CN115725185B - Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof - Google Patents
Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof Download PDFInfo
- Publication number
- CN115725185B CN115725185B CN202211640895.6A CN202211640895A CN115725185B CN 115725185 B CN115725185 B CN 115725185B CN 202211640895 A CN202211640895 A CN 202211640895A CN 115725185 B CN115725185 B CN 115725185B
- Authority
- CN
- China
- Prior art keywords
- aluminum powder
- thermal interface
- silicone oil
- liquid metal
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 78
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229920002545 silicone oil Polymers 0.000 claims abstract description 43
- 229910000846 In alloy Inorganic materials 0.000 claims abstract description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 21
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 21
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000001257 hydrogen Substances 0.000 claims abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 12
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 19
- 230000009969 flowable effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical group C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 9
- -1 polydimethylsiloxane Polymers 0.000 abstract description 7
- 238000012546 transfer Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 230000006835 compression Effects 0.000 abstract description 5
- 238000007906 compression Methods 0.000 abstract description 5
- 230000002349 favourable effect Effects 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000000945 filler Substances 0.000 description 12
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 241000219053 Rumex Species 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 229920005570 flexible polymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 210000004872 soft tissue Anatomy 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of thermal interface materials, in particular to a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof. The invention relates to a thermal interface material based on liquid metal bridging aluminum powder, which comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy. According to the invention, gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conduction performance of a thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
Description
Technical Field
The invention relates to the technical field of thermal interface materials, in particular to a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof.
Background
With the ever decreasing transistor size and increasing packing density, thermal management is becoming a bottleneck in the development of next generation electronics. An important component of thermal management is Thermal Interface Materials (TIMs). The thermal interface material connects two heterogeneous solid surfaces together, replacing the original poor thermal conductor on the two surfaces-air-to assist in heat transfer from one medium to the other. At present, flexible polymers are widely used in the field of thermal interface materials due to low processing cost, easy processing, excellent mechanical properties and the like. However, the flexible polymer has the defect of poor heat conduction performance, and cannot meet the heat dissipation of electronic components, so that scientific researchers blend high-heat-conduction fillers into the polymer, and the fillers are contacted with each other in a polymer matrix to form an effective heat conduction path, thereby realizing the improvement of the heat conduction performance of the thermal interface material. Scientists can realize high filling quantity in the polymer when pursuing high heat conduction, such as Wei Yu and the like, the siloxane matrix is filled with fillers with different particle sizes, and under the condition that the filler content is the same, gaps among large-size particles are filled by small-size particles, so that the fillers are stacked more tightly, the thermal resistance among the fillers is reduced, and the heat conduction performance of the thermal interface material is improved. However, the high filling amount of the filler can lead to the sacrifice of the flexibility of the thermal interface material and the deterioration of the processability, so that the high heat conduction and the good flexibility cannot be simultaneously combined, and a balance point is found between the heat conduction performance and the flexibility so as to meet the requirements of the current electronic equipment.
Thermal interface materials are one of the key materials of integrated circuit packages for reducing the thermal contact resistance between an electronic device and a heat sink, directly affecting the performance and lifetime of the electronic device. As electronic device power density and package size continue to increase, thermal interface materials not only require high thermal conductivity but also excellent compliance (high elongation at break and low elastic modulus) to reduce thermal contact resistance and mitigate stress-induced warp failure. However, thermal conductivity and compliance tend to be mutually constrained in thermal interface materials.
In order to improve the flexibility of the thermal interface material, ma Jiang and the like (MAQ, WANG Z, LIANG T, et al Unviling the role of filler surface energy in enhancing thermal conductivity and mechanical properties of thermal interface materials [ J ]. Composites Part A: applied Science and Manufacturing,2022, 157:106904.) are used for grafting silane coupling agents with different lengths on the surface of aluminum powder to reduce the surface energy of the aluminum, so that the dispersibility of aluminum filler in polydimethylsiloxane is improved, and the performances of elongation at break, heat conductivity and the like are improved. Hu Qinghua et al (HUQ, BAI X, ZHANG C, et al, ordered BN/Silicone Rubber Composite Thermal Interface Materials with High Out-of-Plane Thermal Conductivity and Flexibility [ J ]. Composites Part AApplied Science and Manufacturing,2021,152 (7428): 106681.) prepared a silicone rubber-based thermal interface material having high out-of-plane thermal conductivity and softness by combining shear orientation and layer-by-layer stacking methods by stacking uncured highly horizontally oriented BN/silicone rubber films layer-by-layer by utilizing the high temperature curing characteristics of the silicone rubber, forming tight chemical bonds between the films during curing, thereby improving compliance overall. Although the flexibility of the work is improved, the work cannot be greatly broken through.
Thus, in thermal interface materials, how to improve compliance while improving thermal conductivity remains a significant challenge.
Disclosure of Invention
In order to overcome the technical problems, the invention provides a thermal interface material based on liquid metal bridging aluminum powder and a preparation method thereof, wherein gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conduction performance of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
The invention provides a thermal interface material based on liquid metal bridging aluminum powder, which comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy;
the spherical aluminum powder is dispersed in the polydimethylsiloxane polymer matrix, and the gallium indium alloy forms a metal liquid bridge connection between the spherical aluminum powder and the spherical aluminum powder.
Preferably, the mass average molecular weight of the vinyl silicone oil is 180000-20000, and the hydrogen group content is 0.1-0.12 mmol/g.
Preferably, the molecular weight of the hydrogen-containing silicon oil is 8000-10000, and the vinyl content is 0.20-24 mmol/g.
Preferably, the mass average molecular weight of the vinyl silicone oil is 4000-5000, and the vinyl content is 0.32-0.34 mmol/g.
Preferably, the average particle diameter of the spherical aluminum powder is 11 to 13 μm.
Preferably, the mass ratio of Ga to In the gallium-indium alloy is 3:1.
The invention also provides a preparation method of the thermal interface material based on the liquid metal bridging aluminum powder, which comprises the following steps:
mixing the vinyl silicone oil, the hydrogen-containing silicone oil and the inhibitor, and then dispersing in an ultrasonic cleaner to obtain a silicone oil mixture;
placing the silicone oil mixture and the gallium indium alloy into a high-speed mixer for vacuum stirring to obtain a dispersion liquid of the gallium indium alloy and the silicone oil;
adding the spherical aluminum powder into the dispersion liquid, and carrying out vacuum stirring in a high-speed mixer to obtain uniform fluidity paste A;
dropwise adding the catalyst into the flowable paste A, and stirring in a high-speed mixer in vacuum to obtain uniform flowable paste B;
and (3) rolling and curing the flowable paste B to obtain a heat conduction gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
Preferably, in the ultrasonic cleaner dispersing, the dispersing time is 30min.
Preferably, the conditions of vacuum stirring in the high-speed mixer are as follows: vacuum degree is 30bar or below, temperature is 25deg.C, and rotation speed is 1500r/min;
preparing a dispersion liquid of the gallium indium alloy and the silicone oil, wherein the stirring time is 5min;
in the preparation of the flowable pastes A and B, the stirring time was 2min.
Preferably, in the post-calendering curing of the flowable paste B, the curing conditions are: curing for 2h at 150 ℃.
Compared with the prior art, the invention has the beneficial effects that:
according to the thermal interface material based on the liquid metal bridging aluminum powder, gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system to serve as auxiliary filler, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum and spherical aluminum in a liquid bridge mode, so that interface thermal resistance is reduced, and the heat conducting property of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved. The thermal interface material based on the liquid metal bridging aluminum powder has a heat conductivity coefficient as high as 4.25W m -1 K -1 The elongation at break is as high as 164.9%, the Young modulus is only 174kPa, the thermal interface material has excellent flexibility, is similar to the mechanical property of biological soft tissue, and can be used as a thermal interface material for high-power and large-size chips (such as CoWoS wafer level package).
The preparation method of the thermal interface material based on the liquid metal bridging aluminum powder has the advantages of simple process and easy realization.
Drawings
Fig. 1 is a schematic structural diagram of a thermal interface material based on liquid metal bridging aluminum powder of the present invention;
fig. 2 is an EDS image of a cross section of a thermal interface material based on liquid metal bridged aluminum powder prepared in example 1 of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description. The following description is of the preferred embodiments of the present invention, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the principles of the embodiments of the present invention, and these modifications and variations are also considered to be within the scope of the invention.
The invention provides a thermal interface material based on liquid metal bridging aluminum powder, which comprises the following raw material components: 8.54 parts of vinyl silicone oil, 1.44 parts of hydrogen-containing silicone oil, 0.003 part of catalyst, 0.01 part of inhibitor, 60-90 parts of spherical aluminum powder and 0.01-30 parts of gallium-indium alloy;
the spherical aluminum powder is dispersed in the polydimethylsiloxane polymer matrix, and the gallium indium alloy forms a metal liquid bridge connection between the spherical aluminum powder and the spherical aluminum powder.
The structure of the thermal interface material based on the liquid metal bridging aluminum powder is shown in figure 1, gallium-based liquid metal is introduced as an auxiliary filler, the fluidity of the liquid metal is exerted, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum powder and spherical aluminum powder in a liquid bridge mode, so that the interface thermal resistance is reduced, and the heat conduction performance of the thermal interface material is improved. Meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved.
Wherein the mass average molecular weight of the vinyl silicone oil is preferably 180000-20000, and the hydrogen group content is preferably 0.1-0.12 mmol/g. The average molecular weight of the hydrogen-containing silicon oil is preferably 8000-10000, and the vinyl content is preferably 0.20-24 mmol/g. The mass average molecular weight of the vinyl silicone oil is preferably 4000-5000, and the vinyl content is preferably 0.32-0.34 mmol/g. The average particle diameter of the spherical aluminum powder is preferably 11 to 13 μm. The mass ratio of Ga to In the gallium indium alloy is preferably 3:1.
The invention also provides a preparation method of the thermal interface material based on the liquid metal bridging aluminum powder, which comprises the following steps:
mixing the vinyl silicone oil, the hydrogen-containing silicone oil and the inhibitor, and then dispersing in an ultrasonic cleaner to obtain a silicone oil mixture;
placing the silicone oil mixture and the gallium indium alloy into a high-speed mixer for vacuum stirring to obtain a dispersion liquid of the gallium indium alloy and the silicone oil;
adding the spherical aluminum powder into the dispersion liquid, and carrying out vacuum stirring in a high-speed mixer to obtain uniform fluidity paste A;
dropwise adding the catalyst into the flowable paste A, and stirring in a high-speed mixer in vacuum to obtain uniform flowable paste B;
and (3) rolling and curing the flowable paste B to obtain a heat conduction gel, namely the thermal interface material based on the liquid metal bridging aluminum powder.
In the ultrasonic process, the oxide film is broken and dispersed into droplets with the diameter of micrometers, and in the high-speed stirring process with aluminum powder, capillary force is formed between the oxide film and the aluminum powder, and the aluminum powder distributed in islands is bridged by the Liquid Metal (LM).
In the ultrasonic cleaner dispersing, the dispersing time is preferably 30min. The conditions of vacuum stirring in the high-speed mixer are all preferably as follows: vacuum degree is 30bar or below, temperature is 25deg.C, and rotation speed is 1500r/min; preparing a dispersion liquid of the gallium indium alloy and the silicone oil, wherein the stirring time is 5min; in the preparation of the flowable pastes A and B, the stirring time was 2min. In the post-calendering curing of the flowable paste B, the curing conditions are preferably: curing for 2h at 150 ℃.
Example 1
The preparation process of the thermal interface material based on the liquid metal bridging aluminum powder comprises the following steps:
vinyl silicone oil (RH-100 and RH-500 of Zhejiang Rumex silicone New material Co., ltd., mass ratio of 1:4), hydrogen-containing silicone oil (RH-86 and RH-DH07 of Zhejiang Rumex silicone New material Co., ltd., mass ratio of 3:4) and inhibitor (2-phenyl-3-butyn-2-ol) are mixed according to a ratio of 1000:169:1, weighing and placing the mixture in a container according to the mass ratio, and dispersing the mixture in an ultrasonic cleaner for 30min to obtain a silicone oil mixture;
9.997g of the silicone oil mixture and 10g of gallium indium alloy are placed in a high-speed mixer, and after vacuumizing, the mixture is stirred for 5min at 1500r/min, so as to obtain a dispersion liquid of the gallium indium alloy and the silicone oil;
adding 80g of spherical aluminum powder into the dispersion liquid of the gallium indium alloy and the silicone oil, mixing, and stirring in a high-speed mixer at 1500r/min for 2min under vacuum to obtain uniform fluidity paste A;
dropwise adding 0.003g of catalyst into the fluidity paste A, and stirring at 1500r/min in a high-speed mixer for 2min to obtain uniform fluidity paste B;
and (3) after the flowable paste B is rolled, curing for 2 hours at 150 ℃ to obtain a heat conducting gel, namely the heat interface material based on the liquid metal bridging aluminum powder.
As shown in fig. 2, in the EDS image of the cross section of the thermal interface material based on the liquid metal bridged aluminum powder prepared in this embodiment, it can be seen from the figure that the Liquid Metal (LM) not only forms a bridge structure between the aluminum powder, but also forms a bridge structure between the PDMS, and the aluminum powder and the Liquid Metal (LM) are not agglomerated in the PDMS matrix, and are uniformly dispersed, which is beneficial to improving the thermal conductivity and the flexibility of the thermal interface material.
Example 2
The preparation process differs from that in example 1 in the thermal interface material based on liquid metal bridging aluminum powder: the mass of the gallium-indium alloy is 20g, and the mass of the spherical aluminum powder is 70g.
Example 3
The preparation process differs from that in example 1 in the thermal interface material based on liquid metal bridging aluminum powder: the mass of the gallium-indium alloy is 30g, and the mass of the spherical aluminum powder is 60g.
Comparative example 1
Vinyl silicone oil (RH-100 and RH-500 of Zhejiang Rumex silicone New material Co., ltd., mass ratio of 1:4), hydrogen-containing silicone oil (RH-86 and RH-DH07 of Zhejiang Rumex silicone New material Co., ltd., mass ratio of 3:4) and inhibitor (2-phenyl-3-butyn-2-ol) are mixed according to a ratio of 1000:169:1, weighing and placing the mixture in a container according to the mass ratio, and dispersing the mixture in an ultrasonic cleaner for 30min to obtain a silicone oil mixture;
adding 90g of spherical aluminum powder into 9.997g of the silicone oil mixture, mixing, and stirring in a high-speed mixer at 1500r/min for 2min under vacuum to obtain uniform flowable paste A;
dropwise adding 0.003g of catalyst into the fluidity paste A, and stirring at 1500r/min in a high-speed mixer for 2min to obtain uniform fluidity paste B;
and (3) compacting the flowable paste B, and then curing the paste at 150 ℃ for 2 hours to obtain the thermal interface material.
The thermal conductivity test and the mechanical property test were performed on the thermal interface material based on the liquid metal bridging aluminum powder prepared in examples 1 to 3 and the thermal interface material prepared in comparative example 1.
And (3) testing heat conduction performance:
the standard test method for measuring the heat conduction in the vertical direction by a steady state method comprises the following specific steps of: the thermal resistance R of three thermal interface composite materials with different thicknesses is respectively tested at the temperature of 80 ℃ and the pressure of 10psi Total And the relationship between the thermal interface material and the thickness BLT is obtained, and the obtained data is subjected to linear fitting, wherein the slope is the heat conductivity coefficient kappa of the thermal interface material TIM The intercept with the y axis is the contact thermal resistance R Contact ：
R Total ＝R Contact +BLT/κ TIM
Mechanical property test:
and testing the breaking energy of the thermal interface material by using an Shimadzu universal electronic tester AGX-10 kNVD. Test conditions and parameters: the temperature was 25℃and the stretching speed was 10mm/min. The test procedure was to cut the thermal interface material into dumbbell-shaped samples 50mm long and 4mm wide.
The thermal conductivity, thermal contact resistance and breaking energy test results of the thermal interface materials of examples 1 to 3 and comparative example 1 were obtained according to the above-described method test method and are shown in table 1.
Table 1 results of thermal conductivity, thermal contact resistance, and breaking energy tests for the thermal interface materials of examples 1-3, comparative example 1
Compared with the prior art, the invention has the beneficial effects that:
the invention is based on liquid stateThe metal bridging aluminum powder thermal interface material is characterized in that gallium-based liquid metal is introduced into a polydimethylsiloxane/aluminum system to serve as auxiliary filler, and a channel which is favorable for phonon heat transfer is erected between spherical aluminum in a liquid bridge mode, so that interface thermal resistance is reduced, and the heat conducting property of the thermal interface material is improved; meanwhile, the liquid metal is used as a connecting agent, so that the material has certain compression deformation capacity, and the flexibility of the thermal interface material is improved. The thermal interface material based on the liquid metal bridging aluminum powder has a heat conductivity coefficient as high as 4.25W m -1 K -1 The elongation at break is as high as 164.9%, the Young modulus is only 174kPa, the thermal interface material has excellent flexibility, is similar to the mechanical property of biological soft tissue, and can be used as a thermal interface material for high-power and large-size chips (such as CoWoS wafer level package).
The preparation method of the thermal interface material based on the liquid metal bridging aluminum powder has the advantages of simple process and easy realization.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (5)
1. The preparation method of the thermal interface material based on the liquid metal bridging aluminum powder is characterized by comprising the following steps of:
mixing vinyl silicone oil, hydrogen-containing silicone oil and inhibitor according to the weight ratio of 1000:169:1, weighing and placing the mixture in a container according to the mass ratio, and dispersing the mixture in an ultrasonic cleaner for 30min to obtain a silicone oil mixture;
9.997g of the silicone oil mixture and 30g of gallium-indium alloy are placed in a high-speed mixer, and after vacuumizing, the mixture is stirred for 5min at 1500r/min, so as to obtain a dispersion liquid of the gallium-indium alloy and the silicone oil;
adding 60g of spherical aluminum powder into the dispersion liquid of the gallium indium alloy and the silicone oil, mixing, and stirring in a high-speed mixer at 1500r/min for 2min under vacuum to obtain uniform fluidity paste A;
dropwise adding 0.003g of catalyst into the fluidity paste A, and stirring at 1500r/min in a high-speed mixer for 2min to obtain uniform fluidity paste B;
the flowable paste B is rolled and then solidified for 2 hours at 150 ℃ to obtain a heat conducting gel, namely a heat interface material based on liquid metal bridging aluminum powder;
wherein the vinyl silicone oil is selected from RH-100 and RH-500 of Zhejiang Runner organic silicon new materials Co., ltd, and the mass ratio is 1:4, a step of;
the hydrogen-containing silicone oil is selected from RH-86 and RH-DH07 of Zhejiang Runner organic silicon new material Co., ltd, and the mass ratio is 3:4, a step of;
the inhibitor is 2-phenyl-3-butyn-2-ol;
the average particle diameter of the spherical aluminum powder is 11-13 mu m;
the mass ratio of Ga to In the gallium indium alloy is 3:1.
2. The method for preparing the thermal interface material based on the liquid metal bridging aluminum powder according to claim 1, wherein the mass average molecular weight of the vinyl silicone oil is 180000-20000 and the hydrogen group content is 0.1-0.12 mmol/g.
3. The method for preparing a thermal interface material based on liquid metal bridging aluminum powder according to claim 1, wherein the hydrogen-containing silicone oil has a mass average molecular weight of 8000-10000 and a vinyl content of 0.20-24 mmol/g.
4. The method for preparing a thermal interface material based on liquid metal bridging aluminum powder according to claim 1, wherein the vinyl silicone oil has a mass average molecular weight of 4000-5000 and a vinyl content of 0.32-0.34 mmol/g.
5. The method for preparing the thermal interface material based on the liquid metal bridging aluminum powder according to claim 1, wherein the conditions of vacuum stirring in the high-speed mixer are as follows: the vacuum degree was 30bar and below, and the temperature was 25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211640895.6A CN115725185B (en) | 2022-12-20 | 2022-12-20 | Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211640895.6A CN115725185B (en) | 2022-12-20 | 2022-12-20 | Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115725185A CN115725185A (en) | 2023-03-03 |
| CN115725185B true CN115725185B (en) | 2024-03-15 |
Family
ID=85301794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211640895.6A Active CN115725185B (en) | 2022-12-20 | 2022-12-20 | Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115725185B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116891729B (en) * | 2023-07-13 | 2024-04-02 | 中国农业大学 | Liquid metal thermal interface material with elasticity and viscosity and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6339120B1 (en) * | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| CN107488436A (en) * | 2017-09-20 | 2017-12-19 | 天津沃尔提莫新材料技术股份有限公司 | A kind of two-component heat-conducting silica gel sheet of the filler containing liquid metal for conducting heat |
| CN111070833A (en) * | 2019-12-10 | 2020-04-28 | 深圳先进技术研究院 | High-thermal-conductivity electromagnetic shielding composite material and preparation method thereof |
| CN113337125A (en) * | 2021-05-31 | 2021-09-03 | 中国科学院深圳先进技术研究院 | Polydimethylsiloxane-based liquid metal bridged spherical boron nitride heat-conducting composite material and preparation method and application thereof |
| CN113717701A (en) * | 2021-07-26 | 2021-11-30 | 四川大学 | Modified liquid metal composite material capable of being directly formed and preparation method thereof |
| CN113913018A (en) * | 2021-11-30 | 2022-01-11 | 四川大学 | High-fluidity insulating and heat-conducting silicone grease and preparation method thereof |
| CN114410119A (en) * | 2022-02-14 | 2022-04-29 | 深圳先进电子材料国际创新研究院 | Flexible high-thermal-conductivity silicone rubber composite material and preparation method and application thereof |
| CN114539781A (en) * | 2020-11-25 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Heat-conducting gel and preparation method thereof |
| CN115403931A (en) * | 2022-10-09 | 2022-11-29 | 清华大学 | Flexible heat conducting pad and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220363865A1 (en) * | 2021-02-25 | 2022-11-17 | Board Of Regents Of The University Of Nebraska | Lightweight liquid metal embedded elastomer composite |
-
2022
- 2022-12-20 CN CN202211640895.6A patent/CN115725185B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6339120B1 (en) * | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| CN107488436A (en) * | 2017-09-20 | 2017-12-19 | 天津沃尔提莫新材料技术股份有限公司 | A kind of two-component heat-conducting silica gel sheet of the filler containing liquid metal for conducting heat |
| CN111070833A (en) * | 2019-12-10 | 2020-04-28 | 深圳先进技术研究院 | High-thermal-conductivity electromagnetic shielding composite material and preparation method thereof |
| CN114539781A (en) * | 2020-11-25 | 2022-05-27 | 深圳先进电子材料国际创新研究院 | Heat-conducting gel and preparation method thereof |
| CN113337125A (en) * | 2021-05-31 | 2021-09-03 | 中国科学院深圳先进技术研究院 | Polydimethylsiloxane-based liquid metal bridged spherical boron nitride heat-conducting composite material and preparation method and application thereof |
| CN113717701A (en) * | 2021-07-26 | 2021-11-30 | 四川大学 | Modified liquid metal composite material capable of being directly formed and preparation method thereof |
| CN113913018A (en) * | 2021-11-30 | 2022-01-11 | 四川大学 | High-fluidity insulating and heat-conducting silicone grease and preparation method thereof |
| CN114410119A (en) * | 2022-02-14 | 2022-04-29 | 深圳先进电子材料国际创新研究院 | Flexible high-thermal-conductivity silicone rubber composite material and preparation method and application thereof |
| CN115403931A (en) * | 2022-10-09 | 2022-11-29 | 清华大学 | Flexible heat conducting pad and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| High thermal conductivity in soft elastomers with elongated liquid metal inclusions;Michael D. Bartlett 等;PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA;第114卷(第9期);第2143-2148页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115725185A (en) | 2023-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6597575B1 (en) | Electronic packages having good reliability comprising low modulus thermal interface materials | |
| US7060747B2 (en) | Chain extension for thermal materials | |
| US6469379B1 (en) | Chain extension for thermal materials | |
| EP1754235A2 (en) | Thermally conductive compositions and methods of making thereof | |
| Li et al. | Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management | |
| KR20120092505A (en) | Semiconductor-encapsulating liquid epoxy resin composition and semiconductor device | |
| CN115725185B (en) | Thermal interface material based on liquid metal bridging aluminum powder and preparation method thereof | |
| JP3794349B2 (en) | Liquid epoxy resin composition for sealing and semiconductor device | |
| Li et al. | Liquid bridge: liquid metal bridging spherical BN largely enhances the thermal conductivity and mechanical properties of thermal interface materials | |
| CN112375340B (en) | Circuit laminated film for wafer level packaging sealing, and preparation method and application thereof | |
| CN113667325A (en) | Preparation method of modified inorganic filler, modified inorganic filler and heat-conducting gel | |
| JP2016037529A (en) | Liquid epoxy resin composition and heat sink, and adhesive for stiffener | |
| CN115746799A (en) | Preparation method of single-component heat-conducting gel with high heat conductivity | |
| JPH10158366A (en) | Liquid injection sealing underfill material | |
| CN114410119A (en) | Flexible high-thermal-conductivity silicone rubber composite material and preparation method and application thereof | |
| Komori et al. | Development trend of epoxy molding compound for encapsulating semiconductor chips | |
| CN112457808A (en) | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method | |
| Kohli et al. | Advanced thermal interface materials for enhanced flip chip BGA | |
| US6310120B1 (en) | Flip-chip type semiconductor device sealing material | |
| Rector et al. | On the performance of epoxy molding compounds for flip chip transfer molding encapsulation | |
| US20050152773A1 (en) | Liquid epoxy resin composition and semiconductor device | |
| CN117925182B (en) | High-heat-conductivity filling adhesive for packaging semiconductor flip chip | |
| KR100312237B1 (en) | Electronic device modules using a thermally conductive compliant sheet | |
| WO2024150753A1 (en) | Clay-like thermally conductive composition | |
| JPH1160914A (en) | Epoxy resin composition and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |