CN115793801A - Electronic device - Google Patents

Abstract

The application provides an electronic device, and relates to the technical field of electronic products. The electronic equipment comprises a mainboard, a power supply circuit board and a plurality of functional modules; the power supply circuit board comprises a power supply module and a functional interface, and the power supply module is inserted on the power supply circuit board; the power supply module is electrically connected with the mainboard and the functional interface respectively; part of the functional modules are electrically connected with the power supply module, and the rest functional modules are electrically connected with the mainboard. This application is on the basis that possesses the mainboard, additionally sets up the power supply circuit board again, and power module inserts and establishes on power supply circuit board, and so the mainboard is got in power supply circuit board, and functional module gets in power supply circuit board or mainboard, and in the correlation technique, whole functional module get compare in the technical scheme of mainboard, can reduce the preparation degree of difficulty of mainboard, and then reduce the preparation cost of mainboard to and reduce the requirement to the current capacity of mainboard.

Description

Electronic device

Technical Field

The embodiment of the application relates to the technical field of electronic products, in particular to an electronic device.

Background

With the progress of electronic technology, electronic devices develop toward diversification, intellectualization and flexibility, and more integrated functions are provided, where, for example, a server is taken as an example in the electronic devices, the server generally includes a motherboard and a Power Supply Unit (PSU), and the Power Supply module is disposed on the motherboard and used for supplying Power to the function module, so as to ensure the normal operation of the function module.

However, the above structure has a high requirement on the through-current capacity of the motherboard, and the performance of the motherboard is reduced.

Disclosure of Invention

In view of the foregoing problems, embodiments of the present application provide an electronic device, which can improve the current capacity of a motherboard and reduce the manufacturing cost of the motherboard.

In order to achieve the above object, the embodiments of the present application provide the following technical solutions:

an embodiment of the present application provides an electronic device, which includes: the system comprises a mainboard, a power supply circuit board and a plurality of functional modules; the power supply circuit board comprises a power supply module and a functional interface, and the power supply module is inserted on the power supply circuit board and is electrically connected with the functional interface; the power supply module is electrically connected with the mainboard and the functional interface respectively;

and part of the functional modules are electrically connected with the power supply module, and the rest of the functional modules are electrically connected with the mainboard.

In a possible implementation manner, the power supply circuit board includes a first area and second areas respectively located at two sides of the first area;

the functional interface is arranged in the first area; the power supply module is arranged in the second area.

In a possible implementation manner, the number of the power supply modules and the number of the functional interfaces are multiple;

the plurality of power supply modules are arranged in the first area at intervals;

part of the power supply modules are arranged in one of the second areas, and the rest of the power supply modules are arranged in the other second area.

In one possible implementation, the functional interface is configured to be electrically connected to a first fan module for dissipating heat from the power supply circuit board.

In a possible implementation manner, the functional module includes a hard disk backplane, a conversion module, and a second fan module, the hard disk backplane is electrically connected to the motherboard, and the conversion module and the second fan module are electrically connected to the power supply circuit board.

In a possible implementation manner, the electronic device further includes an expansion module, and the expansion module is connected with the main board and/or the power supply circuit board.

In a possible implementation manner, the expansion module includes at least one of a riser card, a network card, an OCP card, and an IO card.

In a possible implementation manner, the electronic device includes a chassis, and the conversion module, the motherboard, and the power supply circuit board are sequentially arranged along a length direction of the chassis.

In a possible implementation manner, the second fan module is located above the motherboard, and the second fan module is configured to dissipate heat of the motherboard.

In one possible implementation, the expansion module is arranged above the power supply circuit board.

In the electronic equipment that this application embodiment provided, on the basis that possesses the mainboard, additionally set up the power supply circuit board again, power module PSU inserts and establishes on the power supply circuit board, so the mainboard is got in the power supply circuit board, and functional module gets in power supply circuit board or mainboard, and in the correlation technique, whole functional module gets to compare in the technical scheme of mainboard, can reduce the preparation degree of difficulty of mainboard, and then reduce the preparation cost of mainboard to and reduce the requirement to the current capacity of mainboard.

In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems solved by the electronic device provided by the embodiments of the present application, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a first schematic diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2 is a second schematic diagram of an electronic device according to an embodiment of the present application;

fig. 3 is a schematic power supply diagram of an electronic device according to an embodiment of the present application.

Description of the reference numerals:

100: a main board;

110: a first power supply interface;

120: a fourth power supply interface;

200: a power supply circuit board;

210: a power supply module;

220: a functional interface;

230: a first region;

240: a second region;

250: a second power supply interface;

260: a third power supply interface;

270: a fifth power supply interface;

300: a first fan module;

400: a functional module;

410: a hard disk backplane;

420: a conversion module;

430: a second fan module;

500: a chassis;

600: a bus bar;

700: a first cable;

800: a second cable;

900: a third cable;

1000: and an expansion module.

Detailed Description

As described in the background art, there is a technical problem in the related art that the current capacity of the motherboard is limited. The inventor finds that the reason for such a problem is that the current electronic device generally adopts 2+2 redundant CRPS Power Supply Unit (PSU) to Supply Power to the electronic device system. For example, the power supply module is directly plugged on a motherboard, and the motherboard integrates functional modules such as a Central Processing Unit (CPU), a memory, a hard disk connection interface, a fan connection interface, a high-speed serial computer expansion bus standard interface (PCIE), and the power supply module PSU is used to directly supply power to the functional modules. Therefore, the load power consumption of the mainboard is large, the requirement on the through-current capacity of the mainboard is large, and the preparation cost of the mainboard is increased.

To the above-mentioned defect, this application embodiment provides electronic equipment, on the basis that possesses the mainboard, additionally set up the power supply circuit board again, power module PSU inserts and establishes on the power supply circuit board, so the mainboard is got in the power supply circuit board, and functional module gets in power supply circuit board or mainboard, and in the correlation technique, whole functional module gets and compares in the technical scheme of mainboard, can reduce the preparation degree of difficulty of mainboard, and then reduces the preparation cost of mainboard to and reduce the requirement to the current capacity of mainboard.

In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 3, an embodiment of the present application provides an electronic device, where the electronic device may include a mobile phone, a watch, or a server of a data center. The following description will be made taking a server as an example.

The electronic device includes a main board 100, a power supply circuit board 200, and a plurality of functional modules 400. The motherboard 100 is integrated with a Central Processing Unit (CPU), which is a control center of the electronic device and is one of the most basic and important components of the electronic device.

Power supply circuit board 200 and mainboard 100 can the interval set up in electronic equipment's quick-witted case 500, for example, power supply circuit board 200 sets up the one side at mainboard 100, and power supply circuit board 200 sets up with mainboard 100 is adjacent, so, can shorten the distance between power supply circuit board 200 and the mainboard 100, and then make things convenient for the circuit connection between power supply circuit board 200 and the mainboard 100, improve electronic equipment's wholeness ability.

The power supply circuit board 200 includes a power supply module 210 and a functional interface 220. The power supply module 210 is inserted into the power supply circuit board 200, for example, the power supply circuit board 200 has a power supply socket, and the power supply module 210 can be inserted into the power supply socket to connect the power supply module 210 and the power supply circuit board 200, so as to provide power input for the power supply circuit board 200.

In the embodiment, the Power Supply Unit 210 (PSU) may be connected to an external Power Supply system, for example, a municipal Power Supply system. Power is provided to power module 210 through a municipal power supply system, which in turn provides power input to power circuit board 200.

The power supply module 210 is electrically connected to the motherboard 100 and the functional interface 220, respectively. For example, the output terminals of the power supply module 210 are connected by a bus bar 600. Thus, when the power supply module 210 is connected to the motherboard 100, power can be supplied to the motherboard 100 to ensure the normal operation of the motherboard 100. When the power supply module 210 is connected to the functional interface 220, the functional interface 220 has power, and is further electrically connected to the functional module electrically connected to the functional interface 220, so as to ensure the normal operation of the functional module.

It should be noted that, in this embodiment, the functional interface 220 may be connected to an external device, and may also be connected to a functional module of an electronic device, for example, a hard disk backplane, a conversion module, or an expansion module.

In one example, the functional interface 220 is configured to electrically connect with the first fan module 300. For example, the first fan module 300 is inserted into the functional interface 220 to dissipate heat of the power circuit board 200 and/or dissipate heat of the chassis 500.

The electronic device further comprises a plurality of functional modules 400, wherein part of the functional modules 400 are electrically connected with the power supply circuit board 200 through power supply interfaces; part of the functional modules 400 are electrically connected to the main board 100 through a power supply interface.

In the electronic device provided in the embodiment of the present application, on the basis of the motherboard 100, the power supply circuit board 200 is additionally provided, and the power supply module PSU is inserted on the power supply circuit board 200. Thus, the motherboard 100 is powered by the power supply circuit board 200, and the functional module 400 is powered by the power supply circuit board 200 or the motherboard 100. Compared with the technical scheme that all the functional modules 400 are powered on the main board 100 in the related art, the manufacturing difficulty of the main board 100 can be reduced, and the manufacturing cost of the main board 100 is further reduced. Meanwhile, part of the functional modules 400 are powered on the power supply circuit board 200, so that the load of powering on the main board 100 can be reduced, the problem of overlarge current capacity of the main board 100 is solved, and the manufacturing cost of the main board 100 is reduced.

Referring to fig. 2, in one possible implementation, the power supply circuit board 200 includes a first area 230 and two second areas 240, and the two second areas 240 are respectively disposed at two sides of the first area 230. Taking the orientation shown in fig. 2 as an example, two second regions 240 are respectively disposed on the left and right sides of the first region 230. For convenience of defining the first region 230 and the second region 240, the first region 230 and the second region 240 are not sequentially marked from left to right in fig. 2.

The functional interface 220 is disposed within the first region 230; the power supply module 210 is disposed in the second region 240. By such an arrangement, the power supply module 210 can be arranged around the functional interface 220, so that the power supply module 210 can provide power for the functional interface 220, and the overall performance of the electronic device is improved.

With continued reference to fig. 2, in one possible implementation, the number of power supply modules 210 and functional interfaces 220 is multiple. The number of the power supply modules 210 is plural, and the plural power supply modules 210 are arranged at intervals in the first region 230. So configured, the power supply module 210 can be selectively connected with other functional modules, so as to better provide power for the other functional modules.

It should be noted that some power supply modules of the plurality of power supply modules 210 may be used as main power supply modules, and the remaining power supply modules 210 may be used as standby power supply modules, so as to prevent the electronic device from failing to work normally after the main power supply modules fail.

Illustratively, the number of the power supply modules 210 is 6, and 6 power supply modules 210 are arranged in the first region 230 at intervals. In this embodiment, the 6 power supply modules 210 may implement a 3+3 redundancy scheme or other redundancy schemes, which is not specifically limited herein.

Some of the plurality of power modules 210 are disposed in one of the second regions 240, and the remaining power modules 210 are disposed in the other second region 240. Illustratively, 3 power supply modules 210 are disposed in one of the second regions 240, and 3 power supply modules 210 are disposed in the other second region 240. So set up, a plurality of power module 210 can set up around function interface 220, can make things convenient for power module 210 to connect by function interface 220 selectively, improve electronic equipment's wholeness ability.

The number of the functional interfaces 220 is plural, the functional interfaces 220 may be arranged in the first area 230 in an array, for example, the functional interfaces 220 may be arranged in two rows and three columns in the first area 230. It should be noted that, in this embodiment, the number of the functional interfaces 220 and the power supply modules 210 is not limited to 6, and other options are available, and this embodiment is not limited in detail here.

Referring to fig. 3, in one implementation, the functional module 400 includes a hard disk backplane 410, a conversion module 420, and a second fan module 430. The main board 100 has a first power supply interface 110, one end of a first cable 700 is connected to the first power supply interface 110, and the other end of the first cable 700 is connected to the hard disk backplane 410, so as to supply power to the hard disk backplane 410.

It should be noted that the hard disk backplane 410 is a circuit board for the electronic device to access more hard disks.

The power supply circuit board 200 has a second power supply interface 250 and a third power supply interface 260, and the conversion module 420 is connected to the second power supply interface 250 through a second cable 800 to transmit the power of the power supply module 210 to the conversion module 420, thereby ensuring the normal operation of the conversion module 420. The conversion module 420 may include a Peripheral Component Interconnect Express (PCIE), a Graphics Processing Unit (GPU), a video card, or a memory.

The number of the second cables 800 may be one or more. Exemplarily, the number of the second cables 800 is two, and the conversion module 420 takes power from the power supply circuit board 200 through the two second cables 800.

The second fan module 430 is connected to the third power supply interface 260 through the third cable 900 to ensure the normal operation of the second fan module 430. The second fan module 430 can dissipate heat of the motherboard 100, and can rapidly reduce the temperature of the motherboard 100, thereby improving the performance of the motherboard 100.

In a possible implementation manner, the electronic device further includes an expansion module 1000, and the expansion module 1000 is connected to the main board 100 and/or the power supply circuit board 200. That is, the expansion module 1000 may be separately connected to the main board 100; or can be separately connected with the power supply circuit board 200; it is also possible to connect to both the main board 100 and the power supply circuit board 200.

The motherboard 100 has a fourth power supply interface 120, the power supply circuit board 200 has a fifth power supply interface 270, and the expansion module 1000 may be electrically connected to the fourth power supply interface 120 and/or the fifth power supply interface 270 through a power supply cable.

Illustratively, the expansion module 1000 includes at least one of a riser card, a network card, an OCP card, and an IO card. In one example, the riser card, the network card, the OCP card, and the IO card may all be connected to the motherboard 100. In another example, the riser card, network card, OCP card, and IO card may all be connected to power circuit board 200. In yet another example, some of the riser card, the network card, the OCP card, and the IO card are connected to the motherboard 100, and the rest are connected to the power supply circuit board 200.

In a possible implementation manner, referring to fig. 1 continuously, the electronic device includes a chassis 500, and the conversion module 420, the motherboard 100, and the power supply circuit board 200 are sequentially arranged along a length direction of the chassis 500, i.e., an X direction in fig. 1. That is, the conversion module 420 is disposed at the front of the chassis 500, the main board 100 is disposed at the middle of the chassis 500, and the power supply circuit board 200 is disposed at the rear of the chassis 500. With such an arrangement, the layout of the first fan module 300 can be facilitated, the heat generated by the conversion module 420 and the motherboard 100 can be better diffused to the outside of the case 500, the heat can be prevented from being accumulated in the case 500, and the stability of the electronic device is improved.

In one possible implementation, with continued reference to fig. 1, the second fan module 430 is located above the motherboard 100. So set up, can shorten the distance between second fan module 430 and the mainboard 100, can dispel the heat for mainboard 100 fast, improved mainboard 100's performance.

With continued reference to fig. 2, the expansion module 1000 is disposed above the power circuit board 200. The expansion module 1000 is located at the top of the chassis 500, so that the expansion module 1000 can be plugged and unplugged conveniently.

In the present specification, each embodiment or implementation mode is described in a progressive manner, and the emphasis of each embodiment is on the difference from other embodiments, and the same and similar parts between the embodiments may be referred to each other.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

In general, terms should be understood at least in part by their use in context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in the singular or may be used to describe a combination of features, structures, or characteristics in the plural, depending, at least in part, on the context. Similarly, terms such as "a" or "the" may also be understood to convey a singular use or to convey a plural use, depending at least in part on the context.

It should be readily understood that "on … …", "above … …" and "above … …" in this application should be interpreted in the broadest manner such that "on … …" means not only "directly on something", but also "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above" or "on" something, but also the meaning of "above" or "on" without intermediate features or layers therebetween (i.e., directly on something).

In the description of the present application, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. An electronic device is characterized by comprising a mainboard, a power supply circuit board and a plurality of functional modules; the power supply circuit board comprises a power supply module and a functional interface, and the power supply module is inserted on the power supply circuit board; the power supply module is electrically connected with the mainboard and the functional interface respectively;

and part of the functional modules are electrically connected with the power supply module, and the rest of the functional modules are electrically connected with the mainboard.

2. The electronic device according to claim 1, wherein the power supply circuit board includes a first area and second areas respectively located on both sides of the first area;

the functional interface is arranged in the first area; the power supply module is arranged in the second area.

3. The electronic device of claim 2, wherein the number of the power supply modules and the number of the functional interfaces are plural;

a plurality of power supply modules are arranged in the first area at intervals;

part of the power supply modules are arranged in one of the second areas, and the rest of the power supply modules are arranged in the other second area.

4. The electronic device of any of claims 1-3, wherein the functional interface is configured to electrically connect with a first fan module for dissipating heat from the power supply circuit board.

5. The electronic device of claim 4, wherein the functional module comprises a hard disk backplane, a conversion module and a second fan module, the hard disk backplane is electrically connected to the motherboard, and the conversion module and the second fan module are electrically connected to the power supply circuit board.

6. The electronic device of claim 5, further comprising an expansion module, wherein the expansion module is connected with the motherboard and/or the power supply circuit board.

7. The electronic device of claim 6, wherein the expansion module comprises at least one of a riser card, a network card, an OCP card, and an IO card.

8. The electronic device of claim 5, wherein the electronic device comprises a chassis, and the conversion module, the motherboard and the power supply circuit board are arranged in sequence along a length direction of the chassis.

9. The electronic device of claim 8, wherein the second fan module is located above the motherboard, and the second fan module is configured to dissipate heat from the motherboard.

10. The electronic device of claim 9, wherein the expansion module is disposed above the power supply circuit board.

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