the effect of air cooling is the wind speed, the greater the wind speed, the smaller the thermal resistance of the radiator, but the greater the flow resistance, the more limited the heat dissipation capacity, the less significant the wind speed increases beyond a certain value and the temperature cannot be lowered below room temperature. The water cooling device is generally composed of a radiator, a water pipe and a water pump, so that the advantage of water cooling can be fully exerted, and more heat is taken away. Meanwhile, the water cooling system has no fan, so that the noise is low. However, the water cooling system has a relatively high price, water is easy to generate scale and deteriorate in a closed state, water leakage, water interruption and other conditions are completely avoided in the use process, and the system has a complex structure, more parts and more volume and weight, and is obviously larger than air cooling heat dissipation, so that the application environment of the system is limited to a certain extent.
Thermoelectric technology is an emerging technology for directly converting heat energy and electric energy, and utilizes the peltier effect and the seebeck effect of semiconductor materials, namely, when current flows through interfaces of two different materials, heat is absorbed or released from the outside. In recent years, along with the development of semiconductor material manufacturing technology, thermoelectric cooling systems have been rapidly developed. The refrigeration end of thermoelectric cooling can control the temperature of a heat source to be lower than the ambient temperature, which is not possible by conventional air cooling, natural cooling or even liquid cooling. Thermoelectric refrigeration utilizes electrical energy to achieve efficient and rapid refrigeration over a small range. The technology has the advantages of no vibration, no noise, safety, reliability and the like, and has wide application scenes in the aspects of waste heat power generation, refrigerator refrigeration and the like. The seebeck effect of thermoelectric technology is an effect in which a current is generated in a circuit when a temperature difference is generated across a thermoelectric sheet. Thermoelectric generators can convert low-grade heat into electrical energy. The thermoelectric generator generates electricity by using the temperature difference at two ends, and the larger the temperature difference is, the higher the electricity generation performance is. The amount of power generated by the thermoelectric generator may provide power support for electronic devices requiring power ranging from microwatts (μw) to watts (W). The seebeck effect of the thermoelectric technology can effectively utilize a large amount of waste heat, waste heat and the like in life and industry to generate power, so that energy is secondarily utilized, and the energy utilization rate is further improved, for example, the seebeck effect is applied to waste heat recovery of human skin, waste heat recovery of a combustion chamber and the like.
At present, researches are usually carried out only on the heat source aiming at the Peltier effect of the thermoelectric technology, waste heat of the system is directly emitted in a dissipation mode or only on the Seebeck effect of the thermoelectric technology is carried out for waste heat recovery, however, the Seebeck effect of the thermoelectric technology can reduce the temperature of the heat source, but the total heat dissipation capacity is limited by the heat dissipation capacity of a cold end, and the refrigeration effect is far less than that of the Peltier effect of the thermoelectric technology. Therefore, there is no study on switching between the two effects and high-precision temperature control using the mutual switching between the two effects.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide an intelligent waste heat recycling system which is connected with a thermoelectric power generation low-temperature loop for waste heat recycling when the temperature of a heat source is low and is connected with a thermoelectric refrigeration high-temperature loop for refrigeration of the heat source when the temperature is high. When the temperature of the heat source is lower, the low-temperature loop is communicated, the thermoelectric sheet generates the Seebeck effect, at the moment, the thermoelectric surface attached to the waste heat source is used as the hot end of the thermoelectric generator, the air side is used as the cold end, the fan on the air side creates a forced convection environment to strengthen heat exchange, at the moment, waste heat of the system can be recovered, and the heat energy is converted into electric energy for other power consumption devices to operate. When the temperature of the waste heat source gradually rises and exceeds the temperature set by the temperature control module, the temperature control switch of the low-temperature loop is turned off, the temperature control switch of the high-temperature loop is turned on, the thermoelectric sheet generates a Peltier effect under the drive of the direct-current power supply, the thermoelectric surface attached to one side of the waste heat source is used as a cold end, the air side is used as a hot end, and the cold end is cooled to a temperature much lower than the air side under the air forced convection environment, so that the heat source is cooled. Conversely, when the temperature of the heat source gradually decreases, the system is switched from a high-temperature loop to a low-temperature loop, and the thermoelectric chips convert refrigeration of the heat source into waste heat of the heat source to generate electricity.
The technical scheme of the invention is realized as follows: the system for realizing intelligent recovery of waste heat and refrigeration of a heat source comprises a thermoelectric module and a temperature intelligent identification control device, wherein the system comprises the temperature intelligent identification control device which can sense the temperature change to be detected in the external environment and control a circuit; when the external environment temperature is higher than the set temperature, the temperature intelligent identification control device generates cold energy, and when the external environment temperature is lower than the set temperature, the temperature intelligent identification control device starts the thermoelectric module capable of utilizing waste heat to perform thermoelectric conversion.
The thermoelectric module consists of thermoelectric sheets, a flat radiator and a fan, wherein heat conducting media are filled between the thermoelectric sheets and the flat radiator, the thermoelectric module is close to a waste heat source, the heat conducting media are filled between the thermoelectric module and the waste heat source, and a heat insulation sealing ring is arranged outside the thermoelectric sheets.
The refrigerating end of the thermoelectric sheet is close to the waste heat source, the other end of the thermoelectric sheet is close to the flat plate radiator, and the flat plate radiator adopts a fan to perform forced air convection heat dissipation.
The intelligent temperature identification control device comprises a first temperature control switch and a second temperature control switch, wherein the first temperature control switch and the second temperature control switch are both provided with temperature measuring probes, and the accuracy of the temperature measuring probes is greater than +/-2 ℃. The temperature measuring probe is attached to the surface of the waste heat source. The temperature control switch of the high-temperature loop and the temperature control switch of the low-temperature loop are both provided with temperature probes, and the temperature probes are attached to the surface of the heat source.
The intelligent temperature identification control device comprises a parallel circuit formed by a first temperature control switch and a second temperature control switch, wherein the first temperature control switch is closed when being set to be lower than a set temperature T1, the second temperature control switch is closed when being set to be higher than the set temperature T1, the high-temperature loop is connected when the waste heat source temperature T0 is higher than the set temperature T1, the high-temperature loop temperature control switch is closed, namely the second temperature control switch is closed, at the moment, the thermoelectric sheet can generate the Seebeck effect, the waste heat is utilized to generate electricity, the low-temperature loop is connected when the waste heat source temperature T0 is lower than the set temperature T1, the low-temperature loop temperature control switch is closed, namely the first temperature control switch is closed, and at the moment, the thermoelectric sheet can generate the Peltier effect to perform refrigeration under the action of a direct current power supply.
The invention has the following advantages:
1. the invention can control the temperature of the heat source below the ambient temperature, which is not possible by conventional air cooling, natural cooling or even liquid cooling.
2. The invention can not only realize the accurate temperature control of the heat source, but also can recycle the waste heat, thereby realizing the secondary utilization of energy.
3. The whole set of device has small volume, light weight and sustainability, can realize heat energy recovery, and can also improve the service life of electronic equipment.
4. The thermoelectric module is convenient to load, only needs to attach the thermoelectric block on the surface of the heat source, has long service life and simple structure, is convenient to maintain, and can realize high-precision temperature control through temperature detection and control means.
5. The thermal inertia of the semiconductor refrigerating plate is very small, and the refrigerating time is very fast.
The invention fills the problem of single research of Seebeck thermal power generation effect and Peltier effect aiming at thermoelectric sheets in the current research. Under the condition of the same thermoelectric sheet, the heat source can be refrigerated by utilizing the Peltier effect of the thermoelectric technology, and the waste heat source can be subjected to waste heat recovery aiming at the Seebeck effect of the thermoelectric technology. The thermoelectric technology is combined with the temperature sensor control device, so that heat dissipation and waste heat recovery of a heat source can be realized, and high-precision temperature control can be realized.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings that are required to be used in the description of the present invention will be briefly described.
FIG. 1 is a schematic diagram of the system of the present invention.
Fig. 2 is a schematic view of a thermoelectric module according to the present invention.
In the figure: the device comprises a waste heat source 1, a thermoelectric module 2, a first temperature control switch 3, a second temperature control switch 4, a power supply 5, a temperature measuring probe 6, a fan 7, a flat plate radiator 8 and thermoelectric chips 9.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The drawings illustrate specific embodiments of the invention.
Referring to fig. 1, the intelligent waste heat recycling system of the invention comprises a thermoelectric module 2, a first temperature control switch 3, a second temperature control switch 4, a temperature measuring probe 6 carried by the first temperature control switch and the second temperature control switch, and a direct current power supply 5. The positive electrode of the direct current power supply 5 is connected with the thermoelectric chip 9 and the low-temperature loop temperature control switch, namely the first temperature control switch 3, the low-temperature loop temperature control switch is connected with an electric appliance, the other end of the thermoelectric chip 9 is connected with the electric appliance and the high-temperature loop temperature control switch, namely the second temperature control switch 4, and then connected with the negative electrode of the direct current power supply. The first temperature control switch 3 and the second temperature control switch 4 are both provided with a temperature measuring probe 6, and the temperature measuring probe 6 is attached to the surface of the waste heat source 1. The temperature control switch of the high-temperature loop and the temperature control switch of the low-temperature loop are the same in set temperature, and different requirements of users can be met, because the low-temperature loop and the high-temperature loop are simultaneously opened or are both in open circuit in a certain time period if the set temperatures of the temperature control switch of the high-temperature loop and the temperature control switch of the low-temperature loop are different.
Referring to fig. 2, 7 is a fan, 8 is a flat plate heat sink, and 9 is a thermoelectric sheet. In order to reduce contact thermal resistance and convective heat transfer thermal resistance, heat conducting media are filled between the thermoelectric sheet 9 and the flat plate radiator 8 and between the thermoelectric sheet 9 and the waste heat source 1, and a heat insulation sealing ring is arranged outside the thermoelectric sheet 9. The refrigerating end of the thermoelectric sheet 9 is close to a heat source, and air cooling is adopted in consideration of refrigeration, however, the heat exchange coefficient of natural convection is very low and is far smaller than the heat exchange coefficient of forced convection at the same temperature, so that the heat exchange coefficient is increased by adopting the fan 7. Meanwhile, in order to increase the contact area between the thermoelectric sheet and air, a plate-type radiator 8 is attached to the other end of the thermoelectric sheet to strengthen heat dissipation.
Claims (7)
1. An intelligent waste heat recycling system is characterized by comprising a temperature intelligent identification control device which can sense the temperature change to be detected in the external environment and control a circuit; when the external environment temperature is higher than the set temperature, the temperature intelligent identification control device generates cold energy, and when the external environment temperature is lower than the set temperature, the temperature intelligent identification control device starts the thermoelectric module (2) capable of utilizing waste heat to perform thermoelectric conversion.
2. The intelligent waste heat recycling system according to claim 1, wherein the thermoelectric module (2) is composed of a thermoelectric sheet (9), a flat plate radiator (8) and a fan (7), a heat conducting medium is filled between the thermoelectric sheet (9) and the flat plate radiator (8), the thermoelectric module (2) is close to the waste heat source (1), and the heat conducting medium is filled between the thermoelectric module (2) and the waste heat source (1).
3. The intelligent waste heat recovery and utilization system according to claim 2, wherein a heat insulation sealing ring is arranged outside the thermoelectric sheet (9).
4. The intelligent waste heat recycling system according to claim 2, wherein the temperature intelligent identification control device comprises a first temperature control switch (3) and a second temperature control switch (4), the first temperature control switch (3) and the second temperature control switch (4) are provided with temperature measuring probes (6), and the temperature measuring probes (6) are attached to the surface of the waste heat source (1).
5. The intelligent waste heat recycling system according to claim 4, wherein the temperature intelligent recognition control device comprises a parallel circuit formed by the first temperature control switch (3) and the second temperature control switch (4), the first temperature control switch (3) is closed when being lower than a set temperature T1, the second temperature control switch (4) is closed when being higher than the set temperature T1, the high temperature loop is connected when the temperature T0 of the waste heat source (1) is higher than the set temperature T1, the second temperature control switch (4) is closed, the thermoelectric sheet (9) generates the Seebeck effect at the moment, the waste heat is utilized to generate electricity, the low temperature loop is connected when the temperature T0 of the waste heat source (1) is lower than the set temperature T1, the first temperature control switch (3) is closed, and the thermoelectric sheet (9) generates the Peltier effect to perform refrigeration under the action of the direct current power supply (5).
6. The intelligent waste heat recovery and utilization system according to claim 5, wherein the refrigerating end of the thermoelectric sheet (9) is close to the waste heat source (1), the other end of the thermoelectric sheet is close to the flat radiator (8), and the flat radiator (8) adopts a fan (7) to perform forced air convection heat dissipation.
7. The intelligent waste heat recovery and utilization system according to claim 4, wherein the accuracy of the temperature probe (6) is greater than ±2 ℃.
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CN202310536098.1A CN116793132A (en) | 2023-05-12 | 2023-05-12 | Intelligent waste heat recycling system |
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CN202310536098.1A CN116793132A (en) | 2023-05-12 | 2023-05-12 | Intelligent waste heat recycling system |
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