CN115717057A - Single-phase immersed cooling medium, cooling system and cooling method - Google Patents
Single-phase immersed cooling medium, cooling system and cooling method Download PDFInfo
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- CN115717057A CN115717057A CN202211406113.2A CN202211406113A CN115717057A CN 115717057 A CN115717057 A CN 115717057A CN 202211406113 A CN202211406113 A CN 202211406113A CN 115717057 A CN115717057 A CN 115717057A
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Abstract
The invention provides a single-phase immersed cooling medium, a cooling system and a cooling method, wherein the single-phase immersed cooling medium comprises a lower-layer liquid refrigerant consisting of fluorocarbon substances and an upper-layer isolation layer consisting of silicone oil substances. The lower-layer liquid refrigerant plays a role in heat transfer, the heating component is immersed in the lower-layer liquid refrigerant for cooling, and the lower-layer liquid refrigerant consists of fluorocarbon substances, and the main component of the lower-layer liquid refrigerant is hexafluoropropylene trimer; the upper isolation layer of the cooling medium has the main functions of avoiding the volatilization, oxidation and degradation of the lower liquid refrigerant, effectively reducing the loss rate of the cooling medium and reducing the use cost of the cooling medium.
Description
[ technical field ] A method for producing a semiconductor device
The invention belongs to the technical field of liquid cooling, and particularly relates to a single-phase immersion type cooling technology.
[ background of the invention ]
In the times of artificial intelligence and 5G, along with the scale of a data center becoming larger and larger, the deployed racks become denser and the requirements on server loads become more severe, and the traditional air cooling technology cannot meet the refrigeration requirements of the data center. To address this problem, many enterprises have begun to employ submerged liquid cooling technology in their data centers.
Immersion liquid cooling is a typical direct contact type liquid cooling, in which a heat-generating electronic component is immersed in a refrigerant (cooling liquid) and heat is removed by liquid heat exchange. Immersion liquid cooling is because heating element and the all-round direct contact of refrigerant, and the radiating efficiency compares in traditional radiating mode: air cooling and water cooling, its radiating efficiency is higher, and relative to cold plate or spraying liquid cooling, its noise is lower.
At present, an immersed liquid cooling system is mainly divided into a single-phase system and a two-phase system, wherein a cooling medium of the single-phase system does not undergo phase change, and heat of a heating component is taken away through flow circulation; the cooling medium of the two-phase system absorbs heat generated by the heating components in the heat exchange process, and is converted from a liquid state to a gas state, so that the heat is taken away, and then the heat is condensed and refluxed by the condenser and is circulated. Two-phase systems have a relatively high use cost for current applications due to the high demand for cooling medium due to the phase change involved in the cooling process. And because evaporation and condensation are needed in the cooling process, the sealing performance of the whole cooling system must be better, otherwise, the loss of the cooling medium is excessive, and the application cost is further increased. In addition, there are reports that damage to electronic components by cooling media may occur.
Therefore, a single-phase immersion type liquid cooling system which is lower in cost, simpler to operate and lower in requirement on equipment is continuously developed as a cooling system of a mainstream of a future data center. In the past, the immersed cooling liquid mainly comprises inert liquid such as mineral oil, kerosene, silicon oil and the like for conducting heat, but the fluidity of the substances is poor, the heat dissipation effect is poor, the mineral oil, the kerosene and the like are flammable, and once sparks are generated on equipment, combustion and explosion are easy to occur. At present, fluorocarbon compounds, mainly fluorine alkane and perfluoropolyether compounds, are mainly used as cooling agents in the mainstream, and the cooling agent has the advantages of low toxicity, high chemical stability, excellent dielectric property and the like. However, the GWP value of the compound is high, the greenhouse effect is serious, and finally the compound is inevitable to face a phase-out result. Therefore, the cooling liquid for cooling the integrated chip circuit board, which has better fluidity, good compatibility with electronic components, environmental friendliness and high-efficiency heat dissipation, is very important to obtain.
Patent CN113717699A discloses a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersion cooling system, wherein the technical scheme is that a perfluoropolyether substance is used as a main material, and a flow promoter, trifluoropropylmethyl silicone oil and hexafluoropropylene trimer are added to form the silicon-containing liquid coolant.
Patent CN109072054A discloses a technical scheme of using hexafluoropropylene trimer as liquid cooling heat transfer fluid, the hexafluoropropylene trimer has the advantages of low GWP value, low viscosity and the like, and can solve the problems, but because the boiling point is low, the loss rate is high in the using process, and the using cost is too high.
In summary, the main problems of the single-phase immersion cooling medium at present are the contradiction between the cooling medium heat dissipation, environmental friendliness and application cost. The fluorine alkane and perfluoropolyether compounds have high boiling point and low loss rate, but generally have high viscosity, are not easy to circularly take away heat generated by heating elements, and have serious greenhouse effect. And the use of the low-boiling-point fluorocarbon compound has good fluidity and excellent heat dissipation performance, but the loss rate is high in the application process, and the application cost is high due to the fact that a cooling medium needs to be continuously supplemented.
[ summary of the invention ]
Aiming at the defects in the prior art, the invention aims to provide a single-phase immersed cooling medium, which can effectively solve the defects of poor fluidity, high GWP value and high use loss of the traditional cooling medium.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a single-phase immersed cooling medium, which comprises a lower-layer liquid refrigerant consisting of fluorocarbon substances and an upper-layer isolation layer consisting of silicone oil substances.
Preferably, the silicone oil-type substance has the following structure:
wherein R is 1 、R 2 Is H or C 1 -C 20 Alkyl or aralkyl groups of (a).
Preferably, the boiling point of the silicone oil substances is more than or equal to 120 ℃, and the viscosity of the silicone oil substances is 5-500cP at 25 ℃.
Preferably, the silicone oil is any one or a mixture of any two or more of dimethyl silicone oil, ethyl silicone oil, phenyl silicone oil, methylphenyl silicone oil, methyl ethyl silicone oil, methyl propyl silicone oil, methyl butyl silicone oil, methyl amyl silicone oil, methyl hexyl silicone oil, methyl dodecyl silicone oil and methyl hydrogen-containing silicone oil.
Preferably, the thickness of the upper isolation layer is more than or equal to 1mm, and the proportion of the upper isolation layer in the total height of the cooling medium is less than or equal to 10%.
Preferably, the fluorocarbon substance comprises the following components in parts by weight: 90-100 parts of hexafluoropropylene trimer; 0-10 parts of perfluoropolyether.
Preferably, the boiling point of the fluorocarbon substance is more than or equal to 150 ℃, and the viscosity of the fluorocarbon substance is 10-10000cP at 25 ℃.
In another aspect, the present invention further provides a cooling system, which includes a cooling medium storage tank and a cooling medium stored in the cooling medium storage tank, wherein the cooling medium is the single-phase immersed cooling medium, and the heat generating component is disposed in the cooling medium storage tank and immersed in the cooling medium for cooling.
Furthermore, the cooling system also comprises a liquid coolant circulating pump and a heat exchange device which are connected with the cooling medium storage tank.
In addition, the invention also provides a cooling method, the cooling system is adopted to cool the heating part, the heating part is immersed in the single-phase immersed cooling medium for cooling, and the lower-layer liquid refrigerant exchanges heat with the heat exchange device.
According to the technical scheme, the lower-layer liquid refrigerant plays a role in heat transfer, the heating component is immersed in the lower-layer liquid refrigerant for cooling, and the lower-layer liquid refrigerant consists of fluorocarbon substances, and the main component of the lower-layer liquid refrigerant is hexafluoropropylene trimer; the upper isolation layer of the cooling medium has the main functions of avoiding the volatilization, oxidation and degradation of the lower liquid refrigerant, effectively reducing the loss rate of the cooling medium and reducing the use cost of the cooling medium.
Therefore, compared with the prior art, the invention has the following beneficial effects:
1. compared with the traditional fluoroalkane and perfluoropolyether compound cooling liquid, the cooling medium has higher fluidity and lower GWP value, and the cooling system using the cooling medium has higher heat dissipation efficiency.
2. Compared with the method of simply using hexafluoropropylene trimer as cooling liquid, the cooling medium has the advantages of low volatility, low use loss rate and low application cost.
These features and advantages of the present invention will be disclosed in more detail in the following detailed description of the invention.
[ description of the drawings ]
FIG. 1 is a schematic diagram illustrating the operation of a single-phase immersion cooling system according to an embodiment of the present invention.
In the figure, 1-a heat generating component, 2-a lower layer liquid refrigerant, 3-an upper layer isolation layer, 4-a liquid refrigerant circulating pump and 5-a heat exchange device.
[ detailed description ] A
The technical solutions of the present invention are explained and illustrated below with reference to the following embodiments of the present invention, but the following embodiments are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative effort belong to the protection scope of the present invention.
The main problems of the single-phase immersed cooling medium at present are the contradiction between the cooling medium heat dissipation, the environmental friendliness and the application cost. Therefore, the embodiment of the invention provides a single-phase immersed cooling medium, which is of course required to be arranged in a cooling medium storage tank because the cooling medium is in a liquid state as shown in fig. 1, and comprises an upper isolation layer 3 composed of silicon oil substances and a lower liquid refrigerant 2 composed of fluorocarbon substances.
Wherein, the silicone oil substance is one substance or a mixture of a plurality of substances with the following structures:
wherein R is 1 、R 2 Is H or C 1 -C 20 Alkyl or aryl radicals of (a).
Specifically, the silicone oil substance suitable for the upper insulation layer of the cooling medium can be any one of dimethyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl ethyl silicone oil, methyl propyl silicone oil, methyl butyl silicone oil, methyl amyl silicone oil, methyl hexyl silicone oil, methyl dodecyl silicone oil and methyl hydrogen-containing silicone oil or a mixture of any two or more of the two.
The fluorocarbon compound comprises the following components in parts by weight: 90-100 parts of hexafluoropropylene trimer; 0-10 parts of perfluoropolyether.
In the embodiment of the invention, as the main component of the liquid coolant for the lower layer to play the main heat transfer role is hexafluoropropylene tripolymer, compared with the traditional fluorine compound liquid coolant, the liquid coolant has the characteristics of easy volatilization, easy oxidation and degradation. Therefore, the upper isolation layer of the cooling medium has the main functions of avoiding the volatilization, oxidation and degradation of the lower liquid refrigerant, effectively reducing the loss rate of the cooling medium and reducing the use cost of the cooling medium.
In the embodiment of the invention, the silicone oil substance has a boiling point of 120 ℃ or higher and a viscosity of 5-500cP at 25 ℃. The boiling point of the silicone oil as the upper isolation layer is too low, and the effect of inhibiting the volatilization of the lower layer cannot be achieved. When the viscosity exceeds 500cP at room temperature, inconvenience may occur in the process of replacing the cooling medium, moving the heating element, etc. due to excessive viscosity.
Preferably, silicone oils are used which have a boiling point of 150 ℃ or higher and a viscosity of 5-100cP at 25 ℃.
In the embodiment of the invention, the mixture of the hexafluoropropylene tripolymer and the perfluoropolyether is used as the lower-layer liquid refrigerant, and the loss of the hexafluoropropylene tripolymer in the using process can be reduced to a certain extent on the premise of not influencing the fluidity.
In the embodiment of the invention, the perfluoropolyether has a boiling point of 150 ℃ or higher and a viscosity of 10-10000cP at 25 ℃. When the boiling point of the perfluoropolyether is more than or equal to 150 ℃, the addition of the perfluoropolyether can reduce the volatility of the lower-layer liquid refrigerant, thereby reducing the loss of the lower-layer liquid refrigerant in the using process. However, perfluoropolyether has the characteristics of higher boiling point and higher viscosity, and at the above mixing ratio, when the viscosity of the added perfluoropolyether at room temperature exceeds 10000cP, the viscosity of the liquid refrigerant is greatly improved, and the fluidity in the use process is influenced.
In the embodiment of the invention, the thickness of the upper isolation layer consisting of the silicone oil substances is not less than 1mm, and the ratio of the thickness of the upper isolation layer to the height of the total cooling medium is not more than 10%. Since the silicone oil-like substance and the lower-layer liquid refrigerant have a certain difference in surface tension, the thickness of the silicone oil-like substance is not less than 1mm so that the silicone oil-like substance can be completely spread over the lower-layer liquid refrigerant. When the ratio of the height of the upper isolation layer to the total cooling medium height is more than 10% in the actual use process, the isolation effect is basically unchanged, and the height ratio of the upper isolation layer is continuously increased, so that the heating element cannot be completely contacted with the lower-layer liquid refrigerant, and the height of the cooling medium storage tank of the cooling system is increased.
As shown in fig. 1, the present invention further provides a cooling system, which comprises a closed or semi-closed cooling medium storage tank, and a cooling medium, wherein the cooling medium is the above-mentioned single-phase immersed cooling medium, and the cooling medium is stored in the cooling medium storage tank. The heat generating component is contacted with the cooling medium in the cooling medium storage tank, and particularly, the heat generating component is completely immersed in the lower layer liquid refrigerant of the single-phase immersed cooling medium. The cooling system also comprises a liquid coolant circulating pump 4 and a heat exchange device 5 which are connected with the lower part of the cooling medium storage tank, and corresponding pipelines. The liquid cryogen circulating pump 4 is connected with the liquid cryogen at the layer and the heat exchange device, and the liquid cryogen at the lower layer exchanges heat with other heat exchange devices under the action of the liquid cryogen circulating pump 4.
It is understood that the heat generating component may be a data center or other electronic component.
The invention also provides a cooling method, which is characterized in that the main body of the heating component is partially or completely immersed in the lower-layer liquid refrigerant of the single-phase immersed cooling medium, and then the lower-layer liquid refrigerant exchanges heat with the heat exchange device. Namely, the upper isolation layer composed of silicon oil substances does not participate in the circulation of the cooling medium, and the lower liquid refrigerant composed of fluorocarbon compounds participates in the circulation of the cooling medium.
The present invention will be described in detail with reference to specific examples. The following examples will aid those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any manner.
The materials used in the present invention are commercially available conventional materials unless otherwise specified.
In the present invention, the viscosity of the cooling medium is measured using a rotational viscometer.
The dielectric breakdown strength of the cooling medium in the present invention is measured according to ASTM D149.
The dielectric constant and the volume resistivity of the cooling medium are measured by using a broadband dielectric impedance spectrometer.
Example 1
Injecting a liquid refrigerant with the height of 45cm into a square cooling medium storage tank with the length of 60cm, the width of 30cm and the height of 60cm, wherein the liquid refrigerant comprises 100 percent hexafluoropropylene trimer, then injecting dimethyl silicon oil with the height of 1mm, completely immersing the computer host in the liquid refrigerant, and performing heat exchange with a heat exchanger outside the storage tank by using a pump to circulate the liquid refrigerant. Under the condition that the CPU runs at full load, the computer is enabled to run stably for 24h, the temperature of the CPU is detected through a corresponding computer program, and the temperature of the cooling medium is displayed by the body distribution digital thermometer.
The test data results and the cooling medium loss rate are shown in table 1, and the detection data of the viscosity, dielectric breakdown strength, dielectric constant and volume resistivity of the cooling medium are shown in table 2.
Example 2
Under the same conditions as in example 1, the liquid coolant composition was 99% hexafluoropropylene trimer and 1% perfluoropolyether PFPE1 (commercially available product). The specific detection results are shown in tables 1 and 2.
Example 3
Under the same conditions as in example 1, the liquid coolant composition was 98% hexafluoropropylene trimer and 2% perfluoropolyether PFPE1 (commercially available product). The specific detection results are shown in tables 1 and 2.
Example 4
Under the same conditions as in example 1, the liquid coolant composition was 95% hexafluoropropylene trimer and 5% perfluoropolyether PFPE1 (commercially available product). The specific detection results are shown in tables 1 and 2.
Example 5
Under the same conditions as in example 1, the liquid coolant composition was 90% hexafluoropropylene trimer and 10% perfluoropolyether PFPE1 (commercially available product). The specific detection results are shown in tables 1 and 2.
Example 6
Under the same other conditions as in example 1, the height of the dimethylsilicone fluid was 2cm. The specific detection results are shown in tables 1 and 2.
Example 7
Under the same other conditions as in example 1, the height of the dimethylsilicone fluid was 4.5cm. The specific detection results are shown in tables 1 and 2.
Example 8
Under the same conditions as in example 1, the height of the dimethylsilicone fluid was 6cm. The specific detection results are shown in tables 1 and 2.
Example 9
Under the same other conditions as in example 1, ethyl silicone oil was injected as a barrier layer. The specific detection results are shown in tables 1 and 2.
Comparative example 1
The test was carried out by the method of example 1, using perfluoropolyether PFPE2 (commercially available) as cooling medium. The specific detection results are shown in tables 1 and 2.
Comparative example 2
Hexafluoropropylene trimer (commercially available) was used as the cooling medium and tested by the method of example 1. The specific detection results are shown in tables 1 and 2.
TABLE 1 liquid cooling test results for examples 1-9, comparative examples 1, 2
TABLE 2 physical Properties of Cooling Medium test results of examples 1 to 9 and comparative examples 1 and 2
As is obvious from the data in tables 1 and 2, the cooling medium provided by the invention has good cooling effect and excellent dielectric property, but when perfluoropolyether substances are used as the cooling medium, the circulation is blocked due to high viscosity, the heat dissipation is difficult, and the problem of material loss is faced when hexafluoropropylene trimer is used as the cooling medium.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that the invention is not limited thereto, but rather, may be embodied in many different forms and varied. Any modification which does not depart from the functional and structural principles of the invention is intended to be included within the scope of the claims.
Claims (10)
1. The single-phase immersed cooling medium is characterized by comprising a lower-layer liquid refrigerant consisting of fluorocarbon substances and an upper-layer isolation layer consisting of silicone oil substances.
2. A single-phase immersion cooling medium as claimed in claim 1, wherein said silicone oil has the structure:
wherein R is 1 、R 2 Is H or C 1 -C 20 Alkyl or aralkyl groups of (a).
3. A single-phase immersion cooling medium as claimed in claim 1, wherein said silicone oil-like substance has a boiling point of 120 ℃ or higher and a viscosity of 5-500cP at 25 ℃.
4. A single-phase immersion cooling medium as claimed in any one of claims 1 to 3 wherein said silicone oil is any one of dimethyl silicone oil, ethyl silicone oil, phenyl silicone oil, methylphenyl silicone oil, methylethyl silicone oil, methylpropyl silicone oil, methylbutyl silicone oil, methylpentyl silicone oil, methylhexyl silicone oil, methyldodecyl silicone oil, methyl hydrogen-containing silicone oil or a mixture of any two or more thereof.
5. The single-phase immersion cooling medium as claimed in claim 1, wherein the thickness of the upper insulating layer is greater than or equal to 1mm and the proportion of the upper insulating layer to the total thickness of the cooling medium is less than or equal to 10%.
6. A single-phase immersion cooling medium as claimed in claim 1 wherein the fluorocarbon species is comprised of the following components in parts by weight: 90-100 parts of hexafluoropropylene trimer and 0-10 parts of perfluoropolyether.
7. A single-phase immersion cooling medium as claimed in claim 6, wherein the fluorocarbon species has a boiling point of 150 ℃ or higher and a viscosity of 10-10000cP at 25 ℃.
8. A cooling system comprising a cooling medium reservoir and a cooling medium stored in the cooling medium reservoir, wherein the cooling medium is the single-phase immersion cooling medium of any one of claims 1 to 7, and the heat generating component is disposed in the cooling medium reservoir and immersed in the cooling medium for cooling.
9. The cooling system of claim 8, further comprising a liquid coolant circulation pump and a heat exchange device connected to the coolant reservoir.
10. A cooling method characterized in that a heat generating component is cooled by the cooling system of claim 9, the heat generating component is immersed in the single-phase immersion cooling medium for cooling, and the underlying liquid refrigerant exchanges heat with a heat exchanging device.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116731689A (en) * | 2023-08-14 | 2023-09-12 | 南方电网调峰调频(广东)储能科技有限公司 | Silicon oil-based immersion type cooling liquid for electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116731689A (en) * | 2023-08-14 | 2023-09-12 | 南方电网调峰调频(广东)储能科技有限公司 | Silicon oil-based immersion type cooling liquid for electronic components |
| CN116731689B (en) * | 2023-08-14 | 2023-10-27 | 南方电网调峰调频(广东)储能科技有限公司 | Silicon oil-based immersion type cooling liquid for electronic components |
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