CN115732895A - Antenna structure and combination method thereof - Google Patents
Antenna structure and combination method thereof Download PDFInfo
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- CN115732895A CN115732895A CN202110983588.7A CN202110983588A CN115732895A CN 115732895 A CN115732895 A CN 115732895A CN 202110983588 A CN202110983588 A CN 202110983588A CN 115732895 A CN115732895 A CN 115732895A
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Abstract
The invention provides an antenna structure and a combination method thereof, wherein the combination method comprises the following steps: the circuit board is provided with at least one joint hole penetrating through the circuit board, at least one electrode layer and a feed-in wire are formed on the periphery of the joint hole, and the feed-in wire is electrically connected with the electrode layer. A chip antenna is provided, which includes a substrate having a wiring section, a fixing section is provided at one end of the wiring section, and a conductive layer is formed on the fixing section. And penetrating the fixed connection section of the chip antenna through the joint hole of the circuit board to electrically and fixedly connect the conductive layer and the electrode layer, so that the chip antenna is vertically and fixedly connected on the circuit board. Therefore, the height of the chip antenna standing on the circuit board can be reduced, and the antenna structure is easy to mount on an electronic product for use.
Description
Technical Field
The present invention relates to an antenna, and more particularly, to an antenna structure and a method for vertically electrically connecting a chip antenna to a circuit board.
Background
With the popularization of networks, people rely on the networks gradually, and more mobile internet access devices are developed, for example, when mobile internet access devices such as desktop computers, notebook computers, tablet computers, electronic books (E-readers), smart phones and the like are prevalent in the market, the mobile internet access devices also transmit requirements of people on the acquisition of network information and the interpersonal interaction of the networks, and then the stability of receiving and transmitting of a communication system.
A True Wireless Stereo (TWS) headphone used in the market in recent years. The principle of the TWS earphone means that the mobile device is connected with a main (right) earphone and then the main (right) earphone is quickly connected with an auxiliary (left) earphone in a wireless mode, so that real Bluetooth left and right sound channels are wirelessly separated for use.
In the above electronic products, it is necessary to transmit or receive through an antenna structure, which includes a circuit board and a chip antenna. The electrode layer of the chip antenna is welded with the conducting layer of the circuit board, so that the chip antenna is vertically welded on the circuit board, and the metal layer on the chip antenna is electrically connected with the feed-in line on the circuit board. Therefore, signals between the electronic products can be transmitted or connected to the internet for use.
The electrode layer of the chip antenna is soldered on the conductive layer of the circuit board by solder. After welding, the length of the chip antenna and the thickness of the soldering tin increase the height of the chip antenna standing on the circuit board, and the antenna structure is difficult to mount under the condition that the space position for mounting the antenna structure on an electronic product is limited. Next, when soldering an electronic circuit, if the solder is not completely melted, the heat source is removed, resulting in a poor circuit connection, which is called a cold solder joint (cold solder joint). Therefore, in the process of mounting the antenna structure, when the chip antenna is accidentally influenced by external force, the chip antenna is easily separated or falls off from the circuit board, so that the antenna structure is damaged.
Disclosure of Invention
Therefore, the main objective of the present invention is to solve the conventional disadvantages, and the antenna structure of the present invention is redesigned such that the chip antenna vertically penetrates through the circuit board and then is electrically connected to the circuit board, thereby not only firmly and electrically connecting the chip antenna to the circuit board, but also reducing the height of the chip antenna vertically on the circuit board, and making the antenna structure easy to be mounted on an electronic product for use.
To achieve the above object, the present invention provides a method for combining antenna structures, including: the circuit board is provided with at least one joint hole penetrating through the circuit board, at least one electrode layer and a feed-in wire are formed on the periphery of the joint hole, and the feed-in wire is electrically connected with the electrode layer. A chip antenna is provided, which includes a substrate having a wiring section, a fixing section is provided at one end of the wiring section, and a conductive layer is formed on the fixing section. And penetrating the fixed connection section of the chip antenna through the joint hole of the circuit board to electrically and fixedly connect the conductive layer and the electrode layer, so that the chip antenna is vertically and fixedly connected on the circuit board.
In an embodiment of the present invention, the chip antenna is vertically and vertically fixed on the circuit board.
In one embodiment of the present invention, the chip antenna is fixed on the circuit board in a horizontal vertical manner.
In an embodiment of the present invention, a ground layer is formed on the front or back surface, or both the front and back surfaces of the circuit board, and a clearance area is formed on the back surface of the circuit board, wherein the clearance area corresponds to the electrode layer on the front surface of the circuit board.
In an embodiment of the present invention, the coupling hole is formed inside the circuit board body, or at a side of the circuit board body and forms a side hole in a U-shape.
In one embodiment of the present invention, the engagement hole is a single hole type, a two hole type, or a three hole type.
In one embodiment of the present invention, the chip antenna is made of a ceramic material or a glass fiber material.
In one embodiment of the present invention, the wiring segment is formed with a metal layer.
In an embodiment of the invention, the metal layer includes a plurality of linear bars disposed on the surface of the substrate and a plurality of conductive pillars penetrating through the substrate, and the plurality of conductive pillars penetrate through the substrate and are electrically connected to the plurality of linear bars disposed on the surface of the substrate, so that the plurality of linear bars and the plurality of conductive pillars form a spiral winding disposed on the substrate.
In an embodiment of the invention, the fixed section is a column, a plurality of pins, a plurality of terminals, a recess or a U-shaped notch.
In an embodiment of the invention, the joint hole is located on a side of the circuit board and has a specific distance with the side, the electrode layer is disposed around the joint hole and at the specific distance, and the electrode layer is electrically connected to the feed-in line.
In an embodiment of the invention, a lower portion of the U-shaped notch of the chip antenna passes through the circuit board and is fixedly connected to the joint hole, and the U-shaped notch is bridged over a specific distance of the circuit board, so that the conductive layer is electrically connected to the electrode layer.
To achieve the above object, the present invention further provides an antenna structure, including: a circuit board and a chip antenna. The circuit board is provided with at least one joint hole penetrating through the circuit board, the periphery of the joint hole is provided with at least one electrode layer and a feed-in wire, and the feed-in wire is electrically connected with the electrode layer. The chip antenna is provided with a substrate, the substrate is provided with a wiring section, one end of the wiring section is provided with a fixed connection section, and the fixed connection section is provided with a conductive layer. The fixed connection section of the chip antenna penetrates through the joint hole of the circuit board, so that the conductive layer is electrically and fixedly connected with the electrode layer, and the chip antenna is vertically and fixedly connected on the circuit board.
In an embodiment of the present invention, the chip antenna is vertically and vertically fixed on the circuit board.
In an embodiment of the present invention, the chip antenna is fixed on the circuit board in a horizontal vertical manner.
In an embodiment of the present invention, a ground layer is formed on the front or back surface, or both the front and back surfaces of the circuit board, and a clearance area is formed on the back surface of the circuit board, wherein the clearance area corresponds to the electrode layer on the front surface of the circuit board.
In an example of the present invention, the coupling hole is provided inside the circuit board body, or at a side of the circuit board body and forms a side hole in a U-shape.
In one embodiment of the present invention, the engagement hole is a single hole type, a two hole type, or a three hole type.
In one embodiment of the present invention, the chip antenna is made of ceramic material or glass fiber material.
In one embodiment of the present invention, the wiring segment is provided with a metal layer.
In an embodiment of the invention, the metal layer includes a plurality of straight bars disposed on the surface of the substrate and a plurality of conductive pillars penetrating through the substrate, and the plurality of conductive pillars penetrate through the substrate and are electrically connected to the plurality of straight bars disposed on the surface of the substrate, so that the plurality of straight bars and the plurality of conductive pillars form a spiral winding and are disposed on the substrate.
In an embodiment of the invention, the fixed section is a column, a plurality of pins, a plurality of terminals, a recess or a U-shaped notch.
In an embodiment of the invention, the joint hole is located on a side of the circuit board and has a specific distance with the side, the electrode layer is disposed around the joint hole and at the specific distance, and the electrode layer is electrically connected to the feed-in line.
In an embodiment of the invention, a lower section of the U-shaped notch of the chip antenna passes through the circuit board to be fixedly connected with the joint hole, and the U-shaped notch is bridged over a specific distance of the circuit board, so that the conductive layer is electrically connected with the electrode layer.
Drawings
FIG. 1 is an exploded view of the antenna structure according to the first embodiment of the present invention
FIG. 2 is a schematic view of the three-dimensional assembly of FIG. 1
FIG. 3 is a schematic side cross-sectional view of FIG. 2;
FIG. 4 is an exploded view of the antenna structure according to the second embodiment of the present invention
FIG. 5 is a perspective assembly view of FIG. 4;
FIG. 6 is a schematic side cross-sectional view of FIG. 5;
FIG. 7 is an exploded view of the antenna structure according to the third embodiment of the present invention
FIG. 8 is a perspective assembly view of FIG. 7;
FIG. 9 is an exploded view of the antenna structure according to the fourth embodiment of the present invention
FIG. 10 is the perspective view of FIG. 9
FIG. 11 is an exploded view of the antenna structure according to the fifth embodiment of the present invention
FIG. 12 is a perspective assembly view of FIG. 11;
FIG. 13 is a side cross-sectional schematic view of FIG. 12;
FIG. 14 is an exploded view of the antenna structure according to the sixth embodiment of the present invention
FIG. 15 is a perspective assembly view of FIG. 14;
FIG. 16 is an exploded view of the antenna structure according to the seventh embodiment of the present invention
Fig. 17 is a perspective assembly view of fig. 16.
Symbolic illustration in the drawings:
1. a circuit board;
11. 11a, 11b engage the holes;
11c, 11d, 11e side holes;
12. 12a, 12b, 12c, 12d, 12e, 12f electrode layers;
13. feeding a wire;
2. a chip antenna;
21. a substrate;
22. a wiring section;
23. a fixed connection section;
23a pin;
a 23b terminal;
23c a recessed portion;
23d, 23e, 23f notches;
231f a lower section;
24. 24a, 24b, 24c, 24d, 24e, 24f conductive layers;
a is a specific distance.
Detailed Description
The technical contents and the detailed description of the present invention are described below with reference to the drawings:
please refer to fig. 1-3, which are exploded views of an antenna structure according to a first embodiment of the present invention, a perspective assembly shown in fig. 1, and a side cross-sectional view shown in fig. 2. As shown in the figure: the method for combining the antenna structure of the present invention comprises, firstly, providing a circuit board 1, forming at least one joint hole 11 penetrating the circuit board 1 on the circuit board 1, and forming at least one electrode layer 12 on the periphery of the joint hole 11. In addition, a feeding line 13 is formed on the circuit board 1, and the feeding line 13 is electrically connected to the electrode layer 12. A grounding layer (not shown) is formed on the front or back surface, or both the front and back surfaces of the circuit board 1 for grounding the antenna. A clearance area (not shown) is formed on the back surface of the circuit board 1, the clearance area corresponds to the electrode layer 12 on the front surface of the circuit board 1, the clearance area mainly functions to keep metal away from the antenna body (metal shielding), the resonant frequency can be changed by changing the size of the clearance area, and the separation between the near field and the far field of the antenna is changed to a certain extent by the clearance area. In this figure, the engaging hole 11 can be formed inside the circuit board 1 (as shown in fig. 1-8, 16-17) or at the side of the circuit board 1 to form a side hole (as shown in fig. 9-15).
In addition, a chip antenna 2 is provided, and the chip antenna 2 is made of a ceramic material or a glass fiber material. The chip antenna 2 includes a substrate 21, the substrate 21 has a wiring section 22, and one end of the wiring section 22 has a fixing section 23. The wiring segment 22 is formed with a metal layer (not shown) by printing or etching, the metal layer is composed of, but not limited to, a plurality of straight lines disposed on the surface of the substrate and a plurality of conductive pillars penetrating through the substrate, the conductive pillars penetrate through the substrate and are electrically connected to the straight lines disposed on the surface of the substrate, so that the straight lines and the conductive pillars form a spiral winding on the substrate 21 to form the metal layer. In addition, a conductive layer 24 electrically connected to the metal layer is formed on the fixed section 23. In the figure, the fixing section 23 is a column, a plurality of pins, a plurality of terminals, a recess or a U-shaped notch.
When the circuit board 1 is electrically connected to the chip antenna 2, the fixing section of the chip antenna 2 passes through the joint hole 11 of the circuit board 1, so that the conductive layer 24 is electrically connected to the electrode layer 12. After the circuit board 1 is fixedly connected with the chip antenna 2, the height of the chip antenna 2 which can be vertically or horizontally and fixedly connected on the circuit board 1 is reduced, and meanwhile, the chip antenna 2 is fixedly connected with the circuit board 1 electrically. Under the condition that the space for installing the antenna structure in the electronic product is limited, the antenna structure design can easily adjust the height of the chip antenna standing on the surface of the circuit board 1, and the problem of installing the antenna structure in the electronic product can be greatly reduced.
Please refer to fig. 1-3, which are exploded views of an antenna structure, a perspective assembly shown in fig. 1, and a side cross-sectional view shown in fig. 2 according to a first embodiment of the present invention. As shown in the figure: the antenna structure of the present invention includes: a circuit board 1 and a chip antenna 2. The chip antenna 2 is vertically and electrically fixed on the circuit board 1 by penetrating the circuit board 1.
The circuit board 1 has at least one joint hole 11 penetrating the circuit board 1, and at least one electrode layer 12 is disposed on the periphery of the joint hole 11. In addition, a feeding line 13 is disposed on the circuit board 1, and the feeding line 13 is electrically connected to the electrode layer 12. A grounding layer (not shown) is formed on the front or back surface, or both the front and back surfaces of the circuit board 1 for grounding the antenna. A clearance area (not shown) is formed on the back surface of the circuit board 1, the clearance area corresponds to the electrode layer 12 on the front surface of the circuit board 1, the clearance area mainly functions to keep metal away from the antenna body (metal shielding), the resonant frequency can be changed by changing the size of the clearance area, and the separation between the near field and the far field of the antenna is changed to a certain extent by the clearance area. In the present drawing, the joint hole 11 can be formed inside the circuit board 1 body, or at the side of the circuit board 1 body, to form a side hole.
The chip antenna 2 is made of ceramic material or glass fiber material. The chip antenna 2 includes a substrate 21, the substrate 21 has a wiring section 22, and one end of the wiring section 22 has a fixing section 23. The wiring segment 22 is formed with a metal layer (not shown) by printing or etching, the metal layer is composed of, but not limited to, a plurality of straight lines disposed on the surface of the substrate 21 and a plurality of conductive pillars penetrating through the substrate 21, the conductive pillars penetrate through the substrate 21 and then are electrically connected to the straight lines disposed on the surface of the substrate 21, so that the straight lines and the conductive pillars form a metal layer spirally wound on the substrate 21. In addition, a conductive layer 24 electrically connected to the metal layer is disposed on the fixed section 23. In the figure, the fixing section 23 is a column, a plurality of pins, a plurality of terminals, or a U-shaped notch.
When the circuit board 1 is electrically connected to the chip antenna 2, the fixing section 23 of the chip antenna 2 passes through the connecting hole 11 of the circuit board 1, so that the conductive layer 24 is electrically connected to the electrode layer 12. After the circuit board 1 is fixedly connected with the chip antenna 2, the height of the chip antenna 2 which can be vertically or horizontally and fixedly connected on the circuit board 1 is reduced, and meanwhile, the chip antenna 2 is fixedly connected with the circuit board 1 electrically. Under the condition that the space for installing the antenna structure in the electronic product is limited, the antenna structure design can easily adjust the height of the chip antenna standing on the surface of the circuit board 1, and can greatly reduce the problem of installing the antenna structure in the electronic product.
Please refer to fig. 4-6, which are exploded views of an antenna structure, a perspective assembly of fig. 4 and a side cross-sectional view of fig. 5 according to a second embodiment of the present invention. As shown in the figure: the present embodiment is substantially the same as the first embodiment, except that the engaging holes 11a of the circuit board 1 are of a porous design, in the present embodiment, two holes, and at least one electrode layer 12a is disposed on the periphery of the engaging holes 11 a. The electrode layer 12a is electrically connected to the feeding line 13.
The fixed section 23 of the chip antenna 2 is a plurality of pins 23a, and a conductive layer 24a is disposed on the surface of the pins 23 a. In the embodiment, the number of the pins 23a is 2 but not limited to 2.
When the circuit board 1 is electrically connected to the chip antenna 2, the pins 23a of the chip antenna 2 pass through the engagement holes 11a of the circuit board 1, so that the conductive layer 24a is electrically connected to the electrode layer 12a. The height of the chip antenna 2 can be vertically or horizontally fixed on the circuit board 1, and the chip antenna 2 is firmly fixed with the circuit board 1.
Please refer to fig. 7-8, which are exploded perspective views of an antenna structure and the antenna assembly shown in fig. 7 according to a third embodiment of the present invention. As shown in the figure: the present embodiment is substantially the same as the first and second embodiments, except that the engaging holes 11b of the circuit board 1 are designed to be multi-hole, in the present embodiment, three holes are provided, and at least one electrode layer 12b is provided on the periphery of the engaging holes 11 b. The electrode layer 12b is electrically connected to the feeding line 13. In the present drawing, the electrode layer 12b is a roman numeral ii pattern.
The fixed section 23 of the chip antenna 2 is a plurality of terminals 23b, and a conductive layer 24b is disposed on the surface of the terminals 23 b. In the present embodiment, the number of the terminals 23b is 3 but is not limited to 3.
When the circuit board 1 is electrically connected to the chip antenna 2, the terminals 23b of the chip antenna 2 pass through the engagement holes 11b of the circuit board 1, so that the conductive layer 24b is electrically connected to the electrode layer 12b. The height of the chip antenna 2 can be vertically or horizontally fixed on the circuit board 1, and the chip antenna 2 is firmly fixed with the circuit board 1.
Please refer to fig. 9-10, which are exploded perspective views of an antenna structure and the perspective assembly of fig. 9 according to a fourth embodiment of the present invention. As shown in the figure: the present embodiment is substantially the same as the first, second and third embodiments, except that the engaging hole 11 of the circuit board 1 is designed as a side hole 11c, and at least one electrode layer 12c is disposed on the periphery of the side hole 11 c. The electrode layer 12c is electrically connected to the feeding line 13. In the drawing, the side hole 11c is U-shaped.
A concave portion 23c is disposed on one side of the fixed connection section 23 of the chip antenna 2, and a conductive layer 24c is disposed on the fixed connection portion 23 and the surface of the concave portion 23 c. In the present drawing, the recess 23c is L-shaped.
When the circuit board 1 is electrically connected to the chip antenna 2, the concave portion 23c of the chip antenna 2 penetrates through the circuit board 1 and is fixedly connected to the side hole 11c, so that the conductive layer 24c is electrically connected to the electrode layer 12c. The height of the chip antenna 2 can be vertically or horizontally fixed on the circuit board 1, and the chip antenna 2 is firmly fixed with the circuit board 1.
Please refer to fig. 11-13, which are exploded views of an antenna structure, a perspective assembly of fig. 11 and a side cross-sectional view of fig. 12 according to a fifth embodiment of the present invention. As shown in the figure: the present embodiment is substantially the same as the first, second, third and fourth embodiments, except that the engaging holes 11 of the circuit board 1 are designed as side holes 11d, and at least one electrode layer 12d is disposed on the periphery of the side holes 11 d. The electrode layer 12d is electrically connected to the feeding line 13. In the drawing, the side hole 11d has a U-shape.
A gap 23d is formed at one side of the fixed connection section 23 of the chip antenna 2, and a conductive layer 24d is formed on the periphery of the gap 23 d. In the drawing, the notch 23d is U-shaped, and the opening of the notch 23d and the chip antenna 2 are disposed in a mutually perpendicular relationship.
When the circuit board 1 is electrically connected to the chip antenna 2, the notch 23d of the chip antenna 2 penetrates through the circuit board 1 and is fixedly connected to the side hole 11d, so that the conductive layer 24d is electrically connected to the electrode layer 12d. The height of the chip antenna 2 vertically and fixedly connected to the circuit board 1 (the chip antenna 2 and the circuit board 1 are arranged in a mutually perpendicular relationship) can be reduced, and the chip antenna 2 is also fixedly connected to the circuit board 1 electrically.
Fig. 14-15 are exploded perspective views of an antenna structure according to a sixth embodiment of the present invention and the perspective assembly of fig. 14. As shown in the figure: the present embodiment is substantially the same as the first, second, third, fourth and fifth embodiments, except that the engaging holes 11 of the circuit board 1 are side holes 11e, and at least one electrode layer 12e is disposed on the periphery of the side holes 11 e. The electrode layer 12e is electrically connected to the feeding line 13. In the drawing, the side hole 11e is U-shaped.
A notch 23e is formed at one side of the fixed connection section 23 of the chip antenna 2, and a conductive layer 24e is formed on the periphery of the notch 23 e. In the drawing, the notch 23e is U-shaped, and the opening of the notch 23e is disposed coaxially with the chip antenna 2.
When the circuit board 1 is electrically connected to the chip antenna 2, the notch 23e of the chip antenna 2 penetrates through the circuit board 1 and is fixedly connected to the side hole 11e, so that the conductive layer 24e is electrically connected to the electrode layer 12e. The chip antenna 2 can be vertically or horizontally erected and fixedly connected to the circuit board 1, so that the height of the chip antenna 2 after being fixedly connected can be reduced, and meanwhile, the chip antenna 2 is fixedly connected with the circuit board 1 in an electrical mode.
Fig. 16-17 are exploded perspective views of an antenna structure according to a seventh embodiment of the present invention and the perspective assembly of fig. 16. As shown in the figure: this embodiment is substantially the same as the first, second, third, fourth, fifth and sixth embodiments, except that the joining hole 11 is located on the side of the circuit board 1 with a specific distance a from the side, and an electrode layer 12f is provided around the joining hole 11 and over the specific distance a. The electrode layer 12f is electrically connected to the feeding line 13.
A notch 23f is formed at one side of the fixed connection section 23 of the chip antenna 2, and a conductive layer 24f is formed on the periphery of the notch 23 f. In the drawing, the notch 23f is U-shaped, and the opening of the notch 23f is disposed in a perpendicular relationship with the chip antenna 2 body.
When the circuit board 1 is electrically connected to the chip antenna 2, the lower section 231f of the notch 23f of the chip antenna 2 passes through the circuit board 1 and is fixedly connected to the joint hole 11, and the notch 23f is bridged over a specific distance a of the circuit board 1, so that the conductive layer 24f is electrically connected to the electrode layer 12f. The chip antenna 2 can be vertically or horizontally erected and fixedly connected on the circuit board 1, so that the height of the chip antenna 2 after being fixedly connected can be reduced, and meanwhile, the chip antenna 2 is fixedly connected with the circuit board 1 electrically and stably.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that equivalent changes made by using the contents of the present specification or drawings are all included in the scope of the present invention, and it is obvious that the present invention is also covered by the claims.
Claims (24)
1. A method of bonding antenna structures, the method comprising:
a) The circuit board is provided with at least one joint hole penetrating through the circuit board, at least one electrode layer and a feed-in wire are formed on the periphery of the joint hole, and the feed-in wire is electrically connected with the electrode layer;
b) The chip antenna comprises a substrate, a wiring section is arranged on the substrate, a fixed connection section is arranged at one end of the wiring section, and a conductive layer is formed on the fixed connection section;
c) And penetrating the fixed connection section of the chip antenna through the joint hole of the circuit board to electrically and fixedly connect the conductive layer and the electrode layer, so that the chip antenna is vertically and fixedly connected on the circuit board.
2. The method of claim 1, wherein the chip antenna is vertically and vertically fixed on the circuit board.
3. The method of claim 1, wherein the chip antenna is vertically fixed to the circuit board in a horizontal manner.
4. The method of claim 1, wherein a ground layer is formed on the front or back surface, or both the front and back surfaces of the circuit board, and a clearance area is formed on the back surface of the circuit board, the clearance area corresponding to the electrode layer on the front surface of the circuit board.
5. The method of claim 1, wherein the bonding hole is formed inside the circuit board body or at a side of the circuit board body and a side hole is formed in a U shape.
6. The method of claim 1, wherein the coupling hole is a single hole type, a two hole type, or a three hole type.
7. The method of claim 1, wherein the chip antenna is made of ceramic material or glass fiber material.
8. The method of claim 1, wherein the wire segment is formed with a metal layer.
9. The method as claimed in claim 8, wherein the metal layer includes a plurality of straight bars disposed on the surface of the substrate and a plurality of conductive posts penetrating through the substrate, the plurality of conductive posts penetrating through the substrate and electrically connected to the plurality of straight bars disposed on the surface of the substrate, such that the plurality of straight bars and the plurality of conductive posts form a spiral winding on the substrate.
10. The method of claim 1, wherein the fixed section is a column, a plurality of pins, a plurality of terminals, a recess, or a U-shaped notch.
11. The method of claim 10, wherein the joint hole is located on a side of the circuit board with a specific distance from the side, the electrode layer is disposed around the joint hole and at the specific distance, and the electrode layer is electrically connected to the feed-in line.
12. The method of claim 11, wherein a lower portion of the U-shaped notch of the chip antenna passes through the circuit board and is fixed to the connecting hole, and the U-shaped notch is bridged over a specific distance of the circuit board to electrically connect the conductive layer and the electrode layer.
13. An antenna structure, comprising:
a circuit board, which is provided with at least one joint hole penetrating through the circuit board, the periphery of the joint hole is provided with at least one electrode layer and a feed-in wire, and the feed-in wire is electrically connected with the electrode layer;
a chip antenna, which has a substrate with a wiring section, wherein one end of the wiring section is provided with a fixed connection section, and the fixed connection section is formed with a conductive layer;
the fixed connection section of the chip antenna penetrates through the joint hole of the circuit board, so that the conductive layer is electrically and fixedly connected with the electrode layer, and the chip antenna is vertically and fixedly connected on the circuit board.
14. The antenna structure of claim 13, wherein the chip antenna is vertically and vertically fixed to the circuit board.
15. The antenna structure of claim 13, wherein the chip antenna is vertically fixed to the circuit board in a horizontal manner.
16. The antenna structure of claim 13 wherein a ground plane is formed on the front or back side, or both the front and back sides of the circuit board, and a clearance area is formed on the back side of the circuit board, the clearance area corresponding to the electrode layer on the front side of the circuit board.
17. The antenna structure according to claim 13, wherein the engagement hole is provided inside the circuit board body or at a side of the circuit board body and forms a side hole in a U-shape.
18. The antenna structure according to claim 13, characterized in that the engagement hole is a single hole, a two-hole or a three-hole.
19. The antenna structure of claim 13, wherein the chip antenna is a ceramic material or a fiberglass material.
20. The antenna structure of claim 13, wherein the wire segment has a metal layer disposed thereon.
21. The antenna structure of claim 20, wherein the metal layer includes a plurality of straight bars disposed on the surface of the substrate and a plurality of conductive pillars penetrating the substrate, the plurality of conductive pillars penetrating the substrate and electrically connected to the plurality of straight bars disposed on the surface of the substrate, such that the plurality of straight bars and the plurality of conductive pillars form a spiral winding disposed on the substrate.
22. The antenna structure of claim 13, wherein the fixed section is a column, a plurality of pins, a plurality of terminals, a recess, or a U-shaped notch.
23. The antenna structure of claim 22, wherein the joint hole is located on a side of the circuit board with a specific distance therebetween, and the electrode layer is disposed around the joint hole and at the specific distance and electrically connected to the feed-in line.
24. The antenna structure of claim 23, wherein a lower portion of the U-shaped notch of the chip antenna passes through the circuit board and is fixed to the connection hole, and the U-shaped notch is bridged over a specific distance of the circuit board to electrically connect the conductive layer and the electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110983588.7A CN115732895A (en) | 2021-08-25 | 2021-08-25 | Antenna structure and combination method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110983588.7A CN115732895A (en) | 2021-08-25 | 2021-08-25 | Antenna structure and combination method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115732895A true CN115732895A (en) | 2023-03-03 |
Family
ID=85289783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110983588.7A Pending CN115732895A (en) | 2021-08-25 | 2021-08-25 | Antenna structure and combination method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115732895A (en) |
-
2021
- 2021-08-25 CN CN202110983588.7A patent/CN115732895A/en active Pending
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