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CN116141110A - Processing device - Google Patents

Processing device Download PDF

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Publication number
CN116141110A
CN116141110A CN202211423557.7A CN202211423557A CN116141110A CN 116141110 A CN116141110 A CN 116141110A CN 202211423557 A CN202211423557 A CN 202211423557A CN 116141110 A CN116141110 A CN 116141110A
Authority
CN
China
Prior art keywords
workpiece
light
cassette
unit
storage area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211423557.7A
Other languages
Chinese (zh)
Inventor
山本大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN116141110A publication Critical patent/CN116141110A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Provided is a processing device capable of detecting whether or not a workpiece is stored in a storage area of a cassette in an early stage, regardless of the shape of the workpiece and the surface state of a side surface. The processing device comprises: a cassette mounting table for mounting a cassette for storing the workpiece, the cassette having a plurality of storage areas capable of storing the workpiece; a carry-in/out unit for carrying in/out the workpiece with respect to the cassette; and a sensor unit that detects the presence or absence of the workpiece stored in each storage area of the cassette placed on the cassette placement stage, the sensor unit including: a light emitting unit having a plurality of light emitting portions capable of irradiating light to the plurality of storage areas of the cartridge, respectively; and a light receiving unit having a plurality of light receiving portions capable of receiving the light diffusely reflected by the side surface of the object to be processed, and determining whether or not the object to be processed is stored in the storage area based on whether or not the light diffusely reflected by the side surface of the object to be processed is received by the light receiving portions.

Description

Processing device
Technical Field
The present invention relates to a processing apparatus for carrying in a plate-shaped object to be processed in a state in which the object is accommodated in a cassette and processing the object.
Background
A disk-shaped wafer having a plurality of devices such as ICs and LSIs formed on its front surface is thinned to a predetermined thickness by processing from the rear surface side by a grinding device and a polishing device, and then the wafer is divided into device chips by processing the regions between the devices by a cutting device and a laser processing device. The device chips manufactured by division are widely used for electronic devices such as mobile phones and personal computers.
In processing apparatuses such as grinding apparatuses, polishing apparatuses, cutting apparatuses, and laser processing apparatuses, a plurality of plate-shaped objects to be processed are collectively carried into the processing apparatus in a state of being accommodated in a cassette. The cassette has a plurality of storage areas for storing plate-like objects to be processed such as wafers. The storage areas are stacked in the vertical direction, and each plate-shaped workpiece is stored in each storage area such that the front and rear surfaces thereof are in the horizontal direction. The processing apparatus further includes a carry-out/carry-in unit that carries out the processed object stored in the storage area of the cassette from the cassette and returns the processed object to the storage area.
Here, the workpiece is not necessarily accommodated in all the accommodation areas of the cassette. For example, in any of various steps performed on a workpiece, there are cases where the workpiece is not processed with sufficient quality or damage is generated to the workpiece. Even if such a workpiece is further processed thereafter, a result of sufficient quality is not obtained, and therefore such a workpiece is excluded from the cassette in the middle of the process. At this time, the storage area of a part of the cassette is empty. When the number of objects to be processed is smaller than the number of storage areas, a part of the storage areas is left empty from the beginning.
Therefore, the processing apparatus includes an optical sensor unit for detecting the presence or absence of the object to be processed stored in each storage area when the cassette is carried in. For example, the sensor unit is attached to the carry-in/out unit, and the carry-in/out unit is brought close to the storage area as the detection target, and the presence or absence of the workpiece is detected by the sensor unit. Alternatively, the processing apparatus includes an independent sensor unit that can be lifted and lowered, and detects the presence or absence of the object to be processed in each storage area while lifting and lowering the sensor unit in front of the cassette (see patent documents 1 and 2).
The sensor unit has a light emitting section and a light receiving section. For example, the processing device moves the sensor unit in and out of the cassette so that the outer peripheral portion of the disk-shaped object to be processed is positioned between the light emitting portion and the light receiving portion which are arranged along the substantially horizontal plane. Then, whether or not the light emitted from the light emitting section reaches the light receiving section, that is, whether or not the light is shielded by the workpiece is determined as a criterion, and whether or not the workpiece is present is detected.
The processing device irradiates the light emitted from the light emitting unit to the storage area from outside the cassette, and detects the presence or absence of the workpiece using whether or not the light is reflected by the smooth side surface of the workpiece and reaches the light receiving unit as a criterion.
Patent document 1: japanese patent application laid-open No. 2015-50410
Patent document 2: japanese patent laid-open publication No. 2018-26486
In some cases, a processing apparatus carries in a rectangular workpiece instead of a disk-shaped workpiece and processes the workpiece. When a rectangular workpiece is stored in the storage area, the light emitting portion and the light receiving portion cannot be inserted into the storage area so as to sandwich the workpiece between the light emitting portion and the light receiving portion. In addition, when light is irradiated from the light emitting portion of the sensor unit positioned outside the cassette to the side surface of the workpiece and the reflected light is detected by the light receiving portion, if the side surface of the workpiece is not a smooth surface, the light is scattered on the side surface and is hard to reach the light receiving portion.
It takes time to raise and lower the sensor unit in front of the cassette to sequentially detect the presence or absence of the workpiece in each storage area. Therefore, it is necessary to wait for the carry-out operation of the workpiece before the detection of the workpiece is completed, and this may cause a decrease in the processing efficiency of the workpiece in the processing apparatus.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and an object thereof is to provide a processing apparatus capable of early detecting whether or not a workpiece is stored in a storage area of a cassette, regardless of the shape of the workpiece and the surface state of a side surface, and early starting a work of carrying out the workpiece.
According to one aspect of the present invention, there is provided a processing apparatus for processing an object to be processed, the processing apparatus comprising: a chuck table for holding a workpiece; a processing unit for processing the workpiece held by the chuck table; a 1 st cartridge mounting table for mounting a cartridge for storing the workpiece, the cartridge having a plurality of storage areas capable of storing the workpiece, respectively; a carry-in/out unit that carries in/out the workpiece with respect to the cassette; and a sensor unit that detects the presence or absence of the workpiece stored in each storage area of the cassette placed on the 1 st cassette placement stage, the sensor unit including: a light emitting unit having a plurality of light emitting portions capable of emitting light to the plurality of storage areas of the cassette mounted on the 1 st cassette mounting stage, respectively; and a light receiving unit having a plurality of light receiving portions capable of receiving the light diffusely reflected by the side surfaces of the object to be processed received in the plurality of receiving areas of the cassette placed on the 1 st cassette placement stage, respectively, and determining whether or not the object to be processed received in the receiving area of the cassette placed on the 1 st cassette placement stage is present based on whether or not the light diffusely reflected by the side surfaces of the object to be processed is received by the light receiving portions.
Preferably, the processing apparatus further has a 2 nd cartridge stage adjacent to the 1 st cartridge stage, and the sensor unit further includes: a main body that is erected adjacent to the 1 st cartridge mounting table and the 2 nd cartridge mounting table, and to which the light emitting unit and the light receiving unit are attached; and a rotation driving source capable of changing the orientations of the light emitting unit and the light receiving unit by rotating the main body, irradiating light from the light emitting portion of the light emitting unit to the storage region of the cartridge mounted on the 2 nd cartridge mounting table, and receiving the light diffusely reflected by the side surface of the object to be processed stored in the storage region of the cartridge mounted on the 2 nd cartridge mounting table by the light receiving portion of the light receiving unit, thereby determining whether or not the object to be processed stored in the storage region of the cartridge mounted on the 2 nd cartridge mounting table.
Preferably, the machining means is a grinding means capable of grinding the workpiece held by the chuck table.
A sensor unit of a processing apparatus according to an embodiment of the present invention includes: a light emitting unit having a plurality of light emitting portions capable of irradiating light to a plurality of storage areas of the cartridge, respectively; and a light receiving unit having a plurality of light receiving portions capable of receiving light diffusely reflected by the side surfaces of the workpiece, respectively. The processing device determines whether or not the object to be processed is stored in the storage area of the cassette based on whether or not the light receiving portion receives the light.
Here, the processing device can detect the presence or absence of the object to be processed in each storage area of the cassette at the same time, and in this case, the sensor unit does not need to be lifted and lowered. Therefore, whether or not the workpiece is present in each storage area of the cartridge can be detected instantaneously. Further, since the sensor unit detects light diffusely reflected by the side surface of the workpiece, the presence or absence of the workpiece whose side surface is not smooth can be detected, and a workpiece other than a circular shape can be detected.
Therefore, according to the present invention, it is possible to provide a processing apparatus capable of early detecting whether or not a workpiece is stored in a storage area of a cassette and early starting a work of carrying out the workpiece, regardless of the shape of the workpiece and the surface state of the side surface.
Drawings
Fig. 1 is a perspective view schematically showing a processing apparatus.
Fig. 2 is a cross-sectional view schematically showing a workpiece accommodated in the cassette and the sensor unit.
Fig. 3 is a plan view schematically showing a workpiece accommodated in the cassette and the sensor unit.
Fig. 4 (a) is a perspective view schematically showing a case where the presence or absence of a workpiece in the storage area of the 1 st cartridge is detected by the sensor unit, and fig. 4 (B) is a perspective view schematically showing a case where the presence or absence of a workpiece in the storage area of the 2 nd cartridge is detected by the sensor unit.
Fig. 5 (a) is a plan view schematically showing a case where the presence or absence of a workpiece in the storage area of the 1 st cartridge is detected by the sensor unit, and fig. 5 (B) is a plan view schematically showing a case where the presence or absence of a workpiece in the storage area of the 2 nd cartridge is detected by the sensor unit.
Description of the reference numerals
1: a workpiece; 3: a side surface; 2: a grinding device; 4: a base station; 4a: an upper surface; 6a, 6b: a cassette mounting table; 8a, 8b: a case; 10: a carry-in/out unit; 14a, 14b: an opening; 16a, 16b: an X-axis moving stage; 18a, 18b: a dust-proof drip-proof cover; 20a, 20b: a chuck table; 22a, 22b: a porous member; 24a, 24b: a support section; 26a, 26b: a Z-axis guide rail; 28a, 28b: a Z-axis moving plate; 30a, 30b: a Z-axis ball screw; 31a, 31b: a Z-axis pulse motor; 32a, 32b: a grinding unit; 34a, 34b: a main shaft; 36a, 36b: a mounting base; 38a, 38b: a grinding wheel base; 40a, 40b: grinding tool; 42a, 42b: grinding the grinding wheel; 44: a rotary cleaning device; 46: a sensor unit; 48: a storage area; 50: a carry-out inlet; 52: an inner wall; 54: a light emitting unit; 54a: a light emitting section; 56: a light receiving unit; 56a: a light receiving section; 58: a rotation driving source; 60: a main body; 62. 64: light.
Detailed Description
An embodiment of the present invention will be described with reference to the drawings. The processing apparatus according to the present embodiment is, for example, a grinding apparatus for grinding a workpiece such as a disk-shaped wafer or a rectangular resin substrate formed of a semiconductor, or a polishing apparatus for polishing a workpiece. Or a cutting device or a laser processing device used for dividing the workpiece. Fig. 1 shows a grinding device 2 as an example of the processing device of the present embodiment. The case where the machining device of the present embodiment is the grinding device 2 will be described below as an example, but the machining device of the present embodiment is not limited to the grinding device 2.
In the grinding device (processing device) 2, the objects to be processed are carried in the state of being accommodated in the cassettes 8a, 8b, and the objects to be processed carried out from the cassettes 8a, 8b are ground (processed), and returned to the cassettes 8a, 8b. The workpiece to be ground by the grinding device 2 is made of, for example, silicon carbide, or another semiconductor material, or a sapphire, glass, or quartz material. Alternatively, the work is a resin substrate such as a package substrate or a printed circuit board in which a plurality of chips are sealed with a molding resin.
Fig. 2 and 3 show a rectangular resin substrate as an example of the workpiece 1. That is, fig. 2 includes a cross-sectional view schematically showing the work 1 as a resin substrate, and fig. 3 includes a plan view schematically showing the work 1 as a resin substrate. The processing apparatus of the present embodiment will be described below taking a case where the object 1 is a rectangular resin substrate as an example, but the object 1 is not limited to the rectangular resin substrate.
Fig. 1 is a perspective view schematically showing a grinding apparatus 2. The grinding device 2 has a base 4 for supporting each structure. A 1 st cartridge mount table 6a and a 2 nd cartridge mount table 6b are provided on an upper surface 4a of a front side portion of the base 4. However, the number of cassette mounting blocks 6a and 6b included in the grinding device 2 is not limited to two.
The 1 st cassette 8a storing the workpiece 1 before grinding is placed on the 1 st cassette placement table 6a, for example. A 2 nd cassette 8b for accommodating the workpiece 1 after grinding is mounted on the 2 nd cassette mounting block 6b, for example. However, the use of the respective cassette mounting tables 6a, 6b and the cassettes 8a, 8b is not limited thereto. The workpiece 1 stored in the 1 st cassette 8a can be returned to the 1 st cassette 8a after grinding.
Fig. 2 shows a cross-sectional view schematically illustrating the cassettes 8a, 8b mounted on the cassette mounting tables 6a, 6b. The cassettes 8a and 8b are, for example, rectangular parallelepiped box-shaped with a carry-out/carry-in port 50 provided on the front side in the horizontal direction, and house a plurality of workpieces 1 in the inner space so as to overlap in the longitudinal direction.
Each of the cassettes 8a and 8b has a plurality of storage areas 48 in which the workpiece 1 can be stored. Each of the storage areas 48 is defined by, for example, grooves formed in the horizontal direction on the two inner walls 52 of the inner space. One end of the groove reaches the carry-in/out port 50, and is formed at the same height on both inner walls 52 of the internal space. The inner spaces of the cartridges 8a, 8b are formed to have a width and depth corresponding to the workpiece 1.
When the workpiece 1 is stored in the cassettes 8a, 8b, the orientation of the workpiece 1 is aligned with the horizontal direction, and the height of the workpiece 1 is aligned with the storage area 48 in which the workpiece 1 is to be stored. Then, the workpiece 1 is inserted into the cassettes 8a and 8b from the carry-out port 50 in the horizontal direction, and the workpiece 1 is pushed in along the slot. Then, both end portions of the workpiece 1 are supported by the grooves, and the workpiece 1 is accommodated in the accommodation area 48.
The storage area 48 may be formed of a structure other than a groove formed in the inner wall 52 of the cassettes 8a and 8b. For example, rails along the horizontal direction may be fixed to the two inner walls 52 of the cassettes 8a and 8b, respectively, and the storage area 48 may be constituted by the rails. Hereinafter, description will be continued taking a case where the storage area 48 is constituted by a groove as an example.
The cassettes 8a and 8b have a plurality of storage areas 48 arranged in the longitudinal direction inside. The workpiece 1 can be stored in the number of storage areas 48. The workpiece 1 is conveyed between the processing apparatuses in a state of being accommodated in the cassettes 8a and 8b, is pulled out from the cassettes 8a and 8b in the respective processing apparatuses to be processed, and is returned to the cassettes 8a and 8b to be processed in a series.
The grinding device 2 will be described further. The grinding device 2 has a carry-in/out unit 10 mounted on the base 4 at a position adjacent to the cassette mounting tables 6a and 6b. The carry-in/out unit 10 includes: a function of carrying out the workpiece 1 from the cassettes 8a, 8b placed on the cassette mounting tables 6a, 6b and carrying it to a predetermined carrying destination; and a function of carrying the processed object 1 into the cassettes 8a, 8b.
The carry-in/out unit 10 is formed by, for example, an articulated robot as shown in fig. 1, and is configured to move the support portion of the distal end freely by rotating the arm portions about the connecting portions, which connect the arm portions, as axes, and expanding and contracting the arm portions. One or both of the carry-in/out unit 10 and the cassette mounting tables 6a and 6b can be lifted and lowered, and the support portion of the carry-in/out unit 10 is positioned at a height corresponding to the predetermined storage area 48 of the cassettes 8a and 8b by lifting and lowering the one or both.
Two openings 14a, 14b are provided on the upper surface of the rear side portion of the base 4 of the grinding device 2. The X-axis moving stages 16a and 16b each having chuck tables 20a and 20b for sucking and holding the workpiece 1 are placed on the upper surfaces of the openings 14a and 14b. The X-axis moving stages 16a and 16b are movable in the X-axis direction by an X-axis direction moving mechanism, not shown.
Inside the openings 14a and 14b, the outside of the X-axis moving stages 16a and 16b is covered with dust-proof drip-proof covers 18a and 18b that can expand and contract in accordance with the movement of the X-axis moving stages 16a and 16b. The X-axis direction moving mechanism is protected by dust- proof drip shields 18a, 18 b.
The X-axis moving stages 16a and 16b are positioned in the carry-in/out area for loading and unloading the workpiece 1 on the chuck tables 20a and 20b and in the processing area for grinding the workpiece 1 sucked and held on the chuck tables 20a and 20b by the function of the X-axis direction moving mechanism.
On the upper surfaces of the chuck tables 20a and 20b, porous members 22a and 22b having the same planar shape as the workpiece 1 are exposed. The upper surfaces of the porous members 22a, 22b of the chuck tables 20a, 20b serve as holding surfaces for holding the workpiece 1.
The chuck tables 20a and 20b have suction paths (not shown) having one ends connected to the porous members 22a and 22b and the other ends connected to a suction source (not shown) inside. When the suction source is operated, a negative pressure is applied to the workpiece 1 placed on the holding surface, and the workpiece 1 is sucked and held by the chuck tables 20a and 20b. The chuck tables 20a and 20b are rotatable about axes perpendicular to the holding surfaces.
Grinding units (processing units) 32a, 32b for grinding (processing) the workpiece 1 held by the chuck tables 20a, 20b are disposed above the processing regions of the openings 14a, 14b, respectively. Two support portions 24a and 24b are provided upright at the rear end of the base 4 of the grinding device 2, and the grinding units 32a and 32b are supported by the support portions 24a and 24 b.
A pair of Z- axis guide rails 26a, 26b extending in the Z-axis direction are provided on the front surfaces of the support portions 24a, 24b, and Z- axis moving plates 28a, 28b are slidably attached to the Z- axis guide rails 26a, 26 b.
A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z- axis moving plate 28a, 28b, and Z-axis ball screws 30a, 30b parallel to the Z- axis guide rails 26a, 26b are screwed into the nut portion. The Z- axis pulse motors 31a and 31b are connected to one end portions of the Z-axis ball screws 30a and 30b.
When the Z-axis ball screws 30a and 30b are rotated by the Z- axis pulse motors 31a and 31b, the Z- axis moving plates 28a and 28b move along the Z- axis guide rails 26a and 26b in the Z-axis direction. Grinding units (processing units) 32a, 32b are fixed to front surface side lower portions of the Z- axis moving plates 28a, 28b, respectively. When the Z- axis moving plates 28a and 28b are moved in the Z-axis direction, the grinding units 32a and 32b can be moved in the Z-axis direction.
Each grinding unit 32a, 32b has: main shafts 34a and 34b rotated by motors connected to the base end side; and grinding wheels 42a, 42b fixed to mounting seats 36a, 36b provided on the tip sides of the spindles 34a, 34 b. Each grinding wheel 42a, 42b has: annular grinding wheel bases 38a, 38b formed of a material such as aluminum; the grinding tools 40a, 40b are annularly arranged on the lower surface side of the grinding wheel bases 38a, 38 b.
When the motors are operated to rotate the spindles 34a and 34b, the grinding wheels 42a and 42b rotate, and the grinding tools 40a and 40b rotate on the endless track. When the grinding units 32a and 32b are lowered in this state and the grinding tools 40a and 40b are brought into contact with the workpiece 1 held by the chuck tables 20a and 20b, the workpiece 1 is ground (machined).
The grinding apparatus 2 is further provided with a rotary washing apparatus 44 for washing and spin-drying the workpiece 1 ground by the grinding units 32a, 32b. The rotary washing device 44 includes: a rotary table (not shown) for supporting the workpiece 1; and a supply nozzle for supplying a fluid to the workpiece 1 held by the rotary table. When the rotary table supporting the workpiece 1 is rotated at a high speed and the cleaning water is supplied from the supply nozzle to the workpiece 1, the workpiece 1 is cleaned.
When grinding the workpiece 1 by the grinding device 2, the workpiece 1 is first carried out from the cassettes 8a and 8b by the carry-in-and-out unit 10 and conveyed to the chuck tables 20a and 20b located in the carry-in-and-out area. The workpiece 1 is sucked and held by the chuck tables 20a and 20b, and the chuck tables 20a and 20b are fed to the grinding areas below the grinding units 32a and 32b. Then, the main shafts 34a and 34b are rotated, the grinding units 32a and 32b are lowered to a predetermined height, and the workpiece 1 is ground by the grinding tools 40a and 40 b.
After the workpiece 1 is thinned to a predetermined thickness by grinding by the grinding units 32a, 32b, the chuck tables 20a, 20b are returned to the carry-in and carry-out area, and suction and holding of the workpiece 1 by the chuck tables 20a, 20b are released. The workpiece 1 is transported from the chuck tables 20a and 20b to the spin cleaning device 44 by the carry-in/out unit 10, and the workpiece 1 is cleaned by the spin cleaning device 44. The work 1 is transported from the spin cleaning device 44 to the cassettes 8a and 8b and stored by operating the carry-in/out unit 10.
In the grinding device 2, the objects 1 stored in the storage areas 48 of the cassettes 8a and 8b are pulled out one by one to be processed, and returned to the cassettes 8a and 8b. After finishing grinding (working) of all the objects 1 to be worked stored in the storage areas 48 of the cassettes 8a, 8b, the cassettes 8a, 8b are carried out from the cassette mounting tables 6a, 6b.
Here, the workpiece is not necessarily accommodated in all the accommodation areas 48 of the cartridges 8a, 8b. That is, the storage areas 48 of a part of the cartridges 8a and 8b may be empty. Even if the support portion of the carry-in/out unit 10 is inserted into the empty storage area 48, the work 1 does not exist, and not only does the work 1 fail to be pulled out, but also the pulling-out operation takes an unnecessary time.
Therefore, the grinding device 2 uses a sensor unit capable of detecting the presence or absence of the workpiece 1 in each storage area 48 by checking the inside of the cassettes 8a, 8b placed on the cassette placement tables 6a, 6b. Conventionally, a sensor unit that moves up and down in front of the cartridges 8a and 8b is used. Then, the light is irradiated from the sensor unit to the storage area 48, and the light reflected by the side surface 3 of the object 1 is detected, thereby detecting the presence or absence of the object 1. This detection operation is sequentially performed for each storage area 48.
However, the side surface 3 of the workpiece 1 is not necessarily smooth and sufficiently reflects light. For example, when the workpiece 1 is a rectangular resin substrate, the side surface 3 has a minute uneven shape, and light is scattered even when the side surface 3 is irradiated with light. In this case, the light reflected by the side surface 3 of the workpiece 1 is not necessarily detected with sufficient intensity, and the detection accuracy as to whether the workpiece 1 is present or not is insufficient.
Further, it takes time to raise and lower the sensor unit in front of the cassette to sequentially detect the presence or absence of the workpiece 1 in each storage area 48. Therefore, it is necessary to wait for the carrying-out operation of the workpiece 1 before the detection of the workpiece 1 is completed, and this may cause a decrease in the processing efficiency of the workpiece 1 in the grinding apparatus 2. Therefore, in the grinding device 2 of the present embodiment, the sensor unit 46 capable of instantaneously detecting the presence or absence of the workpiece 1 in each storage area 48 of the cassette without performing the lifting operation is used.
Next, the structure of the sensor unit 46 and the detection operation of the workpiece 1 using the sensor unit 46 will be described. The sensor unit 46 detects the presence or absence of the workpiece 1 stored in the storage areas 48 of the cassette 8a placed on the 1 st cassette placement stage 6a and the cassette 8b placed on the 2 nd cassette placement stage 6b. As shown in fig. 1, the sensor unit 46 is provided near the cassette mounting stages 6a and 6b. Fig. 2 contains a side view schematically illustrating the sensor unit 46.
The sensor unit 46 has, for example, a rod-like main body 60 erected adjacent to the 1 st cartridge mount 6a and the 2 nd cartridge mount 6b. The main body 60 is provided with a light emitting unit 54 including a plurality of light emitting portions 54a and a light receiving unit 56 including a plurality of light receiving portions 56a. The sensor unit 46 further includes a rotation drive source 58 capable of rotating the main body 60 to change the orientations of the light emitting unit 54 and the light receiving unit 56. The rotation driving source 58 is, for example, an electric motor.
The plurality of light emitting portions 54a of the light emitting unit 54 can irradiate the plurality of storage areas 48 of the cassette 8a mounted on the 1 st cassette mounting stage 6a and the cassette 8b mounted on the 2 nd cassette mounting stage 6b with light, respectively. The light emitting units 54 preferably have the same number of light emitting portions 54a as the storage areas 48 of the cartridges 8a, 8b. The light emitting portions 54a are preferably attached to the main body 60 at height positions corresponding to the plurality of storage areas 48 of the cartridges 8a, 8b, respectively.
The plurality of light receiving portions 56a of the light receiving unit 56 can receive light diffusely reflected by the side surfaces 3 of the workpiece 1 stored in the plurality of storage areas 48 of the cassette 8a placed on the 1 st cassette placement stage 6a and the cassette 8b placed on the 2 nd cassette placement stage 6b, respectively. The light receiving units 56 preferably have the light receiving portions 56a in the same number as the storage areas 48 of the cassettes 8a, 8b. The light receiving portions 56a are preferably attached to the main body 60 at height positions corresponding to the plurality of storage areas 48 of the cartridges 8a, 8b, respectively.
The light emitting portion 54a is a light source such as an LED or a lamp. The light emitted from the light emitting portion 54a may be white light or monochromatic light. The light receiving unit 56a is a light receiving element such as a CMOS sensor or a CCD sensor. The light receiving portion 56a can receive at least light having a wavelength equal to that of the light emitted from the light emitting portion 54a.
A control unit including a computer or the like for controlling each constituent element of the grinding apparatus (processing apparatus) 2 is connected to the rotation drive source 58, the light emitting unit 54, and the light receiving unit 56. The control unit has a function of controlling the sensor unit 46 to detect the presence or absence of the workpiece 1 in each of the storage areas 48 of the cartridges 8a, 8b.
The grinding device 2 operates the sensor unit 46 when the cassettes 8a, 8b are placed on the cassette mounting tables 6a, 6b. As shown in fig. 2 and 3, the sensor unit 46 operates the light emitting portions 54a of the light emitting unit 54 to irradiate the light 62 to the storage areas 48 of the cartridges 8a and 8b. The light 62 emitted from the light emitting portion 54a is shown by a broken line in fig. 2 and 3.
When the workpiece 1 is stored in the storage area 48 to which the light 62 is irradiated, the light 62 irradiates the side surface 3 of the workpiece 1. On the side surface 3 of the workpiece 1, the light 62 is diffusely reflected according to the state of the side surface 3, and a part of the light 62 travels toward the light receiving portion 56a of the light receiving unit 56. Fig. 2 and 3 show, by broken lines, light 64 that is diffusely reflected by the side surface 3 of the workpiece 1 and travels toward the light receiving portion 56a. When the light 64 is received, the light receiving unit 56a transmits an electric signal indicating that the light 64 is received to the control unit of the grinding device 2.
When the workpiece 1 is not stored in the storage area 48 to which the light 62 is irradiated, the light 62 does not strike the workpiece 1 and is diffusely reflected. That is, the light receiving portion 56a of the light receiving unit 56 does not receive the light 64 diffusely reflected by the side surface 3 of the workpiece 1. When the light 62 is generated by the light emitting unit 54a, the control unit of the grinding device 2 determines that the light 64 is not received by the light receiving unit 56a when the electric signal indicating that the light 64 is received by the light receiving unit 56a is not received.
The control unit of the grinding apparatus 2 determines whether or not the workpiece 1 is accommodated in the accommodation area 48 of the cassettes 8a, 8b placed on the cassette tables 6a, 6b, based on whether or not the light receiving portion 56a of the light receiving unit 56 receives the light 64 diffusely reflected by the side surface 3 of the workpiece 1.
That is, when the light receiving unit 56a receives the light 64, it is determined that the workpiece 1 is stored in the storage area 48 of the object of the cassettes 8a, 8b. On the other hand, when the light receiving unit 56a does not receive the light 64, it is determined that the workpiece 1 is not stored in the storage area 48 of the object of the cassettes 8a, 8b. In this way, the grinding device (processing device) 2 detects the object 1 stored in the storage area 48 based on the light 64 diffusely reflected by the side surface 3 of the object 1, and thus can detect the object 1 regardless of the state of the side surface 3.
The sensor unit 46 includes a light emitting portion 54a and a light receiving portion 56a dedicated to each of the plurality of storage areas 48 of the cartridges 8a and 8b, and can detect the presence or absence of the stored workpiece 1 in the plurality of storage areas 48 at the same time. Therefore, the grinding device 2 can instantly determine whether or not the workpiece 1 stored in each storage area 48 is present without moving the light emitting portion 54a and the light receiving portion 56a up and down in front of the cassettes 8a, 8b.
For example, when the reflection of light generated on the side surface 3 of the workpiece 1 is used, the arrangement of the light emitting portion and the light receiving portion of the sensor unit must be determined so that the incident angle of light emitted from the light emitting portion to the side surface 3 matches the reflection angle of light reflected on the light receiving side surface 3. In this case, the sensor unit must be moved to the front of the target cassette 8a or 8b when the detection operation is performed, and must be moved further so as not to interfere with the carry-in/out operation of the workpiece 1 after the detection operation is completed.
In contrast, the grinding device (processing device) 2 of the present embodiment detects the presence or absence of the workpiece 1 in the storage area 48 using diffuse reflection of light generated on the side surface 3 of the workpiece 1. Therefore, unlike the case of using the reflection of light generated on the side surface 3 of the workpiece 1, the light 62 irradiated to the workpiece 1 by the light emitting portion 54a and the light 64 received by the light receiving portion 56a are less restricted in the light path. For example, the sensor unit 46 may be disposed at a position that does not interfere with the carry-in and carry-out operation of the workpiece 1, and in this case, it is not necessary to move the sensor unit 46 before and after the detection operation.
However, when the distance between the plurality of storage areas 48 in the cassettes 8a and 8b is too short, the light 64 diffusely reflected by the side surface 3 of the workpiece 1 stored in the storage area 48 as the detection target easily reaches the light receiving portion 56a vertically adjacent to the light receiving portion 56a responsible for the storage area 48.
Therefore, in order to prevent detection errors, the plurality of storage areas 48 of the cartridges 8a, 8b are preferably separated from each other by a predetermined distance or more. For example, the storage areas 48 are preferably separated from each other by a distance of 10mm or more, and more preferably by a distance of 20mm or more.
In the case where the grinding device 2 includes a plurality of cassette mounting blocks 6a and 6b, the grinding device 2 may include a plurality of sensor units 46 for detecting the workpiece 1 stored in the cassettes 8a and 8b mounted on the respective cassette mounting blocks 6a and 6b. Alternatively, the grinding device 2 may have one sensor unit 46 capable of detecting the workpiece 1 stored in the cassettes 8a, 8b mounted on the respective cassette mounting tables 6a, 6b. In other words, the sensor unit 46 can switch the cartridges 8a, 8b as detection targets.
Fig. 4 (a) is a perspective view schematically showing a case where the presence or absence of the stored workpiece 1 is detected by the sensor unit 46 in each storage area 48 of the 1 st cassette 8a placed on the 1 st cassette placement table 6a. Fig. 5 (a) is a plan view schematically showing a case where the presence or absence of the stored workpiece 1 is detected by the sensor unit 46 in each storage area 48 of the 1 st cassette 8a.
Fig. 4 (B) is a perspective view schematically showing a case where the presence or absence of the stored workpiece 1 is detected by the sensor unit 46 in each storage area 48 of the 2 nd cassette 8B placed on the 2 nd cassette placement stage 6B. Fig. 5 (B) is a plan view schematically showing a case where the presence or absence of the stored workpiece 1 is detected by the sensor unit 46 in each storage area 48 of the 2 nd case 8B.
The main body 60 of the sensor unit 46 can change its orientation by operating the rotational drive source 58 shown in fig. 2. The sensor unit 46 can switch the presence or absence of the cartridges 8a, 8b, which are objects to be detected of the work 1 stored in the respective storage areas 48, by rotating the main body 60 to change the orientations of the light emitting unit 54 and the light receiving unit 56.
For example, a 1 st cassette 8a for accommodating the workpiece 1 before processing is placed on the 1 st cassette placement table 6a. When the 1 st cassette 8a is placed on the 1 st cassette placement stage 6a, the sensor unit 46 operates the light emitting unit 54 and the light receiving unit 56 to detect the presence or absence of the workpiece 1 stored in each storage area 48. Then, the grinding device 2 operates the carry-in/out unit 10 to carry out the workpiece 1 from the 1 st cassette 8a, and sequentially grinds the respective workpieces 1.
Further, for example, a 2 nd cassette 8b for accommodating the processed object 1 is placed on the 2 nd cassette mounting block 6b. When the 2 nd cassette 8b is placed on the 2 nd cassette placement stage 6b, the sensor unit 46 operates the light emitting unit 54 and the light receiving unit 56 to confirm that the respective storage areas 48 are empty. Then, the grinding apparatus 2 operates the carry-in and carry-out unit 10 to sequentially store the ground (machined) objects 1 in the 2 nd cassette 8b.
However, the sensor unit 46 may switch the cartridges 8a, 8b as detection targets of the object 1 to be processed by another method. For example, the grinding device 2 may have a moving mechanism capable of moving the sensor unit 46 in a substantially horizontal direction on the upper surface 4a of the base 4, and the sensor unit 46 may be moved on the upper surface 4a of the base 4. In this case, even if the number of cassette mounting tables included in the grinding apparatus 2 exceeds two, the presence or absence of the workpiece 1 in the cassette mounted on each cassette mounting table can be detected by the single sensor unit 46.
In addition, the rotation drive source 58 that rotates the main body 60 of the sensor unit 46 may be used for other purposes. For example, when the rotation driving source 58 is operated to change the orientation of the sensor unit 46, the irradiation position of the light 62 emitted from the light emitting portion 54a of the light emitting unit 54 can be changed on the side surface 3 of the workpiece 1.
For example, the workpiece 1 may be stored in the cassettes 8a and 8b in an improper manner, and one end of the workpiece 1 may be stored in a groove defining the storage area 48 and the other end may be stored in another groove vertically adjacent to the groove having the same height as the groove. At this time, the workpiece 1 is tilted in the internal space of the cartridges 8a, 8b.
When the direction of the main body 60 of the sensor unit 46 is changed and the light 62 is irradiated onto the side surface 3 of the workpiece 1 while changing the irradiation position in this case, the detection condition of the light 64 diffusely reflected by the side surface 3 by the light receiving unit 56a changes. The grinding device 2 can detect an abnormality in the storage condition of the workpiece 1 in the cartridges 8a and 8b with reference to a change in the detection condition of the light 64 when the orientation of the main body 60 of the sensor unit 46 is changed.
The present invention is not limited to the description of the above embodiments, and can be variously modified and implemented. For example, in the above embodiment, the following is explained: the sensor unit 46 causes the light emitting portion 54a to emit light 62, and detects whether or not the object 1 is present in the storage area 48 by detecting light 64 diffusely reflected on the side surface 3 of the object 1 by the light receiving portion 56a corresponding to the light emitting portion 54a. However, the grinding device 2 of the present embodiment is not limited thereto.
For example, the sensor unit 46 does not need to detect the light 64 diffusely reflected by the side surface 3 of the workpiece 1 by using only the light receiving portion 56a corresponding to the light emitting portion 54a that emits the light 62. For example, the grinding device 2 may detect the light 64 by using the other light receiving portions 56a vertically adjacent to the light receiving portion 56a, or may determine whether or not the workpiece 1 is present by using the detection condition of the light 64 by the other light receiving portions 56a vertically adjacent to each other as a proof.
The light 64 diffusely reflected by the side surface 3 of the workpiece 1 has a weaker intensity than the light reflected on the smooth surface. In the grinding device 2 of the present embodiment, since the presence or absence of the workpiece 1 is detected by the light 64 having a relatively weak intensity, the light 64 can be detected by the plurality of light receiving portions 56a in order to improve the detection accuracy.
In addition, the structure, method, and the like of the above embodiment can be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (3)

1. A processing apparatus for processing an object to be processed, characterized in that,
the processing device comprises:
a chuck table for holding a workpiece;
a processing unit for processing the workpiece held by the chuck table;
a 1 st cartridge mounting table for mounting a cartridge for storing the workpiece, the cartridge having a plurality of storage areas capable of storing the workpiece, respectively;
a carry-in/out unit that carries in/out the workpiece with respect to the cassette; and
a sensor unit for detecting whether or not the object to be processed is stored in each storage area of the cassette placed on the 1 st cassette placement stage,
the sensor unit includes:
a light emitting unit having a plurality of light emitting portions capable of emitting light to the plurality of storage areas of the cassette mounted on the 1 st cassette mounting stage, respectively; and
a light receiving unit having a plurality of light receiving portions capable of receiving the light diffusely reflected by the side surfaces of the object to be processed stored in the plurality of storage areas of the cassette placed on the 1 st cassette placement stage,
whether or not the workpiece is accommodated in the accommodation area of the cassette placed on the 1 st cassette placement stage is determined based on whether or not the light receiving portion receives the light diffusely reflected by the side surface of the workpiece.
2. The processing apparatus according to claim 1, wherein,
the processing device also has a 2 nd box loading platform adjacent to the 1 st box loading platform,
the sensor unit further comprises:
a main body that is erected adjacent to the 1 st cartridge mounting table and the 2 nd cartridge mounting table, and to which the light emitting unit and the light receiving unit are attached; and
a rotation driving source capable of rotating the main body to change the orientations of the light emitting unit and the light receiving unit,
the light-emitting unit irradiates light from the light-emitting unit to the storage area of the cassette placed on the 2 nd cassette stage, and receives the light diffusely reflected by the side surface of the object to be processed stored in the storage area of the cassette placed on the 2 nd cassette stage by the light-receiving unit of the light-receiving unit, thereby determining whether or not the object to be processed stored in the storage area of the cassette placed on the 2 nd cassette stage is present.
3. A processing apparatus according to claim 1 or 2, wherein,
the machining unit is a grinding unit capable of grinding the workpiece held by the chuck table.
CN202211423557.7A 2021-11-22 2022-11-15 Processing device Pending CN116141110A (en)

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JP2021-189223 2021-11-22

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JP6227334B2 (en) 2013-09-04 2017-11-08 ローツェ株式会社 Load port for detecting multiple types of semiconductor wafers
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