CN115732421A - Power module case, power module, and semiconductor module - Google Patents
Power module case, power module, and semiconductor module Download PDFInfo
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- CN115732421A CN115732421A CN202211491522.7A CN202211491522A CN115732421A CN 115732421 A CN115732421 A CN 115732421A CN 202211491522 A CN202211491522 A CN 202211491522A CN 115732421 A CN115732421 A CN 115732421A
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Abstract
The application provides a power module housing, a power module and a semiconductor assembly. The power module shell comprises a shell body and a plurality of PIN PINs arranged at intervals, wherein the shell body is provided with a groove, the bottom wall of the groove is provided with a plurality of openings, and the side wall of each opening is provided with a first fixing part; the PIN needle is including the first connecting portion, second fixed part and the second connecting portion that connect gradually, and the second fixed part corresponds spacing connection with first fixed part for the PIN needle is fixed on the casing, and one end of first connecting portion is located the one side of keeping away from the recess of the diapire of recess, and the second connecting portion are arranged in the recess. The PIN needle of this power module shell is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or the drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a power module shell, a power module and a semiconductor assembly.
Background
Power semiconductor modules are groups of semiconductor components used in power electronic circuits, typically for use in vehicles, solar energy and industrial applications, such as inverters and rectifiers. Power Semiconductor modules typically contain IGBT (Insulated Gate Bipolar Transistor) or MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) Semiconductor chips, DBC (Direct Bonding Copper ceramic substrate) substrates, PIN PINs and PIN bases for connection and package housings for protection, some also having a bottom heat sink for heat dissipation, an additional Semiconductor diode for overvoltage protection and NTC (Negative Temperature Coefficient) elements for overheating protection.
More power semiconductor module packaging structure commonly used, for example, EASY module, because the contact PIN of PIN needle is longer in the use, EASY because of the fracture takes place for the stress problem in the in-service use, in addition, the contact PIN upper end is fixed with driver circuit board after not installing with module relatively fixed, if module and driver circuit board take place relative displacement when taking place vibrations, lead to contact PIN and base to take place to drop the deformation easily.
The above information disclosed in this background section is only for enhancement of understanding of the background of the technology described herein and, therefore, certain information may be included in the background that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
Disclosure of Invention
The main objective of the present application is to provide a power module housing, a power module and a semiconductor component, so as to solve the problem that a PIN in the prior art is easily damaged when the power module vibrates or the power module and a driving circuit board are displaced relatively.
In order to achieve the above object, according to one aspect of the present application, there is provided a power module casing comprising a casing and a plurality of PIN PINs arranged at intervals, wherein the casing has a groove, a bottom wall of the groove has a plurality of openings therein, and a side wall of each of the openings is provided with a first fixing portion; the PIN needle is including the first connecting portion, second fixed part and the second connecting portion that connect gradually, the second fixed part with first fixed part corresponds spacing connection, makes the PIN needle is fixed on the casing, the one end of first connecting portion is located keeping away from of the diapire of recess one side of recess, the second connecting portion are located in the recess.
Furthermore, the limit connection mode of the first fixing part and the second fixing part comprises one of snap connection and tooth connection.
Further, under the condition that the first fixing part and the second fixing part are connected in a limiting connection mode through the buckle, the first fixing part and the second fixing part are both of a groove structure and a flange structure, and the first fixing part and the second fixing part are different in structure.
Further, under the condition that the first fixing part and the second fixing part are connected in a limiting connection mode of the teeth, the first fixing part and the second fixing part are both of a tooth structure and a counter-tooth structure, and the first fixing part and the second fixing part are different in structure.
Further, the tooth structure and the counter tooth structure each include a plurality of serrations each having a beveled edge and a horizontal edge.
Furthermore, the second connecting portion comprises an elastic portion and a horizontal portion which are sequentially connected, the elastic portion is connected with the second fixing portion, and the plane where the elastic portion is located is perpendicular to the plane where the horizontal portion is located.
Further, the structure of the elastic part includes a spring structure.
Further, the material of the elastic part at least comprises one of a metal material and a thermosetting material containing a continuous conductive medium.
Further, the structure of the first connection portion includes one of a fisheye structure, an H-shaped structure, a C-shaped structure, a pincer-shaped structure, and a straight needle structure.
Further, the shell is of a tetragonal structure.
According to another aspect of the present application, there is provided a power module comprising a metal-clad ceramic substrate, a chip, a power module case, a bonding wire, and a silicone gel, wherein the chip is located on a surface of the metal-clad ceramic substrate; the power module shell comprises any one of the power module shells, the power module shell is connected with the metal-clad ceramic substrate, so that a cavity is formed between a groove of a shell of the power module and the metal-clad ceramic substrate, the chip and a PIN needle of the power module shell are positioned in the cavity, and the PIN needle is connected with the metal-clad ceramic substrate; the bonding wire is electrically connected with the chip and the horizontal part of the PIN needle; the silicone gel is filled in the cavity.
According to yet another aspect of the present application, there is provided a semiconductor assembly including a power semiconductor module, a heat sink, and a driving circuit board, wherein the power semiconductor module includes the power semiconductor module; the radiator is in heat conduction connection with the power semiconductor module; the driving circuit board is electrically connected with the power semiconductor module.
According to the technical scheme, the power module shell comprises a shell body and a plurality of PIN needles arranged at intervals, wherein the shell body is provided with a groove, a plurality of openings are formed in the bottom wall of the groove, and a first fixing part is arranged on the side wall of each opening; the PIN needle is including the first connecting portion, second fixed part and the second connecting portion that connect gradually, the second fixed part with the first fixed part corresponds spacing connection, makes the PIN needle is fixed on the casing, the one end of first connecting portion is located keeping away from of the diapire of recess one side of recess, the second connecting portion are located in the recess. The PIN needle of this power module shell is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or the drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:
FIG. 1 illustrates a side view schematic diagram of a power module enclosure according to an exemplary embodiment of the present application;
FIG. 2 shows a schematic structural diagram of a PIN according to an embodiment of the present application;
FIG. 3 illustrates a structural schematic of a tooth structure and an anti-tooth structure according to an embodiment of the present application;
fig. 4 shows a schematic top view of a power module housing according to an embodiment of the application;
FIG. 5 illustrates a side view structural schematic of a power module according to another exemplary embodiment of the present application;
fig. 6 is an enlarged structural view of a circle portion in fig. 5.
Wherein the figures include the following reference numerals:
1. a housing; 2. a metal-coated ceramic substrate; 3. a PIN needle; 4. a first connection portion; 5. a chip; 6. welding wires; 7. a fixed connection part; 8. a notch; 9. a connecting portion; 10. a fixed part; 11. a ceramic layer; 12. a front metal layer; 13. a second fixed part; 14. a back metal layer; 15. a second connecting portion; 16. pouring a glue opening; 17. a horizontal portion; 18. an elastic portion; 19. a groove; 20. a through hole; 21. a tooth structure; 22. a reverse tooth structure; 23. bevel edge of tooth structure; 24. a horizontal side of the tooth structure; 25. bevel edge of inverted tooth structure; 26. a horizontal side of the inverted tooth structure; 27. a silicone gel; 28. a fixing hole; 29. a heat sink.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Also, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.
As described in the background art, in order to solve the problem that the PIN in the prior art is easily damaged when the power module vibrates or the power module and the driving circuit board are relatively displaced, a power module housing, a power module, and a semiconductor assembly are provided.
In an exemplary embodiment of the present application, a power module housing is provided, as shown in fig. 1, including a housing 1 and a plurality of PIN PINs 3 arranged at intervals, wherein the housing 1 has a groove 19, a bottom wall of the groove 19 has a plurality of openings, and a side wall of each of the openings is provided with a first fixing portion; the PIN 3 includes a first connecting portion 4, a second fixing portion 13 and a second connecting portion 15 connected in sequence, the second fixing portion 13 is connected to the first fixing portion in a corresponding limited manner, so that the PIN 3 is fixed on the housing 1, one end of the first connecting portion 4 is located on the side of the bottom wall of the recess 19 away from the recess 19, the second connecting portion 15 is located in the recess 19, and the first PIN from the left in fig. 1 is a cross-sectional view.
The power module shell comprises a shell and a plurality of PIN PINs arranged at intervals, wherein the shell is provided with a groove, the bottom wall of the groove is provided with a plurality of openings, and the side wall of each opening is provided with a first fixing part; the PIN needle comprises a first connecting portion, a second fixing portion and a second connecting portion, the first connecting portion, the second fixing portion and the first fixing portion are connected in a corresponding limiting mode, the PIN needle is fixed on the shell, one end of the first connecting portion is located on one side, away from the groove, of the bottom wall of the groove, and the second connecting portion is located in the groove. The PIN needle of this power module shell is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or the drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
In practical application, because during the preparation power module shell, with PIN needle snap-on the casing, only need put into the shell with DBC after pasting chip and routing operation during the preparation power module, then compress tightly, PIN needle on the shell can realize electrical connection with DBC, reduces the technology step, increases the reliability, in addition, does not need to weld PIN holder (PIN needle file) on the DBC, has promoted the degree of freedom of DBC design.
Specifically, the PIN plays a role in transmitting a control signal and a power signal, and the material of the PIN includes, but is not limited to, al, cu, ag, cuSn 4 And Al with Cu. The shell mainly plays a role in protection, and the material of the shell can be reinforced glass fiber PBT and PPS material.
In order to prevent the PIN from being removed from the housing, in another embodiment of the present application, the first fixing portion and the second fixing portion are connected in a limited manner by one of a snap connection and a tooth connection.
In practical applications, the limit connection manner of the first fixing portion and the second fixing portion is not limited to snap connection and tooth connection.
In another embodiment of the present invention, when the first fixing portion and the second fixing portion are connected by the snap connection, the first fixing portion and the second fixing portion are both of a groove structure and a flange structure, and the first fixing portion and the second fixing portion have different structures. Above-mentioned groove structure and flange structure form the locking structure jointly, prevent that the PIN needle from droing.
Specifically, as shown in fig. 2, the second fixing portion 13 of the PIN is a groove structure, and the corresponding first fixing portion flange structure in the housing may be, but not limited to, a rectangular parallelepiped, a semi-cylinder, etc., and the shape of the groove structure corresponds to the shape of the flange structure to form a locking structure, which can be designed by those skilled in the art according to actual needs.
In order to further prevent the PIN from being removed from the housing, in another embodiment of the present application, in a case where the first fixing portion and the second fixing portion are connected to each other in a limited manner by the teeth, the first fixing portion and the second fixing portion are both of a tooth structure and an inverted tooth structure, and the first fixing portion and the second fixing portion are different in structure.
In another embodiment of the present application, the tooth structure and the anti-tooth structure each include a plurality of teeth, each tooth having a hypotenuse and a horizontal side. Specifically, in the case of the above-described tooth connection, as shown in fig. 3, each tooth of the tooth structure 21 includes a tooth structure bevel edge 23 for insertion guidance and a tooth structure horizontal edge 24 for preventing the tooth structure 21 from coming out, and the counter-tooth structure 22 also includes a counter-tooth structure bevel edge 25 for insertion guidance and a counter-tooth structure horizontal edge 26 for preventing the tooth structure 21 from coming out, and the tooth structure 21 is inserted in such a direction that the tooth structure bevel edge 23 is opposed to the counter-tooth structure bevel edge 25 of the corresponding counter-tooth structure 22, if the tooth structure bevel edge 24 and the counter-tooth structure horizontal edge 26 are separated from each other upon completion of the insertion and locked against each other. In order to ensure stable insertion connection, the head of the tooth structure along the insertion direction is a guiding bevel edge, the other side is a horizontal edge, and the direction of the horizontal edge and the insertion direction can be more than 80 degrees. Under the condition of tooth connection, because the shell is formed by injection molding, the position of the embedded PIN needle which is placed in a mold can be simply adjusted during injection molding, and the shells corresponding to the metal-coated ceramic substrates with different metal layer thicknesses can be prepared by the same batch of materials.
In order to further improve the shock resistance of the PIN, in another embodiment of the present invention, as shown in fig. 2, the second connecting portion includes an elastic portion 18 and a horizontal portion 17 connected in sequence, the elastic portion 18 is connected to the second fixing portion 13, and a plane of the elastic portion 18 is perpendicular to a plane of the horizontal portion 17. Above-mentioned elastic part can play fine cushioning effect when power module takes place to shake owing to have better elasticity to can prevent that PIN needle is impaired when power module shakes, and above-mentioned horizontal part can increase the area of contact of PIN needle and DBC, make PIN needle and bonding wire and DBC have good contact.
Specifically, the horizontal portion may be, but not limited to, a square with a size of 2mm × 2mm, and may also be a square with other sizes or other shapes, such as a hexagon, a circle, etc., and only needs to satisfy that adjacent embedded PIN PINs are not directly interconnected, and that electrical requirements such as creepage distance are satisfied between embedded PIN PINs with different functions, and electrical connection is not affected.
In yet another embodiment of the present application, the structure of the elastic portion includes a spring structure. The spring structure has good elasticity, so that the PIN needle has the shockproof performance.
In another embodiment of the present application, the material of the elastic portion includes at least one of a metal material and a thermosetting material containing a continuous conductive medium.
Specifically, when the elastic portion is a spring structure, the elastic portion is not limited to an S-shaped planar spring and a Z-shaped planar spring, the spring structure may be a metal material, a thermosetting material containing a continuous conductive medium, or a spring structure made of other materials containing a soft metal wire inside, and those skilled in the art can select the spring structure according to actual needs.
In order to form a good connection between the first connection portion and the driving circuit board, in another embodiment of the present application, the structure of the first connection portion includes one of a fish eye structure, an H-shaped structure, a C-shaped structure, a pincer-shaped structure, and a straight needle structure.
In another embodiment of the present application, the housing has a square structure.
In practical application, as shown in fig. 4, the housing 1 is in a square shape, as shown in fig. 5, a fixing connection portion 7 may be provided on a corresponding side surface for fixing the power module, an opening is provided at a position corresponding to the bottom wall, a first fixing portion is provided on a side wall of the opening, and a corresponding second fixing portion of the PIN 3 is engaged with the first fixing portion to form a stable connection. In a specific embodiment, the housing can be designed to be split, and a snap or tooth structure is used between each part, so that the metal-coated ceramic substrate 2 can be fixed in the gap between each part of the housing, and pressure is applied to the embedded PIN 3, thereby ensuring the stability of crimping.
In another exemplary embodiment of the present application, a power module is provided, as shown in fig. 5 and 6, including a metal-coated ceramic substrate 2, a chip 5, a power module housing, a bonding wire 6, and a silicone gel 27, wherein the chip 5 is located on a surface of the metal-coated ceramic substrate 2; the power module housing comprises any one of the power module housings, the power module housing is connected with the metal-clad ceramic substrate 2, so that a cavity is formed between a groove of a shell of the power module and the metal-clad ceramic substrate 2, the chip 5 and the PIN 3 of the power module housing are positioned in the cavity, and the PIN 3 is connected with the metal-clad ceramic substrate 2; the bonding wires 6 electrically connect the chip 5 and the horizontal portion 17 of the PIN 3; the silicone gel 27 fills the cavity.
The power module comprises a metal-coated ceramic substrate, a chip, a power module shell, a bonding wire and silica gel, wherein the chip is positioned on the surface of the metal-coated ceramic substrate; the power module shell comprises any one of the power module shells, the power module shell is connected with the metal-clad ceramic substrate, so that a cavity is formed between a groove of a shell of the power module and the metal-clad ceramic substrate, the chip and a PIN needle of the power module shell are positioned in the cavity, and the PIN needle is connected with the metal-clad ceramic substrate; the bonding wire is electrically connected with the chip and the horizontal part of the PIN needle; the silicone gel is filled in the cavity. Above-mentioned power module's PIN needle is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
In practical application, the metal-coated ceramic substrate and the power module housing may be connected by using a dispensing means or by using a crimping method, the housing used in the crimping method is a split housing, and is composed of a plurality of portions, and the portions may be connected by using a buckle or tooth structure, but not limited to the buckle or tooth structure, and the metal-coated ceramic substrate is located in a gap formed by the portions of the housing during installation and is pressed and fixed by the structures of the portions of the housing. The power module shell can also comprise a groove for accommodating the metal-coated ceramic substrate, the size of the groove perpendicular to the thickness direction is the same as that of the metal-coated ceramic substrate, and the other directions are slightly larger than that of the metal-coated ceramic substrate, so that the allowance reserved for considering thermal expansion and cold contraction is realized.
Specifically, as shown in fig. 5 and 6, the cermet substrate 2 includes a front metal layer 12, a ceramic layer 11, and a back metal layer 14 stacked in this order, the front metal layer 12 and the back metal layer 14 may be made of bare copper or a plating layer having a special function on the surface, the plating layer may be Ni, au, or the like, the ceramic layer 11 may be Al 2 O 3 And SiN or the like, the metal-clad ceramic substrate 2 may be a copper-clad ceramic substrate DBC. The chip 5 is connected on the front metal layer 12 of the metal-coated ceramic substrate 2 through a reflow soldering or silver sintering method, the PIN PINs 3 are welded on the front metal layer 12 of the metal-coated ceramic substrate 2 through a pressure connection method, and the chip 5, the front metal layer 12 of the metal-coated ceramic substrate 2 and the PIN PINs 3 are interconnected through bonding wires 6. After the parts are assembled, a cavity for accommodating the metal-clad ceramic substrate 2 can be formed, so that the parts of the shell are meshed with the metal-clad ceramic substrate 2, the shell can be ensured to press the metal-clad ceramic substrate 2, the metal-clad ceramic substrate 2 applies pressure to the PIN PINs 3, the second connecting parts of the PIN PINs 3 correspondingly contract, and reliable electrical compression joint is ensured. The chip can be an IGBT,FRD, MOS tube, or one or combination of chips with other structures.
In a specific embodiment of the present application, as shown in fig. 4 and 5, the power module housing further includes a glue filling port 16 for filling silicone gel, and silicone gel 27 can be filled into the module through the glue filling port 16 to protect the chip 5, the front metal layer 12 on the metal-coated ceramic substrate 2, the bonding wires 6, and other structures, so as to achieve the effects of isolating water vapor and buffering stress. Four fixing holes 28 are symmetrically arranged around the housing 1 for inserting screws to fix the driving circuit board and the semiconductor when they are combined. As shown in fig. 4, 5 and 6, the power module case further includes a fixing connection portion 7, the fixing connection portion 7 may be made of stainless steel, the fixing connection portion 7 includes a connection portion 9 for fixedly connecting with the housing 1 and a fixing portion 10 for connecting with the heat sink 29, the connection portion 9 is fixed in the housing 1 during injection molding, and is used for stably connecting the housing 1 and the fixing connection portion 7, one end of the fixing connection portion 7, which is far away from the housing 1, is provided with a bent fixing portion 10, the fixing portion 10 is used for enhancing the structural strength of the fixing portion, the fixing connection portion is provided with a notch 8 and a through hole 20, and the through hole 20 may be a kidney-shaped hole or a circular hole and is connected with the heat sink 29 through a screw. In one embodiment, the bolt structure used on the power module housing is connected with the cooling body, so that the DBC is completely attached to the cooling body, efficient heat transfer is ensured, and in the case of specially designing the cooling body, the installation method can be changed from traditional bolt fixing to special connecting structure fixing.
In another specific embodiment of the application, the groove can be etched at the position, needing to be in compression joint with the PIN needle, on the metal-clad ceramic substrate, so that the accuracy of the compression joint position of the PIN needle is ensured, and the actual performance of the power module cannot be influenced by errors of the compression joint position.
Specifically, the mounting method of the power semiconductor module may include the steps of: firstly, fixing a connecting part on a power module shell and a radiator, and smearing heat-conducting silicone grease in the middle for filling gaps; the first connecting portion is inserted into the driving circuit board.
In another exemplary embodiment of the present application, a semiconductor assembly is provided, which includes a power semiconductor module, a heat sink, and a driving circuit board, wherein the power semiconductor module includes the power semiconductor module; the radiator is in heat conduction connection with the power semiconductor module; the driving circuit board is electrically connected with the power semiconductor module.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:
1) The power module shell comprises a shell and a plurality of PIN PINs arranged at intervals, wherein the shell is provided with a groove, the bottom wall of the groove is provided with a plurality of openings, and the side wall of each opening is provided with a first fixing part; the PIN needle comprises a first connecting portion, a second fixing portion and a second connecting portion, the first connecting portion, the second fixing portion and the first fixing portion are connected in a corresponding limiting mode, the PIN needle is fixed on the shell, one end of the first connecting portion is located on one side, away from the groove, of the bottom wall of the groove, and the second connecting portion is located in the groove. The PIN needle of this power module shell is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or the drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
2) The power module comprises a metal-coated ceramic substrate, a chip, a power module shell, a bonding wire and silica gel, wherein the chip is positioned on the surface of the metal-coated ceramic substrate; the power module housing comprises any one of the power module housings, the power module housing is connected with the metal-clad ceramic substrate, so that a cavity is formed between a groove of a shell of the power module and the metal-clad ceramic substrate, the chip and the PIN of the power module housing are positioned in the cavity, and the PIN is connected with the metal-clad ceramic substrate; the bonding wire is electrically connected with the chip and the horizontal part of the PIN needle; the silicone gel is filled in the cavity. Above-mentioned power module's PIN needle is fixed on the casing, and when power module takes place vibrations or power module and dirver circuit board take place relative displacement, the difficult fracture or drop of PIN needle, and then solved among the prior art PIN needle shake or power module and dirver circuit board take place the fragile problem when taking place relative displacement at power module.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (12)
1. A power module housing, comprising:
the shell is provided with a groove, the bottom wall of the groove is provided with a plurality of openings, and the side wall of each opening is provided with a first fixing part;
PIN needle that a plurality of intervals set up, the PIN needle is including first connecting portion, second fixed part and the second connecting portion that connects gradually, the second fixed part with first fixed part corresponds spacing connection, makes the PIN needle is fixed on the casing, the one end of first connecting portion is located keeping away from of the diapire of recess one side of recess, the second connecting portion are located in the recess.
2. The power module housing of claim 1, wherein the positive connection of the first and second securing portions comprises one of a snap-fit connection and a tooth connection.
3. The power module housing according to claim 2, wherein, in a case where the first fixing portion and the second fixing portion are connected in a limited manner by the snap connection, the first fixing portion and the second fixing portion are both of one of a groove structure and a flange structure, and the first fixing portion and the second fixing portion are different in structure.
4. The power module case according to claim 2, wherein in a case where the first fixing portion and the second fixing portion are connected in a limited manner by the teeth, the first fixing portion and the second fixing portion are each one of a tooth structure and an inverted tooth structure, and the first fixing portion is different from the second fixing portion in structure.
5. The power module enclosure of claim 4 wherein the tooth structure and the anti-tooth structure each include a plurality of serrations each having one beveled edge and one horizontal edge.
6. The power module housing according to claim 1, wherein the second connecting portion includes an elastic portion and a horizontal portion connected in sequence, the elastic portion is connected to the second fixing portion, and a plane of the elastic portion is perpendicular to a plane of the horizontal portion.
7. The power module enclosure of claim 6, wherein the structure of the resilient portion comprises a spring structure.
8. The power module casing of claim 6, wherein the material of the spring comprises at least one of a metallic material, a thermoset material containing a continuous conductive medium.
9. The power module casing of claim 1, wherein the structure of the first connection portion comprises one of a fisheye structure, an H-shaped structure, a C-shaped structure, a pincer-shaped structure, and a straight-pin structure.
10. The power module enclosure of claim 1 wherein the housing is a cuboid structure.
11. A power module, characterized in that
A metal-coated ceramic substrate;
a chip located on a surface of the metal-coated ceramic substrate;
a power module housing comprising the power module housing of any of claims 1-10, the power module housing being connected to the cermet coated substrate such that a cavity is formed between a recess of a housing of the power module and the cermet coated substrate and the chip and PIN PINs of the power module housing are located within the cavity and the PIN PINs are connected to the cermet coated substrate;
the bonding wire is electrically connected with the chip and the horizontal part of the PIN needle;
and a silicone gel filled in the cavity.
12. A semiconductor device, characterized in that
A power semiconductor module comprising the power semiconductor module of claim 11;
a heat sink in thermally conductive connection with the power semiconductor module;
and the driving circuit board is electrically connected with the power semiconductor module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211491522.7A CN115732421A (en) | 2022-11-25 | 2022-11-25 | Power module case, power module, and semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211491522.7A CN115732421A (en) | 2022-11-25 | 2022-11-25 | Power module case, power module, and semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115732421A true CN115732421A (en) | 2023-03-03 |
Family
ID=85298423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211491522.7A Pending CN115732421A (en) | 2022-11-25 | 2022-11-25 | Power module case, power module, and semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115732421A (en) |
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2022
- 2022-11-25 CN CN202211491522.7A patent/CN115732421A/en active Pending
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