CN115651561B - Preparation method of composite mica tape and mica tape prepared by using same - Google Patents
Preparation method of composite mica tape and mica tape prepared by using same Download PDFInfo
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- CN115651561B CN115651561B CN202211228391.3A CN202211228391A CN115651561B CN 115651561 B CN115651561 B CN 115651561B CN 202211228391 A CN202211228391 A CN 202211228391A CN 115651561 B CN115651561 B CN 115651561B
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- 239000010445 mica Substances 0.000 title claims abstract description 206
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 206
- 239000002131 composite material Substances 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 221
- 239000011248 coating agent Substances 0.000 claims abstract description 210
- 239000003822 epoxy resin Substances 0.000 claims abstract description 125
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 125
- 239000000853 adhesive Substances 0.000 claims abstract description 90
- 230000001070 adhesive effect Effects 0.000 claims abstract description 90
- 239000002904 solvent Substances 0.000 claims abstract description 19
- 238000003618 dip coating Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims description 88
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011265 semifinished product Substances 0.000 claims description 34
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000007598 dipping method Methods 0.000 claims description 11
- 238000010981 drying operation Methods 0.000 claims description 8
- 238000013329 compounding Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 claims description 3
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- 238000004804 winding Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 114
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- 239000012790 adhesive layer Substances 0.000 abstract description 4
- 238000007761 roller coating Methods 0.000 abstract description 4
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- 239000002994 raw material Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
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- 239000012298 atmosphere Substances 0.000 description 2
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- 239000013557 residual solvent Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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- 230000009477 glass transition Effects 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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- Laminated Bodies (AREA)
Abstract
The embodiment of the invention discloses a preparation method of a composite mica tape and the mica tape prepared by the preparation method, wherein the preparation method adopts a coating method combining dip coating and micro-concave roller coating, the whole procedure comprises two coating operations, continuous coating is carried out, three-layer coating composite coating (comprising two layers of epoxy resin coatings and one layer of adhesive coating) is realized, and finally, a release film is attached, so that the process flow is simple, and the production efficiency and the performance of the mica tape can be obviously improved; in addition, the preparation method firstly carries out dip coating operation on the mica skeleton structure to form a compact epoxy resin coating on the surface of the mica skeleton structure, so that the adhesive is not easy to permeate into the mica skeleton structure when the adhesive coating is coated subsequently, namely, the phenomenon of solvent residue is avoided, and environmental pollution and potential safety hazard are avoided; in addition, when the adhesive coating is directly coated on the epoxy resin coating in a micro-gravure roll coating mode, the thickness of the adhesive is convenient to control, and the adhesive layer with larger thickness is easy to coat.
Description
Technical Field
The invention relates to the technical field of insulating tapes, in particular to a preparation method of a composite mica tape and the mica tape prepared by using the same.
Background
The mica tape is an insulating material which has excellent high temperature resistance and combustion resistance, is suitable for refractory insulating layers of various refractory electromagnetic cables and coils, and is widely applied to the fields of motor insulation, cables and the like. The mica tape can be adhered to the surface of equipment such as a motor in the use process, so that the purpose of heat insulation and insulation on the surface of electrical equipment such as the motor can be realized, the effect of protecting the surface of the motor is achieved, and the mica tape has good fire resistance and flame retardance.
At present, the preparation method of the mica tape generally adopts a coating method to coat the adhesive on the reinforcing material through a roller, and comprises the following specific operations: firstly, adsorbing mica raw materials onto a reinforcing material by utilizing an electrostatic field to further fix the mica raw materials, spraying an adhesive onto the reinforcing material of the mica raw materials, then compounding a second layer of reinforcing material to obtain a semi-finished product of the double-sided reinforced mica tape, drying the semi-finished product by an oven to remove an organic solvent, cooling and rolling to prepare a mica tape roll, and finally obtaining a finished product of the double-sided reinforced mica tape.
Such a preparation method has the following technical drawbacks and disadvantages:
① . The framework structure of the mica substrate composed of the mica raw material and the reinforcing material is a loose porous structure, if the adhesive is directly coated on the reinforcing material of the mica raw material, the adhesive is easy to permeate into the porous layer, so that the coating thickness of the adhesive is affected, the coating thickness cannot be accurately grasped, the thickness uniformity is poor, and thick adhesive coating is difficult to achieve;
② . In addition, if the solvent in the adhesive permeates into the framework structure of the mica substrate, namely, remains in the mica tape, and slowly releases the solvent from the mica tape, the solvent can cause adverse effects on the health and environment of users, and when the solvent in the adhesive volatilizes into the atmosphere, the solvent can cause environmental pollution and potential safety hazards such as fire disaster are easy to cause.
Disclosure of Invention
In order to solve the technical problems that the coating thickness is difficult to accurately grasp and environmental pollution and potential safety hazards are easily caused due to the fact that the adhesive in the preparation method of the mica tape in the prior art is easy to permeate into a porous structure, the invention provides the preparation method of the composite mica tape and the mica tape prepared by using the preparation method.
The invention adopts the technical proposal for solving the problems that:
the preparation method of the composite mica tape comprises the following steps:
S1, compounding a first fiber reinforced layer and a second fiber reinforced layer on two sides of a mica layer to obtain a mica skeleton structure;
S2, carrying out dip coating operation on the mica framework structure so as to coat epoxy resin paint on the surface of the first fiber reinforced layer, the surface of the second fiber reinforced layer, between the first fiber reinforced layer and the mica layer and between the second fiber reinforced layer and the mica layer;
s3, performing a first drying operation on the mica skeleton structure to remove water in the epoxy resin coating, so that the epoxy resin coating forms a continuous and compact epoxy resin coating to obtain a mica substrate semi-finished product;
S4, carrying out micro-gravure roll coating operation on the mica substrate semi-finished product so as to coat the epoxy resin coating to form a continuous and uniform adhesive coating;
S5, performing a second drying operation on the mica substrate semi-finished product so as to remove the organic solvent in the adhesive coating.
In a first embodiment of the invention, a technical solution is disclosed of how to perform a dip coating operation on a mica skeletal structure in particular.
In step S2, the "dip coating operation on the mica skeleton structure" specifically includes:
introducing the mica skeleton structure into an impregnation vessel filled with an epoxy resin coating, so that the surface of the first fiber reinforcement layer, the surface of the second fiber reinforcement layer, the gaps between the first fiber reinforcement layer and the mica layer and the gaps between the second fiber reinforcement layer and the mica layer are fully saturated and impregnated with the epoxy resin coating.
Further, the epoxy resin coating is a water-based coating taking water as a solvent, the dipping temperature is controlled at 20-30 ℃, the viscosity of the epoxy resin coating under the temperature condition is 400-2000 cps, and the solid content is 30-50 wt%.
Further, when the dip coating operation is performed, the coating line speed is 40-60 m/min, the residence time of the mica skeleton structure in the dip container is 0.1-0.3 s, and the travelling time of the mica skeleton structure in the dip container is increased by winding a roller.
In a second embodiment of the invention, a technical solution is disclosed of how to perform an extrusion operation on the mica skeleton structure in particular.
Wherein, between step S2 and step S3, there is also a step S6, specifically:
S6, extruding the mica framework structure, and extruding redundant epoxy resin coating to enable the epoxy resin coating to be uniformly and densely coated on the surface of the first fiber reinforced layer and the surface of the second fiber reinforced layer.
In a third embodiment of the invention, a technical scheme of how to perform a micro gravure roll coating operation on a mica substrate semi-finished product is disclosed.
In step S4, the "performing a micro gravure roll coating operation on the mica substrate semi-finished product" specifically includes:
and introducing the mica substrate semi-finished product into a coating container filled with an adhesive, wherein a micro-concave roller is arranged in the adhesive, so that the mica substrate semi-finished product is contacted with the micro-concave roller, and the micro-concave roller is driven to rotate by traction of the mica substrate semi-finished product, so that the adhesive is continuously coated on the surface of the mica substrate semi-finished product.
Further, the solvent of the adhesive comprises water, the coating temperature is controlled to be 20-30 ℃, the viscosity of the adhesive under the temperature condition is 400-2000 cps, and the solid content is 30-50 wt%.
In a fourth embodiment of the invention, a technical scheme of how to attach a release film to a mica substrate semi-finished product is disclosed.
After step S5, step S7 is further provided, specifically:
s7, attaching a release film on the surface of the adhesive coating to form a release layer, and then pressing to obtain the multilayer composite mica tape.
Based on the same design thought, the invention also provides an embodiment of the mica tape, which comprises:
the mica layer, the first fiber reinforced layer and the second fiber reinforced layer are respectively arranged on two sides of the mica layer;
The first epoxy resin coating is arranged between the first fiber reinforced layer and the mica layer and on the surface of the first fiber reinforced layer, and the second epoxy resin coating is arranged between the second fiber reinforced layer and the mica layer and on the surface of the second fiber reinforced layer;
the adhesive coating is arranged on the surface of the first epoxy resin coating;
and the release layer is arranged on the surface of the adhesive coating.
Further, the thickness of the first epoxy resin coating and the second epoxy resin coating is 2-6 mu m;
the thickness of the adhesive coating is 4-50 mu m, and the thickness difference of the adhesive coating is less than 2 mu m.
In summary, compared with the prior art, the preparation method of the composite mica tape and the mica tape prepared by using the preparation method provided by the invention have at least the following technical effects:
1) The preparation method of the composite mica tape provided by the invention adopts a coating method combining dip coating and micro-concave roller coating, the whole procedure comprises two coating operations and two baking operations, the continuous coating is carried out, the three-layer coating composite coating (comprising two layers of epoxy resin coatings and one layer of adhesive coating) is realized, and finally, the release film is attached.
2) In the preparation method of the composite mica tape, firstly, the mica skeleton structure is subjected to dip coating operation, so that a compact epoxy resin coating is formed on the surface of the mica skeleton structure, and therefore, when an adhesive coating is coated subsequently, the adhesive is not easy to permeate into the mica skeleton structure, namely, the phenomenon of solvent residue is avoided, and environmental pollution and potential safety hazard are avoided; in addition, when the adhesive coating is directly coated on the epoxy resin coating in a micro-gravure roll coating mode, the thickness of the adhesive is convenient to control, and the adhesive layer with larger thickness is easy to coat;
3) In the mica tape prepared by the preparation method of the composite mica tape provided by the invention, the first epoxy resin coating and the second epoxy resin coating can respectively play roles in adhesive compounding and structural reinforcement between the first fiber reinforced layer and the mica layer and between the second fiber reinforced layer and the mica layer, and can obviously improve the structural properties such as the overall tensile strength, the elongation at break and the like of the mica tape.
Drawings
FIG. 1 is a process flow diagram of a method for preparing a composite mica tape of the present invention;
FIG. 2 is a schematic view of the interlayer structure of the mica tape of the present invention;
FIG. 3 is a scatter plot with smooth lines for epoxy coating thickness and tensile strength;
FIG. 4 is a scatter plot with smooth lines for epoxy coating thickness and elongation at break;
Wherein the reference numerals have the following meanings:
1. A mica layer; 2. a first fibrous reinforcement layer; 3. a second fibrous reinforcement layer; 4. a first epoxy coating; 5. a second epoxy coating; 6. an adhesive coating; 7. and (5) a release layer.
Detailed Description
For a better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 and 2, according to an embodiment of the present invention, a method for preparing a composite mica tape includes the steps of:
Step S1: and compounding the first fiber reinforced layer 2 and the second fiber reinforced layer 3 on two sides of the mica layer 1 to obtain a mica skeleton structure. The first fiber reinforced layer 2 and the second fiber reinforced layer 3 can be compounded on the mica layer 1 in an electrostatic field electrostatic adsorption mode, and other processes can be adopted to realize the compounding of the first fiber reinforced layer 2 and the second fiber reinforced layer 3.
Step S2: and (3) carrying out dip coating operation on the mica skeleton structure prepared in the step (S1) so as to coat epoxy resin paint on the surface of the first fiber reinforced layer 2, the surface of the second fiber reinforced layer 3, the space between the first fiber reinforced layer 2 and the mica layer 1 and the space between the second fiber reinforced layer 3 and the mica layer 1.
Step S3: and (3) performing a first drying operation on the mica skeleton structure prepared in the step (S2) to remove moisture in the epoxy resin coating between the first fiber reinforced layer 2 and the mica layer 1 and between the second fiber reinforced layer3 and the mica layer 1, so that the epoxy resin coating forms a continuous and compact epoxy resin coating, and a mica substrate semi-finished product is obtained. Wherein the formed epoxy resin coating comprises a first epoxy resin coating 4 and a second epoxy resin coating 5. Specifically, the oven used for the drying operation in this step may preferably be a six-stage suspension oven, the single-stage oven having a length of 3m to 6m, the temperatures of the respective ovens being set to 90 ℃/100 ℃/120 ℃/100 ℃/80 ℃ in order, with a tolerance of ±10 ℃.
Step S4: and (3) carrying out a micro gravure roll coating operation on the mica substrate semi-finished product obtained in the step (S3) so as to coat and form a continuous and uniform adhesive coating 6 on the epoxy resin coating. Wherein, the surface of the first epoxy resin coating layer 4, the surface of the second epoxy resin coating layer 5 or both are coated to form an adhesive coating layer 6 in the step, so that the mica tape has single-sided or double-sided adhesive performance.
Step S5: and (3) performing a second drying operation on the mica substrate semi-finished product prepared in the step S4 to remove the organic solvent in the adhesive coating 6. Wherein, the drying operation in the step can adopt a five-section type oven, the length of a single-section type oven is 3 m-5 m, the temperature of each oven can be sequentially set to 90 ℃/100 ℃/120 ℃/100 ℃/80 ℃, and the tolerance is +/-10 ℃.
In the technical scheme of the embodiment, the preparation method of the composite mica tape adopts a coating method combining dip coating and micro-concave roller coating, the whole preparation process comprises two coating operations and two baking operations, and the coating is continuously carried out, so that the composite coating of the first epoxy resin coating 4, the second epoxy resin coating 5 and the adhesive coating 6 is realized. More specifically, the preparation method firstly carries out dip coating operation on the mica skeleton structure to form a compact first epoxy resin coating 4 and a compact second epoxy resin coating 5 on the surface of the mica skeleton structure, so that when the adhesive coating 6 is coated on the follow-up micro-concave roller, the adhesive is not easy to permeate into the mica skeleton structure, namely, the phenomenon of solvent residue cannot be generated, the residual solvent is prevented from being released from the mica skeleton structure, the adverse effects on the health and the environment of users are avoided, and the potential safety hazards such as environmental pollution and fire explosion are avoided when the residual solvent volatilizes into the atmosphere. In addition, when the adhesive coating 6 is directly coated on the first epoxy resin coating 4 and/or the second epoxy resin coating 5 in a micro-gravure roll coating mode, the thickness of the adhesive can be conveniently controlled, and the adhesive layer with larger thickness can be easily coated.
Furthermore, the first epoxy resin coating 4 and the second epoxy resin coating 5 which are dip-coated can respectively play roles of adhesive composition and structural reinforcement between the first fiber reinforced layer 2 and the mica layer 1 and between the second fiber reinforced layer 3 and the mica layer 1, so that the overall structural properties such as tensile strength, elongation at break and the like of the mica tape are obviously improved.
Example 1
In a first embodiment of the invention, a technical solution is disclosed of how to perform a dip coating operation on a mica skeletal structure in particular.
In the technical solution of this embodiment, in step S2, "dip coating operation on mica skeleton structure" specifically includes: the mica skeleton structure prepared in the step S1 is introduced into an impregnation vessel filled with epoxy resin coating, so that the surface of the first fiber reinforced layer 2, the surface of the second fiber reinforced layer 3, the gaps between the first fiber reinforced layer 2 and the mica layer 1 and the gaps between the second fiber reinforced layer 3 and the mica layer 1 are fully saturated and impregnated with the epoxy resin coating. Wherein. The dipping container may preferably be a dipping tank, and contains a preset volume of aqueous epoxy resin paint therein. Through the dipping coating process, the mica skeleton structure has better waterproof, moistureproof and anti-corrosion effects, and meanwhile, the mica skeleton structure has better mechanical properties, and the mica skeleton structure has better adhesion with the adhesive coated in the subsequent steps, so that the adhesive force of the mica skeleton structure is increased.
In a preferred embodiment of this embodiment, the epoxy resin coating is a water-based coating using water as a solvent, and in step S2, the dipping temperature in the dipping tank (i.e., the feeding temperature of the mica skeleton structure) is controlled to be 20-30 ℃, the viscosity of the epoxy resin coating under the temperature condition is 400-2000 cps, the solid content is 30-50 wt%, and the glass transition temperature of the first epoxy resin coating 4 and the second epoxy resin coating 5 formed after the glue is dried and cured is 90-120 ℃.
In another preferred embodiment of this embodiment, the dipping coating operation is performed at a coating line speed of 40m/min to 60m/min, the residence time of the mica skeleton structure produced in step S1 in the dipping container is 0.1S to 0.3S, and in addition, this step ensures that the surface of the first fiber reinforced layer 2, the surface of the second fiber reinforced layer 3, the gap between the first fiber reinforced layer 2 and the mica layer 1, and the gap between the second fiber reinforced layer 3 and the mica layer 1 are sufficiently saturated-impregnated with the epoxy resin coating material by increasing the travel time of the mica skeleton structure in the dipping container around the roller.
Example 2
In a second embodiment of the invention, a technical solution is disclosed of how to perform an extrusion operation on the mica skeleton structure in particular.
In the technical solution of this embodiment, between step S2 and step S3, step S6 is further provided, specifically: and (3) extruding the mica skeleton structure prepared in the step (S2) to extrude out the redundant epoxy resin coating so that the epoxy resin coating is uniformly and densely coated on the surface of the first fiber reinforced layer (2) and the surface of the second fiber reinforced layer (3). The mica skeleton structure after the dipping operation can be extruded by the extrusion roller pair, so that the redundant epoxy resin coating at the gap between the first fiber reinforced layer 2 and the mica layer 1 and the gap between the second fiber reinforced layer 3 and the mica layer 1 is extruded out, and the continuous and compact epoxy resin coating is ensured to be formed subsequently; and, under the extrusion action of the extrusion roller, it is ensured that the epoxy resin coating material uniformly and densely coats the surface of the first fiber reinforced layer 2 and the surface of the second fiber reinforced layer 3.
More specifically, the squeeze rolls in this step may preferably be vertical three-roll squeeze, the squeeze pressure is 0.05MPa to 0.1MPa, and the squeeze pressure may be adjusted by adjusting the magnitude of the air pressure.
Example 3
In a third embodiment of the invention, a technical scheme of how to perform a micro gravure roll coating operation on a mica substrate semi-finished product is disclosed.
In the technical solution of this embodiment, in step S4, "performing a micro gravure roll coating operation on a mica substrate semi-finished product" specifically includes:
And (3) introducing the mica substrate semi-finished product prepared in the step (S3) into a coating container filled with an adhesive, wherein a micro-concave roller is arranged in the adhesive, so that the mica substrate semi-finished product is contacted with the micro-concave roller, and the micro-concave roller is driven to rotate by traction of the mica substrate semi-finished product, so that the adhesive is continuously coated on the surface of the mica substrate semi-finished product. Specifically, the coating container may be a coating tank containing an adhesive with a preset volume, the coating tank is provided with a micro-concave roller, the lower part of the micro-concave roller is soaked in the adhesive coating liquid, and the upper part of the micro-concave roller is contacted with the mica substrate semi-finished product, so that the adhesive coating liquid in the coating tank can be uniformly coated on the surface of the mica substrate semi-finished product, namely the surface of the first epoxy resin coating 4/the second epoxy resin coating 5, in the process of pulling the mica substrate semi-finished product to move.
More specifically, the micro-concave roller in the step can be selected from a snake-shaped roller, an anilox roller, a hexagonal net point, a quadrilateral net point and other roller grains, the roller diameter is 30-90 mm, the roller material is made of stainless steel chrome plating material, and the number of the roller grains is 20-300 meshes.
In a preferred scheme of the embodiment, the solvent of the adhesive contained in the coating tank comprises water, PMA, butanone, xylene and the like, the coating temperature (namely the feeding temperature of the mica substrate semi-finished product) is controlled to be 20-30 ℃, the viscosity of the adhesive under the temperature condition is 400-2000 cps, and the solid content is 30-50 wt%.
Example 4
In a fourth embodiment of the invention, a technical scheme of how to attach a release film to a mica substrate semi-finished product is disclosed.
After step S5, step S7 is further provided, specifically: and attaching the release film on the surface of the adhesive coating to form a release layer, and then pressing to obtain the multilayer composite mica tape. Wherein, the composite pressure of the pressing operation is 0.05 MPa-0.10 MPa, and the pressure is adjusted by adjusting the air pressure. By arranging the release layer, the mica tape can play a structural protection role.
In summary, the preparation method of the composite mica tape provided by the invention adopts a coating method combining dip coating and micro-concave roller coating, the whole procedure comprises two coating operations and two baking operations, the coating is continuously carried out, the composite coating of two epoxy resin coatings and one adhesive coating is realized, and finally, a release film is attached. In addition, in the preparation method of the composite mica tape provided by the invention, the mica skeleton structure is subjected to dip coating operation, so that a compact epoxy resin coating is formed on the surface of the mica skeleton structure, and therefore, when the adhesive coating is coated subsequently, the adhesive is not easy to permeate into the mica skeleton structure, namely, the phenomenon of solvent residue is avoided, and the environmental pollution and the potential safety hazard are avoided. And when the adhesive coating is directly coated on the epoxy resin coating in a micro-gravure roll coating mode, the thickness of the adhesive is convenient to control, and the adhesive layer with larger thickness is easy to coat.
Example 5
Based on the same design thought, the invention also provides a mica tape, which is prepared by the preparation method of the composite mica tape in the embodiment.
Referring to fig. 2, in the technical solution of this embodiment, the mica tape specifically includes a mica layer 1, a first fiber reinforced layer 2 and a second fiber reinforced layer 3, where the first fiber reinforced layer 2 and the second fiber reinforced layer 3 are disposed on two sides of the mica layer 1 respectively. Wherein, the surface of first fiber reinforcement layer 2 is equipped with first epoxy coating 4, and the surface of second fiber reinforcement layer 3 is equipped with second epoxy coating 5, and the surface of first epoxy coating 4 still is equipped with adhesive coating 6.
Through this structural design mode, can form the fine and close epoxy coating of one deck on mica skeleton texture (by mica layer 1, first fibre enhancement layer 2 and second fibre enhancement layer 3), so when coating adhesive coating 6, the solvent in the adhesive coating 6 can not permeate this mica skeleton texture, can not produce solvent residue promptly, ensures safe and environment-friendly, and because adhesive coating 6 can not permeate in the mica skeleton texture, can ensure that adhesive coating 6's thickness homogeneity is good. In addition, through setting up first epoxy coating 4 on the mica substrate, can directly coat adhesive coating 6 on first epoxy coating 4 during processing to be convenient for control glue film thickness, and the adhesive coating 6 of easy coating thickness is great, and structural design is simple reasonable and operation simple and convenient.
More specifically, a first epoxy resin coating 4 is also arranged between the first fiber reinforced layer 2 and the mica layer 1, a second epoxy resin coating 5 is also arranged between the second fiber reinforced layer 3 and the mica layer 1, and the first epoxy resin coating 4 and the second epoxy resin coating 5 respectively play roles in adhesive compounding and structural reinforcement between the first fiber reinforced layer 2 and the mica layer 1 and between the second fiber reinforced layer 3 and the mica layer 1, so that the structural properties such as tensile strength, elongation at break and the like of the whole mica tape can be remarkably improved. In addition, in the structural design mode of the invention, the water in the adhesive coating 6 and the two epoxy resin coatings is used as a solvent to be baked during processing, so that the finished product of the mica tape has no solvent residue, high safety performance and little pollution.
Further, the mica tape further comprises a release layer 7, and the release layer 7 is arranged on the surface of the adhesive coating 6. The release layer 7 is arranged at the outermost side of the mica tape, and the release layer 7 is attached at the end of the process flow, so that the mica tape can be structurally protected. More specifically, the release agent used for the release layer 7 in this embodiment may preferably be a silicon-free, low silicon-containing, silicone release agent; and the thickness of the release layer 7 is set to be 10-50 mu m, and the release force is set to be 50-300 g.
In an alternative to this embodiment, the thickness of the adhesive coating 6 may be set to 4 μm to 50 μm, the specific thickness setting depending on the adhesive capability requirement of the mica tape, which may be coated with a larger thickness of the adhesive coating 6 based on the structural design of the first epoxy coating 4. And, the thickness difference of the adhesive coating 6 is smaller than 2 μm, that is, in the coated adhesive coating 6, the difference between the maximum thickness and the minimum thickness of the adhesive coating 6 is smaller than 2 μm, so as to ensure that the thickness distribution of the adhesive coating 6 is uniform.
In another alternative of this embodiment, the thicknesses of the first epoxy resin coating layer 4 and the second epoxy resin coating layer 5 were set to 2 μm to 6 μm, and the respective mechanical properties of the mica tape of the present invention at the different thicknesses of the first epoxy resin coating layer 4 and the second epoxy resin coating layer 5 were tested by the following test examples.
Test case
Test object: 7 groups of mica tapes with different epoxy resin coating thicknesses, wherein the number of each group of mica tapes is more than or equal to 3.
Test items: the test of the mechanical performance parameters of the mica tape under the parameters of the thickness of the first epoxy resin coating 4/the second epoxy resin coating 5 (hereinafter referred to as the thickness of the epoxy resin coating) is that the test can be performed by using a measuring tool, a clamp, a chest expander and other devices, or by using a special tensile test machine, and the specific test method is not limited.
Test results:
This test was conducted on 7 sets of mica tapes of different epoxy coating thicknesses to obtain 7 sets of data for tensile strength and 7 sets of elongation at break, respectively, and the specific test results are shown in table 1 below.
It should be noted that, due to the influence of factors such as vendor materials, ambient temperature and humidity, the mechanical performance parameters under the condition of the sum of the thicknesses cannot be precisely determined to be a certain value through a single test, and the test example uses the value tending to be stable in multiple tests as a calculation and comparison object, so as to obtain the test conclusion of the following table 1.
TABLE 1 influence of epoxy coating thickness on mechanical Properties
Analysis method
With the thickness of the epoxy resin coating as the abscissa and the tensile strength as the ordinate, a scatter diagram can be drawn, and each scatter diagram is sequentially connected through a smooth wire, so that the scatter diagram with the smooth wire, which is shown in fig. 3, about the thickness and the tensile strength of the epoxy resin coating can be obtained, and as can be seen from fig. 3:
When the thickness of the epoxy resin coating is 2 μm, the value of the tensile strength (or tensile strength) is 72N/mm 2, and considering that the function of the first epoxy resin coating 4/the second epoxy resin coating 5 is to strengthen the structural performance of the mica tape, if the tensile strength is lower than 72N/mm 2, the structural strengthening effect of strengthening the fracture resistance is difficult to be achieved, so the optimal value of the minimum value of the thickness of the epoxy resin coating should be 2 μm;
When the thickness of the epoxy resin coating is in the range of 2-6 mu m, the slope of the curve in the graph is larger, namely the increasing rate of the tensile strength along with the increase of the thickness is higher, which indicates that when the sum of the thicknesses of the coating is in the range of 2-6 mu m, the tensile strength can be improved by increasing the thickness of the coating, and the effect of the mode is obvious;
When the thickness of the epoxy resin coating is larger than 6 mu m, the slope of the curve in the graph is smaller, namely the increasing rate of the tensile strength (or tensile strength) along with the increase of the thickness is lower, and the increasing of the thickness of the epoxy resin coating approaches zero infinitely, which means that when the thickness of the epoxy resin coating is larger than 6 mu m, the tensile strength is difficult to be increased by increasing the thickness of the coating, and the optimal value of the maximum value of the thickness of the epoxy resin coating is 6 mu m in consideration of the cost of the combined material;
the optimal value of the thickness of the epoxy resin coating is 2-6 mu m.
With the thickness of the epoxy resin coating as the abscissa and the elongation at break as the ordinate, a scatter diagram can be drawn, and each scatter diagram is sequentially connected through a smooth line, so that the scatter diagram with the smooth line, which is shown in fig. 4, about the thickness and the elongation at break of the epoxy resin coating can be obtained, and as can be seen from fig. 4:
When the thickness of the epoxy resin coating is 2 mu m, the value of the elongation at break is 17%, and considering that the functions of the two epoxy resin coatings are the structural reinforcement effect of the mica tape, if the elongation at break is lower than 17%, the structural reinforcement effect of the toughness is difficult to play, so the optimal value of the minimum value of the thickness of the epoxy resin coating is 2 mu m;
When the thickness of the epoxy resin coating is in the range of 2-6 mu m, the slope of the curve in the graph is larger, namely the increasing rate of the elongation at break along with the increase of the thickness is higher, which shows that when the sum of the thicknesses of the coating is in the range of 2-6 mu m, the magnitude of the elongation at break can be improved by increasing the thickness of the coating, and the effect of the mode is obvious;
When the thickness of the epoxy resin coating is larger than 6 mu m, the slope of the curve in the graph is smaller, namely the increase rate of the elongation at break along with the increase of the thickness is lower, and the increase of the thickness of the epoxy resin coating approaches zero infinitely, which shows that when the thickness of the epoxy resin coating is larger than 6 mu m, the elongation at break is difficult to be increased by increasing the thickness of the coating, and the optimal value of the maximum value of the thickness of the epoxy resin coating is 6 mu m in consideration of the cost of the material;
the optimal value of the thickness of the epoxy resin coating is 2-6 mu m.
In summary, it is understood that the optimal value of the thickness of the epoxy resin coating layer of the present invention should be 2 to 6 μm, both in view of the fracture resistance (characterized by the tensile strength of table 1) of the mica tape of the present invention and in view of the toughness (characterized by the elongation at break of table 1) of the mica tape.
The technical means disclosed by the scheme of the invention is not limited to the technical means disclosed by the embodiment, and also comprises the technical scheme formed by any combination of the technical features. It should be noted that modifications and adaptations to the invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (3)
1. The preparation method of the composite mica tape is characterized by comprising the following steps of:
S1, compounding a first fiber reinforced layer and a second fiber reinforced layer on two sides of a mica layer to obtain a mica skeleton structure;
S2, carrying out dip coating operation on the mica framework structure so as to coat epoxy resin paint on the surface of the first fiber reinforced layer, the surface of the second fiber reinforced layer, between the first fiber reinforced layer and the mica layer and between the second fiber reinforced layer and the mica layer;
s3, extruding the mica framework structure, and extruding out redundant epoxy resin coating so that the epoxy resin coating is uniformly and densely coated on the surface of the first fiber reinforced layer and the surface of the second fiber reinforced layer;
s4, performing a first drying operation on the mica skeleton structure to remove water in the epoxy resin coating, so that the epoxy resin coating forms a continuous and compact epoxy resin coating, and a mica substrate semi-finished product is obtained;
S5, carrying out micro-gravure roll coating operation on the mica substrate semi-finished product so as to coat the epoxy resin coating to form a continuous and uniform adhesive coating;
S6, performing a second drying operation on the mica substrate semi-finished product to remove the organic solvent in the adhesive coating, wherein the thickness of the adhesive coating is 4-50 mu m, and the thickness difference of the adhesive coating is less than 2 mu m;
in step S2, the dip coating operation on the mica skeleton structure specifically includes: introducing the mica skeleton structure into an impregnation vessel filled with an epoxy resin coating, so that the surface of the first fiber reinforced layer, the surface of the second fiber reinforced layer, the gaps between the first fiber reinforced layer and the mica layer and the gaps between the second fiber reinforced layer and the mica layer are fully saturated and impregnated by the epoxy resin coating;
The epoxy resin coating is a water-based coating taking water as a solvent, the dipping temperature is controlled to be 20-30 ℃, the viscosity of the epoxy resin coating under the temperature condition is 400-2000 cps, and the solid content is 30-50 wt%;
When dip coating operation is carried out, the coating line speed is 40-60 m/min, the residence time of the mica framework structure in the dip container is 0.1-0.3 s, and the travelling time of the mica framework structure in the dip container is increased by winding a roller;
In step S5, the operation of performing the micro-gravure roll coating on the mica substrate semi-finished product specifically includes: introducing the mica substrate semi-finished product into a coating container filled with an adhesive, wherein a micro-concave roller is arranged in the adhesive, so that the mica substrate semi-finished product is contacted with the micro-concave roller, and the micro-concave roller is driven to rotate by traction of the mica substrate semi-finished product, so that the adhesive is continuously coated on the surface of the mica substrate semi-finished product;
the solvent of the adhesive comprises water, the coating temperature is controlled to be 20-30 ℃, the viscosity of the adhesive under the temperature condition is 400-2000 cps, and the solid content is 30-50 wt%;
The mica tape prepared by the preparation method comprises the following structures:
A mica layer, a first fiber reinforcement layer and a second fiber reinforcement layer, the first fiber reinforced layer and the second fiber reinforced layer are respectively arranged at two sides of the mica layer, and epoxy resin is filled in the mica layer;
The first epoxy resin coating is arranged between the first fiber reinforced layer and the mica layer and on the surface of the first fiber reinforced layer, the second epoxy resin coating is arranged between the second fiber reinforced layer and the mica layer and on the surface of the second fiber reinforced layer, and the first epoxy resin coating and the second epoxy resin coating which are respectively arranged on the two surfaces of the mica layer are connected through epoxy resin filled in the mica layer;
the thickness of the first epoxy resin coating and the second epoxy resin coating is 2-6 mu m.
2. The method for preparing a composite mica tape according to claim 1, wherein after step S6, step S8 is further provided, specifically:
S8, attaching a release film on the surface of the adhesive coating to form a release layer, and then pressing to obtain the multilayer composite mica tape.
3. A mica tape made according to the method of claim 2, comprising:
A mica layer, a first fiber reinforcement layer and a second fiber reinforcement layer, the first fiber reinforced layer and the second fiber reinforced layer are respectively arranged at two sides of the mica layer, and epoxy resin is filled in the mica layer;
The first epoxy resin coating is arranged between the first fiber reinforced layer and the mica layer and on the surface of the first fiber reinforced layer, the second epoxy resin coating is arranged between the second fiber reinforced layer and the mica layer and on the surface of the second fiber reinforced layer, and the first epoxy resin coating and the second epoxy resin coating which are respectively arranged on the two surfaces of the mica layer are connected through epoxy resin filled in the mica layer;
The adhesive coating is arranged on the surface of the first epoxy resin coating, the thickness of the adhesive coating is 4-50 mu m, and the thickness difference of the adhesive coating is less than 2 mu m;
The release layer is arranged on the surface of the adhesive coating;
the thickness of the first epoxy resin coating and the second epoxy resin coating is 2-6 mu m.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102885672A (en) * | 2011-07-21 | 2013-01-23 | 日东电工株式会社 | Production method for medical pressure-sensitive adhesive tape or sheet |
| CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57115479A (en) * | 1981-01-09 | 1982-07-17 | Nitto Electric Ind Co Ltd | Preparation of pressure-sensitive double-coated adhesive tape |
| EP2159321B1 (en) * | 2007-06-07 | 2014-05-28 | Kuraray Co., Ltd. | Resinous-substance-impregnated planar paper and adhesive tape using the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102885672A (en) * | 2011-07-21 | 2013-01-23 | 日东电工株式会社 | Production method for medical pressure-sensitive adhesive tape or sheet |
| CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
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