CN116321934B - 5U rack-type immersion liquid cooling system - Google Patents
5U rack-type immersion liquid cooling system Download PDFInfo
- Publication number
- CN116321934B CN116321934B CN202211721779.7A CN202211721779A CN116321934B CN 116321934 B CN116321934 B CN 116321934B CN 202211721779 A CN202211721779 A CN 202211721779A CN 116321934 B CN116321934 B CN 116321934B
- Authority
- CN
- China
- Prior art keywords
- case
- pipeline
- cold plate
- cooling system
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 100
- 238000001816 cooling Methods 0.000 title claims abstract description 72
- 238000007654 immersion Methods 0.000 title claims description 28
- 239000000110 cooling liquid Substances 0.000 abstract description 26
- 238000013461 design Methods 0.000 abstract description 9
- 230000010354 integration Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A 5U rack submerged liquid cooling system, the liquid cooling system comprising: the machine case comprises a 3U machine case and a 2U machine case, wherein the 3U machine case and the 2U machine case are arranged in parallel up and down, and a cooled device is arranged in the 3U machine case; the heat exchanger component is arranged in the 2U case; the pipeline system comprises a liquid inlet pipeline, a liquid outlet pipeline and a circulating pump; a fan assembly. The 5U rack type submerged liquid cooling system is reasonable in structural design, the chassis comprises a 3U chassis and a 2U chassis, the 3U chassis and the 2U chassis are integrated with the 5U rack, the 3U chassis and the 2U chassis are respectively provided with a heat exchanger component, a pipeline system, a fan component and the like, the structure is compact, the high integration is realized, the submerged liquid cooling system is suitable for submerged liquid cooling of a cooled device, the heat generated by the cooled device is absorbed by cooling liquid, the energy utilization rate is higher, and the submerged liquid cooling system is suitable for flexible deployment of a data center and has wide application prospect.
Description
Technical Field
The invention belongs to the technical field of liquid cooling, and particularly relates to a 5U rack type immersed liquid cooling system.
Background
With the rapid development of data centers, the rapid increase of energy consumption becomes a non-negligible problem in the development of data center industry. How to reduce the PUE of a data center and improve the energy efficiency has become an important point and a difficult problem in the industry. Therefore, the traditional air cooling mode is not advantageous, and the liquid cooling mode can meet the requirements of timely heat dissipation, high density and low energy consumption of the data center.
At present, common liquid cooling modes comprise three modes of cold plate type, spray type and immersion type. The immersion liquid cooling uses cooling liquid as a heat transmission medium, the liquid has higher heat conductivity and specific heat capacity, so that heat can be conducted faster and absorbed more effectively, meanwhile, the use of fans and air conditioners is reduced, and the data center adopting the immersion liquid cooling system has lower PUE, has highest heat transmission efficiency and can avoid local hot spots, and is the technical means most likely to solve various problems faced by a heat dissipation system in a high-performance computing environment at present.
Therefore, compared with a cold plate type liquid cooling system and a spray type liquid cooling system, the immersed liquid cooling system is more energy-saving and consumption-reducing, and becomes the first choice of a data center refrigerating system.
The invention aims to provide a rack type immersion liquid cooling system structure which is used for adapting to a 19' rack, is designed according to the size of a standard server case, is compact in structure, is highly integrated, and is suitable for flexible deployment of a data center.
Disclosure of Invention
The invention aims to: in order to overcome the defects, the invention aims to provide a 5U rack type submerged liquid cooling system which is reasonable in structural design, is designed according to the size of a standard server case aiming at a 19' frame, wherein the case comprises a 3U case, a 2U case, the 3U case and a 2U case integrated 5U frame, and a heat exchanger component, a pipeline system, a fan component and the like are respectively integrated in the 3U case and the 2U case.
The invention aims at realizing the following technical scheme:
a 5U rack submerged liquid cooling system, the liquid cooling system comprising:
the machine case comprises a 3U machine case and a 2U machine case, wherein the 3U machine case and the 2U machine case are arranged in parallel up and down, and a cooled device is arranged in the 3U machine case;
the heat exchanger component is arranged in the 2U case;
the pipeline system comprises a liquid inlet pipeline, a liquid outlet pipeline and a circulating pump, wherein the liquid inlet pipeline and the circulating pump are arranged in the 2U machine box and are positioned at the front side of the heat exchanger component, and the liquid outlet pipeline is arranged in the 2U machine box and is positioned at the rear side of the heat exchanger component; one end of the liquid inlet pipeline sequentially penetrates through the front side surface of the 2U machine case, the front side surface of the 3U machine case and is communicated with the inside of the 3U machine case, a circulating pump is arranged on the liquid inlet pipeline, and the other end of the liquid inlet pipeline is communicated with the heat exchanger component; one end of the liquid outlet pipeline is communicated with the heat exchanger component, and the other end of the liquid outlet pipeline sequentially penetrates through the rear side surface of the 2U machine case, the rear side surface of the 3U machine case and the interior of the 3U machine case;
the fan assembly is arranged on the front side surface of the 2U case, a cooling channel is formed between the heat exchanger assembly and the case, and air flow generated by the fan assembly discharges heat generated by the heat exchanger assembly through the cooling channel; the fan assembly is composed of 1 or more fans.
The 5U frame type submerged liquid cooling system is designed according to the size of a standard server case aiming at a 19' frame, wherein the case comprises a 3U case and a 2U case, the 3U case and the 2U case are integrated with the 5U frame, and a heat exchanger component, a pipeline system, a fan component and the like are integrated in the case.
The 3U case is used for placing the cooled device and a container for containing cooling liquid, is a main place for heat exchange between the cooled device and the cooling liquid, the cooling liquid is heated after heat exchange between the inside of the 3U case and the cooled device, the cooling liquid flows out of the 3U case through the liquid inlet pipeline to take away heat, and the cooling liquid is cooled after passing through the liquid inlet pipeline and the heat exchanger component under the pressure of the circulating pump, and enters the 3U case again from the liquid outlet pipeline.
Further, the 5U rack-type immersion liquid cooling system, the chassis further includes:
the top cover plate is arranged on the top surface of the 3U chassis;
the front panel is arranged on the front side surface of the 3U chassis and is arranged up and down in parallel with the fan assembly.
Further, the 5U rack-type immersion liquid cooling system further includes:
the emptying device comprises an emptying valve assembly, wherein the emptying valve assembly comprises an emptying pipeline and an emptying valve, one end of the emptying pipeline penetrates through the front side surface of the 3U machine case and is communicated with the interior of the 3U machine case, the other end of the emptying pipeline penetrates through the front panel, and the emptying pipeline is provided with the emptying valve.
The emptying valve assembly is arranged to drain the cooling medium of the 3U machine box during overhauling and maintenance.
Further, the above-mentioned 5U rack-mounted immersion liquid cooling system, the heat exchanger subassembly includes:
the heat exchange group plate consists of a plurality of cold plates;
and the cooling plate is provided with fins.
Further, the above-mentioned 5U rack-type immersion liquid cooling system, the heat transfer group board includes:
the left side cold plate group consists of 2 cold plates, wherein the 2 cold plates are arranged up and down in parallel, and fins are arranged between the 2 cold plates; the inside of the 2 cold plates is provided with left heat exchange tubes, and two ends of each left heat exchange tube extend out of the front side surface and the rear side surface of the cold plate respectively;
the right side cold plate group also comprises 2 cold plates, wherein the 2 cold plates are arranged up and down in parallel, and fins are arranged between the 2 cold plates; the inside of the 2 cold plates is provided with right heat exchange tubes, and two ends of each right heat exchange tube extend out of the front side surface and the rear side surface of the cold plate respectively;
the middle cold plate consists of 1 cold plate and is positioned between the left cold plate group and the right cold plate group, and fins are arranged on the cold plates; the cold plate is internally provided with a middle heat exchange tube, the middle heat exchange tube is provided with 3 tube ends and extends out of the front side surface of the cold plate, one tube end positioned on the left side is connected with one end of 2 left heat exchange tubes extending out of the front side surface of the cold plate through a three-way joint, one tube end positioned on the middle is connected with a liquid inlet pipeline, and one tube end positioned on the right side is connected with one end of 2 right heat exchange tubes extending out of the front side surface of the cold plate through a three-way joint.
Further, the above-mentioned 5U rack-type immersion liquid cooling system, the heat exchange group board still includes:
one end of the left outlet pipe is connected with one end of the 2 left heat exchange pipes extending out of the rear side surface of the cold plate through a three-way joint, and the other end of the left outlet pipe is connected with a liquid outlet pipeline;
the right side exit tube, the one end of right side exit tube is connected with 2 right side heat exchange tube stretches out the one end of cold plate trailing flank through three way connection, the other end and the play liquid pipeline connection of right side exit tube.
The heat exchanger component adopts cold plate type air-liquid heat dissipation, the heat exchange group plate is composed of a plurality of cold plates, the size of the cold plates is small, the combination of a plurality of cold plates enables the design to be more flexible, and scattered space in the 2U chassis can be fully utilized to meet the heat exchange area requirement.
Further, in the 5U-frame type submerged liquid cooling system, the parameter T of the fin is 0.3mm, and the parameter P of the fin is 1.8mm.
The fin with the structure is matched with the cold plate, and the heat exchange effect is good.
The columnar structure is used for matching with the small door and providing guiding function and shrinkage shape fixation for the valve core during installation.
Further, the 5U rack-type immersion liquid cooling system further includes:
and the electrical component is arranged in the 2U chassis.
Through the split type structure of electrical component and other subassemblies of liquid cooling system, reduced the pipeline quantity in the electrical component, electrical component and liquid cooling system's heat exchanger subassembly, circulating pump, fan subassembly etc. electric connection and control its operation.
Further, the 5U rack-type immersion liquid cooling system further includes:
the PCB is arranged in the 2U case and is positioned on one side of the heat exchanger component.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention discloses a 5U frame type immersed liquid cooling system, which is reasonable in structural design, is designed according to the size of a standard server case aiming at a 19' frame, wherein the case comprises a 3U case and a 2U case, the 3U case and the 2U case are integrated with the 5U frame, a cooled device is arranged in the 3U case, a heat exchanger component, a pipeline system, an electric component and a PCB (printed circuit board) are arranged in the 2U case, a fan component is arranged on the front side surface of the 2U case, and the immersed liquid cooling system is compact in structure, highly integrated, suitable for immersed liquid cooling of the cooled device and suitable for flexible deployment of a data center;
(2) The invention discloses a 5U frame type immersion liquid cooling system.A 3U case is a container for placing a cooled device and containing cooling liquid, is a main place for heat exchange between the cooled device and the cooling liquid, the cooling liquid is subjected to heat exchange between the inside of the 3U case and the cooled device, the temperature of the cooling liquid is increased, the cooling liquid flows out of the 3U case through a liquid inlet pipeline to take away the heat, and under the pressure of a circulating pump, the temperature of the cooling liquid is reduced after heat exchange between the cooling liquid and a heat exchange device through a liquid inlet pipeline of the 2U case, and the cooling liquid enters the 3U case again from a liquid outlet pipeline; the design ensures that the cooled device is directly immersed in the cooling liquid, and the cooling liquid is used as a heat transmission medium by means of absorbing the heat generated by the cooled device, and can conduct and absorb the heat more quickly because the liquid has higher heat conductivity and specific heat capacity;
(3) According to the 5U frame type submerged liquid cooling system disclosed by the invention, the heat exchanger component adopts the cold plate type air-liquid heat radiation, the heat exchange group plate consists of a plurality of cold plates, the size of the cold plates is small, the combination of the plurality of cold plates enables the design to be more flexible, and the scattered space in the 2U machine case can be fully utilized to meet the heat exchange area requirement; the fin with the structural parameters is matched with the cold plate, so that the heat exchange effect is better.
Drawings
FIG. 1 is a schematic diagram of a 5U rack-mounted immersion liquid cooling system according to the present invention;
FIG. 2 is a left/right side view of a 5U rack immersion liquid cooling system according to the present invention;
FIG. 3 is a top view of a 5U rack immersion liquid cooling system according to the present invention;
FIG. 4 is a front side view of a 5U rack immersion liquid cooling system according to the present invention;
FIG. 5 is a rear side view of a 5U rack immersion liquid cooling system according to the present invention;
FIG. 6 is an exploded view of a 5U rack-mounted immersion liquid cooling system according to the present invention;
FIG. 7 is a schematic diagram of a heat exchanger assembly of the 5U rack-mounted submerged cooling system according to the present invention;
FIG. 8 is a top view of a heat exchanger assembly of a 5U rack-submerged cooling system according to the present invention;
FIG. 9 is a rear view of a heat exchanger assembly of the 5U rack-submerged cooling system of the present invention;
FIG. 10 is a schematic view of the VI (2:1 ratio) of FIG. 10 of a 5U rack-submerged cooling system according to the present invention;
in the figure: chassis 1, 3U chassis 11, 2U chassis 12, top cover 13, front panel 14, heat exchanger assembly 2, heat exchanger package plate 21, cold plate 201, left side cold plate package 211, left side heat exchange tube 212, right side cold plate package 213, right side heat exchange tube 214, middle cold plate 215, middle heat exchange tube 216, tube end 2161, three-way joint 217, left side exit tube 218, right side exit tube 219, fins 22, piping system 3, liquid inlet piping 31, liquid outlet piping 32, circulation pump 33, fan assembly 4, fan 41, drain valve assembly 5, drain piping 51, drain valve 52, electrical assembly 6, PCB board 7, cooled device a.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 10 and comparative examples, examples and specific experimental data, and it is apparent that the described embodiments are only some of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The following embodiments 1-3 provide a 5U rack-mounted immersion liquid cooling system, which specifically comprises the following steps:
example 1
As shown in fig. 1-6, the 5U rack-type immersion liquid cooling system comprises a chassis 1, a heat exchanger assembly 2, a pipeline system 3, a fan assembly 4, an electrical assembly 6 and a PCB board 7.
The case 1 includes a 3U case 11 and a 2U case 12, the 3U case 11 and the 2U case 12 are arranged in parallel up and down, the cooled device a is disposed in the 3U case 11, and the 3U case 11 is a container for placing the cooled device a and containing cooling liquid, and is a main place where the cooled device a and the cooling liquid exchange heat.
The heat exchanger component 2, the pipeline system 3, the electrical component 6 and the PCB 7 are arranged in the 2U case 12, one end of a liquid inlet pipeline 31 of the pipeline system 3 sequentially penetrates through the front side surface of the 2U case 12, the front side surface of the 3U case 11 and the interior of the 3U case 11, one end of a liquid outlet pipeline 32 sequentially penetrates through the rear side surface of the 2U case 12 and the rear side surface of the 3U case 11 and the interior of the 3U case 11, after heat exchange is carried out on cooling liquid in the 3U case 11 and a cooled device a, the temperature of the cooling liquid rises, the cooling liquid flows out of the 3U case 11 through a liquid inlet pipeline 31 to take away heat, and under the pressure of a circulating pump 33, the temperature of the cooling liquid is reduced after passing through the liquid inlet pipeline 31 and the heat exchanger component 2, and then the cooling liquid enters the 3U case 11 again from the liquid outlet pipeline 32.
The design enables the cooled device a to be directly soaked in the cooling liquid, and the cooling liquid is used as a heat transmission medium by means of absorbing the heat generated by the cooled device a, so that the liquid has higher heat conductivity and specific heat capacity, and can conduct and absorb the heat more quickly and effectively, and meanwhile, the use of a fan and an air conditioner is reduced, so that the energy utilization rate is higher.
In addition, fan assembly 4 is disposed on the front side of 2U chassis 12 for generating an air flow through the cooling channels to remove heat generated by heat exchanger assembly 2.
The design ensures that the liquid cooling system has compact structure, high integration of each component, adaptation of submerged liquid cooling of the aAVC main board of the cooling device and the like, and flexible deployment of the data center.
Example 2
The structural basis based on embodiment 1 above is shown in fig. 7-10.
The heat exchanger component 2 of the 5U rack-type immersion liquid cooling system comprises a heat exchange group plate 21 and fins 22. The heat exchange group plate 21 is composed of a plurality of cold plates 201, specifically, the heat exchange group plate 21 comprises a left cold plate group 211, a right cold plate group 213 and a middle cold plate 215, the left cold plate group 211 is composed of 2 cold plates 201, 2 cold plates 201 are arranged in parallel up and down, fins 22 are arranged between the 2 cold plates 201, the right cold plate group 213 is also composed of 2 cold plates 201, 2 cold plates 201 are arranged in parallel up and down, fins 22 are arranged between the 2 cold plates 201, and the middle cold plate 212 is composed of 1 cold plate 201 and is positioned between the left cold plate group 211 and the right cold plate group 213, and the fins 22 are arranged on the cold plates 201. The left side cooling plate group 211 is provided with a left side heat exchange tube 212, the right side cooling plate group 213 is provided with a right side heat exchange tube 214, and the middle cooling plate 215 is provided with a middle heat exchange tube 216.
From the above, the heat exchanger component 2 of the invention adopts a cold plate type air-liquid heat dissipation mode, the heat exchange group plate 21 consists of a plurality of cold plates 201, the size of the cold plates 201 is small, the combination of the plurality of cold plates 201 enables the design to be more flexible, and the scattered space in the 2U chassis can be fully utilized to meet the heat exchange area requirement.
Further, the parameter T of the fin 22 is 0.3mm, the parameter P of the fin 22 is 1.8mm, and the fin with the structure is matched with the cold plate, so that the heat exchange effect is good.
Example 3
The structural basis based on embodiment 1 or embodiment 2 above is shown in fig. 6.
The 5U frame type immersion liquid cooling system further comprises a drain valve assembly 5, one end of a drain pipeline 51 of the drain valve assembly 5 penetrates through the front side surface of the 3U machine case 11 to be communicated with the interior of the 3U machine case 11, the other end of the drain pipeline 51 penetrates through the front panel 14, and a drain valve 52 is arranged on the drain pipeline 51. The drain valve assembly 5 is provided to drain the cooling medium of the 3U cabinet during the service.
There are many ways in which the invention may be practiced, and what has been described above is merely a preferred embodiment of the invention. It should be noted that the above examples are only for illustrating the present invention and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that modifications may be made without departing from the principles of the invention, and such modifications are intended to be within the scope of the invention.
Claims (7)
1. A 5U rack submerged liquid cooling system, wherein the liquid cooling system comprises:
the device comprises a case (1), wherein the case (1) comprises a 3U case (11), a 2U case (12) and a top cover plate (13), the 3U case (11) and the 2U case (12) are arranged in parallel up and down, and a cooled device is arranged in the 3U case (11); the top cover plate (13) is arranged on the top surface of the 3U case (11);
the heat exchanger assembly (2) is arranged in the 2U case (12), and the heat exchanger assembly (2) comprises a heat exchange group plate (21) and fins (22); the heat exchanger assembly (2) comprises a left cold plate group (211), a left heat exchange tube (212), a right cold plate group (213), a right heat exchange tube (214), a middle cold plate (215) and a three-way joint (217), wherein the left cold plate group (211) consists of 2 cold plates (201), 2 cold plates (201) are arranged in parallel up and down, and fins (22) are arranged between the 2 cold plates (201); the inside of the 2 cold plates (201) is provided with left heat exchange tubes (212), and two ends of each left heat exchange tube (212) extend out of the front side surface and the rear side surface of the cold plate (201) respectively; the right side cold plate group (213) is also composed of 2 cold plates (201), the 2 cold plates (201) are arranged in parallel up and down, and fins (22) are arranged between the 2 cold plates (201); the inside of the 2 cold plates (201) is provided with right heat exchange tubes (214), and two ends of each right heat exchange tube (214) extend out of the front side surface and the rear side surface of the cold plate (201) respectively; the middle cold plate (212) consists of 1 cold plate (201) and is positioned between the left cold plate group (211) and the right cold plate group (213), and fins (22) are arranged on the cold plates (201); the cold plate (201) is internally provided with a middle heat exchange tube (216), the middle heat exchange tube (216) is provided with 3 tube ends (2161) and extends out of the front side surface of the cold plate (201), one tube end (2161) positioned at the left side is connected with one end of 2 left heat exchange tubes (212) extending out of the front side surface of the cold plate (201) through a three-way joint (217), one tube end (2161) positioned at the middle is connected with a liquid inlet pipeline (31), and one tube end (2161) positioned at the right side is connected with one end of 2 right heat exchange tubes (214) extending out of the front side surface of the cold plate (201) through the three-way joint (217);
the pipeline system (3), the pipeline system (3) comprises a liquid inlet pipeline (31), a liquid outlet pipeline (32) and a circulating pump (33), the liquid inlet pipeline (31) and the circulating pump (33) are arranged in the 2U machine box (12) and are positioned at the front side of the heat exchanger assembly (2), and the liquid outlet pipeline (32) is arranged in the 2U machine box (12) and is positioned at the rear side of the heat exchanger assembly (2); one end of the liquid inlet pipeline (31) sequentially penetrates through the front side surface of the 2U machine case (12) and the front side surface of the 3U machine case (11) to be communicated with the inside of the 3U machine case (11), a circulating pump (33) is arranged on the liquid inlet pipeline (31), and the other end of the liquid inlet pipeline (31) is communicated with the heat exchanger component (2); one end of the liquid outlet pipeline (32) is communicated with the heat exchanger assembly (2), and the other end of the liquid outlet pipeline (32) sequentially penetrates through the rear side surface of the 2U case (12) and the rear side surface of the 3U case (11) to be communicated with the inside of the 3U case (11);
the fan assembly (4) is arranged on the front side surface of the 2U case (12), a cooling channel is formed between the heat exchanger assembly (2) and the case (1), and the fan assembly (4) generates air flow to discharge heat generated by the heat exchanger assembly (2) through the cooling channel; the fan assembly (4) consists of 1 or more fans (41).
2. The 5U rack immersion liquid cooling system according to claim 1, wherein the chassis (1) further comprises:
and the front panel (14) is arranged on the front side surface of the 3U case (11) and is arranged in parallel with the fan assembly (4) up and down.
3. The 5U rack immersion liquid cooling system of claim 2, further comprising:
the emptying device comprises an emptying valve assembly (5), wherein the emptying valve assembly (5) comprises an emptying pipeline (51) and an emptying valve (52), one end of the emptying pipeline (51) is penetrated through the front side surface of a 3U machine case (11) and is communicated with the interior of the 3U machine case (11), the other end of the emptying pipeline (51) is penetrated through a front panel (14), and the emptying pipeline (51) is provided with the emptying valve (52).
4. The 5U rack-submerged cooling system according to claim 1, wherein the heat exchanger package plate (21) further comprises:
one end of the left outlet pipe (218) is connected with one end of the 2 left heat exchange pipes (212) extending out of the rear side surface of the cold plate (201) through a three-way joint (217), and the other end of the left outlet pipe (218) is connected with the liquid outlet pipeline (32);
the right side exit tube (219), the one end of right side exit tube (219) is connected with 2 right side heat exchange tube (214) stretches out the one end of cold plate (201) trailing flank through three way connection (217), the other end of right side exit tube (219) is connected with play liquid pipeline (32).
5. The 5U rack submerged cooling system of claim 1, wherein the parameter T of the fins (22) is 0.3mm and the parameter P of the fins (22) is 1.8mm.
6. The 5U rack immersion liquid cooling system of claim 1, further comprising:
and the electrical component (6), wherein the electrical component (6) is arranged in the 2U case (12).
7. The 5U rack immersion liquid cooling system of claim 1, further comprising:
the PCB (7) is arranged in the 2U case (12) and is positioned on one side of the heat exchanger component (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211721779.7A CN116321934B (en) | 2022-12-30 | 2022-12-30 | 5U rack-type immersion liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211721779.7A CN116321934B (en) | 2022-12-30 | 2022-12-30 | 5U rack-type immersion liquid cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116321934A CN116321934A (en) | 2023-06-23 |
| CN116321934B true CN116321934B (en) | 2023-12-22 |
Family
ID=86821073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211721779.7A Active CN116321934B (en) | 2022-12-30 | 2022-12-30 | 5U rack-type immersion liquid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116321934B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017215162A1 (en) * | 2016-06-16 | 2017-12-21 | 广东合一新材料研究院有限公司 | Cooling system of working medium contact type for high-power electrical device |
| WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN209314194U (en) * | 2018-10-12 | 2019-08-27 | 北京丰联奥睿科技有限公司 | A kind of cooling system of liquid dipping machine cabinet |
| CN111031770A (en) * | 2020-01-15 | 2020-04-17 | 许昌许继晶锐科技有限公司 | Server rack and heat exchange equipment cabinet for server |
| CN111526694A (en) * | 2019-02-02 | 2020-08-11 | 北京百度网讯科技有限公司 | Liquid cooling system for server cabinet and server cabinet |
| CN213482808U (en) * | 2020-08-18 | 2021-06-18 | 中国船舶重工集团公司第七一五研究所 | Wind-liquid integrated heat dissipation case |
| CN113056167A (en) * | 2021-03-05 | 2021-06-29 | 上海菡威装备有限公司 | Liquid cooling server heat exchange equipment based on separate heat pipe heat exchanger |
| CN113710057A (en) * | 2021-08-12 | 2021-11-26 | 中国电子科技集团公司电子科学研究院 | Airborne single-phase immersed comprehensive circulating heat management system and airborne integrated comprehensive rack |
| WO2022017346A1 (en) * | 2020-07-24 | 2022-01-27 | 阿里巴巴集团控股有限公司 | Single-phase immersed liquid cooling system |
| CN114096133A (en) * | 2021-12-22 | 2022-02-25 | 北京字节跳动网络技术有限公司 | Immersed liquid cooling device and liquid cooling system |
| CN114190063A (en) * | 2021-12-22 | 2022-03-15 | 苏州浪潮智能科技有限公司 | Integrated directional immersion cooling type server module and data center |
| CN115220545A (en) * | 2022-07-21 | 2022-10-21 | 山西国科睿创科技有限公司 | Non-phase-change immersion type liquid cooling server |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11778778B2 (en) * | 2020-11-03 | 2023-10-03 | Cmotion Technologies Limited | Liquid-cooled container equipment |
-
2022
- 2022-12-30 CN CN202211721779.7A patent/CN116321934B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017215162A1 (en) * | 2016-06-16 | 2017-12-21 | 广东合一新材料研究院有限公司 | Cooling system of working medium contact type for high-power electrical device |
| WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN209314194U (en) * | 2018-10-12 | 2019-08-27 | 北京丰联奥睿科技有限公司 | A kind of cooling system of liquid dipping machine cabinet |
| CN111526694A (en) * | 2019-02-02 | 2020-08-11 | 北京百度网讯科技有限公司 | Liquid cooling system for server cabinet and server cabinet |
| CN111031770A (en) * | 2020-01-15 | 2020-04-17 | 许昌许继晶锐科技有限公司 | Server rack and heat exchange equipment cabinet for server |
| WO2022017346A1 (en) * | 2020-07-24 | 2022-01-27 | 阿里巴巴集团控股有限公司 | Single-phase immersed liquid cooling system |
| CN213482808U (en) * | 2020-08-18 | 2021-06-18 | 中国船舶重工集团公司第七一五研究所 | Wind-liquid integrated heat dissipation case |
| CN113056167A (en) * | 2021-03-05 | 2021-06-29 | 上海菡威装备有限公司 | Liquid cooling server heat exchange equipment based on separate heat pipe heat exchanger |
| CN113710057A (en) * | 2021-08-12 | 2021-11-26 | 中国电子科技集团公司电子科学研究院 | Airborne single-phase immersed comprehensive circulating heat management system and airborne integrated comprehensive rack |
| CN114096133A (en) * | 2021-12-22 | 2022-02-25 | 北京字节跳动网络技术有限公司 | Immersed liquid cooling device and liquid cooling system |
| CN114190063A (en) * | 2021-12-22 | 2022-03-15 | 苏州浪潮智能科技有限公司 | Integrated directional immersion cooling type server module and data center |
| CN115220545A (en) * | 2022-07-21 | 2022-10-21 | 山西国科睿创科技有限公司 | Non-phase-change immersion type liquid cooling server |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116321934A (en) | 2023-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111176389A (en) | Semiconductor dehumidification device and liquid cooling server | |
| CN207589404U (en) | A kind of electronic equipment liquid cold cabinet | |
| CN109152314B (en) | Heat abstractor, control radiating component and washing machine | |
| CN116321934B (en) | 5U rack-type immersion liquid cooling system | |
| CN216626506U (en) | Data center cooling system and data center | |
| CN204598553U (en) | A kind of water-cooled cabinet and the water-cooling system containing this rack | |
| CN211745074U (en) | Server cabinet and heat exchange equipment cabinet for server | |
| CN102467202A (en) | Cooling system of server and method for cooling electronic device | |
| CN209946807U (en) | Auxiliary heat dissipation device for computer case | |
| CN114860051B (en) | Low-voltage direct-current power supply immersion liquid cooling artificial intelligence server | |
| CN205665634U (en) | Liquid cooling's rack -mounted server | |
| CN210168376U (en) | Data center water-cooling heat dissipation rack | |
| CN114727566A (en) | Ultra-computation/data center passive cooling system with low energy consumption | |
| CN209216031U (en) | A kind of radiator on computer | |
| CN221930564U (en) | Cabinet for data communication equipment | |
| CN208242073U (en) | The cooling system of a kind of electronic equipment | |
| CN221531816U (en) | Body fluid cooling and radiating device of server cabinet | |
| CN217011603U (en) | Rack-mounted case contact heat dissipation module | |
| CN217825810U (en) | Single-phase immersed heat dissipation system | |
| CN221862290U (en) | Dustless switch board with heat dissipation function | |
| CN216795362U (en) | Circuit board heat dissipation device | |
| CN218449118U (en) | Energy-conserving electric power distribution low-voltage switchgear | |
| US20230266068A1 (en) | Waste heat utilization system of immersed liquid cooling heat dissipation device | |
| CN200953119Y (en) | Computer radiating device with cooling function | |
| CN213659378U (en) | Water-cooling circulation equipment for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |