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CN1166265C - 压接连接衬底、液晶装置及电子设备 - Google Patents

压接连接衬底、液晶装置及电子设备 Download PDF

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CN1166265C
CN1166265C CNB998005118A CN99800511A CN1166265C CN 1166265 C CN1166265 C CN 1166265C CN B998005118 A CNB998005118 A CN B998005118A CN 99800511 A CN99800511 A CN 99800511A CN 1166265 C CN1166265 C CN 1166265C
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substrate
mentioned
crimping
opposite side
wiring pattern
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CN1263690A (zh
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������ɽ����
内山宪治
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BOE Technology Group Co Ltd
BOE Technology HK Ltd
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Seiko Epson Corp
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Abstract

在结构为形成多个配线层的压接连接衬底中，在压接连接衬底的压接侧表面上形成、与相对侧端子实现导电连接的衬底侧端子的背面侧所对应的位置上、不存在背面配线图案的部分，形成与背面配线图案具有大致相同的厚度的高低平面差补偿用图案。由于在压接处理过程中进行加压时在衬底侧端子上施加均匀的压力，所以能够稳定地获得连接可靠性高的压接连接结构。

Description

压接连接衬底、液晶装置及电子设备
技术领域
本发明涉及通过压接与其他构件连接的压接连接衬底。本发明还涉及在结构上包含该压接连接衬底的液晶装置。此外，本发明还涉及在结构上包含该液晶装置的电子设备。
背景技术
目前，在携带式电话机、携带式信息终端等各种电子设备中，广泛地应用着液晶装置。在大多数情况下，该液晶装置用于显示文字、数字、图案等可视信息。
液晶装置，在结构上一般包含彼此相对的衬底及在该两个衬底之间封入的液晶。此外，在该液晶装置中，有时将压接连接衬底与该两个衬底或其中任何一个衬底连接。该压接连接衬底，具有为驱动液晶装置所需的驱动电路，在该驱动电路上，安装IC芯片、无源元件芯片部件等，并形成为连接这些元件所需的配线图案。此外，在该压接连接衬底的适当部位，还形成与液晶装置侧的端子实现导电连接的衬底侧端子。
用于使压接连接衬底上的衬底侧端子与在液晶装置的衬底上形成的端子(即，相对侧端子)实现导电连接的压接处理，通常按如下方式进行，即，在将ACF(Anisotropic Conductive Film：各向异性导电膜)、ACP(Anisotropic Conductive Paste：各向异性导电糊剂)、ACA(Anisotropic Conductive Adhesive：各向异性导电粘着剂)等各向异性导电粘着剂夹在压接连接衬底与液晶装置的衬底之间的状态下，用压接工具对该粘着剂进行加热和加压。
可是，对上述压接连接衬底，可以考虑单面配线型、双面配线型及多层配线型等各种配线形态。所谓单面配线型，就是将上述驱动电路、配线图案及衬底侧端子等全部都在衬底的单面上形成的配线形态。所谓双面配线型，就是将上述驱动电路、配线图案及衬底侧端子等分别配置在衬底的正反两面上并根据需要通过导电性通孔使各部分导通的配线形态。而所谓多层配线型，就是将形成了驱动电路、配线图案等的多个配线层在中间夹入绝缘层的状态下反复层叠并根据需要通过导电性通孔使各层导通的配线形态。
图8示出用ACF51通过压接将双面配线型的压接连接衬底53与压接对象物52连接时的状态。在图中，一边用压接工具55将配置在压接对象物52和压接连接衬底53之间的ACF51加热到规定温度，一边进一步以压力F加压，从而使ACF1在加压下固化，并由此将压接对象物52与压接连接衬底53相互压接在一起。借助于这种压接处理，使在压接连接衬底53上形成的多个凸台54通过ACF51内的导电粒子59分别与压接对象物52的凸起56实现导电连接。
但是，对于上述现有的双面配线型压接连接衬底53，在压接侧表面上形成凸台54等衬底侧端子，而在压接侧表面的相反一侧的面上形成背面配线图案58。因此，在多个凸台54中混有两种凸台，即位置与背面配线图案58重合的凸台54a及位置与背面配线图案58不重合的凸台54b。
当用压接工具55对这种压接连接衬底53进行压接处理时，在位置与背面配线图案58重合的凸台54a上将施加很大的加压力，而与之相反，在位置与背面配线图案58不重合的凸台54b上所施加的压力就不够了。在这种情况下，将使多个凸起56与多个凸台54之间的连接在局部上变得不充分，因而使两者之间的连接可靠性显著降低。
图8所示的连接结构体。采用结构为在衬底的正反两面形成配线层的双面配线型压接连接衬底53，但对于结构为将多个配线层重叠后形成的多层配线型压接连接衬底，也存在着同样的问题。
发明内容
本发明的目的在于，像双面配线型压接连接衬底或多层配线型压接连接衬底等那样在结构上将多个配线层重叠后形成的压接连接衬底中，能稳定地获得连接可靠性高的压接连接结构。
本发明的压接连接衬底，通过压接与具有相对侧端子的压接对象物连接，并具有与上述压接对象物连接的压接侧表面、在该压接侧表面上形成、与上述相对侧端子实现导电连接的衬底侧端子、及在上述压接侧表面的相反一侧的面上形成的背面配线图案，该压接连接衬底的特征在于：在上述相反一侧的面内，在与上述衬底侧端子的背面侧对应的位置上、不存在所述背面配线图案的部分，形成与上述背面配线图案具有大致相同的厚度的高低平面差补偿用图案。
在上述的本发明中，例如，如图5所示，在将压接连接衬底3压接于压接对象物2时，将ACF等连接材料1夹在中间，然后，一边对该连接材料1进行加热，一边以压力F对压接连接衬底3和压接对象物2两者进行加压。这时，可以使在压接连接衬底3的压接侧表面上形成的衬底侧端子4与在压接对象物2上形成的相对侧端子6进行导电连接。
按照本发明，在压接连接衬底3的压接侧表面的相反一侧的面内，在位于衬底侧端子4的背面侧且没有形成背面配线图案的部分上，形成了与背面配线图案8具有大致相同的厚度的高低平面差补偿用图案7。因此，由压接工具5对各衬底侧端子4施加的压力将变得均匀，其结果是，可以使所有衬底侧端子4的每一个可靠地与所有相对侧端子6的每一个实现导电连接。就是说，如采用本发明的压接连接衬底，则即使该衬底是双面配线型或多层配线型之类的在结构上将多个配线图案重叠的衬底，也能获得可靠性高的压接连接结构。
另外，在具有上述结构的压接连接衬底中，也可以在上述压接侧表面的相反一侧的面内的与接连跨接了多个上述衬底侧端子的区域的背面侧对应的位置上至少形成高低平面差补偿用图案的一部分。在这种情况下，也能取得与上述相同的作用。
另外，在具有上述结构的压接连接衬底中，压接对象物，例如可以是IC芯片。在这种情况下，可以考虑将在IC芯片的工作面上形成的凸起用作相对侧端子。
另外，在具有上述结构的压接连接衬底中，压接对象物，例如，可以是具有彼此相对的一对衬底及在该一对衬底之间封入的液晶的液晶板的衬底。在这种情况下，可以考虑将在一对衬底的至少一个衬底上形成的外部连接用端子用作相对侧端子。
另外，具有上述结构的压接连接衬底的特征在于：通过各向异性导电粘着剂与上述压接对象物实现导电连接。
在上述的本发明中，例如，如图5所示，将各向异性导电粘着剂作为连接材料1夹在中间，然后，一边对该各向异性导电粘着剂进行加热，一边以压力F对压接连接衬底3和压接对象物2两者进行加压。这时，可以使在压接连接衬底3的压接侧表面上形成的衬底侧端子4与在压接对象物2上形成的相对侧端子6实现可靠的导电连接，从而获得可靠性高的压接连接结构。
其次，本发明的液晶装置，具有彼此相对的一对衬底、在该一对衬底之间封入的液晶、及通过压接与上述一对衬底的至少一个衬底连接的压接连接衬底，该液晶装置的特征在于：该压接连接衬底，由如上所述的压接连接衬底构成。
按照该液晶装置，即使与液晶侧的衬底连接的压接连接衬底是双面配线型或多层配线型之类的在结构上将多个配线图案重叠的衬底，也能获得可靠性高的压接连接结构，因此，可以防止发生因导电不良引起的显示缺陷。
另外，本发明的电子设备，在结构上包含液晶装置，该电子设备的特征在于：该液晶装置，由如上所述的液晶装置构成，因此可以提供能同样取得如上所述的作用的电子设备。作为这种电子设备，例如，可以考虑携带式电话机、携带式信息终端等。
附图的简单说明
图1是表示本发明的压接连接衬底的一实施形态的分解斜视图。
图2是对应于图1中箭头A的压接连接衬底的底面图。
图3是表示本发明的压接连接衬底的另一实施形态及本发明的液晶装置的一实施形态的分解斜视图。
图4是对应于图3中箭头B的压接连接衬底的底面图。
图5是示意地表示本发明的压接连接衬底与压接对象物的连接状态的断面图。
图6是表示本发明的电子设备的一实施形态的分解斜视图。
图7是表示在图6的电子设备中使用的电气控制系统的一例的框图。
图8是表示现有的压接连接衬底的一例的断面图。
用于实施发明的最佳形态
以下，根据附图说明本发明的实施形态。
(第1实施形态)
图1示出用本发明的压接连接衬底构成的压接连接结构体。图中示出的压接连接结构体10，通过将作为压接对象物的IC芯片12安装在本发明的压接连接衬底13上制成。
压接连接衬底13，具有用于连接IC芯片12的压接侧表面13a，在该压接侧表面13a上，通过众所周知的图案处理形成处理形成多个配线图案19。在这些配线图案19的内侧前端，形成用作衬底侧端子的凸台14。
本实施形态的压接连接衬底13是双面配线型衬底，在压接侧表面13a的相反一侧的面13b上形成背面配线图案18。图2示出从箭头A方向看去的压接连接衬底13的相反一侧的面13b的状态。从该图可以清楚看出，形成背面配线图案18，使其在压接侧表面13a上的凸台14的背面侧位置上通过。
另外，在本实施形态中，在压接连接衬底13的相反一侧的面13b内，在与凸台14的背面侧对应的位置上的不存在背面配线图案18的部分，形成高低平面差补偿用图案17。这些高低平面差补偿用图案17，可以在形成背面配线图案18时与其同时形成，或者，也可以通过与背面配线图案18不同的工序形成。
在图1中示出的配线图案19，用于示意地表示配线图案，不一定真实地表示实际的配线图案。此外，与背面配线图案18重合部分的配线图案19，为使所示出的结构易于理解，在图中将其一部分省略。另外，凸台14的实际面积比图中更小，而数量则更多，但在图1中只是将其示意地示出。
另外，在图2中，还表示出在与接连跨接了凸台14中不存在背面配线图案18的多个凸台14的区域的背面侧对应的位置上形成高低平面差补偿用图案17，但不限定于这种方式，也可以将高低平面差补偿用图案17分别设置在与不存在背面配线图案18的多个凸台14的每一个的背面侧对应的位置上，此外，还可以将上述各种方式组合后进行设置。
由于本实施形态的压接连接衬底13具有如上所述的结构，所以，在将IC芯片12与其连接时，可以先将各向异性导电粘着剂、例如ACF11粘结在压接连接衬底13的压接侧表面所形成的凸台14上，然后将IC芯片12的工作面12a安放在该ACF11上。这时，将IC芯片12与压接连接衬底13相对地定位，使在工作面12a上形成的用作相对侧端子的凸起16与压接连接衬底13侧的凸台14在位置上一致。
在这之后，用加热到高温的压接工具(图中未示出)对压接连接衬底13和IC芯片12从两者的外侧以压力F进行加压。通过该加热和加压处理，如图5所示，由ACF11的粘着剂部分21将IC芯片12与压接连接衬底13粘合，并进一步通过ACF11的导电粒子22使凸起16与凸台14实现导电连接。
另外，在本实施形态中，在凸台14的背面侧位置上的不存在背面配线图案18的部分，形成与背面配线图案18具有相同厚度的高低平面差补偿用图案17，所以，使压接处理时施加在多个凸台14上的压力的压力分布变得均匀，其结果是，使所有凸台14无遗漏地都能与凸起16实现可靠的导电连接，因此，可以制成连接可靠性高的压接连接结构体10。
(第2实施形态)
图3示出本发明的压接连接衬底的另一实施形态及用该衬底构成的液晶装置的一实施形态。图中示出的液晶装置31，具有液晶板32及与其连接的压接连接衬底33。液晶板32，具有用环形密封材料29相互粘合的一对衬底28a和28b、及在该一对衬底间封入的液晶27。衬底28a和28b，由玻璃、塑料等形成。
在图中的上侧衬底28a的内侧表面上，形成电极26a和用作相对侧端子的外部连接用端子25，在下侧衬底28b的内侧表面上形成电极26b。这两个电极26a、26b及外部连接用端子25，例如由ITO(铟锡氧化物)形成。衬底28a侧的电极26a，直接与外部连接用端子25连接，与其相对的衬底28b的电极26b，则通过设在衬底28a和衬底28b之间的导通材料(图中未示出)与外部连接用端子25连接。在衬底28a和衬底28b的外侧表面上粘贴着偏振片23。电极26a、电极26b及外部连接用端子25，实际上可分别形成多个，但在图中只示意地示出其中的一部分，其余部分在图中省略。此外，电极26a与端子25的连接方式及电极26b与端子25的连接方式，在图中也省略。
压接连接衬底33，具有与作为压接对象物的衬底28a连接的压接侧表面33a，在该压接侧表面33a上，通过众所周知的图案形成处理形成多个配线图案39。在这些配线图案39的适当部位上形成衬底侧端子34。此外，在衬底33的适当部位上，用倒装焊接法安装着液晶驱动用IC24。
本实施形态的压接连接衬底33，是双面配线型衬底，在压接侧表面33a的相反一侧的面33b上形成背面配线图案38。图4示出从箭头B方向看去的压接连接衬底33的相反一侧的面33b的状态。从该图可以清楚看出，形成背面配线图案38，使其在压接侧表面33a上的衬底侧端子34的背面侧位置上通过。
另外，在本实施形态中，在压接连接衬底33的相反一侧的面33b内，在与衬底侧端子34的背面侧对应的位置上的不存在背面配线图案38的部分，形成高低平面差补偿用图案37。这些高低平面差补偿用图案37，可以在形成背面配线图案38时与其同时形成，或者，也可以通过与背面配线图案38不同的工序形成。在图3中示出的配线图案39，用于示意地表示配线图案，不一定真实地表示实际的配线图案。
另外，在图4中，高低平面差补偿用图案37，将在与衬底侧端子34中不存在背面配线图案38的各个衬底侧端子34的背面侧对应的位置上分别形成的部分及在与接连跨接了多个衬底侧端子34的区域的背面侧对应的位置上形成的部分组合示出，但不限定于这种方式，例如，也可以与不存在背面配线图案38的所有衬底侧端子34的每一个分别对应地设置高低平面差补偿用图案37。
在将压接连接衬底33与作为压接对象物的衬底28a连接时，可以先将各向异性导电粘着剂、例如ACF11粘结在压接连接衬底33的压接侧表面所形成的衬底侧端子34上，然后将液晶板32的衬底28a安放在该ACF11上。这时，将液晶板32与压接连接衬底33相对地定位，使衬底28a上的外部连接用端子25与压接连接衬底33的衬底侧端子34在位置上一致。
在这之后，用加热到高温的压接工具(图中未示出)对压接连接衬底33和液晶板32从两者的外侧以压力F进行加压。通过该加热和加压处理，如图5所示，由ACF11的粘着剂部分21将衬底28a与压接连接衬底33粘合，并进一步通过ACF11的导电粒子22使外部连接用端子25与衬底侧端子34实现导电连接。
另外，在本实施形态中，在衬底侧端子34的背面侧位置上的不存在背面配线图案38的部分，形成与背面配线图案38具有相同厚度的高低平面差补偿用图案37，所以，使压接处理时施加在多个衬底侧端子34上的压力的压力分布变得均匀，其结果是，使所有衬底侧端子34无遗漏地都能与外部连接用端子25实现可靠的导电连接，因此，可以制成连接可靠性高的液晶装置31。
(第3实施形态)
图6示出本发明的电子设备的一实施形态。该实施形态，是将本发明的液晶装置应用于作为电子设备的携带式电话机时的实施形态。图中示出的携带式电话机，在结构上包含上壳体41及下壳体42。上壳体4 1设有发送接收用天线43、键盘单元44、及送话器46。而下壳体42设有例如在图3中示出的液晶装置31、扬声器47、及电路衬底48。
在电路衬底48上，如图7所示，设有与扬声器47的输入端子连接的接收部49、与送话器46的输出端子连接的发送部51、在结构上包含CPU的控制部52、及对各部供电的电源部53。控制部52，读取发送部51及接收部49的状态，并根据所读取的结果对液晶驱动用IC24供给信息，从而在液晶装置31的显示区域显示例如文字、数字等可视信息。此外，控制部52，还根据从键盘单元44输出的信息对液晶驱动用IC24供给信息，从而在液晶装置31的显示区域显示可视信息。
(其他实施形态)
以上，列举最佳的实施形态对本发明进行了说明，但本发明并不限定于该实施形态，在权利要求所述的发明范围内可以进行各种变更。
例如，在图1和图3所示的压接连接衬底中，以双面配线型衬底为例进行了说明，但当然也可以将本发明应用于结构为层叠3层以上的配线层的多层配线型衬底。此外，在图3所示的液晶装置中，将本发明应用于无源矩阵型液晶装置，但当然也可以将本发明应用于有源矩阵型液晶装置。

Claims (7)

1.一种压接连接衬底，通过压接与具有相对侧端子的压接对象物连接，并具有与上述压接对象物连接的压接侧表面、在该压接侧表面上形成、与上述相对侧端子通过各向异性导电粘着剂实现导电连接的衬底侧端子、及在上述压接侧表面的相反一侧的面上形成的背面配线图案，该压接连接衬底的特征在于：在上述相反一侧的面内，在与上述衬底侧端子的背面侧对应的位置上、不存在所述背面配线图案的部分，形成与上述背面配线图案厚度相同的高低平面差补偿用图案。
2.根据权利要求1所述的压接连接衬底，其特征在于：在上述相反一侧的面内，在与跨接在多个上述衬底侧端子的区域的背面侧对应的位置上至少形成上述高低平面差补偿用图案的一部分。
3.根据权利要求1所述的压接连接衬底，其特征在于：上述压接对象物，是IC芯片，上述相对侧端子，是在上述IC芯片的工作面上形成的凸起.
4.根据权利要求1所述的压接连接衬底，其特征在于：上述压接对象物，是具有彼此相对的一对衬底及在该一对衬底之间封入的液晶的液晶板的上述衬底，上述相对侧端子，是在上述一对衬底的至少一个衬底上形成的外部连接用端子。
5.根据权利要求1所述的压接连接衬底，其特征在于：在上述压接侧表面相反一侧的面上、不形成背面配线图案的部分上形成跨接多个衬底侧端子的背面的所述高低平面差补偿用图案。
6.一种液晶装置，具有彼此相对的一对衬底、在该一对衬底之间封入的液晶、及通过压接与在上述一对衬底的至少一个衬底中备有的相对侧端子连接的压接连接衬底，该液晶装置的特征在于：上述压接连接衬底，具有与上述相对侧端子连接的压接侧表面、在该压接侧表面上形成并与上述相对侧端子通过各向异性导电粘着剂实现导电连接的衬底侧端子、及在上述压接侧表面的相反一侧的面上形成的背面配线图案，在上述相反一侧的面内，在与上述衬底侧端子的背面侧对应的位置上、不存在所述背面配线图案的部分，形成与上述背面配线图案厚度相同的高低平面差补偿用图案。
7.一种电子设备，在结构上包含液晶装置，该液晶装置具有彼此相对的一对衬底、在该一对衬底之间封入的液晶、及通过压接与在上述一对衬底的至少一个衬底中备有的相对侧端子连接的压接连接衬底，该电子设备的特征在于：上述压接连接衬底，具有与上述相对侧端子连接的压接侧表面、在该压接侧表面上形成并与上述相对侧端子通过各向异性导电粘着剂实现导电连接的衬底侧端子、及在上述压接侧表面的相反一侧的面上形成的背面配线图案，在上述相反一侧的面内，在与上述衬底侧端子的背面侧对应的位置上、不存在所述背面配线图案的部分，形成与上述背面配线图案厚度相同的高低平面差补偿用图案。
CNB998005118A 1998-04-09 1999-04-06 压接连接衬底、液晶装置及电子设备 Expired - Lifetime CN1166265C (zh)

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