CN115981735A - Chip low-temperature start control method and system, electronic device and storage medium - Google Patents
Chip low-temperature start control method and system, electronic device and storage medium Download PDFInfo
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Abstract
The invention discloses a low-temperature starting control method of a chip, a system, electronic equipment and a storage medium thereof, wherein the chip comprises: temperature sensor and test logic module, the method includes: after the chip is powered on, acquiring a first internal temperature of the chip through a temperature sensor; under the condition that the first internal temperature is lower than the temperature threshold, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor; and under the condition that the second internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode. According to the scheme of the embodiment of the invention, the chip can be safely started in a low-temperature environment, the circuit cost is low, and the starting time delay is short.
Description
Technical Field
The invention relates to the technical field of chip starting, in particular to a low-temperature starting control method and system of a chip, electronic equipment and a storage medium.
Background
The working temperature grade of the chip refers to the natural environment temperature, namely the climate temperature faced by the whole machine or the module for years, and the working temperature grade of the chip limits the application range of the chip due to the difference of the adaptability of the chip to the natural environment and the working environment temperature. The working temperature of the chips with different grades is required to be different, for example, the working temperature range of a commercial grade chip is 0 to +70 ℃, the working temperature range of most industrial grade chips is-40 to +85 ℃, the working temperature range of a few industrial grade chips is-20 to +85 ℃, the working temperature range of an automobile industrial grade chip is-40 to +125 ℃, and the working temperature range of an military grade chip is-55 to +150 ℃. If the temperature of the working environment of the chip exceeds the specification range in which the chip can work, the chip can not be started and even damaged. In a low-temperature environment, each module inside the chip may not work normally, and the chip cannot be started.
In the related art, a wide temperature chip is obtained by adopting a special process, but the manufacturing cost is high. Or, the chip is preheated by additionally arranging the heating device outside the chip, so that the chip is started in a low-temperature environment, the circuit cost is increased by the additionally arranged heating device, and meanwhile, the starting time in a normal-temperature environment is increased.
Disclosure of Invention
The embodiment of the invention provides a chip low-temperature starting control method and a system thereof, electronic equipment and a storage medium, which can safely start a chip in a low-temperature environment, and have the advantages of low circuit cost and small starting time delay.
In a first aspect, an embodiment of the present invention provides a method for controlling low-temperature start of a chip, where the chip includes: a temperature sensor and a test logic module, the method comprising:
after the chip is powered on, acquiring a first internal temperature of the chip through the temperature sensor;
under the condition that the first internal temperature is smaller than a temperature threshold value, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor;
and controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold.
According to some embodiments of the invention, the chip further comprises a memory module, the test logic module comprises an MBIST circuit module, the memory module is electrically connected with the MBIST circuit module, and the controlling the test logic module to perform the warm-up process comprises:
outputting a first enable signal to the MBIST circuit module, causing the MBIST circuit module to start in response to the first enable signal, wherein the MBIST circuit module is a memory built-in self-test circuit module;
and controlling the MBIST circuit module to repeatedly perform read-write operation on the memory module so as to generate heat.
According to some embodiments of the invention, the test logic module comprises a scan test circuit module, wherein the scan test circuit module comprises: the scan chain with a plurality of registers connected in series controls the test logic module to perform preheating treatment, and comprises:
outputting a second enabling signal to the scanning test circuit module, and setting the working mode of the scanning test circuit module to be a scanning shift mode through the second enabling signal;
outputting a scan test signal to the scan test circuit module to cause the registers in the scan chain to toggle repeatedly in response to the scan test signal, thereby generating heat.
According to some embodiments of the present invention, before the controlling the test logic module to perform the preheating process, the chip further includes:
sending a set level signal and a first mode setting signal to the chip, closing the input/output interface module through the set level signal, and enabling the chip to enter a test mode through the first mode setting signal.
According to some embodiments of the invention, before controlling the chip to enter the startup mode when the second internal temperature is greater than or equal to the temperature threshold, the method further comprises:
and sending a reset level signal and a second mode setting signal to the chip, starting the input/output interface module through the reset level signal, and enabling the chip to exit the test mode through the second mode setting signal.
According to some embodiments of the invention, the acquiring, by the temperature sensor, the second internal temperature of the chip comprises:
acquiring the second internal temperature through the temperature sensor after a preset preheating treatment time.
According to some embodiments of the present invention, after acquiring the first internal temperature of the chip by the temperature sensor, the method further comprises:
and controlling the chip to enter a starting mode under the condition that the first internal temperature is greater than or equal to the temperature threshold value.
In a second aspect, an embodiment of the present invention provides a system for controlling a low-temperature start of a chip, including:
the chip comprises a temperature sensor and a test logic module, wherein the temperature sensor is used for collecting the internal temperature of the chip, and the test logic module is used for carrying out preheating treatment on the chip;
a pre-heating control module electrically connected with the chip; the preheating control module is used for: after the chip is powered on, acquiring a first internal temperature of the chip through a temperature sensor; under the condition that the first internal temperature is smaller than a temperature threshold value, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor; and controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold value.
In a third aspect, an embodiment of the present invention provides an electronic device, including: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the low temperature start control method according to the first aspect when executing the computer program.
In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions for executing the low-temperature start control method according to the first aspect.
The embodiment of the invention comprises the following steps: after the chip is powered on, acquiring a first internal temperature of the chip through a temperature sensor; under the condition that the first internal temperature is lower than the temperature threshold, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor; and under the condition that the second internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode. According to the scheme of the embodiment of the invention, after the chip is powered on, the low-temperature start control system firstly obtains the first internal temperature of the chip through the temperature sensor, then judges the magnitude relation between the first internal temperature and the preset temperature threshold through the preheating control module, and controls the test logic module to carry out preheating treatment under the condition that the first internal temperature is smaller than the temperature threshold; then, acquiring a second internal temperature of the chip through a temperature sensor; and finally, judging the size relation between the second internal temperature and a preset temperature threshold value through a preheating control module, controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold value, preheating the chip by utilizing an internal module of the chip under the condition that an additional heating device is not additionally arranged, and starting the chip more safely and quickly under the low-temperature environment. That is to say, the scheme of the embodiment of the invention can safely start the chip in a low-temperature environment, and has the advantages of lower circuit cost and smaller start time delay.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
FIG. 1 is a schematic structural diagram of a low-temperature start control system of a chip according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a cold start control system of a chip according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a scan test circuit module according to an embodiment of the present invention;
FIG. 4 is a flow chart illustrating a method for controlling a cold start according to an embodiment of the present invention;
FIG. 5 is a flow chart illustrating a process for controlling the test logic module to perform a preheat process according to an embodiment of the present invention;
FIG. 6 is a flowchart illustrating a preheating process performed by the control test logic according to another embodiment of the present invention;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
It should be noted that, although a logical order is illustrated in the flowcharts, in some cases, the steps illustrated or described may be performed in an order different from that in the flowcharts. The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the application.
First, several terms referred to in the present application are resolved:
design For Test (DFT): DFT refers to the stage in the original design of a chip where various hardware logic for improving the testability (including controllability and observability) of the chip is inserted, which may also be referred to as DFT test logic. And generating a test vector through DFT test logic to achieve the purpose of testing a large-scale chip.
The internal SCAN path test (SCAN) technique is one of the commonly used DFT methods. One common SCAN circuit is: the conventional flip-flops in the circuit are replaced by observable and controllable Scan flip-flops, which are connected in series to form a Scan Chain (SC). And testing the internal manufacturing defects of the chip through the scan chain of the internal register of the chip.
Built-In Self-Test (BIST) technology is one of the commonly used DFT methods. The BIST technique inspects manufacturing defects of a circuit designed to function properly by the operation of a test logic circuit (distinguished from a scan circuit) specially designed inside a chip, which is equivalent to integrating a small dedicated test instrument inside the chip. BIST methods are commonly used for on-chip memory testing.
Memory built-In-Self Test (MBIST) is one of the BIST techniques. "built-in" means that the Test vectors for the memory are not generated by an external tester (ATE), but are automatically generated by built-in memory Test logic and the results are compared.
Static Random-Access Memory (SRAM) is one type of Random Access Memory. The SRAM can always hold the stored data as long as it is kept powered on.
The invention provides a low-temperature start control method and system of a chip, electronic equipment and a computer readable storage medium. According to the scheme of the embodiment of the invention, after the chip is powered on, the low-temperature start control system firstly obtains the first internal temperature of the chip through the temperature sensor, then judges the magnitude relation between the first internal temperature and the preset temperature threshold through the preheating control module, and controls the test logic module to carry out preheating treatment under the condition that the first internal temperature is smaller than the temperature threshold; then, acquiring a second internal temperature of the chip through a temperature sensor; and finally, judging the size relation between the second internal temperature and a preset temperature threshold value through a preheating control module, controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold value, preheating the chip by utilizing an internal module of the chip under the condition that an additional heating device is not additionally arranged, and starting the chip more safely and quickly under the low-temperature environment. That is to say, the scheme of the embodiment of the invention can safely start the chip in a low-temperature environment, and has the advantages of lower circuit cost and smaller start time delay.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 1, the low-temperature start control system 100 includes: a chip 110 and a preheating control module 120, the preheating control module 120 being electrically connected to the chip 110; the chip 110 includes a temperature sensor 111 and a test logic module 112.
The temperature sensor 111 is used for acquiring the internal temperature of the chip. Specifically, the temperature sensor 111 may acquire the internal temperature of the chip in real time.
And the test logic module 112 is used for performing preheating treatment on the chip. Specifically, test logic module 112 is a DFT test logic module.
A preheating control module 120 for acquiring a first internal temperature of the chip 110 through the temperature sensor 111 after the chip 110 is powered on; under the condition that the first internal temperature is smaller than the temperature threshold, controlling the test logic module 112 to perform preheating treatment, and acquiring a second internal temperature of the chip 110 through the temperature sensor 111; in the case where the second internal temperature is greater than or equal to the temperature threshold, the control chip 110 enters the startup mode.
According to the low-temperature start control system 100 provided by the embodiment of the present invention, after the chip 110 is powered on, the first internal temperature of the chip 110 is first obtained through the temperature sensor 111, then the pre-heating control module 120 determines the magnitude relationship between the first internal temperature and the preset temperature threshold, and in case that the first internal temperature is less than the temperature threshold, the test logic module 112 is controlled to perform the pre-heating process; then, a second internal temperature of the chip 110 is obtained through the temperature sensor 111; finally, the pre-heating control module 120 determines the magnitude relationship between the second internal temperature and the preset temperature threshold, and controls the chip 110 to enter the start mode when the second internal temperature is greater than or equal to the temperature threshold, and the internal module of the chip 110 is used for pre-heating the chip without adding an additional heating device to the chip 110, so that the chip 110 is safely started in a low-temperature environment. That is, the low-temperature start control system 100 can safely start the chip 110 in a low-temperature environment, and has low circuit cost and small start-up time delay.
Referring to fig. 2, the cold start control system 100 includes: a chip 110 and a preheating control module 120, wherein the chip 110 includes a temperature sensor 111, a test logic module 112, a memory module 113, and an input/output interface module 114, and the test logic module 112 further includes: the MBIST circuit block 1121 and the scan test circuit block 1122 electrically connected to the memory block 113, and the preheating control block 120 are electrically connected to the chip 110.
The memory module 113 is used for storing data and can be read or written with data. Specifically, the memory module 113 is a static random access memory.
The input/output interface module 114 is configured to be turned off in response to a set level signal sent by the preheat control module 120 before the preheat control module 120 controls the test logic module 112 to perform the preheat process. During the preheating treatment, the input and the output are closed, the influence on the functions of other elements in the chip is reduced, and the effectiveness of a chip system is guaranteed. And is further configured to restore the input and output of the system-on-chip in response to the reset level signal sent by the warm-up control module 120 being turned on before the control chip 110 enters the start-up mode if the second internal temperature is greater than or equal to the temperature threshold.
And an MBIST circuit block 1121 configured to, after receiving the first enable signal sent by the preheating control block 120, start in response to the first enable signal, and repeat read and write operations on the memory block 113. Through repeated read-write operation heat production, improve the inside temperature of chip. In particular, MBIST circuit module 1121 is a memory built-in self-test circuit module.
The scan test circuit module 1122 is configured to enter a scan shift mode in response to the second enable signal after receiving the second enable signal output by the thermal pre-control module 120, and then the register in the scan test circuit module 1122 is repeatedly flipped in response to the scan test signal after receiving the scan test signal output by the thermal pre-control module 120. The register is repeatedly turned to generate heat, and the temperature inside the chip is improved. In the preheating process, the MBIST circuit module and the scanning test circuit module 1122 are controlled to work and generate heat at the same time, so that the heat generation efficiency is effectively improved, and the starting time delay of the chip in a low-temperature environment is reduced.
Specifically, referring to fig. 3, fig. 3 is a schematic structural diagram of a scan test circuit module according to an embodiment of the present invention. The scan test circuit module comprises a scan chain, wherein the scan chain comprises: a first register 1122A, a second register 1122B, and a third register 1122C, each of which includes an input terminal (D terminal), an output terminal (Q terminal), and a clock pulse input terminal (CLK terminal). The D end of the first register 1122A is a Scan input end (Scan _ in), the Q end of the third register 1122C is a Scan output end (Scan _ out), the Q end of the first register 1122A is connected to the D end of the second register 1122B, the Q end of the second register 1122B is connected to the D end of the third register 1122C, and the CLK end of the first register 1122A is connected to the CLK ends of the second register 1122B and the third register 1122C, respectively. In the test mode shown in fig. 3, all registers are connected in series to form Scan Chain; the register can be repeatedly turned over to generate heat as long as a Scan test signal is input to the Scan _ in end of the Scan Chain.
It should be noted that, the embodiment of the present invention performs the warm-up process by using the MBIST circuit block and the scan test circuit block 1122 in the test logic block 112, but does not pay attention to the test result of the test logic block 112, and even if the test logic block 112 fails, the warm-up process is not affected.
Furthermore, it is understood that the preheating control module 120 is electrically connected to the chip 110, and the low-temperature start-up control system 100 can control the chip 110 and the internal logic circuit of the chip 110 through the preheating control module 120.
According to the low-temperature start control system 100 provided by the embodiment of the present invention, after the chip 110 is powered on, first, the first internal temperature of the chip 110 is obtained through the temperature sensor 111, then, the size relationship between the first internal temperature and the preset temperature threshold is judged through the preheating control module 120, when the first internal temperature is smaller than the temperature threshold, the preheating control module 120 sends a set level signal and a first mode setting signal to the chip 110, the input/output interface module 114 is turned off through the set level signal, and the chip 110 enters the test mode through the first mode setting signal; then, in the test mode, the preheating control module 120 outputs a first enable signal to the MBIST circuit module 1121, so that the MBIST circuit module 1121 is started in response to the first enable signal, and controls the MBIST circuit module 1121 to repeatedly perform read-write operations on the memory module 113, thereby generating heat; meanwhile, the pre-heating control module 120 outputs a second enable signal and a scan test signal to the scan test circuit module 1122, sets the working mode of the scan test circuit module 1122 to a scan shift mode through the second enable signal, and repeatedly inverts a register in the scan chain through the scan test signal, thereby generating heat; then, after the preset preheating time, the preheating control module 120 obtains the second internal temperature of the chip 110, and determines the magnitude relationship between the second internal temperature and the preset temperature threshold, and when the second internal temperature is greater than or equal to the temperature threshold, the preheating control module 120 sends a reset level signal and a second mode setting signal to the chip 110, starts the input/output interface module through the reset level signal, and enables the chip 110 to exit from the test mode and enter into a normal start mode through the second mode setting signal, so that the chip 110 is safely started in a low-temperature environment. The circuit cost is lower, and it is effectual to preheat, and start-up time delay is less.
The device structure and the application scenario described in the embodiment of the present invention are for more clearly illustrating the technical solution of the embodiment of the present invention, and do not form a limitation on the technical solution provided in the embodiment of the present invention, and it is known to those skilled in the art that the technical solution provided in the embodiment of the present invention is also applicable to similar technical problems with the evolution of the device structure and the occurrence of new application scenarios.
Those skilled in the art will appreciate that the system configurations shown in fig. 1 and 2 are not meant to limit embodiments of the present invention, and may include more or fewer modules than those shown, or some modules may be combined, or a different arrangement of modules.
Based on the above system structure, various embodiments of the low-temperature start control method of the present invention are presented below.
Referring to fig. 4, fig. 4 is a flowchart illustrating a low-temperature start control method according to an embodiment of the present invention. The low-temperature start control method can be applied to the low-temperature start control system shown in fig. 1, and the low-temperature start control method includes, but is not limited to, steps S110 to S130.
Step S110: after the chip is powered on, a first internal temperature of the chip is acquired through the temperature sensor.
Step S120: and under the condition that the first internal temperature is smaller than the temperature threshold, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor.
In this step, after the first internal temperature is obtained, the relationship between the first internal temperature and the temperature threshold is compared, and the test logic module is controlled to perform the preheating process when the first internal temperature is lower than the temperature threshold.
In particular, the test logic module is a DFT test logic circuit.
It is understood that the temperature threshold is preset. The working temperature range of the chip can be determined by a person skilled in the art according to the grade of the chip, and then the temperature threshold value is set according to the working temperature range, so as to ensure that the chip can be started safely. The temperature threshold may be a minimum temperature value in the operating temperature range that enables the chip to operate properly. For example, when a commercial grade chip (working temperature range is 0 to +70 ℃) is started by using a low-temperature starting control system, the temperature threshold value can be set to be 0 ℃. Therefore, the value of the temperature threshold is not particularly limited in the embodiment of the present invention.
According to some embodiments of the present invention, after acquiring the first internal temperature of the chip by the temperature sensor, the method further includes: and under the condition that the first internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode. Under the condition that the first internal temperature is proper, the chip enters a normal starting mode, and the starting time delay cannot be increased.
According to the embodiment of the invention, whether the preheating treatment is required or not is automatically judged through the first internal temperature and the temperature threshold of the chip, the preheating treatment is automatically carried out under the condition that the first internal temperature is less than the temperature threshold, and the chip is automatically enabled to enter the normal starting mode under the condition that the first internal temperature is not less than the temperature threshold, so that the process of starting the chip is safe and intelligent, and the starting time delay is greatly saved.
According to some embodiments of the invention, acquiring the second internal temperature of the chip by the temperature sensor comprises: after the preset preheating treatment time has elapsed, a second internal temperature is acquired by the temperature sensor. And in the preset preheating time, the test logic module performs preheating treatment. And after the preset preheating treatment time, acquiring a second internal temperature to provide reference for subsequent treatment.
It is understood that the long duration of the preheat process can result in excessive heat generation, excessive temperatures, and damage to the components within the chip. By setting an appropriate preheating time, the probability that the chip is damaged by preheating can be reduced.
It is understood that, a person skilled in the art can determine the value of the preset preheating time according to actual requirements, and therefore, the present invention does not specifically limit the value of the preset preheating time.
Step S130: and under the condition that the second internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode.
In this step, after the second internal temperature is acquired, the relationship between the second internal temperature and the temperature threshold is determined. And under the condition that the second internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode. And safe starting is realized in a low-temperature environment.
In an embodiment, in the case that the second internal temperature is lower than the temperature threshold, the test logic module continues to be controlled to perform the preheating process until the internal temperature of the chip is raised to the temperature threshold.
It can be understood that, in the start mode, each module inside the chip will be started in sequence according to the conventional steps, and finally the chip is started. Therefore, the embodiment of the present invention does not describe the starting process of the chip.
Through steps S110 to S130, according to the scheme of the embodiment of the present invention, after the chip is powered on, the first internal temperature of the chip is first obtained through the temperature sensor, and then, under the condition that the first internal temperature is smaller than the temperature threshold, the test logic module is controlled to perform the preheating process, and the second internal temperature of the chip is obtained through the temperature sensor; and then, under the condition that the second internal temperature is greater than or equal to the temperature threshold value, the control chip enters a starting mode. Under the condition that an additional heating device is not additionally arranged, the chip is preheated by utilizing the internal module of the chip, and the chip is started safely and quickly in a low-temperature environment. The scheme can safely start the chip in a low-temperature environment, and has the advantages of lower circuit cost and smaller start time delay.
Referring to fig. 5, according to some embodiments of the present invention, the step of controlling the test logic module to perform the preheating process includes, but is not limited to, steps S210 to S220.
Step S210: and outputting a first enabling signal to the MBIST circuit module, so that the MBIST circuit module is started in response to the first enabling signal, wherein the MBIST circuit module is a memory built-in self-test circuit module.
Step S220: and controlling the MBIST circuit module to repeatedly perform read-write operation on the memory module so as to generate heat.
Through steps S210 to S220, after the first enable signal is output to start the MBIST circuit module, the MBIST circuit module performs repeated read-write operation on the memory module to generate heat, so as to increase the internal temperature of the chip.
Specifically, the first enable signal is an MBIST _ EN signal, which is a high level signal; the memory module is an SRAM module.
Taking an example:
in a test mode of the work of the MBIST circuit module, the MBIST circuit module firstly writes all 1 into the SRAM module, then reads data back from the SRAM module, and checks whether all 1; the MBIST circuit block then writes all 0's into the SRAM block, then reads back the data from the SRAM block, and checks if all 0's. The read-write processing is repeated in this way, so that the chip is preheated. In actual testing, various data combinations are constructed, such as 0x55aa writing, so as to enhance the testing effect. After the MBIST circuit module is enabled, the specific test work is automatically completed by the MBIST circuit module, so that the method and the device do not limit the process of realizing the read-write operation.
Referring to fig. 6, the step "controlling the test logic module to perform the preheating process" includes, but is not limited to, steps S310 to S320.
Step S310: and outputting a second enabling signal to the scanning test circuit module, and setting the working mode of the scanning test circuit module to be a scanning shift mode through the second enabling signal.
Step S320: and outputting a scan test signal to the scan test circuit module to enable the register in the scan chain to repeatedly turn over in response to the scan test signal, thereby generating heat.
Through steps S310 to S320, after the second enable signal is output to start the scan test circuit module, the register repeatedly turns over to generate heat, and the temperature inside the chip is increased.
Specifically, the second Enable signal is a Scan _ Enable signal having a value of 1. The operation modes of the registers in the scan chain are normal operation mode and scan shift mode. When the Scan _ Enable signal is 0, the normal working mode is set; when the Scan _ Enable signal is 1, the Scan shift mode is selected.
Taking an example:
in a test mode of the Scan test circuit module, a Scan test signal is input to the Scan _ in terminal, and the Scan test signal may be a binary digital signal (e.g., 01010101), so that the register in the Scan chain is repeatedly flipped. The register consumes power during the turning over, and the temperature is raised by using the power consumption.
In the preheating process, the MBIST circuit module and the scan test circuit module 1122 are controlled to work and generate heat at the same time, so that the heat generation efficiency is effectively improved, and the starting time delay of the chip in a low-temperature environment is reduced.
According to some embodiments of the present invention, before the controlling the test logic module to perform the preheating process, the method further comprises: and sending a set level signal and a first mode setting signal to the chip, closing the input/output interface module through the set level signal, and enabling the chip to enter a test mode through the first mode setting signal. And plays a role in protecting other functional elements in the chip.
Specifically, before controlling the Test logic module to perform the preheating process, the operating mode of the chip needs to be switched from the normal mode to the Test mode, the chip is usually identified by a Test _ mode signal, and the Test _ mode signal being identified as high level indicates that the chip is in the Test mode.
Specifically, the first mode setting signal is a high level signal, and the chip enters the test mode through the first mode setting signal.
According to some embodiments of the present invention, in a case that the second internal temperature is greater than or equal to the temperature threshold, before the controlling chip enters the start mode, the method further includes: and sending a reset level signal and a second mode setting signal to the chip, starting the input/output interface module through the reset level signal, and enabling the chip to exit the test mode through the second mode setting signal.
Specifically, the second mode setting signal is a low level signal, and the chip is enabled to exit the test mode and switch to the normal mode through the second mode setting signal, so as to subsequently start the chip.
As an example, the overall flow of the low-temperature start control method is described.
After the chip is powered on, the temperature sensor detects the internal temperature of the chip; after the first internal temperature of the chip is obtained, the magnitude relation between the first internal temperature and a preset temperature threshold is judged. In one aspect, the chip is directly activated in the event that the first internal temperature is greater than or equal to the temperature threshold. On the other hand, under the condition that the first internal temperature is smaller than the temperature threshold, sending a set level signal and a first mode setting signal to the chip, closing an input/output interface module of the chip through the set level signal, and enabling the chip to enter a test mode through the first mode setting signal; then, in the test mode, outputting a first enable signal to the MBIST circuit module, enabling the MBIST circuit module to start in response to the first enable signal, and controlling the MBIST circuit module 1121 to repeatedly perform read-write operation on the memory module 113, thereby generating heat; outputting a second enabling signal and a scanning test signal to the scanning test circuit module, setting the working mode of the scanning test circuit module into a scanning shift mode through the second enabling signal, and repeatedly turning over a register in a scanning chain through the scanning test signal so as to generate heat; and then, after the preset preheating treatment time, acquiring a second internal temperature of the chip, and judging the magnitude relation between the second internal temperature and a preset temperature threshold value. If the second internal temperature is lower than the temperature threshold, the preheating process is continued. And under the condition that the second internal temperature is greater than or equal to the temperature threshold, sending a reset level signal and a second mode setting signal to the chip, starting the input/output interface module through the reset level signal, and enabling the chip to exit the test mode and enter a normal starting mode through the second mode setting signal, so that the chip is safely started in a low-temperature environment. The circuit cost is lower, and it is effectual to preheat, and start-up time delay is less.
In addition, referring to fig. 7, an electronic device 700 provided in an embodiment of the present invention includes: memory 720, processor 710, and computer programs stored on the memory and executable on the processor.
The processor 710 and the memory 720 may be connected by a bus or other means.
The processor 710 may be implemented by a general-purpose central processing unit, a microprocessor, an application specific integrated circuit, or one or more integrated circuits, and is configured to execute a relevant program to implement the technical solutions provided in the embodiments of the present application.
The memory 720, which is a non-transitory computer-readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer-executable programs. Further, memory 720 may include high speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory located remotely from the processor, and these remote memories may be connected to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
It should be noted that the electronic device of the present embodiment can implement the low-temperature start control method as in any of the foregoing embodiments. The electronic equipment can firstly acquire a first internal temperature of the chip through the temperature sensor after the chip is powered on, then control the test logic module to perform preheating treatment under the condition that the first internal temperature is smaller than a temperature threshold value, and acquire a second internal temperature of the chip through the temperature sensor; and then, under the condition that the second internal temperature is greater than or equal to the temperature threshold, the control chip enters a starting mode, the chip can be safely started in a low-temperature environment, the circuit cost is low, and the starting time delay is short.
Non-transitory software programs and instructions required to implement the low-temperature start control method of the above-described embodiment are stored in the memory 720, and when executed by the processor, perform the low-temperature start control method of the above-described embodiment, for example, perform the method steps in fig. 4, 5, and 6 described above.
The above-described apparatus embodiments or system embodiments are merely illustrative, wherein elements described as separate components may or may not be physically separate, may be located in one place, or may be distributed over multiple network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Furthermore, an embodiment of the present invention also provides a computer-readable storage medium storing computer-executable instructions, which are executed by a processor or controller, for example, by a processor in the above-mentioned apparatus embodiment, and can make the processor execute the low-temperature start control method in the above-mentioned embodiment, for example, execute the method steps in fig. 4, fig. 5 and fig. 6 described above.
It will be understood by those of ordinary skill in the art that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, or suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as is well known to those skilled in the art.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (10)
1. A low-temperature start control method of a chip is characterized in that the chip comprises: a temperature sensor and a test logic module, the method comprising:
after the chip is powered on, acquiring a first internal temperature of the chip through the temperature sensor;
under the condition that the first internal temperature is smaller than a temperature threshold value, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor;
and controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold.
2. The method of claim 1, wherein the chip further comprises a memory module, the test logic module comprises an MBIST circuit module, the memory module is electrically connected to the MBIST circuit module, and the controlling the test logic module to perform the warm-up process comprises:
outputting a first enable signal to the MBIST circuit module, causing the MBIST circuit module to start in response to the first enable signal, wherein the MBIST circuit module is a memory built-in self-test circuit module;
and controlling the MBIST circuit module to repeatedly perform read-write operation on the memory module so as to generate heat.
3. The method of claim 1, wherein the test logic module comprises a scan test circuit module, wherein the scan test circuit module comprises: the scan chain with a plurality of registers connected in series controls the test logic module to perform preheating treatment, and comprises:
outputting a second enabling signal to the scanning test circuit module, and setting the working mode of the scanning test circuit module to be a scanning shift mode through the second enabling signal;
outputting a scan test signal to the scan test circuit module to cause the registers in the scan chain to toggle repeatedly in response to the scan test signal, thereby generating heat.
4. The method as claimed in claim 1, wherein the chip further includes an input/output interface module, and before the controlling the test logic module to perform the warm-up process, the method further includes:
sending a set level signal and a first mode setting signal to the chip, closing the input/output interface module through the set level signal, and enabling the chip to enter a test mode through the first mode setting signal.
5. The cold-start control method of claim 4, wherein before controlling the chip to enter a start mode if the second internal temperature is greater than or equal to the temperature threshold, the method further comprises:
and sending a reset level signal and a second mode setting signal to the chip, starting the input/output interface module through the reset level signal, and enabling the chip to exit the test mode through the second mode setting signal.
6. The cold start control method according to claim 1, wherein the acquiring of the second internal temperature of the chip by the temperature sensor includes:
acquiring the second internal temperature through the temperature sensor after a preset preheating treatment time.
7. The cold start control method according to claim 1, further comprising, after acquiring the first internal temperature of the chip by a temperature sensor:
and controlling the chip to enter a starting mode under the condition that the first internal temperature is greater than or equal to the temperature threshold value.
8. A cold start control system for a chip, comprising:
the chip comprises a temperature sensor and a test logic module, wherein the temperature sensor is used for collecting the internal temperature of the chip, and the test logic module is used for carrying out preheating treatment on the chip;
a pre-heat control module electrically connected with the chip; the preheating control module is used for: after the chip is powered on, acquiring a first internal temperature of the chip through a temperature sensor; under the condition that the first internal temperature is smaller than a temperature threshold value, controlling the test logic module to perform preheating treatment, and acquiring a second internal temperature of the chip through the temperature sensor; and controlling the chip to enter a starting mode under the condition that the second internal temperature is greater than or equal to the temperature threshold value.
9. An electronic device, comprising: memory, processor and computer program stored on the memory and executable on the processor, characterized in that the processor implements the method of cold start control according to any of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium storing computer-executable instructions for performing the cold start control method according to any one of claims 1 to 7.
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