CN115763430A - Display panel and film thickness measuring method and testing structure thereof - Google Patents
Display panel and film thickness measuring method and testing structure thereof Download PDFInfo
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- CN115763430A CN115763430A CN202211342816.3A CN202211342816A CN115763430A CN 115763430 A CN115763430 A CN 115763430A CN 202211342816 A CN202211342816 A CN 202211342816A CN 115763430 A CN115763430 A CN 115763430A
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- 238000005259 measurement Methods 0.000 claims description 114
- 238000000691 measurement method Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 101
- 238000010586 diagram Methods 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
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- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
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- 230000001427 coherent effect Effects 0.000 description 1
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Abstract
The application discloses a display panel, a film thickness measuring method and a film thickness measuring structure of the display panel, wherein the display panel comprises a glass substrate, a film and a measuring mark; the film layer is arranged on the glass substrate; the measuring mark is arranged on the glass substrate, the cross-sectional area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate, and the measuring mark is used for measuring the thickness of the film layer according to the size data of the film layer exposed by the measuring mark. The utility model provides a display panel measures rete thickness through setting up the sign of measurationing on glass substrate, and measuring means does not receive the influence of rete compactness, guarantees the accuracy and the homogeneity of rete thickness, guarantees display panel's precision.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a film thickness measuring method thereof, and a test structure thereof.
Background
The display panel is a main component of the display, and comprises a first substrate and a second substrate which are oppositely arranged, and a film layer filled between the first substrate and the second substrate. The accuracy and uniformity of film thickness is critical to display quality.
The conventional method for measuring the film thickness of the display panel is carried out by measuring the optical path difference, single-point measurement and multi-point monitoring are needed for the film thickness at different positions, the consumed time is long, and the method is easily influenced by the compactness of the film, so that the measurement error is large, and the improvement of the precision of the display panel is not facilitated.
Disclosure of Invention
In order to solve the above technical problems, the present application provides a display panel, a film thickness measuring method thereof, and a testing structure.
In order to solve the above problems, the present application provides a display panel, which includes a glass substrate, a film layer and a measurement mark; the film layer is arranged on the glass substrate; the measuring mark is arranged on the glass substrate, the cross section area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate, and the measuring mark is used for measuring the thickness of the film layer according to the size data of the film layer exposed by the measuring mark.
Optionally, the display panel includes a display area and a non-display area, and the measurement identifier is disposed on the glass substrate corresponding to the non-display area and/or the display area.
Optionally, the display area includes a plurality of display pixels, the measurement identifier is disposed on the glass substrate corresponding to the display area, and the measurement identifier is located between the display pixels.
Optionally, the shape of the projection of the measurement mark on the glass substrate is a polygon and/or a circle.
Optionally, the measuring mark is at least one of a quadrangular pyramid, a cone, a quadrangular frustum and a circular truncated cone.
Optionally, the display panel includes a first substrate and a second substrate that are disposed opposite to each other, the measurement mark is located between the first substrate and the second substrate, and the measurement mark is used for supporting the first substrate and the second substrate.
Optionally, the measurement mark is a quadrangular frustum pyramid and/or a quadrangular pyramid, and the projection area of the measurement mark on the glass substrate is at least 25um 2 And the height of the measuring mark is at least 1um.
In order to solve the above problem, the present application provides a method for measuring a film thickness of a display panel, including: providing a glass substrate, wherein a measuring mark is arranged on the glass substrate, and the cross section area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate; arranging a film layer on the glass substrate; acquiring size data of the measuring mark exposed on the film layer; calculating thickness data for the film layer based on the dimensional data.
Optionally, the step of measuring the mark is provided on the glass substrate, including: providing an insulating layer on the glass substrate; placing a mask plate with a preset-shaped opening on the insulating layer; carrying out exposure treatment on the insulating layer; and developing the exposed insulating layer to obtain the measuring mark, wherein the shape of the measuring mark corresponds to that of the preset opening.
Optionally, before the step of disposing a film layer on the glass substrate, the method for measuring a thickness of a film layer further includes: obtaining the size parameter of the measuring mark; and establishing a measurement model based on the dimension parameter, wherein the measurement model comprises the relative relation between the dimension parameter and the thickness data.
In order to solve the above problems, the present application provides a testing structure, which performs thickness measurement on a film layer of a display panel by using the film layer thickness measuring method as described above.
The application provides a display panel, a film thickness measuring method and a film thickness measuring structure, wherein the display panel comprises a glass substrate, a film and a measuring mark; the film layer is arranged on the glass substrate; the measuring mark is arranged on the glass substrate, the cross section area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate, and the measuring mark is used for measuring the thickness of the film layer according to the size data of the film layer exposed from the measuring mark. The utility model provides a display panel measures the sign through setting up on the glass substrate, measures rete thickness, and measuring mode does not receive the influence of rete compactness, guarantees the accuracy and the homogeneity of rete thickness, guarantees display panel's precision.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of a conventional interferometric method for measuring film thickness;
FIG. 2 is a schematic flow chart diagram illustrating an embodiment of a display panel provided herein;
FIG. 3 is a schematic diagram illustrating a variation of a film thickness and a cross-sectional area of a display panel according to the present disclosure;
FIG. 4 is a schematic structural diagram of a second embodiment of a display panel provided in the present application;
FIG. 5 is a schematic structural diagram of a third embodiment of a display panel provided in the present application;
FIG. 6 is a schematic structural diagram of an embodiment of a metrology mark provided herein;
FIG. 7 is a schematic flowchart illustrating an embodiment of a method for measuring a film thickness;
FIG. 8 is a schematic flow chart illustrating another embodiment of a method for measuring a film thickness according to the present disclosure;
FIG. 9 is a schematic diagram of an embodiment of a test structure provided herein;
FIG. 10 is a schematic flowchart illustrating a film thickness measuring method according to another embodiment of the present disclosure;
FIG. 11 is a schematic structural diagram of another embodiment of a test structure provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort fall within the protection scope of the present application.
It should be noted that if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic diagram of a conventional interferometric film thickness measurement method. As shown in fig. 1, the thickness of a thin film greatly affects the yield and performance of a device, and the thickness of the thin film is usually calculated by measuring the optical path difference between two coherent lights in the conventional method for measuring the thickness of the thin film.
The existing film thickness measuring method is greatly influenced by the density of the film, and when the density of the film is not uniform, a plurality of measuring points need to be tested, so that the measuring time is long, the measuring precision is not high, the precision of the display panel is not high, and the wide application of the display panel is not facilitated.
In view of this, this application has proposed a display panel, is provided with the mark of measurationing on this display panel's the glass substrate, can directly measure the rete thickness through the dimensional data that the mark of measurationing exposes to the rete, and simple structure can show improvement production efficiency.
Referring to fig. 2-3, fig. 2 is a schematic flow chart of an embodiment of a display panel provided in the present application, and fig. 3 is a schematic test structure of variations in film thickness and cross-sectional area of the display panel provided in the present application. As shown in fig. 2, the display panel includes a glass substrate 110, a film layer 310 and a measurement mark 210; the film layer 310 is disposed on the glass substrate 110; the measurement mark 210 is disposed on the glass substrate 110, a cross-sectional area of the measurement mark 210 decreases as a distance between the cross-section and the glass substrate 110 increases, and the measurement mark 210 is used for measuring a thickness of the film 310 according to a dimension data of the film 310 exposed by the measurement mark 210.
The glass substrate 110 is a carrier glass used for manufacturing a display panel, the display panel includes a first substrate and a second substrate, and the glass substrate 110 may be the first substrate or the second substrate. The glass substrate 110 is provided with a measurement mark 210, and the cross-sectional area of the measurement mark 210 decreases with the distance between the cross-section and the glass substrate 110, that is, the measurement mark 210 has a first inclined surface and a second inclined surface, and the angle openings of the first inclined surface and the second inclined surface face the side of the glass substrate 110 close to the measurement mark 210.
The measurement indicator 210 may be an insulating member, and is disposed at a plurality of positions of the glass substrate 110, for example, the display panel includes a display area 320, a non-display area 330, and a plurality of electrical devices, and the measurement indicator 210 may be disposed on the glass substrate 110 corresponding to the display area 320 and/or the non-display area 330, or may be disposed at a position of the glass substrate 110 where no electrical device is disposed, for obtaining a thickness variation condition of the film layer 310 by measuring a cross-sectional area variation of the measurement indicator 210.
The film layer 310 is disposed on the glass substrate 110, and specifically, the film layer 310 may be disposed by pouring, coating, and the like, and the film layer 310 includes, but is not limited to, a liquid crystal film layer 310. The film layer 310 has a first surface and a second surface, the first surface is a side of the film layer 310 away from the glass substrate 110, the second surface is a side of the film layer 310 close to the glass substrate 110, and the measurement identifier 210 is used for measuring the thickness of the film layer 310 according to the size data of the measurement identifier 210 exposed to the film layer 310 (i.e., exposed to the first surface), where the size data includes, but is not limited to, parameters such as length, width, radius, diameter, area, and side length.
As shown in fig. 3 (a) and (b), when the thickness of the film 310 is H, the length of the cross section of the film 310 exposed by the measurement mark 210 is L, and the width thereof is W; as shown in fig. 4 (c) and (d), when the thickness of the film 310 is H '(H' > H), the length L '(L' < L) and the width W '(W' < W) of the cross section of the film 310 exposed by the measurement mark 210 are L '(L' < L), and therefore, the thickness data of the film 310 can be calculated by measuring the dimension data of the first surface of the film 310.
In the embodiment of the present application, the measurement mark 210 is disposed on the glass substrate 110 to measure the thickness of the film layer 310, the measurement mode is not affected by the compactness of the film layer, the accuracy and uniformity of the thickness of the film layer 310 are ensured, and the precision of the display panel is ensured.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a display panel according to a second embodiment of the present disclosure. As shown in fig. 4, in an embodiment, the display panel includes a display area 320 and a non-display area 330, and the measurement indicator 210 is disposed on the glass substrate 110 corresponding to the non-display area 330 and/or the display area 320.
Specifically, the display area 320 is an image display area 320 of the display panel, the non-display area 330 is an area of the display panel other than the display area 320, and the non-display area 330 includes, but is not limited to, a sealing area, a pad area, and the like. The measurement mark 210 is disposed on the glass substrate 110 at a position corresponding to the display area 320 and/or the non-display area 330 of the display panel. For example, the measurement mark 210 may be disposed on the glass substrate 110 corresponding to the display region 320, the measurement mark 210 may be disposed on the glass substrate 110 corresponding to the non-display region 330, or the measurement mark 210 may be disposed on the glass substrate 110 corresponding to the display region 320 and the non-display region 330.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a display panel according to a third embodiment of the present application. As shown in fig. 5, in an embodiment, the display area 320 includes a plurality of display pixels 340, and the measurement indicator 210 is disposed on the glass substrate 110 corresponding to the display area 320, and the measurement indicator 210 is located between the display pixels 340.
Specifically, the display area 320 is an array of a plurality of display pixels 340, and the display pixels 340 are generally composed of red, green, blue, and other sub-pixels. When the measurement mark 210 is disposed on the glass substrate 110 corresponding to the display region 320, the measurement mark 210 is located between the plurality of display pixels 340 to ensure the display effect of the display panel.
In other embodiments, the measurement indicator 210 may be further disposed on the glass substrate 110 corresponding to the non-display area 330 and the display area 320, and disposed between the display pixels 340 to ensure the display effect of the display panel.
In one embodiment, the shape of the projection of the measurement mark 210 on the glass substrate 110 is a polygon and/or a circle.
Specifically, the measurement mark 210 is disposed on the glass substrate 110, and a projection shape of the measurement mark 210 on the glass substrate 110 is a polygon and/or a circle, or a cross-sectional shape of the measurement mark 210 on the glass substrate 110 is a polygon and/or a circle.
In one embodiment, the measurement mark 210 is at least one of a pyramid, a cone, a truncated pyramid, and a truncated cone.
Specifically, the measurement mark 210 is at least one of a quadrangular pyramid, a cone, a quadrangular frustum, and a circular truncated cone, so that the shape of the projection of the measurement mark 210 on the glass substrate 110 is polygonal and/or circular, and has a characteristic that the cross-sectional area decreases as the distance between the cross-sectional area and the glass substrate 110 increases.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a measurement mark provided in the present application. As shown in fig. 6, in an embodiment, the display panel includes a first substrate 120 and a second substrate 130 disposed opposite to each other, a measurement mark 210 is disposed between the first substrate 120 and the second substrate 130, and the measurement mark 210 is used for supporting the first substrate 120 and the second substrate 130.
The display panel includes a first substrate 120 and a second substrate 130 disposed opposite to each other, the measurement mark 210 is located between the first substrate 120 and the second substrate 130, at least one of the first substrate 120 and the second substrate 130 is a glass substrate 110, or the measurement mark 210 is disposed on the first substrate 120 and/or the second substrate 130. Specifically, in one embodiment, when the display panel is a liquid crystal display panel, the display panel is formed by bonding two glass substrates 110, liquid crystal is filled between the two glass substrates 110, a pixel electrode layer and a common electrode layer are respectively disposed on opposite inner sides of the two glass substrates 110, and the rotation direction of liquid crystal molecules is controlled by using voltage field intensity to generate a picture. At this time, the glass substrates 110 are the first substrate 120 and the second substrate 130, and the liquid crystal film layer 310 is disposed between the two glass substrates 110.
In another embodiment, when the display panel is a liquid crystal on silicon display panel, the glass substrate 110 is one of the first substrate 120 and the second substrate 130, and the other of the first substrate 120 and the second substrate 130 is a material substrate such as a wafer. The measurement mark 210 is disposed on the glass substrate 110, and at this time, the liquid crystal film layer 310 is disposed between the glass substrate 110 and the wafer substrate, and the height of the measurement mark 210 needs to be close to the box height of the display panel for supporting the first substrate 120 and the second substrate 130.
In one embodiment, the measurement mark 210 is a quadrangular pyramid and/or a quadrangular pyramid, and the projection area of the measurement mark 210 on the glass substrate 110 is at least 25um 2 The height of the measurement indicator 210 is at least 1um.
Specifically, when the measurement mark 210 is a square pyramid and/or a square pyramid, the length of the measurement mark 210 on the glass substrate 110 is greater than or equal to 5um, the width of the measurement mark on the glass substrate 110 is greater than or equal to 5um, and the projection area of the measurement mark on the glass substrate 110 is greater than or equal to 25um 2 And the height is greater than or equal to 1um, so as to ensure that the measurement identifier 210 can be used for thickness measurement.
The application also provides a film thickness measuring method of the display panel, which can be applied to a test structure, the test structure is used for measuring the thickness of films such as liquid crystal and the like during manufacturing and production of the display panel so as to ensure the accuracy and uniformity of the film thickness, the method is simple, and the production efficiency can be improved.
Referring to fig. 7, fig. 7 is a schematic flow chart illustrating an embodiment of a film thickness measuring method provided in the present application. As shown in fig. 7, in the present embodiment, the method for measuring a film thickness of a display panel includes the following steps:
step S11: a glass substrate 110 is provided, a measurement mark 210 is disposed on the glass substrate 110, and the cross-sectional area of the measurement mark 210 decreases as the distance between the cross-section and the glass substrate 110 increases.
The glass substrate 110 is provided with a measurement mark 210, and the cross-sectional area of the measurement mark 210 decreases as the distance between the cross-sectional area and the glass substrate 110 increases, that is, the measurement mark 210 has a first inclined surface and a second inclined surface, and the angle openings of the first inclined surface and the second inclined surface face the side of the glass substrate 110 close to the measurement mark 210.
Step S12: a film layer 310 is disposed on the glass substrate 110.
The film layer 310 is disposed on the glass substrate 110, and specifically, the film layer 310 may be disposed by pouring, coating, and the like, and the film layer 310 includes, but is not limited to, the liquid crystal film layer 310.
Step S13: dimensional data of the metrology mark 210 exposed to the film 310 is obtained.
The dimension data of the film 310 exposed by the metrology mark 210 or the projection dimension data of the metrology mark 210 on the film 310 is obtained, and the dimension data includes, but is not limited to, length, width, radius, diameter, area, side length, and the like.
Step S14: the thickness data of the film layer 310 is calculated based on the dimensional data.
The thickness data of the film layer 310 is calculated based on the dimensional data of the first surface of the film layer 310 or based on a proportional relationship between the dimensional data and the thickness of the film layer 310.
Since the thickness of the film 310 is directly calculated by measuring the cross-sectional dimension of the mark 210 and the relationship between the cross-sectional dimension and the height in the embodiment, the measuring time is short and is not affected by the quality (compactness) of the film 310.
In the embodiment of the present application, the measurement mark 210 is disposed on the glass substrate 110, so that the thickness of the film layer 310 can be measured quickly and accurately without being affected by the compactness of the film layer 310, the accuracy and uniformity of the thickness of the film layer 310 are ensured, and the production efficiency is improved.
Referring to fig. 8-9, fig. 8 is a schematic flow chart of another embodiment of a film thickness measurement method provided in the present application, and fig. 9 is a schematic structural diagram of an embodiment of a test structure provided in the present application. As shown in fig. 8-9, in the present embodiment, step S11 further includes the following steps:
step S21: an insulating layer 410 is disposed on the glass substrate 110.
Specifically, the insulating layer 410 with a predetermined thickness may be disposed on the glass substrate 110 by coating, the insulating layer 410 is a solid layer made of an insulating material, and the material of the insulating layer 410 at least includes a photoresist.
Step S22: a mask plate 420 formed with a predetermined shape of opening is placed on the insulating layer 410.
The mask plate is a component required to be used in the processes of exposure, development, etching and the like, and the mask plate 420 is a metal component with a plurality of holes and can be accurately positioned when the base material is manufactured. Specifically, the preset-shaped opening on the mask plate 420 corresponds to the shape of the projection of the measurement mark 210 on the glass substrate 110, that is, the preset-shaped opening includes, but is not limited to, a circle, a polygon, and the like.
Step S23: the insulating layer 410 is subjected to exposure treatment.
The insulating layer 410 is exposed by laser, the laser passes through the mask plate 420 and then acts on the insulating layer 410, and since the mask plate 420 has the opening with the preset shape, the region of the insulating layer 410 corresponding to the opening with the preset shape cannot receive ultraviolet rays, that is, the mask plate 420 functions to selectively irradiate or selectively expose the insulating layer 410. However, depending on the shape of the opening of the mask, the insulating layer 410 may be exposed onbase:Sub>A plurality of cross sections, for example, as shown in fig. 9, when the measurement mark 210 isbase:Sub>A truncated pyramid, the insulating layer 410 is exposed on thebase:Sub>A-base:Sub>A 'cross section and the B-B' cross section, respectively.
Fig. 9- (base:Sub>A) isbase:Sub>A schematic structural diagram obtained by selectingbase:Sub>A sectionbase:Sub>A-base:Sub>A 'on the front view of the measurement mark 210, and fig. 9- (B) isbase:Sub>A schematic structural diagram obtained by selectingbase:Sub>A section B-B' on the side view of the measurement mark 210, wherein, for example, the quadrangular frustum hasbase:Sub>A first edge andbase:Sub>A second edge which are intersected, the sectionbase:Sub>A-base:Sub>A 'is parallel to the first edge, and the section B-B' is parallel to the second edge.
Step S24: the exposed insulating layer 410 is developed to obtain the measurement mark 210, and the shape of the measurement mark 210 corresponds to the shape of the predetermined opening.
After the exposure treatment, the insulating layer 410 may be developed by applying a developing solution, and since the insulating layer 410 includes a photoresist, the exposed area of the insulating layer 410 may be dissolved by the developing solution to obtain the measurement identifier 210 having a predetermined shape, and the shape of the measurement identifier 210 corresponds to the predetermined shape of the opening.
In this embodiment, the insulating layer 410 is disposed on the glass substrate 110, and the mask plate 420 is disposed on the insulating layer 410, so that after the insulating layer 410 is exposed and developed, the measurement mark 210 with a preset shape can be formed on the glass substrate 110, thereby achieving precise positioning.
Referring to fig. 10, fig. 10 is a schematic flow chart illustrating a film thickness measurement method according to another embodiment of the present disclosure. As shown in fig. 10, in this embodiment, before the step S12, the method for measuring a film thickness may further include the following steps:
step S31: the dimensional parameters of the metrology mark 210 are obtained.
The dimension parameter of the measurement mark 210 is a projection dimension of the measurement mark 210 on the glass substrate 110, and the dimension parameter includes, but is not limited to, one or more parameters such as length, width, radius, diameter, area, side length, and height. The dimension data of the metrology mark 210 is the dimension of the metrology mark 210 exposed at the film 310, or the dimension data is the dimension of the metrology mark 210 at the first surface of the film 310.
Step S32: and establishing a measurement model based on the dimension parameters, wherein the measurement model comprises the relative relation between the dimension parameters and the thickness data.
A related measurement model may be established based on the dimension parameter of the measurement identifier 210, and the measurement model may define a relative relationship between the dimension parameter and the thickness data of the film layer 310, so that when measuring the thickness of the film layer 310, the corresponding measurement model may be directly invoked according to the dimension of the measurement identifier 210, and the thickness of the film layer 310 corresponding to the measurement identifier may be calculated according to the relative relationship between the dimension data of the measurement identifier 210, the dimension parameter, and the thickness data of the film layer 310.
It can be understood that, in another embodiment, the test structure may be provided with a plurality of measurement identifiers 210 with different sizes and shapes, and store corresponding measurement models, and when the thickness of the film 310 is measured, the corresponding measurement models may be directly called by identifying the identification information on the measurement identifiers 210, so as to accelerate the measurement speed.
Referring to fig. 11, fig. 11 is a schematic structural diagram of another embodiment of a test structure provided in the present application. As shown in fig. 11, the present application further proposes a test structure for performing a thickness measurement on a film 310 of a display panel by using the film thickness measurement method as described in any one of the above.
The test structure comprises a carrier 510 and a test probe 520, wherein the carrier 510 is used for carrying the glass substrate 110, the glass substrate 110 is provided with a measurement mark 210, and the measurement mark 210 can be manufactured by the exposure and development method. The test probe 520 is disposed on the carrier 510, and is configured to obtain a projection size of the measurement mark 210 on the glass substrate 110 or the film layer 310, and calculate a thickness of the film layer 310 according to size data of the measurement mark 210.
In alternative embodiments, the test probe 520 includes, but is not limited to, a camera, an industrial camera, etc., and the test probe 520 is movable for capturing and testing the plurality of metrology markers 210 for the display panel.
Different from the prior art, the film thickness measuring method can directly calculate the thickness of the film 310 through the cross-sectional dimension of the measuring mark 210 and the relationship between the cross-sectional dimension and the height, the measuring time is short, the influence of the compactness of the film 310 is avoided, the accuracy and the uniformity of the thickness of the film 310 are ensured, and the production efficiency is improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (11)
1. A display panel, comprising:
a glass substrate;
the film layer is arranged on the glass substrate;
the measuring mark is arranged on the glass substrate, the cross section area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate, and the measuring mark is used for measuring the thickness of the film layer according to the size data of the film layer exposed by the measuring mark.
2. The display panel according to claim 1, wherein the display panel comprises a display region and a non-display region, and the measurement mark is disposed on the glass substrate corresponding to the non-display region and/or the display region.
3. The display panel according to claim 2, wherein the display region comprises a plurality of display pixels, the measurement mark is disposed on the glass substrate corresponding to the display region, and the measurement mark is located between the display pixels.
4. The display panel of claim 1, wherein the shape of the projection of the measurement mark on the glass substrate is a polygon and/or a circle.
5. The display panel of any one of claims 1 or 4, wherein the measurement indicia is at least one of a quadrangular pyramid, a cone, a quadrangular frustum, and a circular frustum.
6. The display panel of claim 5, wherein the display panel comprises a first substrate and a second substrate disposed opposite to each other, and the measurement mark is located between the first substrate and the second substrate for supporting the first substrate and the second substrate.
7. The display panel of claim 5, wherein the measurement mark is a quadrangular frustum and/or a quadrangular pyramid, and a projection area of the measurement mark on the glass substrate is at least 25um 2 And the height of the measuring mark is at least 1um.
8. A method for measuring the film thickness of a display panel is characterized by comprising the following steps:
providing a glass substrate, wherein a measuring mark is arranged on the glass substrate, and the cross section area of the measuring mark is reduced along with the increase of the distance between the cross section and the glass substrate;
arranging a film layer on the glass substrate;
acquiring size data of the measuring mark exposed on the film layer;
calculating thickness data for the film layer based on the dimensional data.
9. The method of claim 8, wherein the step of providing a measurement mark on the glass substrate comprises:
disposing an insulating layer on the glass substrate;
placing a mask plate with a preset-shaped opening on the insulating layer;
carrying out exposure treatment on the insulating layer;
and developing the exposed insulating layer to obtain the measuring mark, wherein the shape of the measuring mark corresponds to the shape of the preset opening.
10. The method of claim 9, wherein prior to the step of disposing a film on the glass substrate, the method further comprises:
acquiring the size parameter of the measuring mark;
and establishing a measurement model based on the dimension parameter, wherein the measurement model comprises the relative relation between the dimension parameter and the thickness data.
11. A test structure, wherein the test structure performs thickness measurement on a film of a display panel by the film thickness measurement method according to any one of claims 8-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211342816.3A CN115763430B (en) | 2022-10-28 | 2022-10-28 | Display panel and film thickness measuring method and structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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