CN115657420A - Automatic imprinting equipment for micro-lens array - Google Patents

Abstract

The invention discloses an automatic imprinting device of a micro-lens array, which comprises a plurality of workstations, a stacking component and a moving platform, wherein the stacking component moves among the workstations in a circulating manner, the moving platform drives a plurality of supporting platforms to be switched among the workstations, and the stacking component comprises: a wafer carrier for holding substrates, an imprint mold with a lens microstructure layer, a spacer between the wafer carrier and the imprint mold, the plurality of stations comprising at least: an out-in feeding station, a gap measuring station, an imprinting station, and a curing station. The method and the device can solve the problem of the defect of a single-station manual distribution imprinting process, can realize automatic imprinting molding of the wafer, reduce the manual intervention degree, and improve the yield of the micro-lens wafer substrate.

Description

Automatic imprinting equipment for micro-lens array

Technical Field

The application relates to the technical field of optical optoelectronic manufacturing, in particular to automatic stamping equipment for manufacturing micro-lens arrays in batches.

Background

The WLO wafer level optical device is a wafer level lens manufacturing technology and a process, and is different from the traditional optical device processing technology in that the method is to copy and process lenses in batches by using a semiconductor process on a whole glass substrate, press a plurality of lens wafer together and then cut the lens wafer into single lenses, has the advantages of small size, high consistency and high precision, and is widely applied to automobile electronic products and consumer electronic products.

In the existing manufacturing process of a wafer-level optical device, polymers need to be imprinted and solidified through ultraviolet rays, a designed lens structure is copied to a substrate from a mold, eight process steps are needed in the whole process, partial steps in the whole process need to be completed manually, and the manufacturing process has the following problems:

1 all process steps require operator intervention, such as loading the imprint mold, loading the substrate, dispensing the polymer, aligning the imprint location;

2, manually distributing the polymer, so that the stability and the accuracy are low;

3 all the steps are finished on the same station, so that the wafer is not convenient to take out, and the production efficiency is low.

Disclosure of Invention

The utility model aims at solving the problem that "single-station manual distribution impression technology" is not enough, provides an automatic impression equipment, can realize the automatic impression shaping of wafer, reduces manual intervention degree to realize higher output.

In order to achieve the purpose, the following technical scheme is adopted in the application:

an automated imprint apparatus for microlens arrays, comprising a plurality of stations, a stack member cyclically movable between said plurality of stations, a movable stage for moving said stack member between said plurality of stations, and an automated control system, said stack member comprising: a wafer carrier for holding a substrate, an imprint mold having a lens microstructure layer, and a spacer between the wafer carrier and the imprint mold, the plurality of stations including at least:

the discharging and feeding station is used for stacking the substrates, forming the stacking part, identifying the identity information of the substrates and the imprinting mold and taking out the imprinted substrates;

a gap measuring station comprising gap measuring means for measuring the gap between the substrate and the imprint mold in order to calculate the amount of polymer required to fill the gap;

an imprinting station comprising a dispensing arm capable of extending between said substrate and said imprinting mold, said imprinting station being configured to automatically fill and imprint said polymer;

and the curing station is used for carrying out ultraviolet irradiation curing on the polymer.

In an embodiment of the application, a plurality of workstations distribute on same circumference, the mobile station have one along the rotation axial lead that the Z axle extends, this axial lead perpendicular to the plane at circumference place and pass the centre of a circle of this circumference, the mobile station on install a plurality of lower chucks that are used for fixing the part that piles up, the below of mobile station be provided with a plurality of respectively with each Z axle elevating system that the workstation corresponds, each Z axle elevating system be used for driving lower chuck with the part that piles up relative the mobile station go up and down along the Z axle.

In one embodiment of the present application, the gap measuring station, the imprinting station, and the curing station each have an upper chuck, each upper chuck is located directly above the moving stage, and each upper chuck is in air flow communication with a vacuum adsorption system to adsorb and fix the imprinting mold.

In one embodiment of the application, the material inlet and outlet station comprises an image recognition device, and the image recognition device is used for recognizing identity codes of the substrate and the stamping die, and displaying and amplifying alignment marks of the substrate and the stamping die.

In one embodiment of the present application, the gap measuring device is an optical interferometric device.

In one embodiment of the present application, the stamping station is configured to: during dispensing, the imprinting mold is adsorbed on an upper chuck of the imprinting station, and the wafer carrier, the substrate and the spacer are positioned on the Z-axis lifting mechanism.

In one embodiment of the present application, the upper chuck of the curing station is movable in a plane perpendicular to the Z-axis, the imprint mold is held by the upper chuck of the curing station, the curing station includes an image capture device for detecting alignment marks on the substrate and the imprint mold, and the automatic control system is configured to: and moving the upper chuck based on the distance between the two alignment marks to align the imprinting mold with the alignment marks on the substrate.

In an embodiment of the present application, the mobile station is provided with an observation hole opposite to the alignment mark, and the image acquisition device is located below the observation hole.

In one embodiment of the present application, the automatic control system is configured to: at the material inlet and outlet station, carrying out identity recognition on the substrate and the imprinting mold, and then transferring the stacking component to the gap measuring station; calculating the amount of polymer required at said gap measuring station based on feedback data from said gap measuring device, and then transferring said stack to said embossing station; separating the wafer carrier, the substrate and the spacer from the imprinting mold at the imprinting station, extending the dispensing arm between the substrate and the imprinting mold for dispensing, completing polymer imprinting, and transferring the stacked components to the curing station; and aligning the substrate with the imprinting mold at the curing station, then carrying out ultraviolet irradiation curing, and transferring the stacked component to the material inlet and outlet station.

Through above-mentioned technical scheme, it is difficult to see that this application has eliminated the manual intervention in the optical device production process and has confirmed the step, through adopting different workstations, makes these workstations can automatic work to separate each other, the wafer of processing circulates between a plurality of workstations and circulates, consequently can process a plurality of wafers simultaneously, improves wafer production efficiency and output. Because the operator only needs to complete the steps of feeding and discharging, the impressing process does not need to be deeply learned, and the skill requirement of the operator and the probability of human errors are reduced.

Drawings

Fig. 1 is a schematic plan view of an automatic stamping apparatus according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural view of an input/output station according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a gap measuring station according to an embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of an imprinting station according to an embodiment of the present disclosure.

Fig. 5 is a schematic diagram illustrating movement of a chuck of a curing station according to an embodiment of the present disclosure.

Fig. 6 is a schematic light-curing diagram of a curing station according to an embodiment of the present disclosure.

Detailed Description

To explain technical contents, structural features, achieved objects and effects of the invention in detail, the technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. Moreover, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, the particular shapes, configurations and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In addition, in the present application, such as "under 8230: \" 8230: "," under 8230: \ "8230", under 8230, in 8230, \8230, over "," on \8230, above "," on \8230, above "," higher "and side" (for example, as in "sidewalls"), etc., thereby describing the relationship of one element to another (or other) element as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "at 8230 \8230; below" may include both an orientation of above and below. Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In this application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection or a releasable connection or may be integral; may be directly connected or indirectly connected through an intermediate.

As described in the background, applicants are currently performing wafer level optical device fabrication according to the following eight process steps:

1. manually loading the transparent imprinting mold with the micro-lens structure into an imprinting machine;

2. the substrate is placed on a wafer carrier and manually pre-aligned and the chuck is placed on the Z-axis of the imprinter.

3. The correct amount of polymer was dispensed onto the substrate by manual puddle dispensing.

4. And moving the Z axis of the stamping machine to enable the substrate to reach a preset distance with the pre-installed stamping mold.

5. And aligning the substrate and the imprinting mold through preset alignment marks on the imprinting mold and the substrate.

6. The Z-axis is moved to a predetermined final distance between the substrate and the imprint mold, and during the Z-axis movement, the polymer fills the space between the imprint mold and the substrate through the capillary, thereby filling the cavity in the imprint mold.

7. The polymer is hardened by an ultraviolet light source mounted on or near the press, which can be directed through the press mold onto the uv cured polymer for a predetermined time and intensity.

8. The imprint mold is separated from the substrate, and the substrate, upon which the replicated microlens structures are printed, is manually removed.

It can be seen that in the original manufacturing process adopted by the applicant, the steps of loading the imprinting mold, the substrate, dispensing and the like are all manually completed, the operation precision and efficiency are low, and all the processing processes are carried out at one working position, so that the substrate can be processed one by one, the loading and the taking of the substrate are inconvenient, and the output efficiency is low.

To this end, the embodiment of the present application provides an automatic imprinting apparatus for a microlens array. Referring to fig. 1, the automatic imprinting apparatus includes: a plurality of workstations, a plurality of stacker assemblies 500 that move cyclically between the plurality of workstations, a mobile station 600 that moves the stacker assemblies 500 between the plurality of workstations, and an automated control system.

The plurality of workstations includes at least: an out-in feed station 100, a gap measuring station 200, an imprinting station 300, and a curing station 400. The multiple stations are distributed on the same circle and fall within the projection of the mobile station 600 on the Z-axis (the direction out of the plane of the paper in fig. 1 is the "Z-axis" direction as described in the specification). The mobile station 600 has a rotation axis extending in the Z-axis direction, which is perpendicular to the plane of the plurality of stations and passes through the center of the circle. A plurality of Z-axis lifting mechanisms (not shown) corresponding to the plurality of workstations are arranged below the moving table, and each Z-axis lifting mechanism can drive the lower chuck and the stacking component to ascend or descend along the Z axis.

To improve processing efficiency, multiple substrates may be processed simultaneously at a time, and in one embodiment of the present application, a fixed lower chuck 12 may be provided for each station. The lower chuck 12 is mounted on the moving stage 600 and changes the work station as it rotates. The lower chuck 12 is preferably detachably mounted on the moving stage 600 for easy replacement. The lower chuck 12 may be connected to a vacuum suction system of the imprinting apparatus through a vacuum line to provide a suction force to the stacked part 500 placed above the lower chuck 12. Furthermore, the measuring station, the embossing station and the curing station all have a fixed upper chuck. The lower chuck is fixed to rotate along with the moving platform, the upper chucks move up and down in the fixed work station and cannot rotate along with the moving platform, and the upper chucks are connected with a vacuum adsorption system through vacuum pipelines respectively, so that the upper chucks can fix the impression mold through vacuum adsorption.

In this embodiment, the upper and lower chucks are sized to accommodate the size of the substrate 52 to be processed. The movable table is of a rotatable disc type structure and the size of the rotatable disc type structure exceeds the size of the circumference where the plurality of working stations are located, so that the movable table can rotate a substrate to be processed from one working station to another working station when rotating. It should be noted that, in alternative embodiments, the arrangement of the plurality of work stations or the shape of the moving table may be set to other suitable shapes or suitable sizes according to actual needs, and only the stacking component 500 to be processed can be conveyed in a one-way or two-way circulation manner among the plurality of work stations by the action of the moving table, which does not limit the scope of protection of the present application.

Referring to fig. 2, a schematic structural diagram of a feeding and discharging station according to an embodiment of the present disclosure is shown. An out-in station 100 for stacking substrates 52 and forming a stack 500, identifying the Identity (ID) of the substrates 52 and imprint mold 54, and removing the copied substrates 52. The stack 500 is formed by manual stacking at the loading and unloading station 100. The loading and unloading station 100 is the only station requiring manual operation in the automatic stamping apparatus of the present application. The stacking component 500 includes a plurality of elements stacked one on top of another, in order from bottom to top: the lens module comprises a wafer carrier 51 for placing a substrate 52, an imprint mold 54 with a lens microstructure layer 541, and a spacer 53 positioned between the wafer carrier 51 and the imprint mold 54. The substrate 52 to be processed is placed on the wafer carrier 51, a certain gap is reserved between the substrate 52 and the lens microstructure layer 541 through the support of the spacer 53, the gap is filled with high molecular polymer in the imprinting station 300, the imprinting mold 54 is pressed downwards, and finally the polymer is cured by ultraviolet irradiation in the curing station 400, so that the microlens wafer substrate with a plurality of microlens structures is formed on the substrate.

The feeding and discharging station 100 includes an image recognition device, which includes a camera 11 and a display. In order to facilitate informatization management, a camera can recognize the identification codes on the substrate and the stamping die. In order to more precisely form the microlens structure, alignment marks 521 and 542 are respectively formed on the substrate and the imprinting mold, and the other camera 11 forms an auxiliary vision system to help an operator align the alignment marks of the substrate and the imprinting mold.

At the in-out station 100, the operator will "stack" the material required for imprinting on the lower chuck 12, with the lower chuck 12 being provided with a viewing aperture 121. First, a wafer carrier 51 is placed; second, prealigning and placing the substrate 52 on the wafer carrier 51, at which point a vacuum is initiated to secure the wafer carrier 51 with the substrate 52 to the station's lower chuck 12; third, a spacer 53 is placed on the wafer carrier 51; in the fourth step, the alignment marks 542 on the imprint mold 54 and the alignment marks 521 on the substrate 52 are pre-aligned, and the imprint mold 54 is placed on the spacer 53. This "stacking" of the components is done by the operator who, with the aid of the image recognition device, will very easily recognize and accurately align the alignment marks 521, 542 of the substrate 52 and the imprint mold 54, so that the work technique actually required to be done by the operator is simpler and less trained than in conventional methods, where the alignment accuracy is less demanding and it is also precisely adjusted before the subsequent curing. When the stack 500 is set up, the rotary table 600 is rotated through 90 ° to automatically transport the lower chuck 12 together with the stack 500 to the next station.

Fig. 3 shows a schematic structural diagram of a gap measuring station 200 provided in an embodiment of the present application. The gap measuring station 200, including the interferometric gap measuring device 21, is used to measure the gap 55 between the substrate 52 and the imprint mold 54 in order to calculate the amount of polymer needed to fill the gap. When the stack 500 enters the gap measuring station 200, the lower chuck 12 is automatically lifted up to the top of the gap measuring station by the corresponding Z-axis lifting mechanism of the station, the imprint mold 54 of the stack 500 comes into contact with the upper chuck 23, and then the vacuum is started to be fixed by vacuum suction, and the substrate 52 and the wafer carrier 41 are supported on the lower chuck 12, so that the stack 500 is fixed. The distance between the substrate and the mold will be determined by interferometry, and then the volume of polymer, typically in mL, required to properly fill the gap is calculated by the software, depending on the size of the gap. When the gap measurement is completed, the vacuum of the upper chuck 23 will be removed and the stack lowered and unloaded. Then, the lower chuck 12 and the stacking member 500 are rotated and conveyed to the next station by the moving stage 600.

Fig. 4 shows a schematic structural diagram of an imprinting station 300 provided in an embodiment of the present application, where the imprinting station 300 is used for automatic filling and imprinting polymer. The imprint station 300 is provided with a dispensing arm 33 capable of extending between the substrate 52 and the imprint mold 54, and at the imprint station, the imprint mold 54 is attracted to the upper chuck 32 and the wafer carrier 51, the substrate 52, and the spacer 53 are positioned on the lower chuck 12 at the time of dispensing.

When the stack 500 enters the imprint station, in a first step, the station's corresponding Z-axis lift mechanism is automatically raised to the top of the imprint station, the upper chuck 32 holds the imprint mold 54 by vacuum, and then the Z-axis lift mechanism is moved downward again, leaving the imprint mold 54 held on the upper chuck 32, with the wafer carrier, substrate, and spacers left underneath. In the second step, the dispensing arm 33 extends between the substrate 52 and the imprint mold 54 to perform automatic dispensing, and the dispensing amount is calculated according to the parameters fed back from the gap measuring device 21, so that the amount of the polymer 34 can be accurately calculated and accurately controlled. And thirdly, after dispensing is finished, the dispensing arm retreats to the outside of the stacking component, and the Z-axis lifting mechanism ascends again at different speeds until the Z-axis lifting mechanism is blocked by the spacing piece, so that imprinting is finished. In the dispensing step, the polymer 34 is filled in the gap and structure between the substrate 52 and the imprinting mold 54, and when imprinting is completed, the vacuum on the upper chuck 32 is released and the entire stacked part 500 is unloaded by the fall of the Z-axis elevating mechanism. Subsequently, the moving stage 600 rotates and transfers the lower chuck 12 and the stacking member 500 into the curing station 400.

Fig. 5 shows a schematic structural diagram of a curing station 400 provided in an embodiment of the present application. And the curing station is used for carrying out secondary alignment on the stacked parts and finishing ultraviolet irradiation curing. An ultraviolet light source (not shown) and an image acquisition device 42 are arranged in the curing station 400, the upper chuck 43 of the curing station 400 can move on a plane vertical to the Z axis, and the image acquisition device 42 is used for detecting the distance and the orientation between the alignment marks 521 and 542 on the substrate and the imprinting mold and feeding back the distance and the orientation to an automatic control system. The automatic control system controls the upper chuck 43 to move in the X-Y plane, and adjusts the moving direction and distance of the upper chuck based on the distance and positional relationship between the two alignment marks, to finally align the imprint mold with the alignment marks 542, 521 on the substrate.

When the stack 500 enters the curing station, the Z-axis lift mechanism of the station is automatically raised to the top of the station, and the upper chuck 43 fixes the imprint mold 54 by suction by means of vacuum. Subsequently, the Z-axis elevating mechanism is brought into a predetermined height position, the image pickup device 42 detects the alignment marks 521, 542 (which have been previously aligned when the stack is built in and out of the stock station) from the substrate 52 and the imprint mold 54, determines a center point difference between the two alignment marks by the automatic control system, and moves the upper chuck 43, which fixes the imprint mold 54, to an alignment position, thereby aligning the imprint mold 54 to the substrate 52, and performing ultraviolet exposure. When the ultraviolet exposure is completed, the vacuum on the upper chuck 43 is released and the lower chuck 12 and the entire stack 500 are unloaded by the fall of the Z-axis elevating mechanism. Finally, the moving stage rotates to bring the lower chuck 12 and the stacker assembly 500 to the next station, the in-out station 100, where the operator can remove the wafer substrate that has just been replicated, completing a cycle.

The material inlet and outlet station 100 and the curing station 400 are respectively provided with an observation hole opposite to the alignment mark, and the image recognition device and the image acquisition device are both positioned below the observation holes. In this embodiment, the size of the viewing hole should be larger than the size of the alignment marks, so that the image recognition device and the image capture device can simultaneously view the alignment marks on the substrate and the imprinting mold through the viewing hole.

As described above, the automatic stamping device of the present application has an automatic control system therein for controlling the motion executing components to act in time sequence, so as to implement the following process steps:

1. in the material input and output station 100, the wafer carrier 51, the substrate 52, the spacer 53 and the imprinting mold 54 are stacked one by one on the lower chuck 12 corresponding to the material input and output station 100, the image recognition is performed on the stacked component 500 manually stacked by an operator, the identity information of the substrate 52 and the imprinting mold 54 is read, the operator is assisted in preliminarily aligning the alignment marks 521 and 542 on the substrate 52 and the imprinting mold 54, and then the stacked component 500 is transferred to the gap measuring station 200;

2. at the gap measuring station 200, the gap between the substrate 52 and the imprinting mold 54 is measured, and the amount of polymer required is calculated based on the feedback data of the gap measuring device, and then the moving stage 600 rotates to bring the stacked part 500 to the imprinting station 300;

3. separating the wafer carrier 51, the substrate 52 and the spacer 53 from the stamping die 54 at the stamping station 300, extending the dispensing arm 33 between the substrate 52 and the stamping die 54 for automatic dispensing, pressing the stamping die 54 on the surface of the polymer 34 to complete polymer stamping, and transferring the stacked component 500 to the curing station 400;

4. in the curing station 400, the alignment marks on the substrate 52 and the imprinting mold 54 are automatically aligned by the image acquisition device 42 to realize secondary precise alignment, then ultraviolet irradiation curing is performed, and the stacking part 500 is transferred to the feeding and discharging station 100;

5. at the in-out station 100, the imprinted wafer substrate is removed by an operator.

Through above-mentioned manufacture process, the automatic impression equipment of this application has following advantage:

1. almost eliminates the steps of intervention and confirmation of all operators, and avoids error fluctuation caused by manual operation;

2. the precise and stable control of the polymer dosage is realized through automatic dispensing;

3. different workstations are established, so that the workstations are separated from each other and automatically work independently, a plurality of wafers can be processed simultaneously, and the yield of the wafers is greatly improved;

4. since the operator only needs to build the stack, there is no need for a deep understanding and learning of the embossing process and the embossing apparatus, reducing personnel requirements.

In this embodiment, the imprint mold, the wafer stage, the spacer, the microlens structure layer, and the like may adopt structures known in the prior art, and those skilled in the art may select the structures according to specific needs, which are not described herein again.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but various changes and modifications may be made without departing from the spirit and scope of the invention, the scope of which is defined by the appended claims, the description and the equivalents thereof.

Claims (9)

1. An automatic imprint apparatus of a microlens array, characterized in that: the automatic stacking device comprises a plurality of workstations, a stacking component circularly moving among the workstations, a moving platform driving the plurality of stacking components to be switched among the workstations and an automatic control system, wherein the stacking component comprises: a wafer carrier for holding a substrate, an imprint mold having a lens microstructure layer, and a spacer between the wafer carrier and the imprint mold, the plurality of stations including at least:

the feeding and discharging station is used for stacking substrates, forming the stacking part, identifying the identity information of the substrates and the imprinting mold and taking out the imprinted substrates;

a gap measuring station comprising gap measuring means for measuring the gap between said substrate and said imprint mold in order to calculate the amount of polymer required to fill the gap;

an imprint station comprising a dispensing arm capable of extending between said substrate and said imprint mold, said imprint station for automated filling of a polymer and imprinting of said polymer;

the curing station is used for carrying out ultraviolet irradiation curing on the polymer;

the mobile station on install a plurality of lower chucks that are used for fixing the part that piles up, clearance measurement station, impression station and solidification station respectively have last chuck, lower chuck drive the part that piles up wholly shift between a plurality of workstations.

2. An apparatus for automatically imprinting a microlens array according to claim 1, wherein a plurality of said stations are distributed on a same circumference, said movable stage has a rotation axis extending along a Z-axis direction, said axis is perpendicular to a plane of said circumference and passes through a center of said circumference, a plurality of Z-axis elevating mechanisms are disposed under said movable stage and respectively correspond to said stations, each of said Z-axis elevating mechanisms is configured to drive said lower chuck and said stacking member to elevate along a Z-axis relative to said movable stage.

3. The automated imprinting apparatus for microlens arrays according to claim 2, wherein each upper chuck is located directly above said movable stage, and each of said upper chucks is in air flow communication with a vacuum suction system for suction-fixing said imprinting mold.

4. The automated micro-lens array embossing apparatus of claim 3, wherein the input and output station includes an image recognition device for recognizing the identity code of the substrate and the embossing mold, displaying and magnifying the alignment marks of the substrate and the embossing mold.

5. An apparatus for automatically imprinting microlens arrays according to claim 3, wherein said gap measuring device is an optical interferometry device.

6. The automated imprinting apparatus for microlens arrays according to claim 3, wherein said imprinting station is configured to: during dispensing, the imprinting mold is adsorbed on an upper chuck of the imprinting station, and the wafer carrier, the substrate and the spacer are positioned on the Z-axis lifting mechanism.

7. An automated imprint apparatus of a microlens array according to claim 3, wherein the upper chuck of the curing station is movable in a plane perpendicular to the Z-axis, the imprint mold is held by the upper chuck of the curing station, the curing station includes an image capture device for detecting alignment marks on the substrate and the imprint mold, the automated control system is configured to: and moving the upper chuck based on the distance between the two alignment marks to align the imprinting mold with the alignment marks on the substrate.

8. The automatic stamping device for microlens arrays as in claim 7, wherein the moving stage is provided with a viewing hole opposite to the alignment mark, and the image acquisition device is located below the viewing hole.

9. The automated imprinting apparatus for microlens arrays according to any of claims 1-8, wherein said automated control system is configured to: at the material inlet and outlet station, the identity of the substrate and the imprinting mold is identified, and then the stacking component is transferred to the gap measuring station; at said gap measuring station, calculating the amount of polymer required based on feedback from said gap measuring device, and then transferring said stack to said embossing station; separating the wafer carrier, the substrate and the spacer from the stamping die at the stamping station, extending the dispensing arm between the substrate and the stamping die for dispensing, completing polymer stamping, and transferring the stacking component to the curing station; and aligning the substrate with the imprinting mold at the curing station, then carrying out ultraviolet irradiation curing, and transferring the stacked component to the material inlet and outlet station.

Images