CN116088390A - Audio processing method, device and electronic equipment - Google Patents

Abstract

Embodiments of the present application provide an audio processing method, device, and electronic equipment. The method includes: determining the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip; determining initial audio data to be transmitted, the initial audio data being the The audio data generated by the SOC or the DSP chip; according to the first sampling frequency and the second sampling frequency, data filling processing is performed on the initial audio data to obtain target audio data, and pass the first audio interface and the second audio interface transmit the target audio data. The electronic device can play audio normally when the audio interface does not match.

Description

Audio processing method, device and electronic equipment

technical field

The embodiments of the present application relate to the technical field of signal processing, and in particular, to an audio processing method, device, and electronic equipment.

Background technique

The electronic device can be provided with a system-on-chip (System on Chip, SOC) and a digital signal processing (Digital Signal Processing, DSP) chip, and the electronic device can perform audio recording or audio playback through the SOC and the DSP chip.

In related technologies, the audio can be processed in the following way: the audio data to be processed is transmitted to the audio interface of the DSP chip through the audio interface of the SOC, and the DSP chip plays the audio data to be processed through the speaker. Alternatively, the audio data to be processed is transmitted to the audio interface of the SOC through the audio interface of the DSP chip, and the SOC chip stores the audio data to be processed. In the above process, if the audio interface of the SOC is an integrated audio (Integrated Interchip Sound, IIS) interface, the audio interface of the DSP chip is a Time-Division Multiplexing (TDM) interface. The IIS interface does not match the TDM interface, and the sampling frequency of the two interfaces is different. During audio data transmission, there may be different numbers of audio data transmissions in the same period of time, which doubles the speed of audio playback, causing the electronic device to fail to play audio normally.

Contents of the invention

Embodiments of the present application provide an audio processing method, device, and electronic equipment to solve the problem that the electronic equipment cannot play normally.

In the first aspect, the embodiment of the present application provides an audio processing method, which is applied to an electronic device, and the electronic device is provided with a system-on-chip SOC and a digital signal processing DSP chip, and the method includes:

Determine the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip;

Determine the initial audio data to be transmitted, where the initial audio data is audio data generated by the SOC or the DSP chip;

Perform data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, and transmit the target through the first audio interface and the second audio interface audio data.

In a possible implementation manner, the first audio interface is an integrated audio interface IIS interface, and the second audio interface is a time division multiplexing technology TDM interface;

According to the first sampling frequency and the second sampling frequency, data filling processing is performed on the initial audio data to obtain target audio data, including:

Obtain a frequency ratio M between the second sampling frequency and the first sampling frequency, where M is an integer greater than 1;

According to the frequency ratio, data filling processing is performed on the initial audio data to obtain target audio data.

In a possible implementation manner, according to the frequency ratio M, data filling processing is performed on the initial audio data to obtain target audio data, including:

According to the frequency ratio, partial audio data is determined in the initial audio data, and the length of the initial audio data is M times the length of the partial audio data;

Data filling processing is performed on the part of the audio data to obtain the target audio data.

In a possible implementation manner, the initial audio data is data generated by the SOC; data filling processing is performed on the part of the audio data to obtain the target audio data, including:

determining at least one audio data unit in the partial audio data, the length of the audio data unit being a preset unit length;

Preset data is filled after each audio data unit to obtain the target audio data, and the length of the preset data is the preset unit length.

In a possible implementation manner, transmitting the target audio data through the first audio interface and the second audio interface includes:

sending the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface.

In a possible implementation manner, the method also includes:

Removing preset data in the target audio data to obtain audio data to be played;

Play the audio data to be played.

In a possible implementation manner, the initial audio data is data generated by the DSP; data filling processing is performed on the part of the audio data to obtain the target audio data, including:

The preset data is filled after the partial audio data to obtain the target audio data, and the length of the preset data is a difference between the length of the initial audio data and the length of the partial audio data.

In a possible implementation manner, transmitting the target audio data through the first audio interface and the second audio interface includes:

sending the target audio data to the SOC through the TDM interface, so that the SOC receives the target audio data through the IIS interface.

In a second aspect, an embodiment of the present application provides an audio processing device, the device comprising:

The first determination module determines the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip;

The second determination module determines the initial audio data to be transmitted, and the initial audio data is data generated by the SOC or the DSP chip;

The processing module performs data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, and transmits the target audio data through the first audio interface and the second audio interface The target audio data.

In a possible implementation manner, the processing module is specifically configured to:

Obtain a frequency ratio M between the second sampling frequency and the first sampling frequency, where M is an integer greater than 1;

According to the frequency ratio, data filling processing is performed on the initial audio data to obtain target audio data.

In a possible implementation manner, the processing module is specifically configured to:

According to the frequency ratio, partial audio data is determined in the initial audio data, and the length of the initial audio data is M times the length of the partial audio data;

Data filling processing is performed on the part of the audio data to obtain the target audio data.

In a possible implementation manner, the processing module is specifically configured to:

determining at least one audio data unit in the partial audio data, the length of the audio data unit being a preset unit length;

Preset data is filled after each audio data unit to obtain the target audio data, and the length of the preset data is the preset unit length.

In a possible implementation manner, the processing module is specifically configured to:

sending the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface.

In a possible implementation manner, the processing module is specifically configured to:

The preset data is filled after the partial audio data to obtain the target audio data, and the length of the preset data is a difference between the length of the initial audio data and the length of the partial audio data.

In a possible implementation manner, the processing module is specifically configured to:

sending the target audio data to the SOC through the TDM interface, so that the SOC receives the target audio data through the IIS interface.

In a possible implementation manner, the device further includes a playback module.

Wherein, the playing module is used for:

Removing preset data in the target audio data to obtain audio data to be played;

Play the audio data to be played.

In a third aspect, the present application provides a chip, on which a computer program is stored, and when the computer program is executed by the chip, the method according to any one of the first aspect is implemented.

In a fourth aspect, the present application provides a chip module, where a computer program is stored on the chip module, and when the computer program is executed by the chip module, the method according to any one of the first aspect is implemented.

In a fifth aspect, the embodiment of the present application provides an electronic device, including:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,

The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor, so that the at least one processor can execute the method according to any one of the first aspect.

In a sixth aspect, the embodiments of the present application provide a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to cause the computer to execute the method described in any one of the first aspects.

In a seventh aspect, an embodiment of the present application provides a computer program product, including a computer program, and when the computer program is executed by a processor, the method described in any one of the first aspects is implemented.

The audio processing method, device and electronic equipment provided in the embodiments of the present application determine the first sampling frequency of the first audio interface of the SOC, and determine the second sampling frequency of the second audio interface of the DSP chip. Determine the initial audio data to be transmitted. The initial audio data may be audio data generated by the SOC or generated by the DSP chip. According to the first sampling frequency and the second sampling frequency, data filling processing is performed on the initial audio data to obtain target audio data. The target audio data is transmitted through the first audio interface and the second audio interface, so as to play or store the target audio data. In the above process, data filling processing can be performed on the initial audio data according to the first sampling frequency and the second sampling frequency, so as to avoid the situation that the number of audio data transmissions caused by the interface mismatch between the SOC and the DSP chip is different, so that the electronic device can be used in When the audio interface does not match, the audio is played normally.

Description of drawings

FIG. 1 is a schematic diagram of an application scenario provided by an embodiment of the present application;

FIG. 2 is a schematic flowchart of an audio processing method provided in an embodiment of the present application;

FIG. 3 is a schematic flow chart of another audio processing method provided by an embodiment of the present application;

FIG. 4 is a schematic diagram of the process of determining part of the audio data provided by the embodiment of the present application;

FIG. 5 is a schematic diagram of a process for determining target audio data provided by an embodiment of the present application;

FIG. 6 is a schematic diagram of another process for determining target audio data provided by the embodiment of the present application;

FIG. 7A is a schematic diagram of the audio processing process provided by the embodiment of the present application;

FIG. 7B is a schematic diagram of the audio processing process provided by the embodiment of the present application;

FIG. 8 is a schematic structural diagram of an audio processing device provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of another audio processing device provided by an embodiment of the present application;

FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

For ease of understanding, the application scenario applicable to the embodiment of the present application will be described below with reference to FIG. 1 .

FIG. 1 is a schematic diagram of an application scenario provided by an embodiment of the present application. Please refer to FIG. 1 , which includes an electronic device 101 , which may be a car stereo, a mobile phone, and the like. The electronic device 101 is provided with SOC and DSP chips. Both the SOC and the DSP chip are provided with an audio interface. The electronic device 101 can play or record audio through the SOC and DSP chips. When the electronic device 101 is playing audio, the SOC of the electronic device 101 sends the audio data to be played to the DSP chip of the electronic device 101 through the audio interface of the SOC. The DSP chip of the electronic device 101 receives the audio data to be played through the audio interface of the DSP chip, and plays the audio corresponding to the audio data to be played through the speaker of the electronic device 101 . When the electronic device 101 is recording audio, the DSP chip of the electronic device 101 receives the audio data recorded by the microphone of the electronic device 101, and sends the recorded audio data to the SOC of the electronic device 101 through the audio interface of the DSP chip. The SOC of the electronic device 101 receives and stores the recorded audio data through the audio interface of the SOC.

In related technologies, if the audio interface of the SOC is an IIS interface, the audio interface of the DSP chip is a TDM interface. The IIS interface does not match the TDM interface, and the sampling frequency of the two interfaces is different. During audio data transmission, there may be different numbers of audio data transmissions in the same period of time, which doubles the speed of audio playback, causing the electronic device to fail to play audio normally.

In the embodiment of the present application, the first sampling frequency of the first audio interface of the SOC is determined, and the second sampling frequency of the second audio interface of the DSP chip is determined. Determine the initial audio data to be transmitted. The initial audio data may be audio data generated by the SOC or generated by the DSP chip. According to the first sampling frequency and the second sampling frequency, data filling processing is performed on the initial audio data to obtain target audio data. The target audio data is transmitted through the first audio interface and the second audio interface, so as to play or store the target audio data. In the above process, data filling processing can be performed on the initial audio data according to the first sampling frequency and the second sampling frequency, so as to avoid the situation that the number of audio data transmissions caused by the interface mismatch between the SOC and the DSP chip is different, so that the electronic device can be used in When the audio interface does not match, the audio is played normally.

In the following, the method shown in this application will be described through specific examples. It should be noted that the following embodiments may exist independently or be combined with each other, and the same or similar content will not be repeatedly described in different embodiments.

FIG. 2 is a schematic flowchart of an audio processing method provided by an embodiment of the present application. See Figure 2, the method can include:

S201. Determine a first sampling frequency of a first audio interface of the SOC and a second sampling frequency of a second audio interface of a DSP chip.

The executor of the embodiment of the present application may be an electronic device, or may be a chip, a chip module, or an audio processing device disposed in the electronic device. The audio processing device can be implemented by software, or by a combination of software and hardware.

The first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip can be set in advance and stored in the preset storage space of the electronic device.

When setting the first sampling frequency and the second sampling frequency, the first sampling frequency may be 2N times the second sampling frequency. Wherein, N is an integer greater than or equal to 1.

For example, after determining that the first audio interface of the SOC in the electronic device A is an IIS interface, and the second audio interface of the DSP chip is a TDM interface, the first sampling frequency of the IIS interface of the SOC can be set to 96kHz, and the DSP chip's first sampling frequency can be set to 96kHz. The second sampling frequency of the TDM interface is set to 48kHz. And store the first sampling frequency and the second sampling frequency in the preset storage space of the electronic device A.

S202. Determine initial audio data to be transmitted.

The initial audio data is the audio data generated by the SOC or DSP chip.

When the electronic device plays audio, the SOC determines in the storage space of the electronic device that the audio to be played is the initial audio data. When the electronic device records audio, the DSP chip obtains the audio recorded by the microphone of the electronic device, and determines the audio recorded by the microphone as the initial audio data.

For example, the user uses electronic device A to play song 1, and the SOC of electronic device A determines in the storage space of the electronic device that the audio data 1 corresponding to playing song 1 is the initial audio data. The user uses electronic device B to record audio, and the microphone of electronic device B records voice 1 and sends it to the DSP chip of electronic device B. The DSP chip of the electronic device B acquires the voice 1 recorded by the microphone of the electronic device B, and determines the voice 1 recorded by the microphone as the initial audio data.

S203. Perform data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, and transmit the target audio data through the first audio interface and the second audio interface.

The first audio interface is an integrated audio interface IIS interface, and the second interface is a time division multiplexing technology TDM interface.

The target audio data can be obtained in the following manner: obtain the frequency ratio M between the second sampling frequency and the first sampling frequency, and M is an integer greater than 1; perform data filling processing on the initial audio data according to the frequency ratio to obtain the target audio data.

The initial audio data can be filled with 0s, so that the same sound quality can be maintained after the initial audio data is filled.

Because in the same electronic device, the sampling frequency of the IIS interface and the TDM interface are different. During audio data transmission, there are differences in the amount of audio data acquired in the same period of time. Data filling processing may be performed on the initial audio data to obtain target audio data, so that the amount of audio data received by the audio interface within the same period is the same.

For example, when the electronic device A is playing audio, the first sampling frequency of the IIS interface is 96 kHz, and the second sampling frequency of the TDM interface is 48 kHz. According to the first sampling frequency and the second sampling frequency, it can be determined that the amount of audio data transmitted by the IIS interface is twice that of the TDM interface in the same period of time. Therefore, data filling processing can be performed on the audio data transmitted by the IIS interface. Fill the data volume with 0 to the normal data volume, which is twice the data volume of the TDM interface.

In the audio processing method provided in the embodiment of the present application, the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip are determined. Determine the initial audio data to be transferred. According to the first sampling frequency and the second sampling frequency, data filling processing is performed on the initial audio data to obtain target audio data, and the target audio data is transmitted through the first audio interface and the second audio interface. In the above process, data filling processing can be performed on the initial audio data according to the first sampling frequency and the second sampling frequency, so as to avoid the situation that the number of audio data transmissions caused by the interface mismatch between the SOC and the DSP chip is different, so that the electronic device can be used in When the audio interface does not match, the audio is played normally.

On the basis of any one of the above embodiments, the detailed process of audio processing will be described below with reference to FIG. 3 .

FIG. 3 is a schematic flowchart of another audio processing method provided by the embodiment of the present application. See Figure 3, the method includes:

S301. Determine a first sampling frequency of a first audio interface of the SOC and a second sampling frequency of a second audio interface of a DSP chip.

The first audio interface is an IIS interface, and the second audio interface is a TDM interface.

S302. Determine initial audio data to be transmitted.

The initial audio data is the audio data generated by the SOC or DSP chip.

S303. If the initial audio data is data generated by the SOC, acquire a frequency ratio M between the second sampling frequency and the first sampling frequency.

M is an integer greater than 1.

For example, the first audio interface of electronic device A is an IIS interface, and the second audio interface is a TDM interface. The sampling frequency of the IIS interface is 96kHz, and the sampling frequency of the TDM interface is 48kHz. It can be determined that the first sampling frequency is 96 kHz, and the second sampling frequency is 48 kHz. Then it can be determined that the frequency ratio M between the second sampling frequency and the first sampling frequency is 96/48=2.

S304. Determine part of the audio data in the initial audio data according to the frequency ratio.

The length of the original audio data is M times the length of the partial audio data.

Next, with reference to FIG. 4 , the process of determining partial audio data will be described. FIG. 4 is a schematic diagram of a process of determining partial audio data provided by an embodiment of the present application. Please refer to FIG. 4 , including initial audio data 401 , the data length of the initial audio data 401 is 32 bits. Assuming that the frequency ratio M between the second sampling frequency and the first sampling frequency is 2, the partial audio data 402 is any piece of continuous 16-bit audio data in the initial audio data 401 . For example, the partial audio data 402 may be audio data of bits 0-15 in the initial audio data 401 .

S305. Perform data filling processing on part of the audio data to obtain target audio data.

The target audio data can be obtained in the following manner: at least one audio data unit is determined in part of the audio data, and the length of the audio data unit is a preset unit length; each audio data unit is filled with preset data to obtain the target audio data, The length of the preset data is a preset unit length.

The preset unit length can be a data frame (slot). Default data can be 0.

Next, with reference to FIG. 5 , the process of determining target audio data will be described. FIG. 5 is a schematic diagram of a process of determining target audio data provided by an embodiment of the present application. Please refer to FIG. 5 , which includes partial audio data 501 and target audio data 502 . Part of the audio data 501 is the initial audio data received by the IIS interface of the electronic device. The partial audio data 501 includes 8 preset unit lengths, one preset unit length is one slot, and each slot includes 16-bit audio data. Wherein, slot0, slot2, slot4 and slot6 include fixed configuration data (blank slot). slot1, slot3, slot5, and slot7 are audio data (d0, d1, d2, d3). When performing data filling processing, the preset data 0 is filled after slot1, slot3, slot5 and slot7, that is, each slot is supplemented with 16-bit data 0 to obtain the target audio data. Target audio data 502 includes all audio data after the data stuffing process.

S306. Send the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface.

For example, assume that the original audio data is audio D generated by the SOC. The SOC chip performs data filling processing on the audio D according to the frequency ratio to obtain the target audio data D0. The SOC chip sends the target audio data D0 to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data D0 through the TDM interface.

S307. Perform removal processing on preset data in the target audio data to obtain audio data to be played.

For example, according to the target audio data 502 shown in FIG. 5 , the preset data 0 in the target audio data 502 is removed to obtain the audio data to be played.

S308. Play the audio data to be played.

The DSP chip plays the music data to be played through the speaker of the electronic device.

When playing the audio data to be played, the number of preset unit lengths of the audio data to be played is the same as the number of preset unit lengths of the target audio data, so as to avoid differences in the amount of audio data played within a fixed period of time due to differences in audio interface frequencies.

S309. If the initial audio data is data generated by the DSP chip, fill preset data after part of the audio data to obtain target audio data.

The length of the preset data is the difference between the length of the initial audio data and the length of the partial audio data.

Default data can be 0. The length of the partial audio data is the same as the number of microphones of the electronic device.

Next, with reference to FIG. 6 , the process of determining target audio data will be described. FIG. 6 is a schematic diagram of another process of determining target audio data provided by the embodiment of the present application. Please refer to FIG. 6 , including initial audio data 601 and target audio data 602 . Assuming that the electronic device has 4 microphones, after the DSP chip receives the audio data recorded by the microphone of the electronic device, there are 8 channels of audio data in total. Among them, 4 channels are the audio data recorded by the microphone (d0, d1, d2, d3), 4 channels are the recovered audio data (d4, d5, d6, d7), and the audio data of each channel corresponds to a slot . According to the number of microphones of the electronic device, it can be determined that the length of the partial audio data is 4. According to the length of the partial audio, the initial audio data 601 is divided into two partial audio data. Among them, a part of audio data is 4 slots, including audio data d0, d1, d2, and d3. Another part of audio data is 4 slots, including audio data d4, d5, d6, and d7.

According to the length 8 of the initial audio data and the length 4 of the partial audio data, the length of the filled preset data is determined to be 8−4=4. Therefore, when performing data filling processing, preset data 0 with a length of 4 slots is filled after each partial audio data to obtain target audio data 602 .

S310. Send the target audio data to the SOC through the TDM interface, so that the SOC receives the target audio data through the IIS interface.

After the SOC receives the target audio data, it may divide the target audio data into a plurality of first target audio data according to a preset period. The preset data in each first target audio data is deleted to obtain the audio data to be stored. The audio data to be stored is stored in the preset storage space of the electronic device. The duration of the preset period may be the duration corresponding to one period during audio data transmission.

In the audio processing method provided in the embodiment of the present application, the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip are determined. If the initial audio data is data generated by the SOC, a frequency ratio M between the second sampling frequency and the first sampling frequency is acquired. Part of the audio data is determined in the original audio data according to the frequency ratio. Perform data filling processing on part of the audio data to obtain target audio data. Send the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface. If the initial audio data is the data generated by the DSP chip, the preset data is filled after part of the audio data to obtain the target audio data. Send the target audio data to the SOC through the TDM interface, so that the SOC chip receives the target audio data through the IIS interface. In the above process, data filling processing can be performed on the initial audio data according to the first sampling frequency and the second sampling frequency, so as to avoid the situation that the number of audio data transmissions caused by the interface mismatch between the SOC and the DSP chip is different, so that the electronic device can be used in When the audio interface does not match, the audio is played normally.

On the basis of any one of the above embodiments, the audio processing process will be described below when the first audio interface of the SOC is a TDM interface and the second audio interface of the DSP chip is an IIS interface.

When the initial audio data is data generated by the SOC, a frequency ratio M between the second sampling frequency and the first sampling frequency is acquired. According to the frequency ratio, among the initial audio data, the audio data corresponding to each slot to be transmitted within the preset time period is determined. The duration of the preset period may be the duration corresponding to one period during audio data transmission.

For example, as shown in FIG. 5 above, when the first audio interface of the SOC is a TDM interface, the initial audio data can be directly set to the form of the target audio data 502 in FIG. The amount of transmitted audio data varies.

When the initial audio data is the data generated by the DSP chip, the initial audio data can be preprocessed, weaving two 16-bit audio data of the IIS interface into one 32-bit slot, and filling each slot to obtain The processed audio data is transmitted to the SOC through the IIS interface of the DSP chip. At this time, the DSP chip is required to have the ability of data weaving.

On the basis of any one of the above embodiments, the audio processing process will be described below with reference to FIG. 7A-FIG. 7B . FIG. 7A is a schematic diagram of the audio processing process provided by the embodiment of the present application. Please refer to FIG. 7A, including SOC 701 and DSP chip 702. SOC 701 and DSP chip 702 are set in electronic equipment. The SOC 701 is provided with a hardware abstraction layer (Hardware Abstraction Layer, HAL), and the audio interface of the SOC 701 is an IIS interface. The audio interface of the DSP chip 702 is a TDM interface. Before audio processing, the parameters of the IIS interface and the TDM interface can be set through the HAL and stored in the preset storage space of the electronic device. The specific parameters of the IIS interface and the TDM interface can be shown in Table 1:

Table 1

interface parameters IIS interface TDM interface number of slots — 8 slot width — 16 bits Interface bit width 32 bit — Sampling frequency 96kHz 48kHz Serial clock (bit clock, BCLK) 96kHz*32*2 48kHz*64*2 operating mode right align —

The SOC 701 determines that the initial audio data is the audio data d0, d1, d2, and d3 generated by the SOC 701, and the length of each audio data is 16 bits. According to Table 1, it can be determined that the frequency ratio between the second sampling frequency of the TDM interface and the first sampling frequency of the IIS interface is 2. Since the length of the initial audio data is 8 slots, it can be determined that the length of the partial audio data is 4 slots. According to the length of the partial audio data, 2 pieces of partial audio data are determined in the original audio data. Wherein, one part of audio data includes slot0-slot3, and the other part of audio data includes slot4-slot7. When the SOC 701 performs data filling processing, it fills the preset data 0 after slot1, slot3, slot5 and slot7, that is, each slot is supplemented with 16-bit data 0 to obtain the target audio data.

The SOC 701 sends the target audio data to the DSP chip 702 through the IIS interface, and the DSP chip 702 receives the target audio data through the TDM interface. The DSP chip 702 removes the preset data in the target audio data to obtain the audio data to be played, and plays the audio data to be played through the microphone of the electronic device.

FIG. 7B is a schematic diagram of the audio processing process provided by the embodiment of the present application. Please refer to FIG. 7B , the SOC 701 determines that the initial audio data is the audio data d0 , d1 , d2 , d3 , d4 , d5 , d6 , and d7 generated by the DSP chip 702 . The DSP chip 702 determines the length of the filled preset data to be 8−4=4 according to the length 8 of the initial audio data and the length 4 of the partial audio data. Therefore, when performing data filling processing, the DSP chip 702 fills each part of audio data with preset data 0 with a length of 4 slots to obtain target audio data.

DSP chip 702 sends target audio data to SOC 701 through TDM interface, and SOC 701 receives target audio data through IIS interface. After the SOC 701 receives the target audio data, it can divide the target audio data into a plurality of first target audio data according to a preset period. The preset data in each first target audio data is deleted to obtain the audio data to be stored. The audio data to be stored is stored in the preset storage space of the electronic device.

The audio processing process provided by the embodiment of the present application determines the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip. If the initial audio data is data generated by the SOC, a frequency ratio M between the second sampling frequency and the first sampling frequency is obtained. Part of the audio data is determined in the original audio data according to the frequency ratio. Perform data filling processing on part of the audio data to obtain target audio data. Send the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface. If the initial audio data is the data generated by the DSP chip, the preset data is filled after part of the audio data to obtain the target audio data. Send the target audio data to the SOC through the TDM interface, so that the SOC chip receives the target audio data through the IIS interface. In the above process, data filling processing can be performed on the initial audio data according to the first sampling frequency and the second sampling frequency, so as to avoid the situation that the number of audio data transmissions caused by the interface mismatch between the SOC and the DSP chip is different, so that the electronic device can be used in When the audio interface does not match, the audio is played normally.

FIG. 8 is a schematic structural diagram of an audio processing device provided by an embodiment of the present application. The audio processing device can be a chip or a chip module. Referring to Fig. 8, the audio playback device 10 may include:

The first determination module 11 determines the first sampling frequency of the first audio interface of the SOC and the second sampling frequency of the second audio interface of the DSP chip;

The second determination module 12 determines the initial audio data to be transmitted, the initial audio data is the data generated by the SOC or the DSP chip;

The processing module 13, according to the first sampling frequency and the second sampling frequency, performs data filling processing on the initial audio data to obtain target audio data, and passes through the first audio interface and the second audio interface The target audio data is transmitted.

The audio processing device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effect are similar, and will not be repeated here.

In a possible implementation manner, the processing module 13 is specifically configured to:

Obtain a frequency ratio M between the second sampling frequency and the first sampling frequency, where M is an integer greater than 1;

According to the frequency ratio, data filling processing is performed on the initial audio data to obtain target audio data.

In a possible implementation manner, the processing module 13 is specifically configured to:

According to the frequency ratio, partial audio data is determined in the initial audio data, and the length of the initial audio data is M times the length of the partial audio data;

Data filling processing is performed on the part of the audio data to obtain the target audio data.

In a possible implementation manner, the processing module 13 is specifically configured to:

determining at least one audio data unit in the partial audio data, the length of the audio data unit being a preset unit length;

Preset data is filled after each audio data unit to obtain the target audio data, and the length of the preset data is the preset unit length.

In a possible implementation manner, the processing module 13 is specifically configured to:

sending the target audio data to the DSP chip through the IIS interface, so that the DSP chip receives the target audio data through the TDM interface.

In a possible implementation manner, the processing module 13 is specifically configured to:

The preset data is filled after the partial audio data to obtain the target audio data, and the length of the preset data is a difference between the length of the initial audio data and the length of the partial audio data.

In a possible implementation manner, the processing module 13 is specifically configured to:

sending the target audio data to the SOC through the TDM interface, so that the SOC receives the target audio data through the IIS interface.

The audio processing device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effect are similar, and will not be repeated here.

FIG. 9 is a schematic structural diagram of another audio processing device provided by an embodiment of the present application. On the basis of the embodiment shown in FIG. 8 , referring to FIG. 9 , the audio processing device 10 further includes a playback module 14 .

Wherein, the playing module 14 is used for:

Removing preset data in the target audio data to obtain audio data to be played;

Play the audio data to be played.

The audio processing device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effect are similar, and will not be repeated here.

FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Referring to FIG. 10 , the electronic device 20 may include: a memory 21 and a processor 22 . Exemplarily, the memory 21 and the processor 22 are connected to each other through a bus 23 .

The memory 21 is used to store program instructions;

The processor 22 is configured to execute the program instructions stored in the memory, so as to make the electronic device 20 execute the methods shown in the above method embodiments.

The electronic device provided by the embodiment of the present application can implement the technical solutions shown in the above method embodiments, and its implementation principles and beneficial effects are similar, and will not be repeated here.

An embodiment of the present application provides a computer-readable storage medium, where computer-executable instructions are stored in the computer-readable storage medium, and the computer-executable instructions are used to implement the foregoing method when executed by a processor.

The embodiment of the present application may further provide a computer program product, including a computer program, and when the computer program is executed by a processor, the foregoing method may be implemented.

All or part of the steps for implementing the above method embodiments can be completed by program instructions and related hardware. The aforementioned program can be stored in a readable memory. When the program is executed, it executes the steps comprising the above-mentioned method embodiments; and the aforementioned memory (storage medium) includes: read-only memory (English: read-only memory, abbreviated: ROM), random access memory (English: Random Access Memory, abbreviation: RAM), flash memory, hard disk, solid state drive, magnetic tape (English: magnetic tape), floppy disk (English: floppy disk), optical disc (English: optical disc) and any combination thereof.

Embodiments of the present application are described with reference to flowcharts and/or block diagrams of methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each procedure and/or block in the flowchart and/or block diagram, and a combination of procedures and/or blocks in the flowchart and/or block diagram can be realized by computer program instructions. These computer program instructions may be provided to a general purpose computer, special purpose computer, embedded processor, or processing unit of other programmable data processing equipment to produce a machine such that the instructions executed by the processing unit of the computer or other programmable data processing equipment produce a An apparatus for realizing the functions specified in one or more procedures of the flowchart and/or one or more blocks of the block diagram.

These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing apparatus to operate in a specific manner, such that the instructions stored in the computer-readable memory produce an article of manufacture comprising instruction means, the instructions The device realizes the function specified in one or more procedures of the flowchart and/or one or more blocks of the block diagram.

These computer program instructions can also be loaded onto a computer or other programmable data processing device, causing a series of operational steps to be performed on the computer or other programmable device to produce a computer-implemented process, thereby The instructions provide steps for implementing the functions specified in the flow chart or blocks of the flowchart and/or the block or blocks of the block diagrams.

Apparently, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. In this way, if the modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

In this application, the term "include" and its variants may mean non-limiting inclusion; the term "or" and its variants may mean "and/or". The terms "first", "second", etc. in this application are used to distinguish similar objects, and not necessarily used to describe a specific order or sequence. In the present application, "plurality" means two or more. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B may indicate: A exists alone, A and B exist simultaneously, and B exists independently. The character "/" generally indicates that the contextual objects are an "or" relationship.

Claims (12)

1. An audio processing method, which is applied to an electronic device, wherein a system-on-chip SOC and a digital signal processing DSP chip are arranged in the electronic device, the method comprises:

determining a first sampling frequency of a first audio interface of the SOC and a second sampling frequency of a second audio interface of the DSP chip;

determining initial audio data to be transmitted, wherein the initial audio data are audio data generated by the SOC or the DSP chip;

and carrying out data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, and transmitting the target audio data through the first audio interface and the second audio interface.

2. The method of claim 1, wherein the first audio interface is an integrated audio interface IIS interface and the second audio interface is a time division multiplexing TDM interface;

performing data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, wherein the data filling processing comprises the following steps:

acquiring a frequency ratio M between the second sampling frequency and the first sampling frequency, wherein M is an integer greater than 1;

And carrying out data filling processing on the initial audio data according to the frequency ratio to obtain target audio data.

3. The method according to claim 2, wherein performing data filling processing on the initial audio data according to the frequency ratio M to obtain target audio data comprises:

determining partial audio data in the initial audio data according to the frequency ratio, wherein the length of the initial audio data is M times of the length of the partial audio data;

and carrying out data filling processing on the partial audio data to obtain the target audio data.

4. The method of claim 3, wherein the initial audio data is data generated by the SOC; performing data filling processing on the part of audio data to obtain the target audio data, wherein the data filling processing comprises the following steps:

determining at least one audio data unit in the part of audio data, wherein the length of the audio data unit is a preset unit length;

filling preset data after each audio data unit to obtain the target audio data, wherein the length of the preset data is the preset unit length.

5. The method of claim 4, wherein transmitting the target audio data over the first audio interface and the second audio interface comprises:

And sending the target audio data to the DSP chip through the IIS interface so that the DSP chip receives the target audio data through the TDM interface.

6. The method of claim 5, wherein the method further comprises:

removing preset data in the target audio data to obtain audio data to be played;

and playing the audio data to be played.

7. A method according to claim 3, wherein the initial audio data is data generated by the DSP; performing data filling processing on the part of audio data to obtain the target audio data, wherein the data filling processing comprises the following steps:

filling preset data after the part of audio data to obtain the target audio data, wherein the length of the preset data is the difference between the length of the initial audio data and the length of the part of audio data.

8. The method of claim 7, wherein transmitting the target audio data over the first audio interface and the second audio interface comprises:

and sending the target audio data to the SOC through the TDM interface so that the SOC receives the target audio data through the IIS interface.

9. An audio processing apparatus, the apparatus comprising:

the first determining module is used for determining a first sampling frequency of a first audio interface of the SOC and a second sampling frequency of a second audio interface of the DSP chip;

the second determining module is used for determining initial audio data to be transmitted, wherein the initial audio data are data generated by the SOC or the DSP chip;

and the processing module is used for carrying out data filling processing on the initial audio data according to the first sampling frequency and the second sampling frequency to obtain target audio data, and transmitting the target audio data through the first audio interface and the second audio interface.

10. An electronic device, comprising:

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein,,

the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of any one of claims 1 to 8.

11. A non-transitory computer readable storage medium storing computer instructions, wherein the computer instructions are for causing a computer to perform the method of any one of claims 1 to 8.

12. A computer program product comprising a computer program, characterized in that the computer program, when executed by a processor, implements the method of any one of claims 1 to 8.

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