CN115831632A - Capacitor diaphragm and manufacturing method thereof - Google Patents
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- CN115831632A CN115831632A CN202211633926.5A CN202211633926A CN115831632A CN 115831632 A CN115831632 A CN 115831632A CN 202211633926 A CN202211633926 A CN 202211633926A CN 115831632 A CN115831632 A CN 115831632A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 239000003990 capacitor Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 51
- 238000005553 drilling Methods 0.000 claims abstract description 25
- 238000007639 printing Methods 0.000 claims abstract description 24
- 238000004080 punching Methods 0.000 claims abstract description 20
- 238000012216 screening Methods 0.000 claims abstract description 8
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 21
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Abstract
The application relates to the field of manufacturing of capacitor diaphragms, and discloses a capacitor diaphragm and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: manufacturing a first conductive layer on the first surface of the base film; perforating the second surface of the base film by using a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conducting layer; and (3) silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm. According to the method, the first conducting layer is formed on the first surface of the base film, then the second surface is perforated by laser, and the laser drilling cost is low. When punching is carried out, the base film is punched, but the first conducting layer is not punched, then conducting slurry is printed on the second surface in a silk-screen mode, the hole is filled, filter paper is not needed, cost is saved, and slurry is prevented from overflowing from the hole; the holes can be completely filled by printing on two surfaces once, so that the cost of the slurry can be saved, dents on the surfaces can be avoided, and the conduction stability can be ensured.
Description
Technical Field
The application relates to the field of capacitor diaphragm manufacturing, in particular to a capacitor diaphragm and a manufacturing method thereof.
Background
In order to integrate more functions in a limited area or enhance EMC (electromagnetic compatibility) and ESD (electro-static discharge) resistance of the capacitive diaphragm, conductive films are processed on both surfaces of the capacitive diaphragm, and the lines between the two surfaces are conducted with each other.
At present, when a capacitor diaphragm is manufactured, the manufacturing process is roughly as follows: drilling a through hole on the base film in a CNC (Computerized Numerical Control) mode; printing silver paste twice on the first surface of the base film, and drying after each printing; and printing silver paste on the second surface of the base film and drying, wherein the silver paste is filled in the through hole of the base film. The manufacturing process has the following disadvantages: firstly, the base film is generally made of PET (polyethylene terephthalate), friction between a CNC drill bit rotating at a high speed and the base film can generate a large amount of heat, so that the base film is melted and blocks through holes, the integrity of the through holes is ensured, the diameter of the CNC drill bit is generally more than or equal to 0.2mm, slurry easily flows onto a printing base through the through holes when the slurry is printed by the through holes with the diameter of more than 0.2mm, the investment and operation maintenance cost of CNC drilling equipment are high, and the occupied area is large; secondly, when printing silver paste on the first surface, in order to prevent the silver paste from flowing to a printing platform along the through hole to pollute the table top of the printing machine and a drying tunnel during baking, a layer of industrial filter paper is arranged below each base film to rotate together, so that the working hours and the auxiliary material cost are increased; thirdly, slurry falling on the filter paper during printing is easy to pollute products and cause product scrapping, and scraps falling on the filter paper are also easy to pollute the printing environment; fourthly, since a considerable part of the slurry falls onto the filter paper through the through holes every time the silver paste is printed, only a small part of the slurry is hung on the hole wall, and the through holes are easily filled, at least three times of repeated printing and drying are usually needed to effectively fill the through holes to achieve a conduction effect, and the material and the working hours are multiplied; fifthly, as the through holes are easy to be insufficiently filled, the surface of the capacitor diaphragm is generally provided with dents, and the manufactured capacitor diaphragm cannot ensure good conduction performance.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a capacitor diaphragm and a manufacturing method thereof, so that the manufacturing cost of the capacitor diaphragm is reduced, and the conduction stability is improved.
In order to solve the above technical problem, the present application provides a method for manufacturing a capacitive diaphragm, including:
manufacturing a first conductive layer on the first surface of the base film;
perforating the second surface of the base film by using a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conductive layer;
and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
Optionally, the perforating the second surface of the base film by using a laser perforation method includes:
and punching the second surface of the base film by using a laser punching mode, and outputting waste gas generated in punching by using waste gas exhaust equipment.
Optionally, the perforating the second surface of the base film by using a laser perforation method includes:
and perforating the second surface of the base film by using infrared laser.
Optionally, the power range of the infrared laser is 10-12W, and the speed range of the infrared laser is 1000-1300 mm/s.
Optionally, before the perforating on the second surface of the base film by using the laser drilling method, the method further includes:
flatly adsorbing the base film with the first conducting layer on a vacuum adsorption base, wherein the first conducting layer is in contact with the vacuum adsorption base.
Optionally, before the first conductive layer is formed on the first surface of the base film, the method further includes:
and pre-shrinking and baking the base film.
Optionally, after the step of screen-printing conductive paste on the second surface of the base film, filling the holes, and baking, forming a second conductive layer on the second surface, the method further includes:
and printing protective gloss oil on one side of the first surface and one side of the second surface of the base film, and drying to form a protective layer.
Optionally, after the step of screen-printing conductive paste on the second surface of the base film, filling the holes, and baking, forming a second conductive layer on the second surface, the method further includes:
and detecting the filling effect of the conductive paste in the holes, and removing the capacitor diaphragm with the filling effect lower than the preset requirement.
Optionally, detecting a filling effect of the conductive paste in the hole, and removing the capacitor diaphragm with the filling effect lower than a preset requirement includes:
measuring the resistance of the capacitive diaphragm;
judging whether the resistance is smaller than a preset resistance threshold value or not;
and if the resistance is smaller than the preset resistance threshold value, rejecting the capacitor diaphragm.
The application also provides a capacitor diaphragm, which is manufactured by adopting any one of the capacitor diaphragm manufacturing methods.
The application provides a method for manufacturing a capacitor diaphragm, which comprises the following steps: manufacturing a first conductive layer on the first surface of the base film; perforating the second surface of the base film by using a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conductive layer; and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
It can be seen that this application forms first conducting layer at the first surface of base film earlier, then utilizes laser to punch at the second surface, and laser drilling's equipment cost is far less than CNC drilling equipment, and laser drilling equipment processing flexibility is high, can once only process the hole of different diameters and degree of depth, need not consumptive materials such as drill bit, and equipment maintenance cost is also lower. When punching is carried out, the base film is punched, but the first conducting layer is not punched, namely, the hole is a half-cut hole and is not a complete through hole, so that when conducting slurry is printed on the second surface in a silk-screen mode, on one hand, filter paper is not needed, the material consumption cost and the turnover cost are saved, and meanwhile, product pollution and environmental pollution caused by slurry residues on the filter paper and fragments of the filter paper can be avoided, the yield is improved, and the cleanliness of a printing environment is protected; on the other hand, the paste is prevented from overflowing from the hole, the paste printed each time can be completely stored in the hole, the first surface and the second surface can be completely filled with the paste by printing once, and the cost of the paste and the cost of working hours can be saved. In addition, the manufacturing method can completely fill the hole, no virtual filling is performed inside the hole, no dent is formed on the surface of the hole, and the conduction stability is ensured.
In addition, the application also provides a capacitance diaphragm with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a flow chart of a process for manufacturing a capacitor diaphragm according to the prior art;
fig. 2 is a flowchart of a method for manufacturing a capacitive diaphragm according to an embodiment of the present disclosure;
fig. 3 to 7 are flow charts of a process for manufacturing a capacitor diaphragm according to an embodiment of the present disclosure;
FIG. 8 is a flow chart of another method for fabricating a capacitive diaphragm according to an embodiment of the present disclosure;
fig. 9 is a schematic view of a base film provided in the embodiment of the present application, which is attached to a vacuum adsorption base and is drilled by laser;
FIG. 10 is a flow chart of another method for fabricating a capacitive diaphragm according to an embodiment of the present disclosure;
FIG. 11 is a partial cross-sectional view of a capacitive diaphragm provided in accordance with an embodiment of the present application;
fig. 12 is a schematic structural diagram of a capacitive diaphragm according to an embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
At present, a process flow chart of manufacturing a capacitor diaphragm is shown in fig. 1, a through hole 2 is drilled on a base film 1 by using a CNC drilling technology, silver paste 3 is printed on two surfaces for multiple times and is dried, and filter paper 4 is padded below the base film when the silver paste is printed. As described in the background section, the following drawbacks exist with this fabrication process: firstly, a CNC drilling process is used for drilling, so that the aperture is large, the manufacturing cost is high, and the occupied area is large; secondly, in order to prevent the silver paste from flowing to the printing platform along the through hole, a layer of filter paper needs to be arranged, and the working hours and the auxiliary material cost are increased; thirdly, slurry falling on the filter paper during printing easily pollutes products to cause product scrapping, and scraps falling on the filter paper also easily pollute the printing environment; fourthly, hole filling needs to be printed for many times, so that the material and the working hours are multiplied; fifth, the manufactured capacitive diaphragm cannot ensure good conduction performance.
In view of the above, the present application provides a method for manufacturing a capacitive diaphragm, please refer to fig. 2, the method includes:
step S101: and manufacturing a first conductive layer on the first surface of the base film.
The base film may be a PET film.
Referring to fig. 3 and 4, the first surface and the second surface of the base film 1 are two opposite surfaces, one is an upper surface, and the other is a lower surface. The process of making the first conductive layer 6 includes: and (3) placing the base film 1 on a silk-screen base 5 with the first surface facing upwards, silk-screen printing conductive slurry on the first surface of the base film 1 and drying to form a first conductive layer 6. The first conductive layer 6 can be a silver layer, the thickness of the first conductive layer 6 can be 8-10 μm, the mesh number of the screen printing plate can be 280-300 meshes during silk printing, and the thickness of the latex can be 10-14 μm.
Step S102: and perforating the second surface of the base film by utilizing a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conducting layer.
Referring to fig. 5, a half-cut hole 2 is formed in a base film 1.
As an embodiment, the perforating the second surface of the base film by using the laser drilling method includes: and perforating the second surface of the base film by using infrared laser. The wavelength of the infrared laser can be 1064nm, the power range of the infrared laser is 10-12W, and the speed range of the infrared laser is 1000-1300 mm/s. However, the present application does not limit the present application, and as another possible embodiment, the perforating the second surface of the base film by using a laser drilling method includes: and perforating the second surface of the base film by using ultraviolet laser.
The laser power and speed parameters are adjusted according to the thickness of the base film when the thickness of the base film is 0.075mm or 0.125mm, for a common base film with a thickness of 0.1 mm.
Preferably, in order to reduce the manufacturing cost, the punching is performed by using an infrared laser.
Optionally, in order to check whether laser drilling meets requirements, dino can be used for performing spot inspection after drilling, and when the hole does not reach the silver layer, the bottom of the hole is dark, so that the silver layer cannot be seen clearly; when the hole has reached the silver layer the light at the bottom of the hole is bright and the silver layer can be seen clearly.
Step S103: and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
Referring to fig. 6 and 7, the second surface of the base film 1 is screen-printed with conductive paste, which can be well poured into the hole 2 without overflowing.
It should be noted that the capacitive diaphragm further includes a terminal, a touch electrode and a silver wire, and the manufacturing process of the terminal, the touch electrode and the silver wire can refer to the related art, which is not described in detail in this application.
It is emphasized that the laser drilling method is applied to the circuit board manufacturing, however, the circuit board and the capacitive diaphragm are two different fields, the circuit board plays a role in conducting, and the capacitive diaphragm can be regarded as a sensor; in addition, in the process of laser drilling, the substrate of the whole circuit board is drilled firstly, the substrate of the circuit board is drilled through, and then the inner wall of the through hole is coated with a film, so that a silk-screen printing mode cannot be adopted.
This application is first at the first surface formation first conducting layer of base film, then utilizes laser to punch on the second surface, and laser drilling's equipment cost is far less than CNC drilling equipment, and laser drilling equipment processing flexibility is high, can once only process the hole of different diameters and degree of depth, need not consumptive materials such as drill bit, and equipment maintenance cost is also lower. When punching is carried out, the base film is punched, but the first conducting layer is not punched, namely, the hole is a half-cut hole and is not a complete through hole, so that when conducting slurry is printed on the second surface in a silk-screen mode, on one hand, filter paper is not needed, the material consumption cost and the turnover cost are saved, and meanwhile, product pollution and environmental pollution caused by slurry residues on the filter paper and fragments of the filter paper can be avoided, the yield is improved, and the cleanliness of a printing environment is protected; on the other hand, the paste is prevented from overflowing from the hole, the paste printed each time can be completely stored in the hole, the first surface and the second surface can be completely filled with the paste by printing once, and the cost of the paste and the cost of working hours can be saved. In addition, the manufacturing method can completely fill the hole, no virtual filling is performed inside the hole, no dent is formed on the surface of the hole, and the conduction stability is ensured.
On the basis of the foregoing embodiment, in an embodiment of the present application, before the perforating is performed on the second surface of the base film by using a laser drilling method, the method further includes:
flatly adsorbing the base film with the first conducting layer on a vacuum adsorption base, wherein the first conducting layer is in contact with the vacuum adsorption base.
Utilize the vacuum adsorption base to fix the base film that has first conducting layer in this embodiment, when avoiding follow-up laser beam drilling, the base film position takes place the skew, influences the precision of the position of punching.
On the basis of any of the above embodiments, in an embodiment of the present application, referring to fig. 8, a method for manufacturing a capacitive diaphragm includes:
step S201: and manufacturing a first conductive layer on the first surface of the base film.
Step S202: flatly adsorbing the base film with the first conducting layer on a vacuum adsorption base, wherein the first conducting layer is in contact with the vacuum adsorption base.
Step S203: and punching the second surface of the base film by using a laser punching mode, and outputting waste gas generated in punching by using waste gas exhaust equipment.
Wherein the depth of the hole is greater than or equal to the thickness of the base film and less than the sum of the thicknesses of the base film and the first conductive layer.
Referring to fig. 9, the base film 1 with the first conductive layer 6 is adsorbed on the vacuum adsorption base 10, the laser head 8 of the laser device is positioned above the second surface of the base film 1 for punching, and the waste gas generated during punching is discharged in time through the exhaust pipe 9 of the exhaust device, so as to avoid polluting the manufacturing environment.
Step S204: and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
On the basis of any of the above embodiments, in an embodiment of the present application, before the fabricating the first conductive layer on the first surface of the base film, the method further includes:
and pre-shrinking and baking the base film to avoid shrinkage of the base film when baking is carried out after the conductive paste is printed.
The temperature during pre-shrinking baking can be 120 ℃, and the time is 60 minutes.
On the basis of any of the above embodiments, in an embodiment of the present application, referring to fig. 10, a method for manufacturing a capacitive diaphragm includes:
step S301: and manufacturing a first conductive layer on the first surface of the base film.
Step S302: and perforating the second surface of the base film by utilizing a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conducting layer.
Step S303: and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
Step S304: and printing protective gloss oil on one side of the first surface and one side of the second surface of the base film, and drying to form a protective layer.
Referring to fig. 11, a protection layer 11 is formed on both the first surface side and the second surface side of the base film 1 to protect the first conductive layer 6 and the second conductive layer 7 from oxidation.
On the basis of any of the foregoing embodiments, in an embodiment of the present application, after the screen printing of the conductive paste on the second surface of the base film, filling the holes, and baking, the method further includes:
and detecting the filling effect of the conductive paste in the hole, and removing the capacitor diaphragm with the filling effect lower than the preset requirement.
The preset requirement is determined according to the detection mode.
Optionally, as an implementation manner, the detecting a filling effect of the conductive paste in the hole, and removing the capacitor diaphragm whose filling effect is lower than a preset requirement includes:
measuring the resistance of the capacitive diaphragm;
judging whether the resistance is smaller than a preset resistance threshold value or not;
and if the resistance is smaller than the preset resistance threshold value, rejecting the capacitor diaphragm.
The preset resistance threshold value is not limited in the application and can be set by self.
The resistance between the first and second surfaces was measured by placing the positive and negative electrodes of the multimeter, one in electrical contact with the first conductive layer and the other in electrical contact with the second conductive layer. The smaller the resistance of the capacitive diaphragm, the better the filling effect of the hole. The control tolerance of the resistance value is +/-10%.
Optionally, as another possible implementation manner, detecting a filling effect of the conductive paste in the hole, and removing the capacitor diaphragm whose filling effect is lower than a preset requirement includes:
and (4) sampling and detecting the saturation of the irrigation hole on a detection table by using a magnifying glass, and removing the capacitor diaphragm with the saturation lower than a preset saturation threshold value.
After the hole is filled, the capacitor diaphragm which does not meet the requirements is removed by detecting the filling effect of the conductive paste in the hole, and the quality of the capacitor diaphragm can be further improved.
The following describes the manufacturing method of the present application in a specific case.
step 3, placing the first surface of the base film downwards on a vacuum adsorption base, opening the vacuum adsorption to enable the base film to be flatly adsorbed on the base,
step 4, inputting punching data into the laser equipment, adjusting working parameters, checking the punching state by a microscope to ensure that the laser can burn through the base film without burning through the silver layer, and then locking the working parameters;
step 8, checking the filling effect of the holes;
and 9, printing protective gloss oil on the first surface and the second surface of the base film.
The method has the advantages that under the conditions of obviously reducing equipment investment, saving equipment floor area and reducing material consumption, the yield and quality of the hole filling are improved through the improvement of the punching method and the hole filling process, meanwhile, the whole process is simpler and more controllable, and the method can be applied to large-scale production.
The application further provides a capacitor diaphragm, and the capacitor diaphragm is manufactured by the capacitor diaphragm manufacturing method of any one of the embodiments.
Fig. 12 shows a schematic structural diagram of the capacitor diaphragm, which includes a terminal 12, a touch electrode 14, a silver wire 13, a base film, a first conductive layer, and a second conductive layer. The cross-sectional schematic view at the irrigation hole area a may be as shown in fig. 7 or fig. 11.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The capacitive diaphragm and the manufacturing method thereof provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A method for manufacturing a capacitor diaphragm is characterized by comprising the following steps:
manufacturing a first conductive layer on the first surface of the base film;
perforating the second surface of the base film by using a laser perforating mode, wherein the depth of the holes is greater than or equal to the thickness of the base film and is less than the sum of the thicknesses of the base film and the first conductive layer;
and silk-screening conductive paste on the second surface of the base film, filling the holes, baking, and forming a second conductive layer on the second surface to obtain the capacitor diaphragm.
2. The method of manufacturing a capacitive diaphragm of claim 1, wherein the step of perforating the second surface of the base film by laser drilling comprises:
and punching the second surface of the base film by using a laser punching mode, and outputting waste gas generated in punching by using waste gas exhaust equipment.
3. The method of claim 1, wherein the step of perforating the second surface of the base film by laser drilling comprises:
and perforating the second surface of the base film by using infrared laser.
4. The method for manufacturing a capacitor diaphragm according to claim 3, wherein the power range of the infrared laser is 10-12W, and the speed range of the infrared laser is 1000-1300 mm/s.
5. The method for manufacturing a capacitive diaphragm according to claim 1, wherein before the step of perforating the second surface of the base film by laser drilling, the method further comprises:
flatly adsorbing the base film with the first conducting layer on a vacuum adsorption base, wherein the first conducting layer is in contact with the vacuum adsorption base.
6. The method of manufacturing a capacitive diaphragm of claim 1, wherein prior to forming the first conductive layer on the first surface of the base film, further comprising:
and pre-shrinking and baking the base film.
7. The method for manufacturing a capacitive diaphragm according to claim 1, wherein a conductive paste is printed on the second surface of the base film by silk-screening, the holes are filled, baking is performed, and after a second conductive layer is formed on the second surface, the method further comprises:
and printing protective gloss oil on one side of the first surface and one side of the second surface of the base film, and drying to form a protective layer.
8. The method for manufacturing a capacitive diaphragm according to any one of claims 1 to 7, wherein a conductive paste is printed on the second surface of the base film, the holes are filled, baking is performed, and after a second conductive layer is formed on the second surface, the method further comprises:
and detecting the filling effect of the conductive paste in the hole, and removing the capacitor diaphragm with the filling effect lower than the preset requirement.
9. The method for manufacturing a capacitive diaphragm according to claim 8, wherein the step of detecting the filling effect of the conductive paste in the hole, and the step of removing the capacitive diaphragm whose filling effect is lower than a preset requirement comprises the steps of:
measuring the resistance of the capacitive diaphragm;
judging whether the resistance is smaller than a preset resistance threshold value or not;
and if the resistance is smaller than the preset resistance threshold value, rejecting the capacitor diaphragm.
10. A capacitive diaphragm produced by the method of any one of claims 1 to 9.
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| CN202211633926.5A CN115831632A (en) | 2022-12-19 | 2022-12-19 | Capacitor diaphragm and manufacturing method thereof |
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| CN202211633926.5A CN115831632A (en) | 2022-12-19 | 2022-12-19 | Capacitor diaphragm and manufacturing method thereof |
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| CN107079590A (en) * | 2014-10-24 | 2017-08-18 | 住友电工印刷电路株式会社 | Flexible printed circuit board and the method for manufacturing flexible printed circuit board |
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2022
- 2022-12-19 CN CN202211633926.5A patent/CN115831632A/en active Pending
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|---|---|---|---|---|
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