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CN116462186A - Monochiral and close-packed carbon tube array thin film and its preparation method - Google Patents

Monochiral and close-packed carbon tube array thin film and its preparation method Download PDF

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CN116462186A
CN116462186A CN202310517901.7A CN202310517901A CN116462186A CN 116462186 A CN116462186 A CN 116462186A CN 202310517901 A CN202310517901 A CN 202310517901A CN 116462186 A CN116462186 A CN 116462186A
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substrate
tube array
carbon
nano catalyst
growth
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史志文
陈佳俊
陈一
张智淳
吕博赛
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Shanghai Jiao Tong University
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    • C01B32/00Carbon; Compounds thereof
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    • C01B32/158Carbon nanotubes
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    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
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    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
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Abstract

本发明提供一种单一手性且密排的碳管阵列薄膜及其制备方法,该薄膜包括:若干根呈平行排列的单壁碳管;其中,单壁碳管的直径为1nm~2nm;相邻两单壁碳管之间的间距为0.3nm~0.4nm。本发明的碳管阵列薄膜面积可任意选择;性能优异,载流子迁移率大于4000cm2V‑1S‑1,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm;制备方法操作简单、成本低廉且可以大规模生产。

The invention provides a single-chiral and densely packed carbon tube array film and a preparation method thereof. The film comprises: a plurality of single-walled carbon tubes arranged in parallel; wherein, the diameter of the single-walled carbon tubes is 1 nm to 2 nm; and the distance between two adjacent single-walled carbon tubes is 0.3 nm to 0.4 nm. The area of the carbon tube array thin film of the present invention can be selected arbitrarily; the performance is excellent, the carrier mobility is greater than 4000cm 2 V ‑1 S ‑1 , the on-state current density is greater than 1mA/μm, and the current carrying capacity is greater than 8mA/μm; the preparation method is simple to operate, low in cost and can be produced on a large scale.

Description

单一手性且密排的碳管阵列薄膜及其制备方法Monochiral and close-packed carbon tube array thin film and its preparation method

技术领域technical field

本发明属于纳米材料技术领域,特别是涉及一种单一手性且密排的碳管阵列薄膜及其制备方法。The invention belongs to the technical field of nanometer materials, and in particular relates to a monochiral and densely arranged carbon tube array film and a preparation method thereof.

背景技术Background technique

单壁碳纳米管(SWCNTs)具有独特的一维中空管状结构和优异的性能,其宽谱响应、高光吸收系数使其成为未来碳基高性能器件的材料基础之一,其独特的一维中空管状结构使其具备优异的电学、热学、力学特性,潜在应用范围涉及电子器件、能量储存、光电传感、柔性显示、生物医药、复合材料等。但是碳纳米管在电子器件中获得广泛应用的前提是实现其宏量可控制备。Single-walled carbon nanotubes (SWCNTs) have a unique one-dimensional hollow tubular structure and excellent performance. Its wide-spectrum response and high light absorption coefficient make it one of the material foundations for future carbon-based high-performance devices. Its unique one-dimensional hollow tubular structure enables it to have excellent electrical, thermal, and mechanical properties. However, the prerequisite for the widespread application of carbon nanotubes in electronic devices is to realize their macro-controllable preparation.

在本世纪初,SWCNTs主要还是基于CVD生长的单根碳管,做场效应晶体管的演示,那时候主要待解决的问题是如何提高单根碳管的器件质量,比如用不同功函数的金属做接触。当接触问题被解决后,基于碳管薄膜制备大规模器件的研究逐渐变多,但是由于碳管薄膜中碳管的取向极大地影响了碳管器件的性能,只有当器件沟道中的碳管完全平行时,器件才会获得最优的性能。于是才开始致力于获得基于平行排列碳管得到的薄膜。目前主要通过以下两条路径实现:一是直接在衬底上生长碳管薄膜;二是通过一系列后处理方法将独立的碳管组装成准直的薄膜。在技术应用中,每个晶体管需要数个并行的单壁碳管通道,为了超越硅基互补金属氧化物半导体(Si-CMOS)的性能,Patil等人预测单壁碳管密度必须大于每平方微米250根管子。此外,射频应用、塑料电子、显示技术、传感器和电极等领域也需要高密度的大规模平行单壁碳管阵列。理想的碳管薄膜应该是手性单一、完全准直的密排单壁碳管阵列薄膜,理想的碳管薄膜甚至可以被称为碳管晶体,但是这种完美的碳管薄膜目前还未能可控制备。At the beginning of this century, SWCNTs were mainly based on CVD-grown single carbon tubes for the demonstration of field effect transistors. At that time, the main problem to be solved was how to improve the device quality of single carbon tubes, such as using metals with different work functions as contacts. After the contact problem was solved, researches on the preparation of large-scale devices based on carbon tube films gradually increased. However, since the orientation of carbon tubes in carbon tube films greatly affects the performance of carbon tube devices, only when the carbon tubes in the device channel are completely parallel can the device achieve optimal performance. Then began to work on obtaining thin films based on parallel arrangement of carbon tubes. At present, it is mainly achieved through the following two paths: one is to grow carbon tube films directly on the substrate; the other is to assemble independent carbon tubes into aligned films through a series of post-processing methods. In technical applications, each transistor requires several parallel single-walled carbon tube channels. In order to surpass the performance of silicon-based complementary metal-oxide semiconductor (Si-CMOS), Patil et al. predicted that the single-walled carbon tube density must be greater than 250 tubes per square micron. In addition, fields such as radio frequency applications, plastic electronics, display technology, sensors, and electrodes also require high-density massively parallel arrays of single-walled carbon tubes. The ideal carbon tube film should be a single-chiral, fully aligned close-packed single-walled carbon tube array film. The ideal carbon tube film can even be called a carbon tube crystal, but this perfect carbon tube film has not yet been controllably prepared.

发明内容Contents of the invention

鉴于以上所述现有技术的缺点,本发明的目的在于提供一种单一手性且密排的碳管阵列薄膜及其制备方法,用于解决现有技术中未有较大尺寸的手性单一、完全准直的密排单壁碳管阵列薄膜以及其制备方法等的问题。In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a single-chiral and closely-packed carbon tube array film and its preparation method, which is used to solve the problems in the prior art that there is no large-scale single-chiral, fully aligned close-packed single-wall carbon tube array film and its preparation method.

为实现上述目的及其他相关目的,本发明提供一种单一手性且密排的碳管阵列薄膜,所述碳管阵列薄膜包括:若干根呈平行排列的单壁碳管;其中,In order to achieve the above purpose and other related purposes, the present invention provides a single-chiral and densely packed carbon tube array film, the carbon tube array film comprising: a number of single-walled carbon tubes arranged in parallel; wherein,

所述单壁碳管的直径为1nm~2nm;The diameter of the single-walled carbon tube is 1 nm to 2 nm;

相邻两所述单壁碳管之间的间距为0.3nm~0.4nm。The distance between two adjacent single-walled carbon tubes is 0.3nm-0.4nm.

可选地,所述碳管阵列薄膜生长于原子级平整度的衬底上,且所述碳管阵列薄膜与原子级平整度的所述衬底之间的间距为0.3nm~0.5nm。Optionally, the carbon tube array film is grown on an atomically flat substrate, and the distance between the carbon tube array film and the atomically flat substrate is 0.3 nm˜0.5 nm.

进一步地,原子级平整度的所述衬底为六方氮化硼衬底或石墨衬底。Further, the substrate with atomic level flatness is a hexagonal boron nitride substrate or a graphite substrate.

本发明还提供一种单一手性且密排的碳管阵列薄膜的制备方法,用于制备上述任意一项所述的单一手性且密排的碳管阵列薄膜,所述制备方法包括以下步骤:The present invention also provides a method for preparing a single-chiral and closely-packed carbon tube array film, which is used to prepare the above-mentioned single-chiral and close-packed carbon tube array film. The preparation method includes the following steps:

提供具有原子级平整度的衬底;Provides substrates with atomic-level flatness;

于所述衬底表面蒸镀金属纳米催化剂颗粒;Evaporating metal nano-catalyst particles on the surface of the substrate;

将蒸镀有所述金属纳米催化剂颗粒的所述衬底置于炉管中进行加热,并通入甲烷或乙炔或乙醇的碳源气体,以在所述衬底上生长单一手性且密排的碳管阵列薄膜;其中生长温度为600℃~1200℃,保持所述生长温度不变生长的生长时间超过30min,生长过程中通入氢气作为保持所述金属纳米催化剂颗粒活性的气体;当所述碳源气体为甲烷时,生长过程中所述碳源气体与所述氢气的流量比大于10:1;当所述碳源气体为乙炔时,生长过程中所述碳源气体与所述氢气的流量比大于1:2;Place the substrate on which the metal nano-catalyst particles are vapor-deposited in a furnace tube for heating, and feed a carbon source gas of methane, acetylene or ethanol to grow a monochiral and densely packed carbon tube array film on the substrate; wherein the growth temperature is 600° C. to 1200° C., and the growth time of keeping the growth temperature constant is more than 30 minutes. During the growth process, hydrogen is introduced as a gas to maintain the activity of the metal nano-catalyst particles; The flow ratio is greater than 10:1; when the carbon source gas is acetylene, the flow ratio of the carbon source gas to the hydrogen is greater than 1:2 during the growth process;

关闭所述碳源气体,在保护气体的作用下,降温至室温。Turn off the carbon source gas, and cool down to room temperature under the action of protective gas.

可选地,原子级平整度的所述衬底为六方氮化硼衬底或石墨衬底。Optionally, the atomically flat substrate is a hexagonal boron nitride substrate or a graphite substrate.

可选地,所述金属纳米催化剂颗粒为铁纳米催化剂颗粒或钴纳米催化颗粒或镍纳米催化颗粒,所述金属纳米催化剂颗粒的直径为1nm~10nm。Optionally, the metal nano-catalyst particles are iron nano-catalyst particles, cobalt nano-catalyst particles or nickel nano-catalyst particles, and the diameter of the metal nano-catalyst particles is 1 nm to 10 nm.

进一步地,于所述衬底上生长单一手性且密排的碳管阵列薄膜的步骤包括:Further, the step of growing a monochiral and densely packed carbon tube array film on the substrate includes:

提供石英管式炉,并将蒸镀有金属纳米催化剂薄膜的所述衬底置于所述石英管式炉中,其中,所述金属纳米催化剂薄膜的厚度为 A quartz tube furnace is provided, and the substrate evaporated with a metal nanocatalyst film is placed in the quartz tube furnace, wherein the thickness of the metal nanocatalyst film is

升温过程:于所述石英管式炉中通入氢气及氩气保护气体,升温10min~20min至所述生长温度,以使所述金属纳米催化剂薄膜形成为所述金属纳米催化剂颗粒;Heating process: pass hydrogen and argon protective gas into the quartz tube furnace, and raise the temperature for 10 minutes to 20 minutes to the growth temperature, so that the metal nanocatalyst film is formed into the metal nanocatalyst particles;

生长过程:停止通入升温过程中的所述氩气,保持升温过程中所述氢气的流量及所述生长温度不变,并向所述石英管式炉中通入所述碳源气体,所述碳源气体的流量与升温过程中所述氩气的流量相同;Growth process: stop feeding the argon gas during the heating process, keep the flow rate of the hydrogen gas and the growth temperature constant during the heating process, and feed the carbon source gas into the quartz tube furnace, the flow rate of the carbon source gas is the same as the flow rate of the argon gas during the heating process;

降温过程:生长结束后,关闭所述碳源气体,继续通入所述氢气及所述氩气保护气体,所述氢气及所述氩气与升温过程中的流量相同,自然降温至室温。Cooling process: after the growth is completed, the carbon source gas is turned off, and the hydrogen and argon protective gas are continuously fed in. The flow rates of the hydrogen and argon are the same as those in the heating process, and the temperature is naturally cooled to room temperature.

进一步地,原子级平整度的所述衬底为六方氮化硼衬底;所述金属纳米催化剂颗粒为钴纳米催化剂颗粒,所述金属纳米催化剂薄膜厚度为;升温过程中所述氢气的流量为200SCCM,所述氩气的流量为100SCCM,升温过程中保持气压为10pa;所述碳源气体为乙炔,生长过程中保持气压为10pa,生长时间为60min,生长温度为700℃。Further, the substrate with atomic-level flatness is a hexagonal boron nitride substrate; the metal nanocatalyst particles are cobalt nanocatalyst particles, and the thickness of the metal nanocatalyst film is The flow rate of the hydrogen gas in the heating process is 200 SCCM, the flow rate of the argon gas is 100 SCCM, and the air pressure is kept at 10 Pa during the heating process; the carbon source gas is acetylene, and the air pressure is kept at 10 Pa during the growth process, the growth time is 60 min, and the growth temperature is 700 ° C.

可选地,原子级平整度的所述衬底为六方氮化硼衬底;所述金属纳米催化剂颗粒为铁纳米催化剂颗粒,所述金属纳米催化剂薄膜厚度为;升温过程中所述氢气的流量为40SCCM,所述氩气的流量为400SCCM,升温过程中保持气压为1个标准大气压;所述碳源气体为甲烷,生长过程中保持气压为1个标准大气压,生长时间为60min,生长温度为850℃。Optionally, the substrate with atomic-level flatness is a hexagonal boron nitride substrate; the metal nanocatalyst particles are iron nanocatalyst particles, and the thickness of the metal nanocatalyst film is The flow rate of the hydrogen gas during the heating process is 40 SCCM, the flow rate of the argon gas is 400 SCCM, and the air pressure is kept at 1 standard atmosphere during the heating process; the carbon source gas is methane, the air pressure is kept at 1 standard atmosphere during the growth process, the growth time is 60 minutes, and the growth temperature is 850 ° C.

可选地,原子级平整度的所述衬底为石墨衬底;所述金属纳米催化剂颗粒为钴纳米催化剂颗粒,所述金属纳米催化剂薄膜厚度为;升温过程中所述氢气的流量为200SCCM,所述氩气的流量为100SCCM,升温过程中保持气压为10pa;所述碳源气体为乙炔,生长过程中保持气压为10pa,生长时间为60min,生长温度为700℃。Optionally, the substrate with atomic-level flatness is a graphite substrate; the metal nanocatalyst particles are cobalt nanocatalyst particles, and the thickness of the metal nanocatalyst film is The flow rate of the hydrogen gas in the heating process is 200 SCCM, the flow rate of the argon gas is 100 SCCM, and the air pressure is kept at 10 Pa during the heating process; the carbon source gas is acetylene, and the air pressure is kept at 10 Pa during the growth process, the growth time is 60 min, and the growth temperature is 700 ° C.

如上所述,本发明提供一种单一手性且密排的碳管阵列薄膜及其制备方法,该碳管阵列薄膜面积可任意选择;性能优异,载流子迁移率大于4000cm2V-1S-1,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm;制备方法操作简单、成本低廉且可以大规模生产。As mentioned above, the present invention provides a single-chiral and densely packed carbon tube array film and a preparation method thereof. The area of the carbon tube array film can be selected arbitrarily; the performance is excellent, the carrier mobility is greater than 4000 cm 2 V -1 S -1 , the on-state current density is greater than 1 mA/μm, and the current carrying capacity is greater than 8 mA/μm; the preparation method is simple to operate, low in cost and can be mass-produced.

附图说明Description of drawings

图1显示为制备本发明的单一手性且密排的碳管阵列薄膜使用的生长装置结构示意简图。Fig. 1 shows a schematic diagram of the structure of the growth device used for the preparation of the monochiral and densely packed carbon tube array thin film of the present invention.

图2显示为本发明一示例的单一手性且密排的碳管阵列薄膜的三维结构示意图。FIG. 2 shows a schematic diagram of a three-dimensional structure of a monochiral and densely packed carbon tube array film as an example of the present invention.

图3显示为本发明另一示例的单一手性且密排的碳管阵列薄膜的放大结构示意图。FIG. 3 is a schematic diagram showing an enlarged structure of a single-chiral and close-packed carbon tube array thin film of another example of the present invention.

图4显示为本发明的单一手性且密排的碳管阵列薄膜的制备方法制备得到的碳管阵列薄膜的原子力显微镜图片。Fig. 4 shows an atomic force microscope picture of a carbon tube array film prepared by the method for preparing a single-chiral and close-packed carbon tube array film of the present invention.

元件标号说明Component designation description

10 单壁碳管10 single wall carbon tube

11 碳管阵列薄膜11 Carbon tube array film

12 衬底12 substrate

13 金属纳米催化剂颗粒13 Metal Nanocatalyst Particles

14 管式炉14 tube furnace

15 炉管15 furnace tube

16 碳源气体16 carbon source gas

具体实施方式Detailed ways

以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

如在详述本发明实施例时,为便于说明,表示器件结构的剖面图会不依一般比例作局部放大,而且所述示意图只是示例,其在此不应限制本发明保护的范围。此外,在实际制作中应包含长度、宽度及深度的三维空间尺寸。For example, when describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the protection scope of the present invention. In addition, the three-dimensional space dimensions of length, width and depth should be included in actual production.

为了方便描述,此处可能使用诸如“之下”、“下方”、“低于”、“下面”、“上方”、“上”等的空间关系词语来描述附图中所示的一个元件或特征与其他元件或特征的关系。将理解到,这些空间关系词语意图包含使用中或操作中的器件的、除了附图中描绘的方向之外的其他方向。此外,当一层被称为在两层“之间”时,它可以是所述两层之间仅有的层,或者也可以存在一个或多个介于其间的层。本文使用的“介于……之间”表示包括两端点值。For convenience of description, spatial relationship words such as "below", "below", "below", "below", "above", "on" etc. may be used herein to describe the relationship between one element or feature and other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. As used herein, "between" means that both endpoints are inclusive.

在本申请的上下文中,所描述的第一特征在第二特征“之上”的结构可以包括第一和第二特征形成为直接接触的实施例,也可以包括另外的特征形成在第一和第二特征之间的实施例,这样第一和第二特征可能不是直接接触。In the context of this application, structures described as having a first feature "on top of" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed between the first and second features such that the first and second features may not be in direct contact.

实施例一Embodiment one

请参阅图1至图4。需要说明的是,本实施例中所提供的图示仅以示意方式说明本发明的基本构想,遂图示中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可为一种随意的改变,且其组件布局型态也可能更为复杂。See Figures 1 through 4. It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of the present invention, so that only the components related to the present invention are shown in the diagrams rather than drawn according to the number, shape and size of the components in actual implementation. The type, quantity and proportion of each component in actual implementation can be changed arbitrarily, and the layout of the components may also be more complicated.

如图2及图3所示,本实施例提供一种单一手性且密排的碳管阵列薄膜,所述碳管阵列薄膜11包括:若干根呈平行排列的单壁碳管10(如图2所示);其中,As shown in Figure 2 and Figure 3, the present embodiment provides a single-chiral and closely packed carbon tube array film, the carbon tube array film 11 includes: a number of single-walled carbon tubes 10 arranged in parallel (as shown in Figure 2); wherein,

所述单壁碳管10的直径D为1nm~2nm,例如,可以为1nm、1.5nm或2nm等等;The diameter D of the single-walled carbon tube 10 is 1nm-2nm, for example, it can be 1nm, 1.5nm or 2nm, etc.;

相邻两所述单壁碳管10之间的间距L1为0.3nm~0.4nm,例如,可以为0.3nm、0.33nm或0.4nm等等,这里L1指的是相邻两所述单壁碳管10之间的最小距离。The distance L1 between two adjacent single-walled carbon tubes 10 is 0.3nm-0.4nm, for example, 0.3nm, 0.33nm or 0.4nm, etc., where L1 refers to the minimum distance between two adjacent single-walled carbon tubes 10 .

这里需要说明的是,所述碳管阵列薄膜11中的单壁碳管10可以是直管也可以是弯管,例如,图4中的单壁碳管10即为弯管,只要满足若干单壁碳管10之间是平行排列即可。It should be noted here that the single-walled carbon tubes 10 in the carbon tube array film 11 can be straight tubes or bent tubes, for example, the single-walled carbon tubes 10 in FIG.

本实施例的单一手性且密排的碳管阵列薄膜可以为任意尺寸大小,具体根据实际需要进行选择,且采用本实施例的单一手性且密排的碳管阵列薄膜制备的半导体器件载流子迁移率大于4000cm2V-1S-1,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm,性能非常优异。The single-chiral and closely-packed carbon tube array film of this embodiment can be of any size, which is selected according to actual needs, and the carrier mobility of the semiconductor device prepared by using the single-chiral and close-packed carbon tube array film of this embodiment is greater than 4000 cm 2 V -1 S -1 , the on-state current density is greater than 1 mA/μm, and the current carrying capacity is greater than 8 mA/μm, and the performance is very excellent.

如图2及图3所示,作为一优选示例,所述碳管阵列薄膜11生长于原子级平整度的衬底12上,且所述碳管阵列薄膜11与原子级平整度的所述衬底12之间的间距L2为0.3nm~0.5nm,例如,可以为0.3nm、0.4nm或0.5nm等等,这里L2指的是两者之间的最小距离,其是由所述碳管阵列薄膜11与原子级平整度的所述衬底12之间的范德华力的平衡位置决定的,采用原子级平整度的衬底12作为碳管阵列薄膜11的生长基底的机理是:碳纳米管与原子级平整度的衬底之间存在超润滑效应,在其上生长的碳纳米管可以在衬底上任意滑动,进而找到其能量最低的状态,最终堆叠成规则的密排碳管阵列。作为一更优选示例,所述原子级平整度的所述衬底12为六方氮化硼衬底或石墨衬底,该衬底易于与单壁碳管10之间形成更好的超润滑效果,即单壁碳管10与衬底12的摩擦阻力极低,又因为单壁碳管10与单壁碳管10之间存在范德华吸引力,所以单壁碳管10与单壁碳管10会在原子级平整的衬底12表面无阻力地自发吸附到一起,从而形成单一手性碳管、密排碳管薄膜。As shown in Figure 2 and Figure 3, as a preferred example, the carbon tube array film 11 is grown on the substrate 12 of atomic level flatness, and the distance L2 between the carbon tube array film 11 and the described substrate 12 of atomic level flatness is 0.3nm~0.5nm, for example, can be 0.3nm, 0.4nm or 0.5nm etc., here L2 refers to the minimum distance between the two, which is defined by the range between the carbon tube array film 11 and the described substrate 12 of atomic level flatness Determined by the equilibrium position of the De Waals force, the mechanism of using the atomic-level flatness substrate 12 as the growth substrate of the carbon tube array film 11 is: there is a super-lubricating effect between the carbon nanotubes and the atomic-level flatness substrate, and the carbon nanotubes grown on it can slide freely on the substrate, and then find the state with the lowest energy, and finally stack into a regular densely packed carbon tube array. As a more preferred example, the substrate 12 with atomic-level flatness is a hexagonal boron nitride substrate or graphite substrate, which is easy to form a better superlubricating effect with the single-wall carbon tube 10, that is, the frictional resistance between the single-wall carbon tube 10 and the substrate 12 is extremely low, and because there is a van der Waals attraction between the single-wall carbon tube 10 and the single-wall carbon tube 10, so the single-wall carbon tube 10 and the single-wall carbon tube 10 will be spontaneously adsorbed together on the surface of the atomically flat substrate 12 without resistance, thereby forming a single Chiral carbon tubes, close-packed carbon tube films.

实施例二Embodiment two

本实施例提供一种单一手性且密排的碳管阵列薄膜的制备方法,该制备方法可以用于制备上述实施例一所述的单一手性且密排的碳管阵列薄膜,其制备得到的碳管阵列薄膜的效果可请参见上述实施例一,以下不再赘述。所述制备方法包括以下步骤:This embodiment provides a method for preparing a single-chiral and closely-packed carbon tube array thin film. This preparation method can be used to prepare the single-chiral and closely-packed carbon tube array thin film described in the first embodiment above. For the effect of the prepared carbon tube array thin film, please refer to the first embodiment above, and will not be repeated below. The preparation method comprises the following steps:

提供具有原子级平整度的衬底;Provides substrates with atomic-level flatness;

于所述衬底表面蒸镀金属纳米催化剂颗粒;Evaporating metal nano-catalyst particles on the surface of the substrate;

将蒸镀有所述金属纳米催化剂颗粒的所述衬底置于炉管中进行加热,并通入甲烷或乙炔或乙醇的碳源气体,以在所述衬底上生长单一手性且密排的碳管阵列薄膜;其中生长温度为600℃~1200℃,保持所述生长温度不变生长的生长时间不少于30min,生长过程中通入氢气作为保持所述金属纳米催化剂颗粒活性的气体;当所述碳源气体为甲烷时,生长过程中所述碳源气体与所述氢气的流量比大于10:1;当所述碳源气体为乙炔时,生长过程中所述碳源气体与所述氢气的流量比大于1:2;Place the substrate on which the metal nanocatalyst particles are vapor-deposited in a furnace tube for heating, and feed a carbon source gas of methane, acetylene or ethanol to grow a monochiral and densely packed carbon tube array film on the substrate; wherein the growth temperature is 600° C. to 1200° C., and the growth time is not less than 30 minutes while maintaining the growth temperature. The flow ratio of the carbon source gas is greater than 10:1; when the carbon source gas is acetylene, the flow ratio of the carbon source gas to the hydrogen gas during the growth process is greater than 1:2;

关闭所述碳源气体,在保护气体的作用下,降温至室温。Turn off the carbon source gas, and cool down to room temperature under the action of protective gas.

采用本实施例的碳管阵列薄膜的制备方法中薄膜的形成机理为:当单壁碳管在原子级平整度的衬底表面生长时,碳管与衬底之间形成超润滑效应,即碳管与衬底的摩擦阻力极低,所以碳管可以在衬底上任意滑动,进而找到其能量最低的状态,又因为碳管与碳管之间存在范德华吸引力,所以碳管与碳管会在原子级平整的衬底表面无阻力地自发吸附到一起,从而形成单一手性碳管、密排碳管薄膜,且薄膜面积可达到10μm×1μm,载流子迁移率大于4000cm2V-1S-1,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm,性能非常优异。在碳管阵列薄膜的生长过程中,通入氢气使金属纳米催化剂颗粒保持其活性,采用碳源比例较高的甲烷或乙炔或乙醇的碳源气体,例如甲烷与氢气的流量比大于10:1,或乙炔与氢气的流量比大于2:1,金属纳米催化剂颗粒会溶液碳源,并析出单壁碳纳米管;另外,该制备方法操作简单、成本低廉且可以大规模生产;最后采用本实施例的制备方法可形成任意尺寸大小的碳管阵列薄膜。采用本实施例的碳管阵列薄膜的制备方法中薄膜的形成机理为:当单壁碳管在原子级平整度的衬底表面生长时,碳管与衬底之间形成超润滑效应,即碳管与衬底的摩擦阻力极低,所以碳管可以在衬底上任意滑动,进而找到其能量最低的状态,又因为碳管与碳管之间存在范德华吸引力,所以碳管与碳管会在原子级平整的衬底表面无阻力地自发吸附到一起,从而形成单一手性碳管、密排碳管薄膜,且薄膜面积可达到10μm×1μm,载流子迁移率大于4000cm 2 V -1 S -1 ,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm,性能非常优异。 During the growth process of the carbon tube array film, hydrogen is introduced to keep the metal nano catalyst particles active, and a carbon source gas with a relatively high carbon source ratio of methane or acetylene or ethanol is used. For example, the flow ratio of methane to hydrogen is greater than 10:1, or the flow ratio of acetylene to hydrogen is greater than 2:1. The metal nano catalyst particles will dissolve the carbon source and precipitate single-walled carbon nanotubes. In addition, the preparation method is simple to operate, low in cost, and can be produced on a large scale; finally, the preparation method of this embodiment can form a carbon tube array film of any size. .

如图1至图4所示,下面结合附图,对本实施例的制备方法进行详细说明。As shown in FIG. 1 to FIG. 4 , the preparation method of this embodiment will be described in detail below with reference to the accompanying drawings.

如图1所示,首先进行步骤S1,提供具有原子级平整度的衬底12。As shown in FIG. 1 , step S1 is first performed to provide a substrate 12 with atomic level flatness.

作为示例,所述衬底12可以为六方氮化硼衬底或石墨衬底。具体地,基于现有六方氮化硼及石墨的制备方法一般采用机械剥离的方法,本实施例中采用六方氮化硼衬底或石墨衬底时,可通过机械剥离的方法,将六方氮化硼衬底或石墨衬底粘合于硅片晶圆上形成。本申请中六方氮化硼及石墨作为生长碳管阵列薄膜较佳的衬底选择,但也不限于此,其他具有原子级平整度的衬底材料也适于作为本实施例的衬底。采用原子级平整度的衬底作为碳管阵列薄膜的生长衬底,可在碳管生长过程中在两者之间形成超润滑效应,并结合碳管与碳管之间的范德华吸引力,使形成的碳管阵列薄膜成为单一手性且密排形式。As an example, the substrate 12 may be a hexagonal boron nitride substrate or a graphite substrate. Specifically, based on the existing methods for preparing hexagonal boron nitride and graphite, mechanical exfoliation is generally used. When a hexagonal boron nitride substrate or graphite substrate is used in this embodiment, the hexagonal boron nitride substrate or graphite substrate can be bonded to a silicon wafer by mechanical exfoliation. In this application, hexagonal boron nitride and graphite are preferred substrates for growing carbon tube array films, but they are not limited thereto. Other substrate materials with atomic-level flatness are also suitable as substrates in this embodiment. Using an atomic-level flat substrate as the growth substrate of the carbon tube array film can form a superlubricating effect between the two during the growth of carbon tubes, combined with the van der Waals attraction between carbon tubes and carbon tubes, so that the formed carbon tube array film becomes a single-chiral and close-packed form.

如图1所示,然后进行步骤S2,于所述衬底12表面蒸镀金属纳米催化剂颗粒13。As shown in FIG. 1 , step S2 is then performed to vapor-deposit metal nano-catalyst particles 13 on the surface of the substrate 12 .

作为示例,所述金属纳米催化剂颗粒13选择为铁纳米催化剂颗粒或钴纳米催化颗粒或镍纳米催化颗粒。较佳地,所述金属纳米催化剂颗粒13的直径为1nm~10nm,例如1nm、2nm、3nm、4nm、5nm、6nm、7nm、8nm、9nm、10nm等等。所述金属纳米催化剂颗粒13后续作为碳管生长过程中对碳源气体16的溶解剂,以析出单壁碳管10。As an example, the metal nano-catalyst particles 13 are selected as iron nano-catalyst particles, cobalt nano-catalyst particles or nickel nano-catalyst particles. Preferably, the metal nano-catalyst particles 13 have a diameter of 1nm-10nm, such as 1nm, 2nm, 3nm, 4nm, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm and so on. The metal nano-catalyst particles 13 are subsequently used as a dissolving agent for the carbon source gas 16 during the carbon tube growth process, so as to precipitate the single-walled carbon tubes 10 .

作为一具体示例,首先于所述衬底12表面蒸镀金属纳米催化剂薄膜,该金属纳米催化剂薄膜的厚度为,例如/>等等;然后将蒸镀有金属纳米催化剂薄膜的衬底12置于管式炉14的炉管15中进行升温过程,该升温过程中于所述炉管15中通入氢气及氩气保护气体,升温10min~20min至后续碳管阵列薄膜所需的生长温度,该升温过程中可使所述金属纳米催化剂薄膜发生团聚,从而形成所述金属纳米催化剂颗粒13。As a specific example, at first on the surface of the substrate 12 vapor-deposited metal nano-catalyst film, the thickness of the metal nano-catalyst film is , for example /> or etc.; then the substrate 12 evaporated with the metal nanocatalyst film is placed in the furnace tube 15 of the tube furnace 14 to carry out the heating process. During the heating process, hydrogen and argon protective gas are introduced into the furnace tube 15, and the temperature is raised for 10min to 20min to the required growth temperature of the subsequent carbon tube array film. During the heating process, the metal nanocatalyst film can be agglomerated, thereby forming the metal nanocatalyst particles 13.

作为示例,所述管式炉14为炉管15外带有加热炉的形式,该形式可提供具有良好的密封性、保温箱及温控稳定性。升温过程中将衬底12置于所述炉管15内进行升温过程。较佳地,所述炉管15为石英炉管。As an example, the tube furnace 14 is in the form of a heating furnace outside the furnace tube 15, which can provide good sealing, insulation box and temperature control stability. During the heating process, the substrate 12 is placed in the furnace tube 15 to carry out the heating process. Preferably, the furnace tube 15 is a quartz furnace tube.

在该升温过程中,于所述炉管15中通入氢气及氩气作为保护气体,还可作为还原气体使用,以便于还原被氧化的金属纳米催化剂颗粒及在后续的高温生长过程中由所述碳源气体16所生成的一些含碳杂质物质,且后续在生长过程中通入的碳源气体16流量与升温过程中氩气的流量相同,以保证生长过程中气体总体流量的稳定性,保证碳管阵列薄膜的生长质量。In the heating process, hydrogen and argon are introduced into the furnace tube 15 as protective gases, and can also be used as reducing gases to reduce oxidized metal nanocatalyst particles and some carbon-containing impurity substances generated by the carbon source gas 16 during the subsequent high-temperature growth process, and the flow rate of the carbon source gas 16 introduced during the growth process is the same as the flow rate of the argon gas during the heating process, so as to ensure the stability of the total gas flow rate during the growth process and the growth quality of the carbon tube array film.

如图1及图4所示,接着进行步骤S3,将蒸镀有所述金属纳米催化剂颗粒13的所述衬底12置于炉管15中进行加热,并通入甲烷或乙炔或乙醇的碳源气体16,以在所述衬底12上生长单一手性且密排的碳管阵列薄膜11;其中生长温度为600℃~1200℃,保持所述生长温度不变生长的生长时间不少于30min,生长过程中通入氢气气体作为保持所述金属纳米催化剂颗粒13活性的气体;当所述碳源气体16为甲烷时,生长过程中所述碳源气体16与所述氢气气体的流量比大于10:1;当所述碳源气体16为乙炔时,生长过程中所述碳源气体16与所述氢气气体的流量比大于1:2。As shown in Figures 1 and 4, proceed to step S3, place the substrate 12 with the metal nanocatalyst particles 13 evaporated in a furnace tube 15 for heating, and pass into a carbon source gas 16 of methane or acetylene or ethanol to grow a single chiral and densely packed carbon tube array film 11 on the substrate 12; wherein the growth temperature is 600 ° C to 1200 ° C, and the growth time for maintaining the growth temperature is not less than 30 minutes. 13 active gas; when the carbon source gas 16 is methane, the flow ratio of the carbon source gas 16 to the hydrogen gas is greater than 10:1 during the growth process; when the carbon source gas 16 is acetylene, the flow ratio of the carbon source gas 16 to the hydrogen gas is greater than 1:2 during the growth process.

作为一具体示例,当上述升温过程结束后,即进入生长过程,即升温过程及生长过程均在同一管式炉14完成,且为连续的过程,在该过程中,停止通入升温过程中的所述氩气,保持升温过程中所述氢气的流量及所述生长温度不变,并向所述管式炉14,即炉管15中通入所述碳源气体16,所述碳源气体16的流量与升温过程中所述氩气的流量相同,以保证生长过程中气体总体流量的稳定性,保证碳管阵列薄膜的生长质量。As a specific example, when the above-mentioned heating process is over, the growth process is started, that is, the heating process and the growth process are completed in the same tube furnace 14, and it is a continuous process. In this process, the argon gas in the heating process is stopped, and the flow rate of the hydrogen gas and the growth temperature are kept constant during the heating process, and the carbon source gas 16 is introduced into the tube furnace 14, that is, the furnace tube 15. The flow rate of the carbon source gas 16 is the same as the flow rate of the argon gas in the heating process to ensure the growth process. The stability of the total gas flow in the medium ensures the growth quality of the carbon tube array film.

最后,进行步骤S4,关闭所述碳源气体16,在保护气体的作用下,降温至室温。Finally, step S4 is performed, the carbon source gas 16 is turned off, and the temperature is lowered to room temperature under the action of the protective gas.

作为一具体示例,在该降温过程中,关闭所述碳源气体16后,继续通入所述氢气及所述氩气保护气体,且所述氢气及所述氩气与升温过程中的流量相同,自然降温至室温,同样还是保证整个降温过程中气体总体流量的稳定性。As a specific example, in the cooling process, after the carbon source gas 16 is closed, the hydrogen gas and the argon protective gas are continuously introduced, and the flow rates of the hydrogen gas and the argon gas are the same as those in the heating process, and the temperature is naturally lowered to room temperature, which also ensures the stability of the overall gas flow rate in the entire cooling process.

以下通过具体的实验例对本实施例的单一手性且密排的碳管阵列薄膜的制备方法进行进一步的说明。The preparation method of the monochiral close-packed carbon tube array thin film of this embodiment will be further described through specific experimental examples below.

实验例1Experimental example 1

1)取一片硅片晶圆,切成尺寸约为1cm×1cm小片。1) Take a silicon wafer and cut it into small pieces with a size of about 1cm×1cm.

2)取一块六方氮化硼晶体,通过机械剥离的方法,在上述硅片晶圆上制备六方氮化硼薄片,作为原子级平整度的所述衬底12。2) Take a hexagonal boron nitride crystal, and prepare a hexagonal boron nitride thin slice on the above-mentioned silicon wafer by mechanical peeling method, as the substrate 12 with atomic level flatness.

3)采用热蒸发镀膜的方法于上述衬底12表面上蒸镀厚度的钴薄膜,作为生长的催化剂薄膜。3) Evaporate on the surface of the above-mentioned substrate 12 by adopting the method of thermal evaporation coating thickness of cobalt film, as the growth catalyst film.

4)将上述镀有催化剂薄膜的衬底12放置于石英管式炉中,升温过程中炉内气体氛围为氢气,流量为200SCCM和氩气,流量为100SCCM的两种气体,升温过程约15分钟,由室温逐渐升至生长温度700℃,升温过程中保持气压为10pa。4) Place the above-mentioned substrate 12 coated with the catalyst thin film in a quartz tube furnace. During the heating process, the gas atmosphere in the furnace is hydrogen gas with a flow rate of 200 SCCM and argon gas with a flow rate of 100 SCCM. The heating process is about 15 minutes, gradually rising from room temperature to the growth temperature of 700° C., and the pressure is maintained at 10 Pa during the heating process.

5)当温度达到目标生长温度700℃后,停止通入氩气,在原有氢气,流量为200SCCM保持不变的基础上,再通入100SCCM的乙炔气体作为生长气体,生长时间60分钟,生长过程中保持气压为10pa。5) When the temperature reaches the target growth temperature of 700°C, stop feeding the argon gas. On the basis of keeping the original hydrogen gas at a flow rate of 200 SCCM, then feed 100 SCCM of acetylene gas as the growth gas. The growth time is 60 minutes, and the pressure is kept at 10 Pa during the growth process.

6)生长结束后,关闭乙炔气体,通入氢气,流量为200SCCM和氩气,流量为100SCCM,自然降温到室温,然后将样品取出。6) After the growth is over, turn off the acetylene gas, feed hydrogen at a flow rate of 200 SCCM and argon at a flow rate of 100 SCCM, cool down to room temperature naturally, and then take out the sample.

7)通过扫描电子显微镜和原子力显微镜表征得到碳管阵列薄膜11的尺寸可达10μm×1μm。7) The size of the carbon tube array thin film 11 can reach 10 μm×1 μm through the characterization of the scanning electron microscope and the atomic force microscope.

实验例2Experimental example 2

1)取一片硅片晶圆,切成尺寸约为1cm×1cm小片。1) Take a silicon wafer and cut it into small pieces with a size of about 1cm×1cm.

2)取一块六方氮化硼晶体,通过机械剥离的方法,在上述硅片晶圆上制备六方氮化硼薄片,作为原子级平整度的所述衬底12。2) Take a hexagonal boron nitride crystal, and prepare a hexagonal boron nitride thin slice on the above-mentioned silicon wafer by mechanical peeling method, as the substrate 12 with atomic level flatness.

3)采用热蒸发镀膜的方法于上述衬底12表面上蒸镀厚度的铁薄膜,作为生长的催化剂薄膜。3) Evaporate on the surface of the above-mentioned substrate 12 by adopting the method of thermal evaporation coating Thickness of the iron film, as the growth catalyst film.

4)将上述镀有催化剂薄膜的衬底12放置于石英管式炉中,升温过程中炉内气体氛围为氢气,流量为40SCCM和氩气,流量为400SCCM的两种气体,升温过程约15分钟,由室温逐渐升至生长温度850℃,升温过程中保持气压为1个标准大气压。4) Place the above-mentioned substrate 12 coated with the catalyst thin film in a quartz tube furnace. During the heating process, the gas atmosphere in the furnace is hydrogen, with a flow rate of 40 SCCM and argon gas, and two gases with a flow rate of 400 SCCM. The heating process takes about 15 minutes, gradually rising from room temperature to the growth temperature of 850° C., and maintaining the pressure at 1 standard atmosphere during the heating process.

5)当温度达到目标生长温度850℃后,停止通入氩气,在原有氢气,流量为40SCCM保持不变的基础上,再通入400SCCM的甲烷气体作为生长气体,生长时间60分钟,生长过程中保持气压为1个标准大气压。5) When the temperature reaches the target growth temperature of 850°C, stop feeding the argon gas. On the basis of keeping the original hydrogen gas at a flow rate of 40 SCCM, add 400 SCCM methane gas as the growth gas. The growth time is 60 minutes, and the pressure is kept at 1 standard atmospheric pressure during the growth process.

6)生长结束后,关闭甲烷气体,通入氢气,流量为40SCCM和氩气,流量为400SCCM,自然降温到室温,然后将样品取出。6) After the growth is over, turn off the methane gas, feed in hydrogen at a flow rate of 40 SCCM and argon at a flow rate of 400 SCCM, cool down to room temperature naturally, and then take out the sample.

7)通过扫描电子显微镜和原子力显微镜表征得到碳管阵列薄膜11的尺寸可达10μm×1μm。7) The size of the carbon tube array thin film 11 can reach 10 μm×1 μm through the characterization of the scanning electron microscope and the atomic force microscope.

实验例3Experimental example 3

本实验例基本与实验例1相同,不同在于:本实验例中的原子级平整度的所述衬底12为石墨,其余步骤与实验例1相同。通过扫描电子显微镜和原子力显微镜表征本实验例得到碳管阵列薄膜11的尺寸为2μm×50nm。This experimental example is basically the same as the experimental example 1, except that the substrate 12 of the atomic level flatness in this experimental example is graphite, and other steps are the same as the experimental example 1. The dimensions of the carbon tube array thin film 11 obtained in this experimental example are 2 μm×50 nm through scanning electron microscopy and atomic force microscopy.

综上所述,本发明提供一种单一手性且密排的碳管阵列薄膜及其制备方法,该碳管阵列薄膜面积可任意选择;性能优异,载流子迁移率大于4000cm2V-1S-1,开态电流密度大于1mA/μm,电流承载能力大于8mA/μm;制备方法操作简单、成本低廉且可以大规模生产。所以,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。In summary, the present invention provides a single-chiral and densely packed carbon tube array film and a preparation method thereof. The area of the carbon tube array film can be selected arbitrarily; the performance is excellent, the carrier mobility is greater than 4000 cm 2 V -1 S -1 , the on-state current density is greater than 1 mA/μm, and the current carrying capacity is greater than 8 mA/μm; the preparation method is simple to operate, low in cost, and can be mass-produced. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial application value.

上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。The above-mentioned embodiments only illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims (10)

1. A single chiral and closely spaced carbon tube array film, the carbon tube array film comprising: a plurality of single-wall carbon tubes arranged in parallel; wherein,,
the diameter of the single-wall carbon tube is 1 nm-2 nm;
the interval between two adjacent single-wall carbon tubes is 0.3 nm-0.4 nm.
2. The single chiral and close packed carbon tube array film of claim 1, wherein the carbon tube array film is grown on an atomically flat substrate and the spacing between the carbon tube array film and the atomically flat substrate is 0.3nm to 0.5nm.
3. The single chiral and closely spaced carbon tube array film of claim 2, wherein: the substrate with atomic-level flatness is a hexagonal boron nitride substrate or a graphite substrate.
4. A method for preparing the single chiral and close packed carbon tube array film according to any one of claims 1 to 3, wherein the method comprises the steps of:
providing a substrate with atomic-level flatness;
evaporating metal nano catalyst particles on the surface of the substrate;
placing the substrate evaporated with the metal nano catalyst particles in a furnace tube for heating, and introducing carbon source gas of methane or acetylene or ethanol to grow a single chiral and closely arranged carbon tube array film on the substrate; wherein the growth temperature is 600-1200 ℃, the growth time for keeping the growth temperature unchanged is longer than 30min, and hydrogen is introduced in the growth process as the gas for keeping the activity of the metal nano catalyst particles; when the carbon source gas is methane, the flow ratio of the carbon source gas to the hydrogen in the growth process is greater than 10:1; when the carbon source gas is acetylene, the flow ratio of the carbon source gas to the hydrogen in the growth process is greater than 1:2;
and closing the carbon source gas, and cooling to room temperature under the action of the protective gas.
5. The method for preparing the single chiral and closely spaced carbon tube array film according to claim 4, wherein the method comprises the following steps: the substrate with atomic-level flatness is a hexagonal boron nitride substrate or a graphite substrate.
6. The method for preparing the single chiral and closely spaced carbon tube array film according to claim 4, wherein the method comprises the following steps: the metal nano catalyst particles are iron nano catalyst particles or cobalt nano catalyst particles or nickel nano catalyst particles, and the diameter of the metal nano catalyst particles is 1 nm-10 nm.
7. The method of claim 6, wherein the step of growing a single chiral and close packed carbon tube array film on the substrate comprises:
providing a quartz tube furnace, and placing the substrate evaporated with the metal nano catalyst film in the quartz tube furnace, wherein the thickness of the metal nano catalyst film is as follows
And (3) heating: introducing hydrogen and argon shielding gas into the quartz tube furnace, and heating for 10-20 min to the growth temperature so as to form the metal nano catalyst thin film into the metal nano catalyst particles;
the growth process comprises the following steps: stopping introducing the argon in the heating process, keeping the flow of the hydrogen and the growth temperature unchanged in the heating process, and introducing the carbon source gas into the quartz tube furnace, wherein the flow of the carbon source gas is the same as the flow of the argon in the heating process;
and (3) a cooling process: and after the growth is finished, closing the carbon source gas, continuously introducing the hydrogen and the argon shielding gas, wherein the flow rates of the hydrogen and the argon are the same as those in the heating process, and naturally cooling to room temperature.
8. The method for preparing the single chiral and closely spaced carbon tube array film according to claim 7, wherein the method comprises the steps of: the substrate with the atomic-level flatness is a hexagonal boron nitride substrate; the saidThe metal nano catalyst particles are cobalt nano catalyst particles, and the thickness of the metal nano catalyst film is as followsThe flow of the hydrogen is 200SCCM in the heating process, the flow of the argon is 100SCCM, and the air pressure is kept to be 10pa in the heating process; the carbon source gas is acetylene, the air pressure is kept at 10pa in the growth process, the growth time is 60min, and the growth temperature is 700 ℃.
9. The method for preparing the single chiral and closely spaced carbon tube array film according to claim 7, wherein the method comprises the steps of: the substrate with the atomic-level flatness is a hexagonal boron nitride substrate; the metal nano catalyst particles are iron nano catalyst particles, and the thickness of the metal nano catalyst film is as followsThe flow of the hydrogen is 40SCCM in the heating process, the flow of the argon is 400SCCM, and the air pressure is kept to be 1 standard atmosphere in the heating process; the carbon source gas is methane, the air pressure is kept at 1 standard atmosphere in the growth process, the growth time is 60min, and the growth temperature is 850 ℃.
10. The method for preparing the single chiral and closely spaced carbon tube array film according to claim 7, wherein the method comprises the steps of: the substrate with atomic-level flatness is a graphite substrate; the metal nano catalyst particles are cobalt nano catalyst particles, and the thickness of the metal nano catalyst film is as followsThe flow of the hydrogen is 200SCCM in the heating process, the flow of the argon is 100SCCM, and the air pressure is kept to be 10pa in the heating process; the carbon source gas is acetylene, the air pressure is kept at 10pa in the growth process, the growth time is 60min, and the growth temperature is 700 ℃.
CN202310517901.7A 2023-05-10 2023-05-10 Monochiral and close-packed carbon tube array thin film and its preparation method Pending CN116462186A (en)

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Citations (2)

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Publication number Priority date Publication date Assignee Title
CN103086353A (en) * 2013-01-11 2013-05-08 北京大学 Single-walled carbon nanotube array with chiral selective orientation and method for representing chiral structure thereof
US20150023858A1 (en) * 2013-07-18 2015-01-22 William Marsh Rice University Rebar hybrid materials and methods of making the same

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Title
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