CN115945798A - Full-automatic wafer ultraviolet laser slotting equipment - Google Patents
Full-automatic wafer ultraviolet laser slotting equipment Download PDFInfo
- Publication number
- CN115945798A CN115945798A CN202211467781.6A CN202211467781A CN115945798A CN 115945798 A CN115945798 A CN 115945798A CN 202211467781 A CN202211467781 A CN 202211467781A CN 115945798 A CN115945798 A CN 115945798A
- Authority
- CN
- China
- Prior art keywords
- driving
- component
- assembly
- workpiece
- driving assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000007599 discharging Methods 0.000 claims abstract description 32
- 230000000007 visual effect Effects 0.000 claims abstract description 23
- 239000002699 waste material Substances 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims description 65
- 230000003287 optical effect Effects 0.000 claims description 31
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000010147 laser engraving Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 15
- 238000012545 processing Methods 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 description 11
- 239000000428 dust Substances 0.000 description 10
- 238000013459 approach Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Laser Beam Processing (AREA)
Abstract
The invention discloses full-automatic wafer ultraviolet laser grooving equipment which comprises a machine table, and a feeding device, an operation platform device, a feeding device, a laser device, a first CCD device, a second CCD device, a discharging device, a stacking device and a waste throwing device which are arranged on the machine table. In the equipment, a feeding device is responsible for providing a workpiece, after the workpiece is provided, a component is input into a disc body of an operation flat device by a feeding device, the workpiece is subjected to laser processing on the disc body, before the processing, a first CCD device is matched with a second CCD device to perform visual positioning on the upper surface and the lower surface of the workpiece, the workpiece is processed by a laser device above the workpiece after the visual positioning, a groove body is engraved on the surface of the workpiece, and a discharging device, a stacking device and a waste throwing device are responsible for discharging. The device utilizes an upper CCD recognition system and a lower CCD recognition system, the double-side precision can be controlled to be 5-10um level, and the double-side precision is far higher than that of the existing LED exposure machine; the equipment has the advantages of low process cost, low labor cost, low material consumption cost and higher quality.
Description
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to full-automatic wafer ultraviolet laser grooving equipment.
Background
The existing wafer slotting is still in a semi-automatic stage, and the loading and unloading and the workpiece positioning are both manually responsible. The existing LED exposure machine can only use a mask plate for exposure and needs to be added with a developing process;
the invention provides full-automatic slotting equipment, which improves the product quality.
Disclosure of Invention
According to one aspect of the invention, the full-automatic wafer ultraviolet laser grooving equipment comprises a machine table and a groove body arranged on the machine table
A supply device configured to supply a workpiece;
the operation platform device comprises a disc carrying component capable of driving to move, and the disc carrying component is provided with a transparent disc body;
a feeding device which is arranged between the feeding device and the operation platform device and is configured and arranged in the disc body for inputting the workpiece,
the laser device is positioned above the operation platform device and is configured to carry out laser engraving on the workpiece;
a first CCD device positioned above the operation platform device and configured to visually position the upper surface of the workpiece;
and a second CCD device located below the work platform device and configured to perform visual positioning from the lower surface of the workpiece.
The invention provides full-automatic equipment capable of carrying out ultraviolet laser grooving on a wafer. In the equipment, a feeding device is responsible for providing a workpiece, after the workpiece is provided, a component is input into a disc body of an operation flat device by a feeding device, the workpiece is subjected to laser processing on the disc body, before the processing, a first CCD device is matched with a second CCD device to perform visual positioning on the upper surface and the lower surface of the workpiece, the workpiece is processed by the laser device above after the visual positioning, and a groove body is carved on the surface of the workpiece. By utilizing the upper CCD identification system and the lower CCD identification system, the double-side precision can be controlled at 5-10um level and is far higher than that of the existing LED exposure machine. The process cost is low, the labor cost is low, the material consumption cost is low, and the quality is higher.
In some embodiments, the feeding device comprises a material storage mechanism and a material taking mechanism, wherein the material taking mechanism is arranged on one side of the material storage mechanism, and a plurality of workpieces are placed on the material storage mechanism;
the material storage mechanism comprises a first driving component and a material storage rack; the storage rack is arranged at the driving end of the first driving assembly, a plurality of slots for placing workpieces are formed in the storage rack, the slots are distributed in a vertical array mode, and the first driving assembly can drive the storage rack to move up and down;
the material taking mechanism comprises a second driving assembly and a fork disc assembly; the fork disc assembly is arranged at the driving end of the second driving assembly, and the second driving assembly can drive the fork disc assembly to be inserted into or far away from the slot;
the fork disc assembly comprises a mounting plate, a fork disc and a first visual assembly, the fork disc and the first visual assembly are arranged on the mounting plate, the first visual assembly is focused on the slot, and a negative pressure assembly is arranged on the fork disc.
From this, feedway comprises storage mechanism, feeding agencies, and in feedway's the course of operation: the second driving component drives the working end (namely the fork disc) of the fork disc component to be inserted into the slot of the material storage rack, and then the negative pressure component on the fork disc is started to adsorb the workpiece; the second driving component drives reversely, the fork disc takes the workpiece out of the workpiece slot, and the workpiece is positioned on the fork disc to finish taking. In the material taking process, the first vision component is opened in the whole process, so that the position of taking a workpiece can be accurately positioned, and the workpiece is prevented from being damaged; after each piece taking action is completed, the first driving assembly can drive the material storage frame to move vertically, so that a workpiece in the next slot enters the working end of the material taking mechanism.
In some embodiments, the feeding device comprises a third driving assembly, a fourth driving assembly and a suction cup mechanism, wherein the fourth driving assembly is arranged at the driving end of the third driving assembly, and the suction cup mechanism is arranged at the driving end of the fourth driving assembly;
the driving direction of the third driving assembly is a connecting line between the feeding device and the operation platform device, and the driving direction of the fourth driving assembly is a vertical direction.
Therefore, in the feeding device, the third driving assembly is responsible for transverse conveying, the fourth driving assembly is responsible for vertical direction approaching and keeping away from, and in the working process: the fourth driving component drives the sucker mechanism to move from the vertical direction to a workpiece close to the discharge end of the feeding device; the sucking disc mechanism sucks the workpiece, and the fourth driving assembly drives reversely; the third driving assembly drives the sucker mechanism to approach the processing platform device from the transverse direction and stop above the disc body; the fourth driving component drives the sucker mechanism to be close to the disc body in the vertical direction, and the workpiece of the sucker mechanism is released on the disc body.
In some embodiments, the feeding device further comprises a second vision component and a first rotary driving component, the suction cup mechanism is arranged at the driving end of the fourth driving component through the first rotary driving component, the second vision component is arranged below the suction cup mechanism, and the second vision component focuses on the suction cup mechanism.
Therefore, the second vision assembly can perform initial positioning on the workpiece, and after the second vision assembly detects the workpiece, the first rotary driving assembly drives the workpiece to be aligned.
In some embodiments, the work platform arrangement comprises a fifth drive assembly, a first slide plate, a sixth drive assembly, a second slide plate, a second rotary drive assembly,
the first sliding plate is arranged at the driving end of the fifth driving component, the sixth driving component is arranged on the first sliding plate, the second sliding plate is arranged at the driving end of the sixth driving component, the second rotary driving component is arranged on the second sliding plate, the carrying disc component is arranged at the driving end of the second rotary driving component,
the fifth driving assembly, the sixth driving assembly and the second rotary driving assembly are provided with an avoidance part for focusing the second CCD device.
The fifth driving assembly and the sixth driving assembly are vertically distributed, and both the fifth driving assembly and the sixth driving assembly are driven horizontally.
Therefore, in the working platform device, the disc body can move in a plane under the driving of the fifth driving assembly and the sixth driving assembly; moreover, the clearance part can enable the second CCD device to collect images of the lower surface of the workpiece.
In some embodiments, the laser device comprises a laser, a first optical path component, a seventh driving component, a second optical path component, a two-dimensional galvanometer scanning device and a telescopic optical path component,
the first light path component is arranged at the emergent end of the laser, the second light path component is arranged at the driving end of the seventh driving component, and the two-dimensional galvanometer scanning device is arranged at the emergent end of the second light path component; the first light path component and the second light path component are connected through the telescopic light path component.
Therefore, in the laser device, the seventh driving component can drive the two-dimensional galvanometer scanning device to move up and down, so that the distance between the seventh driving component and the workpiece is adjusted; the first light path component and the second light path component are connected through the telescopic light path component, and lifting is not affected.
In some embodiments, the first CCD device includes a first light source and a first camera, the first light source and the first camera are disposed at the driving end of the seventh driving component and are located at one side of the two-dimensional galvanometer scanning device, and the first camera is located above the first light source.
Thus, the first CCD device is constituted by the above-described structure.
In some embodiments, the second CCD device comprises a second light source, a second camera, the second light source, the second camera being located below the work platform device, the second camera being located below the second light source;
the first camera and the second camera are distributed off-axis.
Thus, the second CCD device is constituted by the above-described structure.
In some embodiments, the full-automatic wafer ultraviolet laser grooving equipment further comprises a discharging device and a stacking device, wherein the discharging device and the stacking device are both arranged on the machine platform;
the stacking device is positioned on one side of the feeding device, the discharging device is positioned between the stacking device and the operation platform device, and the discharging device is configured and positioned in the stacking device for inputting workpieces.
Therefore, after the workpieces are machined, the discharging device inputs the workpieces into the stacking device to be stacked and stored.
In some embodiments, the full-automatic wafer ultraviolet laser grooving equipment further comprises a waste throwing device, the waste throwing device is arranged below the discharging device, the waste throwing device comprises a waste tray and an eighth driving assembly, and the waste tray is arranged at the driving end of the eighth driving assembly.
Therefore, after some workpieces fail to be machined, the discharging device inputs the workpieces into the waste tray.
Drawings
Fig. 1 is a schematic perspective view of a full-automatic wafer uv laser grooving apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic top view of the full-automatic wafer uv laser grooving apparatus shown in fig. 1.
Fig. 3 is a schematic perspective view of a feeding device in the full-automatic wafer uv laser grooving apparatus shown in fig. 1.
Fig. 4 is a schematic perspective view of a feeding device in the full-automatic wafer ultraviolet laser grooving apparatus shown in fig. 1.
Fig. 5 is a schematic perspective view of a processing part of the device in the full-automatic wafer ultraviolet laser grooving apparatus shown in fig. 1.
Fig. 6 is a schematic plan view of a processing platform device and a detection device in the full-automatic wafer ultraviolet laser grooving apparatus shown in fig. 1.
Fig. 7 isbase:Sub>A schematic sectional view in the direction ofbase:Sub>A-base:Sub>A in fig. 6.
Fig. 8 is a schematic perspective view of a discharging device in the full-automatic wafer uv laser grooving apparatus shown in fig. 1.
Fig. 9 is a schematic structural diagram illustrating a working process of the full-automatic wafer ultraviolet laser grooving apparatus shown in fig. 1.
The reference numbers in the figures: 000-machine table, 100-feeding device, 110-storing mechanism, 111-first driving component, 112-storing frame, 1121-slot, 120-material taking mechanism, 121-second driving component, 122-fork disc component, 1221-mounting plate, 1222-fork disc, 1223-first visual component, 200-feeding device, 210-third driving component, 220-fourth driving component, 230-suction disc mechanism, 240-second visual component, 250-first rotary driving component, 300-working platform device, 310-carrying disc component, 311-disc body, 320-fifth driving component, 330-first sliding plate, 340-sixth driving component, 350-second sliding plate, 360-second rotary driving component, 301-clearance part, 400-laser device, 410-laser device, 420-first optical path component, 430-telescopic optical path component, 440-second optical path component, 450-two-dimensional galvanometer scanning device, 460-seventh driving component, 470-dust collection component, 471-suction hood, 620-first optical path component, 500-second optical path component, 600-focus cleaning device, 1000-ninth camera, 500-ninth camera device, 1000-ninth camera device, 500-third optical path cleaning device, 1000-fourth optical path cleaning device, and the like components.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1-2 schematically illustrate a fully automated wafer uv laser grooving apparatus according to one embodiment of the present invention. As shown in the figure, the device includes a machine platform 000, a feeding device 100, a work platform device 300, a feeding device 200, a laser device 400, a first CCD device 500, a second CCD device 600, a discharging device 700, a stacking device 800, and a waste disposal device 900, wherein the feeding device 100, the work platform device 300, the feeding device 200, the laser device 400, the first CCD device 500, the second CCD device 600, the discharging device 700, the stacking device 800, and the waste disposal device 900 are all disposed on the machine platform 000.
In order to better explain the components in the present embodiment, the present embodiment is explained in detail by using three-dimensional concepts of X, Y and Z axes in conjunction with fig. 1-2. The feeding driving direction of the feeding device 200 is taken as an X axis, the longitudinal direction perpendicular to the X axis is taken as a Y axis, and the vertical direction perpendicular to the X axis is taken as a Z axis. The plane formed by the X axis and the Y axis is an XY plane, the plane formed by the X axis and the Z axis is an XZ plane, and the plane formed by the Y axis and the Z axis is a YZ plane. Further, the front, rear, left, right, up and down directions in this specification will be described with reference to the arrow direction as a forward direction with reference to fig. 1 to 2: the positive direction of the Y axis is a front position, and the negative direction is a rear position; the positive direction of the Z axis is an upper direction, otherwise, the positive direction is a lower direction; the positive direction of the X axis is the right direction, and the negative direction is the left direction.
The feeding device 100 is located at the leftmost position of the end face of the machine platform 000, the operation platform device 300 is arranged on the right side of the feeding device 100, the feeding device 200 is located between the feeding device 100 and the operation platform device 300, the stacking device 800 is arranged on the front side of the feeding device 100, the discharging device 700 is located between the stacking device 800 and the operation platform device 300, and the waste throwing device 900 is arranged below the discharging device 700.
The supply device 100 is configured to supply a workpiece; the feeding device 200 is configured to be positioned in the input tray 311 for feeding a workpiece, and the laser device 400 is configured to perform laser engraving with the workpiece; the first CCD device 500 is configured to visually locate the upper surface of the workpiece; the second CCD device 600 is configured to perform visual alignment from the lower surface of the workpiece. The working platform device 300 comprises a movable tray assembly 310, wherein the tray assembly 310 is provided with a transparent tray body 311, and the tray body 311 is made of quartz.
The feeding device 100 and the feeding device 200 form a feeding part module, the discharging device and the stacking device form a discharging part module, and the operation platform device 300, the laser device 400 and the CCD device form an operation part module; the feeding part module and the discharging part module are symmetrically distributed along the X axis, the operation part module is located on the common right side of the feeding part module and the discharging part module, the occupied space of the equipment can be maximally reduced through the layout, the transportation time of the workpiece can be minimized, and the working efficiency can be improved.
In the device, the feeding device 100 is responsible for providing workpieces, after the workpieces are provided, the components are input into the tray body 311 of the operation flat device by the feeding device 200, the workpieces are subjected to laser processing on the tray body 311, before the processing, the first CCD device 500 is matched with the second CCD device 600 to perform visual positioning on the upper surface and the lower surface of the workpieces, after the visual positioning, the workpieces are processed by the upper laser device 400, and groove bodies are carved on the surfaces of the workpieces. By utilizing the upper CCD identification system and the lower CCD identification system, the double-side precision can be controlled to be 5-10um level and is far higher than that of the existing LED exposure machine. The process cost is low, the labor cost is low, the material consumption cost is low, and the quality is higher.
Referring to fig. 3, the feeding device 100 includes a material storage mechanism 110 and a material taking mechanism 120, the material taking mechanism 120 is disposed on the right side of the material storage mechanism 110, and a plurality of workpieces are placed on the material storage mechanism 110.
Referring to fig. 3, the storage mechanism 110 includes a first driving assembly 111, a storage rack 112; the first driving component 111 is installed on the machine platform 000, and the storage rack 112 is disposed at the driving end of the first driving component 111. In this embodiment, the first driving assembly 111 is a linear motor driving assembly, and the driving direction thereof is the Z axis, i.e. the first driving assembly can drive the material storage rack to move up and down. The material storage rack 112 is provided with a plurality of slots 1121 for placing workpieces, the plurality of slots 1121 are distributed in a vertical array, and the slots 1121 are provided with notches for inserting the workpieces.
With reference to fig. 3, the material taking mechanism 120 includes a second driving assembly 121, a fork disc assembly 122; the fork disc assembly 122 is arranged at the driving end of the second driving assembly 121, and the second driving assembly 121 can drive the fork disc assembly 122 to be inserted into or separated from the insertion slot 1121; in this embodiment, the second driving assembly 121 is a linear motor driving assembly, and the driving direction thereof is the X axis, i.e. the fork disc assembly 122 can be driven to move left and right.
The fork disc assembly 122 comprises a mounting plate 1221, a fork disc 1222, a first visual assembly 1223, the fork disc 1222 and the first visual assembly 1223 are all disposed on the mounting plate 1221, the first visual assembly 1223 is focused on the insertion slot 1121, and a negative pressure assembly is disposed on the fork disc 1222. In this embodiment, the first vision component 1223 is a CCD vision component.
The feeding device 100 is composed of a material storage mechanism 110 and a material taking mechanism 120, and in the working process of the feeding device 100: the second driving assembly 121 drives the working end (i.e. the fork) of the fork disc assembly 122 to be inserted into the slot 1121 of the material storage rack 112, and then the negative pressure assembly on the fork disc 1222 is activated to suck the workpiece; the second driving assembly 121 reversely drives, the fork 1222 takes out the workpiece slot 1121, the workpiece is located on the fork 1222, and the taking is completed. In the material taking process, the first vision component 1223 is opened in the whole process, so that the workpiece taking position can be accurately positioned, and the workpiece is prevented from being damaged; after each picking motion, the first driving assembly 111 can drive the storage rack 112 to move vertically, so that the next workpiece in the slot 1121 enters the working end of the picking mechanism 120.
Referring to fig. 4, the feeding device 200 includes a third driving assembly 210, a fourth driving assembly 220, and a suction cup mechanism 230. The fourth driving member passes through the mounting frame on the 000 end face of the machine platform, the fourth driving assembly 220 is disposed at the driving end of the third driving assembly 210, and the suction cup mechanism 230 is disposed at the driving end of the fourth driving assembly 220.
In this embodiment, the third driving assembly 210 and the fourth driving assembly 220 are linear motor driving assemblies. Wherein, the driving direction of the third driving assembly 210 is the connecting line between the feeding device 100 and the working platform device 300, i.e. the X-axis; the driving direction of the fourth driving assembly 220 is a vertical direction, i.e., a Z-axis.
In the feeding device 200, the third driving assembly 210 is responsible for transverse conveying, and the fourth driving assembly 220 is responsible for vertical approaching and departing, and during the working process: the fourth driving assembly 220 drives the suction cup mechanism 230 to move the workpiece from the vertical direction to the discharge end of the feeding device 100; the sucker mechanism 230 sucks the workpiece, and the fourth driving assembly 220 drives reversely; the third driving assembly 210 drives the suction cup mechanism 230 to approach the processing platform device from the transverse direction and stop above the tray body 311; the fourth driving assembly 220 drives the suction cup mechanism 230 to approach the tray body 311 from the vertical direction, and the suction cup mechanism 230 releases the workpiece on the tray body 311.
Referring to fig. 4, the feeding device 200 further includes a second vision element 240 and a first rotation driving element 250, the suction cup mechanism 230 is disposed at the driving end of the fourth driving element 220 through the first rotation driving element 250, the second vision element 240 is disposed below the suction cup mechanism 230, and the second vision element 240 focuses on the suction cup mechanism 230. The second vision assembly 240 can initially position the workpiece, and after the workpiece is detected by the second vision assembly 240, the first rotation driving assembly 250 drives the workpiece to be aligned. In this embodiment, the first visual component 1223 is a CCD visual component.
Referring to fig. 5-7, the work platform apparatus 300 includes a fifth driving assembly 320, a first sliding plate 330, a sixth driving assembly 340, a second sliding plate 350, and a second rotary driving assembly 360. The first sliding plate 330 is disposed at the driving end of the fifth driving assembly 320, the sixth driving assembly 340 is disposed on the first sliding plate 330, the second sliding plate 350 is disposed at the driving end of the sixth driving assembly 340, the second rotating driving assembly 360 is disposed on the second sliding plate 350, and the carrier disk assembly 310 is disposed at the driving end of the second rotating driving assembly 360. The fifth driving assembly 320, the sixth driving assembly 340 and the second rotary driving assembly 360 are provided with a space-avoiding portion 301 for the second CCD device 600 to focus on.
In this embodiment, the fifth driving assembly 320 and the sixth driving assembly 340 are vertically distributed, and both the fifth driving assembly 320 and the sixth driving assembly 340 are driven horizontally. The fifth driving assembly 320 and the sixth driving assembly 340 are linear motor driving assemblies. Wherein, the driving direction of the fifth driving assembly 320 is a transverse direction, i.e. an X-axis; the driving direction of the fifth driving assembly 320 is the longitudinal direction, i.e., the Y-axis. The second rotation driving assembly 360 is a hollow motor rotation platform with a hollow space-avoiding portion 301.
In the work platform apparatus 300, the tray 311 can move in a plane by the fifth driving unit 320 and the sixth driving unit 340; further, the clearance 301 enables the second CCD device 600 to capture an image of the lower surface of the workpiece.
Referring to fig. 5, the laser apparatus 400 includes a laser 410, a first optical path assembly 420, a seventh driving assembly 460, a second optical path assembly 440, a two-dimensional galvanometer scanning device 450, and a telescopic optical path assembly 430. The seventh driving assembly 460 is disposed on the machine platform 000, in this embodiment, the fifth driving assembly 320 is a linear motor driving assembly, and the driving direction thereof is a vertical direction, i.e. a Z axis. The laser 410 is arranged on the machine platform 000, the first light path component 420 is arranged at the exit end of the laser 410, the second light path component 440 is arranged at the driving end of the seventh driving component 460, the two-dimensional galvanometer scanning device 450 is arranged at the exit end of the second light path component 440, and the exit end of the two-dimensional galvanometer scanning device 450 is provided with a telecentric field lens 480; the first optical path component 420 and the second optical path component 440 are connected by a telescopic optical path component 430, and the telescopic optical path component 430 is a three-section telescopic optical path component 430. The optical path of the laser device 400 is: the laser 410, the first optical path component 420, the telescopic optical path component 430, the second optical path component 440, the two-dimensional galvanometer scanning device 450 and the telecentric field lens 480.
In the laser device 400, the seventh driving assembly 460 can drive the two-dimensional galvanometer scanning device 450 to move up and down, so as to adjust the distance between the two-dimensional galvanometer scanning device and the workpiece; the first optical path component 420 and the second optical path component 440 are connected by the telescopic optical path component 430, and the lifting is not affected.
The laser device 400 further comprises a dust collection assembly 470, the dust collection assembly 470 comprises a dust collection cover 471, and the dust collection cover 471 is arranged right below the working end of the laser device 400. During operation, the operation platform device 300 is driven to make the disc body 311 located under the dust hood 471 and connected with the dust hood 471, and in the laser engraving process, the dust collector sucks away dust on the workpiece.
With reference to fig. 6-7, the first CCD device 500 includes a first light source 510 and a first camera 520, the first light source 510 and the first camera 520 are disposed at the driving end of the seventh driving component 460 and located at one side of the two-dimensional galvanometer scanning device 450, and the first camera 520 is located above the first light source 510. The first CCD device 500 is composed of the above-described structure.
With reference to fig. 6-7, the second CCD device 600 includes a second light source 610 and a second camera 620, the second light source 610 and the second camera 620 are located below the work platform device 300, and the second camera 620 is located below the second light source 610; the first camera 520 and the second camera 620 are distributed off-axis. The second CCD device 600 is composed of the above-described structure.
Referring to fig. 8, the stacking device 800 is located at one side of the feeding device 100, the discharging device 700 is located between the stacking device 800 and the work platform device 300, and the discharging device 700 is configured to input the workpiece into the stacking device 800. After the workpieces are processed, the discharging device 700 inputs the workpieces into the stacking device 800 for stacking and storage. The stacking device 800 has the same structure as the feeding device 100, and the discharging device 700 has the same structure as the feeding device 200.
With reference to fig. 1 and 8, the full-automatic wafer ultraviolet laser grooving apparatus further includes a waste disposal device 900, the waste disposal device 900 is disposed below the discharging device 700, the waste disposal device 900 includes a waste tray 910 and an eighth driving assembly 920, and the waste tray 910 is disposed at a driving end of the eighth driving assembly 920. After some workpieces fail to be machined, the outfeed device 700 feeds the workpieces into a scrap tray 910.
Referring to fig. 1 and 8, the full-automatic wafer ultraviolet laser grooving apparatus further includes a brush cleaning device 1000, the brush cleaning device 1000 is disposed between the discharging device 700 and the work platform device 300, and the brush cleaning device 1000 includes a ninth driving assembly 1010 and a brush bar 1020. The brush bar 1020 is arranged at the driving end of the ninth driving assembly 1010, the ninth driving assembly 1010 is an air cylinder, and the brush bar 1020 can be driven to move up and down by the ninth driving assembly 1010. After the workpiece is processed; the work platform device 300 drives the disc 311 to the brush cleaning device 1000 for cleaning, and after cleaning, the discharging device 700 inputs the workpiece into the stacking device 800.
The specific work engineering of the equipment is as follows:
s1, feeding: the feeding device 100 is responsible for providing workpieces, and a plurality of workpieces are placed on a storage rack 112 of the storage mechanism 110; the material taking mechanism 120 is responsible for taking out the workpieces of the storage rack 112;
the second driving assembly 121 drives the working end of the fork disk assembly 122 (i.e. the fork disk 1222) to be inserted into the slot 1121 of the storage rack 112, and then the negative pressure assembly on the fork disk 1222 is activated to suck the workpiece,
the second driving assembly 121 reversely drives, the fork 1222 takes out the workpiece slot 1121, the workpiece is located on the fork 1222, and the taking is completed.
( In the material taking process, the first vision component 1223 is opened in the whole process, so that the position of taking a workpiece can be accurately positioned, and the workpiece is prevented from being damaged; after each picking operation is completed, the first driving assembly 111 can drive the storage rack 112 to move vertically, so that the next workpiece in the slot 1121 enters the working end of the picking mechanism 120 )
S2, feeding: the fourth driving assembly 220 drives the suction cup mechanism 230 to move the workpiece from the vertical direction to the discharge end of the feeding device 100; the sucker mechanism 230 sucks the workpiece, and the fourth driving assembly 220 drives reversely;
the third driving component 210 drives the suction cup mechanism 230 to approach the processing platform device from the transverse direction, the second vision component 240 is arranged below the suction cup mechanism 230, the second vision component 240 focuses on the suction cup mechanism 230, and after the detection of the second vision component 240, the first rotation driving component 250 drives the workpiece to be aligned;
the third driving assembly 210 drives the chuck mechanism 230 to move continuously and stop above the plate 311;
the fourth driving assembly 220 drives the suction cup mechanism 230 to approach the tray body 311 from the vertical direction, and the suction cup mechanism 230 releases the workpiece on the tray body 311.
S3, CCD positioning: in the working platform device 300, the fifth driving component 320 and the sixth driving component 340 jointly drive the disc 311 to enter between the first CCD device 500 and the second CCD device 600 for fine positioning;
the first CCD device 500 visually positions the upper surface of the workpiece; the second CCD device 600 performs visual alignment from the lower surface of the workpiece.
S4, engraving: in the work platform device 300, the fifth driving assembly 320 and the sixth driving assembly 340 jointly drive the disc 311 to enter the dust-proof device; the laser device 400 is started to engrave the wafer on the disc 311; with reference to fig. 9, the engraving precision can be improved by the scanning engraving of the two-dimensional galvanometer scanning device 450.
S5, cleaning: the fifth driving assembly 320 and the sixth driving assembly 340 jointly drive the disc body 311 to enter the working end of the brush cleaning device 1000, and the fifth driving assembly 320 and the sixth driving assembly 340 drive the disc body 311 to move and cooperate with a brush, so that dust on a workpiece is brushed away.
S6, discharging: the outfeed device 700 feeds workpieces into the palletizer 800 (bad workpieces are fed into the reject device 900).
S7, stacking: the palletizing device 800 palletizes and stores workpieces.
In the equipment, marking on the surface of a chip is carried out at a marking speed of 2000-8000mm/s according to different exposure requirements, so that a UV glue-dissolving effect is realized, and the equipment has the advantages that a marking image is generated and read by a CAD (computer-aided design), can be used for unlimited times and does not need a mask; beat the mark back second face and beat the mark position according to first face and fix a position, two-sided alignment accuracy 20um.
In addition, in the device, the grooved track movement is taken charge of by the moving platform, the platform precision is high, the scanning is carried out in the center, the laser is vertically injected into the groove, and no inclination angle is generated; moreover, the device adopts the mode to perform slotting, and has high speed and small heat influence.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (10)
1. The full-automatic wafer ultraviolet laser grooving equipment is characterized by comprising a machine table (000) and a groove arranged on the machine table (000)
A supply device (100) configured to supply a workpiece;
the work platform device (300) comprises a disc carrying component (310) capable of driving to move, wherein the disc carrying component (310) is provided with a transparent disc body (311);
the feeding device (200) is positioned between the feeding device (100) and the operation platform device (300) and is configured and positioned in the disc body (311) for inputting workpieces;
a laser device (400) positioned above the work platform device (300) and configured to perform laser engraving with the workpiece;
a first CCD device (500) positioned above the work platform device (300) and configured to visually position the upper surface of the workpiece;
and a second CCD device (600) which is positioned below the work platform device (300) and is configured to perform visual positioning from the lower surface of the workpiece.
2. The full-automatic wafer ultraviolet laser grooving equipment according to claim 1, wherein the feeding device (100) comprises a material storing mechanism (110) and a material taking mechanism (120), the material taking mechanism (120) is arranged on one side of the material storing mechanism (110), and a plurality of workpieces are placed on the material storing mechanism (110);
the storage mechanism (110) comprises a first driving assembly (111) and a storage rack (112); the storage rack (112) is arranged at the driving end of the first driving component (111), a plurality of slots (1121) for placing workpieces are formed in the storage rack (112), the slots (1121) are distributed in a vertical array mode, and the first driving component (111) can drive the storage rack (112) to move up and down;
the material taking mechanism (120) comprises a second driving assembly (121) and a fork disc assembly (122); the fork disc assembly (122) is arranged at the driving end of the second driving assembly (121), and the second driving assembly (121) can drive the fork disc assembly (122) to be inserted into or far away from the insertion slot (1121);
the fork disc assembly (122) comprises a mounting plate (1221), a fork disc (1222) and a first visual assembly (1223), the fork disc (1222) and the first visual assembly (1223) are arranged on the mounting plate (1221), and the first visual assembly (1223) is focused on the insertion slot (1121).
3. The full-automatic wafer ultraviolet laser grooving equipment according to claim 1, wherein the feeding device (200) comprises a third driving assembly (210), a fourth driving assembly (220) and a sucker mechanism (230), the fourth driving assembly (220) is arranged at the driving end of the third driving assembly (210), and the sucker mechanism (230) is arranged at the driving end of the fourth driving assembly (220);
the driving direction of the third driving assembly (210) is a connecting line between the feeding device (100) and the working platform device (300), and the driving direction of the fourth driving assembly (220) is a vertical direction.
4. The full-automatic wafer ultraviolet laser grooving apparatus according to claim 3, wherein the feeding device (200) further comprises a second vision component (240) and a first rotation driving component (250), the chuck mechanism (230) is disposed at a driving end of the fourth driving component (220) through the first rotation driving component (250), the second vision component (240) is disposed below the chuck mechanism (230), and the second vision component (240) is focused on the chuck mechanism (230).
5. The fully automatic wafer uv laser grooving apparatus of claim 1, wherein the work platform device (300) comprises a fifth drive assembly (320), a first sliding plate (330), a sixth drive assembly (340), a second sliding plate (350), a second rotary drive assembly (360);
the first sliding plate (330) is arranged at the driving end of the fifth driving component (320), the sixth driving component (340) is arranged on the first sliding plate (330), the second sliding plate (350) is arranged at the driving end of the sixth driving component (340), the second rotary driving component (360) is arranged on the second sliding plate (350), and the carrying disc component (310) is arranged at the driving end of the second rotary driving component (360);
the fifth driving component (320), the sixth driving component (340) and the second rotary driving component (360) are provided with a space avoidance part (301) for the second CCD device (600) to focus,
the fifth driving assembly (320) and the sixth driving assembly (340) are vertically distributed, and the fifth driving assembly (320) and the sixth driving assembly (340) are driven horizontally.
6. The full-automatic wafer ultraviolet laser grooving apparatus according to claim 1, wherein the laser device (400) comprises a laser (410), a first optical path component (420), a seventh driving component (460), a second optical path component (440), a two-dimensional galvanometer scanning device (450), and a telescopic optical path component (430),
the first light path component (420) is arranged at the emergent end of the laser (410), the second light path component (440) is arranged at the driving end of the seventh driving component (460), the two-dimensional galvanometer scanning device (450) is arranged at the emergent end of the second light path component (440), and the emergent end of the two-dimensional galvanometer scanning device (450) is provided with a telecentric field lens (480); the first optical path component (420) and the second optical path component (440) are connected through the telescopic optical path component (430).
7. The full-automatic wafer ultraviolet laser grooving equipment according to claim 6, wherein the first CCD device (500) comprises a first light source (510) and a first camera (520), the first light source (510) and the first camera (520) are arranged at a driving end of the seventh driving assembly (460) and are positioned on one side of the two-dimensional galvanometer scanning device (450), and the first camera (520) is positioned above the first light source (510).
8. The fully automatic wafer UV laser grooving apparatus according to claim 7, wherein the second CCD device (600) comprises a second light source (610) and a second camera (620), the second light source (610) and the second camera (620) are located below the work platform device (300), and the second camera (620) is located below the second light source (610).
9. The full-automatic wafer ultraviolet laser grooving equipment according to any one of claims 1 to 8, further comprising a discharging device (700) and a stacking device (800), wherein the discharging device (700) and the stacking device (800) are both arranged on the machine platform (000);
the stacking device (800) is located on one side of the feeding device (100), the discharging device (700) is located between the stacking device (800) and the working platform device (300), and the discharging device (700) is configured and located to input workpieces into the stacking device (800).
10. The full-automatic wafer ultraviolet laser grooving equipment according to claim 9, further comprising a waste throwing device (900), wherein the waste throwing device (900) is arranged below the discharging device (700), the waste throwing device (900) comprises a waste tray (910) and an eighth driving assembly (920), and the waste tray (910) is arranged at a driving end of the eighth driving assembly (920).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211467781.6A CN115945798A (en) | 2022-11-22 | 2022-11-22 | Full-automatic wafer ultraviolet laser slotting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211467781.6A CN115945798A (en) | 2022-11-22 | 2022-11-22 | Full-automatic wafer ultraviolet laser slotting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115945798A true CN115945798A (en) | 2023-04-11 |
Family
ID=87281391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211467781.6A Pending CN115945798A (en) | 2022-11-22 | 2022-11-22 | Full-automatic wafer ultraviolet laser slotting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115945798A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188583A (en) * | 2017-11-20 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | Laser processing device |
| WO2020082506A1 (en) * | 2018-10-26 | 2020-04-30 | 苏州富强科技有限公司 | Workpiece feeding device and workpiece feeding method |
| KR20200114225A (en) * | 2019-03-28 | 2020-10-07 | 한미반도체 주식회사 | Laser Transfering System Of Micro Element and Transfering Method |
| CN212695168U (en) * | 2020-09-11 | 2021-03-12 | 刘雷 | Sapphire substrate laser lift-off equipment |
| CN112548353A (en) * | 2020-12-09 | 2021-03-26 | 厦门柔性电子研究院有限公司 | Double-station laser coding equipment and operation method thereof |
| CN215432049U (en) * | 2021-07-29 | 2022-01-07 | 无锡奥特维科技股份有限公司 | Sheet body slotting device and slotting equipment |
-
2022
- 2022-11-22 CN CN202211467781.6A patent/CN115945798A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108188583A (en) * | 2017-11-20 | 2018-06-22 | 大族激光科技产业集团股份有限公司 | Laser processing device |
| WO2020082506A1 (en) * | 2018-10-26 | 2020-04-30 | 苏州富强科技有限公司 | Workpiece feeding device and workpiece feeding method |
| KR20200114225A (en) * | 2019-03-28 | 2020-10-07 | 한미반도체 주식회사 | Laser Transfering System Of Micro Element and Transfering Method |
| CN212695168U (en) * | 2020-09-11 | 2021-03-12 | 刘雷 | Sapphire substrate laser lift-off equipment |
| CN112548353A (en) * | 2020-12-09 | 2021-03-26 | 厦门柔性电子研究院有限公司 | Double-station laser coding equipment and operation method thereof |
| CN215432049U (en) * | 2021-07-29 | 2022-01-07 | 无锡奥特维科技股份有限公司 | Sheet body slotting device and slotting equipment |
Non-Patent Citations (1)
| Title |
|---|
| 叶建斌等: "激光切割技术", 31 July 2012, 上海科学技术出版社, pages: 104 - 105 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110394556B (en) | Full-automatic laser marking machine for double-station substrate | |
| TWI501301B (en) | Processing device (2) | |
| CN106956370B (en) | Conveying mechanism of processing device | |
| CN105935835B (en) | Sheet processing system and method for processing sheet material | |
| WO2003015489A2 (en) | Apparatus and method for mounting electronic parts | |
| TWI392004B (en) | Cutting device | |
| JP4648056B2 (en) | Wafer laser processing method and laser processing apparatus | |
| CN112295946A (en) | Automatic chip sorting system | |
| CN114769887A (en) | Full-automatic laser marking machine for circuit board | |
| CN207914781U (en) | A kind of glass plate laser marker | |
| CN114964989B (en) | Device with dust removal function, method thereof and optical lens detection system | |
| CN216631664U (en) | Detection device | |
| CN115945798A (en) | Full-automatic wafer ultraviolet laser slotting equipment | |
| JP2010056442A (en) | Component-mounting device | |
| CN219216766U (en) | Wafer feeding and discharging module | |
| CN116618832B (en) | Automatic welding, detecting, cleaning and rust-proof integrated production line for rotor and stator | |
| CN219881558U (en) | Automatic welding and rust-proof integrated production line for rotor and stator | |
| CN217412820U (en) | Full-automatic laser marking machine for circuit board | |
| JP3502417B2 (en) | Electronic component mounting device | |
| CN117226280A (en) | Full-automatic laser marking equipment | |
| KR100554444B1 (en) | Intray laser marking system | |
| CN217405387U (en) | Efficient full-automatic chip transport turnover equipment | |
| CN217120905U (en) | Chip module releasing, sorting and packaging integrated device | |
| CN212665202U (en) | Double-station laser marking system | |
| CN219561800U (en) | Wafer galvanometer laser scanning module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |