Background
Hydrogen is considered as one of future alternative fuels at present, and has the advantages of high heat value, no environmental pollution of products, rich raw material sources and the like. The main sources of hydrogen are fossil fuel production and industrial by-product gas recovery, which can contain some amount of CO. In most reactions involving hydrogen, CO is a detrimental impurity whose concentration must be limited, particularly in hydrogen fuel cells using H 2 At this time, the CO concentration is required to be lower than 0.2ppm because a trace amount of CO can poison the anode catalyst in the hydrogen fuel cell. Meanwhile, a large amount of CO gas such as coke oven gas, blast furnace gas, calcium carbide furnace tail gas, yellow phosphorus tail gas and the like is also contained in many industrial waste gases, and if CO in the waste gases is directly discharged into the atmosphere without being separated and purified, the environment is seriously polluted, and precious CO resources are wasted. Among them, pressure Swing Adsorption (PSA) and Temperature Swing Adsorption (TSA) are widely used for CO removal and purification due to low energy consumption and simple operation.
The key to the adsorptive separation technique is the development of efficient adsorbents. In recent years, technology for separating CO by pi-complex adsorption has been rapidly developed. The technology is carried out by the active ingredient (Cu + Or Ag + ) Pi-complexation interactions with CO to effect gas separation. The technology combines the adsorption separation process with pi-complexation reversible characteristic, has the advantages of both, improves adsorption selectivity, and can regenerate the adsorbent and recycle the product gas by simple engineering methods such as pressure reduction or temperature increase.
Chinese patent CN 86102838A, CN 103418337A and CN 110652960A respectively describe a CO adsorbent, its preparation method and application, and specifically, the method is to load monovalent copper compound on a carrier with high specific surface area, in order to obtain samples with large adsorption capacity, a large amount of CuCl is required to be loaded, and in the actual adsorption process, cu is mainly used + Is effective to cause Cl - Waste and pollution of (c).
Solid state ion exchange preparation of Cu (I) molecular sieves the progress of research (chemical progress, ticket 31, 9, pages 1950-1956) describes the reaction principle of solid state ion exchange preparation of Cu (I) type molecular sieves, the influence of the preparation conditions, and the use of Cu (I) type molecular sieves of different structures. Indicating that two roasting temperature ranges exist in the preparation process; one is a higher temperature zone, mainly the copper precursor and the molecular sieve are subjected to solid ion exchange reaction; the other is a high temperature zone, mainly the exchange of copper ions with hydroxyl groups on the surface of the molecular sieve.
Disclosure of Invention
The invention aims at overcoming the defects of the prior art and provides a high-efficiency low-chlorine CO adsorbent and a preparation method thereof.
The first aspect of the invention provides a method for preparing a low-chlorine CO adsorbent, comprising the following steps:
(1) Uniformly mixing HY molecular sieve raw powder and CuO according to a certain proportion;
(2) Roasting the powder obtained in the step (1) to obtain a CuY carrier;
(3) Uniformly mixing the CuY carrier obtained in the step (2), cuCl, a binder and an auxiliary agent, adding deionized water for kneading, and extruding and molding wet materials after kneading;
(4) And (3) drying the adsorbent molded body obtained in the step (3), and roasting in an inert atmosphere to obtain the low-chlorine CO adsorbent.
In the step (1), the addition amount of CuO is 1% -25% based on the weight of the HY molecular sieve raw powder. The HY molecular sieve selects the conventional HY molecular sieve in the field, and the silicon aluminum (namely SiO) 2 /Al 2 O 3 ) Molar ratios are well known to those skilled in the art. For example, siO of HY molecular sieve 2 /Al 2 O 3 The molar ratio is generally 3-6, na 2 The mass fraction of O is lower than 1%.
Further, the roasting conditions in the step (2) are as follows: the roasting temperature is 500-750 ℃, and the roasting time is generally 1-16 h. Specifically, the firing temperature may be 500 ℃, 510 ℃, 520 ℃, 530 ℃, 540 ℃, 550 ℃, 600 ℃, 650 ℃, 660 ℃, 670 ℃, 680 ℃, 690 ℃, 700 ℃, or any value within any two ranges of these values. The invention does not require the roasting atmosphere.
Further, the adding mass ratio of the CuY carrier, the CuCl, the binder and the auxiliary agent in the step (3) is the conventional ratio in the field. Based on the weight of the CuY carrier, the addition amount of CuCl is 10-50%, the addition amount of the binder is 10-30%, and the addition amount of the auxiliary agent is 0.5-5%. The weight ratio of deionized water to solid material is generally 0.4-0.6:1, preferably 0.48-0.56:1. The binder is typically clay. The clay is one or more of kaolin, bentonite, attapulgite, sheep liver soil and diatomite. The auxiliary agent is one or more of starch, sesbania powder, sodium carboxymethyl cellulose and tannin extract.
Further, the drying conditions of step (4) are conventional conditions in the art: the drying temperature is 50-150 ℃ and the drying time is 1-24 hours; the roasting conditions are as follows: the roasting temperature is 250-450 ℃, and the roasting time is generally 2-12 h; inert atmosphere of N 2 Ar or He.
In the invention, after mixing HY molecular sieve raw powder and CuO, roasting at high temperature, wherein hydroxyl in the HY molecular sieve can exchange with CuO to obtain Cu ions of exchange sites to enter the framework cage of the Y molecular sieve; and kneading the obtained CuY carrier with CuCl, a binder, an auxiliary agent, deionized water and the like, forming, drying, and roasting in an inert atmosphere to obtain the low-chlorine CO adsorbent with improved effective Cu loading.
According to a second aspect of the present invention there is also provided a low chlorine CO adsorbent prepared by the method as hereinbefore described.
Further, in the low-chlorine CO adsorbent: cu exists in the form of II valence and I valence, the content of Cu is 5% -40% in terms of elements, and the mol ratio of Cl/Cu element is 0.25-0.98.
Further, the low chlorine CO adsorbent produced by the method of the present invention requires reduction prior to use. The reduction reaction is a conventional procedure in the art. Typical reduction operations: adopts N containing CO 1v% to 5v% 2 And reducing for 2-48 hours at 120-200 ℃ in the atmosphere.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the method, cuO and HY molecular sieve raw powder are roasted at high temperature, and CuO and hydroxyl groups in the HY molecular sieve are exchanged to obtain Cu (II) ions (Cu (II) ions of exchange sites enter the Y molecular sieve framework cage), and when CuCl is loaded, the loading amount of CuCl can be effectively reduced, and meanwhile, the adsorption capacity is higher. The inventors speculate that the cause is: because the radius of Cu ions is larger than that of hydrogen ions, when the Cu ions firstly enter the HY molecular sieve exchange position, then CuCl is loaded, and the CuCl does not enter the framework cage again when being dispersed, but is dispersed on the inner surface or the outer surface of the HY molecular sieve pore canal in a single layer, so that the utilization rate of the CuCl is improved, and the Cu ions in the framework cage can be reduced to adsorb CO, and have better CO complexing effect than the CuCl on the inner surface and the outer surface of the pore canal. Therefore, the CO adsorption capacity of the adsorbent can be improved by a method of solid ion exchange and solid dispersion.
2. The invention has no discharge of waste water and waste gas in the whole process of preparing the CO adsorbent. The hydroxyl groups in the HY molecular sieve are exchanged with CuO, and only water is generated in the process (in the prior art, the HY molecular sieve and CuCl 2 Or Cu (NO) 3 ) 2 HCl and NO are produced when solid state ion exchange is performed 2 ) In the conventional preparation of CuY, liquid ion exchange, e.g. CuCl 2 And Cu (NO) 3 ) 2 Solutions, in which large amounts of wastewater containing chloride ions and nitrate are produced. The method of the invention also does not produce waste water discharge in the subsequent kneading, forming, drying and roasting processes. Meanwhile, the invention also effectively reduces the Cl load on the catalyst due to the reduction of the CuCl load.
Detailed Description
The method of the present invention will be further described with reference to specific examples.
In the examples and comparative examples, the CO adsorption amount of the CO adsorbent was measured by a volumetric method under a test condition of 25 ℃ and a standard atmospheric pressure; the copper and chlorine content was measured by X-ray fluorescence spectroscopy (XRF), and the Cu/Cl molar ratio was calculated. Before testing, the CO adsorbent needs to be subjected to pre-reduction treatment under the following reduction conditions: by usingN containing 1% -5% of CO 2 And (3) reducing for 2-48 h at 150 ℃.
Example 1
Mixing 100gHY molecular sieve raw powder and 1g of CuO, placing the mixture in a muffle furnace for roasting at 550 ℃ for 16 hours after uniformly mixing to obtain a CuY carrier; mixing CuY carrier with 50g of CuCl,20g of kaolin and 0.5g of sesbania powder, fully kneading the uniformly mixed material with 60g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 50 ℃ for 24 hours, drying the dried strip adsorbent at 350 ℃ and N 2 Roasting for 6 hours in the atmosphere to obtain the CO adsorbent.
Example 2
Mixing 100gHY molecular sieve raw powder and 25g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 750 ℃, the roasting time is 2h, obtaining a CuY carrier, mixing the CuY carrier with 10g of CuCl,11g of attapulgite and 2g of starch, fully kneading the uniformly mixed material with 54g of water, adding the uniformly kneaded dough into a bar extruder for bar extrusion, drying the obtained bar adsorbent at 150 ℃ for 1h, and roasting the dried bar adsorbent at 400 ℃ for 2h under Ar atmosphere to obtain the CO adsorbent.
Example 3
Mixing 100gHY molecular sieve raw powder and 10g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 650 ℃, the roasting time is 6h, obtaining a CuY carrier, mixing the CuY carrier with 30g of CuCl,15g of bentonite and 5g of sodium carboxymethyl cellulose, fully kneading the uniformly mixed material with 54g of water, adding the uniformly kneaded dough into a bar extruder for bar extrusion, drying the obtained bar adsorbent at 150 ℃ for 1h, and roasting the dried bar adsorbent at 400 ℃ for 2h under the He atmosphere, thereby obtaining the CO adsorbent.
Example 4
Mixing 100gHY molecular sieve raw powder and 15g CuO, placing the mixture in a muffle furnace for roasting at 720 ℃ for 4 hours to obtain a CuY carrier, mixing the CuY carrier with 35g of CuCl and 10g of goat liver soil,Mixing 10g of diatomite and 2g of tannin extract, fully kneading the uniformly mixed materials with 52g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip-shaped adsorbent at 100 ℃ for 10 hours, drying the dried strip-shaped adsorbent at 350 ℃ and N 2 Roasting for 12 hours in the atmosphere to obtain the CO adsorbent.
Example 5
Mixing 100gHY molecular sieve raw powder and 5g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 670 ℃, the roasting time is 10 hours, obtaining a CuY carrier, mixing the CuY carrier with 50g of CuCl,10g of kaolin, 12g of kieselguhr, 4g of sesbania powder and 0.5g of tannin extract, fully kneading the uniformly mixed materials with 61g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 120 ℃ for 10 hours, and roasting the dried strip adsorbent at 370 ℃ for 10 hours in Ar atmosphere, thereby obtaining the CO adsorbent.
Example 6
Mixing 100gHY molecular sieve raw powder and 5g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 670 ℃, the roasting time is 10 hours, obtaining a CuY carrier, mixing the CuY carrier with 50g of CuCl,20g of kaolin, 10g of kieselguhr, 4g of sesbania powder and 0.5g of tannin extract, fully kneading the uniformly mixed materials with 63g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 120 ℃ for 10 hours, and roasting the dried strip adsorbent at 370 ℃ for 10 hours in Ar atmosphere, thereby obtaining the CO adsorbent.
Example 7
Mixing 100gHY molecular sieve raw powder and 5g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 670 ℃, the roasting time is 10 hours, obtaining a CuY carrier, mixing the CuY carrier with 50g of CuCl,20g of kaolin, 10g of kieselguhr, 4g of sesbania powder and 0.5g of tannin extract, fully kneading the uniformly mixed materials with 63g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 120 ℃ for 10 hours, and roasting the dried strip adsorbent at 250 ℃ for 12 hours under Ar atmosphere to obtain the CO adsorbent.
Example 8
Mixing 100gHY molecular sieve raw powder and 25g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 740 ℃, the roasting time is 8 hours, obtaining a CuY carrier, mixing the CuY carrier with 45g of CuCl,15g of kaolin, 5g of diatomite, 5g of attapulgite, 2g of sesbania powder and 1.5g of sodium carboxymethyl cellulose, fully kneading the uniformly mixed material with 64g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 110 ℃ for 10 hours, and drying the dried strip adsorbent at 360 ℃ under N 2 Roasting for 6 hours in the atmosphere to obtain the CO adsorbent.
Example 9
Mixing 100gHY molecular sieve raw powder and 25g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 740 ℃, the roasting time is 8 hours, obtaining a CuY carrier, mixing the CuY carrier with 35g of CuCl,20g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed material with 54g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent for 10 hours at 100 ℃, and drying the dried strip adsorbent for N at 350 DEG C 2 Roasting for 8 hours in the atmosphere to obtain the CO adsorbent.
Example 10
Mixing 100gHY molecular sieve raw powder and 25g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 740 ℃, the roasting time is 8 hours, obtaining a CuY carrier, mixing the CuY carrier with 25g of CuCl,20g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed material with 59g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent for 10 hours at 110 ℃, and drying the dried strip adsorbent for N at 350 DEG C 2 Roasting for 6 hours in the atmosphere to obtain the CO adsorbent.
Example 11
Mixing 100gHY molecular sieve raw powder and 1gCuO, placing into a muffle furnace for bakingCalcining at 720 ℃ for 8 hours to obtain a CuY carrier, mixing the CuY carrier with 10g of CuCl,20g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed materials with 59g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 110 ℃ for 10 hours, and drying the dried strip adsorbent at 320 ℃ for N 2 Roasting for 6 hours in the atmosphere to obtain the CO adsorbent.
Example 12
Mixing 100gHY molecular sieve raw powder and 25g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 730 ℃, the roasting time is 10 hours, obtaining a CuY carrier, mixing the CuY carrier with 50g of CuCl,10g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed material with 61g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 110 ℃ for 10 hours, and drying the dried strip adsorbent at 300 ℃ and N 2 Roasting for 8 hours in the atmosphere to obtain the CO adsorbent.
Comparative example 1
Mixing 100gHY molecular sieve raw powder and 50g of CuO, placing the mixture in a muffle furnace for roasting after uniform mixing, wherein the roasting temperature is 740 ℃, the roasting time is 8 hours, obtaining a CuY carrier, mixing the CuY carrier with 20g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed material with 59g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 110 ℃ for 10 hours, and drying the strip adsorbent at 350 ℃ and N 2 Roasting for 6 hours in the atmosphere to obtain the CO adsorbent.
Comparative example 2 (comparison with example 9)
Mixing 100gHY molecular sieve raw powder with 60g of CuCl,20g of kaolin, 5g of attapulgite and 2g of sesbania powder, fully kneading the uniformly mixed material with 54g of water, adding the uniformly kneaded dough into a strip extruder for strip extrusion, drying the obtained strip adsorbent at 100 ℃ for 10 hours, drying the dried strip adsorbent at 350 ℃ and N 2 Roasting for 8 hours in the atmosphere to obtain the CO adsorbent.
The properties and Cl contents of the adsorbents prepared in examples and comparative examples are shown in table 1.
TABLE 1