CN116723671A - Liquid cooling plate of driving motor controller - Google Patents
Liquid cooling plate of driving motor controller Download PDFInfo
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- CN116723671A CN116723671A CN202310566580.XA CN202310566580A CN116723671A CN 116723671 A CN116723671 A CN 116723671A CN 202310566580 A CN202310566580 A CN 202310566580A CN 116723671 A CN116723671 A CN 116723671A
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- 238000001816 cooling Methods 0.000 title claims abstract description 151
- 239000007788 liquid Substances 0.000 title claims abstract description 150
- 230000017525 heat dissipation Effects 0.000 claims abstract description 140
- 239000000758 substrate Substances 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 17
- 238000012546 transfer Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 9
- 238000011161 development Methods 0.000 description 8
- 230000008646 thermal stress Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 238000012938 design process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000012356 Product development Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A drive motor controller liquid cooling plate comprising: the controller comprises a shell of the controller, wherein an IGBT module is arranged on the inner side of the shell of the controller; the base plate is arranged between the IGBT module and the controller shell, the base plate and the controller shell are sealed to form a liquid cooling plate runner, and the controller shell is provided with a runner inlet and a runner outlet which are communicated with the liquid cooling plate runner; the heat dissipation column is arranged on the lower end face of the substrate and corresponds to the IGBT module on the upper end face of the substrate, and the heat dissipation column is positioned in the liquid cooling plate flow channel; the liquid cooling plate flow channel comprises two flow channel regions, wherein a first flow channel region and a second flow channel region are respectively arranged from a flow channel inlet to a flow channel outlet, and each flow channel region corresponds to each IGBT half-bridge of the IGBT module; the parameters of the liquid cooling plate flow channel meet the relation formula:
Description
Technical Field
The application relates to the technical field of driving motor controllers, in particular to a liquid cooling plate of a driving motor controller.
Background
The driving motor controller liquid cooling plate is equipment for radiating heat of a driving motor controller in a new energy electric automobile. In the electric automobile industry, because the driving motor controller needs to continuously perform power conversion, larger heat can be generated, and if heat cannot be dissipated in time, the controller can be damaged or the service life of the controller can be shortened. The existing driving motor controller liquid cooling plate has the problems that cooling liquid enters a liquid cooling plate runner from a runner inlet of the motor controller liquid cooling plate, and flows out from a runner outlet after corresponding IGBT (Insulated Gate Bipolar Transistor, namely an insulated gate bipolar transistor) half-bridge is cooled by the liquid cooling plate runner; but the cooling liquid continuously absorbs the heat of the IGBT half-bridge in the flowing process of the cooling liquid in the liquid cooling plate flow channel, and the temperature of the cooling liquid is continuously increased. Therefore, the temperature of the cooling liquid close to the inlet area of the flow channel is low, the heat dissipation effect of the corresponding IGBT half-bridge is good, and the temperature of the IGBT half-bridge is low; the temperature of the cooling liquid near the outlet area of the flow channel is high, the heat dissipation effect of the corresponding IGBT half-bridge is poor, and the temperature rise of the IGBT half-bridge is easy to exceed the standard, so that the service life of the IGBT module is shortened, and even the IGBT module is invalid or burnt out; meanwhile, the temperature distribution of the liquid cooling plate of the driving motor controller is uneven, the temperature difference is large, the IGBT module can generate larger periodic thermal stress in the operation process of the motor controller, and the safe and stable operation of the motor controller is affected when serious.
The liquid cooling plate flow channel structure of the current controller liquid cooling plate is designed by experience, repeated tests and die change are needed, the test period is long, the design efficiency is low, the product development difficulty is high, the development cost is high, and the development period is long. The structural design of the liquid cooling plate flow channel is unreasonable, uneven cooling of the liquid cooling plate is easy to occur, and the local temperature rise of the IGBT module exceeds the standard, so that the power device is invalid or burnt; meanwhile, the temperature distribution of the radiating substrate is uneven, the IGBT module can generate larger periodic thermal stress in the operation process, and the normal operation of the electronic device is affected when serious.
Disclosure of Invention
Aiming at the defects existing in the prior art, the application provides the liquid cooling plate of the driving motor controller, which solves the problems of uneven temperature distribution, large temperature difference, large periodic thermal stress generated in the operation process, serious influence on the safety of electronic devices, repeated test and die change in the design process of a liquid cooling plate flow channel structure, long test period, low design efficiency, large product development difficulty, high development cost and long development period.
The purpose of the application is realized in the following way:
a drive motor controller liquid cooling plate comprising:
the controller comprises a shell of the controller, wherein an IGBT module is arranged on the inner side of the shell of the controller;
the base plate is arranged between the IGBT module and the controller shell, the base plate and the controller shell are sealed to form a liquid cooling plate runner, and the controller shell is provided with a runner inlet and a runner outlet which are communicated with the liquid cooling plate runner;
the heat dissipation column is arranged on the lower end face of the substrate and corresponds to the IGBT module on the upper end face of the substrate, and the heat dissipation column is positioned in the liquid cooling plate flow channel;
the liquid cooling plate flow channel comprises two flow channel regions, wherein a first flow channel region and a second flow channel region are respectively arranged from a flow channel inlet to a flow channel outlet, and each flow channel region corresponds to each IGBT half-bridge of the IGBT module;
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of each row of the heat dissipation columns of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of each row of the heat dissipation columns of the second flow passage area is n 2 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channel meet the relation formula:
further, the liquid cooling plate channel comprises three channel areas, namely a first channel area, a second channel area and a third channel area from a channel inlet to a channel outlet; the IGBT module comprises three IGBT half-bridges, namely a first IGBT half-bridge, a second IGBT half-bridge and a third IGBT half-bridge, wherein the first flow channel region corresponds to the first IGBT half-bridge, the second flow channel region corresponds to the second IGBT half-bridge, and the third flow channel region corresponds to the third IGBT half-bridge;
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of the radiating columns in each row of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of the radiating columns in each row of the second flow passage area is n 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The number of the radiating columns in each row of the third flow passage area is n 3 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channel meet the relation formula:
and/or the number of the groups of groups,
further, the length of the liquid cooling plate flow channel is L, (b×n) 0 -10)mm≤L≤(b*n 0 +10) mm; and/or the number of the groups of groups,
the width of the liquid cooling plate flow channel is B, (l-10) mm is less than or equal to B and less than or equal to (l+10) mm;
wherein n is 0 The number of IGBT half-bridges of the IGBT module is that b is the width of the IGBT half-bridges, and l is the length of the IGBT half-bridges.
Further, the heat dissipation columns are cylindrical, and the heat dissipation columns are arranged in a fork row mode.
Further, the height h of the heat dissipation column is more than or equal to 3mm and less than or equal to 10mm.
Further, the heat dissipation columns are arranged at intervals along the length direction of the liquid cooling plate flow channel, the number of rows of the heat dissipation columns is m, the heat dissipation columns of each row are arranged at intervals along the width direction of the liquid cooling plate flow channel,
the diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; each row of heat dissipation columns of the first flow passage area is n in number 1 The spacing between two adjacent heat dissipation columns in the same row is s 1 ，And s is not less than 1mm 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the number of each row of the heat dissipation columns of the second flow passage area is n 2 The spacing between two adjacent heat dissipation columns in the same row is s 2 ，And s is not less than 1mm 2 -d 2 ≤5mm；
The diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; each row of heat dissipation columns of the third flow passage area is n 3 The spacing between two adjacent heat dissipation columns in the same row is s 3 ，And s is not less than 1mm 3 -d 3 ≤5mm。
Further, the total number of rows of the heat dissipation columns arranged at intervals along the length direction of the liquid cooling plate flow channel is m, m is an integer multiple of 3, the distance between two adjacent rows of heat dissipation columns is c,and is less than or equal to 1mm
c-d 1 ≤5mm、1mm≤c-d 2 ≤5mm、1mm≤c-d 3 Less than or equal to 5mm, wherein d 1 Diameter d of the heat-dissipating column in the first flow channel region 2 Diameter of the second flow path region heat dissipation column d 3 Is the diameter of the heat dissipation column in the third flow passage area.
Further, a groove is formed in the inner side of the shell of the controller, a runner inlet and a runner outlet are respectively formed in two sides of the bottom of the groove, and the shell of the controller is sealed with four sides of the substrate through sealing rings, so that the groove and the substrate are matched to form a liquid cooling plate runner.
Further, the base plate is made of copper or silicon carbide aluminum materials, and the heat dissipation column is made of aluminum or aluminum alloy or copper materials.
Further, the shell of the controller is made of aluminum or aluminum alloy materials.
By applying the technical scheme of the application, for the liquid cooling plate of the driving motor controller, the relation between the specific parameter size and the specific parameter number of the heat dissipation columns in the liquid cooling plate flow channel can be conveniently obtained through the calculation formula related to the parameters and the heat dissipation columns in the liquid cooling plate flow channel, and the calculation formula is obtained according to the external forced convection heat transfer rule, so that the liquid cooling plate of the driving motor controller can select and calculate the specific size and the specific number of the heat dissipation columns in the flow channel on the basis of ensuring the temperature uniformity and the heat dissipation performance, the design process of the liquid cooling plate flow channel structure of the driving motor controller is simplified, and the design period and the die change period of the liquid cooling plate flow channel of the driving motor controller are reduced to a certain extent. Therefore, by the technical scheme provided by the application, the technical problems of long design and die changing period of a design method of the liquid cooling plate flow channel structure of the driving motor controller in the prior art can be solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
FIG. 1 is a schematic diagram of a liquid cooling structure of a driving motor controller;
FIG. 2 is a schematic view of the outside structure of the controller housing;
FIG. 3 is a cross-sectional view of a drive motor controller liquid cooling plate;
FIG. 4 is a side view of a drive motor controller liquid cooling plate;
fig. 5 is a schematic structural diagram of an IGBT module on a substrate;
fig. 6 is a schematic structural diagram of a heat dissipation post on a substrate.
Reference numerals: the IGBT module 1, the first IGBT half-bridge 11, the second IGBT half-bridge 12, the third IGBT half-bridge 13, the controller housing 2, the substrate 3, the liquid cooling plate runner 4, the first runner area 41, the second runner area 42, the second runner area 43, the runner inlet 44, the runner outlet 45, the heat dissipation post 5 and the sealing ring 6.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1 to 6, a driving motor controller liquid cooling plate is characterized by comprising:
a shell 2 of the controller, wherein an IGBT module 1 is arranged on the inner side of the shell 2 of the controller;
the base plate 3 is arranged between the IGBT module 1 and the controller shell 2, the base plate 3 and the controller shell 2 are sealed to form a liquid cooling plate runner 4, and the controller shell 2 is provided with a runner inlet 44 and a runner outlet 45 which are communicated with the liquid cooling plate runner 4; the controller is characterized in that a groove is formed in the inner side of the shell 2 of the controller, a flow channel inlet 44 and a flow channel outlet 45 are respectively formed in two sides of the bottom of the groove, the shell 2 of the controller is sealed with four sides of the base plate 3 through sealing rings 6, the groove is matched with the base plate 3 to form a liquid cooling plate flow channel 4, a sealing groove matched with the sealing rings 6 is formed in the shell 2 of the controller, and the sealing rings 6 are located in the sealing groove to seal gaps between the shell 2 of the controller and the base plate 3.
The heat dissipation column 5 is arranged on the lower end face of the substrate 3 and corresponds to the IGBT module 1 on the upper end face of the substrate 3, and the heat dissipation column 5 is positioned in the liquid cooling plate flow channel 4; the heat dissipation column 5 is in small clearance fit with the bottom of the groove of the controller shell 2.
The liquid cooling plate flow channel 4 comprises two flow channel regions, namely a first flow channel region 41 and a second flow channel region 42 from a flow channel inlet 44 to a flow channel outlet 45, and each flow channel region corresponds to each IGBT half bridge of the IGBT module 1;
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of each row of the heat dissipation columns of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of each row of the heat dissipation columns of the second flow passage area is n 2 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channel meet the relation formula:
the liquid cooling plate flow channel 4 of the present embodiment includes three flow channel regions, namely, a first flow channel region 41, a second flow channel region 42 and a third flow channel region 43 from a flow channel inlet 44 to a flow channel outlet 45; the IGBT module 1 includes three IGBT half-bridges, which are a first IGBT half-bridge 11, a second IGBT half-bridge 12, and a third IGBT half-bridge 13, where the first flow channel region 41 corresponds to the first IGBT half-bridge 11, the second flow channel region 42 corresponds to the second IGBT half-bridge 12, and the third flow channel region 43 corresponds to the third IGBT half-bridge 13;
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of the radiating columns in each row of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of the radiating columns in each row of the second flow passage area is n 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The number of the radiating columns in each row of the third flow passage area is n 3 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channel meet the relation formula:
and/or the number of the groups of groups,
from the liquid channel inlet 44 to the outlet 45, the cooling liquid continuously absorbs the heat loss of the IGBT module 1 in the flowing process, the temperature of the cooling liquid continuously rises, and the heat dissipation capacity of the cooling liquid gradually weakens; the liquid cooling plate flow channel 4 is divided into a first flow channel region 41, a second flow channel region 42 and a third flow channel region 43, different heat dissipation column structural parameters and quantity are designed in different flow channel regions according to the temperature change rule of the cooling liquid, so that the heat dissipation uniformity of the liquid cooling plate of the driving motor controller can be ensured, and the power device failure or damage caused by the exceeding of the temperature rise of the third IGBT half-bridge 13 is prevented.
It should be noted that, the liquid cooling plate runner 4 in this embodiment is a cooling liquid runner, and the main function of the liquid cooling plate is to dissipate heat for the IGBT module, and through the cooling liquid flowing through the liquid cooling plate runner 4, the heat loss of the IGBT is taken away, the temperature rise of the IGBT module is reduced, the IGBT module is made to operate in a safe temperature range, and the reliability of the operation of the controller is ensured.
By adopting the liquid cooling plate of the driving motor controller, through the relation and the rule of forced convection heat transfer outside the fluid horizontal tube bundle in the heat dissipation process, the relation among a plurality of specific parameter sizes of the liquid cooling plate flow channel structure can be obtained, and the relation is based on the influence rule of the diameter of the heat dissipation columns, the flow channel spacing among the heat dissipation columns and the quantity of the heat dissipation columns on the heat dissipation performance and the temperature distribution of the liquid cooling plate of the driving motor controller, so that the temperature uniformity of the liquid cooling plate of the driving motor controller is improved, the risk of exceeding the standard of the local temperature rise of the IGBT module is reduced, the periodic thermal stress of the IGBT module is reduced, and the reliability of stable operation of the controller is improved.
By adopting the driving motor controller liquid cooling plate provided by the embodiment, the relation between the specific parameter sizes of the cooling column of the liquid cooling plate flow channel structure can be conveniently obtained through the calculation formula of the parameters of the liquid cooling plate flow channel structure, so that the design process of the controller liquid cooling plate flow channel structure is simplified, and the design period and the test period of the controller liquid cooling plate flow channel structure are greatly reduced. Therefore, through the driving motor controller liquid cooling plate provided by the embodiment, the technical problems of long design period and test period of the driving motor controller liquid cooling plate design method in the prior art can be well solved.
Specifically, the length of the liquid cooling plate flow channel is L, (b×n) 0 -10)mm≤L≤(b*n 0 +10) mm; and/or the width of the liquid cooling plate flow channel is B, (l-10) mm is less than or equal to B and less than or equal to (l+10) mm;
wherein n is 0 The number of IGBT half-bridges of the IGBT module is that b is the width of the IGBT half-bridges, and l is the length of the IGBT half-bridges. The number of IGBT half-bridges of the IGBT module 1 of the embodiment is n 0 =3, which is the number of IGBT half-bridges commonly used for driving motor controller IGBT modules in the electric automobile industry.
The length and the width of the liquid cooling plate flow channel 4 respectively satisfy the two relational expressions, so that the defect of insufficient heat dissipation capability or poor substrate temperature uniformity caused by too small length and width of the liquid cooling plate flow channel 4 can be prevented, and the increase of material cost and volume caused by too large size of the liquid cooling plate structure can be prevented.
The height h of the heat dissipation column is more than or equal to 3mm and less than or equal to 10mm, so that a good heat dissipation effect can be obtained. The heat dissipation columns are cylindrical, and the arrangement mode of the heat dissipation columns adopts fork rows, so that the turbulence disturbance intensity of the cooling liquid in the liquid cooling plate flow channel can be improved, the forced convection heat transfer performance is further enhanced, the heat dissipation capacity of the liquid cooling plate of the driving motor controller is improved, and the temperature rise of the IGBT module is effectively reduced. The total number of rows of the heat dissipation columns arranged at intervals along the length direction of the liquid cooling plate flow channel is m, the heat dissipation columns of each row are arranged at intervals along the width direction of the liquid cooling plate flow channel,
the diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; each row of heat dissipation columns of the first flow passage area is n in number 1 (n 1 Integer) between two adjacent heat dissipation columns in the same rowThe spacing is s 1 ，And s is not less than 1mm 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the number of each row of the heat dissipation columns of the second flow passage area is n 2 (n 2 Integer) and the spacing between two adjacent heat dissipation columns in the same row is s 2 ，And s is not less than 1mm 2 -d 2 ≤5mm；
The diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; each row of heat dissipation columns of the third flow passage area is n 3 (n 3 Integer) and the spacing between two adjacent heat dissipation columns in the same row is s 3 ，And s is not less than 1mm 3 -d 3 ≤5mm。
According to the process feasibility, when the diameter of the heat dissipation post 5 is smaller than 1mm, the processing difficulty of the substrate heat dissipation post is obviously increased; when the diameter of the heat dissipation column 5 is larger than 5mm, a larger vortex area is generated behind the heat dissipation column 5, so that the convection heat transfer performance of the liquid cooling plate is obviously reduced. The space between two adjacent heat dissipation columns 5 in the first region 41 of the flow channel, the space between two adjacent heat dissipation columns 5 in the second region 42 of the flow channel and the space between two adjacent heat dissipation columns 5 in the third region 43 of the flow channel respectively meet the three relational expressions, so that the flow channel 4 of the liquid cooling plate can meet the requirement of flow resistance loss, and the forced convection heat transfer performance of the liquid cooling plate of the driving motor controller is ensured; when the size of the flow channel between two adjacent heat dissipation columns is smaller than 1mm, the flow resistance loss in the liquid cooling plate flow channel can be obviously increased due to the fact that the flow channel is too narrow and the flow channel sectional area is too small, so that the flow speed is too high; when the size of the flow channel between two adjacent heat dissipation columns is larger than 5mm, the flow velocity is too small due to the too large sectional area of the fluid flow channel, so that the forced convection heat transfer performance in the liquid cooling plate flow channel is obviously reduced.
The heat dissipation columns of the embodiment are arranged at intervals along the length direction of the liquid cooling plate flow channel, the row number of the heat dissipation columns is m, the m is an integer multiple of 3, the interval between two adjacent rows of heat dissipation columns is c,and c-d is not less than 1mm 1 ≤5mm、1mm≤c-d 2 ≤5mm、1mm≤c-d 3 Less than or equal to 5mm, wherein d 1 Diameter d of the heat-dissipating column in the first flow channel region 2 Diameter of the second flow path region heat dissipation column d 3 Is the diameter of the heat dissipation column in the third flow passage area. The space between two adjacent rows of heat dissipation columns 5 in the first flow channel region 41, the space between two adjacent rows of heat dissipation columns 5 in the second flow channel region 42 and the space between two adjacent rows of heat dissipation columns 5 in the third flow channel region 43 respectively satisfy the three relational expressions, so that the liquid cooling plate flow channel 4 can satisfy the requirement of flow resistance loss, and the forced convection heat transfer total area of the heat dissipation columns 5 in the liquid cooling plate flow channel 4 is ensured, so as to satisfy the heat dissipation capacity requirement of the liquid cooling plate.
The base plate is made of copper or silicon carbide aluminum and the like, and the heat dissipation column is made of aluminum or aluminum alloy or copper and the like. The shell of the controller is made of aluminum or aluminum alloy and other materials. The base plate 3, the heat dissipation column 5 and the controller shell 2 are made of high heat conduction materials, so that the heat conduction effect can be conveniently improved, the heat transfer capacity of the IGBT module 1 to the base plate 3 and the heat dissipation column 5 is improved, the heat dissipation performance of a liquid cooling plate of the driving motor controller is improved, the temperature rise of the IGBT module 1 is effectively reduced, and the temperature rise reliability of the driving motor controller is improved. The substrate 3 and the controller housing 2 are connected in a conventional manner such as bolts, welding and the like, and the substrate 3 and the heat dissipation column 5 are connected in a conventional manner such as welding, integrated forming and the like.
The IGBT module is arranged on the upper end face of the substrate 3 of the liquid cooling plate of the driving motor controller and consists of three IGBT half-bridges, and the IGBT is a main heating source. The difference of the highest temperature rise of the adjacent IGBT half-bridges in the embodiment is less than or equal to 4 ℃.
The heat productivity phi of a single IGBT half-bridge, an IGBT module is formed by n 0 The IGBT half-bridge is composed of q m For the mass flow rate of the cooling liquid, c is the specific heat capacity of the cooling liquid, the cooling liquid flows through the liquid cooling plate flow channel to absorb the heat loss of the IGBT, the temperature of the cooling liquid gradually rises, and the temperature difference Deltat of the cooling liquid between the flow channel inlet and the flow channel outlet is as follows:
the contact area between the wall surface of the liquid cooling plate flow channel and the cooling liquid is A, the convection heat transfer coefficient h' between the wall surface of the liquid cooling plate flow channel and the cooling liquid is t, and the average temperature of the wall surface of the liquid cooling plate flow channel is t Board board The average temperature of the cooling liquid is t Liquid and its preparation method Forced convection heat transfer quantity phi between liquid cooling plate flow channel wall surface and cooling liquid Convection current ：
Φ Convection current ＝h'A(t Board board -t Liquid and its preparation method )；
The Nu number of the convective heat transfer of the single-phase fluid in the liquid cooling plate flow channel is influenced by the flowing Reynolds number Re and the Planet number Pr of the cooling liquid:
Nu＝f(Re,Pr)；
the heat conductivity coefficient of the cooling liquid is lambda, the diameter of the heat dissipation column is d, and the convection heat transfer coefficient h' between the wall surface of the liquid cooling plate flow channel and the cooling liquid;
h'＝Nuλ/d；
in the cooling and radiating process of the liquid cooling plate, the heat flow in the heat transfer process meets the relation:
Φ＝Φ convection current 。
The above five formulas are all conventional theoretical formulas, and a person skilled in the art can understand the specific meaning and calculation mode thereof.
According to the heat transfer rule in the cooling and radiating process of the liquid cooling plate, through theoretical derivation, numerical simulation and experimental verification, the influence rule of the diameter of radiating columns, the distance between the radiating columns and the quantity of the radiating columns of the liquid cooling plate on the temperature distribution of a substrate is found, the flow channel structure design method of the liquid cooling plate of the driving motor controller is obtained, the flow channel structure of the liquid cooling plate of the driving motor controller is rapidly designed, the design efficiency of the liquid cooling plate of the driving motor controller is improved, the test and die change times are reduced, the development difficulty and the development cost of the liquid cooling plate of the driving motor controller are reduced, the uniform heat radiation performance of the liquid cooling plate of the driving motor controller is improved, the local temperature rise of an IGBT module is prevented from being too high, the thermal stress of the IGBT module is reduced, and the safety and the reliability of long-term stable operation of the driving motor controller are improved.
The liquid cooling plate of the driving motor controller realizes the following technical effects: the design method of the liquid cooling plate flow channel structure of the driving motor controller is provided, the design efficiency of the liquid cooling plate flow channel structure of the driving motor controller is improved, the test times and the die changing times are reduced, the development period is shortened, the development cost and the test cost are reduced, the risk of excessively high local temperature rise of the IGBT module is reduced, the temperature uniformity of the substrate of the liquid cooling plate of the driving motor controller is improved, the periodic thermal stress of the IGBT module in the operation process is reduced, the Wen Shengan rule requirement of a power device in the driving motor controller is met, and the long-term stable operation reliability of the driving motor controller is improved.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms also are intended to include the plural forms unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative positions, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface," "upper end face," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.
The foregoing description of the preferred embodiment of the present application has been presented for purposes of illustration and not of limitation, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A drive motor controller liquid cooling plate, comprising:
a shell (2) of the controller, wherein an IGBT module (1) is arranged on the inner side of the shell (2) of the controller;
the liquid cooling device comprises a substrate (3), wherein the substrate (3) is arranged between an IGBT module (1) and a controller shell (2), the substrate (3) and the controller shell (2) are sealed to form a liquid cooling plate runner (4), and a runner inlet (44) and a runner outlet (45) which are communicated with the liquid cooling plate runner (4) are arranged on the controller shell (2);
the heat dissipation column (5) is arranged on the lower end face of the substrate (3) and corresponds to the IGBT module (1) on the upper end face of the substrate (3), and the heat dissipation column (5) is positioned in the liquid cooling plate flow channel (4);
the liquid cooling plate flow channel (4) comprises two flow channel regions, namely a first flow channel region (41) and a second flow channel region (42) from a flow channel inlet (44) to a flow channel outlet (45), and each flow channel region corresponds to each IGBT half bridge of the IGBT module (1);
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of each row of the heat dissipation columns of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of each row of the heat dissipation columns of the second flow passage area is n 2 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channelThe following relation is satisfied:
2. the drive motor controller liquid cooling plate according to claim 1, wherein: the liquid cooling plate flow channel (4) comprises three flow channel regions, namely a first flow channel region (41), a second flow channel region (42) and a third flow channel region (43) from a flow channel inlet (44) to a flow channel outlet (45); the IGBT module (1) comprises three IGBT half-bridges, namely a first IGBT half-bridge (11), a second IGBT half-bridge (12) and a third IGBT half-bridge (13), wherein the first flow channel region (41) corresponds to the first IGBT half-bridge (11), the second flow channel region (42) corresponds to the second IGBT half-bridge (12), and the third flow channel region (43) corresponds to the third IGBT half-bridge (13);
the length of the liquid cooling plate flow channel is L, the width of the liquid cooling plate flow channel is B, the height of the heat dissipation column is h, and the total row number of the heat dissipation columns is m; the diameter of the heat dissipation column of the first flow passage area is d 1 The number of the radiating columns in each row of the first flow passage area is n 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The number of the radiating columns in each row of the second flow passage area is n 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The number of the radiating columns in each row of the third flow passage area is n 3 The circumference ratio is pi, and the parameters of the liquid cooling plate flow channel meet the relation formula:
and/or the number of the groups of groups,
3. the drive motor controller liquid cooling plate according to claim 1 or 2, wherein:
the length of the liquid cooling plate flow channel is L, (b is n) 0 -10)mm≤L≤(b*n 0 +10) mm; and/or the number of the groups of groups,
the width of the liquid cooling plate flow channel is B, (l-10) mm is less than or equal to B and less than or equal to (l+10) mm;
wherein n is 0 The number of IGBT half-bridges of the IGBT module is that b is the width of the IGBT half-bridges, and l is the length of the IGBT half-bridges.
4. The drive motor controller liquid cooling plate according to claim 1 or 2, wherein: the heat dissipation columns are cylindrical, and the heat dissipation columns are arranged in a fork row mode.
5. The drive motor controller liquid cooling plate according to claim 1 or 2, wherein: the height h of the heat dissipation column is more than or equal to 3mm and less than or equal to 10mm.
6. The drive motor controller liquid cooling plate according to claim 2, wherein: the heat dissipation columns are arranged at intervals along the length direction of the liquid cooling plate flow channel, the row number of the heat dissipation columns is m, the heat dissipation columns of each row are arranged at intervals along the width direction of the liquid cooling plate flow channel,
the diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; each row of heat dissipation columns of the first flow passage area is n in number 1 The spacing between two adjacent heat dissipation columns in the same row is s 1 ，And s is not less than 1mm 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the number of each row of the heat dissipation columns of the second flow passage area is n 2 The spacing between two adjacent heat dissipation columns in the same row is s 2 ，And is less than or equal to 1mms 2 -d 2 ≤5mm；
The diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; each row of heat dissipation columns of the third flow passage area is n 3 The spacing between two adjacent heat dissipation columns in the same row is s 3 ，And s is not less than 1mm 3 -d 3 ≤5mm。
7. The drive motor controller liquid cooling plate according to claim 2 or 6, wherein: the total number of rows of the heat dissipation columns arranged at intervals along the length direction of the liquid cooling plate flow channel is m, m is an integer multiple of 3, the distance between two adjacent rows of heat dissipation columns is c,and c-d is not less than 1mm 1 ≤5mm、1mm≤c-d 2 ≤5mm、1mm≤c-d 3 Less than or equal to 5mm, wherein d 1 Diameter d of the heat-dissipating column in the first flow channel region 2 Diameter of the second flow path region heat dissipation column d 3 Is the diameter of the heat dissipation column in the third flow passage area.
8. The drive motor controller liquid cooling plate according to claim 1, wherein: the controller is characterized in that a groove is formed in the inner side of the shell (2) of the controller, a flow channel inlet (44) and a flow channel outlet (45) are respectively formed in two sides of the bottom of the groove, the shell (2) of the controller is sealed with four sides of the base plate (3) through sealing rings (6), and the groove is matched with the base plate (3) to form a liquid cooling plate flow channel (4).
9. The drive motor controller liquid cooling plate according to claim 1, wherein: the base plate is made of copper or silicon carbide aluminum materials, and the heat dissipation column is made of aluminum or aluminum alloy or copper materials.
10. The drive motor controller liquid cooling plate according to claim 1, wherein: the shell of the controller is made of aluminum or aluminum alloy materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310566580.XA CN116723671A (en) | 2023-05-19 | 2023-05-19 | Liquid cooling plate of driving motor controller |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310566580.XA CN116723671A (en) | 2023-05-19 | 2023-05-19 | Liquid cooling plate of driving motor controller |
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|---|---|
| CN116723671A true CN116723671A (en) | 2023-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310566580.XA Pending CN116723671A (en) | 2023-05-19 | 2023-05-19 | Liquid cooling plate of driving motor controller |
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| Country | Link |
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| CN (1) | CN116723671A (en) |
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