CN116602666A

CN116602666A - Glucose monitoring device and method for sterilizing glucose monitoring device

Info

Publication number: CN116602666A
Application number: CN202310595697.0A
Authority: CN
Inventors: 夏斌; 龚明利; 彭伟斌; 陈志�; 夏然
Original assignee: Shenzhen Guiji Sensing Technology Co ltd
Current assignee: Shenzhen Guiji Sensing Technology Co ltd
Priority date: 2023-05-24
Filing date: 2023-05-24
Publication date: 2023-08-18

Abstract

The present disclosure describes a glucose monitoring device and a method of sterilizing a glucose monitoring device, the glucose monitoring device including a sensor control device including an electronics housing, an electronics module disposed within the electronics housing, and a sensor coupled to the electronics module, the sensor including a head portion disposed within the electronics housing and coupled to the electronics module and a tail portion extending out of the electronics housing, the method comprising: the electronic module is arranged away from the centre axis of the tail and a shield for shielding radiation is arranged between the electronic module and the tail. Therefore, when the tail is subjected to radiation sterilization, the radiation can be focused on the tail as much as possible and does not irradiate the electronic module, and the influence of the radiation on the performance of the electronic module can be further reduced.

Description

Glucose monitoring device and method for sterilizing glucose monitoring device

Technical Field

The present disclosure relates generally to the field of glucose monitoring technology, and in particular, to a glucose monitoring device and a method for sterilizing the glucose monitoring device.

Background

Diabetes and its chronic complications have become one of the conditions that seriously affect human health today. In order to delay and reduce chronic complications of diabetes, glucose is required to be strictly controlled, and thus a dynamic glucose monitoring system (Continuous glucose monitoring system, CGMS) for dynamically reflecting glucose fluctuations is widely used. There are a number of dynamic glucose monitoring systems currently available for FDA and/or CE certification in the united states that allow use in europe and america, most of which are minimally invasive, using subcutaneous probes to monitor interstitial fluid glucose, and few on the skin surface. The interstitial fluid glucose concentration measured by CGMS has good correlation with the venous glucose concentration and the fingertip glucose concentration, and can be used as an auxiliary glucose monitoring means.

Because the subcutaneous probe needs to be placed in the body of a host when in use, the probe needs to be sufficiently sterilized and disinfected before use for the health and safety of the host. Currently, sterilization of probes is commonly used by irradiating a probe with an electron radiation beam to sterilize the probe, but the irradiation of the radiation beam may damage electronics connected to the probe.

Therefore, when the sensor and the electronic device are integrated and then subjected to radiation sterilization, the arrangement of the electronic device in the glucose monitoring device needs to be considered, and the sterilization system of the probe needs to be improved for the electronic radiation.

Disclosure of Invention

The present disclosure has been made in view of the above-described circumstances, and an object thereof is to provide a glucose monitoring device capable of sufficiently sterilizing an electrode without damaging the effectiveness of an electronic module, and a method of sterilizing the glucose monitoring device.

To this end, a first aspect of the present disclosure provides a glucose monitoring device comprising a sensor control device including an electronics housing, an electronics module disposed within the electronics housing, and a sensor connected to the electronics module, the sensor including a head portion disposed within the electronics housing and connected to the electronics module and a tail portion extending out of the electronics housing, comprising: the electronic module is arranged remote from the centre axis of the tail portion and a shield for shielding the electron radiation is arranged between the electronic module and the tail portion.

In the first aspect of the present disclosure, by configuring the electronic module to be away from the central axis of the tail of the sensor, the radiation beam can be focused on the tail as much as possible without irradiating the electronic module when the tail is subjected to radiation sterilization, and further, by providing a shield for shielding the radiation between the electronic module and the tail, the performance influence of the radiation on the electronic module can be further reduced.

Further, in the glucose monitoring device according to the first aspect of the present disclosure, optionally, a sensor applicator is further included, and the sensor control device is disposed within the sensor applicator. In this case, the sensor control device can be controlled to be placed in the host by the sensor applicator.

In addition, in the glucose monitoring device according to the first aspect of the present disclosure, optionally, a sharps module inserted from a top of the electronic device housing and extending out of a bottom of the electronic device housing is further included, and the tail is disposed in the sharps module. In this case, the sensor can be conveniently driven to be placed in the host through the sharps module.

In addition, in the glucose monitoring device according to the first aspect of the present disclosure, the electronic module may be optionally disposed at a periphery away from a central axis of the tail portion. Therefore, the electronic module can be conveniently distributed in the electronic equipment shell, and the electronic module can be conveniently configured.

In addition, in the glucose monitoring device according to the first aspect of the present disclosure, the sharps module may include a needle portion and a carrier portion connected to the needle portion, and the tail portion may be disposed in the needle portion. In this case, the pushing of the housing of the electronic device by the carrier part can be facilitated to place the needle and the sensor into the host.

Further, in the glucose monitoring device according to the first aspect of the present disclosure, a shield may be optionally provided on the electronic device housing in parallel and/or perpendicular to the central axis of the tail. Thereby, it is possible to conveniently configure a shield for shielding radiation on the electronic device housing.

In addition, in the glucose monitoring device according to the first aspect of the present disclosure, optionally, the sensor control device further includes a first seal for sealing an interface between the carrier portion of the sharps module and the electronic device housing. Therefore, the interface where the bearing part and the electronic equipment shell are located can be conveniently sealed.

In addition, in the glucose monitoring device according to the first aspect of the present disclosure, optionally, the sensor control device further includes a second seal for sealing an interface between the cap and the electronic device housing. Therefore, the interface where the cap and the electronic equipment shell are located can be conveniently sealed.

Further, in the glucose monitoring device according to the first aspect of the present disclosure, optionally, the head portion extends through the carrier portion and is fixed to an inner surface of the electronic device housing. Therefore, the sensor can conveniently extend out of the bearing part, and the sensor can be fixed on the inner surface of the electronic equipment shell.

A second aspect of the present disclosure provides a method of sterilizing a glucose monitoring device according to the first aspect of the present disclosure, comprising: the tail is sterilized by irradiating the tail with radiation in a direction perpendicular or parallel to the central axis of the tail.

In the second aspect of the present disclosure, in the case where the electronic module is configured to be far away from the central axis of the tail, causing the radiation to irradiate the tail in a direction parallel to the central axis of the tail, the radiation can be sufficiently irradiated to the tail without deviating from the tail to irradiate the electronic module, so that the influence of the radiation on the performance of the electronic module can be reduced, and further, by providing a shield for shielding the electronic radiation between the electronic module and the tail, the influence of the electronic radiation on the performance of the electronic module due to refraction or scattering of the electronic device case can be reduced; under the condition that the electronic module is configured to be far away from the central axis of the tail part, the tail part is irradiated by radiation in the direction perpendicular to the central axis of the tail part, so that the radiation can be sufficiently irradiated to the tail part without deviating from the tail part to irradiate the electronic module, the influence of the radiation on the performance of the electronic module can be reduced, and further, the influence of the radiation caused by refraction or scattering of the shell of the electronic equipment on the performance of the electronic module can be weakened by arranging a shielding piece for shielding the electronic radiation between the electronic module and the tail part.

According to the present disclosure, a glucose monitoring device and a method of sterilizing a glucose monitoring device are provided that are capable of sufficiently sterilizing a sensor without damaging the effectiveness of an electronic module.

Drawings

The present disclosure will now be explained in further detail by way of example only with reference to the accompanying drawings, in which:

fig. 1 is a schematic diagram showing an application scenario of a glucose monitoring device according to an example of the present disclosure.

Fig. 2 is a schematic diagram showing a perspective structure of a sensor control device according to an example of the present disclosure.

Fig. 3 is a schematic diagram showing the structure of a sensor control device according to an example of the present disclosure.

Fig. 4 is a functional block diagram showing an electronic module to which examples of the present disclosure relate.

Fig. 5 is a circuit configuration diagram showing an electronic module according to an example of the present disclosure.

Fig. 6 is a schematic diagram showing a structure of a sensor control device provided with a seal according to an example of the present disclosure.

Fig. 7 is a schematic view showing a structure in which a seal assembly according to an example of the present disclosure forms a seal space.

Fig. 8 is a schematic diagram showing a structure of a sensor control device provided with a boss structure according to an example of the present disclosure.

Fig. 9 is a schematic diagram showing one example of sterilizing a sensor control device according to an example of the present disclosure.

Fig. 10 is a schematic diagram showing another example of sterilizing a sensor control device according to an example of the present disclosure.

Reference numerals illustrate:

a glucose monitoring device, a 2-reader, a 10-sensor control device, a 20-sensor applicator, a 30-cap, a 110-sensor, a 120-electronics housing, a 121-upper housing, a 122-lower housing, a 130-adhesive sheet, a 140-electronics module, a 150-shield, a 160-sharps module, a 111-head, a 112-tail, a 123-internal channel, a 141-power module, a 142-switching module, a 143-data processing module, a 144-storage module, a 145-communication module, a 161-carrier, a 162-needle, a 171-first seal, a 172-second seal, a 1201-first boss structure, a 1202-second boss structure, a 1210-first through hole, a second through hole, a 1421 hall sensor, a 1422-switching chip, a 1611-first portion, a 1612-second portion, a 1613-third portion, and a 1614-fourth portion.

Detailed Description

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same members are denoted by the same reference numerals, and overlapping description thereof is omitted. In addition, the drawings are schematic, and the ratio of the sizes of the components to each other, the shapes of the components, and the like may be different from actual ones.

It should be noted that the terms "comprises" and "comprising," and any variations thereof, in this disclosure, such as a process, method, system, article, or apparatus that comprises or has a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus, but may include or have other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In addition, headings and the like referred to in the following description of the disclosure are not intended to limit the disclosure or scope thereof, but rather are merely indicative of reading. Such subtitles are not to be understood as being used for segmenting the content of the article, nor should the content under the subtitle be limited only to the scope of the subtitle.

Fig. 1 is a schematic diagram showing an application scenario of a glucose monitoring device 1 according to an example of the present disclosure. Fig. 2 is a schematic diagram showing a perspective structure of the sensor control device 10 according to the example of the present disclosure. Fig. 3 is a schematic diagram showing the structure of the sensor control device 10 according to the example of the present disclosure.

Referring to fig. 1 to 3, in the present embodiment, a glucose monitoring system is provided. The glucose monitoring system may include a glucose monitoring device 1 and a reading device 2 in communication with the glucose monitoring device 1.

In some examples, the glucose monitoring system may also include a computer system or cloud system or the like in communication with the reading device 2.

In the present embodiment, the glucose monitoring device 1 may be used to detect blood glucose in a human body and transmit detection data (e.g., blood glucose data in the human body) to the reading device 2, so that the host (e.g., user) can view and monitor the blood glucose in real time in the reading device 2.

Alternatively, the reader 2 may upload the received blood glucose data of the human body to a computer system, and further process the data by the computer system or view the data by a practitioner on the computer system. Furthermore, the reading device 2 may upload the received blood glucose data of the human body to the cloud system for storage.

Referring to fig. 1, a glucose monitoring device 1 according to an embodiment of the present disclosure may generally include a sensor control device 10. In some examples, the glucose monitoring device 1 according to embodiments of the present disclosure may further include a sensor applicator 20 and a cap 30.

In some examples, the sensor control device 10 may also be referred to as a sensor device or an analyte sensor device.

In some examples, the analyte sensor apparatus may generate information or the like of a particular analyte in a bodily fluid based on the bodily fluid. For example, the analyte sensor apparatus may react with an analyte in a bodily fluid and generate analyte information. In this case, the reaction with the analyte in the body fluid by the sensor can be performed, whereby the acquisition of the analyte information in the body fluid can be facilitated.

In this embodiment, the analyte for which the analyte sensor apparatus is directed may be one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotrophin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, ketone body, lactate, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone or troponin.

Hereinafter, a glucose monitoring device 1 according to an example of the present embodiment will be described with reference to glucose as an analyte. It should be noted that, for other analytes, those skilled in the art can analyze other analytes by slightly modifying the glucose monitoring device 1 based on glucose.

Specifically, the present disclosure provides a glucose monitoring device 1, which glucose monitoring device 1 may comprise a sensor control device 10.

In this embodiment, the sensor control device 10 may be sterilized as a sealed assembly. In other words, the sensor control device 10 may be sterilized as a separate component after being assembled and sealed.

In some examples, referring to fig. 3, the sensor control apparatus 10 may include an electronics housing 120, an electronics module 140 disposed within the electronics housing 120, and a sensor 110 coupled to the electronics module 140.

In some examples, referring to fig. 3, the sensor 110 may include a head 111 disposed within the electronics housing 120 and coupled to the electronics module 140, and a tail 112 extending out of the electronics housing 120.

In some examples, referring to fig. 3, the electronic module 140 may be disposed away from the central axis L of the tail 112, and a shield 150 for shielding radiation may be disposed between the electronic module 140 and the tail 112.

In the present disclosure, by disposing the electronic module 140 away from the central axis L of the tail 112 of the sensor, the radiation can be focused on the tail 112 as much as possible without impinging on the electronic module 140 when the tail 112 is radiation sterilized, and further, by disposing the shield 150 for shielding the electronic radiation between the electronic module tails 112, the effect of the radiation on the performance of the electronic module 140 can be further reduced.

In some examples, electronic modules 140 may be centrally disposed on a side away from central axis L of tail 112. In this case, the irradiation direction of the radiation source can be better regulated, that is, the tail 112 can be irradiated on a side of the radiation source away from the central axis L of the tail 112.

In other examples, the electronic modules 140 may be disposed on two sides or around the central axis L away from the tail 112. In this case, it is possible to facilitate the distributed arrangement of the electronic modules 140 in the electronic device housing 120, and it is possible to facilitate the arrangement of the individual ones of the electronic modules. In particular, when the electronic device housing is a circular clamshell structure, the electronic modules 140 may be preferably disposed at the periphery of the clamshell structure away from the central axis L of the tail 112, or disposed around the central axis L; when the electronic device case has a rectangular or elongated structure, the electronic modules 140 may be preferably disposed at both sides of the rectangular or elongated structure away from the central axis L of the tail portion 112, or at both sides farther from the central axis L.

In some examples, the radiation may be electron beam radiation or low energy X-ray radiation. The electron beam radiation may be, for example, high energy electron beam radiation or low energy electron beam radiation. In other examples, radiation sterilization may be performed by continuous treatment radiation or by pulsed beam radiation. In pulsed beam radiation, the pulsed beam may be focused at a target location where a component or device to be sterilized is located.

In some examples, referring to fig. 2, an adhesive patch 130 may be disposed on the bottom of the electronics housing 120, and the adhesive patch 130 may be used to adhere the sensor control device 10 to a host body surface.

In some examples, referring to fig. 2, the glucose monitoring device 1 may further include a sensor applicator 20, and the sensor control device 10 may be disposed within the sensor applicator 20. In this case, the sensor control device 10 can be controlled to be placed in the host by the sensor applicator 20. That is, the sensor control device 10 may be placed or applied to the body surface of the user via the action of the sensor applicator 20, or the sensor 110 in the sensor control device 10 may be placed wholly or partially subcutaneously in the host.

In some examples, the tail 112 of the sensor 110 may be partially or fully positioned subcutaneously in the host. In some examples, sensor 110 may react with glucose in subcutaneous tissue fluid after being placed subcutaneously to generate glucose information for the host.

In some examples, the sensor control apparatus 10 (including portions of the electronics housing 120, the electronics module 140, and the sensor 110) may be applied to a body surface of a host. In some examples, the electronic module 140 in the sensor control device 10 may also receive glucose information generated by the sensor 110.

In some examples, the tail 112 (i.e., the implanted portion) of the sensor 110 may be elongate. In some examples, tail 112 may be rigid. Thereby, it can be facilitated to be placed subcutaneously in the host. In other examples, tail 112 may also be flexible, in which case the foreign body sensation of the host can be reduced. In some examples, the length of tail 112 may be 1mm to 10mm, such as 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm. The tail 112, when implanted in a host, may be deep enough to reach the dermis and be positioned between the tissues of the skin so that the sensor 110 may collect glucose information from the interstitial fluid.

In some examples, tail 112 may include a working electrode and a counter electrode. In this embodiment, a sensing layer including a glucose enzyme may be disposed on the working electrode, and the subcutaneous tail 112 may perform an oxidation-reduction reaction with glucose in tissue fluid or blood through the glucose enzyme on the working electrode, and form a loop with the counter electrode to generate a current signal, and perform an analysis process on the current signal to obtain glucose concentration information. In some examples, the current signal generated by the sensor 110 may be transmitted to the electronic module 140.

In some examples, the implanted portion may further comprise a reference electrode. In some examples, the reference electrode may form a known and fixed potential difference with interstitial fluid or blood. In this case, the potential difference between the working electrode and the tissue fluid or blood can be measured by the potential difference formed by the reference electrode and the working electrode. Thus, the voltage generated by the working electrode can be obtained more accurately. Thus, the electronic module 140 in the sensor control device 10 can automatically adjust and maintain the voltage at the working electrode to be stable according to the preset voltage value, so that the measured current signal can more accurately reflect the glucose concentration information in tissue fluid or blood. In some examples, the number of reference electrodes may be one or more, such as two.

Fig. 4 is a functional block diagram illustrating the electronic module 140 according to an example of the present disclosure.

Referring to fig. 4, in some examples, the electronic module 140 may be disposed on a circuit board. In some examples, the electronic module 140 may include a data processing module 143, a power module 141, a switching module 142, and a communication module 145. The power module 141 may supply power to the sensor 110, the data processing module 143, the switch module 142, the communication module 145, etc., the switch module 142 may control on-off of the power module 141 with the sensor 110 and/or the data processing module 143, and the data processing module 143 may process signals (e.g., glucose information) generated by the sensor 110.

In some examples, the power module 141 in the sensor control device 10 may also provide the sensor 110 with the electrical energy needed to obtain physiological information. Thus, continuous monitoring of the sensor 110 subcutaneously in the host can be facilitated.

In the above example, the electronic module 140 is centrally disposed on a side away from the central axis L of the tail 112, that is, the data processing module 143, the power module 141, the switching module 142, and the communication module 145 are centrally disposed on a side away from the central axis L of the tail 112.

In the above example, the electronic modules 140 are disposed at both sides or the periphery away from the central axis L of the tail 112 in a scattered manner, that is, the data processing module 143, the power module 141, the switching module 142, and the communication module 145 are disposed at both sides or the periphery away from the central axis L of the tail 112 in a scattered manner.

In some examples, the sensor control device 10 may upload the monitored blood glucose data to the reading device 2 via the communication module 145. In some examples, the communication module 145 may be a bluetooth module, an NFC module, a Wifi module, or the like. In some examples, the reading device 2 may be a smart phone, a smart watch, a tablet computer, a computer, or the like.

In some examples, the data processing module 143 may be, for example, an application specific integrated circuit or an ASIC.

In some examples, the sensor control device 10 has an initial mode configured as an open circuit and an operating mode configured as a closed circuit. In this case, the sensor control device 10 is configured as an open circuit when in the initial mode, whereby power consumption can be saved before the sensor control device 10 enters the operating state. In some examples, the switch module 142 may be in an open state when the sensor control device 10 is configured in the initial mode, and the switch module 142 may be in a closed state when the sensor control device 10 is configured in the operational mode. That is, the sensor control device 10 can be switched from the initial mode to the operation mode by the switching module 142. In this case, the switching of the sensor control device 10 from the initial mode to the operation mode is controlled by the switching module 142, whereby the power consumption before the operation can be effectively reduced.

Additionally, in some examples, the electronic module 140 may also include a storage module 144. The storage module 144 may store signals generated by the sensor 110.

In some examples, the electronic module 140 may transmit to an external device on the fly upon receiving the glucose information generated by the sensor 110. Thus, the external device can process or display the glucose information in real time. In other examples, the electronic module 140 may also store the glucose information generated by the sensor 110 in the memory module 144 after receiving the glucose information, and then transmit the glucose information to an external device at regular time. Thus, power consumption due to the instant transmission can be reduced.

In some examples, the sensor control device 10 may be configured to be magnetically or optically activated to be activated from an initial mode to an operational mode. In this case, the sensor control device 10 is activated from the initial mode to the operation mode by a noncontact member such as a magnetic action or a light action, and thus the sensor control device 10 can be miniaturized.

In some examples, the switch module 142 may be configured as an optically controlled switch. For example, in an initial mode, the switch module 142 may be in an open state, and when the switch module 142 is illuminated, the switch module 142 may be activated from the open state to a closed state to connect the power module 141 to the data processing module 143, thereby providing power to the data processing module 143.

In other examples, the switch module 142 may also be configured as a magnetically controlled switch. For example, in the initial mode the switch module 142 may be in an open state, and when the magnetic effect experienced by the switch module 142 changes, the switch module 142 may be switched from the open state to the closed state, thereby activating the sensor control device 10 from the initial mode to the operational mode.

As described above, a shield 150 may be disposed between the electronics module 140 and the tail 112 of the sensor 110. In some examples, the shield 150 may be used to shield only a portion of the devices in the electronic module 140 that are susceptible to electron radiation. In other words, only a part of the devices may be disposed on one side of the central axis L of the tail 112. In this case, layout of the electronic module 140 on the circuit can be facilitated, and excessive stacking of a plurality of devices in the electronic module 140 or in one area can be avoided.

In some examples, the shield 150 may be used only to shield the data processing module 143 in the electronics module 140. In other words, the data processing module 143 may be configured to be remote from the central axis L of the tail 112 (or remote from the side of the central axis L of the tail 112) only. In this case, since the data processing module 143 is most susceptible to radiation, it may be shielded by the shielding member 150 alone, and the power module 141, the switching module 142, etc. may be disposed at the other side of the circuit board, thereby enabling the arrangement of the modules on the circuit board.

In some examples, the shield 150 may be made as a shell structure surrounding, semi-surrounding, or at least partially surrounding the data processing module 143, which may be disposed between the data processing module 143 and the tail 112 for shielding the electron radiation, or having the radiation impinge only on the tail 112 and not on the data processing module 143. Thereby, the influence of radiation on the performance of the data processing module 143 can be avoided.

In some examples, the shield 150 may be made of any material capable of blocking (or substantially blocking) radiation transmission. For example, suitable materials for the shield 150 include, but are not limited to, lead, tungsten, iron-based metals (e.g., stainless steel), copper, tantalum, tungsten, osmium, or any combination thereof. In some examples, suitable metals may be corrosion resistant, austenitic, and any non-magnetic metal having a density in the range of between about 5 grams per cubic centimeter (g/cc) and about 15 g/cc. The shield 150 may be manufactured via a variety of manufacturing techniques including, but not limited to, stamping, casting, injection molding, sintering, two-shot molding (two-shot mold), or any combination thereof.

However, in other examples, the shield 150 may comprise a metal filled thermoplastic polymer such as, but not limited to, polyamide, polycarbonate, or polystyrene. In such an embodiment, the shield 150 may be manufactured by: the shielding material is mixed in an adhesive matrix and the combination is dispensed onto a shaped part or otherwise directly onto the data processing module 143. Further, in such embodiments, the shield 150 may include a housing that encapsulates (or substantially encapsulates) the data processing module 143.

In some examples, the switch module 142 may be in an open state when the switch module 142 is proximate to the magnetic component, and the switch module 142 may be energized to a closed state when the switch module 142 is distal from the magnetic component. In other examples, the switch module 142 may be in an open state when the switch module 142 is away from the magnetic component, and the switch module 142 may be energized to a closed state when the switch module 142 is proximate to the magnetic component.

Fig. 5 is a circuit configuration diagram showing the electronic module 140 according to the example of the present disclosure.

Referring to fig. 5, in some examples, the switch module 142 may have a hall sensor 1421 and a switch chip 1422. In some examples, in an initial mode, the switch chip 1422 may be in an open state, and when the hall sensor 1421 senses a change in magnetic action, an excitation signal may be generated to excite the switch chip 1422 from the open state to the closed state, thereby placing the power module 141 in communication with the data processing module 143. In addition, in some examples, after the data processing module 143 communicates with the power module 141, the data processing module 143 may also generate and send an excitation signal to the switch chip 1422, thereby maintaining the switch chip 1422 in a closed state.

In some examples, the sensor control device 10 according to the present embodiment may further include a sensor applicator 20, and the sensor control device 10 may be disposed within the sensor applicator 20. Thus, the sensor control device 10 can be conveniently controlled to be placed on the body surface of the host by the sensor applicator 20.

In some examples, the sensor applicator 20 may include a magnet. When the sensor control device 10 has not been applied to the host, the switch module 142 of the electronic module 140 may be in an off state because the electronic module 140 of the sensor control device 10 is now close to the magnet. When the sensor control device 10 is applied to a host, the switch module 142 of the electronic module 140 may be activated to a closed state as the electronic module 140 of the sensor control device 10 is now away from the magnet.

Specifically, when the sensor control device 10 has not been applied to the host, the electronic module 140 may be in an initial mode at this time, i.e., the switch chip 1422 of the switch module 142 may be in an off state, and the hall sensor 1421 may be close to the magnet of the sensor applicator 20 at this time. When the sensor control device 10 is applied to the host, the hall sensor 1421 generates an excitation signal due to a change in magnetic action sensed by the hall sensor 1421 as a result of movement from the magnet near the sensor applicator 20 to the magnet away, and the switching chip 1422 is excited to a closed state by the excitation signal generated by the hall sensor 1421, thereby communicating the power module 141 with the data processing module 143. In addition, in some examples, when the power module 141 communicates with the data processing module 143, the data processing module 143 may also generate and send an excitation signal to the switching chip 1422, thereby maintaining the switching chip 1422 in a closed state.

Additionally, in some examples, the power module 141 of the electronic module 140 may also be configured to provide power to the sensor 110. In some examples, the power module 141 may be disconnected from the sensor 110 when the electronic module 140 is in the initial mode, and the power module 141 may be in communication with the sensor 110 when the electronic module 140 is activated to the operational mode (i.e., the switch module 142 is in the closed state), thereby providing electrical energy to the sensor 110.

In some examples, the sensor control device 10 may be configured to communicate with an external device by wireless communication or wired communication. In this case, by configuring the sensor control device 10 to be communicable with an external device, the analyte information acquired by the sensor 110 can be read in real time or at a fixed timing. In some examples, the external device may be the reading apparatus 2.

Fig. 6 is a schematic diagram showing the structure of the sensor control device 10 provided with a seal according to the example of the present disclosure.

Referring to fig. 6, in some examples, the sensor control apparatus 10 of the present embodiment may further include a sharps module 160 inserted from the top of the electronics housing 120 and extending out of the bottom of the electronics housing 120. In some examples, the tail 112 of the sensor 110 may be configured in a sharps module 160. Thus, the sensor 110 can be conveniently driven by the sharps module 160 to place the sensor 110 into the host.

In some examples, sharps module 160 may include a needle 162. In some examples, grooves may be provided on the needle 162 that extend along the length of the needle 162. The sensor 110 may be at least partially disposed within a recess of the sharps module 160. In this case, the sensor 110 may be received within the recess, thereby enabling the sensor 110 to be conveniently positioned subcutaneously in the host following the sharps module 160.

In some examples, sharps module 160 may include a carrier 161 connected with a needle 162. In some examples, the needle 162 may be assembled in the sensor applicator 20 by the carrier 161.

In some examples, sharps module 160 may include a needle 162 and a carrier 161 connecting needle 162, and tail 112 may be disposed within needle 162. In this case, the assistance of the electronic device housing 120 by the bearing portion 161 can be facilitated to place the needle 162 and the sensor 110 into the host.

In some examples, the carrier 161 may be configured adjacent to a top of the electronic device housing 120. Thereby, the needle 162 and the sensor 110 can be placed in the host by the pushing of the bearing 161.

In some examples, the carrier 161 may include a first portion 1611, a second portion 1612, and a third portion 1613 connected in sequence. In some examples, first portion 1611, second portion 1612, and third portion 1613 may be three columnar structures of different diameters. Additionally, in some examples, the diameter of the second portion 1612 may be less than the diameter of the first portion 1611 and less than the diameter of the third portion 1613, thereby enabling the formation of an annular recess.

In some examples, referring to fig. 6, the first portion 1611 may be configured adjacent to a top of the electronic device housing 120. In other words, the first portion 1611 of the sharps module 160 may be adjacent to or abut the top of the electronic enclosure 120 when the sharps module 160 is loaded onto the top of the electronic enclosure 120. Thus, the electronic device housing 120 can be facilitated to be advanced through the first portion 1611 to position the sensor 110 within the host body.

In some examples, sensor 110 may also include a neck interconnecting head 111 and tail 112. In some examples, the neck may be a bent structure. In this case, one end of the bent neck portion can be connected to the head 111 and extend the head 111 through the bearing portion 161 of the sharps module 160 to be electrically connected with the electronic module 140; at the same time, the other end of the bent neck portion is capable of connecting tail 112 and extending tail 112 into needle 162 of sharps module 160.

In some examples, the sensor control device 10 according to the present embodiment may further include a cap 30 connected to one of the sensor applicator 20 or the sensor control device 10. Thereby, a sealed space can be formed by fitting the sensor applicator 20 or the sensor control device 10 with the cap 30.

In some examples, the shield 150 may be a separate component configured near the electronic device housing 120 or cap 30. Thus, it is possible to facilitate the arrangement of the shield 150 in the vicinity of the electronic device case 120 or the cap 30, and the shield 150 alone can enhance the performance of shielding radiation (electron radiation).

In other examples, the shield 150 may also be formed as part of the electronics housing 120 or cap 30. This can reduce the number of additional components and can save the internal space of the glucose monitoring device 1 or the sensor control device 10.

In some examples, cap 30 may be an applicator cap 30. The applicator cap 30 may be used to cooperate with an applicator to form a sealed space for packaging the sensor control device 10.

In some examples, the connection between the sensor applicator 20 and the applicator cap 30 may be, for example, at least one of threaded, snap-fit, adhesive, and the like.

In some examples, the cap 30 may be a sensor cap 30. The sensor cap 30 may be adapted to cooperate with the sensor control device 10 to form a sealed space for sealing the sensor 110.

In some examples, the connection between the sensor control device 10 and the sensor cap 30 may be, for example, threaded, snap-fit, or the like.

In some examples, the sensor cap 30 may be threaded with the bottom of the electronics housing 120 to seal the sensor 110 within the sealed space formed by the electronics housing 120 and the sensor cap 30. Thus, a bacteria-blocking space can be formed to isolate the external colonies.

In some examples, the sensor cap 30 may be coupled with the sharps module 160 that extends through the electronics housing 120 to seal the sensor 110 within the sealed space formed by the sharps module 160, the electronics housing 120, and the sensor cap 30.

In some examples, the sensor cap 30 may be attached to the bottom of the electronics housing 120, i.e., the sensor cap 30 may be attached to the electronics housing 120 to seal the sharps module 160 and the sensor 110.

In some examples, the shield 150 may be disposed on the electronic device housing 120 parallel and/or perpendicular to the central axis L of the tail 112. Thereby, the shield 150 can be conveniently disposed on the electronic device case 120.

In some examples, the shield 150 may be configured as part of the electronic device housing 120. For example, when the shield 150 is provided to the electronic device housing 120 in a manner perpendicular to the central axis L of the tail portion 112, at least a portion of the bottom of the electronic device housing 120 may be provided as the shield 150.

In some examples, the shield 150 may be disposed on a side of the electronic module 140 when the shield 150 is disposed on the electronic device housing 120 in a manner parallel to the central axis L of the tail 112.

In some examples, referring to fig. 6, the sensor control device 10 may further include a first seal 171 for sealing an interface where the carrier portion 161 of the sharps module 160 and the electronics housing 120 are located. Thereby, the interface between the head 111 and the electronic device case 120 can be sealed easily. In other words, in this case, the needle-like portion 162 inserted into the electronic device case 120 can be contained in the sealed space formed by the bearing portion 161 and the electronic device case 120.

In some examples, referring to fig. 6, the sensor control device 10 may further include a second seal 172 for sealing the interface where the cap 30 and the electronics housing 120 are located. Thereby, the interface between the cap 30 and the electronic device housing 120 can be sealed conveniently.

In some examples, the first seal 171 and the second seal 172 may be sealing gaskets or O-rings, or the like.

In some examples, the cap 30 described above may be a sensor cap 30. That is, when the sensor cap 30 is connected to the bottom of the electronic device housing 120 or the carrying portion 161 of the sharps module 160, the second seal 172 may be provided at the connection of the sensor cap 30 to the bottom of the electronic device housing 120 or the carrying portion 161 of the sharps module 160. In this case, the interface between the sensor cap 30 and the bottom of the electronic device case 120 can be sealed by the second seal 172, and the needle 162 and the sensor 110 provided in the needle 162 can be contained in the sealed space formed by the bottom of the electronic device case 120 and the sensor cap 30.

In the above example, the needle 162 and the sensor 110 may be contained within the sealed space formed by the carrier 161, the electronic device housing 120, and the sensor cap 30 using the first seal 171 and the second seal 172. In this case, after the sensor control device 10 is assembled and sealed, the entire assembled sensor control device 10 can be subjected to radiation sterilization.

More specifically, after the electronic module 140, the electronic device housing 120, the sharps module 160, the sensor 110, the first seal 171, and the second seal 172 are assembled into the sensor control device 10, the sensor control device 10 may be entirely removed for radiation sterilization. In this example, the electronic module 140 is enclosed within the electronic device housing 120, and the electronic device housing 120 can be part of a sealed or sterile space after sterilization.

In some examples, the head 111 of the sensor 110 may extend through the carrier 161 and be secured to an inner surface of the electronic device housing 120. Thus, the head 111 of the sensor 110 can be easily extended out of the bearing 161, and the sensor 110 can be fixed to the inner surface of the electronic device case 120.

In some examples, the head 111 extending into the electronic device housing 120 may be secured by an internal surface structure (e.g., a raised structure such as a flange, bump, etc.) of the electronic device housing 120.

Referring to fig. 7, in addition to the above-described example, it is more preferable that the needle-shaped portion 162 of the sharps module 160 and the tail portion 112 of the sensor 110 be contained in a sealed space formed by the internal passage 123 of the electronic device housing 120 defined by the carrying portion 161 of the sharps module 160, the top of the electronic device housing 120, the bottom of the electronic device housing 120, the sensor cap 30, the first through hole 1210, and the second through hole 1220 (described later). In other words, the internal passage 123 of the electronic device housing 120 defined by the bearing portion 161, the sensor cap 30, the first through hole 1210, and the second through hole 1220 (described later) may serve as a sealing assembly to seal the needle portion 162 and the tail portion 112 of the sensor 110.

In other words, the internal passage 123 of the electronic device housing 120 defined by the first through hole 1210 and the second through hole 1220 may be a part of the sealed space to be isolated from the internal space of the electronic device housing 120 (i.e., the space containing the electronic module 140). In this case, the needle 162 and the sensor 110 can be better sealed, the influence of the environment of the inner space of the electronic device housing 120 on the needle 162 and the sensor 110 can be avoided, or the propagation of transmissible factors (for example, fungi, bacteria, and viruses) that may exist in the inner space of the electronic device housing 120 to the needle 162 and the sensor 110 can be better avoided.

In some examples, the internal channel 123 may be formed by an internal surface structure of the electronic device housing 120, and the internal surface structure may be an internal surface structure formed at the first through hole 1210 and/or the second through hole 1220.

In other examples, the internal channel 123 may also be formed from a separate component from the electronic device housing 120. In some examples, the separate construct may be a plug that fits between the first channel 1210 and the second channel 1220.

In some examples, referring to fig. 7, the electronic device housing 120 may include an upper case 121 and a lower case 122 cooperatively connected with the upper case 121. In some examples, the mating connection of the upper shell 121 and the lower shell 122 may be at least one of a snap fit, an adhesive, an ultrasonic weld.

In some examples, the upper and lower shells 121, 122 may conform in shape, e.g., the upper and lower shells 121, 122 may be of a circular, oval, square, rectangular half-shell configuration, and may form a sealed cavity when the two are combined to house the electronic module 140 and the sensor 110.

In some examples, the upper case 121 may have a first through hole 1210 and the lower case 122 may have a second through hole 1220 aligned with the first through hole 1210. In other words, the first through hole 1210 and the second through hole 1220 may have the same size.

In some examples, the sharps module 160 may pass through the first through hole 1210 and the second through hole 1220. In other words, the needle portion 162 of the sharps module 160 may pass through the first through hole 1210 and the second through hole 1220 and partially expose the second through hole 1220, and the bearing portion 161 of the sharps module 160 may be located on the first through hole 1210 and abut against the outer surface of the upper case 121. In some examples, referring to fig. 6, the first portion 1611 of the bearing 161 may be located at the first through hole 1210 and abut against the outer surface of the upper case 121.

In some examples, the carrier 161 of the sharps module 160 may further include a fourth portion 1614 for threading the sensor 100. In other words, the tail 112 of the sensor may penetrate into the fourth portion 1614 of the carrier 161 and extend toward the needle 162. In some examples, fourth portion 1614 of carrier 161 may be used primarily to carry needles 162.

In some examples, the fourth portion 1614 of the carrier 161 (the portion that leaks out of the lower shell 122) may be provided with a connection structure that connects with the sensor cap 30. In some examples, fourth portion 1611 may at least partially pass through the bottom of electronics housing 120 when sharps module 160 is inserted through the bottom of electronics housing 120, and sensor cap 30 may be configured on a connection structure to seal needle 162 and sensor 110 in sensor cap 30.

In some examples, the connection structure may be threaded, and correspondingly, internal threads may be provided on the inner ring of the sensor cap 30, and the connection of the sensor cap 30 to the sharps module 160 may be a threaded connection. Thus, the sensor cap 30 can be connected to the sharps module 160 by a threaded connection.

In some examples, the radial dimension of the first portion 1611 may be greater than the radial dimension of the first and second through holes 1210, 1220, and the radial dimension of the first and second through holes 1210, 1220 may be greater than the radial dimension of the fourth portion 1614. In this case, the fourth portion 1614 can extend through the first through hole 1210 and toward the second through hole 1220, i.e., the fourth portion 1614 can extend through the internal passage 123 of the electronic device housing 120.

Referring to fig. 8, in other examples, the electronic device housing 120 may have a boss structure.

In some examples, the boss structure may be a boss structure (e.g., the first boss structure 1201) of the upper case 121 extending to the lower case 122. In some examples, the boss structure may be a boss structure extending at the first through hole 1210 of the upper case 121 to the second through hole 1220 of the lower case 122, in other words, the boss structure may define the first through hole 1210 and the internal passage 123.

In some examples, the boss structure may be one of a cylinder, a cube, a cuboid, etc.

In such an example as described above, the sensor 110 may be secured to the upper case 121 by grooves or through holes in the boss structure. In some examples, grooves or through holes may be reserved or etched in the surface of the boss structure that may ensure that the head 111 of the sensor 110 may pass through.

In such an example as described above, the second seal 172 may be disposed between the sensor cap 30 and the lower portion of the boss structure. In this case, it is possible to conveniently include the needle 162 and the sensor 110 in the sealed space defined by the bearing 161, the first seal 171, the boss structure of the upper case 121, the second seal 172, and the sensor cap 30.

In other examples, the boss structure may also be a boss structure (such as the second boss structure 1202) of the lower shell 122 that extends to the upper shell 121. In some examples, the boss structure may be a boss structure extending at the second through hole 1220 of the lower case 122 to the first through hole 1210 of the upper case 121, in other words, the boss structure may define the second through hole 1220 and the internal passage 123.

Under such an example as described above, the sensor 110 may be secured to the lower housing 122 by grooves or through holes in the boss structure.

In such an example as described above, the first seal 171 may be disposed between the sensor cap 30 and the upper portion of the boss structure. In this case, it is possible to conveniently include the needle 162 and the sensor 110 in the sealed space defined by the bearing 161, the first seal 171, the boss structure of the lower case 122, the second seal 172, and the sensor cap 30.

In some examples, dispensing may be performed between the head 111 of the sensor and the boss structure to seal a gap therebetween.

Referring again to fig. 8, in other examples, the upper case 121 and the lower case 122 may have both boss structures (or, the upper case 121 may have a first boss structure 1201 and the lower case 122 may have a second boss structure 1202. The first boss structure 1201 of the upper case 121 may define a first through hole 1210 and the second boss structure 1202 of the lower case 122 may define a second through hole 1220).

The first and second boss structures 1201 and 1202 may simultaneously define the internal passage 123. The head 111 of the sensor may pass between the first and second boss structures 1201, 1202. The first boss 1201 and the second boss 1202 may be used to secure the head 111 of the sensor. In some examples, glue may be dispensed between the first land 1201, the second land 1202, and the head 111 of the sensor 110 to seal a gap existing therebetween.

In some examples, the head 111 may extend through the fourth portion 1614 of the carrier 161 and be secured to an inner surface of the electronic device housing 120. Thereby, the sensor 110 can be easily extended and leaked out of the fourth portion 1614 of the carrying portion 161, and the sensor 110 can be fixed to the inner surface of the electronic device case 120. And as described above, the inner surface of the electronic device housing 120 may be provided with a protrusion that may secure the head 111 and that may be configured away from the internal channel 123.

In some examples, the applicator cap 30 may be included as part of the sealed space. That is, the sharps module 160, electronics housing 120, and applicator cap 30 may be combined into a sealed assembly and form a sealed space. The sharps module 160, sensor, electronics housing 120, applicator cap 30 may be assembled for sterilization. In such an example, the shield 150 may be disposed at least near the applicator cap 30 or formed at least as part of the applicator cap 30.

In some examples, the electronic device housing 120 may also be formed for at least three shell structures. In some examples, the electronic device housing 120 may include three shell structures, such as a first shell structure, a second shell structure, and a third shell structure, respectively.

In some examples, the first housing structure may be part of the upper or lower housing 121, 122, and the first housing structure may be used to define at least a portion of the internal passage 123. The first housing structure may form the upper case 121 or the lower case 122 together with the second housing structure, and correspondingly, the third housing structure may be separately used to form the lower case 122 or the upper case 121. In this case, the first and third housing structures may collectively define the internal passage 123 and can form a sealed assembly with the sharps module 160, the sensor cap 30, and collectively form a sealed space.

As described above, after the seal assembly is sealed by means of the first seal 171 and/or the second seal 172, the sensor 110 and the needle 162 may be sealed in the sealed space formed by the seal assembly. And after sealing is complete, the seal assembly may be radiation sterilized.

Fig. 9 is a schematic diagram showing one example of sterilizing the sensor control device 10 according to the example of the present disclosure. Fig. 10 is a schematic diagram showing another example of sterilizing the sensor control device 10 according to the example of the present disclosure.

Referring to fig. 9 and 10, the present disclosure also provides a method of sterilizing a glucose monitoring device 1, which may be performed based on the glucose monitoring device 1 or the sensor control device 10 described above.

The method may include: the tail 112 is sterilized by irradiating the tail 112 with radiation in a direction perpendicular to the tail 112 and/or parallel to the central axis L of the tail 112.

In the present disclosure, in the case where the electronic module 140 is disposed at a side far from the central axis L of the tail 112, the radiation irradiates the tail 112 in a direction parallel to the central axis L of the tail 112, so that the radiation can be sufficiently irradiated to the tail 112 without deviating from the tail 112 to irradiate to the electronic module 140, thereby reducing the influence of the radiation on the performance of the electronic module 140, and further, by disposing the shield 150 for shielding the electronic radiation between the electronic module 140 and the tail 112, the influence of the radiation on the performance of the electronic module 140 due to the refraction or scattering of the electronic device case 120 can be reduced.

Of course, in some example examples, radiation may also be directed at tail 112 in directions other than perpendicular to tail 112 and/or parallel to central axis L of tail 112 to sterilize tail 112. For example, the radiation may be directed obliquely to the tail 112 at an angle (any angle between 0 ° and 90 °) to the central axis L of the tail 112. Thus, the radiation direction requirement can be reduced. Meanwhile, in this case, any angle of radiation between 0 ° and 90 ° is also allowable due to the presence of the shield 150.

In the present disclosure, in the case where the electronic module 140 is disposed at a side far from the central axis L of the tail 112, the radiation irradiates the tail 112 in a direction perpendicular to the central axis L of the tail 112, so that the radiation can be sufficiently irradiated to the tail 112 without deviating from the tail 112 to irradiate to the electronic module 140, thereby reducing the influence of the radiation on the performance of the electronic module 140, and further, by disposing the shield 150 for shielding the radiation between the electronic module 140 and the tail 112, the influence of the radiation on the performance of the electronic module 140 due to the refraction or scattering of the electronic device case 120 can be reduced.

Referring to fig. 9, in some examples, electron radiation may be directed at tail 112 in a direction perpendicular to a central axis L of tail 112 to sterilize tail 112. In such an example, the shield 150 may be configured or formed on the bottom of the electronics housing 120 or the applicator cap 30. Thereby, irradiation of the electronic module 140 with a part of the radiation can be prevented, and thus the influence of the radiation on the performance of the electronic module 140 can be avoided. And in this case, the tail 112 can be sterilized more conveniently without affecting the performance of the electronic module 140.

Referring to fig. 10, in some examples, electron radiation may be directed at tail 112 in a direction parallel to a central axis L of tail 112 to sterilize tail 112. In this example, the shield 150 may be configured or formed on the electronics housing 120 or the applicator cap 30 parallel to the central axis L of the tail 112. Thereby, irradiation of the electronic module 140 with a part of the radiation can be prevented, and thus the influence of the radiation on the performance of the electronic module 140 can be avoided. In this case, the importance of the electronic module 140 being far from the central axis L of the tail 112 can be shown, and in general, the further the electronic module 140 is far from the central axis L of the tail 112, the better the sterilization of the tail 112 by the radiation is achieved, and the less the performance of the electronic module 140 is affected by the radiation.

In some examples, the radiation may be directed at tail 112 in a direction perpendicular to tail 112 and parallel to a central axis L of tail 112 to sterilize tail 112. Thus, the tail 112 can be sterilized more sufficiently. In this example, the shield 150 may be configured or formed on the bottom of the electronics housing 120 or the applicator cap 30, as well as parallel to the central axis L of the tail 112. Thereby, the influence of radiation on the performance of the electronic module 140 can be avoided.

The specific structural configuration or each modification of the glucose monitoring device 1 or the sensor control device 10 described in the present method may refer to the content of the glucose monitoring device 1 or the sensor control device 10, and will not be described herein.

In some examples, the sensor control device 10 may be separately sterilized by electron radiation and then the sensor control device 10 is loaded between the sensor applicator 20 and the cap 30 to form the complete glucose monitoring device 1. More specifically, the needle 162 and the tail 112 of the sensor 110 in the sensor control device 10 may be separately sterilized by electron radiation, the sensor cap 30 may be loaded on the bottom of the electronics housing 120, and the sensor control device 10 may be loaded between the sensor applicator 20 and the applicator cap 30.

In other examples, needle 162 and sensor tail 112 portions of sensor control device 10 may be electron radiation sterilized after glucose monitoring device 1 is completed. In such an example, a portion of the applicator cap 30 may be configured as a material that allows electron radiation to pass through.

According to the present disclosure, a glucose monitoring device 1 and a method of sterilizing a glucose monitoring device 1 are provided that are capable of sufficiently sterilizing a sensor 110 without damaging the effectiveness of an electronic module 140.

While the disclosure has been described in detail in connection with the drawings and examples, it is to be understood that the foregoing description is not intended to limit the disclosure in any way. Modifications and variations of the present disclosure may be made as desired by those skilled in the art without departing from the true spirit and scope of the disclosure, and such modifications and variations fall within the scope of the disclosure.

Claims

1. A glucose monitoring device comprising a sensor control device comprising an electronics housing, an electronics module disposed within the electronics housing, and a sensor coupled to the electronics module, the sensor comprising a head disposed within the electronics housing and coupled to the electronics module and a tail extending out of the electronics housing, the glucose monitoring device comprising: the electronic module is arranged remote from the centre axis of the tail and a shield for shielding radiation is arranged between the electronic module and the tail.

2. The glucose monitoring device of claim 1, wherein the glucose monitoring device comprises a sensor,

also included is a sensor applicator within which the sensor control device is disposed.

3. The glucose monitoring device of claim 1, wherein the glucose monitoring device comprises a sensor,

the sensor control device further includes a sharps module inserted from a top of the electronics housing and extending out of a bottom of the electronics housing, the tail being disposed in the sharps module.

4. The glucose monitoring device of claim 1, wherein the glucose monitoring device comprises a sensor,

the electronic module is disposed at a periphery away from a central axis of the tail portion.

5. A glucose monitoring device according to claim 3, wherein,

the sharp object module comprises a needle-shaped part and a bearing part connected with the needle-shaped part, and the tail part is configured in the needle-shaped part.

6. The glucose monitoring device of claim 1, wherein the glucose monitoring device comprises a sensor,

a shield is disposed on the electronic device housing parallel and/or perpendicular to the central axis of the tail portion.

7. The glucose monitoring device of claim 5, wherein the glucose monitoring device comprises a sensor,

The sensor control device further comprises a first sealing element for sealing an interface between the bearing part of the sharp object module and the electronic equipment shell.

8. The glucose monitoring device of claim 5, wherein the glucose monitoring device comprises a sensor,

the sensor control device further includes a second seal for sealing an interface between the cap and the electronics housing.

9. The glucose monitoring device of claim 5, wherein the glucose monitoring device comprises a sensor,

the head portion extends through the carrier portion and is secured to an inner surface of the electronic device housing.

10. A method of sterilizing a glucose monitoring device as set forth in claim 1, wherein,

comprising the following steps: the tail is irradiated with radiation in a direction perpendicular to the tail and/or parallel to the central axis of the tail.